product
www.electronicspecifier.com
June 2013 / Volume 4, Issue 6
In This Issue
Compact low-side
gate drive IC in SOT23-5C package
Cables & Connecting
Board-to-board compression connectors
provide 5,000-cycle durability
Power
Versatile switched mode AC-DC PSUs
Actives
Industry’s fastest 4-channel, 14-bit ADC at
250 MSPS
Sensing
Thermal sensor arrays & low voltage
digital pressure sensors
Win Microchip PICDEM 4 Demo Board
EFM32 Wonder
Gecko MCU
Power generators
harvest waste heat
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product
contents
4
6
10
12
14
18
22
26
30
COMMENTARY
INDUSTRY NEWS
DISTRIBUTION
OPTIMISING LTE
NETWORKS WITH MIMO
WIRELESS
PRODUCTION
CABLES & CONNECTING
POWER
SENSING
22
40
29
34
32
36
40
42
44
ACTIVES
PASSIVES
TEST & MEASUREMENT
DESIGN
COMMS, COMPUTING &
CONTROL
46 ALTERNATIVE ENERGY
48 AUTOMOTIVE
50 OPTOELECTRONICS
product
COMMENTARY
We look set to keep
taking the tablets!
Recently published numbers indicate we are falling out of love with the PC and moving towards a tablet-based
computing experience. While we at Electronic Specifier are quite content to accept the forecast from International Data
Corporation (IDC) that tablet shipments will exceed those of portable PCs this year, we are not yet convinced it’s time to
say goodbye to the computer proper.
It seems the PC market is expected to see negative growth for the second consecutive year while tablet shipments are
expected to grow 58.7% year over year this year reaching 229.3 million units, up from 144.5 million units last year – and
IDC expects tablet shipments to outpace the entire PC market (portables and desktops combined) by 2015.
Certainly, Microsoft was sure that touchscreen devices will soon rule the computing World when it launched Windows 8
which is really good for the finger, but quite awful for the mouse or touch pad. Our understanding now is that Microsoft
is planning to make some changes to the new operating system to
make it a better experience for the luddites among us.
Now there are enough of us here at ES Towers to constitute a
pretty good consumer sample and our findings make slightly
more encouraging reading for the PC although maybe not in the
immediate short term.
Most of us have acquired a tablet – mainly Apple and Samsung –
because we enjoy all the benefits a tablet brings wherever we are.
They take seconds to start, are very fast for net surfing, quick to connect to WiFi and good for films and tunes.
At the same time, though, we have hung on to our desktops and laptops for work because tablets are not capable
meeting our every professional need. And we do not see this changing any time soon.
It seems to us that there is no longer the need to change our PCs at the same frequency as in the past because we can
cope with the speed issues etc at our office or home desk since the many daily tasks we need a computer for demand a
proper keyboard and a reasonable screen and not necessarily lightning fast internet access. But, at some point, we will
replace our PCs since everything has what many describe as built-in obsolescence.
Having said all this, last month Apple made some potential game-changing announcements at the D11: All Things Digital
conference in California. CEO Tim Cook stated that wearable computers could well be next “branch of the Apple tree”.
So far we have “seen” Google glasses and clever wrist devices and wonder which other parts of the body will suit the
future generation of computing devices.
4. June 2013
Any ideas anyone?
www.electronicspecifier.com
Bring 66 DMIPS performance to your 32-bit MCU design
Low-cost, small-package 32-bit PIC32 microcontrollers
Microchip’s smallest and lowest-cost PIC32 microcontrollers now let
you add audio playback, capacitive touch buttons or sliders, and USB
On-the-Go (OTG). All with 66 DMIPS performance at just 40 MHz in
packages as small as 5 mm x 5 mm.
The new PIC32MX1 and MX2 MCUs integrate up to 128KB Flash and
32KB of RAM ; two I2STM audio CODEC interfaces; mTouch™ capacitive
touch-sensing; an 8-bit Parallel Master Port (PMP) for graphics or external
memory; an on-board 1 Msps ADC, as well as USB On-the-Go (OTG) and
other serial communication peripherals. They are available in 28- to
44-pin packages as small as 5 mm x 5 mm (36-pin VTLA) and can operate
in a -40°C to 105°C temperature range.
These new devices also help you to save space and simplify lay-out
with the flexibility of digital pin remapping (PPS), while maintaining
compatibility with the 16-bit PIC24 family giving you an easy migration to
the 66 DMIPS processing power of the PIC32 MIPS 32-bit architecture.
FASTSTART
DEVELOPMENT TOOLS
■
MPLAB® Starter Kit for
PIC32MX1XX/2XX (DM320013)
■ PIC32MX CTMU Evaluation
Board (AC323027)
■ PIC32MX220F032D Plug-In
Module (MA320011) for
Explorer 16
■ Microstick II development
platform for 16-bit and 32-bit
MCUs & DSCs (DM330013-2)
Start adding audio and capacitive touch capabilities to your
cost-sensitive designs today at: www.microchip.com/get/eurmx1mx2
The Microchip name and logo, MPLAB, and PIC are registered trademarks of Microchip Technology Incorporated in the U.S.A., and other countries. mTouch is a trademark of Microchip Technology Inc. in the U.S.A., and other countries.
All other trademarks mentioned herein are the property of their respective companies. © 2012, Microchip Technology Incorporated. All Rights Reserved. DS61173B. ME1013Eng04.12
product
NEWS
Oxford Instruments X-Ray
Technology Helps NASA Find Life On
Mars
Scientists are in the process of confirming that
there was once life on Mars - with the help
of an Oxford Instruments X-Ray Technology
product. Using a drill on its robotic arm, NASA’s
Curiosity rover recently collected a second rock
sample for analysis by its onboard Chemistry
and Mineralogy instrument (CheMin).
Researchers expect to confirm preliminary
findings from the first drilling in February,
which indicate that the red planet was once
favourable to microbial life. Using X-rays from
a specially designed Oxford Instruments X-ray
tube inside the CheMin, rocks and soil are
studied to provide clues about the planet’s
historical climate and geology. The Curiosity
prepares samples by drilling into rocks,
collecting the resulting fine powder, sieving
it, and then delivering it to a sample holder.
An X-ray beam as fine as a human hair is then
directed through the powdered material to an
X-ray sensor that establishes the mineralogy
of the sample by X-ray diffraction. Mineral
composition reveals environmental conditions
that existed during its formation, in particular,
what role water, an essential ingredient for life,
played in the mineral’s development.
PMC Moves to Establish Category Leadership with Flash
Controller Acquisition
PMC has entered into a definitive agreement to acquire Integrated
Device Technology’s Enterprise Flash Controller Business and certain
PCI Express Switch assets for $100 million, subject to certain purchase
price adjustments. IDT’s Enterprise Flash Controller Business accelerates
PMC’s entrance into the rapidly growing enterprise solid-state drive
market with leading-edge PCIe flash controllers
LG Electronics Becomes Lead Partner For ARM
Cortex-A50 Family Of Products And Next-Generation
Mali GPUs
ARM announced that LG Electronics has licensed the next generation
of ARM Cortex-A50 series of central processing unit solutions and the
next generation of ARM Mali graphics processing units. This agreement
means that LG Electronics will have access to ARM’s highest-performing
CPU and GPU solutions to create market-leading technology. This builds
on an already strong relationship between LG Electronics and ARM,
as LG Electronics has previously used both Cortex processors and Mali
GPUs in its system-on-chip technology.
John Heugle To Step Down as ams CEO With Immediate
Effect
ams announces that the Supervisory Board and CEO John Heugle have
agreed that John Heugle will step down from the position of CEO of
the company with immediate effect. Kirk Laney, currently heading the
Optical Sensors and Lighting business unit and former CEO of TAOS Inc.,
was elected to the management board and will assume the position of
interim CEO with immediate effect.
IR Commences Commercial Shipments Of Gallium Nitride On
Silicon Devices
International Rectifier have today announced that it has qualified and shipped
products built on its revolutionary Gallium Nitride-based power device
technology platform for a home theatre system manufactured by a leading
consumer electronics company. The pioneering GaN-based power device
technology platform is the result of ten years of research and development by
IR based on the company’s proprietary GaN-on-silicon epitaxial technology.
“Commencing commercial shipments based on our leading-edge GaNbased technology platform and IP portfolio extends IR’s leadership in power
semiconductor devices and heralds a new era for power conversion, in line with
our core mission to help our customers save energy,” stated IR’s President and
Chief Executive Officer, Oleg Khaykin.
6. June 2013
www.electronicspecifier.com
product
NEWS
Survey reveals burning automation industry issues
European Automation has released the results of a pan-European
survey on the state of the international automation industry. The key
maintenance issues for manufacturers it reveals are quality of automation
spares and the responsiveness of the component supplier. The biggest
threat to manufacturing productivity is unscheduled downtime due to
equipment failure. When production is interrupted, minutes of downtime
can cost thousands of pounds, so getting the right component in under a
day is considered crucial. The 162 survey respondents were made up of
European Automation customers across 30 countries in Europe, America
and the Middle East
IEEE Celebrates Ethernet’s 40th
Anniversary
IEEE celebrates Ethernet’s 40th anniversary. IEEE 802.3
“Standard for Ethernet” and the varied technologies,
applications and networks that the family of standards
helps enable have changed the world as we knew it, and
multi-dimensional innovation never stops. Frontiers of
IEEE 802.3 Ethernet innovation include ever-increasing
speeds and new applications for the technology. For
example, in April 2013, IEEE announced the launch of
an IEEE 802.3 study group to explore development of a
400 Gb/s Ethernet standard to efficiently support everincreasing, exponential network bandwidth growth.
Fast-growing IEEE 802.3 Ethernet application areas include
energy efficiency, the globally emerging smart grid, data
centers and supercomputing, access networks, mobilecommunications infrastructure, healthcare and medicaldevice communications, entertainment and networking
for automotive and other industries.
Harwin announces sponsorship of GB Row
2013: six teams attempt to break world record
rowing unaided and non-stop around Britain
Harwin has announced it is sponsoring GB Row 2013,
acknowledged to be the toughest rowing event in the world.
Teams will set off to row 2013 miles around Britain’s coastline
with the aim of challenging the official world record for
rowing non-stop and unaided around the UK in a number
of different categories. This year, nine teams signed up and
six will go through to try and set new world records for the
Mixed Pair, the Men’s Pair, the Men’s Four; the Ladies Four,
the Mixed Four, Men’s Eight, and Mixed Six. There will also
be a three man team making the first-ever attempt on the
course in an ocean-going pedalo. The race starts on Saturday
1 June when the boats pass under Tower Bridge in London
at around eight a.m. to commence their bid for world record
glory. They will be led by the Royal Row Barge Gloriana built
for the Queen’s Diamond Jubilee, which will escort them for
the first few miles.
www.electronicspecifier.com
June 2013 7.
product
NEWS
Industrial revolution or just a renovation? 3D printing looks set to pack a punch by 2025
3D printing has come
of age, surpassing
$1B in revenues
during 2012 and with
growth expected
to continue across
all target markets
to 2025. Across
the board printer
manufacturers are
reporting a surge
in sales, some
cannot meet demand, as awareness of the technologies
and what they offer grows. Highest growth will be seen
Molex Online RF Cable Assembly
Configurator Goes Live
Molex launch an online RF Assembly Builder
for distributors, customers and prospective
customers. Available now, the free configurator
tool simplifies the design process and allows the
user to build a complete assembly and instantly
submit an RFQ, without downloading any
application or software. The RF Assembly Builder
features step-by-step prompts for designing
Molex RF cable assemblies.
in the medical and
dental fields, as well
as the jewellery,
designer products, and
architectural areas,
although this will not
be monotonic as 3D
printing locks into the
capital investment
cycles of the aerospace
and automotive
industries, as discussed
in the new report from IDTechEx, 3D Printing 2013-2025:
Technologies, Markets, Players. Growth.
Audi Group and Analog Devices to Collaborate on
Automotive Innovations
Analog Devices has been selected by Audi to collaborate strategically
within its PSCP. PSCP increases engagement between Audi and
selected semiconductor suppliers to enhance the value they bring to
the functionality and reliability of future cars. ADI will provide Audi
with pioneering technologies to support their goal of manufacturing
the most innovative and appealing vehicles on the market. ADI’s
technologies enable optimised system partitioning, from sensing to
signal conditioning, via digitisation and signal processing in Powertrain,
Safety, and Infotainment Systems.
Silicon Labs to acquire Energy Micro
Silicon Labs announced that it has signed a definitive agreement to acquire Energy Micro AS. Based in Oslo, Norway, the
late-stage privately held company offers the industry’s most power-efficient
portfolio of 32-bit microcontrollers and is developing multi-protocol wireless
RF solutions based on the industry-leading ARM Cortex-M architecture. Energy
Micro’s energy-friendly MCU and radio solutions are designed to enable
a broad range of power-sensitive applications for the Internet of Things,
smart energy, home automation, security and portable electronics markets.
This strategic acquisition accelerates Silicon Labs’ growth opportunities and
positions the company as the foremost innovator in energy-friendly embedded
solutions. The growth of the IoT market, coupled with continued deployment
of smart grid and smart energy infrastructure, is driving strong demand for
energy-efficient processing and wireless connectivity technology to enable
connected devices in which low-power capabilities are increasingly important.
8. June 2013
www.electronicspecifier.com
product
NEWS
MOSIS Collaborates With imec, Tyndall And ePIXfab
To Offer Advanced Silicon Photonics Technology
MOSIS teams up with ePIXfab, the European Silicon Photonics support
center providing low-cost prototyping services for photonic ICs. The
partnership gives MOSIS’ customers access to imec’s state-of-the-art
fully integrated silicon photonics processes and Tyndall’s advanced
silicon photonics packaging technology. Imec’s silicon photonics
platform enables cost-effective R&D of silicon photonic ICs for highperformance optical transceivers (25Gb/s and beyond) for telecom,
datacom, and optical sensing for life science applications.
CST Interview Series Spotlight On University Research
Computer Simulation Technology announce a series of interviews highlighting the groundbreaking research carried out
by previous winners of the CST University Publication Award. 2013 marks the 10th anniversary of the CST University
Publication Award, and to celebrate, CST has invited past winners, along with some of their university co-operation
partners, to discuss their work with us. University researchers are among the most innovative users of CST’s products, and
every year the company grants the Award to academics to acknowledge the importance of their work. The series began
with an interview with Xiaodong Chen, Professor of Microwave Engineering at Queen Mary, University of London, who
explained how his research group used CST MICROWAVE STUDIO to design an innovative antenna for an experimental
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5/16/13 10:28 AM
June 2013
9.
distiblog
mick.elliott@electronicspecifier.com
Daily posts on the world of electronic parts distribution in Europe, the Middle East
& Africa (EMEA) by electronics industry veteran Mick Elliott.
Glenn Smith Celebrates 40 Years at Mouser: “We
aren’t finished yet”
Glenn Smith, President and Chief Executive Officer at Mouser
Electronics Mouser Electronics is celebrating his 40th anniversary
with the company. The road to this milestone started in 1973
when Glenn Smith was a college kid who went to work part-time
in the warehouse of what was little more than a mom and pop
electronics catalogue start-up in San Diego. Smith was one of just
12 employees. With strategic vision, Smith has built the company
into a global corporation that today – four decades later – has
1,200 employees, 400,000 customers, more than $600 million
annual revenue, and 19 offices on three continents. ONCE Smith
started at Mouser, his foresight and leadership qualities were soon
recognised. From the warehouse, he moved on to management
positions at every department, including technical sales,
marketing, purchasing, operations and IT.
