Application Report SLOA038 - October 1999 THS3001 SPICE Model Performance Jim Karki Mixed Signal Products ABSTRACT This application report outlines the SPICE model of the THS3001 high-speed monolithic operational amplifier. General information about the model file structure, performance comparison, model listing, and a brief comment about symbols are included. The listing can be copied and pasted into an ASCII editor, or it can be down loaded by visiting the THS3001 product folder at http://www.ti.com/sc/docs/products/analog/THS3001.html. Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 File Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Schematic and Subcircuit Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 About Building a Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 List of Figures 1 Output Voltage (pk) vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Output Voltage (pk) vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Supply Current vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Supply Current vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Bias Current vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bias Curent vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Input Offset Voltage vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Input Offset Voltage vs Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Common-Mode Rejection Ratio vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Common-Mode Rejection Ratio vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Power Supply Rejection Ratio vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power Supply Rejection Ratio vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Equivalent Input Voltage Noise vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Equivalent Input Current Noise vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Slew Rate vs Output Voltage (pp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Slew Rate vs Output Voltage (pp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2nd Harmonic vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2nd Harmonic vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3rd Harmonic vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3rd Harmonic vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 4 4 4 4 5 5 5 5 6 6 6 6 7 7 7 7 8 8 1 SLOA038 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Differential Gain vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Differential Phase vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Differential Gain vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Differential Phase vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Differential Gain vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Differential Phase vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Differential Gain vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Differential Phase vs Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Closed-Loop Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Output Impedance vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Output Voltage vs Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Gain and Phase vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Open Loop Transimpedance Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Open