L O W- S I D E G AT E D R I V E R I C S F R O M 2 A T O 1 4 A
N
E
W
P
R
O
D
U
C
T
B
R
I
E
F
Low-Side Gate Driver ICs from 2A to 14A
NEXT GENERATION IXD_5XX LOW-SIDE GATE DRIVERS WITH IMPROVED
COST-EFFICIENCY, CIRCUIT DENSITY AND RUGGEDNESS FOR MOSFETs AND IGBTs
Features
Applications
•
•
•
•
•
Diverse choice of single and dual outputs, with extensive mix of logic,
packaging and output currents
Enable options for fast, controlled shutdown
Rated for operation from 4.5V to 35V and -55ºC to +125ºC
Multiple packaging options, including high density 6-Lead DFN
No internal cross conduction, output rise and fall times of 25ns maximum
•
•
•
•
Industrial – Inverters, Motor Drives, Welding
Consumer – LCD TV, Audio Amplifiers
Power Conversion – SMPS, UPS, PFC
Actuators – Relays, Solenoids
Block Diagrams
IXD(D,E)504 Block Diagram
IXD(F,I,N)502, IXD(F,I,N)504 Block Diagram
Vcc
IXDN
July 2006
IN A
Description
IXDI
IXDF
IXYS’ new family of high performance Gate Driver ICs raises the “industry benchmark” for
superior toughness and reliability. IXYS has long enjoyed a reputation for producing the most
rugged and dependable Power MOSFETs and IGBTs available, and now IXYS engineers are
proud to introduce the most rugged and dependable Gate Driver ICs available.
Power System Designers are well aware that the voltage and current spikes inherent in Power
Supply and Motor Control circuits demand the use of highly reliable and robust Gate Driver
ICs. IXYS’ new IXD_5XX family has been designed using the latest proprietary processes and
design innovations in order to achieve a remarkably strong resistance to noise, coupled with
greatly enhanced immunity to latch-up. Furthermore, these advanced Gate Drivers include
IXYS’ traditional patented* drive stage design features that eliminate internal Cross-Conduction.
Additional advantages include “extended” operating voltage range (up to 35V), and “extended”
operating temperature range (-55°C to +125°C). User logic options include versions which
incorporate an Enable function for fast output shutdown. Further enhancing the value is the
inclusion of a high-density DFN package option, occupying less than 65% of the board area of a
typical 8-pin SOIC, available over the entire range of drive currents.
8-Pin SOIC (SIA)
IXDN
IN B
IXDI
IXDF
GND
Anti-Cross
Conduction
Circuit*
OUT B
or OUT B
EN A
IXDD
IXDE
IN B
EN B
Anti-Cross
Conduction
Circuit*
OUT A
or OUT A
Anti-Cross
Conduction
Circuit*
OUT B
or OUT B
GND
IXD(I, N)509, IXD(I, N)514 Block Diagram
Vcc
Vcc
Vcc
Vcc
8-Pin PDIP (PI)
IXDD
IN
6-Lead DFN (D1)
IXDN
Anti-Cross
Conduction
Circuit*
IXDE
EN
OUT
or OUT
Anti-Cross
Conduction
Circuit*
IN
IXDI
GND
GND
OUT
or OUT
GND
GND
* United States Patent 6,917,227
8-Lead DFN (D2)
Case Drawings
8-Pin SOIC
* United States Patent 6,917,227
8-Pin DPIP
D
8
7
6
DIM
5
E
1
IPK @ TC = 25°C
2 A, Dual
4 A, Dual
4 A, Dual
9 A, Single
14 A, Single
Logic Configuration(1)
F, I, N
F, I, N
D, E
D, E, I, N
D, E, I, N
Package(2)
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D2, D2T/R
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D1, D1T/R
Configuration
Non-Inverting + Enable
Inverting + Enable
Non-Inverting and Inverting
Designation
I
N
Configuration
Inverting
Non-Inverting
Package
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
8-Lead DFN
8-Lead DFN
Packing Style
Tube
Tube
13" Tape and Reel
Bulk
13" Tape and Reel
Bulk
13" Tape and Reel
Pack Qty
50
94
2500
1500
2500
1500
2500
2
4
DIMENSIONS 1
SUMMARY TABLES FOR 50x LOW-SIDE GATE DRIVER FAMILY
Logic Configurations
Designation
D
E
F
Package Details
Designation
PI
SIA
SIAT/R
D1
D1T/R
D2
D2T/R
OUT A
or OUT A
IXD(D,E)509, IXD(D,E)514 Block Diagram
With current ratings from 2A to 14A, with a complete set of logic level control and packaging
options, this new family of IXD_5XX Gate Driver ICs offers superior performance, improved
cost effectiveness, greater circuit density and unsurpassed ruggedness!
