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Contents
1. Overview........................................................................................................................................ 2
2. Application Examples .................................................................................................................... 3
3. Characteristics of the Hall IC ........................................................................................................ 6
4. Cautions on Use .......................................................................................................................... 16
5. Troubleshooting ........................................................................................................................... 20
1
1. Overview
Hall.ICs.are.magnetic.field.sensor.ICs.integrating.a.Hall.element.that.detects.magnetic.fields.generated.by.magnet.together.with.
peripheral.circuits.such.as.amplifiers,.comparator,.and.so.on..The.Panasonic.Hall.ICs,.which.integrate.the.Hall.element.and.peripheral.
circuits.on.the.same.chip.using.the.Bi-CMOS.process,.are.easy-to-use.magnetic.sensor.ICs.to.connect.directly.to.digital.devices.such.
as.microcomputers.
1-1. The construction of Hall IC and operating theory
The.theory.of.Hall.element.is.that.the.electrode.A,.B,.C.and.D.are.made.on.a.resistor.(the.same.diffusion.process.as.resistors.
of.ICs).shown.in.Figure.1(a);.then.the.voltage.is.applied.between.A.and.B,.and.the.current.flows.as.a.result;.in.this.conditions,.if.
magnetic.flux.is.given.vertically.to.the.resistor,.by.Fleming's.left.hand.rule.(Shown.in.Figure.2),.force.'F'.works.from.D.to.C.direction,.
and.the.current.density.will.be.C.>.D.between.C.and.D,.and.potential.difference.will.be.generated..(Shown.in.Figure.1(b).)
.This.phenomenon.is.called."Hall.effect".and.the.potential.difference.is.called.Hall.voltage..This.phenomenon.was.discovered.by.
Dr..E..H..Hall.
The.Hall.element.made.from.compound.semiconductors.with.high.electron.mobility,.such.as.GaAs,.InAs.and.InSb,.has.an.
advantage.of.its.large.Hall.voltage..However,.in.spite.of.its.small.Hall.voltage,.a.practical.advantage.for.the.silicon.Hall.element.is.to.
integrate.peripheral.circuits.on.the.same.chip..
A
A
N
F (Force)
B (Magnetic flux density)
C
D
C
S
B
(a)
D
B
I (Current)
(b)
Figure 1 Operating theory of Hall IC
1-2. Category of Hall IC products
・Classification.by.magnetic.field.detection.method
Unidirectional.magnetic.field.detection.type
Bidirectional.magnetic.field.detection.type
Alternating.magnetic.field.detection.type
・Classification.by.output.type
Open.collector.type
Incorporated.resistor.type.(Pull-up.resistor)
CMOS.inverter.type
・Classification.by.power.supply.control.method
Ever-on.type
Intermittent-operation.type
・Classification.by.application
Consumer.use
Industrial.use
Automotive.use
2
Figure 2 Fleming's left hand rule
2. Application Examples
The.Hall.ICs.are.applied.in.the.various.fields.
Please.refer.to.the.notice.and.cautions.as.described.below.for.designing.typical.applications.
・Application for opened/closed detection
Video camera with LCD display
Flip type cellular phone
Notebook PC
・Application for rotation detection
Mouse
MPU fan motor
2-1. Application for index sensors
Alternating.magnetic.field.detection.type.as.described.in.2),.is.suitable.than.using.unidirectional.type.to.reduce.the.variation.of.the.
pulse.timing.of.index.sensor.
The.accuracy.will.be.much.more.improved.if.the.magnetic.density.steeply.changes.at.the.changing.point.from.S.pole.to.N.
Especially,.using.of.two.magnets.can.generate.steeper.change.of.the.magnetic.density.than.single.magnet..
