NJL6401R-3
COBP High Speed Photo Diode
GENERAL DESCRIPTION
The NJL6401R-3 is a high-speed PIN photodiode capable of detecting in a wide wavelength range of up to
infrared light from the blue-violet light.
The features are low wavelength dependence and fast fall-time.
An ultra-small and thin package of COBP is adopted, and providing high efficient space-saving.
.
FEATURES
• Corresponding to three wavelength (=405nm/650nm/780nm)
• Short rise-time, fall-time
2ns typ. (=405nm/650nm/780nm, VR=2.5V, 10-90%)
• High speed
250MHz ( =780nm)
300MHz ( =650nm)
350MHz ( =405nm)
• Miniature, thin package
• Active area
1.2mmX1.7mmX0.8mm
0.7mmX0.7mm
APPLICATIONS
• Laser monitor for Blu-ray, etc.
• Monitor for RGB wavelength
• Photoelectric switch, Space light transmitting, etc.
ABSOLUTE MAXIMUM RATINGS (Ta=25C)
PARAMETER
Reverse Voltage
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
SYMBOL
VR
Topr
Tstg
Tsol
RATINGS
35
-30 to +85
-40 to +100
255
UNIT
V
C
C
C
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25C)
PARAMETER
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
SYMBOL
ID
VF
Ct
P
S
Rise time, Fall time
tr/tf
Cut off Frequency
fc
TEST CONDITION
VR=10V
IF=1mA
VR=2.5V, f=1MHz
—
VR=2.5V, =780nm
VR=2.5V, =650nm
VR=2.5V, =405nm
VR=2.5V, =780nm, 10-90%, 1mW
VR=2.5V, =650nm, 10-90%, 1mW
VR=2.5V, =405nm, 10-90%, 1mW
VR=2.5V, =780nm, RL=50-3dB
VR=2.5V, =650nm, RL=50-3dB
VR=2.5V, =405nm, RL=50-3dB
MIN
—
—
—
—
0.37
0.34
0.22
—
—
—
—
—
—
TYP
0.1
—
4
800
0.47
0.42
0.28
2
2
2
250
300
350
MAX
2.0
1.0
—
—
—
—
—
—
—
—
—
—
—
UNIT
nA
V
pF
nm
A/W
A/W
A/W
ns
ns
ns
MHz
MHz
MHz

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NJL6401R-3
Unit : mm
Anode
1
2
0.8±0.15
0.45
1
0.08
0.35
1.2
0.12
0.4
（0.28）
0.45
Resist
0.12
（0.2）
0.08
Active area: 0.7x0.7mm
1.7
OUTLINE
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Cathode
GENERAL TOLERANCE : ± 0.1mm
0.54
0.56
1.16
0.56
1: anode
2: cathode
PCB Pattern
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NJL6401R-3
TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25C)
Spectral Response (Ta=25C)
1.00E-03
100%
VR=2.5V
90%
1.00E-04
80%
λ=650nm,780nm
Relative Sensitivity(%)
Light Current IL(A)
70%
λ=405nm
1.00E-05
1.00E-06
60%
50%
40%
30%
20%
1.00E-07
10%
1.00E-08
0.01
0.1
1
10
0%
300
100
400
500
600
700
800
900
1000
Wavelength(nm)
Illuminance (mW/cm2)
Dark Current vs. Temperature
Relative Sensitivity vs. Temperature
1.00E-08
105%
VR=2.5V
VR=2.5V
104%
1.00E-09
Relative Sensitivity(%)
Dark Current ID(A)
1.00E-10
1.00E-11
1.00E-12
103%
λ=780nm
102%
λ=405nm
101%
λ=650nm
100%
99%
98%
97%
1.00E-13
96%
1.00E-14
-40
95%
-20
0
20
40
60
80
100
-40
-20
0
Ambient Temperature Ta(ºC)
20
40
80
100
Rise Time vs. Reverse Voltage (Ta=25C)
Fall Time vs. Reverse Voltage (Ta=25C)
5.0
5.0
RL=50Ω
RL=50Ω
4.0
4.0
λ=780nm
λ=780nm
3.0
Fall Time(ns)
Rise Time(ns)
60
Ambient Temperature Ta(ºC)
λ=405nm,650nm
2.0
1.0
3.0
λ=405nm,650nm
2.0
1.0
0.0
0.0
0
1
2
3
VR(V)
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4
5
0
1
2
3
4
5
VR(V)
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NJL6401R-3
Relative Sensitivity vs. Frequency (Ta=25C)
Capacitance vs. Reverse Voltage (Ta=25C)
10
0
9
VR=2.5V,RL=50Ω
-1
8
Capacitance Cj(pF)
Relative Sensitivity (dB)
7
λ=780nm
-2
λ=650nm
-3
λ=405nm
6
5
4
3
-4
2
-5
1
0
-6
1
10
100
0
1000
1
2
3
4
5
Reverse Voltage VR(V)
Frequency (MHz)
MEASURING CIRCUIT FOR RESPONSE TIME
Oscilloscope
Pulse
Generator
Input
90%
50
Laser
NJL6401R-3
Output
10%
tr
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tf
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NJL6401R-3
 MOUNTING METHOD
NOTE
Mounting was evaluated with the following profiles in our company, so there was no problem.