Part Numbers and Configurations
Part Number
IXD(1)502(2)
IXD(1)504(2)
IXD(1)504(2)
IXD(1)509(2)
IXD(1)514(2)
Anti-Cross
Conduction
Circuit*
Vcc
IXDD
IXDE
IN A
3
K
H
C
L
4
F
A1
JX45º
A
A1
B
C
D
E
F
H
J
K
L
INCHES
MIN
MAX
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.1890
.1968
.1497
.1574
.050 BSC
.2440
.2284
.0099
.0196
0º
8º
.016
.050
MILLIMETERS
MIN
MAX
1.35
1.75
.10
.25
.33
.51
.19
.25
4.80
5.00
3.80
4.00
1.27 BSC
6.20
5.80
0.25
.50
0º
8º
.40
1.27
A
TOP VIEW
E
1
SYM
––––
––––
––––
––––
E1
2
2
5
––––
––––
––––
––––
––––
6
7
eA
eB
8
D
A2 A
A1
L
D1
b3
6-Lead DFN
2
NOTE
3. MOLDED PACKAGE SHALL CONFORM TO JEDEC STANDARD
CONFIGURATION MS-012 VARIATION AA
2 DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS.
1 CONTROLLING DIMENSIONS: MILLIMETERS
NOTES: (UNLESS OTHERWISE SPECIFIED)
B
3
e
c
A
A1
A2
b
b2
b3
c
D
D1
E
E1
e
eA
eB
L
INCHES
MIN MAX
.140
.180
.015
.040
.125
.145
.015
.020
.055
.065
.035
.045
.009
.012
.400
.355
.010
.040
.300
.325
.240
.270
.100 BSC
.300 BSC
.300 .430
.120
.140
MILLIMETERS
MIN
MAX
3.56
4.57
0.38
1.02
3.18
3.68
0.38
0.51
1.40
1.65
0.89
1.14
0.23
0.30
10.16
9.02
0.25
1.02
7.62
8.26
6.10
6.86
2.54 BSC
7.62 BSC
7.62
10.92
3.05
3.56
NOTE: THIS DRAWING MEETS ALL REQUIREMENT OF
JEDEC OUTLINES MS-001 BA.
b
b2
8-Lead DFN
SIDE
BOTTOM VIEW
TOP VIEW
IXYS Semiconductor GmbH
Edisonstr.15 • D-68623 Lampertheim
Telfon: +49-62 06-503-0 • Fax: +49-62 06-503 627
e-mail: marcom@ixys.de
Efficiency Through Technology
SIDE
BOTTOM VIEW
IXYS Corporation
3540 Bassett Street • Santa Clara CA 95054
Phone: (408) 982-0700 • Fax: (408) 496-0670
email: sales@ixys.net
L O W- S I D E G AT E D R I V E R I C S F R O M 2 A T O 1 4 A
N
E
W
P
R
O
D
U
C
T
B
R
I
E
F
Low-Side Gate Driver ICs from 2A to 14A
NEXT GENERATION IXD_5XX LOW-SIDE GATE DRIVERS WITH IMPROVED
COST-EFFICIENCY, CIRCUIT DENSITY AND RUGGEDNESS FOR MOSFETs AND IGBTs
Features
Applications
•
•
•
•
•
Diverse choice of single and dual outputs, with extensive mix of logic,
packaging and output currents
Enable options for fast, controlled shutdown
Rated for operation from 4.5V to 35V and -55ºC to +125ºC
Multiple packaging options, including high density 6-Lead DFN
No internal cross conduction, output rise and fall times of 25ns maximum
•
•
•
•
Industrial – Inverters, Motor Drives, Welding
Consumer – LCD TV, Audio Amplifiers
Power Conversion – SMPS, UPS, PFC
Actuators – Relays, Solenoids
Block Diagrams
IXD(D,E)504 Block Diagram
IXD(F,I,N)502, IXD(F,I,N)504 Block Diagram
Vcc
IXDN
July 2006
IN A
Description
IXDI
IXDF
IXYS’ new family of high performance Gate Driver ICs raises the “industry benchmark” for
superior toughness and reliability. IXYS has long enjoyed a reputation for producing the most
rugged and dependable Power MOSFETs and IGBTs available, and now IXYS engineers are
proud to introduce the most rugged and dependable Gate Driver ICs available.
Power System Designers are well aware that the voltage and current spikes inherent in Power
Supply and Motor Control circuits demand the use of highly reliable and robust Gate Driver
ICs. IXYS’ new IXD_5XX family has been designed using the latest proprietary processes and
design innovations in order to achieve a remarkably strong resistance to noise, coupled with
greatly enhanced immunity to latch-up. Furthermore, these advanced Gate Drivers include
IXYS’ traditional patented* drive stage design features that eliminate internal Cross-Conduction.
Additional advantages include “extended” operating voltage range (up to 35V), and “extended”
operating temperature range (-55°C to +125°C). User logic options include versions which
incorporate an Enable function for fast output shutdown. Further enhancing the value is the
inclusion of a high-density DFN package option, occupying less than 65% of the board area of a
typical 8-pin SOIC, available over the entire range of drive currents.