Solid State Supplies Signs High-End FPGA
Specialist
Top-end FPGA supplier Achronix has been signed
for UK and Ireland distribution by Solid State
Supplies. “The addition of Achronix to our supplier
portfolio is significant news for customers in the
UK communications
market,” said John
Macmichael, Managing
Director, Solid State
Supplies. “Their
innovation in core fabric
and embedded hard
IP, coupled with Intel’s
leading-edge 22nm
process technology, has
delivered groundbreaking high-end FPGA solutions
EBV Elektronik Revamps Website; Adds Features to that will halve the power and cost compared to
rival FPGAs.” Achronix is now shipping its high-end
Aid Design Engineers
Speedster22i HD FPGAs that are built on Intel’s
EBV Elektronik has redesigned its website and added new tools to
advanced 22nm, 3-D Tri-Gate transistor technology.
aid designers. It has created The Virtual Intelligence an area where
Speedster22i HD FPGAs consume half the power and
users will find information based on their previous searches,
are half the cost of competitive high-end FPGAs for
know-how of EBV experts, other customer recommendations and
targeted high bandwidth applications. Speedster22i
associated products. The site also features Premium User whereby
devices are the only FPGAs to include fully integrated
customers can create their own ebv.com based on the products
hard IP protocol functions, including the entire
and markets they register for, and a Product Finder that provides
I/O protocol stack for 10/40/100 Gigabit Ethernet,
the entire database of EBV products from all suppliers covering all
Interlaken, PCI Express Gen 1/2/3, and memory
product areas and market segments.
controllers for 2.133 Gbps DDR3.
L2Tek Adds Ultra HDTV Connector Range
Repping outfit L2Tek is offering connectors that meet
the high 6GHz video-transmission speeds required for
the latest Ultra HDTV (Ultra High-Definition Television)
standard. The new Ultra HD broadcast TV standard,
which is also known as ‘4K’ and offers a picture that is
four times sharper than traditional full high-definition
TV, is being promoted by leading broadcasters and global
consumer manufacturers. Although primarily targeting
broadcast applications, the connectors are also suitable
for implementation in machine-vision applications that
require high-speed video data transmission such as in
industrial robotics systems, for example.
distributor.electronicspecifier.com
We’re now
stocking
over 22,000
TE Connectivity
products.
FIND IT.
DESIGN IT.
BUY IT.
Search TE Connectivity’s extensive range by application at
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product
FOCUS
Optimising LTE Networks with MIMO and DAS
By John Spindler, VP of product management, TE Connectivity
With the high rate of growth in wireless usage, wireless operators are constantly
looking for ways to deliver the required capacity while using spectrum more efficiently in their networks. Multiple input/multiple output (MIMO) technology is gathering momentum among mobile wireless service providers with the launch of LTE
networks.
MIMO significantly improves network throughput, capacity
and coverage, making it possible to do more with the
same amount of spectrum. At the same time, distributed
antenna systems (DAS) are emerging as a way to deliver
capacity and coverage in places where the macro network
doesn’t reach, such as inside buildings. Together, MIMO
and DAS can provide a compelling solution to the LTE
network capacity challenge.
are used to create orthogonal communication channels
analogous to the orthogonal spreading codes in CDMAbased systems. In addition to being required for the higher
orders of modulation, such as 16-QAM and 64-QAM, a
high signal-to-noise ratio is also required to properly model
the wireless channels that allow the MIMO systems to
algorithmically separate the multiple paths, which overlap
one another in frequency and time.
What is MIMO?
MIMO Modes
MIMO stands for multi-input (multiple transmitters)
and multi-output (multiple receivers). SISO (single
input/single output) is the more conventional mode of
communications, where one antenna transmits and one
antenna receives.
There are two major MIMO operating modes – spatial
diversity, in which the same data is transmitted over each
of the multiple paths, and spatial multiplexing, in which
each of the paths carries different data. In 2x2 MIMO with
spatial diversity, for example (Matrix A in Figure 1), each of
the two antennas is essentially transmitting and receiving
the same data although the data is coded differently.
This mode is primarily used to improve signal quality, or
to increase the coverage area. In 2x2 MIMO with spatial
multiplexing (Matrix B in Figure 2), two different streams
With advances in signal processing and silicon, MIMO
is now possible in many small devices such as mobile
handsets and data cards. While the first LTE networks
use 2x2 MIMO (where there are two transmit antennas
and two receive antennas), future LTE systems will use
4x4 MIMO and even higher dimensions of antenna
configurations. It is projected that LTE Advanced systems
will have the ability to use up to 8x8 MIMO configurations.
In order for MIMO to work, a rich scattering environment
– with many different paths between transmitter and
receiver – is needed as well as a high signal-to-noise ratio.
This MIMO processing exploits this multi-path environment
to increase the capacity or the coverage of the network.
The key is that each path must be independent and look
different to the receiver. The differences in the multipath
12. June 2013
www.electronicspecifier.com
product
FOCUS
of data are transmitted over each of the two channels,
which theoretically doubles the system’s data throughput.
With spatial multiplexing, the system throughput can be
increased linearly with the number of transmit antennas
without using any additional spectrum resources.
Commercial MIMO systems switch dynamically between
SISO, MIMO diversity, and MIMO multiplexing modes,
depending on a variety of factors including the channel
environment and signal quality. For example, if the signal
quality is very high, the system uses spatial multiplexing,
and if the signal quality is low, the system automatically
switches to spatial diversity mode or even to SISO mode.
An in-building DAS is an excellent platform for MIMO
because it provides very good signal-to-noise ratio,
and in-building environments provide a rich scattering
environment in which to separate the MIMO signals.
Mobile operators are now deploying DAS with MIMO in
many venues such as stadiums, arenas, and transit stations.
All DAS Are Not Equal
Different types of DAS dictate different approaches to
deploying MIMO, each of which has cost implications.
In a passive or hybrid system that relies on heavy coaxial
cabling to distribute radio signals from the head end to the
antennas, there is no way to support multiple antennas
with a single cable run. Instead, operators would have
to deploy an additional cable system with an additional
antenna to support 2x2 MIMO. This means that the cost
to deploy MIMO with a passive DAS is roughly double the
cost to deploy SISO DAS, given that cable installation is the
major cost factor.
In an active system on the other hand, both MIMO signals
can be distributed on a single cable because the system
digitises the signals and separates them for transport. In
addition, the signal strength is the same at every antenna
because each antenna is amplified. In active DAS, it is only
necessary to deploy a second antenna at each antenna
location in order to support MIMO. Thanks to the ability to
use two antennas with a single run of cabling, active DAS
enables much more cost-effective deployment of MIMO
technology.
Devices like the iPad and iPhone are driving higher and
higher mobile video usage, and thus higher mobile
network throughput requirements, and 4G protocols like
LTE promise subscribers multiple megabits of throughput.
MIMO is the best new technology mobile operators can
use to address the throughput issue without spending
the money to acquire new spectrum or deploy new base
stations. As LTE rollouts continue around the world, MIMO
transmission modes are becoming a standard method of
delivering services over DAS.
About the author
John Spindler
VP, Product
Management, Wirless
Business Unit
John Spindler was named Vice President of Product
Management for TE’s wireless business. Spindler is
responsible for developing and managing an innovative
wireless product portfolio for the company’s Wireless
Business Unit.
During his more than 20 years of industry experience,
Spindler has held a variety of product management
positions with companies such as Nortel Networks, GTE
and InteCom. In these positions, he had responsibility for
the areas of networking, network management, computer
telephony integration and wireless technologies.
www.electronicspecifier.com
June 2013 13.
product
WIRELESS
Pasternack Unveils New RF Coaxial Test Cable Line
Pasternack Enterprises has today announced the addition of
a new line of SMA and N-Type Test Cables, ideal for testing
applications requiring low insertion loss and operating
frequencies up to 26.5 GHz. Pasternack Enterprises’ new
RF test cables are specifically designed for environments
requiring highly durable test cables, but where expensive
ultra-stable cables are not required. New coaxial test cables
from Pasternack are available in both in-series and betweenseries configurations.
Contactless Payment Terminals Using The ams
AS3911 Reader Chip Gain EMV Certification
Infineon presents high-performance LNA for
Global Navigation Satellite Systems
ams announced at CARTES America that a new range of
payment terminals from NBS Payment Solutions containing
its AS3911 reader IC have gained EMV certification. The
510 and 710 series of NOIRE terminals from NBSPS are now
approved for the receipt of payments from contactless cards
bearing the MasterCard PayPass or Visa payWave symbols.
The AS3911 RFID reader IC in the NBSPS terminals provides
the RF and analog front end, reading any contactless payment
card meeting EMV requirements. A reference design similar
to a state-of-the-art contactless payment system, developed
by ams, provides a ready-to-use blueprint for manufacturers
wishing to produce a new EMV-certified terminal. The AS3911
RFID reader IC is in volume production now. It is priced at
$3.50 for 1,000 pieces.
Infineon Technologies has introduced BGA825L6S, a
highly cost-effective Low Noise Amplifier for Global
Navigation Satellite Systems. It features an ultra-low
noise figure, high linearity, high gain and low current
consumption over a wide range of supply voltages from
3.6V down to 1.5V. All these features make BGA825L6S
an excellent choice for GNSS LNA as it improves
sensitivity, provides greater immunity against out-ofband jammer signals, and reduces filtering requirements,
which lowers the overall cost of the GNSS receiver.
BGA825L6S is based on Infineon’s B7HF SiGe technology
which enables a cost-effective and ultra-small solution
in a TSLP-6-3 package. BGA825L6S is already in mass
production.
IDT Introduces Industry’s First Low-power Quad 16-bit DAC with JESD204B for Multi-carrier
Broadband Wireless Applications
IDT announce the industry’s first low-power quad 16-bit
digital-to-analog converter featuring the JESD204B highspeed serial interface. IDT’s new quad DAC enables wide
bandwidth support and eases board routing requirements
in multi-carrier broadband wireless applications. The
DAC165xQ is a quad 16-bit 1.5 Gsps DAC with 750 Msps
input data rate, enabling wide bandwidth support for use
across various base station transceiver platforms. The
integrated 10 Gbps JESD204B interface improves system
performance and greatly simplifies routing and PCB stackup by replacing 32 matched differential lane pairs with up
to eight high-speed differential lanes.
14. June 2013
www.electronicspecifier.com
product
WIRELESS
NXP Announce Gen8+ LDMOS RF Power Transistors For TD-LTE Applications
NXP Semiconductors unveil its new Gen8+ LDMOS RF power
transistors – an expansion of its eighth-generation LDMOS product
line for wireless base stations with a strong focus on TD-LTE. As China
prepares to roll out the world’s largest 4G network, Gen8+ enhances
NXP’s TD-LTE portfolio – the most comprehensive LDMOS portfolio
for TD-LTE available today – and delivers significant improvements in
performance, flexibility and cost-efficiency. The first Gen8+ device to
be introduced, the BLC8G27LS-160AV, is the world’s smallest and most
cost-effective solution for 15 W and 20 W power amplifiers for active
antenna outdoor base stations (2.6 GHz).
Aeroflex Launches 5th Generation Modular
Wireless Test System
Advanced GaAs pHEMT-Based UltraBroadband Driver MMIC Amplifier
Aeroflex announced today that it has launched a new generation
of wide bandwidth RF signal generators and analyzers in
PXI format with class-leading performance enabling a high
performance, flexible, and cost effective solution for RF
component and wireless device testing to the latest standards,
including WLAN 802.11ac. The PXI 3050A low noise RF signal
generator and the PXI 3320 arbitrary waveform generator are
used together to provide a fully configurable RF signal generator
with wide bandwidth vector modulation, low phase noise, and
fast frequency and level settling.
MicroWave Technology announce that it offers an
advanced AlGaAs/InGaAs pHEMT-based MMIC
ultra-broadband driver amplifier product up to 50
GHz. The product is targeted at applications including
fiber optics communications, microwave/mm-wave
communications systems, microwave/mm-wave
testing equipment, and military applications. The
MMA-005022 is an ultra-broadband Traveling Wave
Amplifier MMIC with medium output power and high
gain over a full range of nearly DC 30 KHz to 50 GHz.
It offers a typical +22 dBm saturated power and +20
dBm output power at a 1dB gain compression point at
30 GHz. The MMIC chip typically has 16 dB gain across
the band with +/- 1dB gain flatness. The typical input/
out return loss for the chip is 15 dB.
Toshiba wireless ESP 190x66 Eng.qxd:Layout 1
16/5/13
16:31
Page 1
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June 2013 15.
product
WIRELESS
u-blox Unveils The World’s Smallest Multi-Band 4G LTE-Only Modules
u-blox has today announced the introduction of the TOBY-L1
series, a new line of ultra-compact LTE modules. TOBY-L100
and European variant TOBY-L110 are ideally suited for tablets,
mobile routers and set top boxes, as well as high-speed M2M
applications such as digital signage, mobile health, and security
systems. “The TOBY-L1 family again confirms u-blox as the
leader in wireless technology for mobile applications,” says
Thomas Seiler, u-blox CEO. “TOBY-L1 combines the benefits of
LTE with ultra-small size to solve the most pressing issues our
customers are facing: cost and size.
First 802.11ac WLAN Platform Running
Application-Aware Software
Analog Devices Unveils New Industry-Leading
Broadband RF Gain Blocks
Freescale Semiconductor has demonstrated the
first QorIQ P1020 reference platform for 802.11ac
that simultaneously delivers “gigabit Wi-Fi” while
running application identification software required
for security and core network offload in nextgeneration wireless local area network products. The
turnkey reference platform underscores Freescale’s
continued leadership in the wireless access space,
which Infonetics projects to grow at 12 percent CAGR
through 2017. QorIQ communications processors
from Freescale have been selected to power solutions
for eight of the top 10 manufacturers of enterprise
wireless access point equipment.
Analog Devices today introduced four new RF amplifier gain blocks
which ease the design of high dynamic range communications,
defence and instrumentation systems. Operating over a frequency
range of 30 MHz to 6 GHz, the ADL5544, ADL5545, ADL5610
and ADL5611 RF amplifiers offer the industry’s best combination
of linearity, gain and noise figure performance, enabling high
performance with low power consumption. The ADL5544,
ADL5545, ADL5610 and ADL5611 single-ended RF amplifiers
feature excellent OIP3 and P1dB noise figure specifications over
a wide frequency range and are internally matched to 50 Ω at the
input and output. In addition, they offer bill of materials savings as
the only external components required are coupling/decoupling
capacitors and a dc bias inductor.
Peregrine Semiconductor Unveil Four New Digitally Tunable Capacitors
Peregrine Semiconductor has today announced
four new DuNE Digitally Tunable Capacitors,
creating the industry’s broadest integrated RF
tuning IC portfolio. The PE64906, PE64907,
PE64908, and PE64909 DTCs feature a wide
capacitance range of 0.6 – 7.7 pF and support
power handling up to 34 dBm into 50 Ohms (30
Vpk RF). The monolithic DTCs include integrated
bias generation, RF filtering and bypassing, control
interface, and ESD protection of 2 kV HBM, all
incorporated into a 2 mm x 2 mm package.
