Timing and Data Distribution Subsystem Clock Solutions Data Distribution Skew Delay Receivers Translator Crystal PLL Clock Generator PLL Clock Module Reference Clock PLL Clock Synthesizer MUX Fanout Crosspoint Translator Drivers Skew Delay Flip-Flop Divider/ Counter Latches Processor ASIC Equalization Fanout CMOS/TTL HCSL LVDS PECL/CML PE/EQ Pre-Emphasis ZDB Processor Crosspoint MUX ASIC Pre-Emphasis PLL Clock Generator Gates Translator Gates I/O I/O Latches Discrete PLL Blocks Phase Detector Divider/ Prescaler Loop Filter Gates CMOS/TTL HCSL LVDS PECL/CML PE/EQ Data PLL Clock Module VCO Processor Latches ASIC Flip-Flop ZDB I/O Backplane ON Semiconductor provides a complete portfolio of timing and data management solutions for all aspects of the clock tree. System designers can optimize their clock circuits with industry leading clock distribution devices, demonstrating the industry’s lowest jitter and skew. A broad product portfolio, with multiple output and interface options, allows system designers to build clock circuits that satisfy their specific application requirements. ON Semiconductor utilizes CMOS, Bipolar, and SiGe technology to leverage the best performance for any given application. For further details by device, function, or parametrics, refer to our website at www.onsemi.com. Expanding on more than 30 years of experience as the world’s leader in high performance ECL-based clock distribution, ON Semiconductor has extended its expertise into ultra low jitter PLL clock synthesis and generation. The new PureEdge™ PLL devices utilize a fully differential architecture that enables performance that satisfies the timing requirements for the most demanding applications. Performance Capabilities •Differential design for reduced noise •ECL, PECL, CML, LVDS, HSTL, HCSL, LVTTL/LVCMOS outputs for flexible interfacing •Maximum clock rates >10 GHz •Maximum data rates >12 Gbps •Typical jitter as low as 30 fs •Integrated termination resistors for simplified circuit design •Edge rates as low as 28 ps •Low phase noise floor ≤ –174 dBc/Hz •Low skew Page 2 Networking Solutions PLL Clock Synthesizers/Generators Synthesizer/ Generator Features •Based on phase-locked-loop techniques with zero PPM synthesis error •Low jitter for high accuracy clock signals •Available in industrial temperature range -40°C to +85°C •Supports output interfaces: LVPECL, LVDS, HCSL, LVTTL/LVCMOS •Multiple PLLs and multiple output options NB3N5573 Typical Phase Noise at Fc = 200 MHz Input (MHz) 25 25 25 5 to 27 2 to 50 2 to 50 5 to 52 27 1 to 50 25 25 25 Device NB3N3002 NB3N5573 NB3N51032 NB3N3020 NB3N501 NB3N502 NB4N507A NB3N508S NB3N511 NB3N51034 NB3N51044 NB3N51054 Output (MHz) 25/125/200 25/100/125/200 25/100/125/200 5 to 210 13 to 160 14 to 120 50 to 200 216 14 to 200 100/200 100/125 100 Application CPU/DIMM, PCIe Gen 1,2,3 CPU/DIMM, PCIe Gen 1,2,3 CPU/DIMM, PCIe Gen 1,2,3 Network GigE Networking, Consumer, STB Networking, Consumer, STB Networking, Consumer, STB VCXO Set Top Box Networking, Consumer, STB CPU/DIMM, PCIe Gen 1,2,3 CPU/DIMM, PCIe Gen 1,2,3 CPU/DIMM, PCIe Gen 1,2,3 XTAL 3 3 3 3 3 3 3 3 3 3 3 3 CML 3 Input Level CMOS LVPECL 3 3 3 3 3 3 3 3 3 3 TTL 3 3 3 Output Level HCSL HCSL HCSL ECL, LVTTL CMOS LVCMOS ECL LVDS CMOS HCSL HCSL HCSL VCC Typ (V) 3.3 3.3 3.3 3.3 3.3, 5 3.3, 5 3.3, 5 3.3 3.3, 5 3.3 3.3 3.3 Package(s) TSSOP-16 TSSOP-16 TSSOP-16 TSSOP-16 SOIC-8 SOIC-8 SOIC-16 TSSOP-16 SOIC-8 TSSOP-20 TSSOP-28 TSSOP-24 PCIe Timing Solutions •PCIe clock synthesizers with single, dual, and quad outputs •PCIe buffers with 1:6, 1:8, 1:10, and 1:21 fanouts •Solutions for one, two, six, eight, ten, and twenty-one channel applications available •Ultra low skew •Small propagation delay variation (up to 21 output) •Jitter compliant with PCIe Gen 1,2, 3 specification •Direct device interface eliminates external termination components and simplifies BOM 100 MHz HCSL 100 MHz HCSL NB3N3002/5573 100 MHz HCSL FPGA 1 FPGA 2 NB3N106K/108K/111K/121K 1:6, 1:8, 1:10 HCSL 100 MHz HCSL 100 MHz HCSL ASIC 1 ASIC 2 PCIe Gen 1, 2, 3 Clock Generation and Distribution ON Semiconductor Jitter Results After Fanout Page 3 Zero Delay Buffers Zero Delay Buffer PLL FBK 2 PLL REF Extra Divider (−3, −4) Features CLKA1 2 MUX CLKA2 Extra Divider (–5H) •Industry standard functions and pin-outs •Zero input-output propagation delay, adjustable by capacitive load •Multiple configurations available for maximum flexibility •Operating frequency to 133 MHz for CPU and PCI compatibility Device Input Level Output Level VCC Typ (V) fMax Typ (MHz) NB3N2302 CMOS CMOS 3.3, 5 133 NB2304A CMOS CMOS 3.3 NB2305A CMOS CMOS 3.3 NB2308A CMOS CMOS NB2309A CMOS CMOS CLKA3 CLKA4 S2 SELECT INPUT DECODING S1 Extra Divider (–2, –3) NB2308A Functional Diagram Channels tSkew O-O Max (ps) Package(s) 2 250 SOIC-8 133.3 4 200 SOIC-8 133.3 5 250 SOIC-8, TSSOP-8 3.3 133.3 8 200 SOIC-16, TSSOP-16 3.3 133.3 9 250 SOIC-16, TSSOP-16 2 CLKB1 CLKB2 CLKB3 CLKB4 PCIe Zero Delay Buffers Supports HCSL & NMOS Push Pull Outputs OE_[11:0]# 12 FB_OUT* FB_OUT#* SSC Compatible PLL CLK_IN DIF_[11:0] MUX DIF_[11:0]# CLK_IN# 100M_133M# HBW_BYPASS_LBW# SA_0 SA_1 PWRGD/PWRDN# SDA SCL Features Control Logic * FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L ** IREF pin is for NB3N1200K only; it is NC for NB3W1200L Simplified Block Diagram * Pending 2H14. Page 4 IREF** RREF •NB3N1200K, NB3W1200L – 12 outputs •NB3N1900K*, NB3W1900L* – 19 outputs •DIF SRC clock support •Optimized for 100/133 MHz to meet PCIe Gen 2/3 and Intel QPI phase jitter specifications •Spread spectrum compatible for low EMI •Pseudo-external fixed-feedback for <100 ps input-to-output delay variation •Individual OE control pin to enable/disable outputs •<65 ps output-to-output skew •50 ps cycle-to-cycle jitter (PLL mode) •QFN-64 or QFN-72 package Networking Solutions PureEdge ™ Clock Oscillator Modules VDD 6 CLK CLK 5 4 Crystal PLL Clock Multiplier 1 VC 2 OE 3 VC CLCC-6 VDD 6 1 OE VDD 6 1 OE CLK 5 2 FSEL CLK 5 2 NC CLK 4 3 GND CLK 4 3 GND Dual Frequency Pinout (Bottom View) Single Frequency Pinout (Bottom View) Features •Broad portfolio of Crystal Oscillators XO and Voltage-Controlled Crystal Oscillators (VCXO) •Fully integrated crystal reference and PLL synthesizer in the ceramic module •Industry standard 5 mm x 7 mm x 1.9 mm ceramic module •Footprint compatible replacement to 3rd overtone, and SAW based XO/VCXO modules •XOs offer up to two user selectable frequencies •Lower cost and shorter lead time •LVPECL, LVDS and CML outputs •Output Enable (OE) available •Total frequency stability of ± 20 PPM or ± 50 PPM •Industrial temperature range -40°C to +85°C •Low phase noise floor ≤ -160 dBc/Hz •Integrated phase RMS jitter (12 kHz – 20 MHz) 0.5 ps (Typ) •Spurious noise less than -70 dBc •VCXOs have positive tuning slope •VCXOs have 10% linearity for specified tuning range •VCXOs have ±100 PPM pulling range guaranteed •All standard frequencies available (50 MHz to 700 MHz) •NBXzzA0xx –XO with total frequency stability of ±50 PPM •NBXzzB0xxx – XO with total frequency stability of ±20 PPM •NBVSBA0xx – VCXO with LVPECL output •NBVSPA0xx – VCXO with LVDS output Typical Phase Noise/Jitter Plot @ 125 MHz ON Semiconductor Page 5 Dividers and Counters Counters/ Dividers Features •Low jitter and skew for highly accurate phase matching •Multiple outputs and ratios combined for integrated circuit designs •Supports interface and voltage translation Device NB4L339 NB7V32M NB7N017M NB7L32M NB6N239S NB6L239 CML 3 3 3 3 3 3 Input Level CMOS LVPECL 3 3 3 3 3 3 3 3 LVDS 3 3 3 3 3 3 Output Level ECL CML CML CML LVDS ECL VCC Typ (V) 2.5, 3.3 1.8, 2.5 3.3 2.5, 3.3 3.3 2.5, 3.3 fMax Typ (GHz) 0.7 10 3.5 14 3 3 Div Ratios 1 or 2; 2; 4; 8 2 2 to 256 2 1/2/4/8; 2/4/8/16 1/2/4/8; 2/4/8/16 Package(s) QFN-32 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 DIVSEL CLKSEL CLKA VTA CLKA 50− 50− CLKB VTB CLKB 50− 50− EXAMPLE: fin = 622.08 MHz EN EN A ÷1 / ÷2 R A QA0 QA0 foutA = 622.08 MHz QA1 or 311.04 MHz QA1 B ÷2 R B QB0 QB0 QB1 QB1 C ÷4 R C QC0 QC0 foutC = 155.52 MHz QC1 QC1 D ÷8 R D QD0 QD0 QD1 QD1 MR foutB = 311.04 MHz foutD = 77.76 MHz NB4L339 Functional Diagram Page 6 Networking Solutions Clock and Data Distribution VDD VDDO GND Features Outputs per Channel 21 12 12 10 10 10 10 8 8 8 6 6 6 6 5 5 5 4 4 4 4 4 4 4 4 4 4 4 2 2 2 2 2 2 2 2 2 2 2 2 1 ON Semiconductor Input Level Output Level HCSL CMOS CMOS CMOS HCSL, CMOS,LVDS, ECL HCSL CML HCSL ECL CML HCSL CML CML CML CMOS ECL ECL CMOS, TTL ECL ECL CML ECL CML LVDS LVDS CML ECL CML CMOS, TTL ECL CML ECL CML LVDS ECL CML CML CML CML ECL ECL CML 3 CMOS LVPECL HCSL HSTL LVDS 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 XTAL TTL 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 VCC Typ (V) 3.3 2.5, 3.3 1.8, 2.5, 3.3 1.5, 1.8, 2.5, 3.3 2.5, 3.3 3.3 2.5, 3.3 3.3 2.5, 3.3 2.5, 3.3 3.3 1.8, 2.5 1.8 1.8, 2.5 1.5, 1.8, 2.5, 3.3 2.5,3.3 2.5, 3.3 2.5, 3.3 3.3 3.3 2.5 2.5, 3.3 2.5, 3.3 2.5 3.3 2.5 2.5, 3.3 2.5, 3.3 2.5, 3.3 2.5, 3.3 3.3 2.5, 3.3 2.5, 3.3 3.3 2.5, 3.3 2.5, 3.3 2.5, 3.3 2.5, 3.3 1.8, 2.5 2.5, 3.3 2.5, 3.3 Q1 SEL0 SEL1 •Complete portfolio of fanout buffers, multiplexers, cross point switches •Supporting frequencies from DC to 12 GHz/Gbps •Device noise floor as low as -174 dBc Clock and Data •Pre-Emphasis and Equalization blocks available Distribution •Offer new direct X-tal interface capabilities •Industry leading additive jitter as low as 30 fs typical •Industry leading output-to-output skew as low as 3 ps minimum •Wide offering of voltage and interface translation: •ECL, PECL, CML, LVPECL, LVDS, M-LVDS, HSTL, HCSL, LVCMOS/LVTTL •Power supply 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V Device NB3N121K NB3L83948C NB3V8312C NB3F8L3010C NB3M8T3910G NB3N111K NB7L111M NB3N108K NB7L1008 NB7L1008M NB3N106K NB7V585M NB7V586M NB7VQ1006M NB3F8L3005C NB3L853141 NBSG14 NB3M8304C NB3N853501E NB3N853531E NB6HQ14M NB6L14 NB6L14M NB6L14S NB6N14S NB7HQ14M NB7L14 NB7L14M NB3M8302C NB4L339 NB4N11M NB6L11 NB6L11M NB6L11S NB6L611 NB7L11M NB7L72M NB7L572 NB7VQ572M NBSG11 NB6L56 Q0 Q2 CLK0 CLK0 Q3 CLK1 CLK1 Q4 XTAL_IN XTAL_OUT Q5 OSC Q6 Q7 Q8 Q9 SYNC VDD NB3F8L3010C Functional Diagram t Skew O-O (ps) 100 25 150 55 50 100 20 100 20 25 100 30 30 1 55 30 15 45 30 30 3 20 20 20 20 15 15 15 85 60 25 15 15 25 15 15 10 15 15 15 25 fMax Typ (GHz) 0.4 0.35 0.25 0.2 1.4 0.4 5.5 0.4 7 8 0.4 7 6 7.5 0.2 700 12 0.2 0.266 0.266 5 3 3 2 2 7 7 8 0.2 0.7 2.5 6 2 2 3 8 8.5 7 5 12 2.5 Package(s) QFN-52 LQFP-32 LQFP-32 QFN-32 