S
N
S
S
N
N
S
N
Magnetic
flux density
1) Unidirectional (One-way magnetic field operation type)
+
−
Sample 1
Sample 2
Wide in dispersion width
Figure 3
3
2. Application Examples
NS
NS
Magnetic
flux density
2) Bidirectional (Alternating magnetic field operation type)
+
NS
−
Sample 1
Sample 2
Narrow in dispersion width
Figure 4
S N
Figure 5
2-2. Application for flip type cellular phones
Closing of a flip causes a signal
to be transmitted to a microcomputer, then the power supply is
turned off to save the power
consumption.
Figure 6
Magnet mounted on the flip.
Figure 7
High.sensitivity,.low.current.consumption.and.unidirectional.magnetic.field.operation.type.is.suitable..For.example:.AN48836B.
2-3. Application for micro-switches
Alternating field operation type is suitable to maintain the stroke accuracy and to make On/Off stroke small.
Figure 8
4
2. Application Examples
Same.size.two.magnets.are.used.to.make.a.steep.change.of.magnetic.flux.density.
Their.N-pole.usually.faces.to.a.Hall.IC.and.let.their.S.face.to.it.for.the.operation..(switching.as.On)
Figure 9
2-4. Application for box fan motors
The.fan.motors.of.two-phase.systems.
The.box.fan.motors.generally.use.two.phase.blush-less.motor.
The.Hall.IC.detects.the.rotary.position.of.rotor.magnet.as.three.phase.blush-less.motors.
Figure 10
2-5. Application for the reciprocating motion switches and motors
When.using.the.hall.IC.in.a.reciprocating-action.switch.or.sensor,.a.unidirectional-operation.type.is.used.if.sensing.position.of.ON.
is.not.sufficient.
Use.the.alternating-magnetic-field.operation.type.and.arrange.3.magnets.as.N,.S,.N.as.shown.below.if.accuracy.is.necessary,.so.it.
could.output.only.when.the.S.pole.passes.across.the.Hall.IC.
[Position accuracy is higher.]
S N S
[Position accuracy is Lower.]
N S N
.
S
Alternating.magnetic.field.operation.type.
Unidirectional.magnetic.field.operation.type
Figure 11
5
3. Characteristics of the Hall IC
The definition of '+' and '-' in the operating flux density
N
S
S
Surface of
Hall IC package
N
Magnetic field
Surface of
Hall IC package
N
Magnetic field
S
S
N
1) In case the magnetic flux density is plus
2) In case the magnetic flux density is minus
Figure 12
Note). Except.the.mini-mold.package,.the.IC.chip.face.comes.to.the.face.(type.name.marked).of.the.package.
3-2. Alternating magnetic field detection IC
The.Hall.IC.that.operates.in.the.magnetic.field.which.changes.continuously.S.→.N.→.S.→.N.
Magnetic flux density
S
BW
BH-L
N
Rotation
S
BL-H
N
N
S
Hall IC output
Hall IC output
Figure 13
3-3. Unidirectional magnetic field detection IC
The.Hall.IC.that.operates.only.by.S-pole.or.N-pole.
Magnetic flux density
BW
S
BH-L
BL-H
N
Moving direction
N
S
Hall IC output
(Note) Operated by either S or N.
Hall IC output
Figure 14
8
3. Characteristics of the Hall IC
3-4. Bidirectional magnetic field operation Hall IC
Hall.IC.that.operates.for.magnetic.fields.of.both.S.pole.and.N.pole.
Magnetic flux density
BWS
S
BH-LS
BL-HS
BL-HN
BH-LN
N
S
Moving direction
N
BWN
Hall IC output
(Note) Operated by both of S and N.
Hall IC output
Figure 15
3-5. Measuring method for the operating flux density
Measure.in.an.uniform.magnetic.field.using.electromagnets.with.large.cross-section.area.to.avoid.influence.of.the.chip.position.of.
the.Hall.IC..This.allows.you.to.measure.the.sensitivity.of.the.Hall.IC.itself.regardless.of.the.distance.between.the.magnet.and.the.Hall.
IC.