16. June 2013
www.electronicspecifier.com
product
WIRELESS
Systech Launches adds a new member to the
SysLink family of M2M Modular Gateways
Systech launches the SL-2000 M2M Modular Gateway at
the ThingWorx booth at this weeks CTIA Wireless show.
SL2000-Front-AngleThe SL-2000 is a modular networking
platform that allows custom configuration that best meets
the needs of the target application. At its core the SL2000 is a fully functioning router with two Ethernet ports,
two USB (UF or UH), a PCIe slot for GSM, HSPA, HSPA+
CDMA, EVDO or LTE cellular networks or Wifi connectivity.
An option card slot
offers the ability to
communicate using
POTS, Serial, Bluetooth,
ZigBee, Z-Wave or GPIO.
The Trusted
Leader for Any
Measurement
Dialog Semiconductor introduces the world’s
lowest power Bluetooth Smart Chip
Dialog Semiconductor today launched SmartBond (part
number DA14580) – the world’s lowest power and smallest
Bluetooth Smart System-on-Chip which more than doubles
the battery life of an app-enabled smartphone accessory or
computer peripheral in comparison to competing solutions
on the market.
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for select customers with production scheduled for Q4
2013.
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23/05/2013
June 2013 17.
10:20
product
PRODUCTION
FCT Assembly Installs New Micrometers to Improve Stencil
Accuracy
FCT Assembly today announced that it has installed new Mitutoyo Deep Throat
Micrometers to accurately measure the step etch depth over the entire surface
of the stencil. This is another example of the improvements FCT Assembly is putting
in place since the purchase of Global Stencil. “As we develop new stencil technologies,
we must ensure the accuracy and quality of every product that goes out the door. This
new tool will allow us to inspect every step etch stencil at the micro level to provide
consistency,” commented Mike Scimeca, President & CEO, FCT Assembly. The new
set of micrometers measures 18 into the stencil area, giving FCT the ability to produce
more accurate and consistent step etch stencils. The micrometers will be mounted in a
granite support plate
Count On Tools Unveils Redesigned StripFeeder Modular
System
Essemtec to Increase Accuracy of
Traceability Data
Count On Tools introduces the next version of its award-winning
StripFeeder System for loading tape-and-reel components onto compact
modules for prototyping and high-mix low-volume applications. COT
A traceability solution should be able to
assign assembly data to products without
any doubt. Many systems, however, are
likely to fail if there is manual intervention.
Essemtec has now invented the integrated
PCB identification system that no longer can
be bypassed. Essemtec has now invented the
integrated identification system for Cobra
(fig. 1) and Paraquda placement machines
to avoid such problems. The new system
cannot be bypassed and, furthermore, saves
expensive production space. Essemtec’s
integrated traceability and identification
system can easily be installed in production.
It does not require additional work from
operators and saves floor space.
was awarded a 2013 NPI Award from Circuits Assembly magazine in
the category of Automation Tools for its StripFeeder Modular System.
Customers who have already purchased StripFeeder System can contact
COT about upgrading their systems to the latest version.
Saelig Introduces Affordable Ready-To-Run 3D Printer
Saelig has introduced the award-winning Afinia H479 Rapid-Prototyping 3D Printer - a
self-contained unit that provides an immediate availability 3D prototyping experience.
The H479 3D Printer comes fully assembled, with easy to install software for both the
PC and Mac, and can prototype a part up to 5 inches in each dimension, accurate to
within .2mm (.008). A heated build platform prevents model warping during printing.
The H479 3D Printer is ideal for engineers, educators, and individual experimenters.
Made in the USA, the FCC-approved and locally-supported H479 3D Printer is very
affordable at the low cost of $1499.
18. June 2013
www.electronicspecifier.com
Circuit Note
CN-0267
Engineered and Tested.
Ready to Integrate.
Devices Connected/Referenced
ADuCM360
Low Power, Precision Analog Microcontroller
For more information and/or support,
visit www.analog.com/CN0267
AD5421
16-Bit, Loop Powered, 4 mA to 20 mA DAC
AD5700
Low Power HART Modem
Complete 4 mA to 20 mA Loop Powered Field Instrument with HART Interface
EVALUATION AND DESIGN SUPPORT
Circuit Evaluation Board
CIRCUIT DESCRIPTION
CN0267 Circuit Evaluation Board (DEMO-AD5700D2Z)
The ADuCM360 analog front-end incorporates dual, high performance 24-bit
sigma-delta (∑-∆) analog-to-digital converters (ADCs). It also integrates
programmable gain instrumentation amplifiers, a precision band-gap
reference, programmable current sources, a flexible multiplexer, and many
other features. It allows a direct interface to multiple analog sensors, such as
pressure sensor bridges, resistive temperature sensors, thermocouples, and
many other types of sensors used in the industry.
Design and Integration Files
Schematics, Layout Files, Bill of Materials, Code Example (zip file)
CIRCUIT FUNCTION AND BENEFITS
The circuit shown in Figure 1 is a complete smart industrial, loop powered
field instrument with 4 mA to 20 mA analog output and a highway addressable
remote transducer (HART®) interface. HART is a digital 2-way communication
in which a 1 mA peak-to-peak frequency-shift-keyed (FSK) signal is modulated
on top of the standard 4 mA to 20 mA analog current signal. This allows
features such as remote calibration, fault interrogation, and transmission of
process variables, which are necessary in applications such as temperature and
pressure control.
This circuit has been compliance tested, verified, and registered by the HART
Communication Foundation (HCF). This successful registration provides circuit
designers with a high level of confidence using one or all of the components in
the circuit.
The circuit uses the ADuCM360, an ultralow power, precision analog
microcontroller, the AD5421, a 16-bit, 4 mA to 20 mA, loop powered digitalto-analog converter (DAC), and the AD5700, the industry’s lowest power and
smallest footprint HART-compliant IC modem.
Analog Front-End Interface
The circuit in Figure 1 shows an example connection for a primary bridge
type sensor and a secondary resistive temperature sensor; however
the ADuCM360 flexible front-end allows many other configurations to
accommodate any type of precision analog sensor application.
Primary Sensor Input
The ADuCM360 on-chip ADC0 measures the field instrument primary
sensor, shown as a bridge transducer in Figure 1. The sensor connects to
the analog input pins, AIN0 and AIN1, via an RC filter network for improved
system electromagnetic immunity. The common-mode filter bandwidth is
approximately 16 kHz, and the differential-mode bandwidth is 800 Hz.
The ADuCM360 VREF+ and VREF− voltage reference inputs sense the bridge
excitation voltage and enable the circuit to work in a ratiometric mode,
making the measurement independent of the exact value of the sensor power
supply voltage. The on-chip ground switch can dynamically disconnect the
bridge excitation and save power when required by the application.
Figure 1. 4 mA to 20 mA, Loop Powered Field Instrument with HART Interface (Simplified Schematic: All Connections and Decoupling Not Shown)
Circuits from the Lab™ circuits from Analog Devices have been designed and built by Analog Devices engineers. Standard engineering practices have been employed in the design and construction of each
circuit, and their function and performance have been tested and verified in a lab environment at room temperature. However, you are solely responsible for testing the circuit and determining its suitability
and applicability for your use and application. Accordingly, in no event shall Analog Devices be liable for direct, indirect, special, incidental, consequential or punitive damages due to any cause whatsoever
connected to the use of any Circuits from the Lab circuits. (Continued on last circuit note page)
www.analog.com
Circuit Note
CN-0267
Secondary Sensor Input
The circuit uses a platinum (Pt) 100 Ω resistive temperature device (RTD) as a
secondary sensor. The RTD can sense the temperature of the primary sensor
and thus allow for temperature compensation of the primary sensor
if required.
The ADuCM360 programmable current source supplies the RTD via the AIN4
pin. The ADC1 on the ADuCM360 measures the voltage across the RTD using
the AIN3 and AIN2 pins configured as a differential input. The exact value of
the current flowing through the RTD is sensed by a precision resistor (RREF)
and is measured by the ADC1 using the AIN7 pin. The ADC1 uses the on-chip,
band-gap voltage reference.
Digital Data Processing, Algorithm, and Communications
All the field instrument digital functions are provided by the ADuCM360
32-bit ARM Cortex™ M3 RISC processor, with integrated 128 k bytes of
nonvolatile flash/EE memory, 8 k bytes of SRAM, and an 11-channel direct
memory access (DMA) controller that supports wired (2× SPI, UART, I²C)
communication peripherals.
The demonstration software performs the initialization and configuration,
processes data from the analog inputs, controls the analog output, and
performs the HART communication.
Analog Output
The AD5421 integrates a low power precision 16-bit DAC with a 4 mA to
20 mA, loop powered output driver and provides all functions required for
the field instrument analog output.
The AD5421 interfaces with the ADuCM360 controller via the SPI interface.
The AD5421 also includes a range of diagnostic functions related to the
4 mA to 20 mA loop. The auxiliary ADC can measure the voltage across the
instruments loop terminals via the 20 MΩ/1 MΩ resistive divider connected
to the VLOOP pin. The ADC can also measure the chip temperature via the
integrated sensor. The ADuCM360 controller can configure and read all the
diagnostics of the AD5421, but the AD5421 can also operate autonomously.
As an example, if the communication between the controller and the AD5421
fails, the AD5421 automatically sets its analog output to a 3.2 mA alarm
current after a defined period. This alarm current indicates to the host that the
field instrument failed to operate.
The software controls any change of the output current from one value to
another to prevent disturbance of the HART communication. (See the Analog
Rate of Change section).
An external depletion-mode FET can be used with the AD5421 to increase the
loop voltage maximum. The circuit is protected against reversed polarity by a
pair of diodes in series with loop output.
The ferrite beads in series with the loop together with the 4700 pF capacitor
improve the system EMC performance. Do not use a higher capacitance across
the loop terminals because of the HART network specifications.
The 4.7 V, low leakage, Zener diode protects the AD5421 on-chip, 50 Ω
loop sense resistor in the event of an accidental external voltage between
the AD5421 COM pin and LOOP− pin (for example, when programming the
ADuCM360 or debugging the circuit).
Power Supplies and Power Management
The complete field instrument circuitry, including the sensor drive current, must
operate on the limited amount of power available from the 4 mA to 20 mA loop.
This is a common challenge in any loop powered field instrument design. The
circuit in Figure 1 provides an example of delivering both a low power and high
performance solution. All three integrated circuits used in the application are
designed for low power, and the circuit leverages their integrated features to
deliver a flexible power management structure and an optimum loop-powered
solution.
The AD5421 is powered by the 4 mA to 20 mA loop voltage and provides a
regulated low voltage for the rest of the circuit. The AD5421 REGOUT voltage is
pin programmable from 1.8 V to 12 V depending on circuit requirements. The
circuit in Figure 1 uses the 3.3 V supply voltage option as an example for the
input sensors used. However, the ADuCM360 and the AD5700 have a wider
power supply voltage range; therefore, a different power supply voltage can be
used to suit the application.
The REGOUT RC filter (10 μF/10 Ω/10 μF) helps to prevent any interference
coming from the loop affecting the sensor analog front-end. It also prevents
any interference generated by the circuit, specifically by the controller and the
digital circuitry, from coupling back to the loop, which is important for a reliable
HART communication.
The AD5700 HART modem is supplied through an additional RC filter
(470 Ω/1 μF). This filter is very important in the loop powered application
because it prevents current noise from the AD5700 from coupling to the 4 mA
to 20 mA loop output, which would otherwise affect the HART communication.
The 4 mA to 20 mA loop noise performance is specifically addressed by the
HART in-band, noise during silence test. The AD5700 modem uses the external
crystal with 8.2 pF capacitors to ground on the XTAL1 and XTAL2 pins, which is
the option using the least possible power.
The AD5700 integrates a complete HART FSK modem. The modem is
connected to the ADuCM360 controller via a standard UART interface,
complemented by request to send (RTS) and carrier detect (CD) signals.
The ADuCM360 has very flexible internal power management, with many
options for powering and clocking all the internal blocks and, when utilized
by the software, allows an optimal balance between the required function,
performance, and power for the specific instrument application. Refer to the
ADuCM360 product page and the AN-1111 Application Note.
The HART output is scaled to the required amplitude by the 0.068 μF/0.22 μF
capacitive divider and coupled to the AD5421 CIN pin, where it is combined
with the DAC output to drive and modulate the output current.
The analog front-end AVDD is supplied from another filter (10 μF/ferrite
bead/1.6 Ω/10 μF) to minimize power supply noise for better performance with
respect to low voltage sensor signals.
The HART input is coupled from LOOP+ via a simple passive RC filter to the
AD5700 ADC_IP pin. The RC filter works as the first stage, band-pass filter
for the HART demodulator and also improves the system electromagnetic
immunity, which is important for robust applications working in harsh industrial
environments.
The GND_SW ground switch pin of the ADuCM360 controls the excitation/
power supply for the primary sensor. The switch is off as a default at the
instrument power up. This default allows the system to be fully configured,
including appropriate power modes, before turning on the sensor, and thus
minimizes any possible power-up spikes on the 4 mA to 20 mA loop output.
The AD5700 low power oscillator generates the clock for the HART modem
with a 3.8664 MHz external crystal connected directly to the XTAL1 and
XTAL2 pins.
Similarly, the secondary sensor is supplied from the programmable current
source of the ADuCM360, and therefore, its power is fully controlled by the
software.
Output Protection
ADuCM360 Software
A transient voltage suppressor (TVS) protects the 4 mA to 20 mA HART
interface from overvoltage. Its voltage rating should prevent exceeding the
AD5421 absolute maximum voltage of 60 V on the REGIN pin. Note that the
TVS leakage current can affect the current output accuracy; therefore, pay
attention to the leakage current at a given loop voltage and temperature
range when selecting this component.
A basic code example that demonstrates the functionality and performance of
the circuit can be found in the CN-0267 Design Support Package.
HART Communication
The code example includes a basic HART slave command response to
demonstrate the hardware function and capability. However, the code example
does not include the protocol layers of the HART communication.
Circuit Note
CN-0267
COMMON VARIATIONS
The ADuCM360 has a high performance and very flexible analog front-end,
with 12 analog input pins and extra pins for voltage reference and ground
switch. It allows direct interface to multiple analog sensors of varying
types, such as any resistive bridge sensors, resistive temperature sensors,
or thermocouples. Therefore, do not limit the field instrument solution to
temperature-compensated pressure measurement only because it can be
used for almost any sensor field instrument.
The ADuCM361 can be used as an alternative to the ADuCM360 in
applications that need only one ∑-∆ ADC in the analog front-end. Aside from
the second ADC, the ADuCM361 contains all the features of the ADuCM360.
The ADuCM361 on-chip DAC with an external transistor can be used to
control the 4 mA to 20 mA loop, refer to CN-0300 for details.
The AD5421 can be connected via the protection directly to the loop.