QFN-48 QFN-32 QFN-52 QFN-32 QFN-32 QFN-32 QFN-24 QFN-32 QFN-32 QFN-24 QFN-32 TSSOP-20 QFN-16, BGA-16 SOIC-8 TSSOP-20 TSSOP-20 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 SOIC-8 QFN-32 TSSOP-8 TSSOP-8, SOIC-8 QFN-16 QFN-16 QFN-16 QFN-16 QFN-16 QFN-32 QFN-32 QFN-16, BGA-16 QFN-32 Page 7 Cascadable I/O Expanders Key Features 3.3 V 12 V Button LED •I2C and SMBus interfaces •1 MHz SCL clock frequency •30 mA SDA sink capability SCL SDA SCL SDA I/O I/O INT I/O I/O μC GPIO Vext LEDs I/O I/O I/O I/O I/O Slot 2 Slot 3 3.3 V AUXEN PWRFLT Hot-Plug Controller 12 V MOSFETs 3.3 V PCA96xxE PCA95xxE I/O Expander I/O I/O Backplane Systems AUXEN PWRFLT Hot-Plug Controller 12 V PRSNT2 PRSNT2 I/O I/O I/O I/O Keypad Control ADM1033 Thermal Sensor and Fan Controller Temperature Control Device I/O Cascadable VCC Min (V) VCC Max (V) Interrupt Output PCA9535E 16 64 Programmable Slave Addresses 1.65 5.5 4 QFN-24, SOIC-24, TSSOP-24 PCA9655E 16 64 Programmable Slave Addresses 1.65 5.5 4 QFN-24, SOIC-24, TSSOP-24 PCA9654E 8 8 Slave ID Addresses 1.65 5.5 4 Page 8 I/O LED Blink/ Pullups PWM 4 Package SOIC-16, WQFN-16, TSSOP-16 Networking Solutions Logic Translators Dual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages. PCB #1 PCB #2 Translator Key Features Translator μC #1 •Industry’s first devices with independent power supplies (VL < VCC, VL = VCC, or VL > VCC) •High 100 pF capacitive drive capability •Overvoltage tolerant enable and I/O pins •Non-preferential power-up sequencing •Power-off protection μC #2 PCB-to-PCB Translation On-board translations • SPI • I2C • SMBus Translator EEPROM Autosense Bidirectional Translator (Push-Pull Output) Unidirectional Translator P One−Shot VL Autosense Bidirectional Translator (Open-Drain Output) Bidirectional Translator (with Direction Pin) VCC R1 VL VCC VCCA 1k VCCA VCCB A Block Diagram N One−Shot B I/O VL PU1 I/O VCC P One−Shot OE R2 One−Shot Block RPullup 10 k Gate Bias One−Shot Block EN I/O VL VCCB DIR PU2 RPullup 10 k A EN N B I/O VCC 1k N One−Shot Attributes • High Data Rate • Low Power Consumption • High Data Rate • Low Power Consumption • High Data Rate • Low Power Consumption • Flexible PCB Design • High Data Rate • Low Power Consumption • Flexible PCB Design Trade-Offs • Fixed Input & Output Pins • Modest Output Current • Modest Bandwidth • Directional Control Pin Required •SPI •GPIO •I2C, SMBus, PMBus •GPIO • NLSX3012 (2-Bit, UDFN-8) • NLSX3014 (4-Bit, UQFN-12) • NLSX3013 (8-Bit, CSP-20) • NLSX3018 (8-Bit, UDFN-20) • NLSX4014 (4-Bit, UQFN-12) • NLSX5011 (1-Bit, UULGA-6, UDFN-6) • NLSX5012 (2-Bit, UDFN-8) • NLSX5014 (4-Bit, UDFN-12) • NLSX3373 (2-Bit, UDFN-8) • NLSX3378 (4-Bit, CSP-12) • NLSX4373 (2-Bit, UDFN-8) • NLSX4378 (4-Bit, CSP-12) • NLSV1T45 (1-Bit, ULLGA-6) • NLSV2T245 (2-Bit, UQFN-10) • NLSV2T3236 (2-Bit, UQFN-10) • NLA16T245 (16-Bit, TSSOP-48) Applications •SPI •GPIO • NLSV1T34 (1-Bit, ULLGA-6) • NLSV1T240/244 (1-Bit, UDFN-6) • NLSV2T240/244 (2-Bit, UDFN-8) Sample Device • NLSV4T240/244 (4-Bit, UDFN-12) (I/O Channels, • NLSV4T3234 (4-Bit, CSP-11) Package) • NLSV8T240/244 (8-Bit, UDFN-20) ON Semiconductor •GPIO • SDIO Cards • 1-Wire Bus Page 9 Power over Ethernet IEEE 802.3at, 40 W •Delivers 25.5 W for PoE+ IEEE 802.3at (Draft 4.0) and up to 40 W in proprietary applications •Supports IEEE two event classification •Integrated multi-topology dc-dc converter controller implements highly efficient power conversion at low output voltages •Best in-class cable ESD and thermal characteristics 1SMA58A MBRS1100 Data Pairs VOUT VPORTP CLASS VDDL INRUSH NCP1081 ILIM1 MBRS1100 nCLASS_AT UVLO Spare Pins VPORTIN GATE RTN COMP TL431 IEEE 802.3at + Auxiliary, 40 W •Auxiliary input voltage range from 9.0 V to 57 V •Integrated multi-topology dc-dc converter controller implements highly efficient power conversion at low output voltages in conjunction with auxiliary voltage input •Delivers 25.5 W for PoE+ IEEE 802.3at (Draft 4.0) and up to 40 W in proprietary applications •Supports IEEE two event classification •Best-in-class cable ESD and thermal characteristics VAUX(+) 1SMA58A MBRS1100 Data Pairs VOUT VPORTP CLASS VDDL INRUSH NCP1083 ILIM1 MBRS1100 nCLASS_AT UVLO GATE AUX Spare Pins VPORTIN VAUX(–) Page 10 COMP RTN TL431 Networking Solutions Power over Ethernet IEEE 802.3at (Non-Isolated), up to 40 W •Non-isolated application for simple cost effective solution •Programmable overcurrent protection •Flexibility to scale output MOSFETs for power requirement MMSD4148 VPORTP DRVVCC VB HDRV VS NCP1034 NCP1090/1/2 UVLO LORV SS/SD FB GND VPORTN COMP RTN IEEE 802.3af, 3 W •Integrated PWM controller and Power Device for up to 7.5 W requirements •Up to 1 MHz switching frequency for high power density design •Can be configured in any single-ended topology such as forward or flyback VPORTP MBR340 MUR110 NCP1090/1/2 NCP1031 TL431 VPORTN ON Semiconductor RTN Page 11 DC-DC Power Conversion MBRA160T3 MURA110T3 + 35--76 V -- + 12 V -- MBRA160T3 NCP1030 GND CT VFB COMP VDRAIN VCC UV OV Isolated Bias Supply Regulators Device Topology IO Typ (A) f SW Typ (kHz) VCC Min (V) VCC Max (V) Features Package(s) NCP3231 Step-Down 20 500 4.5 18 0. 6 V internal voltage reference @ up to 15 A QFN-40 NCP3232N Step-Down 15 500 4.5 21 0. 