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Timing and Data Distribution Subsystem
Clock Solutions
Data Distribution
Skew Delay
Receivers
Translator
Crystal
PLL Clock
Generator
PLL Clock
Module
Reference
Clock
PLL Clock
Synthesizer
MUX
Fanout
Crosspoint
Translator
Drivers
Skew Delay
Flip-Flop
Divider/
Counter
Latches
Processor
ASIC
Equalization
Fanout
CMOS/TTL
HCSL
LVDS
PECL/CML
PE/EQ
Pre-Emphasis
ZDB
Processor
Crosspoint
MUX
ASIC
Pre-Emphasis
PLL Clock
Generator
Gates
Translator
Gates
I/O
I/O
Latches
Discrete PLL Blocks
Phase
Detector
Divider/
Prescaler
Loop
Filter
Gates
CMOS/TTL
HCSL
LVDS
PECL/CML
PE/EQ
Data
PLL Clock
Module
VCO
Processor
Latches
ASIC
Flip-Flop
ZDB
I/O
Backplane
ON Semiconductor provides a complete portfolio of timing and data management solutions for all aspects of the clock tree. System
designers can optimize their clock circuits with industry leading clock distribution devices, demonstrating the industry’s lowest jitter and
skew. A broad product portfolio, with multiple output and interface options, allows system designers to build clock circuits that satisfy
their specific application requirements. ON Semiconductor utilizes CMOS, Bipolar, and SiGe technology to leverage the best performance
for any given application. For further details by device, function, or parametrics, refer to our website at www.onsemi.com.
Expanding on more than 30 years of experience as the world’s leader in high performance ECL-based clock distribution, ON Semiconductor
has extended its expertise into ultra low jitter PLL clock synthesis and generation. The new PureEdge™ PLL devices utilize a fully
differential architecture that enables performance that satisfies the timing requirements for the most demanding applications.
Performance Capabilities
•Differential design for reduced noise
•ECL, PECL, CML, LVDS, HSTL, HCSL, LVTTL/LVCMOS outputs for flexible
interfacing
•Maximum clock rates >10 GHz
•Maximum data rates >12 Gbps
•Typical jitter as low as 30 fs
•Integrated termination resistors for simplified circuit design
•Edge rates as low as 28 ps
•Low phase noise floor ≤ –174 dBc/Hz
•Low skew
Page 2
Networking Solutions
PLL Clock Synthesizers/Generators
Synthesizer/
Generator
Features
•Based on phase-locked-loop techniques with zero PPM synthesis error
•Low jitter for high accuracy clock signals
•Available in industrial temperature range -40°C to +85°C
•Supports output interfaces: LVPECL, LVDS, HCSL, LVTTL/LVCMOS
•Multiple PLLs and multiple output options
NB3N5573 Typical Phase Noise at Fc = 200 MHz
Input
(MHz)
25
25
25
5 to 27
2 to 50
2 to 50
5 to 52
27
1 to 50
25
25
25
Device
NB3N3002
NB3N5573
NB3N51032
NB3N3020
NB3N501
NB3N502
