FQD4P40 P-Channel QFET® MOSFET -400 V, -2.7 A, 3.1 Ω Description Features These P-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize onstate resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for electronic lamp ballast based on complimentary half bridge. • -2.7 A, -400 V, RDS(on) = 3.1 Ω (Max.) @ VGS = -10 V, ID = -1.35 A • Low Gate Charge (Typ. 18 nC) • Low Crss (Typ. 11 pF) • 100% Avalanche Tested S D G S G D-PAK D Absolute Maximum Ratings T Symbol VDSS ID o C = 25 C unless otherwise noted. Parameter Drain-Source Voltage - Continuous (TC = 25°C) Drain Current FQD4P40TM -400 - Continuous (TC = 100°C) IDM Drain Current VGSS Gate-Source Voltage - Pulsed (Note 1) Unit V -2.7 A -1.71 A -10.8 A ± 30 V mJ EAS Single Pulsed Avalanche Energy (Note 2) 260 IAR Avalanche Current (Note 1) -2.7 A EAR Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA = 25°C) * (Note 1) 5.0 -4.5 2.5 mJ V/ns W 50 0.4 -55 to +150 W W/°C °C 300 °C dv/dt PD Power Dissipation (TC = 25°C) TJ, TSTG TL (Note 3) - Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Characteristics Symbol RJC RJA Parameter FQD4P40TM Thermal Resistance, Junction to Case, Max. 2.5 Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max. 110 2 Thermal Resistance, Junction to Ambient (*1 in Pad of 2-oz Copper), Max. ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 1 Unit oC/W 50 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET November 2013 Part Number FQD4P40TM Electrical Characteristics T Symbol Package DPAK Top Mark FQD4P40 Packing Method Tape and Reel Reel Size 330 mm Tape Width 16 mm Quantity 2500 units o C = 25 C unless otherwise noted. Parameter Test Conditions Min Typ Max Unit -400 -- -- V -- 0.36 -- V/°C Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 µA ∆BVDSS / ∆TJ Breakdown Voltage Temperature Coefficient ID = -250 µA, Referenced to 25°C IDSS Zero Gate Voltage Drain Current VDS = -400 V, VGS = 0 V -- -- -1 µA VDS = -320 V, TC = 125°C -- -- -10 µA IGSSF Gate-Body Leakage Current, Forward VGS = -30 V, VDS = 0 V -- -- -100 nA IGSSR Gate-Body Leakage Current, Reverse VGS = 30 V, VDS = 0 V -- -- 100 nA On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 µA -3.0 -- -5.0 V RDS(on) Static Drain-Source On-Resistance VGS = -10 V, ID = -1.35 A -- 2.44 3.1 Ω gFS Forward Transconductance VDS = -50 V, ID = -1.35 A -- 2.5 -- S VDS = -25 V, VGS = 0 V, f = 1.0 MHz -- 520 680 pF -- 80 105 pF -- 11 15 pF -- 13 35 ns -- 55 120 ns -- 35 80 ns -- 37 85 ns -- 18 23 nC -- 3.8 -- nC -- 9.4 -- nC Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge VDD = -200 V, ID = -3.5 A, RG = 25 Ω (Note 4) VDS = -320 V, ID = -3.5 A, VGS = -10 V (Note 4) Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- -2.7 A ISM -- -- -10.8 A VSD Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = -2.7 A Drain-Source Diode Forward Voltage -- -- -5.0 V trr Reverse Recovery Time -- 260 -- ns Qrr Reverse Recovery Charge VGS = 0 V, IS = -3.5 A, dIF / dt = 100 A/µs -- 1.4 -- µC 1. Repetitive rating: pulse-width limited by maximum junction temperature. 2. L = 62 mH, IAS = -2.7 A, VDD = -50 V, RG = 25 Ω, starting TJ = 25oC. 3. ISD ≤ -3.5 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25oC. 4. Essentially independent of operating temperature. ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 2 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET Package Marking and Ordering Information 1 10 1 10 VGS -15.0 V -10.0 V -8.0 V -7.0 V -6.5 V -6.0 V Bottom : -5.5 V -I D, Drain Current [A] 0 10 -I D , Drain Current [A] Top : -1 10 ※ Notes : 1. 250μs Pulse Test 2. TC = 25℃ -2 10 0 10 150℃ 25℃ -55℃ -1 -1 0 10 10 1 10 10 2 4 Figure 1. On-Region Characteristics 10 1 10 VGS = - 10V 6 -I DR , Reverse Drain Current [A] RDS(on) [ Ω ], Drain-Source On-Resistance 8 Figure 2. Transfer Characteristics 8 VGS = - 20V 4 2 ※ Note : TJ = 25℃ 0 10 150℃ 25℃ ※ Notes : 1. VGS = 0V 2. 