罗杰斯公司在高性能特种电子材料领域中享有盛名。作为开发和制造高性能电路材料的先驱，罗杰斯公司为
客户不断改革创新了将近0年；产品覆盖对技术要求最苛刻的电路应用领域。微波电路的市场在过去几十年里得
到很大的发展，从应用波导的军用市场到低成本基片的商用市场，Rogers公司总是领先于微波基板的技术领域并
提供微波板材的更多选择。
Contents
High Frequency Laminate Properties .............................................................................................................................................................. 2
Metal Claddings . ..................................................................................................................................................................................................... 3
Ordering Information ............................................................................................................................................................................................ 4
ULTRALAM® 3000 Liquid Crystalline Polymer Circuit Material ............................................................................................................... 5
ULTALAM® 3908 Bondply ..................................................................................................................................................................................... 9
RO4000® Series High Frequency Circuit Materials ...................................................................................................................................... 13
RO4500™ Series Cost Performance Antenna Grade Laminates ............................................................................................................. 19
RO4730™ Series LoPro™ Antenna Grade Laminates . ................................................................................................................................. 21
RO3730™ Antenna Grade Laminates ............................................................................................................................................................... 23
Data Sheet and Processing Guidelines for RO4403™, RO4450B™ and RO4450F™ Prepregs ........................................................ 25
Preliminary Data sheet - RO4233® LNB Laminates . .................................................................................................................................... 29
RO3000® Series High Frequency Circuit Materials ...................................................................................................................................... 30
RO3035™ High Frequency Circuit Materials .................................................................................................................................................. 33
RO3200™ Series High Frequency Circuit Materials ..................................................................................................................................... 35
3001 Bonding Film Properties and Lamination Techniques . .................................................................................................................. 37
RT/duroid® 5870/5880 High Frequency Laminates .................................................................................................................................... 41
ULTALAM® 2000 Woven Glass Reinforced Microwave Laminate . .......................................................................................................... 43
RT/duroid® 6002 High Frequency Laminates . .............................................................................................................................................. 45
RT/duroid® 6006/6010 High Frequency Laminates .................................................................................................................................... 47
TMM Temperature Stable Microwave Lamiinate ......................................................................................................................................... 49
High Frequency Laminate Properties
(1)
PTFE Ceramic
PTFE Ceramic
Reinforced Woven Glass
PTFE Ceramic
Reinforced Woven Glass
PTFE Ceramic
Reinforced Woven Glass
RO3035™
RO3203™
RO3206™
RO3210™
Hydrocarbon Ceramic
Prepreg
Hydrocarbon Ceramic
Prepreg
PTFE Glass Fiber
PTFE Glass Fiber
RO4450B™
**RO4450F™
RT/duroid® 5870
RT/duroid® 5880
0.0024
2.9
ULTRALAM® 3000
Liquid Crystalline
Polymer
ULTRALAM® 2000
0.0022
0.0023
0.0020
0.0020
0.0019
Hydrocarbon Ceramic
TMM 10i
9.20 ± 0.23
0.0027
0.0023
2.40 - 2.60
± 0.04
Hydrocarbon Ceramic
TMM® 10
6.00 ± 0.08
4.50 ± 0.045
3.27 ± 0.032
10.2 ± 0.25
0.0015
0.0012
0.0009
0.0012
PTFE Woven Glass
Hydrocarbon Ceramic
TMM® 6
2.94± 0.04
6.15 ± 0.15
(9)
2.94 ± 0.04
2.20 ± 0.02
2.33 ± 0.02
0.0040
0.0040
0.0033
0.0020
0.0037
0.0027
0.0016
0.0027
0.0027
0.0016
0.0017
0.0023
0.0020
0.0013
0.0020
Hydrocarbon Ceramic
TMM® 4
3.54 ± 0.05
0.004”
3.52 ± 0.05
3.30 ± 0.05
Thickness
0.0036”
(1)
Dissipation
Factor TAN δ
@ 10 GHz
(Typical)
9.80 ± 0.245
Hydrocarbon Ceramic
TMM® 3
®
PTFE Ceramic
PTFE Ceramic
RT/duroid 6006
PTFE Ceramic Woven
Glass
RT/duroid® 6010LM
®
RT/duroid 6202
®
RT/duroid 6002
PTFE Ceramic
3.00±0.08
Hydrocarbon/
Close Microspheres
RO4730 ™
®
3.3±0.08
Hydrocarbon Ceramic
3.48 ± 0.05
3.66
RO4533 ™
Process
Design
Hydrocarbon Ceramic
3.38 ± 0.05
3.55
RO4350B™
(8)
Hydrocarbon Ceramic
Process
Design
3.02 ± 0.04
3.00±0.06
(7)
3.50± 0.05
10.2 ± 0.30
6.15 ± 0.15
RO4003C™
RO3730
PTFE Ceramic
10.2 ± 0.50
PTFE Ceramic
RO3010
™
6.15 ± 0.15
PTFE Ceramic
™
RO3006
™
3.00 ± 0.04
PTFE Ceramic
RO3003™
(7)
Composition
Product
Dielectric
Constant er
@ 10 GHz
(Typical)
TBD
-100
-43
-38
-11
-15.3*
+37
-425
-410
+13**
+12
-125
-115
TBD
60 to150°C
-50 to 60°C
23
N/A
+50
+40
-22
-459
-212
-18
21
-11
10°C to 150°C
13
-34
-50° to 10°C
-280
-160
13
Thermal (2)
Coefficient of er
-50°C to 150°C
ppm/°C
(Typical)
10
3
3
300
(2,068)
300
(2,068)
2,400
(16,547)
2,400*
(16,547)
2,400
(16,547)
2,400*
(16,547)
1 x 109
4 X 107
7*
1 X 108
2 X 108
8*
1 x 10
10
2 X 107
2 X 10
12
1 X 10
4 X 107
2255
(327)
2255
(327)
1,300
(8,970)
2,200
(15,168)
2,200
(15,168)
1,700
(11,730)
2,000*
(13,790)
2,000*
(13,790)
1 x 109
6 X 108
4 X 10
1,916
(13,210)
1,916
(13,210)
>9 x 109
3 X 109
81
(559)
135
(932)
7 X 10
5 X 106
2 X 10
5 X 106
75
(517)
120
(828)
120
(828)
91
(628)
125
(863)
156
(1,076)
146
(1,007)
185
(1,277)
189
(1,340)
146
(1,007)
N/A
N/A
N/A
N/A
575*
(3,964)
575
(3,964)
736
(5,075)
752
(5,185)
742
(5,116)
311
(2,146)
155
(1,070)
150
(1,035)
360*
(2,482)
136
(938)
120
(828)
N/A
N/A
N/A
798
(5,500)
1,664
(11.473)
N/A
841
(5,800)
223
(1,538)
192
(1,324)
129
(889)
181
(1,248)
244
(1,682)
211
(1,455)
167
(1,151)
Z
3,900
(26,889)
140
(965)
140
(965)
140
(965)
N/A
N/A
N/A
TBD
3,700
(25,510)
140
(965)
140
(965)
140
(965)
7
10
9
10
300
(2,068)
300
(2,068)
300
(2,068)
300
(2,068)
300
(2,068)
300
(2,068)
Y
X
Youngs Modulus(3)
kpsi (MPa)
(Typical)
7
10
10
10
3 X 107
2 X 107
7
2 X 108
2 X 107
6
TBD
1.9 X 108
5.5 X 1012
N/A
5.7 X 109
4.2 X 109
107
104
107
107
107
TBD
>2.5 X 1010
1.4 X 1013
N/A
1.2 X 109
1.7 X 1010
107
104
107
107
107
10
10
3
3
10
107
Surface
Resistivity
Mohm
(Typical)
107
Volume
Resistivity
Mohm
cm
(Typical)
(5)
0.06
0.04
0.03
0.16
0.09
0.06
0.07
(4)
0.05
0.05
0.1
0.1
0.015
0.015
0.09
0.05
0.13
N/A
0.06
0.06
0.04
<0.1
<0.1
<0.1
<0.1
<0.1
<0.1
<0.1
0.5
0.24
0.76
0.76
0.72
0.70
0.70
0.78
0.48
0.68
0.60
0.20
0.22
0.65
0.60
0.52
0.60
0.62
0.64
0.45
0.81
0.63
0.50
0.50
0.66
0.61
0.50
Thermal
Moisture(4)
Absorption Conductivity
D24/23
W/m/°K
%
(Typical)
(Typical)
17
15
16
16
16
14
16
24
47
15
16
31
22
19
19
19
13
14
11
11
13
13
13
17
17
17
17
X
17
15
16
16
16
14
16
24
34
15
16
48
28
17
17
17
11
16
14
12
13
13
13
17
17
17
17
Y
150
200
20
20
20
20
20
47
117
30
24
237
173
50
50
40
37
35
46
65
34
34
58
24
24
24
24
Z
Coefficient of Thermal
Expansion(6)
0° - 100°C
ppm/°C
(Typical)
1.4
2.2
2.77
2.77
2.37
2.07
1.78
3.1
2.7
2.1
2.1
2.2
2.2
1.83
1.86
1.45
1.8
1.9
1.8
2.1
3.0
2.7
2.1
2.1
3.0
2.6
2.1
(Typical)
Density
gm/cm3
0.95
(5.2)
18.0
(3.2)
5.0
(0.9)
5.0
(0.9)
5.7
(1.0)
VTM-0
94 V-0
N/A
N/A
N/A
N/A
N/A
5.7
(1.0)
5.7
(1.0)
94V-0
94V-0
94V-0
94V-0
94V-0
94V-0
94V-0
12.3
(2.1)
14.3
(2.5)
9.1
(1.6)
8.9
(1.6)
22.8
(4.0)
20.8
(3.7)
N/A
94V-0
Non FR
N/A
N/A
0.9
94 V-0
7.7
(1 OZ LoPro)
5.2
(0.9)
N/A
N/A
6.0
(1.1)
94 V-0
1.8
(10.5)
94 V-0
94 V-0
94 V-0
94 V-0
94 V-0
94 V-0
Flammability
Rating
UL
13
(2.4)
7
(1.30)
10
(1.7)
9.1
(1.6)
13.4
(2.4)
12.2
(2.1)
17.6
(3.1)
Peel
Strength
1 oz (35 µm)
EDC Foil
lbs/in, (N/mm)
(Typical)
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
Lead-Free
Halogen
Process
Free
Capability
-154
150-160
-154
PIM
dbc
range
(Typical)
55 (1.4)
1 oz. (35µm) Rolled
2 oz (70µm) Rolled
6061
70/30 Cartridge
110
Aluminum
Brass
Copper
12 (0.3)
12 (0.3)
12 (0.3)
15 (0.4)
15 (0.4)
35 (242)
45 (311)
8.9
8.5
2.7
Density
Tensile Strength
kpsi (MPa)
20 (138)
27.0
13.0
8.0
42.0
28.0
20.0
N/A
Elongation
%
28.0 (193)
22.0 (152)
20.0 (138)
32.0 (221)
30.0 (207)
33.0 (228)
N/A
Tensile Strength
kpsi (MPa)
The information contained in this Product Selector Guide is intended to assist you in designing with Rogers’ laminates. It is not intended to and does not create any
warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The user should determine the suitability of
Rogers’ circuit materials for each application.
Typical values are a representation of an average value for the population of the property.
For specification values contact Rogers Corporation.
1) Measured by IPC-TM-650 method 2.5.5.5 @ ~10 GHz, 23°C. RT/duroid 6010 materials were based on testing a 0.025” thick sheet, clad
with 1 oz. electrodeposited copper foil. εr values and tolerance reported by IPC-TM-650 method 2.5.5.5 are the basis for quality acceptance, but for some products these values may be incorrect for design engineering applications, especially those in microstrip. We
recommend that prototype boards of a new design be verified for electrical performance.
2) Measured by IPC-TM-650 method 2.5.5.5 at ~10GHz modified.
3) Young’s modulus (elastic modulus), steepest region of the stress/strain curve is in tension for X and Y axes by ASTM D 638: in compression
of Z axis by ASTM D695 on 12.7 X 12.7 X 25.4 mm stocked specimen.
4) Testing conditions: 24 hours @ 23°C, specimens etched free of copper.
5) Tested by ASTM C518.
6) Tested by ASTM D3386-94. Values are average over temperature range but not necessarily linear. However for RT/duroid 6002 and TMM
grades the response is essentially linear.
7) The nominal dielectric constant of an 0.060” thick RO3003/RO3203 as measured by IPC-TM-2.5.5.5 will be 3.04 due to the elimination
of biasing caused by air gaps in the test fixture. For further information refer to Rogers T.R. 5242.
8) Dielectric constant typical value does not apply to 0.004 (0.101mm) laminates. Dielectric constant specification value of 0.004”
RO4350B materials is 3.36 ± 0.05.
9) Due to construction limitations, the dielectric constant of 0.010” and 0.015” thick laminates is 3.02 ± 0.04”.
Fair to Good
Good
Poor
Machinability
55 (1.4)
½ (17.5µm) Rolled
Alloy
55 (1.4)
2 oz (70 µm) Electrodeposited
Plates
95 (2.4)
115 (2.9)
1 oz. (35µm) Electrodeposited
15 (0.4)
15 (0.4)
70 (1.8)
75 (1.9)
¼ oz (9µm) Electrodeposited
Untreated
Side
µin (µm)
Surface Roughness
Treated
Side
µin (µm)
½ oz (17.5µm) Electrodeposited
Copper Foil
Properties Notes: *Estimated, ** Preliminary Data
Metal Claddings
390
1 20
1 50
Thermal Conductivity
Excellent
Excellent
Excellent
Fair
Fair
Fair
Fair
Stress Crack
Resistance
17
20
24
Coefficient of Thermal
Expansion ppm/°C
2.8
1.4
0.7
2.8
1.4
0.7
0.4
Thickness - mils
Standard Thickness, Tolerance and Panel Size
Ordering Information:
Rogers’ high frequency laminates can be purchased by
contacting a Rogers Customer Service Representative
at (480) 961-1382 or one of our international offices listed
below.
To ensure that you receive the material for your application, please include order information for each of the
categories listed below. For more detailed product information, refer to the charts in this product selector guide.
GRADE:
Laminates - RT/duroid® 5870, 5880, 6002, 6202, 6006,
6010LM, ULTRALAM® 2000, ULTRALAM 3000, TMM® 3,4,6,10,
and 10i, RO3003 , RO3035 , RO3203 , RO3006 , RO3206
RO3010 , RO3210 , RO4003C , and RO4350B high frequency laminates.
