Advanced Circuit Materials Division
Rogers Confidential - This presentation or any portion thereof may not be reproduced or distributed for any reason
The information contained in this presentation is intended to assist you
in designing with Rogers’ circuit materials. It is not intended to and does
not create warranties, express or implied, including any warranty of
merchantability or fitness for a particular purpose or that the results
shown in this presentation will be achieved by a user for a particular
purpose. The user should determine the suitability of Rogers’ circuit
material laminates for each application.
Advanced Circuit Materials Division
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2
Rogers Corporation Overview
Reliable Solutions for A Changing World
Advanced Circuit Materials Division
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3
Rogers Corporation
A Global Leader In Specialty Materials Solutions for A World Of
Applications Demanding Exceptional Performance, Reliability and Design
Advanced Circuit Materials Division
4/6/2010
Rogers Confidential - This presentation or any portion thereof may not be reproduced or distributed for any reason
4
Advanced Circuit Materials Division
Industry Leader in RF/Microwave Materials
Advanced Circuit Materials Division
Rogers Confidential - This presentation or any portion thereof may not be reproduced or distributed for any reason
5
Rogers Advanced Circuit Materials Division
¾ Worldwide leader in high frequency materials
¾ Broadest range of high frequency laminates
– εr from 1.96 to 12.8, PTFE, thermoset, woven glass, ceramic filler
¾ Provide consistent, reliable circuit materials and services that enable
our customers to succeed
¾ 40 years of experience in RF / microwave materials
– Longest continuous supplier / largest manufacturer
¾ Worldwide Technical Support
– Field Application Development Engineers
– Technical Service Engineers
– R&D Facilities and Personnel
– Worldwide Customer Service
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6
Advanced Circuit Materials Division
PRODUCT OVERVIEW
Advanced Circuit Materials Division
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7
Product History
Rogers has supplied a wide selection of quality HF laminates for both HIGH
RELIABILITY APPLICATIONS and COMMERCIAL APPLICATIONS for decades!
PTFE / Random Glass
RT/duroid® 5000
1950
1960
1970
Glass
Thermoset/Ceramic
Microsphere
TMM®
RT/duroid 5880LZ
PTFE / Ceramic
(temp stable)
Thermoset / Ceramic / Woven Glass
RT/duroid 6002
RO4000®, RO3200™
Theta™ Circuit Materials
1980
1990
PTFE / Ceramic
(high K)
RT/duroid
6006/6010
PTFE/Woven Glass
ULTRALAM® 2000
DESIGNER NEEDS
FABRICATOR NEEDS
2000
2010
Commercial
Planar Resistor
Ceramic
RT/duroid 6202PR
RO3000®
Liquid Crystalline Polymer
(LCP) ULTRALAM 3000
MARKET NEEDS
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8
Materials Properties Overview
HIGH Dk
Hydrocarbon
PTFE
Ceramic
Ceramic
TMM® 6
TMM 10
RT/duroid®
6006
RT/duroid
6010LM
Hydrocarbon
Ceramic with
and w/o
Woven
Glass
LOW DK
PTFE
PTFE
Ceramic Random /
Woven
Glass
TMM 3
RT/duroid
6002
RT/duroid
5870
ULTRALAM
3000 LCP
TMM 4
RT/duroid
6202
RO2800®
RT/duroid
5880
Theta™ Series
RO3003™
ULTRALAM®
2000
SYRON™ 7000
RO2808™
TMM 10i
RO3006™
RO3010™
Specialty
Resins
RO4003C™
RO4350B™
RO3035™
XT/duroid™
8000
RO4360™
RO3210™
RO4500™
Series
RO3203™
RO4700™
Series
RO3730™
RO4000®
LoPro™
RT/duroid
5880LZ
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9
Rogers HF Markets
Antennas
Defense, Aerospace
& High Reliability
Automotive
Packaging
LNB
Power Amplifiers
and Components
High Speed Digital
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10
Advanced Circuit Materials Division
NEW PRODUCTS - 2009
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11
New Products
Advanced Circuit Materials Division
RO4000 ® - LoPro ™ Laminate
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12
RO4000 LoPro ™ laminate – key points
¾ Many high frequency applications need lower loss
performance and lower cost
– Backhaul microwave radio (30GHz, 40GHz, 60GHz…)
– Basestation antennas (‘PIM’ concerns : ‘Passive
Intermodulation)
¾ Copper losses at higher frequencies can be significant
– Surface roughness of copper results in increased loss = higher
insertion loss and poor PIM
¾ Rogers RO4000 LoPro ™ laminate offers improved
insertion loss / PIM at higher frequencies compared to
standard RO4000
¾ Rogers RO4000 LoPro ™ laminate offers lower cost
material and processing compared to PTFE.
