Apr. 2016
Evaluation Board
Thank you for your interest in Panasonic general-purpose step- down
PSiP evaluation board is available.
DC-DC regulator ICs, which provide a wide range of input voltages and
DC-DC module
with built-in Inductor
output currents based on our power supply technology that offers low
NN31000A evaluation board
NN31000A-EVB
power consumption and is used in customized power supplies for
mobile phone.
NN31001A evaluation board
NN31001A-EVB
We increase the output current for using these devices to the industrial
and infrastructure applications like server or network.
NN31002A evaluation board
NN31002A-EVB
NN31004A evaluation board
NN31004A-EVB
NN31005A evaluation board
NN31005A-EVB
For more about the evaluation board, please contact our
sales representative or make inquiries on our website.
Sales Offices
http://www.semicon.panasonic.co.jp/en/aboutus/sales_offices.html
Step down DC-DC module
WEB Support
http://www.semicon.panasonic.co.jp/en/contactus/
Request for your special attention and precautions in using the technical information and semiconductors described in this
book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
(2) The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as
expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special
applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion
equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the
failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that
our company shall not be held responsible for any damage incurred as a result of or in connection with your using the
products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most
up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to
exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching.
Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social
damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When
using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time
since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
www.semicon.panasonic.co.jp/en
Power device solution, ENELEAD
Panasonic provides ENELEAD, the “Total solution of power devices,” which
supports from power system design to purchasing of components, allowing you to
select a suitable small, high-efficiency power device, to easily perform a design and
evaluation of power systems by using web-based tools, and to purchase peripheral
components.
Design Support Tools
Power supplies
by application
Power Devices
Panasonic will continue to offer the power solutions that
satisfy our customers along with the "ENELEAD."
1 Kotari-yakemachi, Nagaokakyo City, Kyoto 617-8520, Japan
Tel : 81-75-951-8151
www.semicon.panasonic.co.jp/en/applications/power/
or
Issued in Apr. 2016
3.0_LFL000013E
© Panasonic Corporation 2016
010614
Printed in Japan
Panasonic power device simulator global
Click
Feature 3
Feature 5
~Small Footprint~
(PSiP : Power Supply in Package)
50% smaller footprint compared to conventional power circuit
Single-package DC-DC module containing analog control IC,
MOSFET, capacitor, and inductor.
MCP (DC-DC converter with
PSiP solution
Board module
MOS
Capacitor
Capacitor
Built-in
capacitor
and
inductor
Inductor
Inductor
Inductor
MCP DC-DC
Inductor
CAVIN
Low
Area reduction
Reduced DC-DC
area size to 1/2
World's smallest footprint
MCP
49% smaller
PSiP
170mm2
High
77mm2
(IC:64mm2)
150mm2
MCP(DC-DC with MOSFET) Panasonic PSiP
Feature 1
~High efficiency~
PSiP
CVOUT
Board module
91%@100 mA
Peak:95%
100
90
Makes equipment smaller.
Low
Feature 4
~Low Heat Generation~
Simplifies anti-noise measures.
(1) Evolution of package structure : Highly integrated package technology reduces the heat generation area.
Feature 6
~Simple Design~
70
The size of DC-DC converter
Continuous mode
50
40
DC-DC
+
Inductor
<Conditions>
Input voltage: 12V
Output voltage: 3.3V
SW frequency: 600kHz
30
20
10
(For example)
Heat dissipation
(Vin=12V, Vout=3.3V, Io=9A)
High
Inductor
CPVIN
Efficiency [%]
80
Skip mode
MCP DC-DC
Inductor
MCP
CVOUT
CAVIN
0
0.001
0.01
0.1
1
10
Panasonic
Peak : 105C
Load current [A]
Finish!
Reduce Design time
Circuit design/
PSiP
Good
PCB design/
Evaluation
MCP
Discrete
Debugging
Circuit design/
50% smaller
DC-DC converter
parts size
~Fast Response~
Low heat generation
Heat generation area
reduced to 1/3
High
circuit/
PCB design/
PCB design/
Evaluation
Evaluation
Good
Design time
Applications
Communication infrastructure (base station/Optical/router/switch/ server)/
amusement/surveillance camera/measurement instrument/industrial equipment, etc.
[Product Specifications]
CPVIN
PSiP
Finish!
Redesign of
circuit/
PCB design/
Evaluation
Debugging
Redesign of
Increases the development efficiency.
Achieves low power consumption
and low heat generation.
Hysteretic control capable of quickly responding to a sudden change
of load current
Integrating high-current
wires and the wires that
cause noise into a single
package reduces the
layout design cost and
risk of power supplies.
Low
High efficiency over the full range of loads, from light load to heavy load
Feature 2
PSiP
Panasonic
PSiP
(1) Provides MOSFET with low on-resistance.
(2) Offers a Skip-mode function with high efficiency at light load.
60
Low noise
Noise area reduced to 1/3
CPVIN
55% smaller
New device, PSiP that significantly reduces board space
MCP
CVOUT
Panasonic
* MCP (Multi Chip Package)
Inductor
Noise
(Vin=12V, Vout=3.3V, Io=5A)
High
DC-DC
+
Inductor
PSiP
1 package
The size of DC-DC converter
embedded MOSFET) solution
MCP DC-DC
Control IC
~Low Noise~
Evolution of PKG structure : Seals the noise source in a package.
CPVIN
DC-DC Module with Built-in Inductor PSiP
NN31005A
NN31002A
NN31001A
NN31000A
NN31004A
CVOUT
Load current
0.1A5A0.1 A
Panasonic
Input voltage
PSiP
Undershoot: 15mV
Hysteretic control
Peak : 86C
Low
VOUT
(AC)
Load transient response
characteristic
Vin = 12V, Vout = 1V
Cout: 66μF
Iload
50mV/div
(2) Evolution of design technology : Increasing power efficiency (loss
reduction) decreases heat generation.
Efficiency
 Overshoot/Undershoot 20mVpp
 External phase compensation circuit is
not required.
Ensures a stable operation of equipment and
reduces the external parts count.
Vin=12V, Vout=3.3V@9A
Lower heat generation
MCP DC-DC
89.1%
PSiP
92.0%
19ºC lower
surface temperature
Allows heatsink to be downsized or removed.
Output voltage
Output current
4.5 to 16V
30V
Absolute maximum rating
PSiP
Overshoot: 19mV
4.5 to 28V
2A
4A
0.6 to 5.5V
7A
10 A
Operating mode
*1
Skip/FCCM
Protection mode
Package Type
*2
Latch-off/automatic restoration
Size (height)
Pin-pitch
Oscillation frequency
Protective function
Product supply
0.6 to 3.6V
12 A
QFN
8.5mm x 7.5mm (4.7mm)
0.5-mm pitch
Selectable from 400 kHz, 600 kHz, or 800 kHz
OCP, OVD, UVD, SCP, UVLO, TSD
mass production
1 Select “Skip Mode” for high efficiency at light load or “Force Continuous Conduction Mode” for EMI
measures.
2 For OVD (Over Voltage Detection) and SCP (Short Comparator Protection), it is selectable whether latchoff or automatic restoration after protection.