<Measuring method>
Power supply
for Hall IC
R
Volt
meter
Measure
Hall IC's output
Volt
meter
Figure 16
Power supply for
electromagnet
Density of magnetic flux generated in coil
1). Measure.the.current.of.the.coil.and.the.generated.magnetic.flux.density.by.using.a.tesla.meter.
2). You.can.change.the.current.flows.in.the.coil.by.changing.the.power.supply.to.convert.current.value.into.flux.density.value.
3). The.current.running.in.the.coil.can.be.read.from.the.voltage.generated.at.the.two.ends.of.the.resistance.R..Adjust.the.resistance.
value,.for.example,.to.set.100.mT.=.1.000.V..This.allows.you.to.read.directly.the.voltage.as.1.mV.=.0.1.mT.using.a.voltmeter..
(Since.there.may.not.be.linearity.within.the.necessary.flux.density.range,.the.relationship.between.the.flux.density.and.voltage.
should.be.measured.and.verified.in.advance.)
Linear zone
Voltage between both sides of "R"
Figure 17
9
3. Characteristics of the Hall IC
Magnetic flux density B (mT)
3-6. Hall IC sensitivity
When BH-L of the Hall IC is 30 mT (maximum),
the operation up to 4 mm in distance is guaranteed.
90
Apply data (in the worst case)
on which the magnetic flux density
becomes minimum due to
the temperature characteristic,
and variation of magnetization.
60
30
0
0
1
2
3
4
5
Distance (mm)
Figure 18
The.Hall.IC.sensitivity.is.the.value.at.the.chip.surface.(magnetism-sensing.surface),.not.the.value.at.the.Hall.IC.package.surface.
The. operation. sensitivity. of. Hall. IC. varies. depending. on. the. temperature. characteristic. or. mechanical/thermal. stress..Take.
sufficient.margin.
0.27 mm
Sample).AN48841B
Figure 19
When.the.distance.between.the.magnet.surface.and.the.surface.of.Hall.IC.package.is.1.mm,.actual.distance.will.be.as.follows.
.
1.mm.+.0.27.mm.=.1.27.mm
Be.sure.to.actually.measure.the.flux.density.of.the.magnet..Paticularly,.in.case.of.multi-polar.magnetized.disk.type.magnet,.
magnetic.flux.will.decrease.extremely.in.a.small.distance.even.if.the.magnetic.flux.density.at.the.surface.seems.to.be.sufficiently.
large.
3-7. About the sensitivity variation
There.exists.some.variation.in.the.operating.sensitivity.(operating.magnetic.flux.density).of.Hall.ICs..When.designing.equipments,.
be.sure.to.take.variations.including.temperature.and.power.supply.fluctuations.sufficiently.into.account.
3-7-1. Alternating magnetic field detection type
Magnetic flux density
S
BW
BL-H
N
Hall IC output
Pulse width varies with sensitivity variation
Figure 20 − 1
10
BH-L
(BH-L)'
(BW)'
(BL-H)'
3. Characteristics of the Hall IC
Hall IC output
H
Variation zone
Variation zone
L
−
BL-H (BL-H)'
0
BH-L (BH-L)'
+
Magnetic flux density (mT)
Figure 20 − 2
3-7-2. Unidirectional magnetic field detection type
Magnetic flux density
(BH-L)'
(BL-H)'
S
BH-L
BL-H
N
Hall IC output
Pulse width varies with sensitivity variation
Figure 21 − 1
Hall IC output
H
Variation zone
Variation zone
L
−
0
BL-H (BL-H)'
BH-L (BH-L)'
+
Magnetic flux density (mT)
Figure 21 − 2
11
3. Characteristics of the Hall IC
3-7-3. Bidirectional magnetic field detection type
Magnetic flux density
(BH-LS)'
(BL-HS)'
S
BH-LS
BL-HS
BL-HN
BH-LN
(BL-HN)'
(BH-LN)'
N
Hall IC output
Pulse width varies with sensitivity variation
Figure 22 − 1
Hall IC output
H
Variation zone
Variation zone
Variation zone
Variation zone
L
−
(BH-LN)' BH-LN (BL-HN)' BL-HN 0
BL-HS (BL-HS)'
BH-LS (BH-LS)'
+
Magnetic flux density (mT)
Figure 22 − 2
3-7-4. Maximum operating frequency
■ Maximum operating frequency for Ever-on types
Since.Hall.ICs.have.a.incorporated.Schmidt.trigger.circuit,.even.if.the.magnet.rotation.speed.(frequency).is.slow,.the.output.will.