6 V internal voltage reference @ up to 15 A QFN-40 NCP1592 Step-Down 6.0 Up to 700 3.0 6.0 Output down to 0.891 V with 1.0% accuracy TSSOP-28 NCP3133A Step-Down 3.0 1000 2.9 5.5 3 A continuous output; internal soft start QFN-16 NCP3170A Step-Down 3.0 500 4.5 18 Output down to 0.8 V SOIC-8 NCP3170B Step-Down 3.0 1000 4.5 18 Output down to 0.8 V SOIC-8 NCP1032 Flyback; Forward; Step-Down 1.0 Up to 1000 - 200 Integrated 200 V switch; internal soft start WDFN-8 NCP1031 Flyback; Forward; Step-Down 1.0 Up to 1000 - 200 Integrated 200 V switch DFN-8, SOIC-8 NCP1030 Flyback; Forward; Step-Down 0.5 300 - 200 2nd side bias supply Micro8 PWM Controllers Topology Flyback; Forward; Step-Down Step-Down Flyback; Forward; Buck-Boost; Boost Step-Down Step-Down VCC Min (V) 7.6 8.0 3.3 4.7 4.7 VCC Max (V) 75 100 7.5 28 28 f SW Typ (kHz) 400 Up to 500 Up to 1000 400 300; 600 Dual Channel/Multiphase 4.5 20 1200 TL494 Flyback; Forward; Half-Bridge; Push-Pull; Step-Down; Step-Up 7.0 40 Up to 200 Features Small package Non-isolated buck Enhanced UC384x EN, PG, SYNC Capable of 20 A output Compatible to 3.3/5 V DrMOS Versatile controller TL594 Flyback; Forward; Half-Bridge; Push-Pull; Step-Down; Step-Up 7.0 40 Up to 300 Versatile controller Device CS5124 NCP1034 NCP1294 NCP3011 NCP3020 NCP81232* Page 12 Package(s) SOIC-8 SOIC-16 SOIC-16, TSSOP-16 TSSOP-14 SOIC-8 QFN-40 PDIP-16, SOIC-16 PDIP-16, SOIC-16, TSSOP-16 Networking Solutions ARM® Core DC-DC Converters Key Features •High regulating performance from 0.6 V to 1.4 V • Modular efficiency with fragmented power stage • Dynamic voltage scaling per output steps of 6.25 mV by I2C • Tight accuracy of ±1%, due to differential sensing •Fast transient response • Proprietary PFM to PWM transition with equivalent performance to PWM only • Thermally handle high peak current demands up to 10 ms • Flexible design to transient handling output capacitor from 22 µF to 100 µF PWM Efficiency DCDC Converter Modular Output Vin = 3.6 V, Vout = 1.20 V, Fsw = 3.0 MHz, Lossless Inductor(s) 0.95 Efficiency (%) 0.9 0.85 1 2 3 5 10 0.8 Number of Modules 0.75 0.7 0.10 1.00 Load Current (A) VIN (V) VOUT (V) IOUT (A) f SW (MHz) Control Features Package NCP6338 2.3 – 5.5 0.6 – 1.4 6.0 3.0 I²C; VSEL Modular power stage; Differential sensing WLCSP-30 NCP6336B 2.3 – 5.5 0.6 – 1.4 5.0 2.74 I²C Transient load helper WLCSP-20 NCP6335 2.3 – 5.5 0.6 – 1.4 4.0 3.0 I²C; VSEL Transient load helper WLCSP-20 NCP6343 2.3 – 5.5 0.6 – 1.4 3.5 3.0 I²C Dynamic voltage scaling WLCSP-15 Device ON Semiconductor Page 13 Linear Voltage Regulators NCP4671 VIN VIN VBIAS DC/DC converter 1 μF 1 μF CE VOUT VOUT GND 2 μF NCP4671 - Typical Application Schematic NCP59302 Adjustable 3 A LDO Evaluation Board IO Typ Function NCP51460 Device 20 mA Precision Voltage Reference NCP715 50 mA Ultra-low Quiescent Current LDO Linear Voltage Regulator NCP716 80 mA Ultra-low Quiescent Current LDO Linear Voltage Regulator LP2951 100 mA Multi-Feature LDO Linear Voltage Regulator NCP702 200 mA Ultra-low Quiescent Current LDO Linear Voltage Regulator NCP4671 400 mA Low Output Voltage LDO Linear Voltage Regulator NCP705 500 mA Ultra-low Quiescent Current LDO Linear Voltage Regulator NCP690, NCP691, NCP692 1A CMOS LDO Linear Voltage Regulator w/wo Enable NCP693 1A CMOS LDO Linear Voltage Regulator NCP59150 1.5 A Fixed and Adjustable True LDO Linear Voltage Regulator NCP59748 1.5 A Ultra-Low Dropout Voltage Regulator with Bias Rail NCP59302 3A Adjustable True LDO Linear Voltage Regulator NCP59744 3A Precision Ultra-Low Dropout Voltage Regulator NCP59749 3A Ultra-Low Dropout Voltage Regulator with Bias Rail NCP58302 3A Adjustable True LDO Linear Voltage Regulator Page 14 Features •3.3 V reference •Ultra-low quiescent current •Wide input voltage range •Ultra-low quiescent current •Wide input voltage range •Shutdown feature •Fixed or adjustable output (1.25 V to 29 V) •Error flag for out of regulation condition •High PSRR •Very low dropout •Ultra-low noise •Output voltage to 0.6 V •Bias rail structure allows ultra low dropout •Regulates input voltages as low as 0.9 V •High PSRR •Very low dropout •Ultra-low noise •Enhanced ESD: 4 kV and 400 V •Fixed and adjustable outputs •Typical noise voltage of 15 Vrms •Minimum output voltage down to 0.8 V for fixed version and 1.0 V for adjustable version •Typical dropout: 175 mV @ 750 mA; 300 mV @ 1.5 A •Maximum voltage input 18 V •Stable with ceramic capacitors on the output •Typical dropout: 60 mV @ 1.5 A •High PSRR •Very fast transient response • Typical dropout: 175 mV @ 1.5 A; 300 mV @ 3 A • Maximum voltage input 18 V • Stable with ceramic capacitors on the output •Typical dropout: 115 mV @ 3 A •High PSRR •Very fast transient response •Typical dropout: 120 mV @ 3 A •High PSRR •Very fast transient response • Typical dropout: 250 mV @ 1.5 A; 370 mV @ 3 A • Maximum voltage input 18 V • Stable with tantalum capacitors on the output Package SOT-23-5 SC-70-5, DFN-6 WDFN-6 SOIC-8, Micro8™ SOT-23-5 SOT-23-5, SC-70-5, XDFN-6 WDFN-6 DFN-6 UDFN-6 DFN-8, D2PAK-5 DFN-10, QFN-20 D2PAK-5 QFN-20 DFN-10, QFN-20 D2PAK-5 Networking Solutions Advanced Load Switches VCC EN PG Control Logic Charge Pump Delay and Slew Rate Control Smart Load Switch ecoSWITCH™ Integrated Load Switch Device ron (mW) NCP455xx