Apr. 2016 Evaluation Board Thank you for your interest in Panasonic general-purpose step- down PSiP evaluation board is available. DC-DC regulator ICs, which provide a wide range of input voltages and DC-DC module with built-in Inductor output currents based on our power supply technology that offers low NN31000A evaluation board NN31000A-EVB power consumption and is used in customized power supplies for mobile phone. NN31001A evaluation board NN31001A-EVB We increase the output current for using these devices to the industrial and infrastructure applications like server or network. NN31002A evaluation board NN31002A-EVB NN31004A evaluation board NN31004A-EVB NN31005A evaluation board NN31005A-EVB For more about the evaluation board, please contact our sales representative or make inquiries on our website. Sales Offices http://www.semicon.panasonic.co.jp/en/aboutus/sales_offices.html Step down DC-DC module WEB Support http://www.semicon.panasonic.co.jp/en/contactus/ Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. www.semicon.panasonic.co.jp/en Power device solution, ENELEAD Panasonic provides ENELEAD, the “Total solution of power devices,” which supports from power system design to purchasing of components, allowing you to select a suitable small, high-efficiency power device, to easily perform a design and evaluation of power systems by using web-based tools, and to purchase peripheral components. Design Support Tools Power supplies by application Power Devices Panasonic will continue to offer the power solutions that satisfy our customers along with the "ENELEAD." 1 Kotari-yakemachi, Nagaokakyo City, Kyoto 617-8520, Japan Tel : 81-75-951-8151 www.semicon.panasonic.co.jp/en/applications/power/ or Issued in Apr. 2016 3.0_LFL000013E © Panasonic Corporation 2016 010614 Printed in Japan Panasonic power device simulator global Click Feature 3 Feature 5 ~Small Footprint~ (PSiP : Power Supply in Package) 50% smaller footprint compared to conventional power circuit Single-package DC-DC module containing analog control IC, MOSFET, capacitor, and inductor. MCP (DC-DC converter with PSiP solution Board module MOS Capacitor Capacitor Built-in capacitor and inductor Inductor Inductor Inductor MCP DC-DC Inductor CAVIN Low Area reduction Reduced DC-DC area size to 1/2 World's smallest footprint MCP 49% smaller PSiP 170mm2 High 77mm2 (IC:64mm2) 150mm2 MCP(DC-DC with MOSFET) Panasonic PSiP Feature 1 ~High efficiency~ PSiP CVOUT Board module 91%@100 mA Peak:95% 100 90 Makes equipment smaller. Low Feature 4 ~Low Heat Generation~ Simplifies anti-noise measures. (1) Evolution of package structure : Highly integrated package technology reduces the heat generation area. Feature 6 ~Simple Design~ 70 The size of DC-DC converter Continuous mode 50 40 DC-DC + Inductor <Conditions> Input voltage: 12V Output voltage: 3.3V SW frequency: 600kHz 30 20 10 (For example) Heat dissipation (Vin=12V, Vout=3.3V, Io=9A) High Inductor CPVIN Efficiency [%] 80 Skip mode MCP DC-DC Inductor MCP CVOUT CAVIN 0 0.001 0.01 0.1 1 10 Panasonic Peak : 105C Load current [A] Finish! Reduce Design time Circuit design/ PSiP Good PCB design/ Evaluation MCP Discrete Debugging Circuit design/ 50% smaller DC-DC converter parts size ~Fast Response~ Low heat generation Heat generation area reduced to 1/3 High circuit/ PCB design/ PCB design/ Evaluation Evaluation Good Design time Applications Communication infrastructure (base station/Optical/router/switch/ server)/ amusement/surveillance camera/measurement instrument/industrial equipment, etc. [Product Specifications] CPVIN PSiP Finish! Redesign of circuit/ PCB design/ Evaluation Debugging Redesign of Increases the development efficiency. Achieves low power consumption and low heat generation. Hysteretic control capable of quickly responding to a sudden change of load current Integrating high-current wires and the wires that cause noise into a single package reduces the layout design cost and risk of power supplies. Low High efficiency over the full range of loads, from light load to heavy load Feature 2 PSiP Panasonic PSiP (1) Provides MOSFET with low on-resistance. (2) Offers a Skip-mode function with high efficiency at light load. 60 Low noise Noise area reduced to 1/3 CPVIN 55% smaller New device, PSiP that significantly reduces board space MCP CVOUT Panasonic * MCP (Multi Chip Package) Inductor Noise (Vin=12V, Vout=3.3V, Io=5A) High DC-DC + Inductor PSiP 1 package The size of DC-DC converter embedded MOSFET) solution MCP DC-DC Control IC ~Low Noise~ Evolution of PKG structure : Seals the noise source in a package. CPVIN DC-DC Module with Built-in Inductor PSiP NN31005A NN31002A NN31001A NN31000A NN31004A CVOUT Load current 0.1A5A0.1 A Panasonic Input voltage PSiP Undershoot: 15mV Hysteretic control Peak : 86C Low VOUT (AC) Load transient response characteristic Vin = 12V, Vout = 1V Cout: 66μF Iload 50mV/div (2) Evolution of design technology : Increasing power efficiency (loss reduction) decreases heat generation. Efficiency Overshoot/Undershoot 20mVpp External phase compensation circuit is not required. Ensures a stable operation of equipment and reduces the external parts count. Vin=12V, [email protected] Lower heat generation MCP DC-DC 89.1% PSiP 92.0% 19ºC lower surface temperature Allows heatsink to be downsized or removed. Output voltage Output current 4.5 to 16V 30V Absolute maximum rating PSiP Overshoot: 19mV 4.5 to 28V 2A 4A 0.6 to 5.5V 7A 10 A Operating mode *1 Skip/FCCM Protection mode Package Type *2 Latch-off/automatic restoration Size (height) Pin-pitch Oscillation frequency Protective function Product supply 0.6 to 3.6V 12 A QFN 8.5mm x 7.5mm (4.7mm) 0.5-mm pitch Selectable from 400 kHz, 600 kHz, or 800 kHz OCP, OVD, UVD, SCP, UVLO, TSD mass production 1 Select “Skip Mode” for high efficiency at light load or “Force Continuous Conduction Mode” for EMI measures. 2 For OVD (Over Voltage Detection) and SCP (Short Comparator Protection), it is selectable whether latchoff or automatic restoration after protection.