Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
Heli-Array Series --- 13W
Heli-Array, a chip-on-board based solidstate lighting device, provides high
luminous flux output with high efficiency for
the illumination applications. Heli-Array has
characteristics
of
excellent
thermal
management capacity, long operating life,
optimized CRI and cost.
Features
Application













Compact high flux density light source
Energy Star / ANSI compliant bin
Low voltage DC operation
Instant light
Long operating life
Superior thermal performance
RoHS compliant and Pb free
Down light
Spot light
Par light
General lighting
Architectural lighting
Stage lighting
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
Product Nomenclature
■
HA MA - 04 03 C
X1 X2
V
X3 X4 X5 X6
X1
Item
X2
Classification
X3
Chips In One Series
X4
Number Of Parallel
Code
Type
Code
Type
Code
Type
Code
Type
HA
Heli-Array
MA
MCPCB series
04
4 Chips
03
3 Parallel
X5
X6
Current
Color
Code
Type
Code
Type
C
1050mA
W
Cool White
S
Neutral White
V
Warm White
Product Selection Guide
Color
Part Number
CRI
Lumen Performance
Cool White
(ANSI 5700K)
HAMA-0403CW
70
1350lm @ 1050mA
HAMA-0403CS
80
950lm @ 1050mA
HAMA-0403CV
80
950lm @ 1050mA
Neutral White
(ANSI 4100K)
Warm White
(ANSI 3000K)
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Package Dimensions
Note:
1.
2.
3.
4.
5.
6.
Mounting holes are for M2.5 or #4 screws.
Solder pads are labeled “+” and “-“ to denote positive and negative, respectively.
Drawings are not to scale.
All dimensions are all in millimeter.
All dimensions without tolerance are for reference only.
Specifications are subject to change without notice
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Absolute Maximum Ratings
HAMA-0403CW
HAMA-0403CS
Parameter
HAMA-0403CV
Peak Forward Current
(1/10 Duty Cycle at 1KHz)
2100mA
Continuous Forward Current(1)
1050mA
LED Junction Temperature
< 120℃
Operation Temperature
-40℃ ~+105℃
Storage Temperature
-40℃ ~+105℃
Note:
1.
Strongly recommend the case temperature shall not exceed 70℃
 Luminous Flux Characteristics
Luminous Flux Characteristics at Test Current, Junction Temperature at 25℃
Color
Part Number
Cool White
Luminous Flux(1) (lm)
Remark
Min
Type
Max
HAMA-0403CW
--
1350
--
(1050mA)
Neutral White
HAMA-0403CS
--
950
--
(1050mA)
Warm White
HAMA-0403CV
--
950
--
(1050mA)
Note:
1.
Minimum luminous flux performance guaranteed within published operating
conditions. HELIO maintains a tolerance of ±10% on luminous flux measurements.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Optical Characteristics
Optical Characteristics at Test Current, Junction Temperature at 25℃
Color
Color Temperature(1)
Color Rendering
Index
Typical View
Angle (Degrees)
Min
Type
Max
CRI
2Θ1/2(2)
Cool White
4745
5700
7040
70
120
Neutral White
3710
4100
4750
80
120
Warm White
2580
3000
3710
80
120
Note:
1. The tester tolerance of CCT is ±5%.
2. Θ1/2 is the off axis angle from emitter centerline where the radiometric intensity is 1/2 of
the peak value.
 Electrical Characteristics
Electrical Characteristics at Test Current, Junction Temperature at 25℃
Part Number
HAMA-0403CW
HAMA-0403CS
HAMA-0403CV
Forward Voltage
VF(1) (V)
Typical
Temperature
Coefficient of
Forward Voltage
(mV/℃)
Typical Thermal
Resistance
Junction to Case
(℃/W)
Min
Type
Max
ΔVF /ΔT(2)
RθJ-C
10.0
--
14.0
-4 ~ -12
<1
Note:
1. HELIO maintains a tolerance of ±0.1V on forward voltage measurements.
2. The temperature coefficients of forward voltage are measured between T j=30℃ and
Tj=120℃.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Wavelength Characteristics
White、Neutral White and Warm White Color Spectrum, Junction Temperature at 25℃
1.0
Cool White
Relative Intensity (%)
Natural White
0.8
Warm White
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
800
Wavelenght (nm)
 Typical Forward Current Characteristics
Junction Temperature at 25℃
Forward Voltage (V)
16
15
14
13
12
11
10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Current (A)
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Typical Light Output Characteristics over Forward Current
Junction Temperature at 25℃
Normalized Lumious Flux (%)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Current (A)
 Typical Radiation Patterns
Typical Representative Spatial Radiation Pattern
100
Relative Intensity (%)
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular Displacement (Degree)
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Product Binning
Heli-Array series are labeled with four alphanumeric codes. The formats are explained
as follows:
AB CD EF
AB - designates luminous flux power bin.