Integrated Load Switch Features Thermal, Undervoltage & Short-Circuit Protection Bandgap & Biases SR Type VIN GND I Max (A) BLEED •Simple/clean design •No current consumption in standby power mode •Small PCB footprint •Low RDS(ON) due to charge pump driving NMOS •Adjustable soft-start time (SR) •Adjustable integrated discharge •Fault protection •Power rail monitoring & sequencing VOUT VI Min (V) VI Max (V) IQ (mA) Discharge Slew Rate (ms) Features Package(s) NCP330 26 at 3.3 V 3 1.8 5.5 100 — 2000 Reverse blocking TDFN-4 NCP333 55 at 3.3 V 1.5 1.2 5.5 1 Auto 95 — WLCSP-4 NCP334 47 at 3.3 V 2 1.2 5.5 1 — 71 — WLCSP-4 NCP335 47 at 3.3 V 2 1.2 5.5 1 Auto 71 — WLCSP-4 NCP336 23 at 3.3 V 3 1.2 5.5 1 — 810 — WLCSP-6 NCP337 23 at 3.3 V 3 1.2 5.5 1 Auto 810 — WLCSP-6 NCP338 27 at 1.8 V 2 1 3.6 0.6 Auto 20 — WLCSP-6 NCP339 26 at 3.3 V 3 1.2 5.5 2 — 2700 Reverse blocking WLCSP-6 NCP432 50 at 1.8 V 1.5 1 3.6 0.6 — 20 — WLCSP-4 NCP433 50 at 1.8 V 1.5 1 3.6 0.6 Auto 20 — WLCSP-4 NCP434 43 at 1.8 V 2 1 3.6 0.6 — 61 — WLCSP-4 NCP435 43 at 1.8 V 2 1 3.6 0.6 Auto 61 — WLCSP-4 NCP436 23 at 1.8 V 3 1 3.6 1 — 27 — WLCSP-6 NCP437 23 at 1.8 V 3 1 3.6 1 Auto 27 — WLCSP-6 NCP439 28 at 3.3 V 2 1 3.6 4 Auto 75 NCP451 WLCSP-4 13 at 3.3 V 3 0.5 5.5 15 Auto 640 NCP45524 18.0 6 0.5 13.5 — Adj — Power good NCP45525 18.0 6 0.5 13.5 — Adj Adj — DFN-8 NCP45560 2.4 24 0.5 13.5 — Adj Adj Power good; Fault DFN-12 NCP45540 3.9 20 0.5 13.5 — Adj Adj Power good; Fault DFN-12 NCP45541 3.9 20 0.5 13.5 — Adj Adj Power good DFN-12 NCP4543 10.2 7.3 0.5 6 — Adj Adj — QFN-18 NCP4545 4.7 10.5 0.5 6 — Adj Adj — QFN-18 NCP45520 9.5 10.5 0.5 13.5 — Adj — Power good; Fault DFN-8 NCP45521 9.5 10.5 0.5 13.5 — Adj Adj Fault DFN-8 ON Semiconductor WLCSP-6 DFN-8 Page 15 MOSFETs for Power Conversion ORing MOSFETs Key Features •Low RDS(on) for low conduction loss •30 V for IM bus ORing •100 V for 48 V bus ORing = MOSFETs as ORing Diodes Device Configuration Polarity VDS (V) VGS (V) RDS(ON) mΩ VGS = 10 V VGS = 4.5 V Typ Typ Qg (nC) Qgd (nC) RG (Ω) Package NTMFS4H01N Single N 25 20 0.5 0.7 47 13 0.8 SO8-FL NTMFS4H01NF Int. Schottky N 25 20 0.53 0.75 46 12 0.8 SO8-FL NTMFS4H02N Single N 25 20 1 1.5 47 10 0.8 SO8-FL NTMFS4H02NF Int. Schottky N 25 20 1 1.6 48 11 0.8 SO8-FL NTMFS4C01N Single N 30 20 0.9 1.2 65 18 1 SO8-FL NTMFS4931N NTMFS5C404NL NTMFS5C410NL Single Single Single N N N 30 40 40 20 20 20 0.85 0.56 0.71 1.2 0.85 1 62.1 81 66 10.1 23.8 22 0.7 --- NTP6410AN Single N 100 20 11 10 120 57 2.4 NTP6411AN Single N 100 20 12.7 --- 100 47 3.1 SO8-FL SO8-FL SO8-FL TO-220, D2PAK TO-220, D2PAK Isolated Topology DC-DC (Bricks) Key Features •Low RDS(on) for low conduction loss •Low capacitance for low switching loss •Integrated Schottky for low diode loss Device NTMFS4H01N NTMFS4H01NF NTMFS4H013NF NTMFS4H02N NTMFS4H02NF NTTFS4H05N NTTFS4H07N NTMFS4C05N NTMFS4C06N NTMFS4C08N NTTFS4C05N NTMFS5C404NL NTMFS5C410NL NTMFS5C442NL NTMFS5830NL NTMFS5832NL NTMFS5C604NL NTMFS5C612NL NTMFS5C646NL NTMFS5844NL NTTFS5820NL NTTFS5826NL Page 16 Configuration Polarity Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single Single N N N N N N N N N N N N N N N N N N N N N N VDS (V) VGS (V) 25 25 25 25 25 25 25 30 30 30 30 40 40 40 40 40 60 60 60 60 60 60 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 48 V RDS(ON) mΩ VGS = 10 V VGS = 4.5 V Typ Typ 0.5 0.53 0.7 1 1 2.6 3.7 2.7 3.2 4.6 2.9 0.56 0.71 2.2 1.7 3.1 0.93 1.2 3.8 10.2 10.1 19 0.7 0.75 1 1.5 1.6 3.8 5.4 4 4.8 6.8 4.1 0.85 1 3.4 2.6 5 1.25 1.65 5 13 13 25 Forward Flyback Push Pull Half Bridge Full Bridge Vout Qg (nC) Qgd (nC) Ciss (pF) Crss (pF) RG (Ω) 47 46 28 47 48 9.8 6.1 14 11.6 8.4 14.5 81 66 22 60 25 52 41 15.7 15 15 8.4 13 12 7.5 10 11 2.7 1.7 5 4 3.3 5.5 23.8 22 5793 5706 3780 2672 2634 1232 768 1972 1683 1113 1988 12168 8862 3000 5880 2700 8900 6660 2164 1460 1462 850 241 237 150 111 109 51 32 59 40 39 71 79.8 116 28 500 250 40 45 17 96 96 50 0.8 0.8 1 0.8 0.8 1 0.8 1 1 1 1 ---0.5 1.2 ---0.62 0.62 1.5 32 12.7 12.7 10.9 5.1 8 8 3.9 Application Secondary Synchronous Primary Package SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL u8FL u8FL SO-8FL SO-8FL SO-8FL u8FL SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL SO-8FL u8FL u8FL Networking Solutions MOSFETs for Power Conversion Non-Isolated Topology “Buck” DC-DC Control Key Features •Low RDS(on) for low conduction loss •Low capacitance for low switching loss •Integrated Schottky for enhanced light load efficiency RDS(ON) mΩ VGS = 10 V VGS = 4.5 V Typ Typ Configuration VDS (V) VGS (V) NTMFS4H01N Single 25 20 0.5 NTMFS4H01NF Int. Schottky 25 20 NTMFS4H013NF Int. Schottky 25 20 NTMFS4H02N Single 25 NTMFS4H02NF Int. Schottky 25 NTTFS4H05N Single NTTFS4H07N Single NTMFS4C05N NTMFS4C06N Vin Cin Sync PWM Controller Cout Vout Qg (nC) Qgd (nC) Ciss (pF) Crss (pF) RG (Ω) Application Package 0.7 47 13 5793 241 0.8 Synchronous side SO-8FL 0.53 0.75 46 12 5706 237 0.8 Synchronous side SO-8FL 0.7 1 28 7.5 3780 150 1 Synchronous side SO-8FL 20 1 1.5 47 10 2672 111 0.8 Synchronous side SO-8FL 20 1 1.6 48 11 2634 109 0.8 Synchronous side SO-8FL 25 20 2.6 3.8 9.8 2.7 1232 51 1 Control Side u8FL 25 20 3.7 5.4 6.1 1.7 768 32 0.8 Control Side u8FL Single 30 20 2.7 4 14 5 1972 59 1 Synchronous side SO-8FL Single 30 