Alternatively, a depletion mode N-channel MOSFET can be connected
between the AD5421 and the loop power supply, as shown in Figure 2. The
use of the additional MOSEFT in this configuration keeps the voltage drop
across the AD5421 at approximately 12 V, lowers the power dissipated in the
AD5421 package, and therefore improves the 4 mA to 20 mA analog output
accuracy. It also increases the maximum voltage allowed in the loop to the
level of the MOSFET rating. The additional MOSFET has no effect on the
HART communication.
Figure 3. DEMO-AD5700D2Z Printed Circuit Board (Pressure Sensor Not Included)
A connector on the edge of the DEMO-AD5700D2Z makes the ADuCM360
single wire and UART download/debug signals accessible allowing easy
software development, code download, and in-circuit debugging and
emulation. The connector, with a small header extender included with
the DEMO-AD5700D2Z board, is compatible with all Analog Devices, Inc.,
Cortex-M3 based development tools, such as the EVAL-ADuCM360QSPZ
evaluation kit (the evaluation kit is not included with the
DEMO-AD5700D2Z board).
These features are not shown in the simplified diagram in Figure 1; however,
they can be seen in the complete circuit schematic in the CN-0267 Design
Support Package. The design support package also includes a full field
instrument C-code example, which enables complete verification and
evaluation of all hardware blocks and features of the circuit, and a limited
verification of the HART interface functionality. For detailed information
about HART interface specifications and resources, contact the Hart
Communication Foundation.
HART Compliance
The DEMO-AD5700D2Z has been verified to be compliant with HART FSK
Physical Layer Specification (HCF_SPEC-054, Revision 8.1), using methods
and equipment specified in the HART Physical Layer Test Specification (HCF_
TEST-2, Revision 2.2). The board was submitted to the Hart Communication
Foundation and was successfully registered.
The registered circuit can be found on the HART Communication Foundation
(HFC) web site in the product catalog as DEMO-AD5700D2Z.
Figure 2. MOSEFT Connected to the AD5421 Loop Power Supply
The AD5700 is used with a 3.8664 MHz crystal in this circuit, which is the
configuration achieving the lowest power consumption. Alternatively, the
AD5700-1, with an integrated 0.5 % precision internal oscillator, can be used.
The internal oscillator increases the modem power supply current by 225 μA
maximum, compared to the crystal oscillator, but because no external crystal
is needed, this option provides both cost savings and reduced board area
requirements.
For the applications that are not loop powered, the AD5410, AD5420,
AD5422, or AD5755 are good choices for the 4 mA to 20 mA DAC.
The results of two of the tests involved the output noise during silence and
the analog rate of change.
Output Noise During Silence Test
When a HART device is not transmitting (silence), do not couple noise onto the
network. Excessive noise may interfere with reception of HART signals by the
device itself or other devices on the network.
The voltage noise measured across a 500 Ω load in the loop must contain no
more than 2.2 mV rms of combined broadband and correlated noise in the
HART extended frequency band. In addition, the noise should not exceed
138 mV rms outside the HART extended frequency band.
Circuit Hardware
This noise was measured by a true rms meter across the 500 Ω load. This
noise was measured directly for the out-of-band noise and measured through
the HCF_TOOL-31 filter for the in-band noise. An oscilloscope was also used
to examine the noise waveform.
The circuit shown in Figure 1 is built on the DEMO-AD5700D2Z printed
circuit board shown in Figure 3.
The noise was measured at the worse condition, which was 4 mA output
current.
The DEMO-AD5700D2Z circuit board includes some additional features
for easy system evaluation. The 0.1 inch-pitch connector footprints allow
optional primary and secondary sensor connections. There are test points for
HART RTS and CD that may be needed for HART compliance tests.
The circuit was also tested for Power Consumption, Primary Sensor Input
Performance, and Secondary Sensor Input performance. For test details,
results and to learn more about CN-267, visit www.analog.com/CN0267
CIRCUIT EVALUATION AND TEST
Circuits from the Lab circuits are intended only for use with Analog Devices products and are the intellectual property of Analog Devices or its licensors. While you may use the Circuits from the Lab circuits
in the design of your product, no other license is granted by implication or otherwise under any patents or other intellectual property by application or use of the Circuits from the Lab circuits. Information
furnished by Analog Devices is believed to be accurate and reliable. However, Circuits from the Lab circuits are supplied “as is” and without warranties of any kind, express, implied, or statutory including, but
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©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
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product
CABLES &
CONNECTION
New Binder M12 power connectors with S and T coding
The Binder range of M12 power connectors has been
extended with the addition
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that have M12-S and M12-T
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typically used for power
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where large M23 metal
connectors are usually used
while M12-T coding is used
for DC power supplies in
structured networks where large circular 7/8in, M23, RD24
or rectangular connectors
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new Binder connectors with
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the use of 1.5mm2 contacts
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connector housing offers larger
air and clearance distances.
HARTING releases new Han HMC industrial connector series
The new Han HMC industrial connector series combines the capability
for more than 10,000 mating cycles with protection against harsh
environmental conditions. The connector family is designed for use in
applications where equipment may be employed in different locations
and can often be connected and disconnected several times a day. The
Han B HMC housings are equipped with durable locking levers in order to
continue to provide the connector with IP 65 protection against dust and
water after more than 10,000 locking cycles. Han HMC connector inserts
contain high-performance grounding contacts, while the crimp contacts are
equipped with HMC gold surface and constant spring force.
AVX’s New Board-to-Board Compression
Connectors Provide 5,000-Cycle Durability
Aerodynamic And Ultra-Low Profile DDR3
DIMM Memory Module Sockets
AVX has extended its line of high-reliability board-toboard compression connectors for commercial, medical,
and harsh industrial applications with the addition of an
ultra-low-profile power connector. Featuring gold-plated
beryllium copper contacts that are insert-molded within
the insulator for location and mechanical stability, the new
9155-100 Series connectors are capable of supporting the
lowest compressed height (1.3mm) of any comparable
connector currently on the market. The series also provides
the most reliable and resilient performance available in a
similarly miniature package, which is evidenced by their
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Molex have launched a new portfolio of aerodynamic DDR3
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module sockets, both of which are ideal for demanding
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double that of the DDR2 interface.
22. June 2013
www.electronicspecifier.com
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Brad Nano-Change Connectors Conform To M8
Form Factor Standards
Han-Modular docking frame features
floating mount for “blind” connection
Molex supports challenging industrial automation, aerospace and
defence network connectivity with its compact Brad Nano-Change
(M8) connectors.
The rugged NanoChange product
line offers the
industry’s broadest
selection of spacesaving connectors,
cordsets,
receptacles, inserts,
splitters and molded
junction boxes for
sensor and actuator
applications.
A new docking frame with a floating mount has
been added to the HARTING Han-Modular series
of industrial connectors, allowing users to assemble
customised connector configurations using “blind”
connection. The new docking frame, in the 10B size
range, makes it possible to create a modular docking
connector without a housing. This type of connector
is typically used as an insert in switch cabinets,
where the insert cassette is pushed into the cabinet
and the sides of the connector are brought together
“blind” to form a reliable connection. The float
mount frame can move freely over a distance of
±2 mm, and incorporates leading centring pins and
bushes with high mechanical stability to ensure that
both connector sides connect reliably together.
Cost-Effective ARINC 600 Connector From Souriau
As part of its commitment to ensure ongoing customer
satisfaction, Souriau develops solutions to reduce the
cost of its connectors
without sacrificing their
high performance.
One example is its new
Cost-Effective ARINC
600 connector with
harpooned contacts. Like its predecessor, this connector
conforms to the ARINC 600 standard but costs as much
as 25% less. After analysing the growth value, Souriau
noted a low repair rate for ARINC
600 connectors. This observation
enabled the company to simplify
the product’s design: the inserts
are both one piece and unmarked
and the harpooned contacts are
prefitted.
Modular Fast-On Terminal Blocks from Cliff
Electronics
CLIFF Electronics announce the highly versatile Fast-On terminal
blocks and accessories for system and panel builders. The
modular construction of Cliff Fast-On terminal blocks allows users
to simply configure multiple unit assemblies to suit a wide range
of applications. The terminal blocks are available in red, blue
and black to simplify identification and to cater for three-phase
installations. Each terminal has a touch-proof cover which also
offers indication of unauthorised tampering. It is possible to write
on the lid cover with a suitable pen and for OEM users Cliff will
hot-print custom legends.
24. June 2013
www.electronicspecifier.com
Board Mounted Power
Low cost
High reliability
Short lead times
Industry standard footprints
Highest power density
20W
DCDC
in 1”x1”
Industry standard DC-DC ranges
1 to 3 Watts
• SIP & DIP packages
• Regulated & unregulated versions
• ±10%, 2:1 & 4:1 inputs
• 500 V to 6 kV isolation
5W
ACDC
in 1”x1”
AC-DC low power board mounted ranges
2 to 60 Watts
• 1 x 1”, 1 x 2”, 2 x 2” & DIP-24 footprints
• Regulated single, dual & triple outputs
• Wide 2:1 & 4:1 inputs
• Up to 3.5 kV isolation
ECE series
• 5 to 40 Watts
• Ultra compact from 1” x 1”
• Encapsulated
• Single and dual outputs
• <0.3 Watts no load input power
Medical safety approvals
• 3 to 10 Watts
• Meets IEC60601-1 3rd edition
• 4000 VAC reinforced insulation
• 2µA patient leakage current
ECL series
• 5 to 30 Watts
• Ultra compact size
• Single & multi outputs
• Open-frame & encapsulated
• <0.3 Watts no load input power
LED drivers
• 5 to 48 Watts
• Up to 1000 mA output
• Constant current output
• 95% efficiency
Download FREE
Surface mount power
• 1 & 2 Watts
• Regulated & unregulated versions
• ±10, 2:1 & 4:1 inputs
• Single & dual outputs
interactive guides to help select your
AC-DC & DC-DC products at:
www.xppower.com/literature_downloads
Also available from www.farnell.com
Visit our website to request a
copy of our latest Power Supply
Guide and see our complete line
of power products.
GREEN•POWER
Selector App
Available
product
POWER
Vishay Intertechnology’s New Gen2 650 V FRED Pt
Ultrafast Diodes
Toshiba Introduces Low RDS (ON)
P-ch MOSFETs for Mobile Devices
Vishay Intertechnology released 11 new Gen2 650 V FRED Pt Ultrafast
diodes. The H family of bare die devices, suitable for applications
working above 40 kHz, combine extremely fast and soft recovery time
with low forward voltage drop and reverse leakage current to reduce
switching
losses in solar
inverters,
UPS, electric
vehicles and
hybrid electric
vehicles,
welding
machines,
servers, and
continuous
conduction mode power factor correction. The U series, available
on request for applications up to 40 KHz, offers a much lower
forward voltage drop to optimize conduction losses. The new Vishay
Semiconductors Ultrafast diodes are offered with a wide range of
rated currents from 2 A to 150 A.
Toshiba America Electronic Components has
announced the addition of three new high
current P-ch MOSFETs: the SSM6J505NU,
SSM6J501NU and SSM6J503NU. Supporting high
currents for high power dissipation packages,
the new MOSFETs make ideal charging switches
for smartphones and other mobile devices with
high current charging circuits. As the battery
capacity of smartphones and other mobile
devices increases, the charging current increases
as well. Toshiba used the latest UMOS VI process
to design the SSM6J505NU, SSM6J501NU and
SSM6J503NU in a small 2.0mm × 2.0mm ×
0.75mm (UDFN6B) package that achieves low
ON-resistance and allows large currents. As
additional functions are added to mobile devices
and more demands are made on their batteries,
boosting charge density and improving the user
experience by reducing charging time become
top priorities, noted Talayeh Saderi, TAEC.
Highly Integrated PFC IC for Compact Consumer Products and PCs
Power Integrations today introduced HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications
from 100 W to 380 W. HiperPFS-2 ICs combine a boost PFC controller, driver, PFC MOSFET, PFC diode and protection
circuits in one package, enabling exceptionally compact designs ideal for small-form-factor power supplies as used in
mini-tower PCs, all-in-one PCs, game console adapters and TVs. The HiperPFS-2 controller uses a variable-frequency CCM
algorithm providing up to 97% efficiency across the load spectrum from 20% to 100%.
Medically Approved 30–48 Watt AC-DC Power Supplies From Power Sources Unlimited
Power Sources Unlimited introduce the new PM42 Series of compact
30–48W AC-DC power supplies that meet both UL60601-1 third edition
medical safety and EN60950-1 ITE safety standards. The PM42 Series of
compact (2 x 4 x 1.18), open-frame PCB constructed power supplies are
available in single, dual, and triple output models with voltages ranging
from 5VDC to 48VDC. Additional features of the PM42 Series include
90–264VAC universal input, efficiencies up to 88%, over-voltage and
short circuit protection, leakage current of 150μA maximum at 264VAC,
and 4000VDC input-ground withstand voltage.
26. June 2013
www.electronicspecifier.com
AC-DC Power Supplies with
Battery Back Up
The PQE & PQP series are a range
of AC-DC power supplies with
universal AC input and either
dual or triple DC outputs with
battery back up in the event of an
AC power failure. They are
available in 75W or 100W power
rating and can be either open frame
construction (PQE Series) or fully
enclosed (PQP Series). They are
ideal for use in CCTV or Alarm
systems applications or in fact
anywhere where critical systems
need to continue to operate in the
event of an AC failure.
Features
• Universal 90-264VAC 47-64Hz input
• 12V or 24V Battery Back up versions
• DC output nominal 12V or 24V
(depends on battery used)
• Auxiliary 5V 3A output on triple
output versions
• Charger output 12V version is 13.8V
1.8A or 2.5A for 75W or 100W model
• Charger output 24V version is 27.6V
1A or 1.5A for 75W or 100W model
• Auto switching to battery when AC fails
• Short circuit, over load and over voltage protection
• Battery low and battery reverse polarity protection
• Brown out (AC input voltage low) protection
• Alarm signals for AC Power Fail & Battery Low
• Cooling by free air convection
• UL60950-1 and TUV/EN60950-1 approved
• EMI conforms to EN55022 Class B
website: www.powersolve.co.uk
email: sales@powersolve.co.uk
Te l e p h o n e : 4 4 - 1 6 3 5 - 5 2 1 8 5 8
POWER
product
420W PMBus Compliant 1/4 Brick DC-DC Converter From Murata
Incorporating a 32-bit ARM7 processor, the 420 Watt regulated
UDQ2204/001 model is the first in a series of DC-DC converters
from Murata Power Solutions to include a PMBus compatible
digital interface. The UDQ series is packaged in the industry
standard quarter-brick format incorporating the Advanced Bus
Converter pinout for PMBus communications to an isolated DCDC converter. The UDQ2204/001 is an isolated, fully regulated,
420W-12Vout quarter brick that supports the TNV input voltage
range of 36V–75V with a typical efficiency of 95.5%.
Touchstone unveils TS3300 boost regulator
Verotec Announce Versatile VeroPower
Switched Mode AC-DC PSUs
Touchstone Semiconductor today announced the TS3300
boost regulator. The TS3300 uses only 3.5µA of supply
current, and the TS3300’s efficiency performance is
constant over a 100:1 span in output current. No other low
power boost converter offers this level of performance.
