TC-8 MIPSS Presentation - IEEE Standards Working Group Areas

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IEEE P1693 Modular Interconnect
Packaging for Scalable Systems
(MIPSS) Standard
Sponsored By:
IEEE-SASB Coordinating
Committees/SCC20 - Test
and Diagnosis for Electronic
Systems (SASB/SCC20)/
Hardware Interfaces
Working Group (HI_WG)
THE MIPSS STANDARD APPROACH…
Define Interconnect and Packaging Standards that…
…specs an open ATS standard/modular/scalable/user reconfigurable design;
…offers COTS availability/low cost/proven technology/obsolescence prevention;
…inserts technology with combined VXI parallel/PCI Express serial bus control;
…defines a virtual power source for system and/or UUT needs;
…provides direct coupled-pluggable instrument/test interface I/O;
…applies transparent test interface plug-on interconnectivity;
…supports commercial and military applications.
Standardization does achieve common goals
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
2!
MIPSS Building Blocks Serve Vertical/
Horizontal Interoperability and Scalability Needs
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
3!
MIPSS Supports Down-sized Building Blocks for DoD Military Systems
LM-STAR
Rack Mount 14 slot Version
VDATS
LM-STAR
VDATS/TETS/
CASS/NGATS
PLUG-ON
INTERFACE
Or
Benchtop
10 slot RFI
Version or
Personalty
Adapter (PA IEEE-P1693 MIPSS
Building Block
%$,*')!%$(
TETS
NGATS
LM-STAR
VDATS/TETS/
CASS/NGATS
VXI INTRUMENTATION
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
LM-STAR
VDATS/TETS/
CASS/NGATS
VXI INTRUMENTATION
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
4!
IEEE-P1693 MIPSS System Open Standards Interrelationships
IEEE-P1693
Modular Interconnect
Packaging for Scalable Systems
(MIPSS) for Test Systems
(ATS Packaging Spec)
Instrumentation and Measurement Society
TC-8 Automated Instruments Initiatives
industry effort focuses on ATE
interconnect specifications
that:
-  defines a scalable plug&play
building block system integration;
-  defines advanced VXI backplane
which supports current parallel bus
technology and new VITA-41.4 PCI
Express serial bus applying PXI
Protocols, and 1149 test bus;
-  defines a Virtual Power Source for
either ATS and/or UUT needs;
-  defines an integrated Instrument
carrier – test module and transparent plug-on interface; and
VXIbus
Specification
Revision 4.0
(Current Spec)
Instr/RFI Direct
Interconnect
Pkg/Integ Spec
(Part of MIPSS)
VITA-41.3
(Serial Bus)/PCI -Express
Current Spec
Building Block
Enclosure
Pkg/Integ Spec
(Part of MIPSS)
IEEE-1149/Rev
JTAG System Level
Test Bus
Current Spec
- supports ARGCS/DOD Frameworks
goals.
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
Virtual Power Mod
Packaging/Integ
Specification
(Part of MIPSS))
MIPS
Fixture Packaging/
Integration Spec
(Part of MIPSS)
IEEE-1505
RFI General Spec
(Approved)
IEEE-1505.1
CTI Pin Map Spec
(Approved)
IEEE-1671/Rev
ATML for ATE via XML
(Approved)
IEEE-1636
SIMICA
(Approved)
IEEE-1232/Rev
AI-ESTATE
(Approved)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
5!
MIPSS Building Block Architecture Is Fully Realized Through
Direct Coupled Instrumentation and Segmented Test Interfacing
MIPSS Improves: •Delivery •Plug&Play Assembly •User Reconfigurability •Costs
•Repeatable Parametric Performance •Ease of Calibration/Maintenance •Reliability
Benefits are achieved through!
!test interface segmentation and
scalability
!direct coupling of the instrument to
user test interface choice system; and
!minimizing inter-building block
cabling and interconnects.
Test Interface Segmentation Converts
Consolidated Unit Into a Multi-Segment Units
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
6!
MIPSS Building Block
10 Slot Packaging Specification
A.
IEEE-P1693 MIPSS Defines Interlocking
Enclosure with 10 slot VXI Chassis Spec for
modular/ scalable plug&play building block
to meet any ATE requirement (transportable
suitcase to multi-unit large ATE).
B.
IEEE-P1693 MIPSS Defines High
Performance Multi-Method Cooling Spec for
Convective/Conductive/ Liquid Means.