Bonding Film -3001 Prepreg - RO4403 , RO4450B and
RO4450F
™
™
™
™
™
™
™
™
Standard Dielectric Thickness
Standard Panel Sizes
RO3003™
RO3035™
*RO3203™
0.005” (0.127mm) ± 0.0005”
0.010” (0.254mm) ± 0.0007”
0.020” (0.508mm) ± 0.001”
0.030” (0.762mm) ± 0.0015”
0.060” (1.524mm) ± 0.003”
RO3003
12”X18” (305mm X 457mm)
24”X18” (610mm X 457mm)
RO3203, RO3035
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
18”X36” (457mm X 915mm)
18”X48” (457mm X 1.219m)
RO3006™
RO3010™
*RO3206™
*RO3210™
0.005” (0.127mm) ± 0.0005”
0.010” (0.254mm) ± 0.0007”
0.025” (0.635mm) ± 0.001”
0.050” (1.270mm) ± 0.002”
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
18”X36” (457mm X 915mm)
18”X48” (457mm X 1.219m)
RO4003C™
0.008” (0.203mm) ± 0.001”
0.012” (0.305mm) ± 0.001”
0.016” (0.406mm) ± 0.0015”
0.020” (0.508mm) ± 0.0015”
0.032” (0.813mm) ± 0.002”
0.060” (1.524mm) ± 0.004”
12”X18” (305mm X 457mm)
24”X18” (610mm X 457mm)
RO4350B™
0.0040” (0.101mm) ± 0.0007”
0.0066” (0.168mm) ± 0.0007”
0.0100” (0.254mm) ± 0.001”
0.0133” (0.338mm) ± 0.0015”
0.0166” (0.422mm) ± 0.0015”
0.0200” (0.508mm) ± 0.0015”
0.0300” (0.762mm) ± 0.002”
0.0600” (1.524mm) ± 0.004”
12”X18” (305mm X 457mm)
24”X18” (610mm X 457mm)
RT/duroid®5870
RT/duroid 5880
0.005” (0.127mm) ± 0.0005”
0.010” (0.254mm) ± 0.0007”
0.020” (0.508mm) ± 0.001”
0.031” (0.787mm) ± 0.001”
0.062” (1.570mm) ± 0.002”
0.125” (3.170mm) ± 0.004”
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
18”X36” (457mm X 915mm)
18”X48” (457mm X 1.219m)
RT/duroid 6002
RT/duroid 6202
0.010” (0.254mm) ± 0.0007”
0.020” (0.508mm) ± 0.001”
0.030” (0.762mm) ± 0.001”
0.060” (1.524mm) ± 0.002”
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
18”X36” (457mm X 915mm)
18”X48” (457mm X 1.219m)
RT/duroid 6006
RT/duroid 6010LM
0.005” (0.127mm) ± 0.0005”
0.010” (0.254mm) ± 0.0007”
0.025” (0.635mm) ± 0.001”
0.050” (1.270mm) ± 0.002”
0.075” (1.905mm) ± 0.004”
0.100” (2.540mm) ± 0.005”
18”X12” (457mm X 305mm)
TMM®3
TMM 4
0.015” (0.381mm) ± 0.0015”
0.020” (0.508mm) ± 0.0015”
0.030” (0.762mm) ± 0.0015”
0.060” (1.524mm) ± 0.0015”
0.125” (3.175mm) ± 0.0015”
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
TMM 6
TMM 10
TMM 10i
0.015” (0.381mm) ± 0.0015”
0.025” (0.635mm) ± 0.0015”
0.050” (1.270mm) ± 0.0015”
0.075” (1.905mm) ± 0.0015”
0.100” (2.540mm) ± 0.0015”
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
ULTRALAM® 3000
0.001” (0.025mm)
0.002” (0.051mm)
0.004” (0.101mm)
18”X12” (457mm X 305mm)
18”X24” (457mm X 610mm)
*not availlable in 0.005”
(0.127mm)
*not availlable in
0.005” (0.127mm) and
0.010”(0.254mm)
™
™
™
™
THICKNESS AND TOLERANCE:
Laminate thickness is normally specified as the dielectric
thickness without copper cladding. Custom tolerances are
available on RT/duroid laminates upon request.
TYPE OF FOIL CLADDING:
¼, ½, 1, 2 oz. electrodeposited copper foil, ½, 1, 2 oz.
rolled copper foil. TMM, RO3000 and RO4000 series laminates are not supplied with ¼ oz. electrodeposited or rolled
copper foil.
Some material grades may be supplied unclad. Call
Rogers Customer Service Representatives for unclad
options.
Thick aluminum, copper and brass claddings are available
on Rogers RT/duroid laminates. Thick aluminum and brass
claddings are available on most TMM laminates. Thick
metal cladding is not available on RO4000 laminates. Thick
aluminum, copper, and brass claddings are also available
in a range of thicknesses and thickness tolerances. Other
thick metal backings are available upon request.
SPECIFICATION REQUIREMENTS:
Standard specifications are Rogers’ material specifications.
Certificates of conformance are available.
All other requirements must be identified at the time the
order is placed. If special testing or data generation is
required, additional costs may be incurred.
in (mm)
Product
not available in 0.010” (0.254mm)
18”X24” (457 X 610mm)
not available in 0.010” (0.254mm)
10”X10” (254mm X 254mm)
10”X20” (254mm X 508mm)
20”X20” (508mm X 508mm)
Other thicknesses and panel sizes may be available. Contact customer
service for more information.
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
Rogers Advanced Circuit Materials, ISO 9002 certified
Rogers BVBA - Gent
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480-961-1382
Tel: 32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-62175599
Fax: 480-961-4533
Fax: 32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-62677913
The information contained in this product selector guide is intended to assist you in designing with Rogers’ laminates. It is not intended to and
does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The user should
determine the suitability of Rogers’ circuit materials for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations.
Diversion contrary to U.S. law prohibited.
RT/duroid, ULTRALAM, TMM, RO3000, and RO4000 are licensed trademarks of Rogers Corporation.
The world runs better with Rogers. and the Rogers’ logo are licensed trademarks of Rogers Corporation.
© 1987, 1991, 1994, 1995, 1999, 2001, 2002, 2004, 2005, 2007, 2008, 2009 All Rights Reserved. Printed in USA.
Revised 04/2009 0863-0409-10.0ON Publication #92-601
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
RF1.3000
ULTRALAM® 3000
Liquid Crystalline Polymer Circuit Material
Double-Clad Laminates
Features and Benefits
Excellent high frequency properties
• Stable electrical properties for tightly
controlled impedance matching
• Excellent thickness uniformity for maximum
signal integrity
• Allows use of thinner dielectric layer with
minimal signal distortion
Good dimensional stability
Low modulus
• Bends easily for flex and conformal
applications
• Offers design flexibility and maximizes
circuit density requirements
Extremely low moisture absorption
• Reduces bake times
• Maintains stable electrical, mechanical
and dimensional properties in humid
environments
Flame resistant
• Halogen-free. Meets WEEE.
• UL94VTM/0 – meets requirement for
consumer products
Typical Applications
•
•
•
•
•
•
•
•
High speed switches and routers
Chip packaging
MEMs
Military Satellites and Radar
Sensors
Hybrid substrates
Handheld and RF devices
Base Station Antennas
The world runs better with Rogers.®
ULTRALAM® 3850 laminate circuit materials from
Rogers Corporation, utilize highly temperature
resistant liquid crystalline polymer (LCP) as the
dielectric film. These products were developed
specifically for single layer and multilayer substrate
constructions. These adhesiveless laminates are
well suited for high speed and high frequency
applications in telecommunication network
equipment, high-speed computer data links and
other high performance applications.
ULTRALAM 3850 circuit materials are characterized
by low and stable dielectric constant and
dielectric loss, which are key requirements for
high frequency, high-speed products. ULTRALAM
3850 is offered as a double copper clad laminate.
offered in panels. It can be used, for multilayer
constructions with ULTRALAM 3908 bonding film.
ULTRALAM 3000 laminate materials conform to the
requirements of IPC 4204/24. The UL file number is
E122972.
Dielectric Constant Variation: LCP, All Polyimide, and FR-4 laminates
4.8
4.5
Dielectric Constant
4.3
4.0
FR-4: 50C
Immersion
FR-4: 23C, 50%RH
3.8
PI: 50C Immersion
PI: 23C, 50%RH
3.5
LCP: 50C Immersion
LCP: 23C, 50%RH
3.3
3.0
2.8
2.5
0
2
4
6
8
10
12
Frequency, GHz
Data obtained from cast all polyimide and high Tg FR-4 laminate materials.
The information contained in this datasheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
ULTRALAM® 3000 Laminates
Typical Values
Property
Typical Value
Unit
Test Conditions
%
IPC 2.2.4 method B
®
ULTRALAM 3850
Mechanical Properties
Dimensional Stability
MD
-0.06
CMD
-0.03
0.95 (8.52)
N/mm (lbs/in)
IPC 2.4.8 (1/2 oz. ED foil)
Initiation Tear Strength, min
Peel Strength
1.4 (3.1)
Kg (lbs)
IPC 2.4.16
Tensile Strength
200 (29)
MPa (Kpsi)
IPC 2.4.16
Tensile Modulus
2255 (327)
MPa (Kpsi)
IPC 2.4.19
1.4
gm/cm3, Typical
Density
Thermal Properties
Coefficient of
Thermal Expansion,
CTE (30°C to 150°C)
X
17
Y
17
Z
150
Solder Float, Method B
(288°C)
ppm/°C
PASS
Melting Temperature
315
Relative
Thermal
Index - RTI
mechanical
190
electrical
240
Thermal Conductivity
Thermal Coefficient of Hr,
-50°C to 150°C
IPC 2.4.41.3
IPC 2.4.13
°C (Typical)
DSC
°C
0.2
W/m/°K
ASTM C518
(+)24
ppm/°C
IPC 2.5.5.5, 8 GHz
Electrical Properties
Dielectric Constant, 10 GHz,
23°C
2.9
IPC 2.5.5.5.1
Dissipation Factor, 10 GHz,
23°C
0.0025
IPC 2.5.5.5.1
Surface Resistivity
1X1010
Volume Resistivity
12
Dielectric Breakdown
Strength
MOhm
IPC 2.5.17
MOhm cm
IPC 2.5.17
1378 (3500)
KV/cm (V/mil)
ASTM-D-149
1X10
Environmental Properties
Chemical Resistance
98.7
%
IPC 2.3.4.2
Water Absorption (23°C, 24
hrs)
0.04
%
IPC 2.6.2
Coefficient of Hygroscopic
Expansion, CHE (60°C)
4
ppm/%RH
60°C
Flammability
VTM-0
UL-94
Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corporation.
STANDARD THICKNESS
STANDARD SIZE
STANDARD COPPER CLADDING
ULTRALAM 3850:
ULTRALAM 3850:
ULTRALAM 3850:
0.001” (25Pm)
0.002” (50Pm)
0.004” (100Pm)
18” X 12” (457mm X 305mm) panel
18” X 24” (457mm X 610mm) panel
Custom sizes available upon request
½ oz. (18Pm)
Copper Type:
Very low profile ED copper per IPC
4562 3.4.5 (<Rz 5.1 mm). Other claddings available.
The information contained in this datasheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
ULTRALAM® 3850 circuit materials can be used in combination with ULTRALAM 3908 bonding films to create
truly adhesiveless all-LCP multi-layer circuit constructions:
4 or More Layer Build
3 Layer Build
ULTRALAM 3850 double clad with one side etched off.
ULTRALAM 3850 double clad
ULTRALAM 3908 bonding film
ULTRALAM 3908 bonding film
ULTRALAM 3850 double clad
ULTRALAM 3850 double clad
ULTRALAM® 3908 bondply should never be stacked together in a design in order to increase the bondply
thickness. In designs where a bondply spacing greater than 0.002” (.0508mm) is required, it is recommended to use the following multi-layer bondply approach to achieve the desired dielectric thickness.
4 or More Layer Build with
ULTRALAM 3850 / ULTRALAM 3908 Bondply Spacers
ULTRALAM 3850 double clad
1 or 2 mil (25μm, 50μm) ULTRALAM 3908 Bonding Film
1,2 or 4 mil (25μm, 50μm,100μm) ULTRALAM 3850 double
clad spacer with both sides etched off
1 or 2 mil (25μm, 50μm) ULTRALAM 3908 Bonding Film
ULTRALAM 3850 double clad
ULTRALAM® 3000 circuit materials can also be combined with RO4450B™ prepreg, R/flex CRYSTAL® 7200
adhesive, SPEEDBOARD® C prepreg, or other types of epoxy, acrylic, cyanate ester, or PTFE resin systems to
enhance the properties of a multi-layer design as needed
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
Rogers Advanced Circuit Materials, ISO 9002 Certified
Rogers NV - Gent
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480-961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480-961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information contained in this datasheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
ULTRALAM, R/flex CRYSTAL and RO4450B are licensed trademarks of Rogers Corporation
SPEEDBOARD is a registered trademark of W.L. Gore & Associates, Inc.
©2003, 2004, 2005, 2006, 2007, 2008 Rogers Corporation, Printed in U.S.A, All rights reserved.
Revised 03/08 0788-0308-0.3-CC, Publication #92-125
Advanced Circuit Materials Division
100 N. Dobson Road
Chandler, AZ 85224
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
RF1.3908
ULTRALAM® 3908 Bondply
ULTRALAM 3000 Series
Liquid Crystalline Polymer Circuit Materials
Features and Benets
Excellent electrical properties
• Stable dielectric constant for minimal
cross talk between signal layers
• Allows use of thinner bonding lm with
very minimal signal losses
Low modulus
• Bends easily for ex applications
• Offers design flexibility and minimizes
space requirements
Extremely low moisture absorption
• Maintains stable electrical, mechanical
and dimensional properties
Flame resistant
• Halogen-free
• UL94VTM/0 – meets requirement for consumer products
ULTRALAM® 3908 bondply from Rogers Corporation, is used as a bonding medium (adhesive layer)
between copper and the dielectric material. This
product was developed specically for multi-layer
substrate constructions. This adhesiveless lm is well
suited for high speed and high frequency applications in telecommunication network equipment,
high-speed computer data links and other high
performance applications.
ULTRALAM 3908 bondply is characterized by low
and stable dielectric constant, which is required for
high frequency, high-speed products. This product
can be used for multilayer constructions with other
Rogers ULTRALAM 3000 family of LCP circuit materials such as ULTRALAM 3850 double clad laminate.
ULTRALAM 3908 bondply materials conform to the
requirements of IPC 4203/TBD. The UL le number is
E122972.
Typical Applications
All LCP ex interconnections
• High speed switches and routers
• Backplane-to-backplane
• Data links
• Card-to-card
Hybrid substrates
• Handheld and RF devices
The information contained in this data sheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
The world runs better with Rogers.®
Dielectric Constant Variation: LCP, All Polyimide, and FR-4 laminates
0.040
0.035
FR-4: 50°C Immersion
Dissipation factor
0.030
FR-4: 23°C, 50%RH
0.025
PI: 50°C Immersion
0.020
PI: 23°C, 50%RH
0.015
LCP: 50°C Immersion
0.010
LCP: 23°C, 50%RH
0.005
0.000
0
2
4
6
8
10
12
Frequency, GHz
Dielectric Constant Variation: LCP, All Polyimide, and FR-4 laminates
4.8
Dielectric Constant
4.5
4.3
FR-4: 50°C Immersion
4.0
FR-4: 23°C, 50%RH
3.8
PI: 50°C Immersion
3.5
PI: 23°C, 50%RH
3.3
LCP: 50°C Immersion
3.0
LCP: 23°C, 50%RH
2.8
2.5
0
2
4
6
8
10
12
Frequency, GHz
Data obtained from cast all polyimide and high Tg FR-4 laminate materials.
The information contained in this data sheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
10
Typical Values
Property
ULTRALAM® 3908 Bondply
Value
Unit
Test Conditions
Mechanical Properties
Dimensional Stability
Initiation Tear Strength, min
MD: <0.1
CMD: <0.1
1.4 (3.1)
%
IPC 2.2.4 method A
Kg (lbs)
IPC 2.4.16
Tensile Strength
216 (31)
MPa (Kpsi)
IPC 2.4.19
Tensile Modulus
2450 (355)
MPa (Kpsi)
IPC 2.4.19
<±10
%
ASTM-D374
Coefcient of Thermal
Expansion, CTE
(30°D to 150°C)
X:17
Y:17
Z:150
ppm/°C
IPC 2.4.41.3
Solder Float, Method B
(288°C)
PASS
Thickness Variation
Thermal Properties
Melting Temperature
IPC 2.4.13
280
°C
mechanical
190
°C
electrical
240
°C
DSC
Relative Thermal Index (RTI)
Electrical Properties
Dielectric Constant
(10 GHz, 23°C)
Dissipation Factor (10 GHz,
23°C)
2.9
IPC 2.5.5.5.1
0.0025
IPC 2.5.5.5.1
Mega Ohms
IPC 2.5.17
Mega Ohms-cm
IPC 2.5.17
118 (3000)
KV/cm (V/mil)
ASTM-D-149
Chemical Resistance
98.7
%
IPC 2.3.4.2
Water Absorption
(23°C, 24 hrs)
0.04
%
IPC 2.6.2
4
ppm/%RH
60°C
Surface Resistivity
1.2 X 1012
Volume Resistivity
2.6 X 10
Dieclectric Breakdown
Strength
14
Environmental Properties
Coefcient of Hydroscopic
Expansion, CHE (60°C)
Flammability
VTM-O
UL-94
Standard Thickness
Standard Size
Storage/Shelf Life
0.001”, 0.002” (25µm, 50µm)
18” X 12” (457mm X 305mm)
18” X 24” (457mm X 610mm)
up to 20.48” (520mm X 150m) rolls.