The TS3300 is the industry’s first boost plus linear regulator
that can operate from supply voltages as low as 0.6Vup to
4.5V and can deliver at least 75mA of continuous output
current. The TS3300 is ideally suited to be powered from a
wide variety of power sources including single or multiplecell alkaline or single Li-chemistry batteries. The boost
regulator’s output voltage range can be user-set from 1.8V
to 5.25V to power an entire range of low-power analog
circuits, microcontrollers, and low-energy Bluetooth radios
simultaneously.
The VeroPower family of 3U pluggable switched mode ACDC power supplies from Verotec offer high power densities
in compact plug-in
modules compatible with
any standard 19” subrack
system. The VeroPower
range consists of 20, 40
and 50 Watt units in
slimline 4HP (0.8”) width,
80W supplies in 8HP
(1.6”) width and 150W units in 12HP (2.4”) width. All sizes
have autoranging 94-253VAC, 47 - 63Hz input voltages,
making them suitable for use in all geographies without
having manually to set the input voltage.
New Compact 6.5 kV IGBT-driver Cores From CONCEPT Feature Reduced Component Count for
High Reliability
CT-Concept Technologie has launched the 1SC0450V, a compact
and robust single-channel gate-drive solution for 6.5 kV IGBT
modules. The driver is able to support the operation of up
to four IGBT modules in parallel, and the use of CONCEPT’s
proprietary SCALE-2 ASIC technology results in a significantly
lower component count compared to a discrete solution. This
approach increases reliability, enabling a service life guarantee of
over 15 years. Featuring an on-board power supply, the drivers
have a gate current of ±50 A and operate from a +15 V/-10 V
supply. Power capability is 4 W at 85°C.
28. June 2013
www.electronicspecifier.com
product
POWER
Expanded lineup of micro DC-DC converters
Murata Manufacturing
Co. Ltd. has developed
two new series of
micro DC-DC converters
(LXDC55F series and
LXDC55K series) and
launched their mass
production. As electronic
devices incorporate
more functionality, it
has become necessary
to convert voltages
and supply power individually for each functional circuit.
Until now, the required discrete components have been
mounted on the circuit
boards. To meet market
demands for a smaller
footprint, lower EMI
noise, and higher
energy-saving, Murata
applied the company’s
proprietary circuit
design and multi-layer
process technologies to
develop the first micro
DC-DC converters and
introduced to market in October 2010.
Linear Technology Announces The LTC4417
PowerPath Controller
New TO-Leadless Package For High Current
Applications Up To 300A
Linear Technology has introduced the LTC4417, a triplesupply prioritized PowerPath controller for 2.5V to 36V
systems. The controller selects the highest priority valid
supply among three inputs to power the load. Priority is
defined by pin assignment, while a supply is considered
valid after it has been inside a voltage window set by
1.5% accurate undervoltage and overvoltage thresholds
for 256ms. The LTC4417 greatly simplifies designs,
deriving power from multiple, disparate voltage sources
common in handheld and high availability electronics.
In such systems, a prioritizer is a better solution than a
simple diode-OR, especially when the preferred power
source is not the highest voltage. The LTC4417 controller
also protects the load from reversed inputs to −42V.
Infineon Technologies introduce the new TO-Leadless package
offering reduced package resistance, significantly smaller
size as well as improved EMI behaviour. It contains the latest
OptiMOS MOSFET generation for applications with high
power and
reliability
requirements
such as
forklift, light
electric
vehicles,
eFuse, Point
of Load and
telecom
systems.
The new
TO-Leadless
package has been designed for high currents up to 300A. Due
to its low package resistance it enables the lowest R DS(on)
in all voltage classes. The 60 percent smaller package size
compared to D 2PAK 7pin enables a very compact design.
TO-Leadless shows a substantial reduction in footprint of 30
percent and requires less board space for example in forklift
applications.
www.electronicspecifier.com
June 2013 29.
product
SENSING
ZMDI Launches ZSSC3036 Sensor Signal Conditioning IC
ZMD AG today announces the launch of the ZSSC3036,
a leading-edge 16-bit sensor signal
conditioning IC with an integrated
18-bit digital signal processor
for linearization and calibration
functions. ZMDI has developed the
ZSSC3036 to expand its family of
16-bit SSC ICs for calibrated resistive
sensor modules. Optimized for highresolution industrial, consumer, and medical applications,
this sensor interface IC combines the 18-bit DSP, high
accuracy amplification, and 16-bit
precision analog-to-digital conversion
with special features for battery-driven
low-power devices, including 900µA
typical overall current consumption,
ultra-low 50nA typical sleep mode
current , and a 1.8 to 3.6V power
supply range.
Digital Differential Pressure Sensor For High Accuracy Monitoring
Omron Electronic Components has added a new digital flow sensor offering exceptionally high accuracy and repeatability
in monitoring low air flows. The sensor is an ideal alternative to a differential pressure sensor for optimising energy
efficiency in air conditioning and ventilation systems, like variable air volume and heat recovery unit systems or for use
in high quality medical equipment and industrial applications. the new Omron D6F-PH provides better accuracy and
repeatability than standard differential pressure sensors.
HD CameraChip Sensor For Portable Devices
And Smart TVs
ULIS Launch Thermal Sensor Arrays Within
Scope Of The MIRTIC Project
OmniVision announce a cost-efficient and compact
720p high definition CameraChip sensor, designed
specifically for secondary cameras in notebooks, tablets
and smartphones, as well as the rapidly developing
smart TV market. The new OV9728 utilizes a 1.75-micron
OmniBSI+ pixel to deliver dramatically improved HD video
ULIS announces today it will conclude the first of two phases
in the MIRTIC project with the launch of the Micro80P
thermal sensor array. The launch will take place at the Sensor
and Test Fair in Nuremburg, Germany, May 14 – 16, 2013.
Micro80P is the first 80x80 small pixel pitch high-sensitivity
array in a line of next-generation thermal sensor arrays that
meet the needs of applications
seeking to achieve maximum
energy efficiency in everyday
use, such as building automation
for heating, ventilation and
air conditioning or automatic
lighting. The new thermal sensor array product line was
developed within the scope of MIRTIC, a EUR 24.8M project
performance that exceeds the Microsoft Lync and Skype
set up by ENIAC Joint Undertaking (a public and private
premium specifications for video quality. The OV9728
partnership in nanoelectronics) in 2012. Micro80P offers a
features a one-lane high-speed MIPI interface and fits into
thermal sensitivity greater than 100 mK under a blackbody
a compact 6 x 6 x 3 mm module. It is currently available
illumination set at 20 degrees Celcius (equivalent to most
for sampling and is expected to enter volume production
room ambient temperatures), captured at a 1 Hz or 50 Hz
in the third quarter of 2013.
frame rate, using a compact 34 micron pixel pitch.
30. June 2013
www.electronicspecifier.com
product
SENSING
Infineon Releases New 3D Image Sensor Chip Family
Infineon Technologies today introduced a family of 3D Image Sensor chips for
implementation of touchless gesture recognition. Developed in cooperation
with pmdtechnologies, the new chips are the first to combine a 3D image sensing
pixel array with the digital conversion and control functionality needed to design
very compact and accurate monocular systems for gesture recognition applications
in computers and consumer electronics devices. The Infineon 3D Image Sensor chips will simplify and enhance the
way people interact with machines. They enable fast and reliable tracking of finger movements and hand gestures to
complement today’s touch screen and mouse or stylus user interfaces. “Gesture recognition will dramatically change
the way people control computing and consumer electronic systems,” says Ralf Bornefeld, Vice President and General
Manager of the Sense & Control business line at Infineon Technologies AG.
Farsens Introduces Battery Free Pressure
Sensor Tag
ZMOTION Detection Module II With
Advanced Sensing Technology
The Vortex1 from Farsens is a battery free RFID sensor
tag capable of transmitting a unique identifier and the
associated pressure data to a commercial EPC C1G2
reader without the need of a battery on the sensor tag.
The device features a LPS331AP pressure sensor from
STMicroelectronics with an absolute pressure range from
260 to 1260 mbar. The tag comes in a variety of antenna
designs and sizes to adapt the performance to the required
application. The reading distance for the battery free
pressure sensor tag is around 1.5 meters (5 feet) and it can
be embedded in a wide variety of materials .Evaluation kits
are available. The main advantage of the product lies on
the possibility of using the sensor without batteries at all.
The Vortex1 is ideal for pressure sensitive asset and process
management.
Zilog introduces its latest detection and control
technology ideally suited for motion detection
applications including customer sensing, lighting control
and other energy management purposes. The ZMOTION
Detection Module II
(ZDM II) provides an
integrated and flexible
solution for Passive
Infrared-based motion
detection applications.
It is an excellent
solution for detecting
people as they approach entrances, kiosks, product
displays, vending machines, appliances and advertising
displays.
CISSOID Sets Standard for High Temperature Sensors with OPAL
OPAL is a dual Op Amp specifically designed to meet the toughest
environmental constraints of sensors in automotive, industrial and
general High Reliability applications such as aeronautics, military
and down-hole tools (Oil&Gas) electronics. Key features include
low input offset (50µV typ.), low noise (5 µVpp typ.) and single
+5V ±10% power supply. A first product flavor now available is
CHT-OPAL, guaranteed for operation from -55°C up to +225°C. It is
available in a thin dual flat pack (TDFP) surface mount, hermetically
sealed ceramic package, with footprint of only 5 x 5.5mm.
www.electronicspecifier.com
June 2013 31.
product
ACTIVE
COMPONENTS
TI Announces Industry’s First 8-Channel PWM Audio Processor With Dual ASRCs
TI have introduced the
industry’s fastest 4-channel,
14-bit analog-to-digital
converter, clocking in at 250
MSPS. The high-density
ADS4449 enables receiver
systems to support up to
125 MHz of instantaneous
bandwidth in extremely
small forms, such as multiple
input and multiple output base stations and munitions
High-Temperature, General Purpose 80V / 3A
Dual Diode
CISSOID expands its PLANET family of discrete products
with the launch of CHT-AMALTHEA, a medium power,
general purpose, dual diode in a hermetically sealed
metal can TO-257 package. This new device is guaranteed
for operation from -55°C up to +225°C. CHT-AMALTHEA
includes two diodes and is available in three possible
configurations: Common anode, common cathode and
dual series configurations. Each diode has a reverse voltage
of 80V, a maximum forward current of 3A DC and 4A peak
at 225°C, making them suitable for a number of power
applications.
guidance, or in greater density
applications, such as active
electrically scanned array and
other phased-array radars.
System designers are increasingly
challenged to pack more
antennas, and their requisite
receive chains, into remote radio
units and AESA radar systems,
while also improving dynamic
range and noise levels.
Fujitsu expands FM3 32-bit MCUs with
new MB9B120J series
Fujitsu has introduced a new series of 32-bit RISC
microcontrollers based on the ARM CORTEX -M3 processor,
expanding the frujitsu FM3 MCU to roughly 500 products in
total. This new MCU series includes the MB9BF121JWQN
model, which features low-pin-count QFN packaging and
it is optimized for system control in household appliances,
office automation systems and industrial equipment. The
MCUs announced today are part of the FM3 basic group,
which balances performance and cost. Samples will be
available by the end of June 2013, with mass production
scheduled to begin later in 2013.
Energy Micro Announces Energy Efficient EFM32 Wonder Gecko MCU
Energy Micro is shipping its latest and most
advanced microcontroller yet, the EFM32 Wonder
Gecko, with devices and development kits available
immediately. The Wonder Gecko MCU includes the
ARM Cortex-M4 processor that provides a full DSP
instruction set and a dedicated floating point unit. The
EFM32 Wonder Gecko also utilises the extreme low
leakage process for ultimate low-power operation
in active and sleep modes. The Wonder Gecko
family consists of 60 scalable memory and package
configurations with up to 256 KB Flash and 32 KB
RAM.
32. June 2013
www.electronicspecifier.com
product
ACTIVE
COMPONENTS
Microchip Expands General-Purpose 8-bit PIC Microcontroller Portfolio With Increased
Microchip have announced an expansion to the PIC16F75X
family of 8-bit microcontrollers featuring intelligent
analog and core-independent
peripherals, making them
ideal for general-purpose
applications, as well as power
supplies, battery charging
and LED lighting. The new
PIC16F753 MCU builds on
the success of the popular
PIC12F752. The PIC16F753
offers all the key features of the PIC12F752, such as the
integrated Complementary Output Generator peripheral
that provides non-overlapping,
complementary waveforms
for inputs such as comparators
and Pulse Width Modulation
peripherals, while enabling deadband control, auto shutdown, auto
reset, phase control and blanking
control.
Industry’s Smallest 18-Bit SAR ADC Saves 70% Board
Space
Maxim is now shipping the MAX11156, the industry’s smallest 12-pin, 18bit successive approximation register analog-to-digital converter. Available
in a tiny 3mm x 3mm TDFN
package, the MAX11156
integrates an internal
reference and reference
buffer, saving cost and at
least 70% board space
over competing solutions.
With 18-bit resolution, this
high-performance ADC
features Beyond-the-Rails
technology, which supports a ±5V input from a single positive 5V input
rail. This technology eliminates the need for negative power supplies and
simplifies designs.
Swissbit announces INDUSTRIAL
2-8 GB DDR3L SO-DIMMs
Swissbit announces new members of its
INDUSTRIAL family of DDR3 SODIMMs
compatible with the JEDEC DDR3L standard
running at 1.35V. DDR3L will allow an up to
15% reduction in power consumption over
DDR3. With the introduction of 3x and 2x nm
DRAM technology, the modules are able to
run at lower external supply voltage than the
standard 1.50V. Foreseeing this evolution,
JEDEC as the standardization group for DRAM
components has developed a new standard
for 1.35V operation called DDR3L (L standing
for low voltage). The Swissbit DDR3L modules
are backwards compatible with the DDR3
standard.
www.electronicspecifier.com
June 2013 33.
product
ACTIVE
COMPONENTS
USB 2.0 Hub Controller Chip With Battery Charging Function
Renesas Electronics announce development of the µPD720115 USB 2.0 hub controller chip, which supports
simultaneous USB communication and charging of portable devices such as smartphones and tablet PCs via a single
USB connector. The most important feature of the µPD720115 is its implementation of USB ports with battery charging
functionality which supports the USB Battery Charging Specification, Revision 1.2 (USB BC 1.2).
Toshiba Reveal Next Generation
NAND Flash Memory
Toshiba Corporation has announced
that the company has developed second
generation 19 nanometre process
technology that it will apply to mass
production of 2-bit-per-cell 64 gigabit
NAND memory chips later this month.
Toshiba has used the new generation
technology to develop the world’s smallest
2-bit–per-cell 64 gigabit NAND memory
chips, with an area of only 94 square
millimetres. Using a unique high speed
writing method, the next generation chips
can achieve a write speed of up to 25
megabytes a second – the world’s fastest
class in 2-bit-per-cell chips. Toshiba is also
developing 3-bit-per-cell chips by using this
process technology and aims to start mass
production in the second quarter of this
fiscal year.