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13
Standard vs.
LoPro™ Resin Coated Foil Roughness
Standard RO4000 copper
TWS 1 OZ Copper Foil
Treated Side
Roughness: 2.8µ RMS
RO4000® LoPro™ Laminate
1 OZ Foil
Treated / Coated Side
Roughness: 0.5-0.7µ RMS
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14
Features & Benefits
Antennas /
Backhaul Microwave Radio
Features
Benefits
Ability to bond reverse-treated foil to RO4000®
based products
• Low Insertion Loss
• Reduced PIM
• Maintains Same Excellent Yields as with
RO4000
–Good Lot-to-Lot Consistency
• Better Electrical Performance
Thermoset Resin System
• Processes Similar to FR-4
• Automated Assembly Compatible
Low Z-Axis CTE / High Tg (Same as RO4000 >
280°C)
•
•
•
•
•
Hybrid MLB Capability
Design Flexibility
Ease of Fabrication
RoHS Compliant
Lead Free Process Compatible
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15
Technical Overview
RO4003C™ Insertion Loss with Different
Cu Foil Types / 0.008” Laminate (25 GHz)
RO4003C™ Insertion Loss with Different Copper Foil Types
0.008" Laminate
RO4003C Standard Laminate
0
RO4003C LoPro™ Laminate
-0.2
Insertion loss (dB/in)
-0.4
-0.6
-0.8
-1
-1.2
0
5
10
15
Frequency (GHz)
20
25
30
25 GHz
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16
Technical Overview
RO4003C™ Insertion Loss with Different
Cu Foil Types / 0.008” Laminate (50 GHz)
RO4003C™ Insertion Loss With Different Copper Foil Types
0.008" laminate
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
RO4003C Standard Laminate
-1.6
RO4003C LoPro™ Laminate
-1.8
-2.0
0
10
20
30
40
50
60
50GHz
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17
Advanced Circuit Materials Division
Introduces
RO4360™ High Frequency Laminates
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18
RO4360 laminate – Key Points
¾Some designers would like to reduce circuit size – e.g. low frequency
power amplifier.
¾Circuit size reduction can be achieved with higher Dk material – eg. Dk
6.15 compared to Dk 3.5
¾Currently, the only materials available in a higher (6.15) Dk range are
ceramic filled PTFE woven fiberglass or organic-ceramic laminates with
WG reinforcement
RO4360™ laminate is a 6.15 Dk low loss, copper clad, glassreinforced, ceramic thermoset material that provides a low-cost
alternative to PTFE products. It is designed for use in both doublesided and multilayer boards.
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19
RO4360 Market Overview
¾ Target Markets
– Communications Infrastructure
– Military
¾ Typical Target Applications:
– RF Circuitry used in:
•
•
•
•
Power Amplifiers
LNAs,
Combiners / Splitters, RF Components
Back-haul Microwave Radios (Point-toPoint)
– Patch Antennas (WLANs)
– LTCC Replacement
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20
RO4360 Product Solution
Solution
RO4360™ 6.15 Dk high frequency laminates provide the ease
of fabrication, repeatability, reliability and lower cost that
customers have come to expect from Rogers RO4000®
product line. It provides customers with the low Dk loss, PTH
process capability, and high thermal conductivity needed for
power amp base station and other applications.