Loop Transimpedance Gain vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 THS3001 SPICE Model Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 List of Tables 1 Subcircuit Node to Symbol Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2 THS3001 SPICE Model Performance SLOA038 1 Introduction SPICE modeling has become commonplace today, especially with the advent of affordable PCs with more computing power than main frames of a few years ago. A big concern in SPICE modeling is the accuracy of the models. Without a good model, simulation results are little more than verification of rudimentary circuit operation. The Boyle operational amplifier (op amp) model introduced during the mid ‘70s came from the need for a model that did not use a lot of computing resources, and gave reasonable results for the µA741. In the years since, people have enhanced the Boyle model to add more accuracy. Today, full-transistor models simulate with speed and accuracy on modest home systems. The goal, when creating the SPICE model of the THS3001 high-speed monolithic operational amplifier, is to provide a model that will accurately simulate the actual device in a circuit. The model is derived from the full-transistor model used internally by TI design. Simplifications are made to speed simulation time, and various performance parameters are adjusted to match the model to measured device performance. 2 File Structure The THS3001 SPICE model file, THS3001.lib, is written in ASCII file format and is compatible with a wide variety of computing platforms. The model is written in subcircuit format and has been tested with MicroSim PSpice release 8 and OrCAD PSpice version 9. It should be compatible with most SPICE2- and SPICE3-based simulation programs. The THS3001.lib file contains the subcircuit definition for the THS3001. The model begins with a .SUBCKT statement and ends with a .ENDS statement. 3 Performance Typical performance parameters are modeled, and normal part-to-part variations experienced in real life cannot be expected. At frequencies above a few hundred MHz, performance becomes increasingly dependent on parasitic devices associated with the circuit, and modeling suffers. So, even though the model is very accurate, always verify circuit performance with lab testing. An EVM is available upon request. The following graphs compare simulation results to measured device data. In all graphs, the simulation results are dashed lines and the measured data are solid lines. Device performance is measured using the THS3001 EVM, or is taken from the data sheet. SPICE simulation was done using MicroSim PSpice release 8. Most of the parameters are measured using Vcc=±15 V, and performance follows at lower voltages. THS3001 SPICE Model Performance 3 SLOA038 13.6 RL = 1 kΩ 13.2 13 12.8 RL = 150 Ω 12.6 12.4 12.2 –40 0 20 40 60 80 RL = 1 kΩ 3.4 VI 3.3 3.2 RL = 150 Ω –20 T – Temperature – °C I CC – Supply Current – mA I CC – Supply Current – mA 5 4 3 20 40 60 80 100 5 4 3 –20 0 20 40 60 80 100 T – Temperature – °C Figure 4. Supply Current vs Temperature 2.5 2.5 VCC = ±5 V VCC = ±15 V 2 Bias Current – µ A 2 Bias Current – µ A 100 SPICE Measured Figure 3. Supply Current vs Temperature 1.5 1 1.5 1 0.5 0.5 SPICE Measured SPICE Measured –20 0 20 40 60 80 100 T – Temperature – °C Figure 5. Bias Current vs Temperature 4 80 6 1 –40 T – Temperature – °C 0 –40 60 2 SPICE Measured 0 40 VCC = ±5 V 6 –20 20 7 VCC = ±15 V 7 1 –40 0 Figure 2. Output Voltage (pk) vs Temperature 9 2 1 kΩ T – Temperature – °C Figure 1. Output Voltage (pk) vs Temperature 8 500 Ω SPICE Measured 2.9 –40 100 + – THS3001 SPICE Model Performance 0 –40 –20 0 20 40 60 80 VO RL 3.1 3 SPICE Measured –20 G = 3, Rf = 1 kΩ, VCC = ±5 V 3.5 VO – Output Voltage – V VO – Output Voltage – V 13.4 3.6 G = 3, Rf = 1 kΩ, VCC = ±15 V 100 T – Temperature – °C Figure 6. Bias Curent vs Temperature SLOA038 VIO – Input Offset Voltage – mV 1.6 0.5 VCC = ±15 V VIO – Input Offset Voltage – mV 1.8 1.4 1.2 1 0.8 0.6 0.4 0.2 SPICE Measured 0 VCC = ±5 V 0.4 0.3 0.2 0.1 0 –0.1 SPICE Measured –0.2 –40–30–20–10 0 10 20 30 40 50 60 70 80 –0.2 –40–30–20–10 0 10 20 30 40 50 60 70 80 T – Temperature – °C T – Temperature – °C 80 VCC = ±15 V 70 60 50 40 30 20 10 0 101 SPICE Measured 102 103 104 105 106 107 108 Figure 8. Input Offset Voltage vs Temperature CMRR – Common-Mode Rejection Ratio – dB CMRR – Common-Mode Rejection Ratio – dB Figure 7. Input Offset Voltage vs Temperature 80 VCC = ±5 V 70 60 50 40 30 20 10 0 101 SPICE Measured 102 103 104 105 106 107 108 f – Frequency – Hz f – Frequency – Hz Figure 9. Common-Mode Rejection Ratio vs Frequency 1 kΩ 1 kΩ 1 kΩ + – VI VO 1 kΩ Figure 10. Common-Mode Rejection Ratio vs Frequency THS3001 SPICE Model Performance 5 SLOA038 PSRR – Power Supply Rejection Ratio – dB PSRR – Power Supply Rejection Ratio – dB 80 VCC = ±15 V 70 60 50 40 30 20 10 SPICE Measured 0 103 104 105 106 107 108 90 70 60 50 40 30 20 10 0 103 1 kΩ 104 105 106 1 kΩ + – 1 kΩ SPICE Measured VO + – VI VCC VCC Figure 12. Power Supply Rejection Ratio vs Frequency 1000 VCC = ±15 V Equivalent Input Current Noise –pA/rt Hz Equivalent Input Voltqge Noise – nV/rt Hz 10 SPICE Measured 102 103 104 105 f – Frequency – Hz Figure 13. Equivalent Input Voltage Noise vs Frequency 6 VO 1 kΩ Figure 11. Power Supply Rejection Ratio vs Frequency 1 101 108 1 kΩ 1 kΩ VI 1 kΩ 107 f – Frequency – Hz f – Frequency – Hz 1 kΩ VCC = ±5 V 80 THS3001 SPICE Model Performance VCC = ±15 V 100 10 SPICE Measured 1 101 102 103 104 105 f – Frequency – Hz Figure 14. Equivalent Input Current Noise vs Frequency SLOA038 10000 10000 VCC = ±15 V Slew Rate – V/ µ s Slew Rate – V/ µ s VCC = ±5 V 1000 SPICE Measured SPICE Measured 100 0 1 2 3 4 1000 100 0 5 5 VO – Output Voltage (pp) – V VI 10 VI + _ 15 + _ VO VO 150 Ω 150 Ω 250 Ω 250 Ω 1 kΩ Figure 15. Slew Rate vs Output Voltage (pp) 1 kΩ Figure 16. Slew Rate vs Output Voltage (pp) –70 –80 VCC = ±5 V VCC = ±15 V –80 –90 Harmonic – dBc Harmonic – dBc 20 VO – Output Voltage (pp) – V –90 –100 –100 –110 SPICE Measured –110 106 SPICE Measured 107 –120 106 107 f – Frequency – Hz VI + – f – Frequency – Hz VI VO = 2Vpp + – 150 Ω 750 Ω 750 Ω Figure 17. 2nd Harmonic vs Frequency VO = 2Vpp 150 Ω 750 Ω 750 Ω Figure 18. 2nd Harmonic vs Frequency THS3001 SPICE Model Performance 7 SLOA038 –70 –80 VCC = ±5 V VCC = ±15 V –75 Harmonic – dBc Harmonic – dBc –90 –80 –85 –90 –100 –110 –95 SPICE Measured –100 106 SPICE Measured 107 –120 106 107 f – Frequency – Hz VI + – f – Frequency – Hz VI VO = 2Vpp + – 150 Ω 750 Ω 750 Ω 750 Ω 750 Ω Figure 19. 3rd Harmonic vs Frequency Figure 20. 