NB4N507A
NB3N508S
NB3N511
NB3N51034
NB3N51044
NB3N51054
Output
(MHz)
25/125/200
25/100/125/200
25/100/125/200
5 to 210
13 to 160
14 to 120
50 to 200
216
14 to 200
100/200
100/125
100
Application
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
Network GigE
Networking, Consumer, STB
Networking, Consumer, STB
Networking, Consumer, STB
VCXO Set Top Box
Networking, Consumer, STB
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
XTAL
3
3
3
3
3
3
3
3
3
3
3
3
CML
3
Input Level
CMOS LVPECL
3
3
3
3
3
3
3
3
3
3
TTL
3
3
3
Output
Level
HCSL
HCSL
HCSL
ECL, LVTTL
CMOS
LVCMOS
ECL
LVDS
CMOS
HCSL
HCSL
HCSL
VCC Typ
(V)
3.3
3.3
3.3
3.3
3.3, 5
3.3, 5
3.3, 5
3.3
3.3, 5
3.3
3.3
3.3
Package(s)
TSSOP-16
TSSOP-16
TSSOP-16
TSSOP-16
SOIC-8
SOIC-8
SOIC-16
TSSOP-16
SOIC-8
TSSOP-20
TSSOP-28
TSSOP-24
PCIe Timing Solutions
•PCIe clock synthesizers with single, dual, and quad outputs
•PCIe buffers with 1:6, 1:8, 1:10, and 1:21 fanouts
•Solutions for one, two, six, eight, ten, and twenty-one channel applications available
•Ultra low skew
•Small propagation delay variation (up to 21 output)
•Jitter compliant with PCIe Gen 1,2, 3 specification
•Direct device interface eliminates external termination components and simplifies BOM
100 MHz HCSL
100 MHz HCSL
NB3N3002/5573
100 MHz HCSL
FPGA 1
FPGA 2
NB3N106K/108K/111K/121K
1:6, 1:8, 1:10 HCSL
100 MHz HCSL
100 MHz HCSL
ASIC 1
ASIC 2
PCIe Gen 1, 2, 3 Clock Generation and Distribution
ON Semiconductor
Jitter Results After Fanout
Page 3
Zero Delay Buffers
Zero Delay
Buffer PLL
FBK
2
PLL
REF
Extra Divider (−3, −4)
Features
CLKA1
2
MUX
CLKA2
Extra Divider
(–5H)
•Industry standard functions and pin-outs
•Zero input-output propagation delay, adjustable by
capacitive load
•Multiple configurations available for maximum flexibility
•Operating frequency to 133 MHz for CPU and PCI
compatibility
Device
Input
Level
Output
Level
VCC Typ
(V)
fMax Typ
(MHz)
NB3N2302
CMOS
CMOS
3.3, 5
133
NB2304A
CMOS
CMOS
3.3
NB2305A
CMOS
CMOS
3.3
NB2308A
CMOS
CMOS
NB2309A
CMOS
CMOS
CLKA3
CLKA4
S2
SELECT
INPUT
DECODING
S1
Extra
Divider
(–2, –3)
NB2308A
Functional Diagram
Channels
tSkew O-O
Max (ps)
Package(s)
2
250
SOIC-8
133.3
4
200
SOIC-8
133.3
5
250
SOIC-8, TSSOP-8
3.3
133.3
8
200
SOIC-16, TSSOP-16
3.3
133.3
9
250
SOIC-16, TSSOP-16
2
CLKB1
CLKB2
CLKB3
CLKB4
PCIe Zero Delay Buffers
Supports HCSL & NMOS Push Pull Outputs
OE_[11:0]#
12
FB_OUT*
FB_OUT#*
SSC Compatible
PLL
CLK_IN
DIF_[11:0]
MUX
DIF_[11:0]#
CLK_IN#
100M_133M#
HBW_BYPASS_LBW#
SA_0
SA_1
PWRGD/PWRDN#
SDA
SCL
Features
Control
Logic
* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L
** IREF pin is for NB3N1200K only; it is NC for NB3W1200L
Simplified Block Diagram
* Pending 2H14.