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21
RO4360™ Product Overview
Features & Benefits
Features
Benefits
RO4000® Thermoset Resin System
Specially Formulated To Meet 6.15
Dk
• Ease of Fabrication / Processes
Similar to FR-4
• RO4000 Repeatability
• PTH Capability / Reliability
• Low Dielectric Loss
• High Thermal Conductivity
• Lower Total PCB Cost Solution
than Competing PTFE Products
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22
RO4360™ Product Overview
Features & Benefits
Features
Benefits
Low Z-Axis CTE ~30 PPM/°C / High
Tg (Same as RO4000® Laminate >280°C)
• Design Flexibility
Environmentally Friendly
• Lead Free Process Compatible
• Automated Assembly Compatible
• RoHS Compliant
Regional Finished Goods Inventory • Short Lead Times / Quick
Inventory Turns
• Efficient Supply Chain
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23
Product Overview
RO4360™ Laminate Vs. Competitors
Grade
(All values per
data sheets)
Rogers
RO4360 Laminate
Competitor A
PTFE based
Competitor B
PTFE based
6.15 +/- 0.15
6.15 +/- 0.25
6.15
0.0038 @ 10 GHz
0.003 @ 2.5GHz
0.0038 @ 10 GHz
Not Published for 2 GHz
0.0020 @ 10 GHz
0.0017 @ 1.8 GHz
X = 16.6 / Y = 14.6
Z = 30
(From 0°C – 100°C)
X=9 /Y=8
Z = 69
(From -30°C – 130°C)
X=9/ Y=9
Z = 35
(From 0°C – 100°C)
Peel Strength
(After Thermal
Stress)
5.2 PLI
8 PLI
8 PLI
TCDk (PPM/°C)
-119.8
(-50°C to 150°C)
<-200
(Rogers Estimate)
-75
(-50°C to 140°C)
0.0 (MD)
0.1 (CD)
0.68 (MD)
1.05 (CD)
N/A
Dk
(@ 10 GHz)
Df
CTE X/Y/Z
(PPM/°C)
Dim Stab
(mils/inch)
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24
Product Overview
RO4360™ Laminate Vs. Competitors
Grade
(All values per
data sheets)
Rogers
RO4360 Laminate
Competitor A
PTFE based
Competitor B
PTFE based
0.13%
0.02%
0.03%
0.81
0.40
Z (thru) = 1.1
X, Y (in-plane) 1.4
(100°C)
Thickness (Mils)
0.008” / 0.012” . 0.016” /
0.020” / 0.032” / 0.060”
0.0100” / 0.0250” / 0.0310” /
0.0500” / 0.0600” / 0.1250”
0.010” / 0.015” / 0/020” /
0.025”/ 0.030” / 0.040” /
0.050” / 0.060”
Copper Cladding
½ oz / 1 oz / 2 oz
½ oz / 1 oz / 2 oz
½ oz / 1 oz / 2 oz
UL94V-0 approved
RTI expected mid 2010
UL 94 V-0
UL94-V-0
Moisture
Absorption
TC (W/(m●K)
Flammability
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25
New Products
Advanced Circuit Materials Division
RT/duroid ® RT5880LZ Laminate
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26
RT5880LZ ® laminate – Key Points
¾ Certain applications require low Dk, low loss performance and high
reliability
¾ Rogers’ RT5870 and RT5880 already provide this, but RT5880LZ is an
advancement
RT/duroid® 5880LZ laminates provide the lowest dielectric constant for a
copper clad material available today. The unique composition of 5880LZ
results in a low density, lightweight, high-performance material.
With a Z-Axis CTE of less than 46 PPM/°C and TCDk of 22 PPM/°C, awardwinning 5880LZ ® laminates provide reliability not previously available in
this dielectric range.
