SIGC16T120CS
FEATURES:
•
1200V NPT technology
•
180µm chip
• short circuit prove
• positive temperature coefficient
• easy paralleling
CE
Cn
SIGC16T120CS
MECHANICAL PARAMETER:
Raster size
Area total / active
Emitter pad size
Gate pad size
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metalization
Collector metalization
This chip is used for:
•
SGP07N120
Applications:
• drives, SMPS, resonant applications
2
G
C
E
mm
2
4.04 x 4
16.16 / 10.4
1.88x2.18
0.71x1.08
180
150
0
898 pcs
Photoimide
3200 nm Al Si 1%
1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding
µm mm deg
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment electrically conductive glue or solder
Al,
≤
500µm
∅
0.65mm ; max 1.2mm store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies AI PS DD HV3, L 7131-S, Edition 2, 03.09.2003

SIGC16T120CS
MAXIMUM RATINGS:
Parameter Symbol Value Unit
Collector-emitter voltage, T j=25
°
C
DC collector current, limited by T jmax
V
CE
I
C
1200
1 )
V
A
Pulsed collector current, t p
limited by T jmax
Gate emitter voltage
I c p u l s
V
G E
24
±
20
A
V
Operating junction and storage temperature T j
, T s t g
-55 ... +150
1 )
depending on thermal properties of assembly
STATIC CHARACTERISTICS (tested on chip), T j=25
°
C, unless otherwise specified:
Value
Parameter Symbol Conditions min. typ. max.
°C
Unit
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
V
(BR)CES
V
CE(sat)
V
GE
=0V , I
C
=500µA 1200
V
GE
=15V, I
C
=8A 2.5 3.1 3.6 V
Gate-emitter threshold voltage
Zero gate voltage collector current
V
GE(th)
I
CES
I
C
=350µA , V
GE
=V
CE
3.0
V
CE
=1200V , V
GE
=0V
4.0 5.0
1 µA
Gate-emitter leakage current I
GES
DYNAMIC CHARACTERISTICS (tested at component):
V
CE
=0V , V
GE
=20V 120 nA
Parameter Symbol Conditions
Input capacitance
Output capacitance
Reverse transfer capacitance
C i s s
C o s s
C r s s
V
C E
= 2 5 V ,
V
G E
= 0 V , f =1MHz
SWITCHING CHARACTERISTICS (tested at component) , Inductive Load:
Value min. typ. max.
-
-
-
720
90
50
870
110
60
Unit pF
Parameter Symbol Conditions*
Value min. typ. max.
Unit
Turn-on delay time
Rise time
Turn-off delay time t t t r d ( o n ) d ( o f f )
T j
= 2 5
°
C
V
C C
= 8 0 0 V ,
I
C
=8A
V
G E
= + 1 5 / 0 V ,
R
G
= 4 7
Ω
-
-
-
27
29
440
35
38
570 ns
Fall time t f
- 21 27
* switching conditions different to LowLoss, Standard, IGBT3; under comparable switching conditions 40%
faster than Standard. V alues also influenced by parasitic L- and C- in measurement and package.
Edited by INFINEON Technologies AI PS DD HV3, L 7131-S, Edition 2, 03.09.2003

CHIP DRAWING:
SIGC16T120CS
Edited by INFINEON Technologies AI PS DD HV3, L 7131-S, Edition 2, 03.09.2003

SIGC16T120CS
FURTHER ELECTRICAL CHARACTERISTICS:
SGP07N120
Description:
AQL 0,65 for visual inspection according to failure catalog
Electrostatic Discharge Sensitive Device according to MIL-STD 883
Test-Normen Villach/Prüffeld
Published by
Infineon Technologies AG ,
Bereich Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.
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We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
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Edited by INFINEON Technologies AI PS DD HV3, L 7131-S, Edition 2, 03.09.2003