Custom sizes available upon request.
No special storage
requirements. No shelf
life limit
The information contained in this data sheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
11
ULTRALAM® 3850 circuit materials can be used in combination with ULTRALAM 3908 bonding lms to create
truly adhesiveless all-LCP multi-layer circuit constructions:
4 or More Layer Build
3 Layer Build
ULTRALAM 3850 double clad with one side etched
ULTRALAM 3850 double clad
ULTRALAM 3908 bonding lm
ULTRALAM 3908 bonding lm
ULTRALAM 3850 double clad
ULTRALAM 3850 double clad
ULTRALAM® 3908 bondply should never be stacked together in a design in order to increase the bondply
thickness. In designs where a bondply spacing greater than 0.002” (.0508mm) is required, it is recommended to use the following multi-layer bondply approach to achieve the desired dielectric thickness.
4 or More Layer Build with
ULTRALAM 3850 / ULTRALAM 3908 Bondply Spacers
ULTRALAM 3850 double clad
1 or 2 mil (25µm, 50µm) ULTRALAM 3908 Bonding Film
1,2 or 4 mil (25µm, 50µm,100µm) ULTRALAM 3850 double
clad spacer with both sides etched off
1 or 2 mil (25µm, 50µm) ULTRALAM 3908 Bonding Film
ULTRALAM 3850 double clad
ULTRALAM® 3000 circuit materials can also be combined with RO4450B™ prepreg, R/ex CRYSTAL® 7200
adhesive, SPEEDBOARD® C prepreg, or other types of epoxy, acrylic, cyanate ester, or PTFE resin systems to
enhance the properties of a multi-layer design as needed.
CONTACT INFORMATION:
USA
Rogers Advanced Circuit Materials Division, ISO 9002 Certied
Belgium
Roger NV - Gent
Japan
Roger Japan Inc.
Taiwan
Rogers Taiwan Inc.
Korea
Rogers Korea Inc.
Singapore
Rogers Technologies Singapore Inc.
China
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480 961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480 961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 866-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information contained in this data sheet is intended to assist you in designing with Rogers’ liquid crystalline polymer circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this datasheet will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ liquid crystalline polymer circuit materials for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
ULTRALAM and R/ex CRYSTAL are licensed trademarks of Rogers Corporation
SPEEDBOARD is a registered trademark of W.L. Gore & Associates, Inc.
©2003, 2004, 2006 Rogers Corporation, Printed in U.S.A., All rights reserved
Revised 11/2006 0749-1106-0.5-CC, Publication: #92-126
12
Advanced Circuit Materials
RO4000® Series High Frequency Circuit Materials
Features:
• Not-PTFE
• Excellent high frequency performance due to
•
•
•
•
•
•
low dielectric tolerance and loss
Stable electrical properties versus frequency
Low thermal coefcient of dielectric constant
Low Z-Axis expansion
Low in-plane expansion coefcient
Excellent dimensional stability
Volume manufacturing process
Some Typical Applications:
• LNB’s for Direct Broadcast Satellites
• Microstrip and Cellular Base Station Antennas
•
•
and Power Ampliers
Spread Spectrum Communications Systems
RF Identications Tags
RO4000® Series High Frequency Circuit Materials are
glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high
volume commercial applications.
RO4000 laminates are designed to offer superior
high frequency performance and low cost circuit
fabrication. The result is a low loss material which
can be fabricated using standard epoxy/glass (FR4)
processes offered at competitive prices.
The selection of laminates typically available to
designers is signicantly reduced once operational
frequencies increase to 500 MHz and above.
RO4000 material possesses the properties needed by
designers of RF microwave circuits. Stable electrical
properties over environmental conditions allow for
repeatable design of lters, matching networks
and controlled impedance transmission lines. Low
dielectric loss allows RO4000 series material to be
used in many applications where higher operating
frequencies limit the use of conventional circuit
board laminates. The temperature coefcient of
dielectric constant is among the lowest of any
circuit board material (Chart 1), making it ideal for
temperature sensitive applications. RO4000 materials
exhibit a stable dielectric constant over a broad
frequency range (Chart 2). This makes it an ideal
substrate for broadband applications.
RO4000 material’s thermal coefcient of expansion
(CTE) provides several key benets to the circuit
designer. The expansion coefcient of RO4000
material is similar to that of copper which allows the
material to exhibit excellent dimensional stability,
a property needed for mixed dielectric multilayer
board constructions. The low Z-axis CTE of RO4000
laminates provides reliable plated through-hole
quality, even in severe thermal shock applications.
RO4000 series material has a Tg of >280°C (536°F) so
its expansion characteristics remain stable over the
entire range of circuit processing temperatures.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.®
13
RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR4 circuit board
processing techniques. Unlike PTFE based high performance materials, RO4000 series laminates do not require
specialized via preparation processes such as sodium etch. This material is a rigid, thermoset laminate that
is capable of being processed by automated handling systems and scrubbing equipment used for copper
surface preparation.
RO4003™ laminates are currently offered in various congurations utilizing both 1080 and 1674 glass fabric
styles, with all congurations meeting the same laminate electrical performance specication. Responding
to the need for higher Relative Thermal Index (RTI) values than 105°C, we have developed the RO4350B™
laminate, which exhibits RTI values as high as 150°C. Specically designed as a drop-in replacement for
RO4350™ material, RO4350B laminate is the standard ame retardent product in the RO4000 product line.
These materials conform to the requirements of IPC-4103, slash sheet /10 for RO4003C and /11 for RO4350B.
Chart 1: RO4000 Series Materials
Dielectric Constant vs. Temperature
Er(f)Er (5 GHz)
Chart 2: RO4000 Series Materials
Dielectric Constant vs. Frequency
Frequency (GHz)
Chart 3: Microstrip Insertion Loss
(0.030” Dielectric Thickness)
0.000
-0.200
dB/Inch
-0.400
-0.600
-0.800
-1.000
-1.200
-1.400
-1.600
RO3003
0
2
4
PTFE Woven Glass
6
8
10
Frequency, GHz
RO4003
RO4350
12
BT Glass
14
16
Epoxy/PPO
18
BT/Epoxy
FR4
14
Property
Typical Value
Direction
Units
Condition
Test Method
RO4003C™
RO4350B™
3.38 ± 0.05
3.48 ± 0.05(1)
Z
--
10 GHz/23°C
IPC-TM-650
2.5.5.5
Clamped Stripline
3.55 ± 0.05
3.66 ± 0.05
Z
--
FSR/23°C
IPC-TM-650
2.5.5.6
Full Sheet Resonance
0.0027
0.0021
0.0037
0.0031
Z
--
10 GHz/23°C
2.5 GHz/23°C
IPC-TM-650
2.5.5.5
+40
+50
Z
ppm/°C
-100°C to
250°C
IPC-TM-650
2.5.5.5
Volume Resistivity
1.7 X 1010
1.2 X 1010
M:•cm
COND A
IPC-TM-650
2.5.17.1
Surface Resistivity
4.2 X 109
5.7 X 109
M:
COND A
IPC-TM-650
2.5.17.1
Electrical Strength
31.2
(780)
31.2
(780)
Z
KV/mm
(V/mil)
0.51mm
(0.020”)
IPC-TM-650
2.5.6.2
Tensile Modulus
26,889
(3900)
11,473
(1664)
Y
MPa
(kpsi)
RT
ASTM D638
Tensile Strength
141
(20.4)
175
(25.4)
Y
MPa
(kpsi)
RT
ASTM D638
Flexural Strength
276
(40)
255
(37)
Dimensional Stability
<0.3
<0.5
X,Y
mm/m
(mils/inch)
after etch
+E2/150°C
IPC-TM-650
2.4.39A
11
14
46
14
16
35
X
Y
Z
ppm/°C
-55 to 288°C
IPC-TM-650
2.1.41
>280
>280
°C DSC
A
IPC-TM-650
2.4.24
Dielectric Constant, Hr
(Process specication)
Dielectric Constant, Hr
(Recommended for use in
circuit design)
Dissipation Factor
tan, G
Thermal Coefcient
of Hr
Coefcient of
Thermal Expansion
Tg
MPa
(kpsi)
IPC-TM-650
2.4.4
Td
425
390
°C TGA
Thermal Conductivity
0.64
0.62
W/m/°K
100°C
ASTM F433
Moisture Absorption
0.06
0.06
%
48 hrs immersion 0.060”
sample Temperature 50°C
ASTM D570
Density
1.79
1.86
gm/cm3
23°C
ASTM D792
Copper Peel Strength
1.05
(6.0)
0.88
(5.0)
N/mm
(pli)
after solder
oat
1 oz. EDC Foil
IPC-TM-650
2.4.8
Flammability
N/A
94V-0
Lead-Free Process
Compatible
Yes
Yes
STANDARD THICKNESS:
RO4003C:
0.008” (0.203mm), 0.012 (0.305mm),
0.016” (0.406mm), 0.020” (0.508mm)
0.032” (0.813mm), 0.060” (1.524mm)
RO4350B:
*0.004” (0.101mm), 0.0066” (0.168mm)
0.010” (0.254mm), 0.0133 (0.338mm),
0.0166 (0.422mm), 0.020” (0.508mm)
0.030” (0.762mm), 0.060” (1.524mm)
ASTM D3850
UL
STANDARD PANEL SIZE:
STANDARD COPPER CLADDING:
12” X 18” (305 X457 mm)
24” X 18” (610 X 457 mm)
24” X 36” (610 X 915 mm)
48” X 36” (1.224 m X 915 mm)
½ oz. (17Pm), 1 oz. (35Pm) and
2 oz. (70Pm) electrodeposited copper foil.
*0. 004” material in not available in panel
sizes larger than 24”x18” (610 X 457mm).
(1) Dielectric constant typical value does not apply to 0.004 (0.101mm) laminates. Dielectric constant specication value for 0.004 RO4350B material is 3.36 ± 0.05
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and does
not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that the results
shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit
material laminates for each application.
15
16
17
18
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85224
Tel: 480-961-1382, Fax: 480-917-5256
www.rogerscorporation.com
Advanced Circuit Materials
Preliminary Data Sheet
Antenna Grade Laminates
Rogers’ Antenna Grade Materials
RO4500™ Series Cost Performance Antenna Grade Laminates
A new line of cost/performance materials from Rogers Corporation. These laminates are specically engineered and manufactured to meet the specic demands of the antenna markets.
Typical Applications
· Cellular infrastructure base station antennas
· WiMAX antenna networks
RO4533™, RO4534™, AND RO4535™ Laminates
FEATURES
BENEFITS
Loss range (0.0020 to 0.0037)
Dk range (3.3 to 3.5)
Wide range of application use
Low PIM response
Thermoset resin system
Compatible with standard PCB fabrication
Excellent dimensional stability
Greater yield on larger panels sizes
Uniform mechanical properties
Robust handing and long life in use with thin materials
High thermal conductivity
Improved power handling
RO4500™ Series High Frequency Laminates extend the capabilities of the successful RO4000® product series into antenna
applications. This ceramic-lled, glass-reinforced hydrocarbon based material set provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip
antenna applications.
As with all RO4000 High Frequency Laminates, RO4500 laminates are fully compatible with conventional FR4 and high
temperature lead free solder processing. These laminates do not require special treatment needed on traditional PTFEbased laminates for plated through hole preparation. This product series is an affordable alternative to more conventional
antenna technologies, thus allowing designers to maximize the price and performance of their antennas. Moreover, these
materials are available halogen-free to meet the most stringent “green” standards, or with our RoHS-compliant ame-retardant technology for applications requiring UL94 V-0 certi
The resin systems of RO4500 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefcients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good
CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4500 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through hole reliability. These properties, in combination with a dimensional stability value of less than 0.05%, make RO4500 laminates an excellent candidate for printed
circuit antenna applications. RO4500 materials also provide increased thermal conductivity over equivalent PTFE/woven
glass materials, allowing for design of antennas with increased power handling capability.
In addition to these excellent thermo-mechanical properties, RO4500 laminates embody electrical characteristics that
antenna designers need. The laminates have a dielectric constant (Dk) ranging from 3.3 to 3.5 (±0.08) and a loss tangent
(Df) of 0.0020 to 0.0037 measured at 2.5 GHz. These values allow antenna designers to realize substantial gain values while
minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than –155 dBC
using two 43 dBm swept tones at 1900 MHz.
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based
materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design. Although
Rogers’ high frequency materials have been used successfully in innumerable applications and reports of oxidation resulting
in performance problems are extremely rare, Rogers recommends that the customer evaluate each material and design
combination to determine tness for use over the entire life of the end product.
The information contained in this data sheet and processing guide is intended to assist you in designing with Rogers’ circuit materials and
prepreg. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a particular purpose.
The user is responsible for determining the suitability of Rogers’ circuit materials and prepreg for each application.
The world runs better with Rogers.®
19
Typical Values
RO4500™ Series Cost Performance Laminates
Product
Dielectric
Constant
@10 GHz
Dissipation
Factor
( tan δ) @
2.5 GHz /10 GHz
RO4533™
RO4534™
RO4535™
3.3 ± 0.08
3.4 ± 0.08
3.5 ± 0.08
0.0020 / 0.0025
0.0022 / 0.0027
0.0032 / 0.0037
Dielectric Dimensional
Strength
Stability
V/mil
mm/m
>500
>500
>500
Coefcient of
Thermal
Expansion
ppm/°C
<0.2
<0.3
<0.5
13
11
14
11
14
16
37
46
35
X
Y
Z
Tg
°C
Thermal
Density
Conductivity
gm/
W/m/°K
cm3
Peel
Strength
N/mm
PIM (1)
dBc
range
UL
>280
>280
>280
0.6
0.6
0.6
1.8
1.8
1.9
0.9
1.0
0.9
150-160
150-160
N/A
N/A
N/A
V0(2)
UL 94
Direction
Z
Z
Z
X,Y
Condition
10 GHz 23°C
10 GHz 23°C
0.51mm
after etch
-55 to 288°C
A
100°C
23°C
1 oz. EDC
post
solder
oat
Reected 43
dBm swept
tones
Test
Method
IPC-TM-650
2.5.5.5
IPC-TM-650
2.5.5.5
IPC-TM-650
2.5.6.2
IPC-TM- 650
2.4.39A
IPC-TM-650
2.4.41
IPCTM-650
2.4.24
ASTM F433
ASTM
D792
IPCTM-650
2.4.8
Summitek
1900b PIM
Analyzer
Ordering Information:
Laminate Thickness and Copper Foil Options:
Standard
Panel Sizes:
Product
30
(0.762)
RO4533
RO4534
RO4535
32 (0.813)
40
(1.016)
24”X18” (610 X 457 mm)
48”X36”(1.224 X 0.915 m)
Additional thicknesses and panel sizes are available up to 50”
X 110” (Untrimmed)
60
Copper Cladding:
(1.524)
Standard EDC:
1/2 oz (17mm), 1 oz (35 Pm)
Reverse Treated EDC for PIM Sensitive Applications:
1/2 oz (17mm), 1 oz (35 Pm)
For most applications the standard EDC foil should be used. When PIM and
insersion loss is critical, the reverse-treat copper should be considered. Rogers’ uses a proprietary surface modier to bond reverse-treat foils to RO4000
laminates.
(1) PIM Performance is heavily inuenced by the copper choice. PIM values provided are based on testing of reverse-treat electrodepostied copper foils. Typical PIM rating on standard EDC foils are < -145 dBm. Refer to the laminate thickness and copper option table for
material options.
(2) UL94 V-0 certication in process; not certied by UL.
Typical values are a representation of an average value for the population of the property.
For specication values contact Rogers Corporation.