250μs Pulse Test -1 0 3 10 12 0.0 0.5 1.0 -ID , Drain Current [A] 1200 -V GS , Gate-Source Voltage [V] 10 Ciss 600 Coss 400 0 -1 10 ※ Notes : 1. VGS = 0 V 2. f = 1 MHz Crss 0 10 3.0 1 10 VDS = -80V VDS = -200V 8 VDS = -320V 6 4 2 ※ Note : ID = -3.5 A 0 0 2 4 6 8 10 12 14 16 18 20 QG, Total Gate Charge [nC] VDS, Drain-Source Voltage [V] Figure 5. Capacitance Characteristics ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 2.5 12 800 200 2.0 Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 1000 1.5 -VSD , Source-Drain Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Capacitance [pF] 6 -VGS , Gate-Source Voltage [V] -VDS, Drain-Source Voltage [V] 0 ※ Notes : 1. VDS = -50V 2. 250μs Pulse Test Figure 6. Gate Charge Characteristics 3 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET ! 2.5 2.0 1.1 RDS(ON) , (Normalized) Drain-Source On-Resistance -BV DSS , (Normalized) Drain-Source Breakdown Voltage 1.2 1.0 ※ Notes : 1. VGS = 0 V 2. ID = -250 μA 0.9 0.8 -100 -50 0 50 100 150 1.5 1.0 ※ Notes : 1. VGS = -10 V 2. ID = -1.75 A 0.5 0.0 -100 200 -50 o 0 50 100 150 200 o TJ, Junction Temperature [ C] TJ, Junction Temperature [ C] Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 3.0 Operation in This Area is Limited by R DS(on) 2.5 1 100 µs -I D, Drain Current [A] -I D, Drain Current [A] 10 1 ms 0 DC 10 -1 10 10 ms ※ Notes : o 1. TC = 25 C 2.0 1.5 1.0 0.5 o 2. TJ = 150 C 3. Single Pulse -2 10 0 1 10 2 10 0.0 25 3 10 10 50 ZθJ C(t), Thermal Response [oC/W] Figure 9. Maximum Safe Operating Area 10 125 150 D = 0 .5 0 ※ N o te s : 1 . Z θ J C ( t ) = 2 . 5 ℃ /W M a x . 2 . D u ty F a c t o r , D = t 1 /t 2 3 . T J M - T C = P D M * Z θ J C( t ) 0 .1 0 .0 5 -1 0 .0 2 0 .0 1 PDM t1 s in g le p u ls e 10 100 Figure 10. Maximum Drain Current vs. Case Temperature 0 .2 10 75 TC, Case Temperature [℃] -VDS, Drain-Source Voltage [V] t2 -2 10 -5 10 -4 10 t1, -3 10 -2 10 -1 10 0 10 1 q u a r e W a v e P u ls e D u r a t io n [ s e c ] Figure 11. Transient Thermal Response Curve ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 4 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET ! FQD4P40 — P-Channel QFET® MOSFET 200nF 200nF 12V VGS Same Same T Ty ype as DUT DUT 50KΩ 50K Ω Qg 300nF 300nF VDS VGS Qgs Qgd DUT DUT IG = const. Charg Ch arge e Figure 12. Gate Charge Test Circuit & Waveform VDS RG RL t on td(on d( on)) VDD VGS VGS t of offf tr td(of d( offf) tf 10 10% % DUT VGS VDS 90% Figure 13. Resistive Switching Test Circuit & Waveforms VDS BVDS DSS S 1 -----------------------------EAS = ---- L IAS2 ------2 BVDS DSS S - VDD L tp ID RG VGS Tim Ti me VDD VDD VDS (t) (t)) ID (t DUT DUT IAS BVDSS tp Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 5 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET + VDS DUT _ I SD L Driver Driv er RG VGS VGS ( Driver Driver ) I SD ( DUT ) Compliment of DUT Comp (N-C (N-Channel hannel)) VDD • dv/dt cont ntrrolled b byy RG • ISD con onttrol ollled by pu pullse pe perriod Gate P Pul ulsse W idth ul D = -------------------------Gate te Pul Ga Pulse Per Period 10 10V V Body Bo dy D Diiod ode eR Re everse C Cu urren entt IRM di//dt di IFM , Bo Body dy D Diiod ode eF For orw ward Cu Curren entt VDS ( DUT ) VSD Body Bo dy D Diiode For Forw ward Vol Volttag age e Drop Drop VDD Body Bo dy Diod Diode e Recov cove ery dv dv/d /dtt Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 6 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET Mechanical Dimensions Figure 16. TO252 (D-PAK), Molded, 3-Lead, Option AA&AB Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003 ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 7 www.fairchildsemi.com tm *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I66 ©2000 Fairchild Semiconductor Corporation FQD4P40 Rev. C0 8 www.fairchildsemi.com FQD4P40 — P-Channel QFET® MOSFET TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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