Atrenne
Computing Solutions
MISSION CRITICAL — RUGGED & READY WHEN YOU ARE
700
SERIES
Atrenne Computing Solutions, Inc. specializes
in rugged electronic systems for mission-critical
and performance-critical embedded computing
platforms deployed in harsh environments. With a
legacy spanning over forty years of providing
enclosures, backplanes, system integration and
custom solutions for VME, VPX, CompactPCI,
xTCA, small-form factors and more. The 700
Series ATR Enclosures are available in standard
ARINC sizes that include 1/4 ATR Short to
1 1/2 ATR Long and any custom form factor desired
utilizing the flexibility of a modular frame. The 700
Series ATR will accept a variety of bus
structures and platforms, including VME, VME64x,
VXS, VPX, and cPCI technologies, providing an
expansive product offering of bus standards as well
as application-specific custom designs.
VPX DEVELOPMENT SYSTEMS
522 Series
Development/
Test Station for VPX
Atrenne Computing Solutions 522 VPX
Series Development/Test Station offers the
test and development community a featureenhanced design combining functionality and
flexibility with aesthetic detail. Designed with
the development engineer in mind, the 522
VPX Series offers an open frame concept
providing probe access to cards under test
and an optional intelligent monitoring system.
Available with a wide range of OpenVPX
backplane profiles, custom backplane configurations or a user-definable, wafer cable-ready backplane for the ultimate flexibility
in a development system.
Features and Benefits
• Aesthetic aluminum design
• Available in 3U and 6U formats
• LED Array for DC Voltages
• DC Voltage test jacks
• Open frame for easy card access
• High-volume cooling fans
• Speed-controlled fans
• Fan fail monitored
• Front-mounted system reset switch
• VPX/VME64x hybrid
•
•
•
•
backplane option
Rear transition module configured
System monitoring board with
LCD display
Available in VME, VME64x,
VXS and cPCI platforms
Easily configurable for air-cooled
or conduction-cooled cards
585 Series
Portable Enclosures for VPX
Atrenne Computing Solutions 585 Series is
a portable, lightweight aluminum enclosure,
excellent for development, industrial automation
and mobile test environments. Highly serviceable and maintainable, the 585 Series features
a flush card cage accommodating either five or
eight 3U or 6U x 160mm VPX boards housed
in a vertical orientation. Available with a wide
range of OpenVPX backplane profiles, custom
configured or the flexibility of user-definable,
wafer cable–ready versions.
The 585 Series is commonly used as the
commercial development system prior to
deploying production-configured hardware.
Features and Benefits
• Configurations for both 3U
•
•
and 6U cards
Available with VPX, VME64x
and cPCI Backplanes
Can be configured for both
air-cooled and conduction-cooled
cards
• High-volume cooling fans
• Lightweight-aluminum construction
• Top-mounted handle for portability
• 5-slot and 8-slot configurations
• Rear transition module configured
700 SERIES
714 Convection-cooled ATR Enclosures
Designed for maximum strength and lightweight deployment, the frame and construction of the 714 Series models the
fabrication techniques used in manufacturing today’s commercial and military aircraft. Utilizing an aluminum frame that
provides flexibility in size, the frame is assembled with solid rivet technology and reinforced with aluminum outer panels to
form a rugged ATR that can withstand the most severe shock and vibration environments.
W
H
L2
716 Conduction-cooled ATR Enclosures
Engineered for strength, lightweight deployment, and maximum cooling in a conduction-cooled environment, the 716 Series
incorporates a unique frame and configurable conducting walls that allow the ATR to be tailored to meet a wide range of
thermal requirements.
Features and Benefits of Atrenne’s 700 Series
• Expansive range of ARINC sizes
• Easily configurable for custom sizes
• Modular power supply
• AC or DC filtered inputs
• High-altitude fan offering
www.atrenne.com
• System performance monitoring
• VPX, VME64x, cPCI
• Cold-start heaters
• Avionics isolation tray
• Configurable I/O panel
• Lightweight solutions
• Top-load and side-load options
• I/O Board modules to reduce wiring
• Engineered thermal performance
• Available with water-tight seals
717 Air-Over Conduction-cooled ATR Enclosures
Designed for strength and maximum cooling in a conduction-cooled environment, the 717 Series incorporates brazed
folded-fin material thermally bonded between the conducting wall and the outer panel and a machined finned rear panel
that help increase the thermal planes for maximum heat dissipation. Combined with an auxiliary external fan, the 717 Series can
increase thermal dissipation over 30 percent compared with conventional conduction cooling.
720 Liquid-cooled ATR Enclosures
Engineered to provide the ultimate in thermal cooling performance, the 720 Series is capable of utilizing a variety of cooling
fluids, such as Polyalphaolefin (PAO) and Ethylene or Propylene glycol/water (EGW) or (PGW). The conducting walls are
uniquely designed for either front or rear fluid access and can be configured with a mating avionics tray that provides a blind
mate/quick disconnect feature. The liquid panels are also configured as a Line Replaceable Unit (LRU) for field upgrades.
Dimensions:
ATR Size
1
714
2
716
717
3
720
737
4
5
Aprox. Vol.