Page 4
IREF**
RREF
•NB3N1200K, NB3W1200L – 12 outputs
•NB3N1900K*, NB3W1900L* – 19 outputs
•DIF SRC clock support
•Optimized for 100/133 MHz to meet PCIe Gen
2/3 and Intel QPI phase jitter specifications
•Spread spectrum compatible for low EMI
•Pseudo-external fixed-feedback for <100 ps
input-to-output delay variation
•Individual OE control pin to enable/disable outputs
•<65 ps output-to-output skew
•50 ps cycle-to-cycle jitter (PLL mode)
•QFN-64 or QFN-72 package
Networking Solutions
PureEdge ™ Clock Oscillator Modules
VDD
6
CLK CLK
5
4
Crystal
PLL
Clock
Multiplier
1
VC
2
OE
3
VC
CLCC-6
VDD
6
1
OE
VDD
6
1
OE
CLK
5
2
FSEL
CLK
5
2
NC
CLK
4
3
GND
CLK
4
3
GND
Dual Frequency Pinout
(Bottom View)
Single Frequency Pinout
(Bottom View)
Features
•Broad portfolio of Crystal Oscillators XO and Voltage-Controlled
Crystal Oscillators (VCXO)
•Fully integrated crystal reference and PLL synthesizer in the
ceramic module
•Industry standard 5 mm x 7 mm x 1.9 mm ceramic module
•Footprint compatible replacement to 3rd overtone, and SAW
based XO/VCXO modules
•XOs offer up to two user selectable frequencies
•Lower cost and shorter lead time
•LVPECL, LVDS and CML outputs
•Output Enable (OE) available
•Total frequency stability of ± 20 PPM or ± 50 PPM
•Industrial temperature range -40°C to +85°C
•Low phase noise floor ≤ -160 dBc/Hz
•Integrated phase RMS jitter (12 kHz – 20 MHz) 0.5 ps (Typ)
•Spurious noise less than -70 dBc
•VCXOs have positive tuning slope
•VCXOs have 10% linearity for specified tuning range
•VCXOs have ±100 PPM pulling range guaranteed
•All standard frequencies available (50 MHz to 700 MHz)
•NBXzzA0xx –XO with total frequency stability of ±50 PPM
•NBXzzB0xxx – XO with total frequency stability of ±20 PPM
•NBVSBA0xx – VCXO with LVPECL output
•NBVSPA0xx – VCXO with LVDS output
Typical Phase Noise/Jitter Plot @ 125 MHz
ON Semiconductor
Page 5
Dividers and Counters
Counters/
Dividers
Features
•Low jitter and skew for highly accurate phase matching
•Multiple outputs and ratios combined for integrated circuit designs
•Supports interface and voltage translation
Device
NB4L339
NB7V32M
NB7N017M
NB7L32M
NB6N239S
NB6L239
CML
3
3
3
3
3
3
Input Level
CMOS LVPECL
3
3
3
3
3
3
3
3
LVDS
3
3
3
3
3
3
Output
Level
ECL
CML
CML
CML
LVDS
ECL
VCC Typ
(V)
2.5, 3.3
1.8, 2.5
3.3
2.5, 3.3
3.3
2.5, 3.3
fMax Typ
(GHz)
0.7
10
3.5
14
3
3
Div Ratios
1 or 2; 2; 4; 8
2
2 to 256
2
1/2/4/8; 2/4/8/16
1/2/4/8; 2/4/8/16
Package(s)
QFN-32
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
DIVSEL
CLKSEL
CLKA
VTA
CLKA
50−
50−
CLKB
VTB
CLKB
50−
50−
EXAMPLE: fin = 622.08 MHz
EN
EN
A
÷1 / ÷2
R
A
QA0
QA0 foutA = 622.08 MHz
QA1
or 311.04 MHz
QA1
B
÷2
R
B
QB0
QB0
QB1
QB1
C
÷4
R
C
QC0
QC0 foutC = 155.52 MHz
QC1
QC1
D
÷8
R
D
QD0
QD0
QD1
QD1
MR
foutB = 311.04 MHz
foutD = 77.76 MHz
NB4L339 Functional Diagram
Page 6
Networking Solutions
Clock and Data Distribution
VDD
VDDO
GND
Features
Outputs per
Channel
21
12
12
10
10
10
10
8
8
8
6
6
6
6
5
5
5
4
4
4
4
4
4
4
4
4
4
4
2
2
2
2
2
2
2
2
2
2
2
2
1
ON Semiconductor
Input Level
Output Level
HCSL
CMOS
CMOS
CMOS
HCSL, CMOS,LVDS, ECL
HCSL
CML
HCSL
ECL
CML
HCSL
CML
CML
CML
CMOS
ECL
ECL
CMOS, TTL
ECL
ECL
CML
ECL
CML
LVDS
LVDS
CML
ECL
CML
CMOS, TTL
ECL
CML
ECL
CML
LVDS
ECL
CML
CML
CML
