BALF-112X-02D3
50 ohm nominal input / conjugate match balun CC1120,
CC1125, 433 MHz, with integrated harmonic filter
Datasheet - production data
Description
STMicroelectronics' BALF-112X-02D3 is an ultraminiature balun, integrating both matching
network and harmonics filter.
Matching impedance has been customized for
the CC1120, CC1125, CC1175 and CC1200
transceivers from Texas Instruments.
The device uses STMicroelectronics' IPD
technology on a non-conductive glass substrate,
which optimizes RF performance.
Figure 1: Application schematic
Features
Vdd
Vdd
25
DCPL_PFD_CHIP
AVDD_PFD_CHIP
Vdd
28
27
AVDD_SYNTH2
29
CDPL_XOSC
AVDD_XOSC
31
30
XOSC_Q1
Vdd
22
Vdd
21
Antenna
(50Ω)
20
19
18
17
NC
NC
PA
23
C10
L11
16
16
15
15
AV
DD_RF
AVDD_RF
TRX_SW
RBIAS
RBIAS
SCLK
14
14
SI
24
C44
R13
Vdd
MCU connection SPI
interface and optional
gpio pins
LNA_N
LNA_P
AV
DD_IF
AVDD_IF
Very low profile (< 630 μm thickness)
High RF performance
RF BOM and size reduction
DCPL_VCO
DCPL
Vdd



DVDD
9
9
Benefits
Texas
CC1121
GPIO2
DVDD
DVDD
8
AVDD_SYNTH1
13
13
7
GPIO3
Vdd
6
LPF1
LPF0
CSn
CSn
Vdd
5
RESET_N
12
12
4
VDD_GUARD
11
11
3
EXT_XOSC
32
2
GPIO0
GPIO0
1
SO
(GPIO1)
SO (GPIO1)
Vdd
XOSC_Q2
(Optional
control pin
from CC1121)
26
XOSC/
TCXO
BALF-1121-02D3




50 Ω nominal input / conjugate match to
CC1120, CC1125, CC1175, CC1200
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint
10
10

