Manufacturing and Design Engineering Inc.
Failure Analysis Capabilities
April 2011
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Failure Analysis Laboratory
MDE-i Failure Analysis Lab.
Objectives:
Assist quality assurance identify the different failure mechanisms at
component/system level.
Develop root cause failure analysis of component/system problems
in order to pursue corrective actions that have positive impact on
customer products.
FA Lab Benefits
• Reduce costly production stoppages.
• Verify a failure exists and determine the root cause.
• Assess the quality of manufacture of the components.
• Determine whether misuse or manufacturing process were involved.
• Resolve conflicting insurance/legal claim.
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Failure Analysis Laboratory
FA Lab Equipment Capabilities
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Stereo Microscope (3)
Metallurgical Microscope (2)
Digital Cameras (3)
Curve tracer (1)
LCR Meter (2)
Coplanarity Measurement Fixture
Non-contact metrology systems (VIEW Voyager 18x18)
Fume Hood
Hot plate for Manual Chemical Decapsulation
Ultrasonic cleaner
Cross sectional analysis (Grinder / Polisher & Precision saw)
Solderability Tester
Universal Electronic Tester designed for testing compressive/tensile strengths
X-Ray System
Network Analyzer
RF Communications Test Set
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Failure Analysis Laboratory
Failure Analysis Process Flow
NonNon-Destructive Analysis
Destructive Tests / Analysis Report
(Complete within 2 days—working days)
OCCURRENCE
/ DETECTION
OF FAILURE
VERIFICATION THRU
DOCUMENTS &
RECORDS
(Complete Within 4 days—working days)
CROSSCROSSSECTION
X-Ray
EXTERNAL VISUAL
CHECK
by OM
OPTICAL MICROSCOPE
INSPECTION
FAULT
VERIFICATION –
INTERNAL DIE
EXAMINATION / ANALYSIS OF CAUSE &
FAILURE MECHANISM
Notes: X-Section/ X-Ray Inspection/
Solder Joint Strength/ Dye & Pry
only are applied on Selected PCBAs/
Components
FINAL REPORT WITH RECOMMENDED
CORRECTIVE ACTION
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Failure Analysis Laboratory
External Visual Inspection
Optical microscopy is often used as the first step in doing failure analysis or materials characterization. At MDE-I FA Lab
our optical microscopes can provide up to 1000X magnification and darkfield/brightfield imaging, which can document
part markings and any external damage that might be present.
Molding
Compound
Deformation
Crack
Exposed
Copper
Crack
Broken
solder joint
Mold-Cap
Delamination
Cap with incomplete End
Termination Plating.
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Failure Analysis Laboratory
Electrical Characterization (Curve Tracer)
Electrical Analysis or Curve Tracing is the process to identify which pins exhibit current/voltage (I/V) anomalies of an
electrical path (an IC) using a Tektronix 576. The objective of curve tracing is to look for open or shorted pins and pins
with abnormal I/V characteristics (excessive leakage, abnormal breakdown voltages, etc).
Curve tracing is very useful in failure verifications and in the early stages of failure analysis. It can identify electrical
failures that exhibit abnormal voltage-current relationships at the output pins. A curve tracer is usually used with two
probes, one for each of the nodes that define the electrical path being characterized.
Reference Part
(Good)
Suspicious bad
Component
(Resistive)
V-I plots of reported failing pin and a
reference
part.
Resistive
behavior
observed during Curve Tracer analysis.
Curve traces which could be associated
with electrical anomalies on the devices.
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Failure Analysis Laboratory
X-Ray Inspection
X-Ray Radiography is a nondestructive semiconductor failure analysis technique used to examine the interior details of
the package. X-Ray is commonly used to inspect for wiresweeping and other wirebond problems, die attach voids,
package voids and cracks. It is excellent for determining leadframe outlines as well.
Popcorning
Lifted bond
wire
Short
Voids
Open
Traces
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Failure Analysis Laboratory
Chemical De-capsulation
By using nitric acid and/or sulfuric acid, the encapsulation of a plastic package can be removed to reveal the internal
structure of a package. The decapsulated devices can then be subjected to optical, SEM and other investigations.
Decapsulation is one of the indispensable tool for quality control and failure analysis of plastic packaged devices.
Manual Chemical Etching
Manual chemical etching consists of manually dispensing some acid on the surface of a package to remove the plastic
material covering the die. Red fuming nitric acid (HNO3) or sulfuric acid (H2SO4) is often used for this purpose. A
cavity is first milled on the top surface of the package. Red fuming nitric acid heated to about 85-140 deg C or sulfuric
acid heated to 140 deg C is then repeatedly dropped into the cavity to remove the plastic material covering the die.
When the die has been exposed adequately, the unit is rinsed with acetone then with D/I water, before being blow-dried
carefully.
