APA2308
Class AB Stereo Headphone Driver
Features
Gereral Description
•
The APA2308 is an integrated class AB stereo headphone
driver contained in an SOP-8 and a DIP-8 plastic packages.
Operating Voltage
- Single Supply, 3V to 6V
- Dual Supply, ±1.5V to ± 3.0V
•
High Signal-to-Noise Ratio, 100dB
•
Low Distortion, -65dB
•
Large Output Voltage Swing
•
Excellent Power Supply Ripple Rejection
•
Low Power Consumption
•
Short-Circuit Elimination
The APA2308 is capable of delivering 280mW of max.
Output power to an 8Ω load or 110mW to a 32Ω load with
less than 10% (THD+N) from a 5V power supply. The
device is fabricated in a CMOS process and has been
primarily developed for portable digital audio applications.
Applications
•
Wide Temperature Range
•
No Switch ON/OFF Clicks
•
Available in 8 pin SOP or DIP Packages
•
Lead Free and Green Devices Available
•
Portable Digital Audio
(RoHS Compliant)
Ordering and Marking Information
APA2308
Package Code
J : DIP - 8
K : SOP - 8
Temperature Range
I : - 40 to 85 oC
Handling Code
TU : Tube
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
Assembly Material
Handling Code
Temperature Range
Package Code
APA2308 J :
APA2308
XXXXX
APA2308 K :
APA2308
XXXXX
XXXXX - Date Code
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
1
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APA2308
Absolute Maximum Ratings
Symbol
VDD
TSC(O)
Parameter
Supply Voltage
Output Short-Circuit Duration, at TA=25°C, PTOT=1W
TA
Operating Ambient Temperature Range
TJ
Maximum Junction Temperature
TSTG
TS
Storage Temperature Range
Rating
Unit
7
V
20
S
-40 to 85
°C
150
°C
-65 to +150
°C
260
°C
Typical Value
Unit
DIP-8
109
°C/W
SOP-8
210
Maximum Lead Soldering Temperature, 10 Seconds
Thermal Characteristics
Symbol
Parameter
Thermal Resistance from Junction to Ambient in Free Air
(Note 1)
θJA
Note 1: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Electrical Characteristics
VDD=5V , VSS=0V , TA=25°C , fi=1kHz , RL=32Ω ( unless otherwise noted)
Symbol
Parameter
Test Conditions
APA2308
Unit
Min.
Typ.
Max.
-
-
-
Single
3.0
5.0
6.0
Dual
±1.5
±2.5
±3.0
-1.5
-2.5
-3.0
V
SUPPLY
Supply Voltage
VDD
V
VSS
Negative Supply Voltage
IDD
Supply Current
No Load
-
2.5
5
mA
Total Power Dissipation
No Load
-
12.5
25
mW
PTOT
DC CHARACTERISTICS
VI(OS)
Input Offset Voltage
-
5
-
mV
IBIAS
Input Bias Current
-
10
-
pA
0
-
3.5
V
dB
VCM
Common Mode Voltage
Open-loop Voltage Gain
RL=5kΩ
-
75
-
Maximum Output Current
THD+N<0.1%
-
140
-
mA
-
0.25
-
Ω
0.25
-
4.75
0.5
-
4.5
-
65
-
GV
IO
RO
Output Resistance
AC CHARACTERISTICS
RL=32Ω (Note 2)
VO
Output Voltage Swing
RL=16Ω
PSRR
Power Supply Rejection Ratio
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
(Note 2)
Fi=100Hz
VRIPPLE(P-P) =100mV
2
V
dB
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APA2308
Electrical Characteristics (Cont.)
VDD=5V , VSS=0V , TA=25°C , fi=1kHz , RL=32Ω ( unless otherwise noted)
Symbol
Parameter
APA2308
Test Conditions
Min.
Typ.
Unit
Max.
AC CHARACTERISTICS (CONT.)