CML
ECL
ECL
CML
3
CMOS
LVPECL
HCSL
HSTL
LVDS
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
XTAL
TTL
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
VCC Typ
(V)
3.3
2.5, 3.3
1.8, 2.5, 3.3
1.5, 1.8, 2.5, 3.3
2.5, 3.3
3.3
2.5, 3.3
3.3
2.5, 3.3
2.5, 3.3
3.3
1.8, 2.5
1.8
1.8, 2.5
1.5, 1.8, 2.5, 3.3
2.5,3.3
2.5, 3.3
2.5, 3.3
3.3
3.3
2.5
2.5, 3.3
2.5, 3.3
2.5
3.3
2.5
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
3.3
2.5, 3.3
2.5, 3.3
3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
1.8, 2.5
2.5, 3.3
2.5, 3.3
Q1
SEL0
SEL1
•Complete portfolio of fanout buffers, multiplexers, cross point switches
•Supporting frequencies from DC to 12 GHz/Gbps
•Device noise floor as low as -174 dBc
Clock and Data
•Pre-Emphasis and Equalization blocks available
Distribution
•Offer new direct X-tal interface capabilities
•Industry leading additive jitter as low as 30 fs typical
•Industry leading output-to-output skew as low as 3 ps minimum
•Wide offering of voltage and interface translation:
•ECL, PECL, CML, LVPECL, LVDS, M-LVDS, HSTL, HCSL, LVCMOS/LVTTL
•Power supply 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V
Device
NB3N121K
NB3L83948C
NB3V8312C
NB3F8L3010C
NB3M8T3910G
NB3N111K
NB7L111M
NB3N108K
NB7L1008
NB7L1008M
NB3N106K
NB7V585M
NB7V586M
NB7VQ1006M
NB3F8L3005C
NB3L853141
NBSG14
NB3M8304C
NB3N853501E
NB3N853531E
NB6HQ14M
NB6L14
NB6L14M
NB6L14S
NB6N14S
NB7HQ14M
NB7L14
NB7L14M
NB3M8302C
NB4L339
NB4N11M
NB6L11
NB6L11M
NB6L11S
NB6L611
NB7L11M
NB7L72M
NB7L572
NB7VQ572M
NBSG11
NB6L56
Q0
Q2
CLK0
CLK0
Q3
CLK1
CLK1
Q4
XTAL_IN
XTAL_OUT
Q5
OSC
Q6
Q7
Q8
Q9
SYNC
VDD
NB3F8L3010C
Functional Diagram
t Skew O-O
(ps)
100
25
150
55
50
100
20
100
20
25
100
30
30
1
55
30
15
45
30
30
3
20
20
20
20
15
15
15
85
60
25
15
15
25
15
15
10
15
15
15
25
fMax Typ
(GHz)
0.4
0.35
0.25
0.2
1.4
0.4
5.5
0.4
7
8
0.4
7
6
7.5
0.2
700
12
0.2
0.266
0.266
5
3
3
2
2
7
7
8
0.2
0.7
2.5
6
2
2
3
8
8.5
7
5
12
2.5
Package(s)
QFN-52
LQFP-32
LQFP-32
QFN-32
QFN-48
QFN-32
QFN-52
QFN-32
QFN-32
QFN-32
QFN-24
QFN-32
QFN-32
QFN-24
QFN-32
TSSOP-20
QFN-16, BGA-16
SOIC-8
TSSOP-20
TSSOP-20
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
SOIC-8
QFN-32
TSSOP-8
TSSOP-8, SOIC-8
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-32
QFN-32
QFN-16, BGA-16
QFN-32
Page 7
Cascadable I/O Expanders
Key Features
3.3 V
12 V
Button
LED
•I2C and SMBus interfaces
•1 MHz SCL clock frequency
•30 mA SDA sink capability
SCL
SDA
SCL
SDA
I/O
I/O
INT
I/O
I/O
μC
GPIO
Vext
LEDs
I/O
I/O
I/O
I/O
I/O
Slot 2 Slot 3
3.3 V
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
MOSFETs
3.3 V
PCA96xxE
PCA95xxE
I/O Expander
I/O
I/O
Backplane
Systems
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
PRSNT2
PRSNT2
I/O
I/O I/O I/O
Keypad
Control
ADM1033
Thermal Sensor
and
Fan Controller
Temperature
Control
Device
I/O
Cascadable
VCC Min
(V)
VCC Max
(V)
Interrupt
Output
PCA9535E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9655E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9654E
8
8 Slave ID Addresses
1.65
5.5
4
Page 8
I/O
LED Blink/
Pullups
PWM
4
Package
SOIC-16, WQFN-16, TSSOP-16
Networking Solutions
Logic Translators
Dual supply voltage logic translators connect ICs and
PCBs together that operate at different supply voltages.