3rd Harmonic vs Frequency 0.4 0.025 3.58 MHz, VCC = ±5 V 3.58 MHz, VCC = ±5 V Differential Phase – deg 0.020 Differential Gain – % VO = 2Vpp 150 Ω 0.015 0.010 0.3 0.2 0.1 0.005 SPICE Measured SPICE Measured 0 0 1 2 3 4 5 6 7 1 8 2 3 4 Figure 21. Differential Gain vs Loads 7 8 0.4 3.58 MHz, VCC = ±15 V 3.58 MHz, VCC = ±15 V Differential Phase – deg 0.035 Differential Gain – % 6 Figure 22. Differential Phase vs Loads 0.040 0.030 0.025 0.020 0.015 0.010 0.005 SPICE Measured 1 2 3 4 5 6 7 8 150 Loads Figure 23. Differential Gain vs Loads THS3001 SPICE Model Performance SPICE Measured 0.3 0.2 0.1 0 0 8 5 150 Loads 150 Loads 1 2 3 4 5 6 7 8 150 Loads Figure 24. Differential Phase vs Loads SLOA038 0.5 0.045 4.43 MHz, VCC = ±5 V 4.43 MHz, VCC = ±5 V 0.040 0.4 Differential Phase – deg Differential Gain – % 0.035 0.030 0.025 0.020 0.015 0.010 0.005 SPICE Measured 0.3 0.2 0.1 SPICE Measured 0 0 1 2 3 4 6 5 7 1 8 2 3 4 Figure 25. Differential Gain vs Loads 7 8 0.4 4.43 MHz, VCC = ±15 V 0.035 0.030 VI + – 0.025 VO RL 0.020 750 Ω 0.015 750 Ω 0.010 0.005 Differential Phase – deg 4.43 MHz, VCC = ±15 V 0.040 Differential Gain – % 6 Figure 26. Differential Phase vs Loads 0.045 SPICE Measured 1 2 3 4 5 6 7 0.3 SPICE Measured 750 Ω 1 2 3 4 6 7 8 Figure 28. Differential Phase vs Loads 3 G = 1, VCC = ±5 V 0 Rf = 750 Ω VI + – –2 Rf = 1 kΩ Rf –3 Rf = 1.5 kΩ –4 SPICE Measured 106 107 VO 150 Ω ACL – Closed-Loop Gain – dB 2 1 –6 105 5 150 Loads 3 –5 VO 750 Ω 0.1 8 Figure 27. Differential Gain vs Loads –1 + – RL 150 Loads 2 VI 0.2 0 0 ACL – Closed-Loop Gain – dB 5 150 Loads 150 Loads 1 0 –1 109 f – Frequency – Hz Figure 29. Closed-Loop Gain vs Frequency Rf = 750 Ω VI + – Rf = 1 kΩ –2 –3 VO 150 Ω Rf Rf = 1.5 kΩ –4 –5 108 G = 1, VCC = ±15 V –6 105 SPICE Measured 106 107 108 109 f – Frequency – Hz Figure 30. Closed-Loop Gain vs Frequency THS3001 SPICE Model Performance 9 SLOA038 9 9 G = 2, VCC = ±5 V 7 6 VI Rf = 560 Ω 5 4 + – VO RL Rf = 750 Ω Rf 3 Rf 2 Rf = 1 kΩ 1 –1 105 106 107 7 6 Rf = 560 Ω 5 108 Rf Rf = 1 kΩ 1 SPICE Measured 106 107 108 109 f – Frequency – Hz Figure 31. Closed-Loop Gain vs Frequency Figure 32. Closed-Loop Gain vs Frequency 17 17 G = 5, VCC = ±5 V 15 14 Rf = 390 Ω 13 VI 12 + – VO RL Rf = 620 Ω 11 10 Rf Rf = 1 kΩ 9 Rf 4 8 7 SPICE Measured 6 5 105 106 G = 5, VCC = ±15 V 16 ACL – Closed-Loop Gain – dB 16 ACL – Closed-Loop Gain – dB VO RL Rf 2 f – Frequency – Hz 107 15 14 Rf = 390 Ω 13 VI 12 Rf = 560 Ω 11 Rf Rf = 1 kΩ 8 109 Rf 4 7 SPICE Measured 5 105 106 107 108 109 f – Frequency – Hz Figure 34. Closed-Loop Gain vs Frequency Figure 33. Closed-Loop Gain vs Frequency 100 Z O – Output Impedance – Ω VCC = ±15 V 10 1 + – 0.1 1 kΩ 0.01 0.001 105 SPICE Measured 106 107 108 f – Frequency – Hz 109 Figure 35. Output Impedance vs Frequency THS3001 SPICE Model Performance VO VO RL 9 6 108 + – 10 f – Frequency – Hz 10 + – 3 –1 105 109 VI Rf = 680 Ω 4 0 SPICE Measured 0 G = 2, VCC = ±15 V 8 ACL – Closed-Loop Gain – dB ACL – Closed-Loop Gain – dB 8 50 Ω VI SLOA038 10 G = 4.9, Rf = 390 Ω, RL = 150 Ω, VCC = ±15 V 0 Bessel, Fc = 159 kHz, R = 1 kΩ, C = 1 nF, K = 1, Rf = 1 kΩ, VCC = ±15 V 0 –50 –100 –10 Phase –20 –150 –200 –30 Gain –40 –250 –300 –50 –60 SPICE Measured 0 10 20 30 40 50 60 70 80 –350 SPICE Measured –70 104 105 106 107 108 –400 109 f – Frequency – Hz t – Time – ns VI Phase – deg 15 13 11 9 7 5 3 1 –1 –3 –5 –7 –9 –11 –13 –15 GAIN