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Failure Analysis Laboratory
Internal Visual Inspection
The device will be de-capsulated in order to see the internal wafer and chip set. This procedure allows to inspect the
part internally. In most cases we would be able to see the device health and also manufactures logo or part number on
the wafer that proves device's originality.
Electrical Overstress (EOS)
Fused bond wire
Internal Die
Electrical Overstress (EOS)
This could be caused by ESD.
Intermittent
Oscillator
with
cracked
crystal
Fused bond wire
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Failure Analysis Laboratory
K18R Liquid Crystal Hot Spot Detection
Liquid crystal hot spot detection locates heat sources associated with the electrical failure of a device.
Hot spot detection is non-destructive and applicable whenever abnormal leakage or power is associated with a failure.
The goal is to precisely identify the location of abnormal heat. The defect causing failure is often at or near the source of
heat. Liquid crystal hot spot analysis can easily detect a point source of 1 mW. Under optimum conditions 10 µW can
be located.
Hot spot
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Failure Analysis Laboratory
Mechanical Cross Sectioning
Cross-sectioning or microsectioning is a failure analysis technique for mechanically exposing a plane of interest in a PCB,
IC or other device for further analysis or inspection. It usually consists of sawing, grinding, polishing and staining the
specimen o sample until the plane of interest is ready for optical inspection or electron microscopy.
Cross-section analysis can be the best FA method to detect issues such as internal cracks, open via hole, internal
short, solder joint fractures, voids on the solder balls, thru hole barrel without solder and delamination.
Crack
Large
Unacceptable
Void
Solder Joint fractures
PTH pad lifting
worsens, > 50% pad length
PTH
100% fill
open via
hole
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Failure Analysis Laboratory
Red Dye Penetration Testing
Red Dye Penetration Test is a guide to highlight possible locations of broken solder joints in all types of BGA’s. Any
open or partially open connection is characterized by space between the two ends of the broken interconnect. The test
utilizes the capillary action of the liquid red dye to find out all the small crevices and gaps underneath the package.
Then after the red dye has dried and is not longer fluid the package can be removed, and where the red dye is visible, it
can be deduced that there was an open connection in that space.
Open Connection
Partially Connection
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Failure Analysis Laboratory
Counterfeit Component Detection
Our services include : Visual Inspection, Lead Coplanarity, Physical dimension, X-Ray Inspection, Curve trace
Testing, LCR Meter, Solderability Test, ‘Decapsulation’ ICs to verify chip authenticity.
Counterfeit Part
Original
Original
Counterfeit Part
Counterfeit Part
Original
Actel
Logo on die
Counterfeit Part
Original
Device lead
condition shows
parts were used
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Failure Analysis Laboratory
Lead Coplanarity Measurement Analysis
Lead Coplanarity is a measurement of the distance between the highest and lowest lead when the connector is sitting on
a perfectly flat surface. Coplanarity of leads is critical for good solder fillets. Ideally, all leads should lie in the same plane
because if even one lead is significantly higher or lower than the plane, it could lead to open solder joints.
Most specifications call for Coplanarity to be a maximum of 0.004 inch (0,10 mm) to .008 inch (0,20mm) deviation from
the seating plane.
•JEDEC STANDARD No. 22-B108A (Coplanarity Test for Surface-Mount Semiconductor Devices) 5.1 Seating
plane method.
Lifted Lead
0.031496 in
Seating Plane
Seating Plane
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Failure Analysis Laboratory
Lead Pull Test
Lead Pull Test for SOIC Components: The purpose of this test is to measure adhesion lead strength determining
compliance with the specified adhesion lead strength requirements. This test must be applied to external lead or
terminal.
Pull test is a tool for which could help to analyze soldering issues of failure could be caused by weak joints of the leads
with the PCB pads which could be caused by poor solder amount or improper oven profile, using the pull test new
solder pastes can be evaluated also qualification of new products and components could be possible.
This test method can be used only when the loop height of the lead is large enough to allow a suitable hook for pulling
to be placed under the pin.
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Failure Analysis Laboratory
Non-contact metrology systems (VIEW Voyager 18x18)
Model V18x18 High Performance
Non-Contact Metrology System
• Fast, accurate, & reproducible.
• Fully automatic operation.
• Windows® operating system – easy to
program and use.
• Supports a wide range of advanced
lighting,
optics, & laser technologies.
• Powerful VIEW Metrology Software
options.
• Industry-leading gage R&R performance.
VIEW Voyager
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Failure Analysis Laboratory
Contact Information
For more information, or for a quote on specific test requirements, contact:
Eleazar Estrada
USA Ph. 520-980-6888
Nextel DC: 52*1022642*4
MX Ph. 044-631-150-7265
Fax: 520-223-8227
eestrada@mde-i.com
sales@mde-i.com
Address:
Manufacturing & Design Engineering Inc.
1200 W Mariposa Rd PMB 119
Nogales, AZ 85621
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Failure Analysis Laboratory