be.a.square.waveform..There.is.a.delay.in.both.of.rise.and.fall.time,.which.is.indicated.as.a.and.c.in.the.switching.wave.form.in.the.
Figure.25..When.the.changes.are.faster.than.the.term,.the.IC.output.signal.will.not.reach.to.the.specified.H.or.L.levels..Please.use.Hall.
ICs.at.frequencies.less.than.these.term..For.example,.when.the.rise.and.fall.time.is.supposed.to.be.3.ms.+.40.ns ≒ 4.ms,.maximum.
frequency.will.be.250.kHz,.although,.please.design.the.system.within.100.kHz.as.a.margin.in.consideration.
For.example,
If.the.disc.type.magnet.rotates.with.60.000.rpm.(rotation.frequency.per.minute)
.
60.000.÷.60.=.1.000.rotations/second
Suppose.the.number.of.magnetic.pole.is.20.poles.at.most.
.
1.000.×.20.÷.2.=.10.000.(Hz)...(1.Hz.at.S.and.N)
Therefore,.compared.with.the.mechanical.operation.described.above,.the.operational.speed.of.Hall.ICs.is.generally.fast.enough.
Schmidt
Amplifier trigger
Figure 23 Block diagram of IC interior
12
3. Characteristics of the Hall IC
 Switching characteristic of Hall IC
a
S
N
N
3 µs
S
a
b
b
c
c
40 ns
Hall IC
In case the supply voltage is constant, only the interval
'b' changes with variation in the rotation frequency.
VCC
In case of VCC = 12 V,
a = 3 ms (typ.), c = 40 ns (typ.)
Figure 24 Measuring circuit
Figure 25 Switching waveforms
■ Maximum operating frequency of intermittent-operation types
In.intermittent-operation.type.Hall.ICs,.since.the.power.source.in.the.IC.is.supplying.voltage.intermittently.to.a.Hall.sensor,.the.
maximum.operating.frequency.at.which.the.Hall.IC.output.responds.to.the.input.magnetic.flux.density.is.one.cycle.of.the.power.
source.intermittent.operation.time.(Sample.rate.=.Operating.time.+.Idle.time),.or.in.other.words,.(1/Intermittent.operation.time).
3-7-5. Method for measuring magnet characteristics
N
Sensor
S
Magnet
Tesla meter
Distance Lg
Figure 26
1). Gradually.increase.the.distance.between.the.magnet.surface.and.the.sensor.and.measure.the.magnetic.flux.density.at.each.point..
(Magnet.Data.Example.1)
2). Measure.the.variations.in.the.magnetism.of.the.magnet..(Magnet.Data.Example.1)
3). Measure.the.temperature.characteristics.listed.above.1).and.2)..(Magnet.Data.Example.2)
13
3. Characteristics of the Hall IC
3-7-5. Method for measuring magnet characteristics (continued)
 Magnet data example 1
Magnet data example 2
100
80
80
typ.
60
max.
40
20
0
.
(Temperature characteristics)
100
Magnetic flux density B (mT)
Magnetic flux density B (mT)
(variation of magnetization)
min.
40
20
min.
0
1
25°C
60
2
3
4
0
5
max.
0
1
.