The information contained in this data sheet and processing guide is intended to assist you in designing with Rogers’ circuit materials and
prepreg. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or tness for
a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a particular purpose.
The user is responsible for determining the suitability of Rogers’ circuit materials and prepreg for each application.
20
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorp.com
Advanced Circuit Materials
Data Sheet
1.4730 LoPro Antenna Grade Laminate
RO4730™ LoPro™ Antenna Grade Laminates
Features:
Benefits:
RO4730 LoPro laminate (low loss dielectric with low
prole foil)
• Reduced PIM
• Low insertion loss
• Match DK to 3.0 materials
Unique ller / closed microspheres
• Low density/lightweight - ~30% lighter than
PTFE/ glass
Low Z-Axis CTE ~40 ppm/°C
High Tg ( same as RO4000® laminate - >280°C)
• Design exibility
• Automated assembly compatible
Low TCDk ~23° ppm/°C
• Consistent circuit performance
Specially formulated thermoset resin system/ller
• Low TCDk
• 3.0 DK
• Ease of fabrication
• PTH process capability
Environmentally friendly
• Halogen free
• Lead free process compatible
• RoHS compliant
™
™
Typical Applications:
•
Base Station Antennas
RO4730 LoPro antenna grade laminates are fully compatible with conventional FR4 and high temperature lead-free solder processing. These laminates do not require the special treatment needed
on traditional PTFE-based laminates for plated through hole preparation. This product is an affordable
alternative to more conventional antenna technologies, thus allowing designers to maximize the price
and performance of their antennas.
The resin systems of RO4730 dielectric materials are designed to provide the necessary properties for
ideal antenna performance. The coefcients of thermal expansion (CTEs) in both the X and Y directions
are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.
The typical glass transition temperature of RO4730 materials exceeds
280°C (536°F), leading to a low Z-axis CTE and excellent plated through
hole reliability.
RO4730 LoPro laminate has excellent thermo-mechanical properties,
and electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) of 3.0 and a loss tangent (Df) of
0.0023 measured at 2.5 GHz. These values allow antenna designers to
realize substantial gain values while minimizing signal loss. Materials are
available with a demonstrated low PIM performance, with values better
than -154 dBc (Using Rogers’ internal test method).
The world runs better with Rogers.®
21
RO4730 LoPro Antenna Grade Laminates - Preliminary Data Sheet
Property
Condition
Test Method
Z
10 GHz/23°C
2.5 GHz
IPC-TM-2.5.5.5
0.0033
0.0023
Z
10 GHz/23°C
2.5 GHz
IPC-TM-650, 2.5.5.5
Thermal Coefcient of Hr
23
Z
ppm/°C
-100°C to
250°C
IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030")
1.40E+13
MΩ•cm
COND A
IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030")
5.50E+12
MΩ
COND A
IPC-TM-650, 2.5.17.1
<-154
dBc
Dielectric Constant, Hr
Dissipation Factor
PIM [2]
Electrical Strength
Typical Value [1]
Direction
3.00 ± 0.08
620
Tensile Modulus
N/A (thin <10 mil)
Tensile Strength
Flexural Strength
Dimensional Stability
Coefcient of Thermal
Expansion
Units
Z
V/mil
IPC-TM-650, 2.5.6.2
MPa (kpsi)
RT
ASTM D638
N/A (thin <10 mil)
MPa (kpsi)
RT
ASTM D638
1.34E+04
MPa (kpsi)
IPC-TM-650, 2.4.4
mm/m (mils/inch)
IPC-TM-650, 2.4.39A
ppm/°C
IPC-TM-650, 2.1.41
-0.14/-0.145
X,Y
19
X
17
Y
40
Z
Thermal Conductivity
0.52
W/m/K
IPC-TM-650 2.5.2.1
Moisture Absorption
0.13
%
IPC-TM-650 2.6.2.1
ASTM D570
Tg
>280
°C TMA
ASTM D3850
Td
441
°C TGA
ASTM D3850
Density
1.45
gm/cm3
ASTM D792
7.7 (1 oz LoPro)
pli
IPC-TM-650 2.4.8
Copper Peel Strength
Flammability
Non FR
Lead-Free Process Compatible
UL
YES
[1] Typical values are a representation of an average value for the population of the property. For specification values contact Rogers
Corporation.
[2] Using Rogers’ internal test method.
Standard Thickness
Standard Panel Size:
Standard Copper Cladding
0.0307” (0.780mm)
0.0407” (1.034mm)
0.0607” (1.542mm)
24”X18” (610 X 457 mm)
48”X36” (1.224 X 0.915mm)
LoPro Reverse Treated EDC Foil: ½ (18Pm),
1 oz (35Pm)
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based
materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design. Although
Rogers’ high frequency materials have been used successfully in innumerable applications and reports of oxidation resulting
in performance problems are extremely rare, Rogers recommends that the customer evaluate each material and design
combination to determine tness for use over the entire life of the end product.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not
intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for
a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular purpose. The user
should determine the suitability of Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export
Administration regulations. Diversion contrary to U.S. law prohibited.
The world runs better with Rogers. and the Rogers’ logo are licensed trademarks of Rogers Corporation
RO4000, LoPro and RO4730 are licensed trademarks of Rogers Corporation.
©2009 Rogers Corporation, Printed in U.S.A. All rights reserved.
Issued 06/2009 0865-0609-0.5CC Publication #92-142
22
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorp.com
Advanced Circuit Materials
Data Sheet
RO3730 Data Sheet
RO3730™ Antenna Grade Laminates
Features:
Benefits:
RO3730™ reinforced woven ber glass with
optimized glass and ller loading
•
•
•
•
Improved mechanical rigidity/easier handling and processing
versus non-reinforced PTFE products
Lower dissipation factor
Low PIM
PTH process capability
Low PIM
•
Reduced signal interference
Low Loss
•
Improved antenna gain
Economically priced
•
Volume manufacturing
Environmentally friendly
•
•
Lead-free process compatible
RoHS compliant
Regional nished goods inventories
•
•
Short lead times / quick inventory turns
Efcient supply chain
Typical Applications:
•
•
•
•
Base Station Antennas
RFID Antennas
WLAN Antennas
Satellite Radio Antennas
RO3730 laminates have the excellent thermo-mechanical properties, and electrical characteristics that antenna
designers need. The laminates have a dielectric constant (Dk) of 3.0 and a loss tangent (Df) of 0.0013 measured at
2.5 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials
are available with a demonstrated low PIM performance, with values better than -154 dBc* (using Rogers’ internal test
method).
RO3730 materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques
as described in the application note, “Fabrication Guidelines for RO3730
High Frequency Circuit Materials.”
Cladding is 1 ounce rolled annealed copper (35 Ǎm thick). RO3730
laminates are manufactured under an ISO 9002 certied quality system.
The world runs better with Rogers.®
23
Typical Values
RO3730™ Antenna Grade Material
Property
Dielectric Constant, Hr
Dissipation Factor, G
Typical
Value
Direction
3.00 ± 0.06
0.0016
0.0013
Units
Condition
Test Method
Z
10 GHz/23°C
IPC-TM-2.5.5.5
Z
10 GHz/23°C
2.5GHz/23°C
IPC-TM-650, 2.5.5.5
MΩ•cm
COND A
IPC-TM-650, 2.5.17.1
MΩ
COND A
IPC-TM-650, 2.5.17.1
Volume Resistivity
107
Surface Resistivity
10
Flexural Strength
9
8
X
Y
MPa (kpsi)
IPC-TM-650, 2.4.4
0.02
0.03
X
Y
mm/m
(mils/inch)
IPC-TM-650, 2.4.39A
11
X
12
Y
ppm/°C
IPC-TM-650, 2.1.41
65
Z
Dimensional Stability
Coefcient of Thermal
Expansion
PIM
7
<-154*
dBc
Td
500
°C TGA
Thermal Coefcient of Hr - TcDK
-22
ppm/°C
-50°C to +150°C
Thermal Conductivity
0.45
W/m/°K
D24/23
Moisture Absorption
0.04
%
D48/50
ASTM D570
Specic Gravity
2.1
gm/cm3
23°C
ASTM D792
1.8
(10.5)
N/mm
(pli)
10 sec. 550°F
Solder Float
IPC-TM-650 2.4.8
Copper Peel Strength
ASTM D3850
IPC-TM-650 2.6.2.1
V-0
pending
Flammability
Lead-Free Process
Compatible
UL94
YES
*as tested on similar constructions in development.
Thickness
0.030” (0.762mm),
0.060” (1.524mm)
Panel Sizes
24"X18" (610mm X 457mm)
24"X54" (610mm X 1.37m)
Standard Claddings
1 oz. Rolled Copper foil
Typical values are a representation of an average value for the population of the property. For specification values contact Rogers
Corporation.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
The Rogers’ logo and The world runs better with Rogers are licensed trademarks for Rogers Corporation
RO3730 is a licensed trademark of Rogers Corporation.
© 2009 Rogers Corporation, Printed in U.S.A., All rights reserved.
Issued August 2009 0877-0809 Publication #92-144
24
Advanced Circuit Materials
Data Sheet and Processing Guidelines for
RO4403™, RO4450B™ and RO4450F™ Prepregs
RO4000® dielectric materials have long been used in combination with FR4 cores and prepreg as a means
to achieve a performance upgrade of standard FR4 multilayer designs. RO4003C™ and RO4350B™ glass
reinforced hydrocarbon/ceramic laminates have been used in layers where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. FR4 cores
and prepreg are still commonly used to inexpensively form less critical signal layers.
The RO4400™ prepreg family is comprised of three grades based on the RO4000 series core materials, and
are compatible in multilayer constructions with either RO4003C or RO4350B laminates. A high post-cure Tg
(>280°C) makes RO4400 series prepreg an excellent choice for multilayers requiring sequential laminations
as fully cured RO4400 prepregs are capable of handling multiple lamination cycles. In addition, FR4 capatible bond requirements (350°F/177°C) permit RO4400 prepreg and low flow FR4 prepreg to be combined
into non-homegeneos multilayer constructions using a single bond cycle.
RO4450F™ prepreg is the latest product in the RO4400 family of prepregs. RO4450F prepreg has demonstrated improvement in lateral flow capability, and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements.
RO4450B™ prepreg is available in both 3.6 mil and 4.0 mil thicknesses. The electrical properties of these two
prepreg thicknesses differ slightly due to the resin-to-glass ratio, and this should be taken into consideration
during electrical design review.
Each of the RO4450™ series prepregs are recognized by Underwriter Laboratories with the UL-94 flame rating, and are compatible with lead-free processes.
PROCESSING GUIDELINES:
STORAGE:
Upon receipt, all prepreg should be immediately moved from the receiving area into a controlled
environment. Proper storage conditions would include temperatures between 10°C and 30°C (50°F
and 85°F) and protection against exposure to catalytic conditions such as high radiation and ultraviolet
light. The prepreg should not be stored under vacuum. It is best to store the prepreg in its heat sealed
packaging, partially used packages should be resealed with tape.
When properly stored, prepreg properties will be maintained for 12 months from the date of manufacture.
A “first-in, first-out” inventory system is recommended.
UNPACKING:
RO4400 prepregs are packaged in a dust-free environment, but will collect dust and debris from counter
tops. We recommend counter tops be cleaned prior to unpackaging the prepreg. Plastic slip-sheeting has
been provided to ease separation of individual plies and to shield the prepreg from contamination until it is
ready for use.
25
TOOLING:
Tooling holes can be punched, drilled, or cut. Thin entry and exit materials may be needed to support the
prepreg through the tooling hole formation process. The slip-sheeting should remain in place through tooling as it will shield the prepreg from contamination and should eliminate the risk of individual plies fusing
together as the tooling holes are formed.
MULTILAYER PREPARATION:
Each ply of RO4450F™ and RO4450B™ 4-mil prepreg will bond to a nominal 0.004” (0.101mm) thickness,
and each ply of RO4450B 3.6-mil prepreg will bond to a nominal 0.0036” (0.091mm) when recommended
bonding parameters are used. The actual thickness each ply will add to a multilayer construction is
dependent upon the weight and distribution of copper on the innerlayer surfaces.
Rogers recommends the use of two or more plies of prepreg between metal layers, and that the proper
press cycle parameters are used per our guidelines. Any deviation from these recommendations can lead
to poor fill performance or electrical failures, especially in high-speed digital/high density designs. If the
design requires single-ply usage between metal layers, the user must ensure the proper testing protocol is in
place to evaluate fill/flow and electrical performance. Contact your local technical services representative
for questions or assistance with these guidelines.
Also contact your local technical services representative for designs using more than six metal layers, or 35
micron foil on both sides, or when bonding against FR4 cores.
Etched dielectric surfaces should not be mechanically or chemically altered prior to multilayer bonding.
Innerlayer metal surfaces should be oxide treated to promote improved mechanical adhesion. Reduced
black oxide, brown oxide, and additive or subtractive oxide alternatives have been successfully applied.
Inner-layers should be baked for 15 to 30 minutes at 115°C to 125°C just prior to preparing the multi-layer
package for bonding.
Core bonded constructions are preferred, but foil bonded outer-layers are an option with RO4400 prepregs.
Rogers’ qualified and recommended copper foil is HTE-TWS available from Circuit Foils. Sheeted foils are
available through the manufacturers or through the sheeting service listed below:
Circuit Foil America
625 rue du Luxembourg
Granby J2J 2S9 - Canada
Phone (+1) 450-770-8558
Fax: (+1) 450-770-8022
Contact Information:
USA Customers
Copper Rolls - petey.decarlo@circuitfoil.com
(fax # +1-215-887-6911)(USA)
Copper Sheets - carmen.pignon@circuitfoil.com
(fax # +1-450-405-4622)(Canada)
Europe and Asia
Copper Rolls and sheets - paul.jung@circuitfoil.com
(fax # +11 352 95 75 51 249)(Luxembourg)
The information contained in this data sheet and processing guide is intended to assist you in designing with Rogers’ circuit materials
and prepreg. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability
or fitness for a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a
particular purpose. The user is responsible for determining the suitability of Rogers’ circuit materials and prepreg for each application.
Page 2 of 4
26
RO4450B™ and RO4450F™ prepregs allow a rapid ramp to 107°C (225°F), a 2.8°C - 4.0°C/Min (5°F-7°F) ramp
rate between 107°C and 121° (250°F), and a maximum 2.2°C/Min (4°F/min) from 121°C to 177°C (350°F). The
full pressure of 400 psi should be used regardless of vacuum assistance potential, and lengthy (>5 minutes)
draw downs should be avoided. Pressure should be applied before package temperature exceeds 38°C
(100°F). Transfer to a cooling press is allowed after a 60 minute dwell at 177°C. The graph below provides
an optimum temperature and pressure profile for bonding RO4450B and RO4450F prepregs. The temperature profile can be matched using an in-hot process. Time vs. temperature trials may be required to define
requirements for lagging materials.
Special Bonding Note: The RO4450B and RO4450F prepreg resin system is at its lowest viscosity at temperatures between 210°F (100°C) and 250°F (120°C). High layer count MLB’s, designs with buried metal layers
thicker than ½ oz. copper, and constructions using single plies of RO4450B or RO4450F prepreg will benefit
by spending 20 minutes in the reduced viscosity window. This can be accomplished by ramping at a rate of
2°F/Min (1°C/Min) or by dwelling at 240°F (115°C) for 20 minutes. Should the latter approach be chosen, the
ramp rates from RT to 240°F (115°C) and from 240°F to 350°F (115°C-175°C) can be 5°F-7°F/Min (2.8°C-4.0°C/
Min). Care should be taken to not exceed 250°F (120°C) during the 20 minute dwell.
Cycle time:
2 hours
Outerlayer and PTH Processing: Processing guidelines for RO4003C™ and RO4350B™ double-sided circuits
are applicable to RO4000® MLB’s. However, the multilayer constructions will require desmear. CF4/O2
plasma and alkaline-permanganate processes used to desmear high Tg (170°C) FR4 materials have been
found to work well with RO4000 multilayers. While desmear may be required, etchback of the resin system is
not recommended.