Top View
Side View
Features:
- ruggedized laminated-conductive enclosure
- four side interlocking engagement mechanism
- four side interconnect blindmate connectors
- high volume fan/ pressurized cooling system/
conductive guides/optional liquid cooling
- metered slot air flow with temperature
monitoring and fan control
- AC/DC Conversion to 48VDC Bus
Front View
24
RFI Electric
Drive Motor
RFI 14 slot
Receiver
RFI Signal High
Speed Module
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
7!
MIPSS Building Block Expansion to
19 Rack Mount 14 Slot Packaging Specification
Top View
IEEE-1693 MIPSS Standard defines an optional expanded 14 slot VXI
Chassis Enclosure Spec of the modular/ scalable plug&play building block
dimensions to meet existing 19 rack mount ATE requirement, while
maintaining matched fixture engagement applicable to the 10 slot
configuration.
Features:
-  expanded chassis to support 14 slot rack mount systems
-  replacement of existing chassis that supports current VXI instrumentation
and new IEEE-1155 VXI Revised serial based instrumentation prevents
obsolescence and utilizes installed investment
-  Supports MIPSS building block wiith advanced VXI revised serial bus
backplance, virtual power module, multi-method cooling, and direct coupled
instruments/RFI interconnect design
-  matched with IEEE-P1505 RFI segmented 14 slot framework to 10 slot
building block dimensions that can support scalable fixtures from 1-56 slots
Front View
Left 19 Rack Mount
Right 19 Rack Mount
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
Side View
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
8!
MIPSS Building Block Spec
Interlocking Stackable Configuration
6
6
6
Side View for MIPSS
Stackable Implementation
of Two (2) 10 slot VXI
Chassis with a Example
Choice of Two (2) IEEE
1505 RFI Receivers.
Shown with VXI Revised
Pressurized Cooling, VXI
Card, Instrument/RFI
Interconnect, and RFI
Interfacing to High Speed
Signal Connector.
This Layout Represents A
MIPSS Stackable Configuration That Can Be
Scaled To the Level able
to interconnect to the RFI
Framework. Otherwise
Added VXI Chassis Can
Be Supported But Dictate
Wiring Schemes to Bring
Instrument Signals to the
RFI/CTI System.
VXI INSTRUMENT
TO RFI INTERCONNECT DIRECT
COUPLER
RFI
ELECTRIC
MOTOR
DRIVE
EXT SIGNAL TO
VXI INSTRUMENT
FLATPACK
CONNECTOR
VXI INSTRUMENT
TO RFI SIGNAL
INTERCHASSIS
CONNECTOR
VXI C-SIZE
INSTRUMENT
MODULE
VXI
CHASSIS
9 SLOT
RUGGEDIZED
OUTER CASE
VXI-VITA 41.3
SERIAL BUS
BACKPLANE
BLOWER
250 CFM
48VDC
EXIT AIR FLOW
ALL THREE SIDES
COUPLER
TO RFI
DISCONNECT
ACTUATOR
RFI SIGNAL
HIGH SPEED
300 POS
CONNECTOR
VXI
C-SIZE
CARD
SIGNAL
SWITCHING
CIRCUITRY
14"
IEEE-P1505
RECEIVER
FIXTURE
INTERFACE
AIR
FLOW
INTEGRATED
VXI INSTRUMENT
AND FLATPACK
DIRECT COUPLED
INTERCONNECT
ADAPTED VXI
INSTRUMENT
WITH ADDED
FLATPACK
DIRECT COUPLED
INTERCONNECT
EXIT AIR FLOW
ALL THREE SIDES
VXI
C-SIZE
CARD
SIGNAL
SWITCHING
CIRCUITRY
14"
AIR
FLOW
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
24"
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
9!
MIPSS Building Block 10 Slot Spec
Interlocking Stackable Configuration
High Speed Signal Connector
•  Front View for Stackable
Implementation of Four (4)
Ruggedized Cases (Each Supports a
10 slot VXI Chassis; and Twelve (12)
slot RFI Receiver); 4 Building Blocks
supports 36 instrument slots and 48
RFI slots); Exceeds CTI Requirements
But Segmented To Application
•  Shown with RFI Interfacing using the
High Speed Signal Connector (at 300
positions x48 = 14,400 contacts, that
under differential mode could be
applied with stripline flex print up to a
3GHz bandwidth relative to pin
density with a 30,000 cycle-life
durability.
RFI Drive
Operator
Controls/
Indicators
Power
Segment
RF
Segment
14 slot RFI
Framework
•  Cases are designed to be interlocked
to precision accuracy to assure
Fixture alignment across all four RFI
frameworks.