Distance from magnet surface Lg (mm)
2
3
4
5
Distance from magnet surface Lg (mm)
Figure 27
Figure 28
3-7-6. Differences due to magnet material
In.general,.rare-earth.magnets.are.extremely.powerful..Although.ferrite.magnets.cannot.acquire.large.magnetic.flux.densities.
compared.with.rare-earth.magnets,.their.cost.is.lower.
The.flux.density.changes.by.the.material.even.if.the.magnet.size.is.the.same.
 The comparison between the ferrite magnet and manganese aluminium magnet.
(mT)
Magnet
l
Sensor
160
Lg
140
Manganese aluminium magnet (anisotropic)
of 4 mm in diameter and 5 mm in length
150
Lg = 0
130
120
Isotropic ferrite magnet of 4 mm
in diameter and 5 mm in length
110
100
90
Lg = 0
Lg = 0.5
mm
80
70
Lg = 1.0
mm
60
50
Lg = 1.0 mm
40
20
Lg = 2.0 mm
3
2
1
1
10
2
3
3
l (mm)
2
1
1
2
3
l (mm)
Figure 29
14
Lg = 2.5
mm
30
Lg = 1.5 mm
4
3. Characteristics of the Hall IC
3-7-7. Differences due to magnet shape or magnetism pattern
The.flux.density.changes.by.the.shape.and.the.number.of.magnetizing.pole.even.if.the.materials.is.the.same.
Please.design.after.the.test.of.the.characteristics.of.actual.magnet.which.will.be.used.
<Reference data>
 Measured example of manganese aluminium magnet
Axial-direction space-magnetic-flux density
of axial type magnet (04BR)
Axial-direction space-magnetic-flux density
of axial type magnet (07BR)
200
200
S
φ 6.5
N
L
18L
10L
100
8L
18L
100
10L
5L
50
50
0
.
1
Lg
150
14L
0
N
L
Lg
Magnetic flux density B (mT)
Magnetic flux density B (mT)
150
S
φ4
2
3
4
5
0
6
0
1
.
Distance from magnet surface Lg (mm)
2
3
4
5
6
Distance from magnet surface Lg (mm)
Figure 30
Figure 31
Radial-direction space-magnetic-flux density
of ring type magnet
150
15 mm
4 mm
Radial-direction space-magnetic-flux density
(on magnet surface) of ring type magnet
100
100
Surface
Magnetic flux density B (mT)
Magnetic flux density B (mT)
Lg
8 poles
50
24 poles
0
.
0
1
Distance from magnet surface Lg (mm)
2
.
50
0
Lg = 1.5 mm
−50
−100
Rotational angle of magnet
Figure 32
Figure 33
It.is.possible.to.judge.on.the.graph.whether.this.Hall.IC.is.suitable.or.not.if.it.could.prepare.the.measurement.data.of.the.magnet.
described.above.
Without.the.above.study,.it.may.lead.to.any.abnormal.operation.of.the.IC.in.mass.production.line.due.to.the.insufficient.magnetic.
flux.density.
15
4. Cautions on Use
Since.Hall.ICs.are.often.used.in.detecting.moving.objects,.there.is.a.risk.of.changes.in.the.mounted.position.over.a.long.period.
of.time.or.changes.in.the.detection.level.due.to.vibrations.or.impacts..In.order.to.avoid.the.risk,.Hall.ICs.should.be.fixed.in.place.by.
gluing.the.package.or.setting.them.into.a.special.case.
4-1. A case of using adhesive
Some.kinds.of.adhesive.generate.corrosive.gas.(such.as.chloric.gas).during.curing..This.corrosive.gas.corrodes.the.aluminum.on.
the.surface.of.the.Hall.IC,.and.may.cause.a.functional.defect.of.disconnection.
If.Hall.IC.is.to.be.sealed.after.installation,.attention.should.be.given.to.the.adhesive.or.resin.used.for.peripherals.and.substrate.
cleaner,.as.well.as.to.the.adhesive.used.for.Hall.IC.installation..Please.confirm.the.above.matter.to.adhesive.or.resin.manufacturers.
before.using.