The information contained in this data sheet and processing guide is intended to assist you in designing with Rogers’ circuit materials
and prepreg. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability
or fitness for a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a
particular purpose. The user is responsible for determining the suitability of Rogers’ circuit materials and prepreg for each application.
Page 3 of 4
27
Typical Values
PROPERTY
Thickness
Dielectric Constant , εr
RO4403TM, RO4450BTM, RO4450FTM Prepreg
TYPICAL VALUES
DIRECTION
UNITS
CONDITION
TEST METHOD
4 (0.102)
Z
mils (mm)
-
-
RO4403
RO4450B
RO4450F
4 (0.10)
4 (0.10)
3.17 ± 0.05
3.54 ± 0.05
3.52 ± 0.05
Z
-
10GHz - 23°C
IPC-TM-650, 2.5.5.5
Dissipation Factor,
tan δ
0.005
0.004
0.004
Z
-
10GHz-23°C
IPC-TM-650, 2.5.5.5
Dielectric Strength
1000
1000
1000
Z
V/mil
23°C/50% RH
IPC-TM-650, 2.5.6
Volume
Resistivity
3.3 X 1010
>2.5 X 1010
TBD
-
MΩ•cm
23°C/50% RH
IPC-TM-650, 2.5.17.1
Surface
Resistivity
1.9X108
1.9 X 108
TBD
X,Y
MΩ
23°C/50% RH
IPC-TM-650, 2.5.17.1
0.46
0.60
0.65
Z
W/m/K
100°C
ASTM F433
ASTM D570
IPC-TM-650 2.4.24
Thermal
Conductivity
Moisture
Absorption
0.05
0.05
0.09
-
%
48 hrs
immersion
0.060” sample
temperature
50°C
Tg
>280
>280
>280
-
°C TMA
-60°C - 300°C
@ 10°C/min
Td
390
390
390
-
°C TGA
Density
1.65
1.86
1.83
-
gm/cm
Dimensional Stability
Copper
Adhesion
Coefficient of Thermal
Expansion
Color
Flammability
Lead-Free Process
Compatible
3
ASTM D3850
23°C
ASTM D792
IPC-TM-650, 2.2.4
0.6
TBD
-0.065
X,Y
mils/inch
After Etch
+E2/150
5* (0.88)
4.9* (0.86)
4.0* (0.70)
Z
pli (N/mm)
After Solder
Float
IPC-TM-650, 2.4.8
16
19
80
19
17
60
19
17
50
X
Y
Z
ppm/°C
-55 to 125°C
IPC-TM-650, 2.4.41
White
White
White
-
-
-
-
-
94V-0
94 V-0
Yes
Yes
Yes
*Tested on ½ oz. EDC foil for RO4450B and 1 oz. EDC foil for RO4403 prepreg.
STANDARD THICKNESS:
RO4403/RO4450B: 0.004” (0.101mm)
RO4450F: 0.004” (0.101mm)
STANDARD SIZE:
24X18” Sheets (610mm X 457mm) Contact Customer Service for
other available sizes.
28
29
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
1.3000
RO3000® Series High Frequency Circuit Materials
Features and Benefits:
• Low dielectric loss for high frequency
performance (RO3003). Laminate can be
used in applications up to 30-40 GHz.
• Excellent mechanical properties versus
temperature for reliable stripline and
multilayer board constructions.
• Uniform mechanical properties for a range of
dielectric constants. Ideal for multilayer board
designs with a range of dielectric constants.
Suitable for use with epoxy glass multilayer
board hybrid designs.
• Stable dielectric constant versus temperature
and frequency for RO3003. Ideal for band
pass filters, microstrip patch antennas, and
voltage controlled oscillators.
• Low in-plane expansion coefficient (matched
to copper). Allows for more reliable surface
mounted assemblies. Ideal for applications
sensitive to temperature change and
excellent dimensional stability.
• Volume manufacturing process for
economical laminate pricing.
Typical Applications:
• Automotive Collision Avoidance Systems
• Automotive Global Positioning Satellite
Antennas
• Cellular and Pager Telecommunications
Systems
• Patch Antennas for Wireless Communications
• Direct Broadcast Satellites
• Datalink on Cable Systems
• Remote Meter Readers
• Power Backplanes
RO3000® High Frequency Circuit Materials are
ceramic- filled PTFE composites intended for use
in commercial microwave and RF applications.
This family of products was designed to offer
exceptional electrical and mechanical stability at
competitive prices.
RO3000® series laminates are PTFE-based circuit
materials with mechanical properties that are
consistant regardless of the dielectric constant
selected. This allows the designer to develop
multilayer board designs that use different dielectric
constant materials for individual layers, without
encountering warpage or reliability problems.
The dielectric constant versus temperature of
RO3000 series materials is very stable (Charts 1
and 2). These materials exhibit a coefficient of
thermal expansion (CTE) in the X and Y axis of 17
ppm/oC. This expansion coefficient is matched to
that of copper, which allows the material to exhibit
excellent dimensional stability, with typical etch
shrinkage (after etch and bake) of less than 0.5
mils per inch. The Z-axis CTE is 24 ppm/ C, which
provides exceptional plated through-hole reliability,
even in severe thermal environments.
RO3000® series laminates can be fabricated
into printed circuit boards using standard PTFE
circuit board processing techniques, with minor
modifications as described in the application note
“Fabrication Guidelines for RO3000® Series High
Frequency Circuit Materials.”
Available claddings are ½ , 1 or 2 oz./ft2 (17, 35, 70
Pm thick) electrodeposited copper foil.
RO3000® laminates are manufactured under an ISO
9002 certified system.
The world runs better with Rogers.®
30
Chart 1: RO3003™ Laminate Dielectric Constant vs. Temperature
The data in Chart 1 demonstrates the excellent stability
of dielectric constant over temperature for RO3003™––- laminates, including the elimination
of the step change in dielectric
constant, which occurs near
room temperature with PTFE
glass materials.
Chart 2: RO3006™ and RO3010™ Laminate Dielectric Constant vs. Temperature
The data in Chart 2 shows the
change in dielectric constant
vs. temperature for RO3006™
and RO3010™ laminates. These
materials exhibit significant
improvement in temperature
stability of dielectric constant
when compared to other high
dielectric constant PTFE laminates.
Chart 3: Dielectric Constant vs. Frequency for RO3000® Series Laminate
Chart 3 demonstrates the stability of dielectric constant for
RO3000® series products over
frequency. This stability simplifies the design of broad- band
components as well as allowing the materials to be used in
a wide range of applications
over a very broad range of
frequencies.
The data in Charts 1, 2 and 3 was produced using a modified IPC-TM-650, 2.5.5.5 method. For additional information request Rogers
T.R. 5156 and T.M. 4924.
31
Typical Values
RO3000 Series High Frequency Laminates
PROPERTY
TYPICAL VALUE
RO3003
Dielectric Constant Hr
Dissipation Factor
RO3006
(1)
DIRECTION
UNIT
CONDITION
TEST METHOD
RO3010
3.00±0.04(2) 6.15±0.15 10.2±0.30
Z
-
10GHz 23°C
IPC-TM-650
2.5.5.5
0.0013
0.0020
0.0023
Z
-
10GHz 23°C
IPC-TM-650
2.5.5.5
Thermal Coefficient
of Hr
13
-160
-280
Z
ppm/°C
10GHz 0-100°C
IPC-TM-650
2.5.5.5
Dimensional Stability
0.5
0.5
0.5
X,Y
mm/m
COND A
ASTM D257
Volume Resistivity
107
103
103
M:•cm
COND A
IPC 2.5.17.1
Surface Resistivity
107
103
103
M:
COND A
IPC 2.5.17.1
Tensile Modulus
2068
(300)
2068
(300)
2068
(300)
X,Y
MPa
(kpsi)
23°C
ASTM D638
Water Absorption
<0.1
<0.1
<0.1
-
%
D24/23
IPC-TM-650
2.6.2.1
0.93
(0.22)
0.93
(0.22)
0.93
(0.22)
Thermal Conductivity
0.50
0.61
0.66
-
W/m/K
100°C
ASTM C518
Coefficient of Thermal
Expansion
17
24
17
24
17
24
X,Y
Z
ppm/°C
-55 to 288°C
ASTM D3386-94
Td
500
500
500
Color
Tan
Tan
Off White
Density
2.1
2.6
3.0
gm/cm3
Copper Peel Strength
3.1
(17.6)
2.1
(12.2)
2.4
(13.4)
N/mm
(lb/in)
Flammability
94V-0
94V-0
94V-0
Yes
Yes
Yes
Specific Heat
Lead Free Process
Capatible
J/g/K
(BTU/lb/°F)
Calculated
°C TGA
ASTM D 3850
After solder
float
IPC-TM-2.4.8
UL
(1) References: Internal T.R.’s 1430, 2224, 2854. Tests at 23°C unless otherwise noted. Typical values should not be used for specification
limits.
(2) The nominal dielectric constant of an 0.060” thick RO3003® laminate as measured by the IPC-TM-650, 2.5.5.5 will be 3.02, due to the
elimination of biasing caused by air gaps in the test fixture. For further information refer to Rogers T.R. 5242.
STANDARD THICKNESS:
RO3003:
RO3006/3010:
0.005” (0.13 mm) 0.005”(0.13 mm)
0.010” (0.25 mm) 0.010”(0.25 mm)
0.020” (0.50 mm) 0.025”(0.64 mm)
0.030” (0.75 mm) 0.050”(1.28 mm)
0.060” (1.52 mm)
STANDARD PANEL SIZE:
STANDARD COPPER CLADDING:
RO3003:
12” X 18” (305 X 457mm)
24” X 18” (610 X 457mm)
24” X 36” (610 X 915mm)
½ oz. (17Pm), 1 oz. (35Pm),
2 oz. (70Pm) electrodeposited copper foil.
RO3006/3010:
18” X 12” (457 X 305mm)
18” X 24” (457 X 610mm)
18” X 36” (457 X 915mm)
18” X 48” (457 X 1.224m)
32
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorp.com
Advanced Circuit Materials
Data Sheet
1.3035
RO3035™ High Frequency Circuit Materials
Features and Benefits:
• Low dielectric loss for high frequency
performance. Laminate can be used in
applications up to 30-40 GHz.
• Excellent mechanical properties versus
temperature for reliable stripline and multilayer
board constructions.
• Uniform mechanical properties for a range of
dielectric constants. Ideal for multilayer board
designs with a range of dielectric constants.
Suitable for use with epoxy glass multilayer
board hybrid designs.
• Stable dielectric constant versus temperature
and frequency. Ideal for band pass filters,
microstrip patch antennas, and voltage
controlled oscillators.
• Low in-plane expansion coefficient (matched
to copper). Allows for more reliable surface
mounted assemblies. Ideal for applications
sensitive to temperature change and excellent
dimensional stability.
• High thermal conductivity for lower operating
temperature and increased reliability in Power
Amplifier applications.
RO3000® high frequency circuit materials are
ceramic- filled PTFE composites intended for use
in commercial microwave and RF applications.
This family of products was designed to offer
exceptional electrical and mechanical stability at
competitive prices.
RO3000 series laminates are ceramic-filled PTFE
based circuit materials with mechanical properties
that are consistent regardless of the dielectric
constant selected. This allows the designer to
develop multilayer board designs that use different
dielectric constant materials for individual layers,
without encountering warpage or reliability
problems.
The dielectric constant versus temperature of
RO3000 series materials is very stable . These
materials exhibit a coefficient of thermal expansion
(CTE) in the X and Y axis of 17 ppm/oC. This
expansion coefficient is matched to that of copper,
which allows the material to exhibit excellent
dimensional stability and minimizes the tendency for
bow and twist. This matched expansion coefficient
also eliminates the tendency for delamination for
thick metal cladding. The Z-axis CTE is 24 ppm/ C,
which provides exceptional plated through-hole
reliability, even in severe thermal environments.
RO3000 series laminates can be fabricated
into printed circuit boards using standard PTFE
circuit board processing techniques, with minor
modifications as described in the application note
“Fabrication Guidelines for RO3000 Series High
Frequency Circuit Materials.”
Available claddings are 1/2, 1, 2 copper foil
and custom thick metal plates per customer
specifications.
RO3000 laminates are manufactured under an ISO
9002 certified system.
The world runs better with Rogers.®
33
Typical Value
RO3035™ High Frequency Laminates
Property
Dielectric Constant, Hr
Dissipation Factor
Typical Value (1)
Direction
Unit
Condition
Test Method
3.50 ± 0.05
Z
-
10 GHz 23°C
IPC-TM-650
2.5.5.5
.0018
Z
-
10 GHz 23°C
IPC-TM-650
2.5.5.5
Volume Resistivity
107
M:•cm
COND A
IPC 2.5.17.1
Surface Resistivity
107
M:
COND A
IPC 2.5.17.1
%
D24/23
IPC-TM-650
2.6.2.1
Water Absorption
<0.1
Specific Heat
-
0.93
(0.22)
Thermal Conductivity
Coefficient of Thermal Expansion
Calculated
0.50
-
W/m/K
100°C
ASTM C518
17
24
X,Y
Z
ppm/°C
-55 to 288°C
ASTM D3386-94
20 sec. @ 288°C
IPC-TM-2.4.8
Color
Tan
Density
2.1
Copper Peel Strength
1.6
(9.1)
Flammability
94V-0
Lead-free Process Compatible
J/g/K
(BTU/lb/°F)
gm/cm3
N/mm
(lb/in)
After solder
float
UL
Yes
(1) Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corporation.
STANDARD THICKNESS:
0.005" (0.13 mm)
0.010" (0.25 mm)
0.020" (0.50 mm)
0.030" (0.75 mm)
0.060" (1.52 mm)
STANDARD PANEL SIZE:
STANDARD COPPER CLADDING:
18” X 12” (457 X 305mm)
18” X 24” (457 X 610mm)
18” X 36” (457 X 915mm)
18” X 48” (457 X 1.224m)
½ oz. (17Pm), 1 oz. (35Pm),
2 oz. (70Pm) electrodeposited copper foil.
Additional claddings: Available with thick
copper
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
Rogers Advanced Circuit Materials Division, ISO 9002 Certified
Rogers NV - Gent
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480-961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480-961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information in this data sheet is intended to assist you in designing with Rogers' circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers' circuit material laminates for each application.
These commodities, technology or software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law is prohibited.
The world runs better with Rogers. and the Rogers' logo are licensed trademarks of Rogers Corporation.
RO3000 and RO3035 are licensed trademarks of Rogers Corporation.
©2004, 2005, 2009 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 2/2009, 0849-0209-.5CC Publication #92-119
34
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
RO3200™ Series High Frequency Circuit Materials
Features:
•
•
•
•
•
•
•
•
Woven glass reinforcement improves rigidity
for easier handling.
Uniform electrical and mechanical
performance is ideal for complex multilayer
high frequency structures.
Low dielectric loss for high frequency
performance (RO3203) can be used in
applications exceeding 20 GHz.
Excellent mechanical properties over a wide
range of dielectric constants are ideal for
multilayer board designs.
Low in-plane expansion coefcient
(matched to copper) is suitable for use with
epoxy glass multilayer board hybrid designs
and reliable surface mounted assemblies.
Excellent dimensional stability for high
production yields.
Economically priced for volume
manufacturing.
Surface smoothness allows for ner line
etching tolerances.
Typical Applications:
•
•
•
•
•
•
•
•
•
•
Automotive Collision Avoidance Systems
Automotive Global Positioning Satellite
Antennas
Wireless Telecommunications Systems
Microstrip Patch Antennas
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes
LMDS and Wireless Broadband
Base Station Infrastructure
1.3200
RO3203™ , RO3206™ and RO3210™ High Frequency
Circuit Materials are ceramic-lled laminates reinforced with woven berglass. These materials are
engineered to offer exceptional electrical performance and mechanical stability at competitive
prices. The RO3200™ Series High Frequency Materials were designed as an extension of the RO3000®
Series High Frequency Circuit Materials with one
distinguishing characteristic - improved mechanical stability.