In3
Litre
Width (W)
+/– .03 in +/–.76mm
Length (L1)
+/– .04 in +/–1.0mm
Length (L2)
inches
mm
Height (H)*
inches
mm
1⁄4 Short
299
4.90
2.25
57.15
12.52
318.0
12.62
320.5
7.62
193.5
1⁄4 Long
466
7.64
2.25
57.15
19.52
495.8
19.62
498.3
7.62
193.5
1⁄2 Short
649
10.64
4.88
123.95
12.52
318.0
12.62
320.5
7.62
193.5
1⁄2 Long
1012
16.58
4.88
123.95
19.52
495.8
19.62
498.3
7.62
193.5
3⁄4 Short
997
16.34
7.50
190.50
12.52
318.0
12.62
320.5
7.62
193.5
3⁄4 Long
1555
25.48
7.50
190.50
19.52
495.8
19.62
498.3
7.62
193.5
1 Short
1346
20.06
10.12
257.05
12.52
318.0
12.62
320.5
7.62
193.5
1 Long
2098
34.38
10.12
257.05
19.52
495.8
19.62
498.3
7.62
193.5
1-1⁄2 Long
3188
52.24
15.38
390.65
19.52
495.8
19.62
498.3
7.62
193.5
Max
(6U) slots
1
5
8
12
18
* 714 Series – Height 10.62 in., 269.88 mm
737 Composite Air-over Conduction-cooled ATR Enclosures
Designed as a lightweight option to the popular air-over conduction of ATRs. Strategically uses composite blended
materials. The 737 series incorporated brazed folded-fin material thermally bonded between the conducting wall and
the outer composite panel.
VPX Series Backplanes VITA 46/65
Designed for performance, the VPX series backplanes meet or exceed the latest VITA standard requirements, from VITA
46 to VITA 65 OpenVPX to complete custom-configured solutions. Each backplane is designed to meet the rigorous
performance and environmental standards associated with the deployment of VPX-based systems. Available in a wide
range of slot counts in 3U and 6U formats and an array of backplane profiles for a wide range of applications.
Specifications:
Storage Temp.
Operating Temp.
EMC
Input Power
Wiring
IP Rating
-40°C to +85°C
-40°C to +70°C
MIL-STD-810F
Acceleration
13.5g
MIL-STD-810F Method 513.5
MIL-STD-461D
Altitiude
10K standard fan, 50K-ft-high-altitude
fans (714), 50K-ft (716/717)
MIL-STD-810F Method 500.4
28VDC
115VAC/ 400Hz. 1Ø
115VAC/ 400Hz. 3Ø
MIL-STD-704A
Thru 704E
MIL-STD-1275A
Humidity
Up to 95% RH
MIL-STD-810F Method 507.4
Salt Fog
5% for 48 hours
MIL-STD-810F Method 509.4
Fungal Growth
Low Toxicity
MIL-C-24643
No growth
MIL-STD-810F Method 508.5
IP53 (714), IP68 (716, 717 & 720)
Thermal Shock
Sudden change in temperature
of surrounding atmosphere
MIL-STD-810F Method 503.4
–
–
–
–
Vibration
15 to 2,000Hz
At 0.1g2/ Hz. (RMS~12g)
MIL-STD-810F
Method 514.5
Sand & Dust
Sand @ 5,700 ft./min., Dust @ 1,750 ft./min.
(714), Sealed from environment (716/717)
MIL-STD-810F Method 510.4
Shock
20g for 11ms
MIL-STD-810F
Method 516.5
Finish
Chromate
MIL-C-5541, MIL-DTL-81706
MIL-STD-595
www.atrenne.com
WHETHER YOU KNOW US AS MUPAC, CARLO GAVAZZI,
SIE, HYBRICON OR NOW ATRENNE, OUR COMMITMENT
TO CUSTOMERS NEVER WAVERS.
Mupac originally started as a wire wrap manufacturer for prototype systems for the industrial and military industries in 1972. The
company was acquired by Carlo Gavazzi in 1986 and by SIE in 2009. In 2014, SIE was acquired by Atrenne Integrated Solutions™
and became Atrenne Computing Solutions. In 2015, Atrenne acquired the Hybricon® electronic packaging group from
Curtiss-Wright, solidifying its position as the leading integrator of chassis, backplanes and related accessories for military markets.
Throughout our storied history, Atrenne Computing Solutions has remained in Brockton, Massachusetts and we continue to
serve customers around the world from our state-of-the-art, vertically integrated manufacturing facility.
While the company has changed ownership, we have always remained committed to meeting our customers’ requirements.
1 97 2
1986
2009
Atrenne
© Copyright 2015, Atrenne Computing Solutions
All Rights Reserved. ACS-BB-700-Series-511019A
Computing Solutions
2015
2 01 0
1 97 7
CURTISS-WRIGHT
ELECTRONIC
PACKAGING
NEW HOPE, MN
Atrenne
LITTLETON, MA
BROCKTON, MA
Computing Solutions
10 Mupac Drive • Brockton, MA 02301
Phone: 800.926.8722 • 508.588.6110 • Fax: 508.588.0498
www.atrenne.com
DALLAS/FORT WORTH, TX