AND PHASE vs FREQUENCY Gain – dB VO– Output Voltage – V OUTPUT VOLTAGE vs TIME 1 nF + – VO 1 kΩ 150 Ω 1 kΩ VI 390 Ω + – 1 nF 100 Ω VO 1 kΩ Figure 36. Output Voltage vs Time Figure 37. Gain and Phase vs Frequency 140 120 –20 110 –40 90 80 70 –80 –100 –120 –140 –160 60 –180 50 –200 SPICE Measured 40 30 102 VCC = ±15 V –60 100 Phase – deg Gain – dB Ω 20 0 VCC = ±15 V 130 103 104 105 106 107 108 109 f – Frequency – Hz Figure 38. Open Loop Transimpedance Gain vs Frequency –220 –240 102 SPICE Measured 103 104 105 106 107 108 109 f – Frequency – Hz Figure 39. Open Loop Transimpedance Gain vs Frequency THS3001 SPICE Model Performance 11 SLOA038 4 Schematic and Subcircuit Listing The schematic representation of the model and the subcircuit listing follow. Figure 40. THS3001 SPICE Model Schematic 12 THS3001 SPICE Model Performance SLOA038 * [Disclaimer] (C) Copyright Texas Instruments Incorporated 1999 All rights reserved * Texas Instruments Incorporated hereby grants the user of this SPICE Macro–model a * non–exclusive, nontransferable license to use this SPICE Macro–model under the following * terms. Before using this SPICE Macro–model, the user should read this license. If the * user does not accept these terms, the SPICE Macro–model should be returned to Texas * Instruments within 30 days. The user is granted this license only to use the SPICE * Macro–model and is not granted rights to sell, load, rent, lease or license the SPICE * Macro–model in whole or in part, or in modified form to anyone other than user. User may * modify the SPICE Macro–model to suit its specific applications but rights to derivative * works and such modifications shall belong to Texas Instruments. This SPICE Macro–model is * provided on an ”AS IS” basis and Texas Instruments makes absolutely no warranty with * respect to the information contained herein. TEXAS INSTRUMENTS DISCLAIMS AND CUSTOMER * WAIVES ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WARRANTIES OF MERCHANTABILITY OR * FITNESS FOR A PARTICULAR PURPOSE. The entire risk as to quality and performance is with * the Customer. ACCORDINGLY, IN NO EVENT SHALL THE COMPANY BE LIABLE FOR ANY DAMAGES, * WHETHER IN CONTRACT OR TORT,INCLUDING ANY LOST PROFITS OR OTHER INCIDENTAL, CONSEQUENTIAL, * EXEMPLARY, OR PUNITIVE DAMAGES ARISING OUT OF THE USE OR APPLICATION OF THE SPICE * Macro–model provided in this package. Further, Texas Instruments reserves the right to * discontinue or make changes without notice to any product herein to improve reliability, * function, or design. Texas Instruments does not convey any license under patent rights or * any other intellectual property rights, including those of third parties. * * THS3001 SUBCIRCUIT * HIGH SPEED, CURRENT FEEDBACK, OPERATIONAL AMPLIFIER * WRITTEN 8/10/99 * TEMPLATE=X^@REFDES %IN+ %IN– %Vcc+ %Vcc– %OUT @MODEL * CONNECTIONS: NON–INVERTING INPUT * | INVERTING INPUT * | | POSITIVE POWER SUPPLY * | | | NEGATIVE POWER SUPPLY * | | | | OUTPUT * | | | | | * | | | | | * | | | | | .SUBCKT THS3001 1 2 3 4 5 * * INPUT * Q1 31 32 2 NPN_IN 4 QD1 32 32 1 NPN 4 Q2 7 15 2 PNP_IN 4 QD2 15 15 1 PNP 4 * PROTECTION DIODES * D1 1 3 Din_N D2 4 1 Din_P D3 5 3 Dout_N D4 4 5 Dout_P * SECOND STAGE * Q3 17 31 11 PNP 2 Q4 16 7 13 NPN 2 QD3 30 30 17 PNP 3 THS3001 SPICE Model Performance 13 SLOA038 QD4 30 30 16 NPN 3 C1 