4-2. Fixing a Hall IC
It.is.necessary.to.fix.firmly.with.a.holder.if.any.vibration.could.be.given.when.the.Hall.IC.of.an.insertion.type.package.is.installed.
only.by.the.soldered.lead.wire..Otherwise,.vibration.may.cause.metal.fatigue.in.the.lead.wire.of.Hall.IC,.resulting.in.wire.breakage.
4-3. On fixing a Hall IC to holder
When.a.Hall.IC.is.mounted.on.the.printed.circuit.board.with.a.holder,.if.the.coefficient.expansion.of.the.holder.is.large,.the.lead.
wire.of.the.Hall.IC.will.be.stretched.and.it.may.give.a.stress.to.the.Hall.IC.
The.adhesives.between.the.package.and.the.lead.wire.may.be.weakened.and.cause.a.minute.gap.resulting.in.the.deterioration.of.its.
resistance.to.moisture.if.the.lead.wire.is.stressed.intensely.due.to.the.distortion.of.holder.or.board.
Sensitivity.may.also.be.changed.by.this.stress.
4-4. A case bending lead wire
Bend.the.lead.wire.without.stressing.the.package.
Wrong
Fixed
Wrong
W
W
Correct
Fixed
W Fixed
Bending method of lead wire
Figure 34
Wrong
Wrong
Correct
Correct
(a)
(b)
3 mm *
3 mm *
Bending position of lead wire
Note). *.:.The.distance.can.be.within.3.mm,.if.no.stress.is.applied.to.the.resin.mold.by.tightly.fixing.the.lead.wires.with.a.metallic.mold.or.the.like.
Figure 35
16
4. Cautions on Use
4-5. VCC and GND
Do.not.connect.VCC.and.GND.reversely..If.the.VCC.and.GND.pins.are.connected.reversely,.this.IC.will.be.destroyed..If.the.
IC.GND-pin.voltage.is.set.higher.than.other.pin.voltage,.the.IC.configuration.will.become.the.same.as.a.forward.biased.diode..
Therefore,.it.will.turn.on.at.the.diode.forward.voltage.(approximately.0.7.V),.and.a.large.current.will.rush.through.the.IC,.ending.up.
in.its.destruction..(This.is.common.to.monolithic.IC.)
4-6. Cautions on power-on of Hall IC
When.a.Hall.IC.is.turned.on,.the.position.of.the.magnet.or.looseness.may.change.the.output.of.a.Hall.IC..Therefore,.care.should.
be.given.whenever.the.output.state.of.a.Hall.IC.is.critical.when.the.supply.power.is.on.
4-7. Power supply line/Power transmission line
If.a.power.supply.line.or.power.transmission.line.becomes.longer,.noise.or.oscillation.may.be.found.on.the.line..In.this.case,.set.
the.capacitor.of.0.1.mF.to.10.mF.near.the.Hall.IC.to.prevent.it.
If.higher.voltage.than.maximum.rating.is.supposed.to.be.applied.to.the.power.supply.line,.(flyback.voltage.from.coil.or.the.
ignition.pulse,.etc.),.avoid.it.with.external.components.(capacitor,.resistor,.Zener.diode,.diode,.surge.absorbing.elements,.etc.).
4-8. On mounting of the surface mount type package (SMINI-5DE)
When.mounted.on.the.printed.circuit.board,.the.Hall.IC.may.be.highly.stressed.by.the.warp.that.may.occur.from.the.soldering..
This.may.also.cause.a.change.in.the.operating.magnetic.flux.density.and.a.deterioration.of.its.resistance.to.moisture.