8-Pin SOIC (SIA)
IXDN
IN B
IXDI
IXDF
GND
Anti-Cross
Conduction
Circuit*
OUT B
or OUT B
EN A
IXDD
IXDE
IN B
EN B
Anti-Cross
Conduction
Circuit*
OUT A
or OUT A
Anti-Cross
Conduction
Circuit*
OUT B
or OUT B
GND
IXD(I, N)509, IXD(I, N)514 Block Diagram
Vcc
Vcc
Vcc
Vcc
8-Pin PDIP (PI)
IXDD
IN
6-Lead DFN (D1)
IXDN
Anti-Cross
Conduction
Circuit*
IXDE
EN
OUT
or OUT
Anti-Cross
Conduction
Circuit*
IN
IXDI
GND
GND
OUT
or OUT
GND
GND
* United States Patent 6,917,227
8-Lead DFN (D2)
Case Drawings
8-Pin SOIC
* United States Patent 6,917,227
8-Pin DPIP
D
8
7
6
DIM
5
E
1
IPK @ TC = 25°C
2 A, Dual
4 A, Dual
4 A, Dual
9 A, Single
14 A, Single
Logic Configuration(1)
F, I, N
F, I, N
D, E
D, E, I, N
D, E, I, N
Package(2)
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D2, D2T/R
PI, SIA, SIAT/R, D1, D1T/R
PI, SIA, SIAT/R, D1, D1T/R
Configuration
Non-Inverting + Enable
Inverting + Enable
Non-Inverting and Inverting
Designation
I
N
Configuration
Inverting
Non-Inverting
Package
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
8-Lead DFN
8-Lead DFN
Packing Style
Tube
Tube
13" Tape and Reel
Bulk
13" Tape and Reel
Bulk
13" Tape and Reel
Pack Qty
50
94
2500
1500
2500
1500
2500
2
4
DIMENSIONS 1
SUMMARY TABLES FOR 50x LOW-SIDE GATE DRIVER FAMILY
Logic Configurations
Designation
D
E
F
Package Details
Designation
PI
SIA
SIAT/R
D1
D1T/R
D2
D2T/R
OUT A
or OUT A
IXD(D,E)509, IXD(D,E)514 Block Diagram
With current ratings from 2A to 14A, with a complete set of logic level control and packaging
options, this new family of IXD_5XX Gate Driver ICs offers superior performance, improved
cost effectiveness, greater circuit density and unsurpassed ruggedness!
Part Numbers and Configurations
Part Number
IXD(1)502(2)
IXD(1)504(2)
IXD(1)504(2)
IXD(1)509(2)
IXD(1)514(2)
Anti-Cross
Conduction
Circuit*
Vcc
IXDD
IXDE
IN A
3
K
H
C
L
4
F
A1
JX45º
A
A1
B
C
D
E
F
H
J
K
L
INCHES
MIN
MAX
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.1890
.1968
.1497
.1574
.050 BSC
.2440
.2284
.0099
.0196
0º
8º
.016
.050
MILLIMETERS
MIN
MAX
1.35
1.75
.10
.25
.33
.51
.19
.25
4.80
5.00
3.80
4.00
1.27 BSC
6.20
5.80
0.25
.50
0º
8º
.40
1.27
A
TOP VIEW
E
1
SYM
––––
––––
––––
––––
E1
2
2
5
––––
––––
––––
––––
––––
6
7
eA
eB
8
D
A2 A
A1
L
D1
b3
6-Lead DFN
2
NOTE
3. MOLDED PACKAGE SHALL CONFORM TO JEDEC STANDARD
CONFIGURATION MS-012 VARIATION AA
2 DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS.
1 CONTROLLING DIMENSIONS: MILLIMETERS
NOTES: (UNLESS OTHERWISE SPECIFIED)
B
3
e
c
A
A1
A2
b
b2
b3
c
D
D1
E
E1
e
eA
eB
L
INCHES
MIN MAX
.140
.180
.015
.040
.125
.145
.015
.020
.055
.065
.035
.045
.009
.012
.400
.355
.010
.040
.300
.325
.240
.270
.100 BSC
.300 BSC
.300 .430
.120
.140
MILLIMETERS
MIN
MAX
3.56
4.57
0.38
1.02
3.18
3.68
0.38
0.51
1.40
1.65
0.89
1.14
0.23
0.30
10.16
9.02
0.25
1.02
7.62
8.26
6.10
6.86
2.54 BSC
7.62 BSC
7.62
10.92
3.05
3.56
NOTE: THIS DRAWING MEETS ALL REQUIREMENT OF
JEDEC OUTLINES MS-001 BA.
b
b2
8-Lead DFN
SIDE
BOTTOM VIEW
TOP VIEW
IXYS Semiconductor GmbH
Edisonstr.15 • D-68623 Lampertheim
Telfon: +49-62 06-503-0 • Fax: +49-62 06-503 627
e-mail: marcom@ixys.de
Efficiency Through Technology
SIDE
BOTTOM VIEW
IXYS Corporation
3540 Bassett Street • Santa Clara CA 95054
Phone: (408) 982-0700 • Fax: (408) 496-0670
email: sales@ixys.net