Optional
Applications

433 MHz impedance-matched balun filter
optimized for Texas Instruments® CC1120,
CC1125, CC1175, CC1200 sub-GHz RFICs
July 2016
DocID029426 Rev 1
This is information on a product in full production.
1/12
www.st.com
Characteristics
1
BALF-112X-02D3
Characteristics
Table 1: Absolute maximum ratings (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Input power RFIN
VESD
TOP
Typ.
Max.
-
20
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω,
air discharge)
1300
ESD ratings machine model (MM: C = 200 pF, R = 25 W,
L = 500 nH)
250
-
Operating temperature
-40
-
dBm
V
+85
°C
Table 2: Electrical characteristics and RF performance (Tamb = 25 °C) RX balun
Value
Symbol
Parameter
Unit
Min.
ZRX
Nominal differential impedance
ZANT
Antenna impedance
f
S21RX-ANT
S11ANT
Frequency range (bandwidth)
431
Insertion loss in bandwidth
-1.9
Typ.
Match to CC112X
Ω
50
Ω
436
-1.7
Input return loss in bandwidth
Phase_imbal
Output phase imbalance
Ampl_imbal
Output amplitude imbalance
Max.
0
MHz
dB
-20
-18
dB
1.7
10
°
0.3
1
dB
Table 3: Electrical characteristics and RF performance (Tamb = 25 °C) TX filter
Value
Symbol
Parameter
Test condition
Unit
Min.
ZTX
Nominal TX impedance
ZANT
Antenna impedance
f
S21TX-ANT
S11ANT
Att
2/12
Frequency range
(bandwidth)
431
Insertion loss in
bandwidth
-1.5
Input return loss in
bandwidth
Harmonic levels
Typ.
Max.
Match to
CC112X
Ω
50
Ω
436
-1.3
dB
-12
-10
Attenuation at 2 fo
-40
-26
Attenuation at 3 fo
-52
-46
Attenuation at 4 fo
-31
-30
Attenuation at 5 fo
-35
-32
Attenuation at 6 fo
-32
-28
Attenuation at 7 fo
-48
-44
DocID029426 Rev 1
MHz
dB
dBm
BALF-112X-02D3
1.1
Characteristics
RF measurement
Figure 3: Return loss antenna (RX balun)
Figure 2: Insertion loss (RX balun)
RL_antenna_RX (dB)
IL_RX(dB)
0
0
-0.5
-5
-1.0
-10
-1.5
-15
-2.0
-20
-2.5
f (MHz)
f (MHz)
-3.0
-25
431.0
431.5
432.0 432.5
433.0
432.5 434.0
434.5
435.0
435.5 436.0
431.0
Figure 4: Amplitude imbalance (RX balun)
431.5
432.0 432.5
433.0
432.5
434.0
434.5
435.0
435.5 436.0
Figure 5: Phase imbalance (RX balun)
Amplitude_lmb (dB)
Phase_lmb (dB)
1.0
15
10
0.5
5
0
0.0
-5
-0.5
-10
f (MHz)
f (MHz)
-15
-1.0
431.0
431.5
432.0 432.5
433.0
432.5 434.0
434.5
435.0
435.5 436.0
431.0
Figure 6: TX filter transmission
0
431.5
432.0 432.5
433.0
432.5
434.0
434.5
435.0
435.5 436.0
Figure 7: Insertion loss (TX filter)
Transmit_TX(dB)
0
IL_TX(dB)
-10
-0.5
-20
-1.0
-30
-1.5
-40
-2.0
-50
-2.5
f (MHz)
f (MHz)
-60
-3.0
0
500
1000
1500
2000
2500
3000
3500
4000
DocID029426 Rev 1
431.0
431.5
432.0 432.5
433.0
432.5 434.0
434.5
435.0
435.5 436.0
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Characteristics
BALF-112X-02D3
Figure 8: fo attenuation (TX filter)
Figure 9: Return Loss antenna (TX filter)
RL_antenna_TX(dB)
Transmit_TX(dB)
0
0
-10
-5
-20
-10
-30
-15
-40
-20
-50
f (MHz)
-60
800
4/12
1000
1200
1400
1600
1800
2000
2200 2400 2600 2800 3000 3200
f (MHz)
-25
431.0
DocID029426 Rev 1
431.5
432.0 432.5
433.0
432.5 434.0
434.5
435.0
435.5 436.0
Package information
BALF-112X-02D3
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip CSPG 0.4 package information
Figure 10: Flip-Chip CSPG 0.4 package outline
Bottom view
Top view
(balls down)
(balls up)
C1
C1
C2
A2
LOGO + ECOPAK2 symbol
1st line
ZZ
= Part Number
X
= assembly site
2nd line
Y
= year of production
WW = Weekof production
B1
B1
B3
B2
G
E1
B3
Dot indicates Ball #A1
A1
2.1
Z
Y
Z
W
X
W
B2
B3
B1
B1
C1
C3
C4
C1
D1
D3
D2
Table 4: Flip-Chip CSPG 0.4 mechanical data
Dimensions
Frequency
A1
A2
B1
B2
B3
C1
C2
C3
C4
D1
D2
D3
E1
BAL-112X-02D3
433 MHz
1950
1870
225
750
500
223
1424
820
604
425
205
630
255
DocID029426 Rev 1
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Package information
BALF-112X-02D3
Figure 11: Footprint -non solder mask defined
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DocID029426 Rev 1
Figure 12: Footprint - solder mask defined
Package information
BALF-112X-02D3
Figure 13: Ball assignment
1.95 mm
Top view
LNA +
A3
LNA -
B3
TRX_SWITCH
A1
GND
C1
ANT
E1
GND
D3
PA_C
PA_OUT
E3
E2
1.87
650µm
Table 5: Flip-Chip CSPG 0.4 ball description
Ball
Name
Designation
A1
GND
Ground
A3
LNA-
Connect to LNA_N
B3
LNA+
Connect to LNA_P
C1
ANT
Connect to antenna
D3
TRX_SW
Connect to TRX switch
E1
GND
Ground
E2
PA_C
Connect to PA output thru C10
E3
PA_OUT
Connect to PA
DocID029426 Rev 1
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Package information
BALF-112X-02D3
Figure 14: Application board EVB (4 layers)
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DocID029426 Rev 1
Package information
BALF-112X-02D3
Figure 15: Recommended balun land pattern
C10
Connection
pads for
868MHz balun
L11
1800
micron
Center to center distance bettween balun balls to QFN pad is 1.8 mm
Top metal balun pads diamter is 220 micron
Solder mask opening is 340 microns
GND clearance is 178 microns ( 7 mils)
This land pattern is also compatible with 433 MHz balun that will solder to the second row of pads.
Table 6: Bill of material
Designation
Reference
Value
Package
Comments
L11
LQW15AN10NJ00D
56 nH
0402
Wire wounded
C10
39 pF
0402
50 V
R13
18 Ohms
0402
C44
56 pF
0402
U3
CC1121
DFN 5X5
U6
BALF-112X-02D3
FC 2 X 1.5
DocID029426 Rev 1
50 V
433 MHz
9/12
Package information
2.2
BALF-112X-02D3
Flip-chip CSPG 0.4 packing information
Figure 16: Flip-chip CSPG 0.4 tape outline
10/12
DocID029426 Rev 1
Ordering information
BALF-112X-02D3
3
Ordering information
Table 7: Ordering information
4
Order code
Marking
Package
Weight
Base qty.
Delivery mode
BALF-112X-02D3
TG
Flip-Chip CSPG 0.4
3.94 mg
5000
Tape and reel
Revision history
Table 8: Document revision history
Date
Revision
07-Jul-2016
1
Changes
First issue.
DocID029426 Rev 1
11/12
BALF-112X-02D3
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DocID029426 Rev 1