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27
Technical Overview
RT/duroid® 5880LZ Appearance of Filler
Free-standing Filler
Free-standing Filler
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28
RT/duroid® 5880 LZ
Target Market / Applications
¾ Target Market
– Defense & Aerospace
¾ Typical Target Applications
– Airborne Antenna
– Lightweight Feed Networks
– Military Radar Systems
– Missile Guidance Systems
– Point-to-Point Digital Radio Antennas
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29
Product Overview
RT/duroid® 5880 LZ vs. 5880 vs. 5870 (Typical Values)
Grade
5880LZ
5880
5870
Dk @ 10 GHz
1.96 +/- .04
2.20 +/- .02
2.33+/- .02
Df
Typ: .0019
Max: .0027
Typ: .0009
Max: .0015
Typ: .0012
Max: .0015
-125
-115
31/48/237
22/28/173
.32
.20
.22
12X18” / 24X18”
18x (12, 24,36, 48”)
18x (12, 24,36, 48”)
Thickness (Mils)
10-170
5-125
5-125
Flammability
94V-0
94V-0
94V-0
TCDk (PPM/°C)
CTE X/Y/Z (PPM/°C) @
from 0-100°C
TC (W/(m●K))
Panel Size (Inches)
+22
44/43/and Z=
45.7
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30
Technical Overview
RT/duroid® 5880LZ Laminate Expansion Rate
Cu Vs. Substrate Z-Axis CTE PPM/°C
0°C to 150°C
300
PPM/°C
200
100
Cu
0
5880
RO4003C™
5880LZ
RO4350B™
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31
Technical Overview
RT/duroid® 5880LZ TCDk
Tem perature Coefficient of Dielectric Constant for Rogers RT/duroid® 5880LZ
DK(T)/DK(20C) versus Tem perature
1.004
DK(T) / DK (20°C)
1.003
TCDK = +22 PPM / °C
from -50 to +150 °C
1.002
1.001
1.000
Linear (-50 to 150°C)
-50 to 150°C
0.999
DK(T)/DK(20C) = 2E-05 (Temp C) + 0.9998
0.998
-50
-25
0
25
50
75
100
125
150
Tem perature °C
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32
Technical Overview
RT/duroid® 5880 LZ X, Y, Z CTE: 0-100°C (Typical Values)
Note Identical
Slope of X, Y and
Z. Very Isotropic!
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33
Rogers’ Ceramic Filled PTFE
Materials
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RO3000 & Rt/Duroid6000 - Components
¾ Ceramic Filler:
– Blend of high and low Er
– Benefits:
• Tailor Er & TCEr
– Vary from 3.0 to 10.2
• Control Thermal Expansion Characteristics
– Consequences:
• Abrasive
• Porosity
– Proprietary Coating Increases Hydrophobicity
• Reduced Mechanical Strength
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35
RT/duroid® 6002/6202
Microwave Laminate
Non-woven Glass Ceramic Filled PTFE Composites
FEATURES AND BENEFITS:
Typical Applications:
Phase Array Antennas
•
•
•
•
•
•
•
5/09
Date
Radar Systems
GPS Antennas
Power Backplanes
High Reliability Multilayers
Airborne Collision Avoidance
Beam Forming Networks
Low loss for excellent high frequency performance.
• Suitable for applications up to 30-40 GHz.
Tight εr and thickness control.
• Repeatable circuit performance.
Excellent electrical and mechanical properties.
• Ideal for complex multilayer microwave
structures.
Extremely low thermal coefficient of dielectric constant.
• Provides electrical stability for frequency and
phase.
In-plane expansion coefficient matched to copper.
• Eliminates double etching to achieve tight positional
tolerances.
• Provides excellent reliability of surface mounted
assemblies.
• Reduces stress to solder joints.
Low Z-axis expansion.
• Ensures excellent reliability of plated through
holes in MLB’s.
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RT/duroid® 6002 PROPERTIES:
RT/duroid 6002
Dielectric Constant
Loss Tangent
0.0012
TCK’, ppm/C
+16
CTE, ppm/C
16, 16
24
11
X, Y, Z
Peel Strength
Water Absorption %
5/09
Date
2.94 +/- 0.04
0.1
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RT/duroid® 6006, 6010LM
Microwave Laminates
Non-woven Glass Ceramic Filled PTFE Composites
FEATURES AND BENEFITS:
BENEFITS
Typical Applications:
Space Saving Circuitry
•
•
•
•
•
•
Patch Antennas
Satellite Communication Systems
Power Amplifiers
Aircraft Collision Avoidance
Ground Radar Warning Systems
High dielectric constant.
• Reduction of circuit size.
Low loss.
• Ideal for applications operating at
X-band or below.
Low Z-axis expansion for RT/duroid®
6010LM.
• Provides reliable plated through holes in
multilayer boards.