PCB #1
PCB #2
Translator
Key Features
Translator
μC #1
•Industry’s first devices with independent power
supplies (VL < VCC, VL = VCC, or VL > VCC)
•High 100 pF capacitive drive capability
•Overvoltage tolerant enable and I/O pins
•Non-preferential power-up sequencing
•Power-off protection
μC #2
PCB-to-PCB
Translation
On-board
translations
• SPI
• I2C
• SMBus
Translator
EEPROM
Autosense Bidirectional
Translator
(Push-Pull Output)
Unidirectional Translator
P
One−Shot
VL
Autosense Bidirectional
Translator
(Open-Drain Output)
Bidirectional
Translator
(with Direction Pin)
VCC
R1
VL
VCC
VCCA
1k
VCCA
VCCB
A
Block Diagram
N
One−Shot
B
I/O VL
PU1
I/O VCC
P
One−Shot
OE
R2
One−Shot
Block
RPullup
10 k
Gate
Bias
One−Shot
Block
EN
I/O VL
VCCB
DIR
PU2
RPullup
10 k
A
EN
N
B
I/O VCC
1k
N
One−Shot
Attributes
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
Trade-Offs
• Fixed Input & Output Pins
• Modest Output Current
• Modest Bandwidth
• Directional Control Pin Required
•SPI
•GPIO
•I2C, SMBus, PMBus
•GPIO
• NLSX3012 (2-Bit, UDFN-8)
• NLSX3014 (4-Bit, UQFN-12)
• NLSX3013 (8-Bit, CSP-20)
• NLSX3018 (8-Bit, UDFN-20)
• NLSX4014 (4-Bit, UQFN-12)
• NLSX5011 (1-Bit, UULGA-6, UDFN-6)
• NLSX5012 (2-Bit, UDFN-8)
• NLSX5014 (4-Bit, UDFN-12)
• NLSX3373 (2-Bit, UDFN-8)
• NLSX3378 (4-Bit, CSP-12)
• NLSX4373 (2-Bit, UDFN-8)
• NLSX4378 (4-Bit, CSP-12)
• NLSV1T45 (1-Bit, ULLGA-6)
• NLSV2T245 (2-Bit, UQFN-10)
• NLSV2T3236 (2-Bit, UQFN-10)
• NLA16T245 (16-Bit, TSSOP-48)
Applications
•SPI
•GPIO
• NLSV1T34 (1-Bit, ULLGA-6)
• NLSV1T240/244 (1-Bit, UDFN-6)
• NLSV2T240/244 (2-Bit, UDFN-8)
Sample Device
• NLSV4T240/244 (4-Bit, UDFN-12)
(I/O Channels,
• NLSV4T3234 (4-Bit, CSP-11)
Package)
• NLSV8T240/244 (8-Bit, UDFN-20)
ON Semiconductor
•GPIO
• SDIO Cards
• 1-Wire Bus
Page 9
Power over Ethernet
IEEE 802.3at, 40 W
•Delivers 25.5 W for PoE+ IEEE 802.3at (Draft 4.0) and up to 40 W in proprietary applications
•Supports IEEE two event classification
•Integrated multi-topology dc-dc converter controller implements highly efficient power conversion at low output voltages
•Best in-class cable ESD and thermal characteristics
1SMA58A
MBRS1100
Data
Pairs
VOUT
VPORTP
CLASS
VDDL
INRUSH
NCP1081
ILIM1
MBRS1100
nCLASS_AT
UVLO
Spare
Pins
VPORTIN
GATE
RTN
COMP
TL431
IEEE 802.3at + Auxiliary, 40 W
•Auxiliary input voltage range from 9.0 V to 57 V
•Integrated multi-topology dc-dc converter controller implements highly efficient power conversion at low output voltages in
conjunction with auxiliary voltage input
•Delivers 25.5 W for PoE+ IEEE 802.3at (Draft 4.0) and up to 40 W in proprietary applications
•Supports IEEE two event classification
•Best-in-class cable ESD and thermal characteristics
VAUX(+)