Fixture 21 w x 24 h four 14 slot receiver interface
Fixture 21 w x 9 h two horiz 14 slot receiver interface
Digital
Segment
Gen Instr
Segment
Fixture 9 w x 9 h single 14 slot receiver interface
Fixture 24 h x 9 w two vert 14 slot receiver interface
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
10!
MIPSS Expanded 14 Slot Building Block
Specification For 19 Rack Configuration
• 
Front View for implementing six (6)
expanded 14 slot MIPS chassis with four
(4) 12 slot RFI systems (based upon 10 slot
building block requirements/ application in
a 19 rackmount configuration.
• 
Four (4) segmented RFI 14 slot receivers
align dimensionally to four (4) interlocking
building block configuration - allows
fixtures to interoperate on either 10 or 14
slot configuration.
• 
Upward capable with 10 slot building block
instrument requirements with augmentation
capability to expand each building block
with four (4) additional instrument slots, or
optional virtual power module slot.
• 
Case design and precision alignment
specifications assure Fixture engagement
across all four RFI frameworks.
Power
Segment
Digital
Segment
RF
Segment
Gen Instr
Segment
Fixture 21 w x 24 h four 14 slot receiver interface
Fixture 21 w x 9 h two horiz 14 slot receiver interface
Fixture 9 w x 9 h single 14 slot receiver interface
Fixture 26 h x 9 w two vert 14 slot receiver interface
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
11!
SS-V6/NGATS Projects With Common
MIPSS Transparent Support for DoD Legacy Test Interface Options
g Block/Instrument
Element Solution
ATS
DOD Legacy
*2&* 500$+!*560$/$"-,7&2/
!(*(156-4$/-0106$.$DOD
1 !*$
CTI
CASS
6 *(!/ 1(-, (,16$*(
!(*(156$#2"$#--1./(,1
Test Interface
Test Interface
")-2,1
0*-1$/0(-,
/
$,"'1-.0*-1
$/0-, *15
# .1$/
,#$/0(-,
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
2(*#(,&*-")
-,7&2/ 1(-,0
MJS!
4/14/11!
12!
MIPSS Applies COTS Spiral Development
To Insert Technology and Prevent Obsolescence
Evolution of IEEE-1155 VXI Standard to VITA-41.3 High Speed Serial Bus Protects Installed Base Against
Obsolescence and Allows Spiral Development Per DOD Instr 5000.2 Evolution Acquisition
VITA 41.3 leads the way with proven
combined parallel/ serial bus
implementation for IEEE-1155
revised backplane upgrade
Typical System
Power Source
Typical UUT
Power Source
IEEE-1155 Revised VXI based
MIPSS Virtual Common Power
Electronic Module (CPEM)
combines packaging and
technology innovation to meet
both needs in one module
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
13!
MIPSS Building Block Spec
Advanced VXI-VITA 41.4 Backplane
C.
VXI Rev 4.0 Backplane Spec with:
- Parallel and Serial Bus (VITA 41.3) Control
- 110-240VAC/24-48VDC Autoranging Input Power
- System/UUT Power VXI Module Hot Swappable Plug-in;
- Optional Liquid Cooling (VITA-34) Support
Features:
- Any AC/DC input power source access
- Parallel and Serial Bus Support
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
14!
Home
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VXI Controller Supporting 4.0
PCI Express VXIbus Slot-0 InterfaceParallel and Serial Bus Technology
ProDAQ 3030
Product
Select P
Select M
Features & Benefits
Direct connection from PC to VXIbus mainframe
Single-slot, C-size VXIbus Slot-0 to PCI Express x4 interface
Arbitrary power-on/off order of host PC and chassis
Bustec P
Optional fiber optic cable for distances up to 300 m
ProDAQ
First slot-0 controller to support the new VXI-1 Rev. 4.0
standard
ADC F
Supports 2eSST protocol with up to 320 MB/s throughput
DAC F
Optimized for low, first-word latency
DIO Fu
Multi-chassis, daisy-chained operation and triggering
interfaces for PCI and PCI Express-based computer
Counte
Miscel
VXIplug&play compliant
ProDAQ
Windows support
VXIbu
Contro
VXIbu
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Overview
Hardware Interfaces Working Group- (HI_WG)
Mothe
Modul
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
ProDAQ
MJS!
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The ProDAQ 3030 PCI Express VXIbus slot-0 interface is a C-size, register-based VXIbus module providing a direct
connection from a PC to a VXIbus mainframe using the high-speed PCI Express serial bus. Together with any of
the available host cards, the ProDAQ 3030 enables users to use a laptop, desktop, or server computer as an
15!