CD – designates ANSI bin.
EF - designates forward voltage bin.
Photometric Luminous Flux binning information (AB)
Bin Code
J0
K0
L0
M0
Min.
800
900
1000
1200
Max.
900
1000
1200
1400
Unit
lm
Correlated color temperature binning information (CD)
Bin Code
H2
H5
H7
Min.
5310
3710
2870
Max.
6020
4260
3220
Unit
K
Forward voltage binning information (EF)
Bin Code
C0
D0
E0
Min.
10
12
14
Max.
12
14
16
Unit
V
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
ANSI Bin Structure (Code: CD)
Warm White
0.44
2580
2870
3220
0.42
Neutral White
0.4
4260
4745
0.38
White
0.36
H3
6020
H2
0.34
7040
H1
H7
H6
2700K
3000K
3500K
H5
H4
5310
H8
3710
4000K
4500K
5000K
5700K
6500K
0.32
0.3
0.29
0.31
0.33
0.35
0.37
0.39
0.41
0.43
0.45
0.47
0.49
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Mechanical Assembly and Handling
Recommended assembly is illustrated below.
This product should be secured firmly by fastening an M2.5 screw on both sides. Please be
careful not to apply any stress to the resin area. HELIO recommends the use of hard
non-electrically conductive flat washer with spring washers. A thin layer of thermal grease
should be applied to the surfaces of the Heli-Array and heat sink. All air gaps and voids
between the heat sink and array should be eliminated. This product would be bent during
the clamping operation if heat grease in sheet form is used. Thus, it is recommended that
grease in past form is used.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Reliability Test List
Test Item
Room Temperature
Operating Life (RTOL)
Wet High
Temperature
Operating Life
(WHTOL)
High Temperature
Storage Life (HTSL)
Low Temperature
Storage Life (LTSL)
Wet High
Temperature Storage
Life (WHTSL)
Non-Operating
Temperature Cycle
Life (TMCL)
Standard
Test Method
JEITA
ED-4701
100 301
JEITA
ED-4701
100 201
JEITA
ED-4701
100 202
JEITA
ED-4701
100 103
JEITA
ED-4701
100 105
Test Description
Case temperature≦ 55℃,
IF = max DC(1), 1000hr
85℃ / 85%RH, IF = max
DC(1), 500hr
Failure
Criteria
Failure
criteria(2)(3)
Failure
criteria(2) (3)
Result
0
failures
0
failures
100℃, non-operating,
1000hr
Failure
criteria(2) (3)
0
failures
-40℃, non-operating,
1000hr
Failure
criteria(2) (3)
0
failures
85℃ / 85%RH,
non-operating, 1000hr
Failure
criteria(2) (3)
0
failures
-40℃ to 100℃, 30 min
dwell, 5 min transfer,
non-operating, 100 cycles
Failure
criteria(2) (3)
0
failures
Note.
1. Depending on the maximum derating curve.
2. Failure Criteria:
 Forward voltage shift > 10%

3.
Forward or reverse leakage above maximum values specified in product data
sheet.
 Luminous flux or radiometric power degradation > 30%
 White color point shift, Δx, Δy > ±0.01
Catastrophic failures causing the emitter to become non-functional
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Tube Package Specifications
 TUBE DIMENSIONS
UNIT：mm
W1
27.7
W2
27.7
H1
6.7
H2
L
2.25 480.0
±0.2
±0.2
±0.2
±0.2
±1.0
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
12
Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Packaging
Note:
1.
There are 20pcs COB in a tube.
2.
There are 20 tubes in an inner carton.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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Doc.No：DS-18-10-04
HELIO Optoelectronics Corp.
 Label
 Label for Tube & Tray
HAMA-XXXXXX
HVMA-XXXXX
XXXXXX
30
20
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
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