Wrong
Correct
Figure 36
4-9. On mounting, deburring and soldering of insertion type package
If.the.leads.of.a.Hall.IC.in.an.insertion.type.package.are.inserted.up.to.their.root.part.through.holes.on.the.printed.circuit.board,.
abnormal.stress.is.applied.to.the.package.and.the.reliability.of.the.Hall.IC.is.likely.to.deteriorate..So,.when.mounting.each.Hall.IC.of.
the.insertion.type,.insert.the.leads.in.due.degree.at.which.the.bottom.face.of.the.package.is.separated.at.least.2.mm.from.the.top.face.
of.the.PCB.
Also.note.that.burrs.of.epoxy.resin.may.be.left.sticking.to.the.lead.wires..(We.are.trying.to.remove.such.burrs.as.much.as.possible.
in.the.deburring.process,.but.in.some.cases,.they.are.not.perfectly.removable.)
2 mm
Remaining burrs
Printed board
When soldering the leads, separate the
soldering position by 2 mm or more
from the resin part of the package.
Figure 37
17
4. Cautions on Use
4-10. On surface treatment of mini-mold package
Surface.treatment.is..available.in.either.smooth.or.dull.finish.
4-11. On soldering of the surface mount type package
Surface.mounting.type.Hall.ICs.are.apt.to.change.its.electrical.characteristics.due.to.the.stress.from.soldering.at.mounting..
Therefore,. avoid. the. mounting. by. flow. (dipping). and. a. soldering. iron.. Please. mount. it. by. reflow. soldering. abiding. by. its.
recommended.conditions.
4-12. On using flux in soldering
Choose.a.flux.which.does.not.include.ingredients.from.halogen.group,.such.as.chlorine,.fluorine,.etc..The.ingredients.of.halogen.
group.may.enter.where.the.lead.frame.and.package.resin.joint,.causing.corrosion.and.the.disconnection.of.the.aluminum.wiring.on.
the.surface.of.an.IC.chip.
【Reference tips】
 Simple method for determining the S/N poles of a magnet
First,. prepare. a. Hall. IC. (unidirectional. magnetic. field.
detection.type).and.connect.the.output.of.the.Hall.IC.to.an.LED.
as.shown.
VCC
LED
VCC
out
GND
Figure 38
If. the. magnet. approaches. the. marking. side. of. Hall. IC. and.
LED.lights.up,..the.near.side.to.the.Hall.IC.is.the.S-pole.
VCC
Magnet
N
LED
S
Figure 39
Magnet
Paint.the.S-pole,.then.you.can.surely.find.which.is.which.
If.the.magnet.is.even.shorter,.use.it.as.shown.in.the.figure.at.
right.
Plastic or the like
Figure 40
The.S-pole.of.the.other.magnet.will.easily.be.found,.if.the.N-pole.is.protruded.
N
S
It will be better to affix a cellophane adhesive
tape to this face.
(For easy separability of the other magnet
attracted to the N-pole.)
Figure 41
18
N
Other magnet
4. Cautions on Use
 Methods to increase magnetic flux density
The.magnetic.force.lines.of.a.magnet.tend.to.converge.on.magnetic.materials.such.as.ferrite.or.soft.iron.block..Therefore,.it.can.
improve.the.magnetic.flux.density.at.the.magnetism-sensing.surface.of.the.Hall.IC.to.build.a.yoke.using.magnetic.materials.on.the.
back.of.the.Hall.IC.shown.below.
Caution).For.mass-production,.consult.with.the.magnet.and.yoke.material.manufacturers.and.perform.magnetic.simulations.based.on.the.material.data.
and.verification.using.actual.samples.
The block of ferrite or soft iron is
installed on the back side of Hall IC.
Iron core
Magnet
Hall IC
Hall IC
Magnet
Figure 42
19
5. Troubleshooting
When.using.a.Hall.IC,.some.precautions.may.prevent.from.problems..Please.refer.to.the.problem.examples.below.and.utilize.the.
caution.items.in.section.4.in.the.actual.design.work.