Linear Technology Announces LTC2378-20 No Latency SAR
ADC
Linear Technology introduces the LTC2378-20, a 20-bit 1Msps no
latency successive approximation register analog-to-digital converter
with exceptionally low 0.5ppm (typ) and 2ppm (max) Integral NonLinearity error. INL is a key specification in precision applications, such as
seismic monitoring and
semiconductor fabrication,
indicating how much the
ADC transfer function
deviates from its ideal. Since
linearity effectively cannot be
calibrated at the system level,
the ADC’s INL specification
often sets the overall system
accuracy. The best-in-class
0.5ppm INL of the LTC237820 enables a new generation
of precision systems with true
20-bit accuracy. The proprietary architecture leads to an extremely stable
2ppm (max) INL and -114dB THD (max) over the device’s entire operating
range of -40°C to 85°C.
Industry’s Smallest And Most Power-Efficient PCI Express
Clocks
Silicon Labs introduces new one- and two-output PCIe clock generators
that offer the smallest footprint and lowest power in the market.
Designed to meet the stringent specifications of the PCIe Generation
1/2/3 standards, the Si52111 and Si52112 clock generator ICs target
high-volume consumer, embedded, communications and enterprise
applications where board space, power consumption and system cost
are critical concerns. Silicon Labs’ Si5211x clock generators are especially
well-suited for space-constrained, power-sensitive consumer electronics
products such as digital still cameras that require industry-standard PCIe
connectivity.
34. June 2013
www.electronicspecifier.com
product
ACTIVE
COMPONENTS
IR Announce Compact Low-Side Gate Drive IC
in SOT-23-5L Package
International Rectifier have today announced the
introdcution of the IRS44273L low-side gate drive IC offering
high drive capability in a highly compact SOT-23-5L package.
The IRS44273L is easy to use and provides a simple solution
for IGBT and MOSFET gate drive, offering 1.5A (typical)
sink and source capability, fast switching performance
and integrated under-voltage lockout protection with
minimal board space requirements. This new device offers
functionality previously only available in larger packages such
as an SO-8 enabling more compact and economical system design.
HOLTEK HT66FM5230 BLDC Motor Flash MCU
With a firm focus on the Single-phase/Three-phase Brushless DC Motor controller application area, Holtek is delighted
to announce its new Flash type DC-Fan controller MCU, the HT66FM5230. Being specifically directed at single phase and
three phase Brushless DC Motor control, this new device fully supports square wave and sinusoidal wave generation
solutions. Among these, square wave control can support Hall Sensor and Sensor-less control methodologies. The
HT66FM5230 is available in both 16-pin NSOP and 20-pin SSOP package types.
www.electronicspecifier.com
June 2013 35.
product
PASSIVE
COMPONENTS
Silicon Labs Unveil Ultra-Low Jitter
Differential Crystal Oscillators
Bulk Metal Foil COTS Resistors In Demand For
Control And Monitoring Applications
Vishay Precision Group announce that its VFR brand Bulk
Metal Foil commercial off-the-shelf resistors are increasingly
in demand to meet the needs for high reliability and
long-term stability in control and monitoring applications.
Including the surface-mount VSMP Series (0603-2512),
hermetically sealed oil-filled VHP100, and leaded Z
Series, VFR’s comprehensive portfolio offers a variety of
resistor configurations, case sizes, and ultra-high-precision
specifications for optimized performance. All are based on
proven foil resistor technologies with a 50-year track record
of delivering ultra-precision performance while continuing
to evolve and improve to serve the needs of the market.
Samples and production quantities of the foil resistors are
available now, with lead times of five days for prototype
samples and from two days to five weeks for standard orders
at the catalog houses.
Silicon Labs introduce a new family of crystal oscillators
that provide ultra-low jitter reference timing for 10G, 40G
and 100G cloud computing and networking equipment.
These new Si535 and Si536 XOs leverage Silicon Labs’
proven DSPLL technology to provide unparalleled
performance, stability and flexibility for 10/40G data
center core/access switches, storage area networking
equipment, security routers, enterprise switches/routers,
and Carrier Ethernet switches and routers. To support the
burgeoning demand for cloud computing-based services,
data center equipment is migrating to higher speed serial
data transmission, often 10G or faster. In parallel, there
is a significant trend to maximize energy efficiency by
consolidating switching, storage and computing resources
into fewer components. These trends have given rise to
processors, Ethernet switch ICs and FPGAs with integrated
high-speed serializer-deserializer technology that requires
low-jitter timing references. Silicon Labs’ Si535/536
oscillators provide the ultra-low jitter and ±20 ppm
stability.
NXP Launches Industry’s First SD 3.0 Level Shifter Supporting SDR50 Mode
NXP Semiconductors today announced
the IP4855CX25 – a unique voltage level
shifter for SD 3.0-compliant memory cards
with integrated ESD/EMI protection. The
device is designed to operate at clock
frequencies of up to 100 MHz and data
rates of up to 50 MHz. The IP4855CX25 is
the industry’s first SD 3.0 card level shifter
supporting the ultra-high speed SDR50
mode, helping consumers to safely experience the faster
36. June 2013
data rates offered by SD 3.0 memory card
solutions. With 8 kV of integrated ESD
protection according to IEC6100-4-2 (Level
4), as well as an integrated EMI filter, the
IP4855CX25 offers a robust solution for
the communication interface between the
system chip and the memory card. Volume
production of the IP4855CX25 is ramping
up with immediate effect.
www.electronicspecifier.com
PASSIVE
COMPONENTS
product
KEMET Announces the Release of Three New Tantalum
Chip Capacitor Series
KEMET announced the release of three new series of tantalum chip
capacitors: T488 Small Case Substrate Terminal MnO2, T527 Facedown
Polymer, and T529 Small Case Substrate Terminal Polymer. These
miniaturized solutions offer the highest capacitance values (22uF to
220uF) available today in both a standard 2012 (2.0mm x 1.2mm) and
3216 (3.2mm x 1.6mm) EIA case size with maximum package heights of
as low as 1.0mm. In addition to offering a small footprint and low profile,
advancements in counter-electrode technology and package design have
resulted in the lowest ESR values available in the industry for these package sizes.
Microsemi Delivers Highly-Integrated ‘Any-rate’ Clock Multipliers with Industry-leading Low
Jitter
Microsemi announce six new multi-frequency, ‘any-rate’ clock synthesis and frequency-conversion/jitter-attenuation
products. The new solutions focus on high frequency and ultra-low jitter output clocks with integration of fanout buffers
and optional custom configuration. These solutions target applications such as enterprise routers and switches, storage
area network equipment, servers and communications equipment. With the increase of data rates and bandwidth
demand, high-speed transceivers are deployed in new systems to meet these requirements. Microsemi’s new clock
generator family is ideal for clocking high-speed transceivers, including 10G, 40G and 100G Ethernet.
knitter-switch Announces Fully Sealed
IP67 Pushbutton and Toggle switches
knitter-switch has launchesd three new series of switches;
the MHP/MHG/MHW series comprise pushbutton and
toggle switches fully sealed to IP67 and designed for
use in marine
environments
as well as
industrial
machines and
special vehicles
such as military
and industrial
including
garbage trucks
and agricultural
equipment.
Featuring a rugged, non-reflective matt black body,
actuator and hardware, all three series are rated at 2 ~ 3A
(at 250VAC) and 5 ~ 6A (at 125VAC/28VDC). They offer a
working life of min 50,000 cycles at full load.
More Performance... Aries’ ultra high
frequency sockets have a mere 1 dB
signal loss at up to 40 GHz!!! Centre probe
and Microstrip sockets deliver more than
half a million insertions with no loss of
electrical performance.
More Choices... Aries offers a full range of
sockets for handler-use, manual test and
burn-in...for virtually every device type,
including the highest density BGA and CSP
packages. Choice of moulded or machined sockets
for centre probe and Kapton interposer models, too!
Less Cost... in addition to extremely competitive
initial cost, Aries replacement parts and repair
costs beat the competition, assuring you of
lowest total cost of ownership.
ISO 9001
Certified
NOW AVAILAB
LE
for ICs Down
to 0.3mm Pitch!
Less Wait... Aries can deliver the exact sockets
you need in four weeks or less!
So why settle for less? Aries
makes it easy to get the world's
best test sockets. Call or visit
our web site to find out how!
www.electronicspecifier.com
Tel: +1 215 781 9956
Fax: +1 215 781 9845
e-mail: europe@arieselec.com
www.arieselec.com
Sensible Solutions... Fast!
June 2013 37.
PASSIVE
COMPONENTS
product
Littelfuse Increases Voltage Output of Multipulse SIDAC Devices
Littelfuse has introduced the Kxxx1GL Series Multipulse
SIDAC, a thyristor power control device designed for use in
220-240V AC line installations. The thyristor, when coupled
with a capacitor and transformer, generates the multiple high
voltage pulses required to ignite metal-halide lamps. These
new devices offer designers of metal-halide lamp ignition
circuits the advantages of lower switching loss for higher pulse
voltages, improved tolerance for input voltage variations, and
longer pulse durations than the company’s earlier Kxxx1G
Series devices.
IDT Enables Industry’s Lowest Phase
Noise VCO And Fractional Output Divider
KEMET Launches New Line of Industrial
Grade Safety Disc Capacitors
Integrated Device Technology announce two breakthrough
technologies enabling the industry’s lowest phase noise
voltage-controlled oscillator and fractional output divider.
IDT’s latest technologies reinforce the company’s leadership
in timing by empowering customers to solve phase noiserelated challenges in high-performance communication and
networking applications. IDT’s new VCO technology will be
leveraged into next-generation clock generator products,
and has been demonstrated to achieve less than 50
femtoseconds of RMS phase jitter over the wide-band 1 kHz
to 61.44 MHz integration range. The extremely low phase
noise enables customers to generate the highest-quality
reference clocks for use in wireless base-stations, wired
networking, and other high-performance communications
equipment.
KEMET announced the release of the new Radial Through
Hole Ceramic Safety Disc Capacitors. Safety Certified
Capacitors are classified as either X and/or Y capacitors.
Class X capacitors are primarily used in line-to-line (acrossthe-line) applications. In this
application there is no danger
of electric shock to humans
should the capacitor fail, but
could result in a risk of fire. The
class Y capacitor is primarily
used in line-to-ground (line
by-pass) applications. In this
application, failure of the
capacitor could lead to danger
of electric shock.
New PTS 810 Series Enables Visual
Differentiation and Variable Operating Forces
C&K Components has developed a new series of microminiature
SMT top-actuated switches. Designated the PTS 810 Series,
the microminiature switch has a 4.2 x 3.2mm footprint, 2.5mm
height, and is ideal for control panels, nomad devices, remote
controls, and keyless entry systems. Featuring color-coded
actuators, the PTS 810 Series provides easy identification for
design engineers using multiple switches within a single system.
In addition, the PTS 810 Series switches deliver operational life
spans up to 150,000 cycles.
38. June 2013
www.electronicspecifier.com
product
PASSIVE
COMPONENTS
2-Channel ESD Protection Diode for Full-Speed USB 2.0 and RF Interfaces
Toshiba Electronics Europe has extended its line-up of ESD
protection devices with the DF4D6.8UG. The DF4D6.8UG
comes in a compact 4pin Wafer-Level-Chip-Scale Package
and offers ESD protection for dual high-speed data lines while
minimising board space. The device targets applications that are
increasingly sensitive to ESD events due to reduced feature sizes
and working voltages in the system. It is essential to minimize
the load that is added to the data line with any kind of ESD
protection measure when considering signal integrity, especially
with high-speed USB 2.0 data.
Stackpole Announce ZOV High Energy Varistors
The ZOV Series of metal oxide varistors is a series of epoxy coated square varistors with sizes from 23mm to 60mm. These
high energy varistors come in a single disc, double, triple and quadruple disc versions with pulse current capabilities of up
to 80kA. This series offers energy handling up to 4100 Joules with working voltages up to 680 Vrms and 895 Vdc. The ZOV
can be supplied with epoxy coating and rigid terminals, with rigid terminals and no coating, and with a bare metallized
disk. The ZOV is available in 1K and 500 pcs quantities.
Murata Launches Mass-production of
World’s lowest-profile monolithic ceramic
capacitor
Murata Manufacturing is pleased to announce that it has
commercialized the new low profile monolithic ceramic
capacitor, 0603 size (1.6 x 0.8mm) with maximum chip
thickness of 0.55mm, having X5R characteristics, 4.7µF,
16V. Against a background where sets increasingly
have had more
advanced
functions,
the need for
monolithic
ceramic
capacitors with
larger capacities is increasing, especially for the sets for
devices such as smartphones and laptop PCs that require
lower profile parts. To meet this need, Murata has used
its material process technology to develop the world’s
lowest-profile 4.7µF, 16V product with a maximum chip
thickness of 0.55mm (predecessor: 0.95mm). This new
product will contribute to the further size and thickness
reductions of electronic devices.
You specify it
and we’ll make it
PROTOTYPE SERVICE TO FULL PRODUCTION QUANTITIES
Power Ratings
Terminations
0.25W – 16 mm pots (linear laws)
0.40W – 20 mm pots (linear laws)
Choice of solder tags or
pcb pins.
Log, antilog and special non-linear laws will
have lower power ratings.
Mounting Bush
Choice of glass filled nylon or diecast
zinc alloy.
Spindle
Choice of 4 mm, 6 mm and 1⁄4" diameter,
various lengths, with or without flats.
Rotational Feel
Choice of centre or multi-position click
stops if required.
Resistance Ratings
Linear resistance laws : 1k – 1MΩ
Non-linear laws : 4k7 – 470kΩ
Call for samples
Made in the UK
16MM & 20MM CONDUCTIVE POLYMER
TRACK POTENTIOMETERS
OMEG LIMITED IMBERHORNE INDUSTRIAL ESTATE,
EAST GRINSTEAD, WEST SUSSEX, RH19 1RJ Web: www.omeg.com
Tel: +44(0)1342 410420 Fax: +44(0)1342 316253 Email: sales@omeg.com
www.electronicspecifier.com
June 2013 39.
product
TEST &
MEASUREMENT
GOEPEL unveils
CION LX JTAG transceiver IC
Agilent Technologies Introduces OpenLAB
Data Store for Mass Spectrometry
GOEPEL electronic introduces CION LX, a new generation of
JTAG transceiver ICs. The innovative chip provides ultra-low
voltage characteristics, offering a tester-per-pin
architecture based on diverse
Boundary Scan standards
such as IEEE
1149.1IEEE
1149.6
Agilent Technologies today announced OpenLAB Data
Store for MS, a simple and affordable networked solution
for compliant storage of mass spectral data acquired
with Agilent’s ICP-MS MassHunter system. The software
is designed for medium to small laboratories measuring
inorganic impurities in pharmaceutical products and
ingredients in accordance with upcoming specifications
from the United States Pharmacopoeia. The OpenLAB
Data Store for MS bundle allows customers to grow their
compliant data storage to a second ICP-MS system at a
lower price than standalone workstation solutions.
and IEEE
1149.8.1, in
combination
with
additional
digital and
analogue test instruments. Various operation modes enable
a wide range of applications of the IC as bus transceiver, pin
driver and system monitor. For flexible signal adaptation,
different interface types with programmable transceiver
parameters are integrated into the chip.