The dielectric constant of RO3203 High Frequency
Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency
range beyond 40 GHz. The dielectric constant
for RO3206 laminate is 6.15 and 10.2 for RO3210
laminate. The dissipation factor for RO3206 and
RO3210 laminates is 0.0027
RO3200 series laminates combine the surface
smoothness of a non-woven PTFE laminate, for
ner line etching tolerances, with the rigidity of a
woven-glass PTFE laminate. These materials can
be fabricated into printed circuit boards using
standard PTFE circuit board processing techniques
as described in the application note, “Fabrication Guidelines for RO3000® Series High Frequency
Circuit Materials.”
Available cladding options are ½, 1 or 2 oz./ft2 (17,
35, 70 Pm thick) electrodeposited copper foil.
RO3200™ series laminates are manufactured under
an ISO 9002 certied quality system.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.™
35
Typical Values
RO3200™ series High Frequency Laminates
PROPERTY
TYPICAL VALUE
DIRECTION
CONDITION
TEST METHOD
Z
10 GHz/23°C
IPC-TM-650, 2.5.5.5
0.0027
Z
10 GHz/23°C
IPC-TM-650, 2.5.5.5
107
104
Z
Mohm cm
A
ASTM D257
107
107
104
Z
Mohm
A
ASTM D257
0.08
0.08
0.08
X,Y
mm/m
+E2/150
after etch
IPC-TM-650, 2.4.3.9
240
215
140
140
X
Y
kpsi
RT
ASTM D638
RO3203
RO3206
RO3210
10.2±0.50
0.0016
0.0027
Volume Resistivity
107
Surface Resistivity
Dimensional Stability
Dielectric Constant, Hr
3.02±0.040(1) 6.15± 0.15
Dissipation Factor, tan G
Tensile Modulus
UNITS
Flexural Modulus
400
300
650
520
510
460
X
Y
kpsi
A
ASTM D790
Tensile Strength
12.5
13
9
8
9
7
X
Y
kpsi
RT
ASTM D638
Flexural Strength
9
8
14
13
12
10
X
Y
kpsi
A
ASTM D790
Moisture Absorption
<0.1
<0.1
<0.1
%
D24/23
IPC-TM-650, 2.6.2.1
Thermal Conductivity
0.47 (3.2)
0.63 (4.4)
0.81 (5.5)
W/m/K
Coefcient of
Thermal
Expansion
58
13
34
13
34
13
Td
500
500
Density
2.1
Copper Peel Strength
Flammability
ppm/°C
ASTM C518
-55 to 288°C
ASTM D3386
500
°C TGA
ASTM D 3850
2.7
3.0
23°C
ASTM D792
10 (1.74)
7 (1.30)
13 (2.4)
After Solder
IPC-TM-650, 2.4.8
94V-0
94V-0
94V-0
Yes
Yes
Yes
Lead-Free Process
Compatible
Z
X,Y
Float
100°C
(BTU in/ft2/hr/°F)
lbs/in (N/mm)
UL
(1) The nominal dielectric constant of an .060” thick RO3203™ laminate as measured by the IPC-TM-650, 2.5.5.5 will be 3.04, due to the elimination of biasing caused by gaps in the
test xture. For further information, refer to ROGERS T.R. 5242.
STANDARD THICKNESS:
STANDARD PANEL SIZE:
STANDARD COPPER CLADDING:
RO3203:
RO3206/RO3210:
0.010” (0.254mm) 0.025” (0.635mm)
0.020” (0.508mm) 0.050” (1.270mm)
0.030” (0.762mm)
0.060” (1.524mm)
18” X 12” (457 X 305mm)
18” X 24” (457 X 610mm)
18” X 36” (457 X 915mm)
18” X 48” (457 X 1.224m)
½ oz. (17Pm), 1 oz. (35Pm),
2 oz. (70Pm) electrodeposited copper foil.
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
Rogers Advanced Circuit Materials - ISO 9000:2000 certied
Rogers NV - Gent - ISO 9000:2000 certied
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480-961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480-961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
RO3000, RO3200, RO3203, RO3206, and RO3210 are licensed trademarks of Rogers Corporation
© 1998,1999, 2001, 2003, 2005, 2006 Rogers Corporation, Printed in U.S.A., All rights reserved.
Revised 11/06, 0695-1106-.5-CC, Publication #92-109
36
Advanced Circuit Materials
3001 Bonding Film Properties and Laminating
Techniques
Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer. It is recommended for bonding low
dielectric constant PTFE (Teflon® fluorocarbon polymer) microwave stripline packages and other multilayer
circuits. It may also be used to bond other structural and electrical components to the dielectric.
3001 bonding film features a low dielectric constant and low loss tangent at microwave frequencies, ensuring
minimum interference with the electrical function of bonded stripline and other multilayer constructions. It is
compatible with Rogers RT/duroid® low dielectric constant laminates, ULTRALAM® woven glass/PTFE microwave circuit laminates, RO3000® series high frequency circuit materials, RT/duroid® 6002 ceramic filled circuit
materials, and other PTFE-based low dielectric constant substrates.
Reliable bonds can be achieved with 3001 bonding film using equipment readily available in the printed circuit
fabrication industry. Laminating techniques are familiar to most circuit fabrication shops. The film is easily cut
to size, and accurate relief holes for tooling slots and surface mounted launchers may be punched.
3001 bonding film is available in a thickness of 0.0015" (0.381mm), in continuous 12" (305mm) wide rolls, on
standard 3" ID cores. Properly designed packaging and plastic cores ensure freedom from airborne contamination, and paper of cardboard "lint".
(See product data on page 40)
The world runs better with Rogers.®
37
PREPARATION:
BONDING TECHNIQUE:
1. Copper: Following etching and stripping of the
etch resist, copper circuitry should be treated
with a light microetch to ensure complete
removal of resist residues and to provide
sufficient topography for sound mechanical
adhesion. DO NOT mechanically clean.
1. Layup: Assemble boards to be bonded
interleaved with bonding film between
dielectric layers. In cases where registration
is critical, the plates should be provided
with pins and the boards and film with holes.
Clean room or filtered air flow conditions are
recommended. A thermocouple inserted at
the bond line is recommended for observing
the lag time for reaching the bonding
temperature. Thermocouples should be small
diameter and located where they will not
damage the part or interfere with pressure
uniformity.
NOTE: Do not use 3001 Bond Film when bonding to
metal ground planes or where inner layers are
mostly metal.
2. All surfaces to be bonded should be free of
contaminants that impair adhesion, including
dust, grease, oil, fingerprints, non-adherent
oxides, salts or other process chemical residues.
A final rinse of deionized water may be
followed by a dip in clean isopropyl alcohol.
Avoid use of compressed air which can deposit
airborne contaminates such as oil.
The PTFE surface as initially exposed by etching
away electrodeposited foil is typically waterwettable and capable of forming a bond
without a sodium etch treatment. Almost any
kind of solid surface contact by scrubbing,
swabbing, rubbing or normal stacking and
handling will destroy that wettability by
distorting the microscopic surface features left
from the copper cladding. The result will be
that a PTFE surface treatment will be needed
to assure repeatability of a good bond. Treat
the surface with one of the commercially
available elemental sodium solutions such as
Poly-Etch® or FluoroEtch®. Alternatively, sodium
complex in liquid ammonia according to U.S.
Patent 2,789,062 can be used. (Because of the
high ceramic content on RT/duroid 6002, 6006,
6010, RO3000™ and RO3200™ families, surface
preparation might not be needed and not
recommended).
Hot air oven baking should be used to assure
removal of all solvent residues. This can be as
little as 45 to 60 minutes at 121°C (250°F) but
with some solvents such as acetone, methylene
chloride or trichlor as much as 2 hours at 150°C
(302°F) may be needed to assure complete
solvent removal.
3. Staging: Boards prepared for bonding should
be stored in a clean, dry environment.
Generally layup and bonding should be done
within 24 hours of surface preparation.
4. 3001 Bonding Film: The bonding film arrives
ready for use and requires no further
preparation. Handle the film in a clean, dustfree environment only with gloves to avoid
contamination with skin acids and oils.
2. Clamp: While the press is cool, typically below
120°C (248°F), center the assembly package
on the platen area. Close the press and adjust
the hydraulic system so that the bond area
receives the desired pressure. Generally 100 psi
is sufficient but up to 200 psi may be required
to assure flow of the bonding film when the
copper pattern occupies a greater part of the
bond areas.
Clamping in a cool press followed by heating
is important for uniformity of temperature
across the bond area as the bonding film
fuses.
3. Heat: Start the platen heating cycle toward
a 220°C (428°F) set point. Generally the
maximum heating rate is acceptable as
long as enough control is used to keep the
upper and lower platens at nearly the same
temperature, within 1 to 5°C.
4. Dwell: Hold the temperatures at the bond
line at set point for a minimum of 15 minutes.
This allows the film, in its melted state, time to
flow and wet the surfaces to be bonded. The
embedded thermocouple is useful to be sure
the bond line actually sees this dwell. For thick
layups there could be enough lag in heating
to require an extended dwell. Sometimes dwell
might need to be increased to 30-45 minutes.
5. Cool: Turn the heating power supply off and
cool the platens while continuing to maintain
the clamp pressure until the temperature is
down to 120°C (248°F). Remove pressure and
take the assembly out of the press. Platen
cooling water flow could be stopped at this
point to save on heating time on the next
cycle since 120°C (248°F) is cool enough for
clamping in Step 2.
38
Notes:
b. The bonding parameters of temperature,
pressure and time are interrelated and may
be adjusted somewhat to suit individual
requirements. The minimum possible
bonding temperature is 199°C (390°F),
while temperatures over 246°C (475°F)
should be avoided to prevent excess flow.
Excessive temperature may result in material
decomposition and excessive fuming. Vacuum
lamination (14 psi) has been used to obtain a
satisfactory bond.
c. In some cases, it may be feasible to increase
productivity by a transfer press technique in
which the board assembly in a metal plate
fixture is clamped in a hot press where it
quickly reaches the 220°C (428°F) set point
and dwells long enough to melt and flow. The
pressure is then released and the assembly
moved and reclamped at once in a second
press at 120°C (248°F) where it quickly cools to
freeze the bonding film. Design the fixture with
enough thermal capacity and in-plane thermal
conductivity to avoid uneven heating, and to
minimize premature heating or cooling during
press transfers. Pressure must be re-applied
before bond line temperature drops below
220°C (428°F).
d. Bonding presses should be well maintained
and in good working order. Features such as
platen flatness, degree of parallel, temperature
uniformity at heating and cooling, etc, as well
as routine lamination practices should agree
with generally accepted industry guidelines
as well as those of the manufacturer. For
further information the following references
may be consulted: Printed Circuit Handbook,
C.Coombs, McGraw Hill, 1988; The Multilayer
Printed Circuit Handbook, J.A. Scarlett ed.,
Electrical Publications 1985.
e. Packages properly bonded will yield a bond
strength (peel) in excess of 20 lbs. per inch
width.
Safety Note:
As with all halocarbon polymers when subjected
to temperatures at or above their melting point,
adequate ventilation should be provided.
39
Water cool
under pressure
400
Critical step in
bonding cycle
300
200
0
10
20
30
40
TIME-MINUTES
205
149
94
Laminate temp. as
measured by
thermocouple at
bondline
100
0
260
Approx. 30 min. heat-up 15 min at temp.
TEMP °C
500
TEMP °F
a. A maximum bond strength may be achieved
using a press temperature of 232°C (450°F)
for most standard RT/duroid laminates or their
equivalents clad with electrodeposited copper
and etched (but not sodium etched). 3001
bonding film has minimal adhesion to copper
and should not be used where large copper
surfaces are present.
37
50
60
70
0
A time-temperature curve as shown on the
accompanying chart illustrates a typical
press temperature cycle which has produced
satisfactory bonding results.
TROUBLE SHOOTING:
No Bond
1. Surface of board to be bonded was mechanically cleaned (pumice scrubbed, brushed,
etc.).
Solution: Do not mechanically clean. Use
chemical cleaning procedure.
2. Inadequate temperature-time above minimum
bond temperature.
Solution: Double check temperature at bondline with thermocouple.
3. Contamination with release agents, moisture,
dirt, etc.
Solution: Review cleaning and priming procedures and conditions.
Spotty Bonding or Blistering
1. Non-uniform pressure.
Solution: Use fresh padding or additional padding. Check flatness or press.
2. Inadequate temperature.
Solution: Double check temperature at bondline with thermocouple.
3. Inadequate rinse and dry of cores prior to
bonding.
Solution: Review cleaning and drying procedures. Review storage conditions and duration
of time between preparation and bonding.
Distortion
1. Excessive temperature.
2. Non-uniform pressure.
Typical Values
3001 Bonding Film
PROPERTY
TYPICAL VALUE
DIRECTION
UNITS
CONDITION
TEST METHOD
Dielectric Constant
2.28
Z
-
X-band [1]
IPC-TM-650,
2.5.5.5
Dissipation Factor
0.003
Z
-
X-band
IPC-TM-650,
2.5.5.5
Volume Resistivity
1011
Surface Resistivity
10
Dielectric Strength
Thickness
-
Mohm/cm
25°C
ASTM D257
X,Y
Mohm
25°C
ASTM D257
2500
Z
V/mil
ASTM D149
0.0015
Z
inch
Micrometer
9
Water Absorption
0.05
%
24hrs/23°C
ASTM D570
Bond Strength
1400
Z
psi
A
[2]
MD
7.5
X
kpsi
ASTM D882
CMD
5.5
Y
MD
115
X
%
ASTM D882
CMD
200
Y
MD
140
X
kpsi
ASTM D882
CMD
150
Y
Thermal Conductivity
0.22
Z
Maximum Use Temperature
176
°C
Tensile Strength
Elongation
Youngs
Modulus
W/m/K
Crystalline Melt
Nominal
186
°C
Chemical Resistance 2 weeks/ambient
Weight
Increase
(%)
Visual Effect
Weight
Increase
(%)
Visual Effect
Acetone
5.17
Cloudy, Very
Flexible
Methyl Ethyl
Ketone
5.9
Very Flexible
Ammonium Hydroxide
None
None
Nitric Acid - 70%
None
None
Carbon Tetrachloride
4.1
Flexible
Sodium
Hydroxide - 50%
None
None
Ethanol
None
None
Sulfuric
Acid - 30%
None
None
Hydrochloric Acid - 36%
None
None
Toluene
2.8
Flexible
Hydrofluoric Acid - 60%
None
None
Trichloroethlene
10.9
Cloudy, Very
Flexible
Methanol
0.1
None
Trichlorofluoroethane
-
Cloudy Very
Flexible
Typical Values are a representation of an average value for the population of the property. For specificiation values contact Rogers Corporation.
Shelf life: 3001 bonding film is a thermoplastic. As such, there are no shelf life limitations.
Notes:
[1] Two stacks of 40 piles of film are used.
[2] A specimen of two 0.062” thick pieces of RT/duroid®5880 microwave circuit laminate is machined with 0.500” diameter groove cut just through the bond line on one side and
concentric with a 0.375” diameter hole just through the bond line from the other side. Breaking force to pull apart the isolated bond area of 0.375” ID/0.500” OD (0.86 in.2) is
measured at 0.050 in/min. cross head speed.
[3] Differential scanning calorimetry test is on a 8 mg specimen which was melted by heating to 240°C followed by slow cooling to 40°C before a second heating for the measurement.
The information in this data sheet and processing guideline is intended to assist you in fabricating Rogers’ circuit material laminates.
It is not intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for
a particular purpose or that the results shown on this data sheet and fabrication guideline will be achieved by a user for a particular
purpose. The user should determine the suitability of Rogers’ circuit material laminates for each application.
The commodities, technology and software are exported from the United States in accordance with the Export Administration
regulations. Diversion contrary to U.S. law is prohibited
RT/duroid, RO3000 and ULTRALAM are licensed trademarks of Rogers Corporation.