Crosstalk
CL
(THD+N)/S
Channel Separation
-
95
-
dB
Load Capacitance
-
-
200
pF
Total Harmonic Distortion Plus Noise to
RL=32Ω (Note 3)
Signal Ratio
-
-65
-60
dB
RL=32Ω
S/N
Signal to Noise Ratio
FG
Unity Gain Frequency
PO
Maximum Output Power
CI
Input Capacitance
B
Power Bandwidth
-
0.05
0.1
%
90
100
-
dB
RL=5kΩ
-
5
-
MHz
THD+N<0.1%
-
84
-
mW
-
3
-
pF
-
20
-
kHz
Unity Gain Inverting
Note 2 : Values are proportional to VDD ; THD+N< 0.1%
Note 3 : VDD=5.0V ; VO(P-P)=3.5V (at 0 dB)
Typical Operating Characteristics
Total Harmonic Distortion Plus Noise-to-Sig-
Output Power as a Function of Supply
nal Ratio as a Function of Input Frequency
(THD+N) / S (dB)
-60
RL=32Ω
po=50mW
-80
RL=5kΩ
Vo(PP)=3.5V
RL=8Ω
PO (mW)
RL=16Ω
po=50mW
po=50mW
RL=8Ω
Voltage
200
RL=16Ω
100
RL=32Ω
20
10
5
-100
2
100
1k
2.5
10k
4.5
5.5
VDD (Vrms)
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
3.5
3
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APA2308
Typical Operating Characteristics (Cont.)
Crosstalk as a Function of Input
Open Loop Gain as a Function of Input
Frequency
Frequency
RL=8Ω
RL=16Ω
+80
RL=32Ω
-80
Gv (dB)
Crosstalk
+60
-100
No load
+40
RL=32Ω
RL=5kΩ
+20
-120
100
1k
1k
10k
Frequency (Hz)
10k
100k
1M
Frequency (Hz)
Total Harmonic Distortion Plus Noise-toSignal Ratio as a Function of output Voltage
-40
RL=8Ω
RL=16Ω
(THD+N) / S (dB)
-50
RL=32Ω
-60
-70
RL=5KΩ
-80
-90
100m
500m
1
2
Vo (Vrms)
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
4
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APA2308
Block Diagram
8
VD
V
DDD
7
Out B
3
6
Inverting Input B
VVSSSS 4
5
Non-inverting Input B
Out A
1
Inverting Input A
2
-+ +Non-inverting Input A
APA2308
Typical Application Circuit
VDD
220pF
220µF
VOUTA
15kΩ
1
15kΩ
3
VREF
typ.1/2VDD
VINB
2.2µF 15kΩ
5
6
-+
2
VINA
RL
8
APA2308
100µF
-+
2.2µF
7
4
VSS
VOUTB
15kΩ
220µF
RL
220pF
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
5
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APA2308
Package Information
DIP-8
E1
D
L
A1
0.38
A
A2
E
D1
b
e
c
eA
b2
S
Y
M
B
O
L
eB
DIP-8
MIN.
MAX.
A
A1
INCHES
MILLIMETERS
MIN.
MAX.
0.210
5.33
0.015
0.38
A2
2.92
4.95
0.115
0.195
b
0.36
0.56
0.014
0.022
b2
1.14
1.78
0.045
0.070
0.014
0.400
c
0.20
0.35
0.008
10.16
0.355
D
9.01
D1
0.13
E
7.62
8.26
0.300
0.325
E1
6.10
7.11
0.240
0.280
0.005
e
2.54 BSC
eA
7.62 BSC
eB
L
0.100 BSC
0.300 BSC
0.430
10.92
2.92
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
0.115
3.81
6
0.150
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APA2308
Package Information
SOP-8
D
E
E1
SEE VIEW A
h X 45
°
c
A
0.25
b
GAUGE PLANE
SEATING PLANE
A1
A2
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.75
0.069
0.004
0.25
0.010
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
0.049
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
7
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APA2308
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
SOP-8
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-8
Tape & Reel
2500
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
8
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APA2308
Taping Direction Information
SOP-8
USER DIRECTION OF FEED
Reflow Condition (IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
9
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
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APA2308
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
3
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Volume mm
<350
240 +0/-5°C
225 +0/-5°C
Package Thickness
<2.5 mm
≥2.5 mm
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. B.4 - Oct., 2008
10
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