Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
Helixeon - Biochemistry Series
Helixeon, a solid-state lighting device, provides
high luminous flux output with high efficiency.
Helixeon is encapsulated in silicone by
molding technology. Also, Helixeon is capable
of standard lead free solder reflow process.
Features
Application









High luminous flux output
Long life operation
Instant response
RoHS certification
Superior ESD protection
Horticulture plant growing
Dental light for cruing
Decoration lighting
Architectural lighting
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
1
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.

Product Nomenclature
HB HP - E 3 L B
X1
X1
Item
Code
HB
X2
X3
X4
X5
X6
X2
Classification
Type
Code
Biochemistry HP
X5
Lens
Code Type
L
Lambertian
Type
High Power
X6
Color
Code
B
Type
Royal Blue – 440nm
R
Hyper Red – 660nm
X3
Module
Code
E
Type
Emitter
X4
Power
Code
3
Type
3W
Circuit Diagram of Helixeon Emitter
Color
Part number
Royal Blue
HBHP-E3LB
Hyper Red
HBHP-E3LR
Circuit diagram
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
2
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.

Package Dimensions
SMT Lead Form
Lambertian
Note:
1.
2.
The anode side of the device is denoted by a hole in the lead frame.
Electrical insulation between the case and the board is required. The slug of the device is
no electrically neutral.
3.
4.
5.
6.
Drawings are not to scale.
All dimensions are all in millimeter.
All dimensions without tolerance are for reference only.
Specifications are subject to change without notice.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
3
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Characteristics for Helixeon emitter
HBHP-E3LB
Characteristics at If = 700mA (Ta=25℃):
Parameter
Radiometric power
Peak wavelength
(1)
(3)
View angle
Forward Voltage
(4)
Power dissipation
Symbol
Value
Unit
Min
Typical
Max
Po
515
630
--
mW
p
430
440
450
nm
2Θ1/2
--
150
--
degree
VF
3.0
--
4.0
V
PD
2.1
--
2.8
W
HBHP-E3LR
Characteristics at IF = 700mA (Ta=25℃):
Parameter
Radiometric power
Peak wavelength
(3)
View angle
Forward Voltage
(1)
(4)
Power dissipation
Symbol
Value
Unit
Min
Typical
Max
Po
355
390
--
mW
p
650
660
670
nm
2Θ1/2
--
150
--
degree
VF
2.0
--
3.0
V
PD
1.4
--
2.1
W
Note:
1.
The typical radiometric power of Helixeon will be upgraded per season.
2.
Minimum radiometric power performance guaranteed within published operating
conditions. HELIO maintains a tolerance of ±10% on radiometric power measurements.
HELIO maintains a tolerance of ±0.5nm for peak wavelength measurement.
HELIO maintains a tolerance of±0.06V on forward voltage measurement.
3.
4.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
4
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Absolute Maximum Ratings
3W
Parameter
Peak Forward Current
(1/10 Duty Cycle at 1KHz)
1000mA
Continuous Forward Current
700mA
LED Junction Temperature
120℃
Operation Temperature
-40℃ ~+105℃
Storage Temperature
-40℃ ~+120℃
ESD Sensitivity(1)
Reverse Voltage (V)
> 8,000V Human Body Model (HBM)
Class 2 JESD22-A114-B
not designed for reverse operation
Note:
1. It is included the zener chip to protect the product from ESD.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
5
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Product Binning
Helixeon emitters are labeled using 6-digit alphanumeric bin code. The formats are explained as follows:
AB CD EF
Where:
AB - designates radiometric power bin.
CD - designates peak wavelength bin.
EF - designates forward voltage bin.
Radiometric power binning information (AB)
Hyper Red
Royal Blue
Bin Code
N0
Min.
275
Max.
355
P0
355
435
Q0
Q0
435
435
515
515
R0
515
635
S0
635
755
T0
755
875
Bin Code
A0
Min.
640
Max.
650
B0
650
660
C0
A0
660
670
430
435
B0
435
440
C0
440
445
D0
445
450
Unit
mW
Peak wavelength binning information (CD)
Hyper Red
Royal Blue
Unit
nm
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
6
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
Forward voltage binning information (EF)
Bin Code
D0
E0
F0
G0
H0
I0
J0
K0
L0
M0
Min.
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
Max.
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
Unit
V
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
7
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Optical & Electrical characteristics
Wavelength Characteristics
Forward Voltage vs Forward Current
4.0
Royal Blue
Hyper Red
Hyper Red
Royal Blue
80
3.5
Forward Voltage (V)
Relative Spectral Power Distribution (%)
100
60
40
20
3.0
2.5
2.0
0
400
450
500
550
600
650
0
700
Wavelength (nm)
Forward Current (mA)
Typical Light Output Characteristics
over Forward Current
800
140
700
120
Relative Luminous Flux (%)
Forward Current (mA)
Operating Current & Ambient
Temperature
600
500
400
Rj-a= 15 ℃/W
Rj-a= 20 ℃/W
Rj-a= 25 ℃/W
Rj-a= 30 ℃/W
300
200
100
0
0
20
40
60
80
100 200 300 400 500 600 700 800 900 1000
100
Ambient Temperature (℃)
120
Hyper Red
Royal Blue
100
80
60
40
20
0
0
100 200 300 400 500 600 700 800 900 1000
Forward Current (mA)
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
8
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Typical Polar Radiation Pattern
90
150
Relative Intensity(%)
100%
120
60
80%
60%
30
40%
20%
180
0
Royal Blue
90
150
Relative Intensity(%)
100%
120
60
80%
60%
30
40%
20%
180
0
Hyper Red
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
9
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Storage


Do not open the moisture proof bag before the devices are ready to use.
Before the package is opened, LEDs should be stored at temperatures less than 30℃ and

humidity less than 50%.
After the package is opened, LEDs should be stored at temperatures less than 30℃ and


humidity less than 30%.
LEDs should be used within 168 hours (7 days) after the package is opened.
Before using LEDs, baking treatment should be implemented based on the following
conditions: pre-curing at 60±5℃ for 24 hours.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
10
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Handling Precaution
The softness and dust affinity of silicone molding lens constrain the handling of LED. Thus, some
handling indications of HELIXEON emitters are presented for possible damage prevention and
excellent reliability.