 Most frequently occurred troubles
[Case.1].
The. operation. of. every. Hall. IC. manufactured. by. way. of. trial. was. normal,. but. some. Hall. ICs. put. to. mass.
production.did.not.operate.
.
(Causes). . The.magnetic.flux.density.of.the.magnet.was.insufficient.
.
. . The.temperature.characteristics.of.the.Hall.IC.and.the.magnet.were.ignored.
.
(Reasons). . There. was. no. data. on. the. magnetic. flux. density. of. the. magnet,. and. mass. production. was.
conducted.in.way.of.referring.to.just.the.equipment.used.in.design.and.test.production.
.
. . In.some.ferrite.magnets,.the.magnetic.flux.density.drastically.decreases.at.the.high.temperature.
side..But.this.property.was.not.duly.taken.into.consideration.
.
. . The.magnetic.flux.density.was.insufficient.because.the.distance.was.set.between.the.magnet.and.
Hall.IC.package.surface,.and.the.distance.to.the.sensor.was.not.considered.
.(Remedial.measures). . The.magnet.was.exchanged.to.the.magnet.of.large.magnetic.flux.density.
.
. . A.block.of.ferrite.or.soft.iron.was.affixed.to.the.reverse.of.the.Hall.IC.
.
. . The.distance.between.the.magnet.and.the.Hall.IC.was.diminished.
 Trouble cases occurred less frequently but furnishes useful hints
[Case.2].
.
Some.Hall.ICs.became.inoperative.on.the.market.
(Causes). . The. materials. of. the. adhesive. agents. and. the. resin. molds. used. for. fixation. of. the. Hall. ICs.
subsequently. generated. hydrogen. gas. and. other. halogen. gas..This. gas. intruded. into. the. IC.
interior.and.corroded.the.aluminum.wires.on.the.IC.surface.
.(Remedial.measures). . We.ceased.to.use.those.resin.materials.which.generate.such.gas.as.is.corrosive.to.metals.
[Case.3].
.
Some.Hall.ICs.became.inoperative.on.the.market.
(Causes). . The.surge.voltage.ascribable.to.the.counter.electromotive.force.of.motors.and.solenoids.was.
applied.to.these.Hall.ICs.and.it.broke.the.IC.wires.because.the.Hall.ICs.were.being.used.in.the.
vicinity.of.motors.and.solenoids.
.(Remedial.measures). . The.power.supply.line.was.separated.from.those.of.the.motors.and.the.solenoids.
.
. . Surge.absorbing.elements.were.additionally.inserted.in.the.Hall.ICs.
[Case.4].
.
Many.defective.products.were.detected.in.the.mass.production.process.
(Causes). . Abnormal.stress.was.applied.to.many.Hall.ICs.and.their.sensitivity.changed.because.no.jig.was.
used.in.the.lead.wire.bending.process.
.(Remedial.measures). . We.introduced.a.new.method.of.lead.forming.by.a.jig.so.that.abnormal.stress.is.never.applied.to.
each.IC.
[Case.5].
.
Many.defective.products.were.found.in.the.market.
(Causes). . The.chloric.solvent.included.in.the.flux.used.for.the.soldering.work.gradually.intruded.into.the.
IC.interior.with.the.lapse.of.time,.and.corroded.the.aluminum.wires.on.the.chip.surface.
.(Remedial.measures). . Choose.a.flux.which.does.not.include.ingredients.from.the.halogen.group,.such.as.chlorine,.
fluorine.and.the.like.
20
Inquiries
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URL:
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Fill in the new inquiry form.
Pub. No. A11009GE
Hall IC Series
Application Notes
March 15, 2013 7th Edition
Issued by
© Panasonic Corporation 2013
1 Kotari-yakemachi, Nagaokakyo City, Kyoto
617-8520, Japan
Tel : 81-75-951-8151
http://www.semicon.panasonic.co.jp/en
010413
Printed in Japan