Teflon is a registered trademark of E.I. duPont de Nemours & Co.,
Poly-etch is a registered trademark of Matheson Gas Products,
Fluoroetch is a registered trademark of Acton Associates, Inc.
©1994, 2002, 2005, 2008 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 05/08, 0835-0508-0.5-CC, Publication #92-442
40
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
1.5000
RT/duroid®5870 /5880 High Frequency Laminates
Features:
• Lowest electrical loss for reinforced PTFE
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications.
• Low moisture absorption.
• Isotropic
• Uniform electrical properties over
Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in
the directions most valuable to circuit producers
and in the final circuit application.
material.
frequency.
• Excellent chemical resistance.
Some Typical Applications:
• Commercial Airline Telephones
• Microstrip and Stripline Circuits
• Millimeter Wave Applications
• Military Radar Systems
• Missile Guidance Systems
• Point to Point Digital Radio Antennas
The dielectric constant of RT/duroid 5870 and
5880 laminates is uniform from panel to panel
and is constant over a wide frequency range. Its
low dissipation factor extends the usefulness of
RT/duroid 5870 and 5880 to Ku-band and above.
RT/duroid 5870 and 5880 laminates are easily
cut, sheared and machined to shape. They are
resistant to all solvents and reagents, hot or cold,
normally used in etching printed circuits or in
plating edges and holes.
Normally supplied as a laminate with electrodeposited copper of ¼ to 2 ounces/ ft.2 (8to 70Pm)
on both sides, RT/duroid 5870 and 5880 composites can also be clad with rolled copper foil for
more critical electrical applications. Cladding
with aluminum, copper or brass plate may also
be specified.
When ordering RT/duroid 5870 and 5880 laminates, it is important to specify dielectric thickness, tolerance, rolled or electrodeposited copper foil, and weight of copper foil required.
he information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.™
41
TYPICAL VALUE
PROPERTY
RT/duroid® 5870
RT/duroid 5880
2.33
2.33 ± 0.02 spec.
2.20
2.20 ± 0.02 spec.
Dissipation Factor, tan G
0.0005
0.0012
0.0004
0.0009
Thermal Coefficient of Hr
-115
-125
Dielectric Constant, Hr
Volume Resistivity
Surface Resistivity
TEST METHOD
Z
Z
C24/23/50
C24/23/50
1 MHz IPC-TM-650, 2.5.5.3
10 GHz IPC-TM-2.5.5.5
Z
Z
C24/23/50
C24/23/50
1 MHz IPC-TM-650, 2.5.5.3
10 GHz IPC-TM-2.5.5.5
ppm/°C
-50 - 150°C
IPC-TM-650, 2.5.5.5
7
2 X 107
Z
Mohm cm
C96/35/90
ASTM D257
2 X 10
8
7
Z
Mohm
C/96/35/90
ASTM D257
A
ASTM D638
A
ASTM D695
3 X 10
Test at 23°C
Test at 100°C
1300 (189)
490 (71)
1070 (156)
450 (65)
1280 (185
430 (63)
860 (125)
380 (55)
Y
50 (7.3)
34 (4.8)
29 (4.2)
20 (2.9)
X
42 (6.1)
34 (4.8)
27 (3.9)
18 (2.6)
Y
9.8
8.7
6.0
7.2
X
9.8
8.6
4.9
5.8
Y
1210 (176)
680 (99)
710 (103)
500 (73)
X
1360 (198)
860 (125)
710 (103)
500 (73)
Y
803 (120)
520 (76)
940 (136)
670 (97)
Z
30 (4.4)
23 (3.4)
27 (3.9)
22 (3.2)
X
ultimate strain
Compressive Modulus
ultimate stress
ultimate strain
Specific Heat
X
37 (5.3)
25 (3.7)
29 (5.3)
21 (3.1)
Y
54 (7.8)
37 (5.3)
52 (7.5)
43 (6.3)
Z
4.0
4.3
8.5
8.4
X
3.3
3.3
7.7
7.8
Y
8.7
8.5
12.5
17.6
Z
Deformation Under Load,
Test at 150°C
Heat Distortion
Temperature
UNITS
2 X 10
Test at 100°C
ultimate stress
MPa (kpsi)
%
MPa (kpsi)
%
1.0
Z
%
24hr/14 MPa
(2 Kpsi)
ASTM D621
>260 (>500)
>260 (>500)
X.Y
°C (°F)
1.82 MPa (264
psi)
ASTM D648
0.96 (0.23)
0.96 (0.23
Thickness
0.31”
(0.8mm)
0.9 (0.02)
0.9 (0.02)
0.62”
(1.6mm)
13 (0.015)
13 (0.015
J/g/K
mg (%)
Thermal Conductivity
Thermal Expansion
CONDITION
Test at 23°C
Tensile Modulus
Moisture
Absorption
DIRECTION
0.22
0.20
Z
Calculated
D24/23
W/m/K
ASTM C518
X
Y
Z
X
Y
Z
-5.0
-5.5
-11.6
-6.1
-8.7
-18.7
-100°C
-0.6
-0.9
-4.0
-0.9
-1.8
-6.9
15
-0.3
-0.4
-2.6
-0.5
-0.9
-4.5
0.7
0.9
7.5
1.1
1.5
8.7
75
1.8
2.2
22.0
2.3
3.2
28.3
150
3.4
4.0
58.9
3.8
5.5
69.5
Td
500
500
Density
2.2
2.2
Copper Peel
20.8 (3.7)
22.8 (4.0)
Flammability
94V-0
94V-0
Yes
Yes
Lead-Free Process
Compatible
mm/m
ASTM D570
25
ASTM D3386
(10K/min)
(Values given are total
change from a base temperature of 35°C)
250
°C TGA
ASTM D3850
ASTM D792
pli (N/mm)
after solder
float
IPC-TM-650 2.4.8
UL
[1] SI unit given first with other frequently used units in parentheses.
[2] References: Internal TR’s 1430, 2224, 2854. Test were at 23°C unless otherwise noted.
Typical values should not be used for specification limits.
STANDARD THICKNESS:
0.005” (0.127mm),
0.031” (0.787mm)
0.010” (0.254mm),
0.062” (1.575mm)
0.015” (0.381mm),
0.125” (3.175mm)
0.020” (0.508mm),
STANDARD PANEL SIZE:
18” X 12” (457 X 305mm)
18” X 24” (457 X 610mm)
18” X 36” (457 X 915mm)
18” X 48” (457 X 1.224m)
STANDARD COPPER CLADDING:
¼ oz. (8 Pm) electrodeposited copper foil.
½ oz. (17Pm), 1 oz. (35Pm), 2 oz. (70Pm) electrodeposited and
rolled copper foil.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
RT/duroid and DUROID are licensed trademarks of Rogers Corporation.
© 1989, 1994, 1995, 1999, 2002, 2005, 2006 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 11/06 0696-1106-0.5CC Publication #92-101
42
Advanced Circuit Materials
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
ULTRALAM 2000
Data Sheet
1.2000
®
Woven Glass Reinforced Microwave Laminate
Features:
•
•
•
•
•
•
Glass bers oriented in X/Y plane. Improves
dimensional stability, lowers thermal expansion
and is ideal for applications where registration
is critical.
Stable electrical properties versus frequency
for repeatable designs and is suitable for
broadband applications. Provides uniformity
within panel and panel to panel.
Excellent chemical resistance. Minimizes damage to material during fabrication and assembly processes.
Low loss extends useful frequency range to
K-band.
Excellent mechanical properties.
Fabricates with standard PTFE processing.
Some Typical Applications:
•
•
•
•
•
•
•
•
•
Antennas for Wireless
Communications Systems
Cellular Base Stations
LAN Systems
Automotive Electronics
Satellite TV Receivers
Microwave & RF Components
Radar Systems
Mobile Communication Systems
Microwave Test Equipment
ULTRALAM® 2000 woven glass reinforced PTFE
microwave laminate is designed for high reliability
stripline and microstrip circuit applications.
Glass reinforcing bers are oriented in the X/Y
plane of the laminate. This orientation maximizes
dimensional stability and minimizes etch shrinkage
where circuit feature registration is critical.
The dielectric constant of ULTRALAM 2000 material
is controlled to ± 0.04 from the nominal, within the
range of 2.4 to 2.6. It is uniform within each panel,
from panel to panel and dissipation factor extends
the useful frequency range into K-band (17 to 27
GHz).
ULTRALAM 2000 laminate may be cut, sheared
and machined to shape. It has excellent resistance
to all solvents and reagents, hot or cold, normally
used in etching and plating printed circuits.
Cladding options include ½ to 2 oz./ft2 (17 to 70 Pm
thick), rolled or electrodeposited copper.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.®
43
PROPERTY
TYPICAL
VALUE
DIRECTION
CONDITIONS
TEST METHOD
2.4 - 2.6
Z
23°C
IPC-TM-2.5.5.5
Dissipation Factor,
tan, G
0.0022 max.
Z
23°C
IPC-TM-2.5.5.5
Volume Resistivity
2.0 X 107
Z
Mohm cm
C96/23/95
IPC-TM-2.5.5.5
2.5.17.1
Surface Resistivity
4.1 X 107
X,Y
Mohm
C96/23/95
IPC-TM-650
2.5.17.1
Dielectric Breakdown
>50
X,Y
kV
D48/50
ASTM D149
Arc Resistance
185
X,Y
sec.
Tensile Modulus
11.7 (1700)
9.0 (1300)
X
Y
GPa
(kpsi)
A
ASTM D638
Tensile Strength
147 (21.3)
136 (19.7)
X
Y
MPa
(kpsi)
A
ASTM D638
Compressive
Modulus
11.0 (1600)
9.0 (1300)
X
Y
GPa (kpsi)
A
ASTM D695
Commpressive
Strength
>70 (>10.2)
58 (8.4)
X
Y
MPa
(kpsi)
A
ASTM D695
Flexural Strength
170 (24.6)
104 (15.1)
X
Y
MPa
A
ASTM D790
Water Absorption
0.03
%
D48/50
ASTM D570
ppm/°C
25 to 150°C
ASTM E831
Dielectric
Constant, Hr
Coefcient of
Thermal Expansion
15
200
Density
2.2
Copper Peel Strength
X,Y
Z
IPC-TM-650
2.5.1
gm/cm2
3.25 (18.6)
2.38 (13.6)
3.01 (17.2)
Flammability Rating
UNITS [1]
X,Y
ASTM D792
N/mm (lb/in)
After
solder oat
IPC-TM-650
2.4.8
94-VO
UL
[1] S1 units given rst, with other frequently used units in parentheses.
STANDARD THICKNESS:
STANDARD PANEL SIZE:
0.004” (0.101mm) 0.0190” (0.482mm) 18” X 12” (457 X 305mm)
0.0101” (0.256mm) 0.030” (0.762mm)
18” X 24” (457 X 610mm)
0.0147” (0.373mm) 0.060” (1.524mm)
18” X 36” (457 X 915mm)
18” X 48” (457 X 1.219m)
STANDARD COPPER CLADDING:
¼ oz. (8 Pm) electrodeposited copper foil.
½ oz. (17Pm), 1 oz. (35Pm), 2 oz. (70Pm) electrodeposited and rolled copper foil.
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
Rogers Advanced Circuit Materials, ISO 9002 Certied
Rogers N.V.
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Tel: 480-961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Fax: 480-961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
The information in this data sheet is intended to assist you in designing with Rogers laminates. It is not intended to and does not create
any warranties express or implied, including any warranty of merchantability or tness for a particular application. The user should
determine the suitability of Rogers laminates for each application.
These commodities, technology or software are exported from the United States in accordance with the Export Administration requlations. Diversion contrary to U.S. law prohibited.
ULTRALAM® is a licensed trademarks of Rogers Corporation.
© 1991, 2002, 2006 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 11/2006 0616-1106--5-CC Publication #92-106
44
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
1.6002
RT/duroid®6002 High Frequency Laminates
Features:
• Low loss for excellent high frequency
performance.
• Tight Hr and thickness contol.
• Excellent electrical and mechanical
•
•
•
•
properties.
Extremely low thermal coefcient of
dielectric constant.
In-plane expansion coefcient matched to
copper.
Low Z-axis expansion.
Low outgassing; Ideal for space
applications.
Some Typical Applications:
• Phase Array Antennas
• Ground Based and Airborne Radar
•
•
•
•
•
Systems
Global Positioning System Antennas
Power Backplanes
High Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance
Systems
Beam Forming Networks
RT/duroid® 6002 microwave material is the rst low
loss and low dielectric constant laminate to offer
superior electrical and mechanical properties essential in designing complex microwave structures which
are mechanically reliable and electrically stable.
The thermal coefcient of dielectric constant is
extremely low from -55oC to+150oC (-67°F to 302°F)
which provides the designers of lters, oscillators and
delay lines the electrical stability needed in today’s
demanding applications.
A low Z axis coefcient of thermal expansion (CTE)
ensures excellent reliability of plated through-holes.
RT/duroid 6002 materials have been successfully
temperature cycled (-55oC to 125oC [-67°F to 257°F])
for over 5000 cycles without a single via failure.
Excellent dimensional stability (0.2 to 0.5 mils/inch)
is achieved by matching the X and Y coefcient of
expansion to copper. This often eliminates double
etching to achieve tight positional tolerances.
The low tensile modulus (X,Y) greatly reduces the
stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum
amount of low CTE metal (6 ppm/oC) further increasing surface mount reliability.
¼ oz. to 2 oz./ft.2 electrodeposited copper, or ½
oz. to 2 oz/ ft.2 rolled copper foil may be specied
as cladding on dielectric thicknesses from 0.005” to
0.120” (0.13 to 3.05mm). RT/duroid 6002 laminate is
also available clad with aluminum, brass, or copper
plates.
Applications particularly suited to the unique properties of RT/duroid 6002 material include at and
non-planar structures such as antennas, complex
multilayer circuits with interlayer connections, and
microwave circuits for aerospace designs in hostile
environments. RT/duroid 6002 laminates have Underwriters Laboratories recognition under classication
94V-0 (Vertical Flammability Test).
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.™
45
RT/duroid® 6002 High Frequency Laminates
Typical Values
PROPERTY
TYPICAL
VALUE[2]
DIRECTION
UNITS[1]
CONDITIONS
TEST METHOD
Dielectric Constant, Hr
2.94 ± 0.04
Z
--
10 GHz/23°C
IPC-TM-650, 2.5.5.5
--
10 GHz/23°C
IPC-TM-650, 2.5.5.5
(Y Spec) 2.92+-0.04
Dissipation Factor, TanG
0.0012
Z
Thermal Coefcient of Hr
+12
Z
ppm/°C
10 GHz/1-100°C
IPC-TM-650, 2.5.5.5
Volume Resistivity
106
Z
Mohm cm
A
ASTM D257
Surface Resistivity
10
Z
Mohm
A
ASTM D257
Tensile Modulus
Ultimate Stress
Ultimate Strain
828 (120)
6.9 (1.0)
7.3
X,Y
X,Y
X,Y
MPa (kpsi)
MPa (kpsi)
%
23°C
ASTM D638
Compressive Modulus
Moisture Absorption
2482 (360)
0.1
0.13 max
Z
---
MPa (kpsi)
%
D23/24
D48/50
ASTM D638
IPC-TM-650 2.6.2.1
ASTM D570
Thermal Conductivity
Coefcient of Thermal
Expansion
Td
Density
Specic Heat
Copper Peel
Flammability
Lead-Free Process
Compatible
0.60
16
24
500
2.1
0.93 (0.22)
8.9 (1.6)
94V-0
--X,Y
Z
W/m/K
ppm/°C
80°C
(10K/min)
ASTM C518
ASTM D3386
----
ASTM D3850
ASTM D792
Calculated
IPC-TM-650, 2.4.8
UL
7
°C TGA
gm/cm3
J/g/K (BTU/lb/°F)
lbs/in (N/mm)
---
Yes
[1] S1 units given rst, with other frequently used units in parentheses.