Low moisture absorption for RT/duroid
6010LM.
• Reduces effects of moisture on electrical
loss.
Tight εr and thickness control
• Repeatable circuit performance.
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RT/duroid® 6000 PROPERTIES:
RT/duroid 6006
RT/duroid 6010LM
6.15 +/- 0.15
10.2+/- 0.25
Loss Tangent
0.0019
0.0023
TCK’, ppm/C
-410
-425
CTE, ppm/C
47,34, 117
Dielectric Constant
X, Y, Z
Peel Strength
Water Absorption %
5/09
Date
24, 24, 24
16
12
0.05
0.05
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RO3003™, RO3035™, 3006™, 3010™
High Frequency Laminates
Non-woven Ceramic Filled PTFE Composites
FEATURES AND BENEFITS:
BENEFITS
Low dielectric loss for high frequency
performance.
•
Can be used in applications up to 30-40 GHz.
Excellent mechanical properties versus
temperature.
•
Reliable stripline and multilayer constructions.
Uniform mechanical properties for a range
of dielectric constants.
•
•
Typical Applications:
•
•
•
•
•
•
•
•
Collision Avoidance Systems
Automotive GPS Antennas
Cellular and Paging Systems
Patch Antennas for Wireless
Communications
Direct Broadcast Satellite
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes
Ideal for mixed multilayer board designs.
Suitable for use with epoxy glass hybrid designs.
Stable dielectric constant versus
temperature and frequency for RO3003™.
•
Ideal for band pass filters, microstrip patch
antennas, and voltage controlled oscillators.
Low in-plane expansion coefficient
matched to Cu.
•
•
•
Allows for more reliable SMT assemblies.
Ideal for designs sensitive to temp change.
Excellent dimensional stability.
Volume manufacturing process.
•
Economical laminate pricing.
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RO3003
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41
RO3010
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42
RO3000™ PROPERTIES:
PTFE/ceramic
RO3003
RO3006
RO3010
Diel Constant
3.0+/-0.04
6.15+/-0.15
10.2+/-0.30
Loss Tangent
0.0013
0.0025
0.0035
TCK’, ppm/C
+13
-160
-280
CTE, ppm/C
X, Y, Z
Peel Strength
17,17
24
12
17,17
24
12
17, 17
24
12
Water Abs. %
<0.1
<0.1
<0.1
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RO3200® - WG Reinforced
¾
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44
:
RO3200™ PROPERTIES PTFE/ceramic
RO3203
RO3206
RO3210
Diel Constant
3.02+/-0.04
6.15+/-0.25
10.2 +/-0.50
Loss Tangent
0.0016
0.0027
0.0027
CTE, ppm/C
X, Y, Z
Peel Strength
13,13
58
10
13,13
45
7
13, 13
34
13
Water Abs. %
<0.1
<0.1
<0.1
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RO3003™ vs. RO3203™
High Frequency Materials Properties
RO3003 RO3203
Flexural Modulus
Flexural Strength kpsi
125
1.3
400
9.0
Tensile Modulus kpsi
Tensile Strength kpsi
65
.65
110
12.5
Dimensional Stability - mm/m (mil/inch)
0.08
0.5
CTE X,Y
Z
13
58
17
24
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DIMSTAB
¾
DIMSTAB Vs. RO3000 Thickness
0
-0.5
Movement (mils/Inch
-1
-1.5
-2
-2.5
-3
-3.5
-4
-4.5
-5
60
30
20
10
5
Core Thickness (Mils)
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47
DIMSTAB
¾ DIMSTAB of 0.005” RO3003
– Varied Cu Retention
• 0, 25, 50, 75, 100
– Varied Support/Etch Methodology
• Leader Board, Single Pass
• Carrier Board, Double Pass
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48
DIMSTAB
¾
DIMSTAB Vs. Phototool Type & Etch Method
0
0
1
2
3
4
5
DIMSTAB (Mil/In)
-0.2
-0.4
STD Etch
Supported
Linear (STD Etch)
Linear (Supported)
-0.6
-0.8
-1
-1.2
Phototool Type
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49
RO3203 Improved Dim Stab
RO3203 Vs. RO3003: Movement of 0.030" Cores Through Inner-Layer Prep and MLB Bond
0.05
0
Clad
Clad-Etch
Clad-Bake
Clad-Bond
Clad-Etch
Clad-Bake
Movement (%)
-0.05
-0.1
0.030" RO3203, SpdBrdC
0.030" RO3003, SpdBrdC
0.030" RO3203, RO4450B
-0.15
0.030" RO3003, RO4450B
-0.2
-0.25
-0.3
Process Step
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PTFE/ Ceramic Drill Parameters
¾
¾
¾
¾
¾
¾
¾
¾
Entry: Phenolic Composite 0.010”-0.030” (0.25-0.76 mm)
Exit: Phenolic Composite >0.060” (1.5mm)
Chip Load: 0.002"-0.004” (050-100mm)
per revolution
Surface Speed: 300-600 ft/min (90-180m/min)
