THIS DRAWING IS THE PROPERTY OF FAIRCHILD SEMICONDUCTOR CORPORATION. NO USE
THEREOF SHALL BE MADE OTHER THAN AS A REFERENCE FOR PROPOSALS AS SUBMITTED
TO FAIRCHILD SEMICONDUCTOR CORPORATION FOR JOBS TO BE EXECUTED IN CONFORMITY
WITH SUCH PROPOSALS UNLESS THE CONSENT OF SAID FAIRCHILD SEMICONDUCTOR CORPORATION HAS PREVIOUSLY BEEN OBTAINED. NO PART OF THIS DRAWING SHALL BE
COPIED OR DUPLICATED OR ITS CONTENTS DISCLOSED. THE INFORMATION CONTAINED
ON THIS DRAWING IS CONFIDENTIAL AND PROPRIETARY.
2.50
2.25
2X
3.00
0.15 C
A
2.00
0.55 (10X)
B
10
6
1.80
3.00
2.20
2X
1
0.15 C
3.30
5
0.25 (10X)
0.50
TOP VIEW
1.00 MAX
0.10 C
LAND PATTERN RECOMMENDATION
0.20
0.08 C
0.05
0.00
C
SIDE VIEW
SEATING PLANE
3.10
2.90
NOTES: UNLESS OTHERWISE SPECIFIED
2.55
2.45
0.38
5
1
PIN#1 IDENT
E
3.10
2.90
1.85
1.75
0.19 TYP
0.45
0.35
10
6
0.50
2.00
BOTTOM VIEW
A. THIS PACKAGE CONFORMS TO JEDEC MO-229
VARIATION VEED.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D. DIMENSIONS AND TOLERANCES AS PER ASME
Y14.5-1994.
E NON-JEDEC VEED-5 COMPLIANT VALUE.
F. LAND PATTERN DIMENSIONS ARE NOMINAL
VALUES ONLY.
G. FILE NAME: MKT-MLP10GREV1
0.30
0.18
0.10 M C A B
0.05 M C
APPROVALS
DRAWN:
BOBOY MALDO
CHECKED:
G CHEW
APPROVED:
KH LEE
APPROVED:
HOWARD ALLEN
DATE
26JAN11
10LD,MLP,DUAL,JEDEC MO229,
VARIATION VEED, 3MM SQUARE
.
SCALE
PROJECTION
[MM]
INCH
1:1
SIZE
N/A
DRAWING NUMBER
FORMERLY: N/A
MKT-MLP10G
REV
1
SHEET : 1 OF 1