[2] References: Internal TRs 3824, 5016, 5017, 5035. Tests were at 23°C unless otherwise noted.
Typical Values should not be used for specication limits.
Typical Values should not be used for specication limits
STANDARD THICKNESS:
STANDARD PANEL SIZE:
STANDARD COPPER CLADDING:
0.005” (0.127mm)
0.010” (0.254mm)
0.020” (0.508mm)
0.030” (0.762mm)
0.060” (1.524mm)
0.120” (3.048mm)
18” X 12” (457 X 305mm)
18” X 24” (457 X 610mm)
¼ oz. (8 Pm) electrodeposited copper foil.
½ oz. (17Pm), 1 oz. (35Pm), 2 oz. (70Pm) electrodeposited and rolled copper foil.
Unclad material 0.020” or greater is available.
Thick metal claddings are available.
Contact customer service for more information.
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
Rogers Advanced Circuit Materials, ISO 9002 Certied
Rogers N.V. - Gent
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
Tel: 480-961-1382
Tel: +32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480-961-4533
Fax: +32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
RT/duroid and DUROID are licensed trademarks of Rogers Corporation.
© 1987, 1988, 1992, 1999, 2005 Rogers Corporation, Printed in U.S.A., All rights reserved
Revised 3/2005 0700-0305-.5-CC Publication# 92-102
46
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
Data Sheet
1.6000
RT/duroid® 6006/6010LM High Frequency Laminates
Features:
• High dielectric constant for circuit size
•
•
•
•
reduction.
Low loss. Ideal for operating at X-band or
below.
Low Z-axis expansion for RT/duroid 6010LM.
Provides reliable plated through holes in
multilayer boards.
Low moisture absorption for RT/duroid
6010LM. Reduces effects of moisture on
electrical loss.
Tight Hr and thickness control for repeatable
circuit performance.
Some Typical Applications:
• Space Saving Circuitry
• Patch Antennas
• Satellite Communications Systems
• Power Ampliers
• Aircraft Collision Avoidance Systems
• Ground Radar Warning Systems
RT/duroid® 6006/6010LM microwave laminates
are ceramic-PTFE composite designed for
electronic and microwave circuit applications
requiring a high dielectric constant. RT/duroid
6006 laminate is available with a dielectric
constant value of 6.15 and RT/duroid 6010LM
laminate has a dielectric constant of 10.2.
RT/duroid 6006/6010LM microwave laminates
feature ease of fabrication and stability in use.
They have tight dielectric constant and thickness
control, nearly isotropic electrical properties,
low moisture absorption, and good thermal
mechanical stability.
Laminates are supplied clad both sides with ¼
to 2 oz./ft.2 ( 8 to 70 Pm) electrodeposited (ED)
copper foil. Cladding with rolled copper foil is also
available. Thick aluminum, brass, or copper plate
on one side may be specied.
Standard tolerance dielectric thicknesses of
0.010”, 0.025”, 0.050”, 0.075”, and 0.100” (0.254,
0.635, 1.270, 1.905, 2.54 mm) are available. When
ordering RT/duroid 6006 and RT/duroid 6010LM
laminates, it is important to specify dielectric
thickness, electrodeposited or rolled, and weight of
copper foil required.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
The world runs better with Rogers.®
47
Typical Values
RT/duroid® 6006, RT/duroid 6010LM Laminates
PROPERTY
TYPICAL VALUE [2]
6006
6010LM [3]
Dielectric Constant, Hr
6.15 ± 0.15
Z
10 GHz/A
IPC-TM-650 2.5.5.5
Z
Mohm
Mohm cm
MPa (kpsi)
-50 to 170°C
A
A
A
IPC-TM-650 2.5.5.5
IPC 2.5.17.1
IPC 2.5.17.1
A
20 (2.8)
17 (2.5)
17 (2.4)
13 (1.9)
X
Y
MPa (kpsi)
12 to 13
4 to 6
9 to 15
7 to 14
X
Y
%
A
1069 (155)
2144 (311)
Z
MPa (kpsi)
A
54 (7.9)
47 (6.9)
Z
MPa (kpsi)
A
33
25
Z
%
2634 (382)
1951 (283)
38 (5.5)
X
Y
X
Y
Z
Z
MPa (kpsi)
Deformation
under load
0.33
2.10
4364 (633)
3751 (544)
36 (5.2)
32 (4.4)
0.26
1.37
Moisture Absorption
0.05
0.05
2.7
0.48
(3.3)
47
34, 117
500
0.97 (0.231)
14.3 (2.5)
94V-0
Yes
3.1
0.78
Td
Specic Heat
Copper Peel
Flammability Rating
Lead-Free Process
Compatible
IPC-TM-650 2.5.5.5
X
Y
ultimate strain
Thermal Expansion
10 GHz/A
-425
5X106
5X105
931 (135)
559 (81)
ultimate strain
Density
Thermal Conductivity
TEST METHOD
-410
7x107
2X107
627 (91)
517 (75)
ultimate stress
ultimate stress
CONDITION
0.0027
Surface Resistivity
Volume Resistivity
Young’s Modulus
under tension
Flexural Modulus
UNITS[1]
10.2 ± 0.25
10.5 ± 0.25
10.8 ± 0.25
0.0023
Dissipation Factor, tan G
Thermal Coefcient of Hr
Young’s Modulus
under compression
ultimate stress
DIRECTION
24
24, 24
500
1.00 (0.239)
12.3 (2.1)
94V-0
Yes
Z
X
Y,Z
ASTM D638
(0.1/min. strain rate)
ASTM D695
(0.05/min strain rate)
A
ASTM D790
MPa (kpsi)
%
%
24 hr/50°C/7MPa
24 hr/150°/7MPa
ASTM D621
%
24 hr/23°C 0.050”
(1.27mm) thick
IPC-TM- 650 2.6.2.1
W/m/K
(BTU/in/ft2/hr/°F)
ppm/°C
23 to 100°C
°C TGA
J/g/K (BTU/lb/°F)
pli (N/mm)
ASTM D792
ASTM D2214, Modied
0 to 100°C
ASTM 3386
(5K/min)
ASTM D3850
Calculated
IPC-TM-650 2.4.8
UL
after solder oat
[1] SI unit given rst with other frequently used units in parentheses.
[2] References: APR4022.33 DJS 4019.27-32, Internal TR 2610. Tests were at 23°C unless otherwise noted. Typical values should not be used for specication limits.
[3] Dielectric constant is based on .025 dielectric thickness, one ounce electrideposited copper on two sides.
Typical values are a representation of an average value for the population of the property. For specication values contact Rogers Corporation.
STANDARD THICKNESS:
0.010” (0.254mm)
0.025” (0.64mm)
0.050” (1.27mm)
0.075” (1.90mm)
0.100” (2.50mm)
10” X 10” (254 X 254mm)
10” X 20” (254 X 508mm)
20” X 20” (508 X 508mm)
CONTACT INFORMATION:
USA:
Belgium:
Japan:
Taiwan:
Korea:
Singapore:
China:
STANDARD PANEL SIZE:
Rogers Advanced Circuit Materials
Rogers NV - Gent
Rogers Japan Inc.
Rogers Taiwan Inc.
Rogers Korea Inc.
Rogers Technologies Singapore Inc.
Rogers (Shanghai) International Trading Co., Ltd
STANDARD COPPER CLADDING:
¼ oz. (8 Pm) electrodeposited copper foil.
½ oz. (17Pm), 1 oz. (35Pm), 2 oz. (70Pm) electrodeposited and rolled copper foil.
Heavy metal claddings are available. Contact Rogers
Customer Service.
Tel: 480-961-1382
Tel: 32-9-2353611
Tel: 81-3-5200-2700
Tel: 886-2-86609056
Tel: 82-31-716-6112
Tel: 65-747-3521
Tel: 86-21-63916088
Fax: 480-961-4533
Fax: 32-9-2353658
Fax: 81-3-5200-0571
Fax: 886-2-86609057
Fax: 82-31-716-6208
Fax: 65-747-7425
Fax: 86-21-63915060
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and
does not create any warranties express or implied, including any warranty of merchantability or tness for a particular purpose or that
the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of
Rogers’ circuit material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
RT/duroid, The world runs better with Rogers. and the Rogers’ logo are licensed trademarks for Rogers Corporation.
©1991, 1992, 1994, 1995, 1998, 2002, 2005 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 03/2005 0697-0305-1.5ON Publication: #92-105
48
Advanced Circuit Materials Division
100 S. Roosevelt Avenue
Chandler, AZ 85226
Tel: 480-961-1382, Fax: 480-961-4533
www.rogerscorporation.com
Advanced Circuit Materials
TMM
®
Data Sheet
Thermoset Microwave Materials
TMM
TMM® thermoset microwave materials are ceramic
Features:
• Wide range of dielectric constants. Ideal for
•
•
•
•
•
single material systems on a wide variety of applications.
Excellent mechanical properties. Resists creep
and cold flow.
Exceptionally low thermal coefficient of dielectric constant.
Coefficient of thermal expansion matched to
copper. High reliability of plated through holes.
Resistant to process chemicals. No damage
to material during fabrication and assembly
processes.
Thermoset resin for reliable wirebonding. No
specialized production techniques required.
TMM 10 and 10i laminates can replace alumina
substrates.
Some Typical Applications:
• RF and Microwave Circuitry
• Global Positioning Systems Antennas
• Power Amplifiers and Combiners
• Patch Antennas
• Filters and Coupler
• Dielectric Polarizers and Lenses
• Satellite Communication Systems
• Chip Testers
thermoset polymer composites designed for high platedthru-hole reliability stripline and microstrip applications.
TMM laminates are available in a wide range of dielectric
constants and claddings.
The electrical and mechanical properties of TMM
laminates combine many of the benefits of both ceramic
and traditional PTFE microwave circuit laminates, without
requiring the specialized production techniques common
to these materials. TMM laminates do not require a sodium
napthanate treatment prior to electroless plating.
TMM laminates have an exceptionally low thermal
coefficient of dielectric constant, typically less than 30
ppm/°C. The material's isotropic coefficients of thermal
expansion, very closely matched to copper, allow for
production of high reliability plated through holes, and
low etch shrinkage values. Furthermore, the thermal
conductivity of TMM laminates is approximately twice that
of traditional PTFE/ceramic laminates, facilitating heat
removal.
TMM laminates are based on thermoset resins, and do
not soften when heated. As a result, wire bonding of
component leads to circuit traces can be performed
without concerns of pad lifting or substrate deformation.
TMM laminates combine many of the desirable features
of ceramic substrates with the ease of soft substrate
processing techniques. TMM laminates are available clad
with 1/2 oz/ft2 to 2 oz/ ft2 electrodeposited copper foil, or
bonded directly to brass or aluminum plates. Substrate
thicknesses of 0.015" to 0.500" and greater are available.
The base substrate is resistant to etchants and solvents
used in printed circuit production. Consequently, all
common PWB processes can be used to produce TMM
thermoset microwave materials.
The world runs better with Rogers.®
49
Typical Values
TMM® Thermoset Microwave Materials
TYPICAL VALUES
PROPERTIES
DIRECTION
UNITS
CONDITIONS
TEST METHOD
Z
10 GHz
IPC-TM-650
method 2.5.5.5
Z
10 GHz
IPC-TM-650
method
2.5.5.5
ppm/K
-55 to +125°C
IPC-TM-650
method
2.5.5.5
>2000
Gohm
C/96/60/95
ASTM D257
2X108
2X108
Mohm cm
ASTM D257
4X107
4X107
Mohm
ASTM D257
TMM3
TMM4
TMM6
TMM10
TMM10I
3.27 ± 0.032
4.50 ± 0.045
6.00 ± 0.080
9.20 ± 0.230
9.80 ± 0.245
0.0020
0.0020
0.0023
0.0022
0.0020
+37
+15
-11
-38
-43*
>2000
>2000
>2000
>2000
Volume Resistivity
3X109
6X108
1X108
Surface Resistivity
>9X109
1X109
1X109
Flexural Strength
16.53
15.91
15.02
13.62
-
X,Y
kpsi
A
Flexural Modulus
1.72
1.76
1.75
1.79
1.80*
X,Y
Mpsi
A
Impact, Notch Izod
0.33
0.36
0.42
0.43
-
X,Y
ft-lb/in
1.27mm (0.050" thk)
0.06
0.07
0.06
0.09
0.16
3.18mm (0.125" thk)
0.13
(1)
Dielectric
Constant, Hr
(1)
Dissipation Factor,
tan G
Thermal
Coefficient of Hr
Insulation
Resistance
ASTM D790
ASTM D790
ASTM D256A
Water Absorption
(2X2)
%
0.12
0.18
0.20
0.20
Specific Gravity
1.78
2.07
2.37
2.77
2.77
Specific Heat
0.87
0.83
0.78
0.74
0.72*
Thermal
Conductivity
0.70
0.70
0.72
0.76
0.76
Z
15
16
18
21
19
X,Y
23
21
26
20
20
Z
425
425
425
425
425
°C TGA
lb/inch
(N/mm)
Thermal Expansion
Td
Copper Peel Strength
Lead-Free Process
Capatible
5.7 (1.0)
5.7 (1.0)
5.7 (1.0)
5.0 (0.9)
5.0 (0.9)
YES
YES
YES
YES
YES
X,Y
D/48/50
ASTM D570
A
ASTM D792
J/g/K
A
Calculated
W/m/K
80°C
ASTM C518
ppm/K
0 to 140°C
ASTM D3386
ASTM D3850
after solder
float 1 oz. EDC
IPC-TM-650
Method 2.4.8
Notes: ASTM D3386 corresponds to IPC-TM-650, method 2.4.4.1
* estimated
Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corporation.
(1) Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The
rate of change increases at higher temperatures and is highly dependent on the circuit design. Although Rogers’ high frequency materials have been used successfully in innumerable applications and reports of oxidation resulting in performance problems are extremely
rare, Rogers recommends that the customer evaluate each material and design combination to determine fitness for use over the entire
life of the end product.
AVAILABLE THICKNESS:
0.015" (0.381mm)
0.020" (0.508mm)
0.025" (0.635mm)
0.030" (0.762mm)
0.050" (1.270mm)
0.060" (1.524mm)
0.075" (1.905mm)
0.100" (2.540mm)
0.125" (3.175mm)
0.150" (3.810mm)
0.200" (5.080mm)
0.250" (6.350mm)
0.275" (6.985mm)
0.300" (7.620mm)
0.500" (12.70mm)
STANDARD PANEL SIZE:
18" X 12" (457 X 305mm)
18" X 24" (457 X 610mm)
STANDARD COPPER CLADDING:
½ (17Pm), 1 oz (35Pm), 2 oz. (70Pm)
electrodeposited copper foil.
Heavy metal cladding available. Contact Rogers
customer
service.
The information in this data sheet is intended to assist you in designing with Rogers’ circuit material laminates. It is not intended to and does
not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results
shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit
material laminates for each application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
TMM is a licensed trademark of Rogers Corporation.
©1991, 2002, 2005, 2006, 2008 Rogers Corporation, Printed in U.S.A. All rights reserved.
Revised 05/2008 0797-0508-0.5CC Publication #92-108
50
深圳世强电讯有限公司 SHENZHEN SECOM TELECOM CO., LTD.
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Tel: +86-21-52371820 Fax: +86-21-32120694
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Tel: +86-512-69351315 Fax: +86-512-69351319
厦门办事处 XIAMEN OFFICE
沈阳办事处 SHENYANG OFFICE
厦门市湖滨北路莲滨里36号水岸筼筜B栋702室 邮编：361012
沈阳市和平区三好街55号沈阳信息产业大厦708室 邮编：110004
Rm. 702, Brink Yundang B, NO.36 Lianbinli, Hubin north road, xiamen 361012, P.R.C.
Rm.708, Information Industry Bldg., No.55 Sanhao street, Heping District, Shenyang 110004, P.R.C.
Tel: +86-592-5806950 Fax: +86-592-5806951
Tel: +86-24-23988556 Fax: +86-24-23988557
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世强电讯 2010年3月 印