20 3.2 4.8 11.6 4 1683 40 1 Synchronous side SO-8FL NTMFS4C08N Single 30 20 4.6 6.8 8.4 3.3 1113 39 1 Synchronous side SO-8FL NTMFS4C09N Single 30 20 4.6 6.8 10.9 5.4 1252 126 1 Synchronous side SO-8FL NTMFS4C10N Single 30 20 5.8 8.9 9.8 3.7 987 162 1 Synchronous side SO-8FL NTMFS4C13N Single 30 20 7.3 11.4 7.8 3.7 770 127 1 Synchronous side SO-8FL NTTFS4C05N Single 30 20 2.9 4.1 14.5 5.5 1988 71 1 Control Side u8FL NTTFS4985NF Int. Schottky 30 20 2.8 4.16 13.6 4.1 2075 46 1 Synchronous side u8FL NTTFS4C08N Single 30 20 4.7 7.2 8.4 3.3 1113 39 1 Control Side u8FL NTTFS4C10N Single 30 20 5.9 8.8 10.1 6.1 993 163 1 Control Side u8FL NTTFS4C13N Single 30 20 7.5 11.2 7.8 3.7 770 127 1 Control Side u8FL Device ON Semiconductor Page 17 Thermal Management 8 GPIOs Extensive Portfolio SMBus Interface RESET I/O Local Sensors provide temperature information at the device location Remote Sensors provide temperature information of a transistor located at a different position on the board; also includes local sensor capability 4 PWM O/Ps System Voltages +12 V +5 V +3.3 V 8 Tach Inputs +2.5 V +1.8 V Fan Controllers integrate the temperature sensor with a fan controller/monitor System Monitors integrate combinations of remote and/or local temperature sensing, voltage monitoring, fan control & monitoring, reset control, and GPIO functions Fan Drive and Control • 4 PWM Fan Drive Outputs • 8 Tach Inputs Fan2Max +1.5 V +1.25 V +0.9 V TDM1 Temperature • Measures 4 Temp Zones TDM2 VBatt TDM3 1 Local 3 Remote THERM I/O Bi-directional THERM Pins Chassis Intrusion ALERT O/P Supply Range (V) 3 - 5.5 3 - 5.5 2.8 - 5.75 3 - 3.6 3 - 3.6 3 - 3.6 3 - 3.6 3 - 3.6 2.8 - 3.6 1.4 - 2.75 3 - 5.5 3 - 5.5 3 - 5.5 3 - 3.6 3 - 3.6 Temperature Range (°C ) -40 to +120 -40 to +125 -40 to +125 -40 to +120 -40 to +120 -40 to +120 -40 to +120 -40 to +120 -40 to +125 -40 to +125 -55 to +125 -40 to +125 -40 to +125 -40 to +125 -40 to +125 Local Accuracy (°C) ±3 ±2.25 ±2 ±1.5 ±1.5 ±1.5 ±1 ±1 ±1 ±1.75 ±1 ±3 ±3 ±1 ±1 Interface I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS I2C/SMBUS Number of Addresses 3 2 8 3 3 1 8 8 2 2 9 2 2 2 9 NCT75 3 - 5.5 -55 to +125 ±1 I2C/SMBUS 8 NCT275* 3 - 5.5 -55 to +125 ±1 I2C/SMBUS 4 NCT203 1.4 - 2.75 -40 to +125 ±1.75 I2C/SMBUS 1 Device ADM1026 System ADT7462 Monitors NCT80 ADT7476 ADT7473 ADT7475 Fan Controllers ADM1033 ADM1034 NCT72 NCT218 NCT210 Remote ADM1032 Sensors ADT7461 ADT7481 ADT7483 Local Sensors SRC (Ω) — 2k — — 3k — 1k 1k 1.5 k 150 — — 3k — — Remote Accuracy ±3 ±2.25 — ±1.5 ±1.5 ±1.5 ±1 ±1 ±1 ±1 ±3 ±1 ±1 ±1 ±1 Remote Channels 2 3 — 2 2 2 1 2 1 1 2 1 1 2 2 Fan Channels 8 4 — 3 3 3 1 2 Voltage TACH Monitoring Channels Channels 8 19 8 13 2 7 4 5 4 4 1 2 GPIOs 17 8 1 — Package LQFP-48 LFCSP-32 TSSOP-24 QSOP-24 QSOP-16 QSOP-16 QSOP-16 QSOP-16 DFN-8, WDFN-8 WDFN-8, WLCSP-8 QSOP-16 SOIC-8, MSOP-8 SOIC-8, MSOP-8 MSOP-10 QSOP-16 DFN-8, SOIC-8, Micro8 CSP-6 DFN-8, SOIC-8, Micro8 * Pending 2H14. Page 18 Networking Solutions EEPROMs for Configuration and Calibration Features EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs (I2C, SPI, Microwire) •Broad density range: 1 kb to 2 Mb •Wide operating Vcc range: 1.8/1.7 V to 5.5 V •High endurance: 1 million program/erase cycles •Wide temperature range: industrial and extended EEPROMs Data Transmission Standard I2C SPI Microwire Device Density Organization* VCC Min (V) VCC Max (V) fCLK Max (MHz) Package(s) CAT24M01 CAT24C512 CAT24C256 CAT24C128 CAT24C64 CAT24C32 CAT24C16 CAT24C08 CAT24C04 CAT24C02 CAT25M02 CAT25M01 CAT25512 CAT25256 CAT25128 CAT25640 CAT25320 CAT25160 CAT25080 CAT25040 CAT25020 CAT25010 CAT93C86 CAT93C86B CAT93C76 CAT93C76B CAT93C66 CAT93C56 CAT93C46 CAT93C46B 1 Mb 512 kb 256 kb 128 kb 64 kb 32 kb 16 kb 8 kb 4 kb 2 kb 2 Mb 1 Mb 512 kb 256 kb 128 kb 64 kb 32 kb 16 kb 8 kb 4 kb 2 kb 1 kb 16 kb 16 kb 8 kb 8 kb 4 kb 2 kb 1 kb 1 kb 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 256k x 8 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 128 x 8 2k x 8 / 1k x 16 2k x 8 / 1k x 16 1k x 8 / 512 x 16 1k x 8 / 512 x 16 512 x 8 / 256 x 16 256 x 8 / 128 x 16 128 x 8 / 64 x 16 128 x 8 / 64 x 16 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 / 1.65 1.8 1.8 / 1.65 1.8 1.8 1.8 1.8 / 1.65 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 1 1 1 1 1 1 0.4 0.4 0.4 0.4 10 10 20 20 20 20 20 20 20 20 20 20 3 4 3 4 2 2 2 4 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8; WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 * Organization for Microwire devices is selectable. Application Specific EEPROMs Data Transmission Standard Device Density Organization VCC Min (V) VCC Max (V) fCLK Max (MHz) I2C I2C 2 I C/SMBus CAT24C208 CAT34C04* CAT34TS04 8 kb 4 kb 4 kb 1024 x 8 512 x 8 512 x 8 2.5 1.7 2.2 5.5 5.5 5.5 0.4 1 1 I2C CAT34C02 2 kb 256 x 8 1.7 5.5 0.4 I2C/SMBus CAT34TS02 2 kb 256 x 8 3.0 3.6 0.4 Package(s) Notes SOIC-8 UDFN-8 TDFN-8, UDFN-8 UDFN-8, TDFN-8, TSSOP-8 TDFN-8, UDFN-8 VESA™ dual-port serial EEPROM Serial Presence Detect (SPD) I2C EEPROM for DDR4 DIMM 4 kb SPD EEPROM w/ Temperature Sensor for DDR4 DIMM Serial Presence Detect (SPD) I2C EEPROM for DDR3 DIMM 2 kb SPD EEPROM w/ Temperature Sensor for DDR3 DIMM * Pending 4Q14. ON Semiconductor Page 19 Signal Conditioning Low