Retract Rate: 500-600 inch/min (13-15 m/min)
Tools: Carbide
Tool Life Estimates: Stack Height Maximum Hit Count
-0.060” (1.5mm) 300
-0.120” (3.0mm) 250
-0.180” (4.5mm) 100
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51
Rogers' Soft Materials
(PTFE-based, glass reinforced and ceramic filled)
Drilling
¾ Tool Style (Undercut or Standard)
¾ Standard Entry and Backer
¾ Hit Maximums Dropped
¾ Typically 1 High
¾ Increased Chiploads
¾ Slowed Surface Footage (300-350 SFM)
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52
Rogers' Soft Materials
(PTFE-based, glass reinforced and ceramic filled)
Phenolic Entry
PTFE/Teflon Panel
PTFE/Teflon Panel
Kraft Paper
PTFE/Teflon Panel
Standard Backup Material
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Drill Notes
¾ Teflon and Hydrocarbons- High pressure
H2O flush of hole walls to remove loosened
debris.
¾ RO4000 material can go through standard
deburr. PTFE should not.
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RO3000® - MLB Process
¾ Drilling Comments:
– Conservative Tool Life
• Depends upon adhesive system
– Copper/Adhesive/PTFE
Orientation
• Most smear is directed upwards
• What’ll smear/de-smear?
– Be familiar with your holes
• Drill functional holes first,
grounding/shielding holes last
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55
PTFE- PTH Activation
¾ Sodium
Naphthalene
– Tetra Etch
– Fluoro Etch
– Poly Etch
¾ Plasma
¾ NH3 or 70% H2/30%
N2
¾ Not required on
thermoset materials.
¾ *Plasma for
desmear different
gas mixture
¾ (02/CF4 or 02/NF3)
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56
RO3000 Plasma
Rogers R03000 materials
Processing and Fabrication considerations
The special plasma cycle that can be
used to prepare the through hole is:
Other customers use successfully and
that uses 100% Helium.
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Porosity
¾ Heavy Filler Loading Creates Porosity
• 3%-5% Porosity
¾ PTFE Resin System Hydrophobic
¾ Proprietary Hydrophobic Coating is Applied to
Filler
¾ Water Absorption is Very Low
• <0.1%
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58
Porosity
¾ Low Surface Tension Solutions Can Penetrate
Material More Rapidly
– Solvents, Soapy Solutions, Oils, Caustics
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59
Porosity
¾
RO3000 Uptake Rates
5
4.5
4
Uptake (Wt%)
3.5
3
IPA
H2O
H2SO4
2.5
NaOH
Triton
2
1.5
1
0.5
0
0.5
1
2
5
10
60
1440
Exposure Time (Minutes)
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60
Porosity
¾ Sodium & Plasma Treatments Overcome
Hydrophobicity to Make Material Wettable
– Regions Exposed to Treatments Become Highly
Wettable
• PTH walls, Routed edges
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61
Porosity
¾
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62
Porosity
¾ Due to Risk of Absorption:
– Filled PTFE Materials Should Be Rinsed/Baked:
• Prior to sealing surfaces
– MLB Bond, Copper Plate, Soldermask
• Prior to high temperature exposure
– HASL, Reflow
• Rinse/Bake requirement depends upon prior PCB process step
– Exposure to some chemical processes minimized:
• 30 second sodium treatment
• 30 second residence time after flux coat
– Acid flux highly preferred
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63
PTFE Recommended Bakes
¾ Prior to Electro-less copper plate
¾ Prior to Multi-layer Bonding
¾ Prior to Soldermask coverage
¾ Prior to Solder Reflow
¾ Typical bake 1 to 2 hrs 105 – 150 C
¾ 125C Common 2 hr
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64
RO3000® - MLB Process
¾ Etch
• Cu will etch as standard
• Thin core materials may require support
– Leader boards
– Carrier boards/frames
• Preserve Post-Etch Surface
– Retain Imprint of Copper Cladding
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65
RO3000® – MLB Process
– Oxide Treat
• As Dictated By Adhesive System & Copper Retention
– Rinse & Bake
• Bake Temp As Permitted By Oxide Treat
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66
Hybrid Constructions-Bonding
¾
9
9
9
9
9
9
9
9
Considerations
Electrical Properties
Thickness/Spacing
Thermal Resistance
Thermoplastic Req.