However, confirm mounting by the condition of your company beforehand.
The exposure of device under higher temperature many affect to the reliability of the products, it is recommended
to complete soldering in the shortest time possible.
Mounting:
Twice soldering is allowed.
 INFRARED REFLOW SOLDERING METHOD
Recommended reflow soldering procedure
e
255C
230C
180C
150C
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : Mounting temperature
time
e : Peak temperature
: 1 to 4C/s
: 150 to 180C
: 60 to 120s
: 1 to 4C /s
: 230C
: 20 to 40s
: Lower than 255C
f : Temperature ramping rate
: 1 to 6C /s
The temperature indicates at the surface
of mold package
Room
Temp.
a
b
c
d
f
(NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp
Regarding temperature profile, please refer to those fo reflow furnace.
In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored
mold resin. Therefore, please avoid from direct exposure to mold resin.
(NOTE2) Other method
Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate
because the body of device will be heated rapidly. Therefore, these are not recommended to apply.
(NOTE3) The resin gets softened right after soldering, so, the following care has to be taken
Not to contact the lens surface to anything.
Not to dip the device into water or any solvents.
 FLOE SOLDERING METHOD
Flow soldering is not possible.
 IRON SOLDERING METHOD
Iron soldering is not possible.
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NJL6401R-3
 CLEANING
When Cleaning is needed the following conditions are recommended as the ultrasonic cleaning:
Solvent : isopropyl alcohol
Frequency: 40kHz
Power: 30W/ ℓ
Temperature: Lower than 50C
Time: Shorter than 300s
Cleaning: Once
(NOTE1) Do not resonate the products.
(NOTE2) Do not touch the products or their mounted board directly to the vibrator.
(NOTE3) Do not clean the product immediately after the reflow.
(NOTE4) A void the solvent or the vapor solvent from the resin of the device even during the mounting and using.
 IC STORAGE CONDITIONS AND ITS DURATION
(1) Temperature and humidity ranges
Pack Sealing
Temperature:
Humidity:
Pack Opening
Temperature:
Humidity:
5 to 40 [C]
40 to 80 []
5 to 30 [C]
40 to 70 []
After opening the bag, solder products within 48 hours.
Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge.
Store the products in the place where it does not create dew with the products due to a sudden change in temperature.
(2) When baking, place the reel vertically to avoid load to the side.
(3) Do not store the devices in corrosive-gas atmosphere.
(4) Do not store the devices in a dusty place.
(5) Do not expose the devices to direct rays of the sun.
(6) Do not allow external forces or loads to be applied to IC’s.
(7) Be careful because affixed label on the reel might be peeled off when baking.
(8) The product is recommended to do the baking before using for the stability of the quality.
 BAKING
In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape)
Baking method: Ta=60C, 48 to 72h, Three times baking is allowed
Ta=100C, 2 to 6h, Three times baking is allowed
 STORAGE DURATION
Within a year after delivering this device.
For the products stored longer than a year, confirm their terminals and solderability before they are used.
 APPLICATION NOTES
When using the laser diode in the vicinity of =405nm, there is the restriction in terms of use.
Please be careful in the case of the use.
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NJL6401R-3
PACKING SPECIFICATION
PACKING DIMENTIONS
UNIT : mm
Drawing direction
P2
Insert direction
SIMBOL
D0
P0
A
T0
B
D0
D1
E
E
F
W0
P1
P2
B
(TE1)
W1
F
P0
T0
T1
W0
P1
A
T1
D1
W1
DIMENSION
1.40
2.00
1.50
1.10
1.75
3.50
4.00
4.00
2.00
0.25
1.05
8.00
5.40
±0.10
±0.10
REMARKS
BOTOM DIMENSION
BOTOM DIMENSION
+0.10
-0.0
±0.10
±0.10
±0.05
±0.10
±0.10
±0.05
±0.05
±0.10
±0.30
±0.10
THICKNESS 0.1MAX
* Carrier tape material : Polycarbonate(antistatic)
Cover tape material : Polyester(antistatic)
Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength
Is to be within the power of 20 to 40g.
Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start rolling
: Carrier tape open space more than 20 Pieces.
2-2) End of rolling
: Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity
: 2,000 Pieces
4) Seal off after putting each reels in a damp proof bag with silica gel.
E
A
B
D
C
SIMBOL
DIMENSION
A
φ180.0±1.0
B
φ60.0±1.0
C
φ13.0±0.2
D
φ21.0±0.8
E
2.0±0.5
W0
9.5±1.0
W1
13.1±1.0
* Reel material : PPE(antistatic)
W0
W1
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
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