Voltage, Low Power Operational Amplifiers Sensor Buffering Sensor/ Accelerometer Sensor/ Accelerometer MCU Operational Amplifiers Device Page 20 Description Package(s) LMV301 Single 1.8 V RRO CMOS Op Amp SC-70 LMV321 Single 2.5 V RRO Op Amp SC-70, SOT-23 LMV324 Quad 2.5 V RRO Op Amp TSSOP-14, SOIC-14 LMV358 Dual 2.5 V RRO Op Amp SOIC-8, Micro8, uDFN-8 LMV821 Single 2.5 V RRO Op Amp SC-70 LMV824 Quad 2.5 V RRO Op Amp TSSOP-14, SOIC-14 LMV931 Single 1.8 V RRIO CMOS Op Amp TSOP-5, SC-70 LMV981 Single 1.8 V RRIO CMOS Op Amp with EN uLLGA-8 LMV982 Dual 1.8 V RRIO CMOS Op Amp with EN uQFN-10 NCS2001 Single 0.9 V Op Amp SOT-23, SC-70 NCS2004 Single RRO Op Amp SC-70 TLV271 Single RRO Op Amp TSOP-5 Networking Solutions Signal Conditioning Switching Devices ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0. 2nd LCD Display LCD Panel VGA Switch Docking Station Connector External Graphics Processor TMDS DisplayPort Switch HDMI/DVI Switch LAN Switch Internal Graphics Processor PCIe Switch Gigabit LAN Transceiver North Bridge (ICH) South Bridge (MCH) USB Power/ Data Switch Audio Amp Stereo Switch Processor Codec Mic Switch Server Implementation ON Semiconductor Device Interface Data Rate NCN3612B NCN3411 NCN2612B NCN2411 NS3L500 NCN7200 NCN1188 NS5S1153 NLAS7242 NLAS52231 NLAS4684 PCIe 3.0, DisplayPort 1.2 PCIe 3.0 PCIe 2.0, DisplayPort 1.1 PCIe 2.0 Gigabit Ethernet Gigabit Ethernet USB 2.0 / MHL USB 2.0 USB 2.0 Audio Audio 8 Gb/s 8 Gb/s 5 Gb/s 5 Gb/s 1 Gb/s 1 Gb/s 2.25 Gb/s 480 Mb/s 480 Mb/s 36 MHz 9.5 MHz No Quiescent Channels Current 12 8 12 8 11 11 2 2 2 2 2 250 μA 200 μA 250 μA 200 μA 250 μA 380 μA 21 μA 21 μA 1 μA 1 μA 180 nA Page 21 Digitally Programmable Potentiometers for Trimming and Calibration RH0 Features SCL SDA •No drift over time or temperature •No changes due to mechanical stress or shock •Systems can be calibrated real-time, in the field •Broad portfolio provides for selection of optimal number of pots and taps PC BUS INTERFACE CAT5120/1/2 CAT5110 CAT5112 CAT5114 CAT5115 CAT5118/9 CAT5123 CAT5124 CAT5125 CAT5126 CAT5127 CAT5128 CAT5111 CAT5113 CAT5116 CAT5132 CAT5133 CAT5136/7 CAT5138 CAT5140 CAT5171 CAT5172 CAT5221 CAT5411 CAT5419 CAT5261 CAT5269 CAT5271 CAT5273 CAT5241 CAT5401 CAT5409 CAT5251 CAT5259 Page 22 RH2 RH3 WIPER CONTROL REGISTERS RW0 RW1 WP A0 A1 A2 A3 RW2 CONTROL LOGIC NONVOLATILE DATA REGISTERS RW3 RL0 Device RH1 RL1 RL2 RL3 Number of Pots Number of Taps Resistance (kΩ) Buffered Wiper Interface Packages 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 4 4 4 4 4 16 32 32 32 32 32 32 32 32 32 32 32 100 100 100 128 128 128 128 256 256 256 64 64 64 256 256 256 256 64 64 64 256 256 10; 50 10; 50; 100 10; 50; 100 10; 50; 100 10; 50; 100 10; 50; 100 10 50 10 10 10 10; 50 10; 50; 100 1; 10; 50; 100 32 10; 50; 100 10 50 10 50; 100 50; 100 50 2.5; 10; 50; 100 2.5; 10; 50; 100 2.5; 10; 50; 100 50; 100 50; 100 50; 100 50 2.5; 10; 50; 100 2.5; 10; 50; 100 2.5; 10; 50; 100 50; 100 50; 100 No No Yes Yes No No No No No OTP Yes No Yes Yes Yes Yes Yes No No Yes No No Yes Yes Yes Yes Yes No No Yes Yes Yes Yes Yes Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down Up/Down I2C Up/Down I2C I2C I2C I2C SPI I2C SPI I2C SPI I2C I2C I2C I2C SPI I2C SPI I2C SC-70; SOT-23 SC-70; SOT-23 MSOP-8; PDIP-8; SOIC-8; TSSOP-8 MSOP-8; PDIP-8; SOIC-8; TDFN-8; TSSOP-8 MSOP-8; PDIP-8; SOIC-8; TSSOP-8 SC-70; SOT-23 SOT-23 SOT-23 SOT-23 MSOP-8; TDFN-8 MSOP-8 SOT-23-8 MSOP-8; PDIP-8; SOIC-8; TSSOP-8 MSOP-8; PDIP-8; SOIC-8; TSSOP-8 MSOP-8; PDIP-8; SOIC-8; TSSOP-8 MSOP-10 MSOP-10 SC-70 SC-70 MSOP-8 SOT-23-8 SOT-23-8 SOIC-20W; TSSOP-20 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 MSOP-10 MSOP-10 SOIC-20W; TSSOP-20 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 SOIC-24W; TSSOP-24 Networking Solutions Surge Protection For lower data-rates (10/100BASE-T, xDSL), ON Semiconductor offers a combination of crowbar devices known as thyristor surge protector devices (TSPD), and transient voltage suppressor (TVS) devices similar to those used in ESD protection. TSPDs offer the advantage of lower clamping voltages and possess higher surge current capability, for both common and differential mode protection. 30 25 Voltage (V), Current (A) ON Semiconductor provides solutions for protecting against surge strikes, induced by a lighting strike or power-cross fault. Common interfaces found in a wide variety of consumer and telecommunications/networking equipment are the RJ45 interface for the 10/100BASE-T and 1000BASE-T Ethernet protocols and the RJ11 interface for xDSL protocols. RJ45 consists of four pairs of differential data lines, each carrying a maximum data rate of 250 Mbps in a 1000BASE-T configuration, while RJ11 consists of a single differential data pair. These interfaces are often surge rated to an intra-building standard. Protection for these interfaces mainly consist of ensuring that transverse (metallic or differential) surge strikes do not damage sensitive downstream chips such as PHYs. Differential protection is achieved by connecting shunt protection elements from line-to-line (for each pair of lines) that transfer the incoming hostile surge energy back towards the source. This is different from common mode protection as elements are connected line-to-GND