1SMA58A
MBRS1100
Data
Pairs
VOUT
VPORTP
CLASS
VDDL
INRUSH
NCP1083
ILIM1
MBRS1100
nCLASS_AT
UVLO
GATE
AUX
Spare
Pins
VPORTIN
VAUX(–)
Page 10
COMP
RTN
TL431
Networking Solutions
Power over Ethernet
IEEE 802.3at (Non-Isolated), up to 40 W
•Non-isolated application for simple cost effective solution
•Programmable overcurrent protection
•Flexibility to scale output MOSFETs for power requirement
MMSD4148
VPORTP
DRVVCC
VB
HDRV
VS
NCP1034
NCP1090/1/2
UVLO
LORV
SS/SD
FB
GND
VPORTN
COMP
RTN
IEEE 802.3af, 3 W
•Integrated PWM controller and Power Device for up to 7.5 W
requirements
•Up to 1 MHz switching frequency for high power density design
•Can be configured in any single-ended topology such as
forward or flyback
VPORTP
MBR340
MUR110
NCP1090/1/2
NCP1031
TL431
VPORTN
ON Semiconductor
RTN
Page 11
DC-DC Power Conversion
MBRA160T3
MURA110T3
+
35--76 V
--
+
12 V
--
MBRA160T3
NCP1030
GND
CT
VFB
COMP
VDRAIN
VCC
UV
OV
Isolated Bias Supply
Regulators
Device
Topology
IO Typ
(A)
f SW Typ
(kHz)
VCC Min
(V)
VCC Max
(V)
Features
Package(s)
NCP3231
Step-Down
20
500
4.5
18
0. 6 V internal voltage reference @ up to 15 A
QFN-40
NCP3232N
Step-Down
15
500
4.5
21
0. 6 V internal voltage reference @ up to 15 A
QFN-40
NCP1592
Step-Down
6.0
Up to 700
3.0
6.0
Output down to 0.891 V with 1.0% accuracy
TSSOP-28
NCP3133A
Step-Down
3.0
1000
2.9
5.5
3 A continuous output; internal soft start
QFN-16
NCP3170A
Step-Down
3.0
500
4.5
18
Output down to 0.8 V
SOIC-8
NCP3170B
Step-Down
3.0
1000
4.5
18
Output down to 0.8 V
SOIC-8
NCP1032
Flyback; Forward; Step-Down
1.0
Up to 1000
-
200
Integrated 200 V switch; internal soft start
WDFN-8
NCP1031
Flyback; Forward; Step-Down
1.0
Up to 1000
-
200
Integrated 200 V switch
DFN-8, SOIC-8
NCP1030
Flyback; Forward; Step-Down
0.5
300
-
200
2nd side bias supply
Micro8
PWM Controllers
Topology
Flyback; Forward; Step-Down
Step-Down
Flyback; Forward; Buck-Boost; Boost
Step-Down
Step-Down
VCC Min
(V)
7.6
8.0
3.3
4.7
4.7
VCC Max
(V)
75
100
7.5
28
28
f SW Typ
(kHz)
400
Up to 500
Up to 1000
400
300; 600
Dual Channel/Multiphase
4.5
20
1200
TL494
Flyback; Forward; Half-Bridge; Push-Pull; Step-Down; Step-Up
7.0
40
Up to 200
Features
Small package
Non-isolated buck
Enhanced UC384x
EN, PG, SYNC
Capable of 20 A output
Compatible to 3.3/5 V
DrMOS
Versatile controller
TL594
Flyback; Forward; Half-Bridge; Push-Pull; Step-Down; Step-Up
7.0
40
Up to 300
Versatile controller
Device
CS5124
NCP1034
NCP1294
NCP3011
NCP3020
NCP81232*
Page 12
Package(s)
SOIC-8
SOIC-16
SOIC-16, TSSOP-16
TSSOP-14
SOIC-8
QFN-40
PDIP-16, SOIC-16
PDIP-16, SOIC-16,
TSSOP-16
Networking Solutions
ARM® Core DC-DC Converters
Key Features
•High regulating performance from 0.6 V to 1.4 V
• Modular efficiency with fragmented power stage
• Dynamic voltage scaling per output steps of 6.25 mV by I2C
• Tight accuracy of ±1%, due to differential sensing
•Fast transient response
• Proprietary PFM to PWM transition with equivalent performance to PWM only
• Thermally handle high peak current demands up to 10 ms
• Flexible design to transient handling output capacitor from 22 µF to 100 µF
PWM Efficiency DCDC Converter Modular Output
Vin = 3.6 V, Vout = 1.20 V, Fsw = 3.0 MHz, Lossless Inductor(s)
0.95
Efficiency (%)
0.9
0.85
1
2
3
5
10
0.8
Number of Modules
0.75
0.7
0.10
1.00
Load Current (A)
VIN
(V)
VOUT
(V)
IOUT
(A)
f SW
(MHz)
Control
Features
Package
NCP6338
2.3 – 5.5
0.6 – 1.4
6.0
3.0
I²C; VSEL
Modular power stage; Differential sensing
WLCSP-30
NCP6336B
2.3 – 5.5
0.6 – 1.4
5.0
2.74
I²C
Transient load helper
WLCSP-20
NCP6335
2.3 – 5.5
0.6 – 1.4
4.0
3.0
I²C; VSEL
Transient load helper
WLCSP-20
NCP6343
2.3 – 5.5
0.6 – 1.4
3.5
3.0
I²C
Dynamic voltage scaling
WLCSP-15
Device
ON Semiconductor
Page 13
Linear Voltage Regulators
NCP4671
VIN
VIN
VBIAS
DC/DC
converter
1 μF
1 μF
CE
VOUT
VOUT
GND
2 μF
NCP4671 - Typical Application Schematic
NCP59302 Adjustable 3 A
LDO Evaluation Board
IO Typ
Function
NCP51460
Device
20 mA
Precision Voltage Reference
NCP715
50 mA
Ultra-low Quiescent Current LDO Linear Voltage Regulator
NCP716
80 mA
Ultra-low Quiescent Current LDO Linear Voltage Regulator
LP2951
100 mA
Multi-Feature LDO Linear Voltage Regulator
NCP702
200 mA
Ultra-low Quiescent Current LDO Linear Voltage Regulator
NCP4671
400 mA
Low Output Voltage LDO Linear Voltage Regulator
NCP705
500 mA
Ultra-low Quiescent Current LDO Linear Voltage Regulator
NCP690,
NCP691,
NCP692
1A
CMOS LDO Linear Voltage Regulator w/wo Enable
NCP693
1A
CMOS LDO Linear Voltage Regulator
NCP59150
1.5 A
Fixed and Adjustable True LDO Linear Voltage Regulator
NCP59748
1.5 A
Ultra-Low Dropout Voltage Regulator with Bias Rail
NCP59302
3A
Adjustable True LDO Linear Voltage Regulator
NCP59744
3A
Precision Ultra-Low Dropout Voltage Regulator
NCP59749
3A
Ultra-Low Dropout Voltage Regulator with Bias Rail
NCP58302
3A
Adjustable True LDO Linear Voltage Regulator
Page 14
Features
•3.3 V reference
•Ultra-low quiescent current
•Wide input voltage range
•Ultra-low quiescent current
•Wide input voltage range
•Shutdown feature
•Fixed or adjustable output (1.25 V to 29 V)
•Error flag for out of regulation condition
•High PSRR
•Very low dropout
•Ultra-low noise
•Output voltage to 0.6 V
•Bias rail structure allows ultra low dropout
•Regulates input voltages as low as 0.9 V
•High PSRR
•Very low dropout
•Ultra-low noise
•Enhanced ESD: 4 kV and 400 V
•Fixed and adjustable outputs
•Typical noise voltage of 15 Vrms
