FQA11N90 / FQA11N90_F109
N-Channel QFET® MOSFET
900 V, 11.4 A, 960 mΩ
Features
Description
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor®’s proprietary planar
stripe and DMOS technology. This advanced MOSFET
technology has been especially tailored to reduce on-state
resistance, and to provide superior switching performance and
high avalanche energy strength. These devices are suitable
for switched mode power supplies, active power factor
correction (PFC), and electronic lamp ballasts.
• 11.4 A, 900 V, RDS(on) = 960 mΩ (Max.) @ VGS = 10 V,
ID = 5.7 A
• Low Gate Charge (Typ. 72 nC)
• Low Crss (Typ. 30 pF)
• 100% Avalanche Tested
• RoHS Compliant
D
G
G
D
TO-3P
S
S
Absolute Maximum Ratings
Symbol
Parameter
FQA11N90
Unit
VDSS
Drain-Source Voltage
900
V
ID
Drain Current
- Continuous (TC = 25°C)
11.4
A
IDM
Drain Current
- Pulsed
VGSS
Gate-Source Voltage
EAS
- Continuous (TC = 100°C)
7.2
A
(Note 1)
45.6
A
± 30
V
Single Pulsed Avalanche Energy
(Note 2)
1000
mJ
IAR
Avalanche Current
(Note 1)
11.4
A
EAR
Repetitive Avalanche Energy
(Note 1)
30
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD
Power Dissipation (TC = 25°C)
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
- Derate above 25°C
4.0
V/ns
300
W
2.38
W/°C
-55 to +150
°C
300
°C
Thermal Characteristics
Symbol
FQA11N90
Parameter
Unit
RθJC
Thermal Resistance, Junction-to-Case, Max.
0.42
RθCS
Thermal Resistance, Case-to-Sink, Typ.
0.24
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient, Max.
40
°C/W
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
1
°C/W
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
April 2013
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FQA11N90
FQA11N90
TO-3P
--
--
30
FQA11N90
FQA11N90_F109
TO-3PN
--
--
30
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max Unit
900
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = 250 µA
∆BVDSS/
∆TJ
Breakdown Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C
--
1.0
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 900 V, VGS = 0 V
--
--
10
µA
VDS = 720 V, TC = 125°C
--
--
100
µA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30 V, VDS = 0 V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30 V, VDS = 0 V
--
--
-100
nA
3.0
--
5.0
V
--
0.75
0.96
Ω
--
12
--
S
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static Drain-Source On-Resistance
VGS = 10 V, ID = 5.7 A
gFS
Forward Transconductance
VDS = 50 V, ID = 5.7 A
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
--
2700
3500
pF
--
260
340
pF
--
30
40
pF
--
65
140
ns
--
135
280
ns
--
165
340
ns
--
90
190
ns
--
72
94
nC
--
16
--
nC
--
35
--
nC
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
VDD = 450 V, ID = 11.4A,
RG = 25 Ω
(Note 4, 5)
VDS = 720 V, ID = 11.4A,
VGS = 10 V
(Note 4, 5)
Gate-Drain Charge
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
11.4
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
45.6
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS =11.4 A
--
--
1.4
V
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 11.4 A,
dIF / dt = 100 A/µs
(Note 4)
--
850
--
ns
--
11.2
--
µC
NOTES:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 15mH, IAS =11.4A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 11.4A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
2
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
Top :
ID, Drain Current [A]
1
10
ID, Drain Current [A]
1
10
0
10
o
150 C
o
25 C
0
10
o
-55 C
※ Notes :
1. 250µ s Pulse Test
2. TC = 25℃
-1
10
※ Notes :
1. VDS = 50V
2. 250µ s Pulse Test
-1
-1
0
10
10
1
10
10
2
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
IDR, Reverse Drain Current [A]
RDS(ON) [Ω ],
Drain-Source On-Resistance
2.0
VGS = 10V
1.6
VGS = 20V
1.2
0.8
※ Note : TJ = 25℃
0.4
1
10
0
10
150℃
※ Notes :
1. VGS = 0V
2. 250µ s Pulse Test
-1
0
8
16
24
32
10
40
0.2
0.4
ID, Drain Current [A]
4500
4000
Ciss
Coss
2500
2000
1500
※ Notes :
1. VGS = 0 V
2. f = 1 MHz
Crss
1000
500
0
-1
10
1.0
1.2
12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
3500
3000
0.8
Figure 6. Gate Charge Characteristics
VGS, Gate-Source Voltage [V]
5000
0.6
VSD, Source-Drain voltage [V]
Figure 5. Capacitance Characteristics
Capacitance [pF]
25℃
VDS = 180V
10
VDS = 450V
VDS = 720V
8
6
4
2
※ Note : ID = 11.4 A
0
10
0
1
10
10
20
30
40
50
60
70
80
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
0
3
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
※ Notes :
1. VGS = 0 V
2. ID = 250 µA
0.9
0.8
-100
-50
0
50
100
150
2.5
2.0
1.5
1.0
※ Notes :
1. VGS = 10 V
2. ID = 5.7 A
0.5
0.0
-100
200
-50
0
o
50
100
150
200
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
12
Operation in This Area
is Limited by R DS(on)
ID, Drain Current [A]
10
100 µs
1
10
DC
10 µs
ID, Drain Current [A]
2
10
1 ms
10 ms
0
10
※ Notes :
-1
10
o
1. TC = 25 C
8
6
4
2
o
2. TJ = 150 C
3. Single Pulse
-2
10
0
10
1
2
10
0
25
3
10
10
50
75
100
125
150
TC, Case Temperature [℃]
VDS, Drain-Source Voltage [V]
Zθ JC(t), Thermal Response
Figure 11. Transient Thermal Response Curve
D = 0 .5
10
-1
※ N o te s :
1 . Z θ J C ( t) = 0 .4 2 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C ( t)
0 .2
0 .1
0 .0 5
PDM
0 .0 2
10
t1
0 .0 1
-2
s in g le p u ls e
10
-5
10
-4
10
-3
10
-2
10
t2
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
4
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Typical Performance Characteristics (Continued)
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
5
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
6
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Mechanical Dimensions
TO-3P
Dimensions in Millimeters
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
7
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
Mechanical Dimensions
TO-3PN
Dimensions in Millimeters
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
8
www.fairchildsemi.com
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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2.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
©2007 Fairchild Semiconductor Corporation
FQA11N90 / FQA11N90_F109 Rev. C0
9
www.fairchildsemi.com
FQA11N90 / FQA11N90_F109 N-Channel QFET® MOSFET
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