and shunt the surge energy to GND. ESD1014 V(t) ESD1014 I(t) Competitor V(t) Competitor I(t) 20 15 10 5 0 -10 0 10 20 30 40 50 Time (μs) 60 IPP IH IT VC VBR VRWM IR IBO Voltage VD 90 TVS clamping devices support surge levels for the 8/20 μs pulse and are commonly used on the tertiary or PHY-side to capture and safely dissipate any residual surge pulses. Pictured in the figure above is a time-domain plot of the 8/20 μs surge current applied to the ESD1014 TVS from ON Semiconductor. Also shown are time-domain response voltages, clearly showing the superiority of the ON Semiconductor solution in comparison to a competing device. Current TSPD TSPD 80 Example of V & I plots in an 8/20 μs surge IPPS ITSM IT IDRM 70 VDRM VBO I IR VRWM VBR VC IT V TVS IPP ON Semiconductor Page 23 Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit Two & Four Pairs, Low Capacitance Surge and ESD Protection The 10/100BASE-T, 1000BASE-TX, and Gigabit Ethernet (GigE) interfaces operating at higher rates are susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards. Features Typical Application CLC03 8 TPOPD C1 C+ VDD C5 ESD1014 TPOND BLC03 RJ45 TRANSFORMER C5 8 TPONC C1 8 TPOPC B+ VDD 1 •Compatible with Gigabit Ethernet and beyond •Enhanced protection for downstream electronics •Accommodates operating transients above 3.3 V •Small form-factor allows integration into connectors TPONB C1 ALC03 ESD1014 TPOPB A+ VDD C5 1 Benefits TPONA C1 1 1000BASE-T ETHERNET TRANSCEIVER TPOPA 8 1 •Wide range of voltages and capacitance values for tertiary protection •Vclamp (25 A surge) < 11 V •IEC 61000-4-2 rating > 30 kV •No latching danger •Surge rating maintained to 125°C D+ VDD C5 DLC03 Line Side : LC03-6 (optional) Transformer Side: ESD1014 Protection against metallic (transverse) strikes Typical Application SRDA3.3 8 1 VDD Through Board TRANSFORMER A+ MX4+ TR4+ MDI_A+ A– MX4– TR4– MDI_A– VDD RJ45 B+ MCT4 TCT4 B– 10/100BASE-T LINE DRIVER C+ C– D+ D– CHASSIS GND Transformer Side – SRDA3.3 Line-to-Line protection against metallic strikes With ESD1014 Transient Voltage Suppressors Device Data Lines 2 pair ESD Only NUP4114H 10/100/1000BASE-TX, GigE 1 pair SRDA3.3 10/100BASE-T 2 pair ESD1014 1000BASE-TX, GigE 1 pair Line Side LC03-6 10/100/BASE-T, GigE Page 24 Typical ESD Surge IPP Line-Line Contact VDC Max 8/20 ms Capacitance Rating (V) (A) (pF) (±kV) Package 5.0 12* 0.4 13 TSOP-6 3.3 25 4 8 SOIC-8 3.3 25 1.5 30 UDFN-10 5.0 100 8 30 SOIC-8 Signal Integrity for Gigabit Ehternet Networking Solutions T1/E1, T3/E3, and xDSL Ports Surge protection for GR-1089, TIA-968-A, ITU-T and IEC 61000-4-5 T1/E1 links (< 2 Mbps), T3/E3 links (< 43 Mbps) and xDSL lines (< 52 Mbps) are susceptible to ESD strikes, cable-discharge events and lightning-induced transients. TVS Features Benefits •Capable of all T1/E1 and xDSL voltages with a variety of capacitance values, for driver-side protection •Required data-rates are supported by TSPDs •TVS devices provide high levels of tertiary protection without latching TSPD Features •Cline <14 pF for 50 A surge under 8/20 µs (NP0080TA series) TIP VOICE (POTS) RING xDSL MODEM SL15 x2 Typical xDSL + POTS Application Thyristor Surge Protection Devices Device NP0080TA Series VDRM (V) 8-16 VBO (V) 9.5-18 VT (V) — CO (pF) 11-13 IH (mA) 50 Surge IPP, 10/1000 ms (A) 50 (8/20 ms) Package TSOP-5 Transient Voltage Suppressors Device SRDA3.3 SRDA05 LC03-6 SL05 to SL24 ON Semiconductor VDC Max (V) 3.3 5.0 5.0 5 to 24 Surge IPP, 8/20 ms (A) 25 23 100 5 to 17 Line-Line Capacitance (pF) 4.0 5.0 8.0 3.5 ESD Contact Rating (kV) ±8 ±8 ±30 ±8 Package SOIC-8 SOIC-8 SOIC-8 SOT-23 Page 25 Electronic Fuses for Inrush Current Limiting on Power Buses 5 V and 12 V Power Bus Protection Features VCC •Low RDS(ON), high operating and trip currents (IOP, ITRIP) •Overvoltage protection •Precise ITRIP control •Slew rate control •Thermal shut-down •EN pin for synchronizing multiple eFuses •Outperforms poly-fuses: –Tighter spec tolerances –Lower resistance –Shorter trip-time –Superior repeatability •High efficiency with high current capability •eFuses in parallel achieve practically any desired level of IOP and ITRIP Enable/ Fault Charge Pump Enable Source Thermal Shutdown Current Limit UVLO Voltage Clamp ILimit dV/dt Control dV/dt GND Typical Feature Set for eFuse 3 V Power Bus SATA Power 3.3 V NIS5431 3.3 V 3.3 V GND RLIM ENABLE GND 5 V Power Bus GND 5V RLIM NIS545x 5V 5V NIC - Media Type Independent Small Form Factor Pluggable Module GND 3 V Power ENABLE GND NIS5431 RLIM 12 V NIS5232 12 V 3.3 V PCIe 12 V 12 V Power Bus Network Interface Card Application Device NIS5112 NIS5132 NIS5232 NIS5135 NIS5450* NIS5451* NIS5452* NIS5431* Hard Drive/Solid State Drive Application Input Voltage (V) Output Clamping Voltage (V) ITRIP Trip Current (A) RDS(ON) (mW) Adjustable ITRIP Auto Recovery Latching Package -0.6 to 18 -0.6 to 18 -0.6 to 18 -0.6 to 18 -0.6 to 14 -0.6 to 14 -0.6 to 14 -0.6 to 14 15 15 15 6.65 5.85 5.5 5.85 3.85 2.5 3.5 4 3.5 3.1 1.6 2.1 1.6 28 44 44 68 40 40 40 45 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No Yes Yes No No No Yes Yes Yes Yes Yes Yes Yes Yes SOIC-8 DFN-10 DFN-10 DFN-10 WDFN-10 WDFN-10 WDFN-10 WDFN-10 * Pending 4Q14. 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