30 3 0.4p C2 4 30 0.4p F1 3 31 VF1 1 VF1 33 34 0V F2 7 4 VF2 1 VF2 35 6 0V F3 3 12 VF3 1 VF3 34 11 0V F4 14 4 VF4 1 VF4 13 35 0V * FREQUENCY SHAPING * E1 18 0 17 0 1 E2 19 0 16 0 1 R1 44 18 25 R2 19 42 25 C3 0 14 9p C4 0 12 9p L1 44 14 2.8n L2 42 12 2.8n * OUTPUT * Q5 3 14 28 NPN 128 Q6 4 12 29 PNP 128 C5 28 9 7p R5 9 5 100 L3 28 10 30n R7 10 5 8 Re 28 29 Rt 50 C6 29 21 7p R4 21 5 100 L4 29 22 30n R6 22 5 8 * BIAS SOURCES * G1 3 32 VALUE = { 308e–6+1.656e–6*V(3, 4) } G2 15 4 VALUE = { 307e–6+1.656e–6*V(3, 4) } V1 3 33 0.83 V2 6 4 0.83 .MODEL Rt RES TC1=–0.006 * DIODE MODELS * .MODEL Din_N D IS=10E–21 N=1.836 ISR=1.565e–9 IKF=1e–4 CJO=2E–12 VJ=.5 M=.3333 .MODEL Din_P D IS=10E–21 N=1.836 ISR=1.565e–9 IKF=1e–4 CJO=2E–12 VJ=.5 M=.3333 .MODEL Dout_N D IS=10E–21 N=1.836 ISR=1.565e–9 IKF=1e–4 CJO=2E–12 VJ=.5 M=.3333 .MODEL Dout_P D IS=10E–21 N=1.836 ISR=1.565e–9 IKF=1e–4 CJO=2E–12 VJ=.5 M=.3333 * TRANSISTOR MODELS * .MODEL NPN_IN NPN + IS=170E–18 BF=100 NF=1 VAF=100 IKF=0.0389 ISE=7.6E–18 14 THS3001 SPICE Model Performance BV=30 IBV=100E–6 RS=105 TT=11.54E–9 BV=30 IBV=100E–6 RS=160 TT=11.54E–9 BV=30 IBV=100E–6 RS=60 TT=11.54E–9 BV=30 IBV=100E–6 RS=105 TT=11.54E–9 SLOA038 + NE=1.13489 BR=1.11868 NR=1 VAR=4.46837 IKR=8 ISC=8E–15 + NC=1.8 RB=251.6 RE=0.1220 RC=197 CJE=120.2E–15 VJE=1.0888 MJE=0.381406 + VJC=0.589703 MJC=0.265838 FC=0.1 CJC=133.8E–15 XTF=272.204 TF=12.13E–12 + VTF=10 ITF=0.294 TR=3E–09 XTB=1 XTI=5 KF=25E–15 .MODEL NPN NPN + IS=170E–18 BF=100 NF=1 VAF=100 IKF=0.0389 ISE=7.6E–18 + NE=1.13489 BR=1.11868 NR=1 VAR=4.46837 IKR=8 ISC=8E–15 + NC=1.8 RB=251.6 RE=0.1220 RC=197 CJE=120.2E–15 VJE=1.0888 MJE=0.381406 + VJC=0.589703 MJC=0.265838 FC=0.1 CJC=133.8E–15 XTF=272.204 TF=12.13E–12 + VTF=10 ITF=0.147 TR=3E–09 XTB=1 XTI=5 .MODEL PNP_IN PNP + IS=296E–18 BF=100 NF=1 VAF=100 IKF=0.021 ISE=494E–18 + NE=1.49168 BR=0.491925 NR=1 VAR=2.35634 IKR=8 ISC=8E–15 + NC=1.8 RB=251.6 RE=0.1220 RC=197 CJE=120.2E–15 VJE=0.940007 MJE=0.55 + VJC=0.588526 MJC=0.55 FC=0.1 CJC=133.8E–15 XTF=141.135 TF=12.13E–12 + VTF=6.82756 ITF=0.267 TR=3E–09 XTB=1 XTI=5 KF=25E–15 .MODEL PNP PNP + IS=296E–18 BF=100 NF=1 VAF=100 IKF=0.021 ISE=494E–18 + NE=1.49168 BR=0.491925 NR=1 VAR=2.35634 IKR=8 ISC=8E–15 + NC=1.8 RB=251.6 RE=0.1220 RC=197 CJE=120.2E–15 VJE=0.940007 MJE=0.55 + VJC=0.588526 MJC=0.55 FC=0.1 CJC=133.8E–15 XTF=141.135 TF=12.13E–12 + VTF=6.82756 ITF=0.267 TR=3E–09 XTB=1 XTI=5 .ENDS *$ 5 About Building a Symbol The first line of the subcircuit definition – .SUBCKT THS3001_NN 1 2 3 4 5 – defines the name of the model and the subcircuit nodes available for external connection. When creating a symbol in PSpice, the subcircuit node assignments need to match the TEMPLATE device property, and the MODEL value must equal the model name. The comment line in the file * TEMPLATE = X^@REFDES %IN+ %IN– %VCC+ %VCC– %OUT @MODEL gives the proper value for the TEMPLATE property. This associates the symbol pin names with subcircuit nodes available for external connections. The symbol pin numbers are used for packaging purposes and are not used for simulation. Using the forgoing results in the following associations: Table 1. Subcircuit Node to Symbol Pin Summary Subcircuit Node THS3001 Symbol Pin Name 2 IN– 3 Vcc+ 4 Vcc– 5 OUT THS3001 SPICE Model Performance 15 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated