A New Paradigm of Raw Material Management in Advanced Technology Nodes C. Joe Wu, Nano-Materials Center, TSMC Paradigm •A distinct set of concepts or thought patterns. •A group of ideas and models (in material management term) Raw Materials = Semiconductor Processing Materials (LTH, CMP, Chemicals, PVD/CVD target/gas/precursors…) Agenda •Technology Trend and Material Challenges •Driving for Win-Win Solutions •Summary Consequence of EUV (or other NGL) delay •Path for N10 and beyond not clear! Process complexity and Material cost are going up! •Congratulations! We are all in this together. ITRS Roadmap New Engines for Moore’s Law •Materials, Designs, and Software - Chris Mack, 2012 Prod. Dev. Cycle Landscape Changing •Used to be: 24-48 months of technology production Ramp curve… Source: ITRS roadmap Prod. Dev. Cycle Getting Shorter •Aggressive customer schedules –Development cycle (ramp, C/T, D0) being squeezed –Overlap of tech phases stretching resource D0 •Shortened learning cycles -> Increased risks Schedule Raw Material Challenges •No time and resource- aggressive schedule, surprise prone •Metrology/Process gap- see what we see, feel how we feel •Downstream material quality management –Technology: convoluted Material/ Process/ Tool interaction –Logistic: from Sub-supplier, Supplier- Fac- Tool- Wafer defect/yield •Change management- supplier + sub-suppliers risk/quality management •Filtration/purification requirement - how small is too small, how much is too much? effective filter COA Driving for Win-Win Solutions •There must be a better way of doing business with us •So how do we go from here, To here? Driving for win-win solutions •Engagement –Metrology roadmap: •aligning Resources and Focuses –Integrated data stream (Big data analysis): •Transparency and Collaboration Bridging Metrology/Process Control Gaps •Concerns on lack of correlation between CoA items and chipmakers’Key Parameters Indices (defect/uniformity/yield) Chipmakers: Trend QC baseline concern, Improvement opportunity Supplier: Noise Nuisance if COA within Ship to Control limit Chipmaker’s inline Particle monitor trend chart Metrology Challenges •PPT level detection- capability and reliability 20nm Challenge of finding 25 NT$5 coins Between Taipei and Kaohsiung Metrology Challenges •PPT level detection- capability and reliability •Metrology correlation- e.g. Particles vs. metallic •Mind set- trend vs. noise 20nm Need engagement with TSMC to generate a clear metrology roadmap for aligning and prioritize resources Opportunity: •Huge payoff if we figure out how to collaborate TSMC PA Splr [M] Process improvements delivered healthier baseline Transparency and closed feedback loop •Raw Material Information critical for quality –More than just CoA of the finished products –Sub-supplier management + Process Flow information Low WAT data Defect Data accuracy Raw Material: CoA, PCN Process/QC flow sub-splr RM CoA/QC flow Metrology/Proc. Alignment BCP Audit CP data Correlation /Matching data EC, Tool log Metrology data Production data Equipment data Statistical Process Control APC, Wafer History, PM, Alarm, Recipe step time EPO FAC High Raw material second/ minute hour day week Data monthacquirement Missing piecesMfg. processes and Sub-supplier Info Final Prod. CoA Process/ QC Flow Final Prod. CoA Sub-supplier RM Process/ QC Flow, CoA Process/ QC Flow Final Prod. CoA - Not just a proposal, already in practice RM CoA (N28/N20/N16) QC Flow (N20/N16/N10) STC/ OCAP plan Makes sense for both parties Final Prod. CoA Process/ QC Flow Sub-supplier RM Process/ QC Flow, CoA Closed loop feedback from RM to Yield Supplier TSMC/Module TSMC/ QC-FAC iCOA on products In-line/ off-line defense Off-line quality sampling RM + Proc. Parameters SPC remote monitoring (Batch) pre-Qual/Auto pi-run e-Cloud: Real-time baseline management Effective OOC recovery loop Missing pieces Defect/ Yield TSMC Supplier HH H Delivery Mfg proc. (COA) L LL 條碼上線 品質 管理 Upstream RM. (Baseline Control) 化學品供應 液位庫存管理 (CDS) Early alert 機台使用 品質需求規範 (Module) Driving for win-win solutions •Integrated data stream connect Raw Material Quality to Defect/Yield performance –Analytical (trouble shooting) tool –Real time defense –Quality improvement vehicle Summary •Effective engagement between Suppliers and Chipmakers is the key to future material success- against time, resource, and technology challenges •Focus opportunities for engagement: –Alignment of Metrology roadmap for resource prioritization –Transparency in Material Process Flow and Sub-supplier RM quality management –Collaboration with Closed loop feedback system-> timely and effective actions Thank You !