Thermoset Req.
Sequential Lamination
Via fill capability
Press Capability
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PTFE Core Bonding
¾ RO3001
¾ FEP Film
¾ Fusion Bonding
¾ Ultralam 3908
¾ RO4450
¾ Polyimide
¾ Speedboard C
¾ FR4
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68
Bonding Layer Properties
¾ Rogers 3001
– Melt point 200C
– Dk = 2.28 – 2.33
– Df = 0.0025 – 0.003
¾ Dupont FEP
– Melt point 260C
– Dk = 2.1 – 2.2
– Df = 0.001-.0003
¾ Rogers 4450B/F
– Tg - 280C
– Dk = 3.54
– Df = 0.004
¾ Speedboard C
– Tg – 220C
– Dk = 2.6
– Df = 0.004
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69
Bonding Film Considerations
¾ Standard inner layer copper preparation
– Reduced or additive
¾ Metal Finnish
– HASL vs. Ni/Au, other (temperature)
¾ 3001
– Not for large ground areas
¾ PTFE surface preparation
– Sodium naphthalene or plasma
– Sodium requires inner layer bake
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70
RO3001 Bond Cycle
5050-200psi
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71
FEP Bond Cycle
FEP C 20
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72
Speedboard C Bond Cycle
300psi
300psi
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73
Fusion Bond Cycle
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74
Soldermask
PTFE
¾ Epoxy based
¾ - Hysol SR1000
&PC501 good yields
¾ Photoimageable
Enthone DSR3242,
Taiyo PSR4000,
Probimer 52 good yields
¾ Acrylic based - poor
yields
Do not scrub PTFE surfaces prior to soldermask
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Rogers' Soft Materials
(PTFE-based, glass reinforced and ceramic filled)
Routing
¾ Tool Style (2 Flute Endmills)
¾ Phenolic Entry with Standard Backer
¾ Kraft Paper “Sandwich”
¾ Tool Life Shortened
¾ 0.0625” Cutter (30ipm / 20krpm)
¾ Rogers Side Down
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Routing Notes
PTFE
¾ PTFE
¾ Copper present on
panel edges
¾ Prevent Teflon burring
¾ Carbide endmils
¾ Die tool punched
¾ Rigid Entry and Exit
materials
¾ Kraft paper between
layers
Phenolic
Entry
PTFE/Teflon
Panel
PTFE/Teflo
n Panel
Kraft
Paper
PTFE/Teflon
Panel
Standard Backup
Material
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The world runs better with Rogers.
Reliability
Exceptional
Materials
Collaborative
Solutions
The information contained in this presentation is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does
not create warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown in
this presentation will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit material
laminates for each application.
RT/duroid, ULTRALAM, TMM, RO2800, RO3000, RO3003, RO3006, RO3010, RO3035, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C,
RO4232, RO4233, RO4350, RO4350B, RO4450B, RO4450F, RO4500, LoPro and Theta are licensed trademarks of Rogers Corporation.
The world runs better with Rogers. and the Rogers’ logo are licensed trademarks of Rogers Corporation.
©2009 Rogers Corporation. All rights reserved.
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