Avoid leaving fingerprints or scratches (by sharp tools) on the silicone resin parts.



Do not force over 2000g impact or pressure on the silicone molding lens.
The LEDs should only be picked up by making contact with the sides of the LED body.
In case of pick-and-place nozzle for surface mount assembly, avoid directly contacting the
lens with nozzle. The pickup tool was recommended and shown as below.
Units:mm
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
11
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Solder Reflow Process Parameters
Reflow soldering of Helixeon emitters requires effective control of heating and cooling. Both
the rate of heating and cooling and the absolute temperatures reached are critical in assuring
the formation of a reliable solder joint while avoiding damage to the emitter during the reflow
process. The following reflow soldering profiles are provided for reference. It is recommended
that users follow the recommended soldering profile provided by the manufacturer of the
solder paste used.
tP
Temperature
TP
TL
ts
Preheat Area
25oC
Time
Profile Feature
Lead Free Assembly
Ramp-Up Rate
2-3 ºC/s
Preheat Temperature
Preheat Time (ts)
Liquid Temperature (TL)
Time maintained above TL
150-200 ºC
60-120 s
217 ºC
30-60 s
Peak Temperature (Tp)
235±5 ºC
Peak Time (tp)
Max 20 s
Ramp-Down Rate
Max 6 ºC/s
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
12
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Reliability Test List
Test Item
Standard
Test Method
Test Conditions
JEITA ED-4701
Ta=260℃, 10sec.
300 301
(Pre treatment 25℃,70%,168hrs.)
Solderability
JEITA ED-4701
Tsld=215±5℃, 3sec.
1 time over
(reflow soldering)
300 303
(Lead Solder)
95%
Resistance to
soldering heat
Note
Number of
Damaged
2 times
0/10
(reflow soldering)
0/10
Steady state
Ta=25℃, IF = 700mA
operating life
Tested with Helio standard circuit board
Steady state
60℃, RH=90%, IF = 700mA
operating life of
Tested with Helio standard circuit
high humidity heat
board
1000 hrs.
0/10
1000 hrs.
0/10
100 cycles
0/10
20 cycles
0/10
Ta=100℃
1000 hrs.
0/10
Ta=-40℃
1000 hrs.
0/10
2000 Hz, 2directions
60min.
0/10
JEITA ED-4701
-40℃ ~ 25℃ ~ 100℃ ~ 25℃
100 105
30min. 5min.
JEITA ED-4701
0℃ ~ 100℃
300 307
15sec. 15sec.
Temperature cycle
30min. 5min.
Thermal shock
High temperature
JEITA ED-4701
storage
200 201
Low temperature
JEITA ED-4701
storage
200 202
Vibration
Failure Criteria：

Forward Voltage shift ：> 200 mV

Radiometric power degradation ：> 30 %

Forward or Reverse Leakage：>10μ A
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
13
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Tube Package Specifications

TUBE DIMENSIONS
UNIT：mm
W1
16.5
W2
9.7
H1
7.9
H2
3.3
L
420.0
±0.2
±0.2
±0.2
±0.2
±1.0
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
14
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Packaging
INNER BOX: DIMENSIONS (mm)
L
460
W
110
H
60
Note:
1.
There are 50pcs emitters in a tube.
2.
There are 20 tubes in an inner carton.
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
15
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.

Tape-and-Reel Package Specifications

CARRIER TAPE DIMENSIONS (2 PINS)
UNIT：mm
W
24.0
P
12.0
E
1.75
F
11.5
P2
2.0
D
1.5
D1
1.5
P0
4.0
A0
8.2
B0
15.6
K0
5.85
T
0.5
±0.3
±0.1
±0.1
±0.1
±0.1
+0.1
-0.0
±0.1
±0.1
±0.1
±0.1
±0.1
±0.05
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
16
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 REEL DIMENSIONS
UNIT：mm
M
ψ380.0
N
ψ100.0
W
24.6
W1
30.6
H
ψ13.5
K
10.45
S
2.5
±1.0
±1.0
±0.5
±0.5
±0.5
±0.5
±0.5

Leader/Trailer and Orientation(2 PINS)
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
17
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.
 Packaging
INNER BOX: DIMENSIONS (mm)
L
410
W
390
H
65
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
18
Doc. No.: DS-21-10-05
HELIO Optoelectronics Corp.

Label

Label for Tape-and-Reel
XXXX-XXXX
Reel-XXXX-XXXX
1000
(1)
XXXXX XXXX
XXXX-XX-XX
Note：
1. HELIO internal code.

Label for Tube & Tray
XXXX-XXXX
XXXXXX
The information contained herein is the exclusive property of HELIO and shall not be distributed reproduced, or
disclosed in whole or in part without prior written permission of HELIO.
19