Customised ATE Based on Programmable
Power Supplies
National Instruments has announced its newest generalpurpose programmable power supplies, which offer
the highest power density available in PXI and form the
foundation of automated test systems. The NI PXIe-4112
and NI PXIe-4113 modules provide high power density that
saves rack space while simplifying design by eliminating the
need to mix multiple instrumentation form factors. When
programmed with NI LabVIEW software and paired with
a range of PXI hardware instrumentation, the new power
supplies can help engineers create a complete, customised
test solution. The new programmable power supplies are
ideal for a range of applications from aerospace and defence
to automotive and component test. These modules feature
two 60W power supply channels in a single PXI Express slot.
40. June 2013
Serial-Bus Testing Added to Eight-Channel
Oscilloscopes
A number of new enhancements have been introduced
to the Yokogawa DLM4000 Series of 8-channel mixedsignal oscilloscopes. These include the L16 option, which
adds 16 extra channels of logic, plus upgraded firmware
for power measurements and serial-bus testing. The
eight channels on the original instrument could be
allocated as eight analogue channels or seven analogue
channels plus one 8-bit digital input. The new L16
option adds
16 more
channels
of logic to
give seven
channels of
analogue
plus a 24-bit
digital input,
allowing
more detailed analysis of embedded electronics and
serial-bus based systems. Upgraded firmware on the /
G4 option for power measurements gives the DLM4000
enhanced power capabilities in line with the Yokogawa
family of precision power analysers. In particular, the
oscilloscope can be used as a fully featured 3-phase
power meter,.
www.electronicspecifier.com
product
TEST &
MEASUREMENT
Accurate And Cost-Effective USB Data Acquisition Module From Data
Translation
Data Translation release the new DT9828E thermocouple
measurement module, expanding the DT9828 series, which has
been available since the beginning of the year. Designed for users
looking for a very cost-effective module, the DT9828E provides all
the basic features for temperature measurements and analyses
without galvanic isolation and four instead of eight differential
inputs for thermocouples. No compromises are made in terms of
accuracy: The DT9828E provides the same 24-bit A/D technology
as the other modules of the series, and achieves a typical accuracy
of +/-0.1 °C.
4-Channel Analog Input Device for Voltage
and Sensor based Measurements
IPETRONIK upgrades the second generation of its proven
M-Series by adding the new M-SENS2 a 4-channel analog
input device with direct CAN bus output. The new module
is compatible with the previous M-SENS and provides
the same type and number of measurement ranges.
By adding a higher internal sample rate and the newly
designed 500 Hz hardware filter it now supports higher
input frequencies. M-SENS2 covers twelve unipolar and
twelve bipolar voltage measurement ranges from ±0.1
V to ±100 V. All inputs also support the often used 0 to
20 mA or ±20 mA current input without adding external
hardware. Each input provides a selectable sensor
excitation of up to 15 VDC and a maximum supply current
of 60 mA. Measurement inputs, sensor excitation, CAN
bus and power supply are completely galvanically isolated
from each other. The output data is transmitted using CAN
bus 2.0B the automotive standard according to ISO 118982 with up to 1 MBit/s.
Protocol Analyser Supports 16G Fibre Channel
and 10Gbps Ethernet protocols
Teledyne LeCroy has added the SierraNet M168 and its
new FlexPort Technology to the SierraNet product family.
The SierraNet M168 is an 8-port multi-protocol analyser
and error injector supporting up to 16G Fibre Channel
and 10Gbps Ethernet protocols. FlexPort and 40Gbps
Ethernet analysis and error injection capabilities have
been added to the SierraNet M408. Leveraging FlexPort
in the SierraNet family of products eliminates the need
for costly single-function blades, pods and adapters found
in some competitive products. In addition to minimising
cost, FlexPort also allows for the creation of portable,
highly compact, extremely flexible, multi-function protocol
analysers. Utilizing FlexPort, each port-pair can probe both
Ethernet and Fibre Channel links up to speeds of 16G on
copper or optical cabling. Other important innovations
to the SierraNet platforms include: the integration of two
integrated 40Gbps Ports. Integrating the QSFP ports in the
hardware eliminates the complexity of external octopus”
cables used in competitive products. This also ensures
reliable analysis by eliminating the risk associated with the
additional 8 potential failure points the “octopus” cables
create in a test environment.
www.electronicspecifier.com
June 2013 41.
product
DESIGN &
EMBEDDED
AAEON Introduces IMBM-Q67A, an Economical
Premium Industrial Micro-ATX Motherboard
Synopsys Introduces Starter Kit for
DesignWare ARC EM Processors
AAEON today introduced the IMBM-Q67A, a 2nd Generation Intel Core
i7/i5/i3 Micro-ATX motherboard with RAID level 0,1,5 and 10 support
for increased data storage reliability and performance. Fourteen USB
2.0 ports offer expansive connectivity and the system can be configured
to use a SATA or
USB port for a boot
device. The IMBMQ67A supports Intel
Active Management
Technology, enabling
IT managers to have
options for remote
configuration, power
management and
system security. As a
full featured MicroATX motherboard,
the IMBM-Q67A is
an ideal platform for video surveillance, storage and high-resolution
digital signage applications. With its backwards compatibility, this low
power consumption Micro-ATX board offers robust innovations without
affecting customer’s legacy investments, making it an excellent choice
when performing incremental system upgrades.
Synopsys today announced availability of
the DesignWare ARC EM Starter Kit for the
ARC EM family of embedded processor
cores. The DesignWare ARC EM4 and ARC
EM6 processor cores are optimized for
use in embedded and deeply embedded
applications such as sensors, storage devices,
appliances, consumer electronics, and batteryoperated devices where high performance,
small size and minimal power consumption
are essential. The EM Starter Kit provides a
platform for rapid software development
and code porting, as well as software
debugging and system analysis for the ARC
EM processors. It is also used for application
and product prototyping and demos. The kit
is ready for use out-of-the-box and enables
designers to immediately begin writing code
for their design. The ARC EM Starter Kit
includes a base board and daughter card. The
daughter card features a Xilinx Spartan-6 LX45
FPGA, an on-board 125 MHz clock generator,
128 MB of DDR3 memory and 16 MB of flash
memory.
Renesas Releases Reference Platform for RX21A Group of MCUs
Renesas Electronics Europe today announced the availability of a full reference
platform for the RX21A Group of 32-bit microcontrollers for smart electricity meters
with advanced functionality. Renesas will launch the platform at
Smart Grids Paris on 4th June 2013. The RX21A meter reference
platform comprises a full development support environment
including middleware for power measurement and calibration tools,
enabling developers to easily design ultra-compact smart electricity
meters allowing short time-to-market. Key hardware features include
a modular design supporting both 3-phase 4 wire and single-phase operation,
and configurable sensor types including current transformer. This enables it to
operate at nominal 230V 50Hz~60Hz, with full 100mA to 100A measurement
range. Accuracy is equivalent to IEC62053-22 (and ANSI C12.20), to at least 0.5s, and
compliant with IEC6205-23, class 2 reactive.
42. June 2013
www.electronicspecifier.com
product
DESIGN &
EMBEDDED
DATA MODUL Launches MS-9896 passive cooled
3.5“ embedded board
With the MS-9896 DATA MODUL introduces a new, passive
cooled 3.5” embedded board with Intel Atom N2600 / N2800 /
D2550 processors and Intel NM10 Express chipset. Along VGA
and HDMI the MS-9896 has two independent LVDS interfaces
(LVDS1: Single Channel 18/24 Bit, LVDS2: Dual Channel 24 Bit).
The following dual display configurations are possible CRT+LVDS,
CRT+HDMI, HDMI+LVDS, LVDS1+LVDS2. With the onboard
204-pin SODIMM socket up to 4 GB DDR3 system memory are
supported. Furthermore the MS-9896 offers a multitude of other
interfaces like 6 x USB 2.0, 4 x COM (one of them is switchable to
RS232/422/485), 8 GPIOs, 1 x SATA, HD Audio and Dual Gigabit
Ethernet.
Texas Instruments Announce OMAP5432 Processor-Based Evaluation Module
Helping developers jumpstart their product designs, Texas Instruments
introduce its OMAP5432 processor-based evaluation module for
high-performance industrial applications. TI’s OMAP5432 EVM
enables quick, easy evaluation and benchmarking for applications
demanding high-performance processing and graphics at low power, including
human machine interface, portable data terminals, digital signage and medical
monitoring end equipment. Based on the dual-1.5GHz ARM Cortex-A15 MPCore,
the OMAP5432 EVM has the performance to make applications run faster than ever. At
$329 USD, it is a cost-effective tool to prototype software, evaluate applications and benchmark designs. The EVM
gives customers easy access to key interfaces such as Ethernet, USB 3.0, USB 2.0, HDMI, audio I/O and SATA, as well as
expansion ports for multiple display and camera options.
New Development Board For Cypress PSoC
Lattice’s Latest Design Software Enables
3 And PSoC 5LP Architectures
Designers to Derive Big Benefits from Tiny FPGAs
SchmartBoard has expanded its product offering with
a new development board to support users of PSoC
programmable system-on-chip architectures from
Cypress Semiconductor. The board uses SchmartBoard’s
EZ soldering technology to assure fast, easy and
flawless soldering of PSoC 3 or PSoC 5LP silicon onto
the board, or users can purchase one fully populated
with boot-loaded PSoC silicon. Cypress is pleased that
SchmartBoard has added the PSoC 3 and PSoC 5LP
boards into their development board tools, said John
Weil, Senior Director of PSoC Marketing for Cypress’
Programmable Systems Division.
Lattice Semiconductor today announced Lattice Diamond v2.2
software, its flagship FPGA logic design software, and iCEcube2
(v2013-03) software, the company’s design environment for
the iCE40 device family. These new releases support new
additions to Lattice’s ultra-low density FPGA product line that
are ideal for low-power, low-cost, space-constrained systems.
These software releases will also provide access to an array
of additional new Lattice products. Moreover, iCE40 FPGA
designers will now have a choice of synthesis tools to help
achieve their power, space, and cost objectives. The Lattice
iCEcube2 supports the Lattice Synthesis Engine as well as
Synopsys’ Synplify Pro software.
www.electronicspecifier.com
June 2013 43.
product
COMMS,
COMPUTING & CONTROL
World’s First Programmable USB2 Controller Hubs
Microchip Technology announced the expansion of the USB2
Controller Hub portfolio it gained from the recent SMSC acquisition.
The seven new UCH2 ICs across three families are the world’s
first to provide programmability, enabling the developers of PCs
and mobile devices to configure their designs without external
memory. Additionally, these are Microchip’s first UCH2s to support
both USB2 and USB High Speed Interchip connectivity, maximum
battery life via low-power modes such as Link Power Management,
and the ability to replace wall chargers with advanced battery
charging modes, such as BC1.2, Apple, SE1 and China charging. For
applications that need to communicate over multiple protocols,
these UCH2s feature direct I/O bridging to I2C, SPI, UART and general-purpose I/O.
Interface Masters Announces Industry-First High
Port Density 40G PacketMaster For Networkx
Monitoring
Interface Masters Technologies announced a new product to
the PacketMasters line that supports high port density 40Gb
interfaces enabling sophisticated PacketMaster and Hardwarebased Load Balancing functionality. The Niagara 4330-8X
system, which currently holds the highest 40G port density
in the Network Monitoring Switch market today, is built with
30 ports of 40-Gigabit Fiber (QSFP) and 8 ports of 10-Gigabit
Fiber (SFP+, SFP) and complements the PacketMaster family,
enabling filtering, mirroring, sophisticated session-based traffic
distribution and aggregation. Niagara 4330-8X possesses a fullfeatured software suite that can be managed remotely and a
sophisticated WEB GUI.
Kontron drives costs down, performance
densities up for content delivery
applications in the cloud
Kontron announced today that the SYMKLOUD
MS2900 Media platform now supports the newly
released 4th generation Intel Core i7 quad-core
processor. Expected graphics performance levels are
more than double the previous generation with its
integrated Intel Iris Pro graphics 5200. This translates
into a new order of magnitude of efficiency. The
Kontron SYMKLOUD Media platform will be able to
handle massive distributed workloads of content
delivery such as fixed and mobile video transcoding
applications deployed in cloud infrastructure.
Industry’s Highest Performance Small Core x86 Server Processors
AMD unveil a new family of low power server processors: the AMD Opteron X-Series
optimized for scale-out server architectures. The first AMD Opteron X-Series processors,
formerly known as “Kyoto,” are the highest density, most power-efficient small core x86
processors ever built. The new X1150 and X2150 processors beat the top performing
Intel Atom processor on key performance benchmarks, including single thread and
throughput performance with superior power-efficiency, twice the cores and L2 cache
with a more advanced pipeline architecture, higher integration and support for up to 32
gigabytes of DRAM—4x more than the Intel Atom processor.
44. June 2013
www.electronicspecifier.com
product
COMMS,
COMPUTING & CONTROL
Axiomtek Introduces Two New Expandable Industrial Panel Computers
Axiomtek introduced two new expandable industrial panel computers, P1177E-871 (17inch SXGA) and P1157E-871 (15-inch XGA), designed to support the high performance 3rd
Generation Intel Core i7, i5 and i3 processors in LGA1155 socket with the Intel C216 chipset.
The P1177E-871 and P1157E-871 have reserved two PCIe or two PCI slots to fulfill different
application needs. Built around user-convenience, these all-in-one superior touch panel
computers provide a screw-less chassis design. To withstand harsh operating environments,
both units provide protection with aluminum housing and IP65/NEMA 4 sealing and offer
reliable performance and quality. With the new Intel HD 4000 graphics engine, Axiomtek’s
P1177E-871 and P1157E-871 can easily handle the demands of intensive graphical
interfaces or 3D graphics. These high-performing, reliable, and user-friendly touch panel
computers are best suited for factory automation, kiosk, and more industrial fields.
New Powerful and Cost-effective Arrivals in Industrial Computing
The LEC-7950 is a fanless IPC designed for the digital signage market. An upgrade from the previous generation LEC7920, the LEC-7950 offers more power in a smaller form factor. The CPU is now on-board, leading to cost savings over
the older model. The additional Mini-PCIe expansion slot (for a total of two slots) offers even greater scope for device
customization, and the inclusion of an HDMI port and 4 DO ports each supporting 200 mA increases the desirability of
this product for versatile display and signage uses. Another improvement over the previous generation is the provision
of external access to the CF card slot, via a screw cover on the front face of the LEC-7950, allowing for easy change and
maintenance of CompactFlash-based operating systems.
Win a Microchip PICDEM 4 Demo Board!
Electronic Specifier Product is offering its readers the chance to
win a Microchip PICDEM 4 Demonstration Board. The PICDEM
4 is a demonstration and evaluation board for the 8-pin, 14-pin,
and 18-pin general purpose family of products with power
management features.
It comes with two pre-programmed Flash-based
microcontrollers, the PIC18F1320 and PIC16F627A, which
both feature nanoWatt Technology. The demo features many
of the device features and easy peripheral interface. The user
can also take advantage of the Flash-based microcontroller and
its in-circuit debugger capability by cutting, pasting, rewriting
or adding to the program to make their own modification via
MPLAB ICD 2, In-Circuit Debugger, DV164004.
For the chance to win a PICDEM 4, log onto www.microchipcomps.com/esp-picdem4 and enter your details into the online
entry form.
