A New Paradigm of
Raw Material Management in
Advanced Technology Nodes
C. Joe Wu, Nano-Materials Center, TSMC
Paradigm
•A distinct set of concepts or thought patterns.
•A group of ideas and models (in material
management term)
Raw Materials
= Semiconductor Processing Materials
(LTH, CMP, Chemicals, PVD/CVD
target/gas/precursors…)
Agenda
•Technology Trend and Material Challenges
•Driving for Win-Win Solutions
•Summary
Consequence of EUV (or other NGL)
delay
•Path for N10 and beyond not clear! Process complexity and Material cost are
going up!
•Congratulations! We are all in this together.
ITRS Roadmap
New Engines for Moore’s Law
•Materials, Designs, and Software - Chris Mack, 2012
Prod. Dev. Cycle Landscape Changing
•Used to be: 24-48 months of technology production Ramp
curve…
Source: ITRS roadmap
Prod. Dev. Cycle Getting Shorter
•Aggressive customer schedules
–Development cycle (ramp, C/T, D0) being squeezed
–Overlap of tech phases stretching resource
D0
•Shortened learning cycles -> Increased risks
Schedule
Raw Material Challenges
•No time and resource- aggressive schedule, surprise prone
•Metrology/Process gap- see what we see, feel how we feel
•Downstream material quality management
–Technology: convoluted Material/ Process/ Tool interaction
–Logistic: from Sub-supplier, Supplier- Fac- Tool- Wafer defect/yield
•Change management- supplier + sub-suppliers risk/quality
management
•Filtration/purification requirement - how small is too small,
how much is too much? effective filter COA
Driving for Win-Win Solutions
•There must be a better way of doing business with us
•So how do we go from here,
To here?
Driving for win-win solutions
•Engagement
–Metrology roadmap:
•aligning Resources and Focuses
–Integrated data stream (Big data analysis):
•Transparency and Collaboration
Bridging Metrology/Process Control
Gaps
•Concerns on lack of correlation between CoA items and
chipmakers’Key Parameters Indices (defect/uniformity/yield)
Chipmakers: Trend
QC baseline concern,
Improvement opportunity
Supplier: Noise
Nuisance if COA within Ship to Control limit
Chipmaker’s inline Particle monitor trend chart
Metrology Challenges
•PPT level detection- capability and reliability
20nm
Challenge of finding 25 NT$5 coins
Between Taipei and Kaohsiung
Metrology Challenges
•PPT level detection- capability and reliability
•Metrology correlation- e.g. Particles vs. metallic
•Mind set- trend vs. noise
20nm
 Need engagement with TSMC to generate a clear metrology roadmap
for aligning and prioritize resources
Opportunity:
•Huge payoff if we figure out how to collaborate
TSMC
PA
Splr
[M]
Process
improvements
delivered healthier
baseline
Transparency and closed feedback
loop
•Raw Material Information critical for quality
–More than just CoA of the finished products
–Sub-supplier management + Process Flow information
Low
WAT data
Defect
Data accuracy
Raw Material:
CoA, PCN
Process/QC flow
sub-splr RM CoA/QC flow
Metrology/Proc. Alignment
BCP
Audit
CP data
Correlation
/Matching
data
EC,
Tool log
Metrology
data
Production
data
Equipment
data
Statistical
Process
Control
APC, Wafer History,
PM, Alarm, Recipe step time
EPO
FAC
High
Raw material
second/
minute
hour
day
week
Data
monthacquirement
Missing piecesMfg. processes and Sub-supplier Info
Final
Prod.
CoA
Process/ QC Flow
Final
Prod.
CoA
Sub-supplier RM Process/ QC Flow, CoA
Process/ QC Flow
Final
Prod.
CoA
-
Not just a proposal, already in practice
RM CoA (N28/N20/N16)
QC Flow (N20/N16/N10)
STC/ OCAP plan
Makes sense
for both parties
Final Prod.
CoA
Process/ QC
Flow
Sub-supplier RM Process/
QC Flow, CoA
Closed loop feedback from RM to Yield
Supplier
TSMC/Module
TSMC/ QC-FAC
 iCOA on products
 In-line/ off-line defense
 Off-line quality sampling
 RM + Proc. Parameters
 SPC remote monitoring
 (Batch) pre-Qual/Auto pi-run
 e-Cloud: Real-time baseline
management
 Effective OOC recovery
loop
Missing pieces
Defect/ Yield
TSMC
Supplier
HH
H
Delivery
Mfg proc.
(COA)
L
LL
條碼上線
品質 管理
Upstream RM.
(Baseline Control)
化學品供應
液位庫存管理
(CDS)
Early alert
機台使用
品質需求規範
(Module)
Driving for win-win solutions
•Integrated data stream connect Raw Material Quality to
Defect/Yield performance
–Analytical (trouble shooting) tool
–Real time defense
–Quality improvement vehicle
Summary
•Effective engagement between Suppliers and Chipmakers is
the key to future material success- against time, resource, and
technology challenges
•Focus opportunities for engagement:
–Alignment of Metrology roadmap for resource prioritization
–Transparency in Material Process Flow and Sub-supplier RM quality
management
–Collaboration with Closed loop feedback system-> timely and
effective actions
Thank You !