LXI Fu
LXI Ca
Signal Co
VXS Switch Module
Features
! Interconnects any VXS backplane link
! 56 1x (14 4x) backplane data links, up to
3.2Gbps per link
! Up to 12 front panel fibre optic transceivers
! Supports hardware data multicast
!  Can run multiple protocols concurrently at
different speeds
!  Air or conduction cooled rugged versions
!  Repackaged to support VXI C-size plug-in
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
16!
MIPSS Modular Integration/Interconnect Packaging Standards
Provides Plug&Play Reconfiguration and User Independence
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
17!
MIPSS Interconnect Packaging Specification
for VXI Based Carrier/Funnel Extension Common Interface
9
Top View for Side-by-Side Implementation of
Two (2) Ruggedized Cases (Each Supports a
10 slot VXI Chassis); and Two (2) RFI
Receivers (Each Supports a Segmented 14
slot RFI Framework - total 24 slots); Represents 1/2 of the CTI Application (see
previous slide for other 1/2).
9
Pluggable C-Size Power Modules Support
Interchangeable Use for System or UUT
Requirements.
9
Test Interfaces of Choice are Plugged/
Unplugged to the Carrier Interconnect
Modules (C-Size Instrument/ Power Modules
and Direct Coupled Interconnects), That Is
Then Removed to Gain Access to Carrier
Removal/Repair Support.
RFI Drive with 10 slot Building Block in Horizontal Dual Configuration
Example
Using
IEEE 1505
RFI Drive
Interconnect
Plug &Play
Mechanism
VXI Instrument/RFI
Interconnect Carriier or VXI
Module Extension- Shown in
Vertical Application
VXI Carrier w/Common Test
Electronic Module (CTEM)
VXI Carrier w/Common Power
Electronic Module (CPEM)
Figure 15. MIPSS Carrier
Test Module (CTEM) / Power
Module (CPEM), and/or VXI
Module
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
18!
VXI Carrier With Serial Bus Control, Switching,
and Diversity of Mezzanine Card Options
Carrier with M-Modules
Carrier with PC-104
Carrier with PXI - A
PXI - A
Instrument
Module
PXI - A
Instrument
Module
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
19!
MIPSS VXI-Based CPEM Virtual Power Pluggable
Module Spec - Vicor Example
Two (2) ViPac Array
Subassemblies
Supports Eight 125
Watt Programmable
Outputs
Electronic Module
(CPEM)
I/O Power
Distribution
Power/Sense
Switching Supports
Multiple I/O to the
UUT
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
System Source Interconnect
Isolators/Switching
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
20!
MIPSS IEEE-1155 Revised Virtual Power Pluggable
Module Spec - Vicor Example
Backplane Instrument Power
Switching
Programmable Power
Module
Programmable Power
Module
Programmable Power
Module
Programmable Power
Module
Programmable Power
Module
Programmable Power
Module
Switching
UUT Power
Requirements
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
21!
Summary Integrator-User Benefits
• 
Primary Goals:
- Lower Costs - Open Standard COTS Elements - Plug&Play
- Organic Integration/Reconfiguration - Software Integration
- Test Interface Transparency - Vertical Test Integration
- Downsized Footprint
• 
MIPSS Supports Key Decision-Makers-Requirements.
– 
DoD benefits for modularity, scalability, reconfigurability to meet broad application demands
– 
DoD gains from easy organic field set-up, reconfigurability, fault tolerance design, simple
maintenance, and VXI/LXI technology evolution
– 
VXI instrument suppliers can use current VXI products, or extend their products to high speed
bus/PXI control, and employ either in the same mainframe building block.
– 
– 
Digital and low analog suppliers gets high speed differential signal bandwidth capability
Integrator choices through plug&play designs, power flexibility, and direct cabled signaling
– 
Vertical integrated building block test strategy from benchtop to full system scalability allows
users to scale to the application needed and remain upward compatible.
– 
– 
Supports 1149 Testability Bus Standard integration for System and UUT testing.
Software standards based upon 1671 ATML for data collection, analysis, and CBM modeling
– 
Test Interface Independence Supporting Multiple Choice Interfaces
IEEE-SASB Coordinating Committees (SASB/SCC20)/
Test and Diagnosis for Electronic Systems
Hardware Interfaces Working Group- (HI_WG)
MIPSS
IEEE P1693 Modular Interconnect for
Scalable Systems Working Group
MJS!
4/14/11!
22!
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