Features Include:
Three different sockets supporting 8-, 14- and 18-pin DIP devices
On-board +5V regulator for direct input from 9V, 100 mA AC/DC
wall adapter
Active RS-232 port
8 LED’s
2 x 16 LCD display
3 push button switches
and master reset
Generous prototyping
area
I/O Expander
Supercapacitor circuitry
Area for a LIN transceiver
Area for a motor driver
MPLAB ICD 2 connector
www.electronicspecifier.com
June 2013 45.
product
ALTERNATIVE
ENERGY
TI Announces Smart Bypass Diode With Industry’s Lowest Power Dissipation
Texas Instruments introduce a smart bypass diode in a standard
surface-mount package with 15-A current handling capability
and the industry’s lowest power dissipation. In a typical
application, each SM74611 lowers power dissipation by 80
percent and reduces the operating temperature inside the
junction box by 50 degrees C when compared with a similar box
using three conventional Schottky diodes. When a photovoltaic
solar panel is shaded, the SM74611 active diode provides an
alternate low-resistance path for string current to prevent hot
spots that can damage the panel.
Thermobility Series Power Generators
Harvest Waste Heat
Laird Technologies has today announced the release of
its new Thermobility Series Wireless Power Generator
product line. The Thermobility Series are self-contained
thin film thermoelectric power generators that harvest
waste heat and convert it to usable output DC power.
Yamaichi Unveil New Field Assembly Y-Sol4
Series F.A.T. Connector Versions
Cost pressure in the photovoltaic industry is increasing. That’s
why Yamaichi Electronics has developed another connector
version for 4 to 6mm² cable cross-sections. They extend the
successful Y-Sol4 F.A.T. product line. The Y-Sol4 F.A.T. has a
spring clamping mechanism for simple clamping of stripped
cable in the field. This permits quick, effective assembly
without crimping. The new versions of the Y-Sol4 F.A.T. are
specifically suited for thin wire outer diameters of 4.5mm to
6.1mm. Thin wires are popular in photovoltaic installations
Due to its compact size, ability to regulate voltage and
today because they are more cost-effective due to material
store power, these products are ideal to power wireless
sensors, low power LEDs or trickle charge batteries where savings. The existing versions continue to cover the range
of larger cable diameters from 6.1mm to 7.6mm. Versions
a heat source is readily available. With their compact
are now also available in the product line for cable crossform factor and ability to harvest energy at the source,
the Thermobility Series can be used in remote or mobile sections from 1.5mm² to 3.5mm². They are used for thin film
installation, for example.
settings where a hard line is difficult to install.
46. June 2013
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ALTERNATIVE
ENERGY
Energy-efficient low-loss inductive components
for solar power inverters
At this year’s Intersolar in Munich, Germany, SMP shows
inductive components or solar power inverters. The chokes
are compact and low-loss with low stray fields and facilitate
outstanding inverter efficiency. The chokes’ cores consist of
powder composites with low magnetostriction, which SMP
Snap-in Power Aluminium Capacitors from
Vishay Targeted at Solar Applications
Vishay have today announced the introduction of a new
series of snap-in power aluminium capacitors with a
rated voltage of 500 V at 50 °C and a category voltage of
450 V at 105 °C. Targeted at solar applications, where the
highest voltage is present under no load conditions, the
193 PUR-SI Solar devices also feature a long useful life
and rated ripple current up to 2.52 A at + 105 °C and 100
Hz. Featuring a cylindrical aluminium case with a pressure
relief valve, insulated with a blue sleeve, the new 193
PUR-SI Solar capacitors are available in five case sizes
ranging from 35 mm by 30 mm to 35 mm by 60 mm.
New Belden Wind Tower Cables Deliver
Maximum Uptime
specifically engineers for solar inverter applications. With the
low eddy current and hysteresis losses of these materials,
the chokes allow the construction of exceptionally efficient
inverters.
Belden has introduced a range of fiber-optic data
transmission cables designed for use in on-shore and
off-shore wind parks in the EMEA region. New torsion
resistant Belden Optical Wind Tower Cables are suited for
use in extremely harsh environments and energy-dense
areas, where they deliver superior data transmission
performance for maximum reliability and uptime of wind
Customised ATE Based on Programmable
Power Supplies
National Instruments has announced its newest generalpurpose programmable power supplies, which offer
the highest power density available in PXI and form the
foundation of automated test systems. The NI PXIe-4112
and NI PXIe-4113 modules provide high power density that
saves rack space while simplifying design by eliminating the
need to mix multiple instrumentation form factors. When
programmed with NI LabVIEW software and paired with
a range of PXI hardware instrumentation, the new power
supplies can help engineers create a complete, customised
test solution. The new programmable power supplies are
ideal for a range of applications from aerospace and defence
to automotive and component test. These modules feature
two 60W power supply channels in a single PXI Express slot.
parks. Halogen-free Belden Optical Wind Tower Cables
can make a significant contribution to the efficiency of
individual wind turbines and the quality of installation
and maintenance of the overall wind park as well as
maximum safety and security.
www.electronicspecifier.com
June 2013 47.
product
OPTOELECTRONICS
LDD-HS/LS Series SMD Type DC-DC
Constant Current LED Driver from
MEANWELL
Fairchild Semiconductor’s High-Speed Logic
Gate Optocoupler Meets Higher Isolation
Requirements in a New Wide Body 5-Pin SOP
After the launch of LDD-H/HW and LDD-L/LW series,
MEAN WELL further announced two kinds of DC-DC
Buck converter with constant current output for LED
driving purpose LDD-HS and LDD-LS series. With SMD
package, they are suitable to be mounted by surface
mounted-process (SMT) on the system PCB of lighting
Designers working with industrial applications need to transmit
high speed data reliably in environments where noise – in
the form of voltage transients and ground loop currents –
is common. They also need to meet stringent new safety
standards,
such as IEC62109, the
international
standard
for solar
inverters.
At the
same time,
designers
need
solutions
that are
flexible,
and that take up less board space while reducing bill of
material costs. To meet this challenge, Fairchild Semiconductor
developed the FOD8160, a high noise immunity logic gate
optocoupler with Optoplanar technology in a wide body 5-pin
small outline package (SOP). The FOD8160 allows designers
the flexibility of incorporating the isolation on the high voltage
side of the circuit, or replacing two smaller creepage/clearance
distance digital isolators or optocouplers.
fixture and save the labour cost of installation. LDD-HS
features with 9~56VDC input and 2~52VDC output
range while LDD-LS possesses range of 9~32VDC input
and 2~28VDC output. Both series provide multiple
output current options of 300mA/ 350mA/ 500mA/
600mA/ 700mA/ 1000mA for LED system designers to
choose from. MEAN WELL currently can offer the DCDC LED drivers in three different package types.
Photocouplers Optimised for Mid-Speed Communications with Data Rates of 20kbps ~
100kbps
Toshiba Electronics Europe has announced two new
photocouplers that are optimised for RS-232 and RS232-C
communications. The TLP2301 and TLP2303 address emerging
requirements for devices that fill the ‘price/performance gap’
between general-purpose transistor couplers and IC couplers
operating from 1Mbps. Target applications will include factory
automation and other industrial systems, appliances, smart
metering and building automation. Toshiba’s TLP2301 offers
transmission rates up to 20kbps, allowing it to support the lowspeed 9.6kbps or 19.2kbps of RS-232 communications.
48. June 2013
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product
OPTOELECTRONICS
New High-Speed 850 nm and 940 nm IR
Emitters and Package-Matched High-Speed
Silicon PIN Photodiode
Vishay Intertechnology Inc today broadens its
optoelectronics portfolio with the introduction of two new
high-speed 850 nm and 940 nm infrared emitters and a
package-matched high-speed silicon PIN photodiode with
high radiant sensitivity from 780 nm to 1050 nm. The
VSMG10850, VSMB10940 and VEMD10940F offer an
ultra-wide ± 75° angle of half intensity in a compact sideview surface-mount package measuring 3 mm by 2 mm
and a height of only 1 mm.
High Power Laser Diode with Internal
Monitor Photodiode at 637nm
Oclaro’s HL63142DG high power red laser diode is the first
ever high power laser diode to offer an inbuilt monitor
photodiode at a lasing wavelength of 637nm. It is a
unique design which enables system designers to control
optical power output by monitoring the photodiode
current and adjusting power variants and temperature for
precise control and constant performance. Performance
monitoring capabilities are essential for maintaining
constant laser output in situations which are subject to
fluctuations in temperature and operating environment
such as the construction industry and biomedical
applications.
Ophir Extends Image Processing Capabilities of
Laser Beam Profiling Software
BeamGage is a state-of-the-art beam profiling system that
performs rigorous data acquisition and analysis of laser
beam parameters, such as beam size, shape, uniformity,
divergence,
mode content,
and expected
power
distribution.
The new
version adds
Custom
Computations
to expand the
software’s
image
processing
capabilities,
allowing laser
manufacturers and researchers to easily import their own
custom algorithms created in C#/.NET. Once imported,
users can apply BeamGage’s more than 55 advanced
measurement and statistical analysis functions including
fast, off-axis correction of distorted beam images; trend
charting; data logging; power/energy calibration; and pass/
fail production testing.
TI introduces industry-leading LED drivers for high-performance lighting
Texas Instruments Incorporated today introduced three
new DC/DC LED drivers that simplify white color tuning for
high-color rendering and ultra-low dimming in professionalgrade indoor and outdoor LED lighting applications.
The TPS92660 two-string LED driver and TPS92640/1
synchronous buck controllers address the challenges of
precise color and brightness control lighting that designers
face in creating high quality light engines for commercial
area lighting, including architectural and retail displays,
as well as LED-based projection systems and automotive
running lights.
www.electronicspecifier.com
June 2013 49.
product
AUTOMOTIVE
Portfolio of automotive-grade C0G mid-voltage MLCCs expanded
TDK Corporation has expanded
MLCCs with new mid-voltage types
rated voltages from 100 V to 630 V.
capacitance values that are very high
(EIA 2220) MLCC with dimensions of
and is rated for 630 V, which is the
this size and capacitance.* The new
operating temperatures of up to 125
its leading portfolio of automotive-grade
featuring C0G temperature characteristics and
The new components in the CGA series offer
for C0G components. In particular, the IEC 5750
5.7 mm x 5.0 mm has a capacitance of 100 nF
world’s highest voltage rating for a capacitor of
high reliability components are designed for
°C, and are qualified to AEC-Q200.
Industry’s Highest Voltage Rating In
Next-Generation Automotive LED Drivers
Texas Instruments Incorporated today introduced the
next-generation AEC-Q100 qualified automotive LED
drivers, feature-packed with the industry’s highest
voltage rating, thermal shutdown protection and
optimized electromagnetic compatibility (EMC)
performance. In harsh automotive environments,
the electronics must endure high temperatures, high
voltage transient and electromagnetic interference.
It is crucial for the devices to survive such conditions
while reducing electromagnetic emissions. The
TLC6C598-Q1 and TLC6C5912-Q1 are monolithic,
medium-voltage, low-current 8-bit/12-bit shift
registers designed for use in systems that require
relatively moderate load power, such as LEDs. The
TLC6C598-Q1 and TLC6C5912-Q1 are designed for
automotive dashboard applications.
Mitsubishi Electric to Release New Higher Current
Automotive IPMs of the J-Series
Mitsubishi Electric Corporation will announce on Power
Conversion Intelligent Motion (PCIM) Europe 2013 on May 1416 in Nuremberg, Germany, the development of higher current
rated intelligent power modules (IPMs) mainly for electric- (EV)
and hybrid vehicle
(HV) applications. Two
new models of the
J-Series in 3-phase
inverter configuration
(6 in 1) will be
introduced, based on
low-loss CSTBTTM
chip technology.
PM800CJG060G is combining a rating of 600V/800A with a low
saturation voltage of typically 1.8V at Tj=25°C. First samples will
be available from August 2013 onwards.
Melexis Further Expands LIN Transceiver Offering with New Device That Exhibits Strong EMC/
ESD Behavior
Automotive specialist Melexis, has added to its portfolio of devices
supporting the local interconnect network (LIN) bus. The new
MLX80030, which comes in a compact SOIC8 package, is 3rd
member of the company’s next generation of system basis ICs that
enable simple and effective development of LIN slaves. Pin-to-pin
compatible with established LIN devices, such as the ATA6623/29
and TJA1028, this IC combines a physical layer LIN transceiver
(according to LIN 2.x and SAEJ2602) with a 3.3V voltage regulator
that has a RESET output for the system microcontroller.
50. June 2013
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AUTOMOTIVE
Infineon announces early samples of EiceDRIVER SIL and EiceDRIVER Boost IGBT Drivers
Infineon have introduced its next generation of high-voltage
IGBT gate drivers. Designed for the main inverter of hybrid
and electric vehicles (HEV), the new EiceDRIVER SIL and
the EiceDRIVER Boost drivers enable automotive system
suppliers to more easily and more cost-effectively design
HEV drivetrain subsystems that are compliant with ASIL
C/D functional safety requirements (ISO 26262). Target
applications of the new EiceDRIVERs are HEV inverters of up
to 120kW using 400V, 600V and 1200V IGBTs. Early samples
of the EiceDRIVER SIL and EiceDRIVER Boost are available
with broad sampling planned as of December 2013.
ERNI Electronics Extends Portfolio of
PowerElements for the Automotive Industry
NXP’s Mantis Family Sets New Standard in CAN
Transceiver Market
Within the scope of its BLUEcontact Solutions, ERNI
Electronics has extended its offering of versatile
PowerElements for the automotive industry. The portfolio
of PowerElements with a combined flexible/massive
Building on its industry-leading position in in-vehicle
networking (IVN), NXP Semiconductors N.V. today
introduced Mantis, a new family of HS-CAN transceivers.
Mantis (TJA1044T and TJA1057T) and Mantis GT
(TJA1044GT and TJA1057GT) offer a feature set targeting
12 V automotive applications and deliver excellent EMC
performance, with the high-end “GT” variant guaranteeing
critical parameters for CAN FD (Flexible Data rate) networks.
All members of the Mantis family are dual-sourced from
locations in the Netherlands and Singapore to provide an
agile, high-capacity and secure manufacturing base.
press-fit zone has been extended with variants with purely
massive press-fit contacts. In doing this, ERNI is further
extending its services and portfolio of key components
for automotive customers on the basis of its wealth of
expertise in the field of connectors and board design.
The company is focussing on the areas driver’s cab,
exterior and the motor periphery of buses, construction
equipment, trucks, tractors and towing vehicles, etc. For
these applications, ERNI offers its extensive know-how
in press-fit technology, in PCB assembly and as an EMS
service provider to ensure reliable connections also at high
currents.
Synopsys Announces Virtualizer Development
Kit for Freescale’s Qorivva MCU Family
Synopsys announce the availability of Synopsys’ Virtualizer
Development Kit for Freescale Semiconductor’s Qorivva
microcontroller family to accelerate the development of
automotive control applications in powertrain/hybrid,
chassis/safety and body electronic control units. The VDK for
Freescale’s Qorivva MCU family is a software development
kit that includes: virtual prototypes of the Qorivva MCU
family; software development tools; built-in support for
integration with Mathworks’ Simulink, Synopsys’ Saber
and Vector’s CANoe simulation tools; and sample code and
scripts supporting a broad range of automotive software
development use cases.
www.electronicspecifier.com
June 2013 51.
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