•Minimum output voltage down to 0.8 V for fixed version
and 1.0 V for adjustable version
•Typical dropout: 175 mV @ 750 mA; 300 mV @ 1.5 A
•Maximum voltage input 18 V
•Stable with ceramic capacitors on the output
•Typical dropout: 60 mV @ 1.5 A
•High PSRR
•Very fast transient response
• Typical dropout: 175 mV @ 1.5 A; 300 mV @ 3 A
• Maximum voltage input 18 V
• Stable with ceramic capacitors on the output
•Typical dropout: 115 mV @ 3 A
•High PSRR
•Very fast transient response
•Typical dropout: 120 mV @ 3 A
•High PSRR
•Very fast transient response
• Typical dropout: 250 mV @ 1.5 A; 370 mV @ 3 A
• Maximum voltage input 18 V
• Stable with tantalum capacitors on the output
Package
SOT-23-5
SC-70-5, DFN-6
WDFN-6
SOIC-8, Micro8™
SOT-23-5
SOT-23-5, SC-70-5,
XDFN-6
WDFN-6
DFN-6
UDFN-6
DFN-8, D2PAK-5
DFN-10, QFN-20
D2PAK-5
QFN-20
DFN-10, QFN-20
D2PAK-5
Networking Solutions
Advanced Load Switches
VCC
EN
PG
Control
Logic
Charge
Pump
Delay and
Slew Rate
Control
Smart Load Switch
ecoSWITCH™ Integrated
Load Switch
Device
ron
(mW)
NCP455xx Integrated Load Switch Features
Thermal,
Undervoltage
&
Short-Circuit
Protection
Bandgap
&
Biases
SR
Type
VIN
GND
I Max
(A)
BLEED
•Simple/clean design
•No current consumption in standby power mode
•Small PCB footprint
•Low RDS(ON) due to charge pump driving NMOS
•Adjustable soft-start time (SR)
•Adjustable integrated discharge
•Fault protection
•Power rail monitoring & sequencing
VOUT
VI Min
(V)
VI Max
(V)
IQ
(mA)
Discharge
Slew Rate
(ms)
Features
Package(s)
NCP330 26 at 3.3 V
3
1.8
5.5
100
—
2000
Reverse blocking
TDFN-4
NCP333 55 at 3.3 V
1.5
1.2
5.5
1
Auto
95
—
WLCSP-4
NCP334 47 at 3.3 V
2
1.2
5.5
1
—
71
—
WLCSP-4
NCP335 47 at 3.3 V
2
1.2
5.5
1
Auto
71
—
WLCSP-4
NCP336 23 at 3.3 V
3
1.2
5.5
1
—
810
—
WLCSP-6
NCP337 23 at 3.3 V
3
1.2
5.5
1
Auto
810
—
WLCSP-6
NCP338 27 at 1.8 V
2
1
3.6
0.6
Auto
20
—
WLCSP-6
NCP339
26 at 3.3 V
3
1.2
5.5
2
—
2700
Reverse blocking
WLCSP-6
NCP432
50 at 1.8 V
1.5
1
3.6
0.6
—
20
—
WLCSP-4
NCP433
50 at 1.8 V
1.5
1
3.6
0.6
Auto
20
—
WLCSP-4
NCP434 43 at 1.8 V
2
1
3.6
0.6
—
61
—
WLCSP-4
NCP435 43 at 1.8 V
2
1
3.6
0.6
Auto
61
—
WLCSP-4
NCP436
23 at 1.8 V
3
1
3.6
1
—
27
—
WLCSP-6
NCP437
23 at 1.8 V
3
1
3.6
1
Auto
27
—
WLCSP-6
NCP439
28 at 3.3 V
2
1
3.6
4
Auto
75
NCP451
WLCSP-4
13 at 3.3 V
3
0.5
5.5
15
Auto
640
NCP45524 18.0
6
0.5
13.5
—
Adj
—
Power good
NCP45525 18.0
6
0.5
13.5
—
Adj
Adj
—
DFN-8
NCP45560 2.4
24
0.5
13.5
—
Adj
Adj
Power good; Fault
DFN-12
NCP45540 3.9
20
0.5
13.5
—
Adj
Adj
Power good; Fault
DFN-12
NCP45541 3.9
20
0.5
13.5
—
Adj
Adj
Power good
DFN-12
NCP4543 10.2
7.3
0.5
6
—
Adj
Adj
—
QFN-18
NCP4545 4.7
10.5
0.5
6
—
Adj
Adj
—
QFN-18
NCP45520 9.5
10.5
0.5
13.5
—
Adj
—
Power good; Fault
DFN-8
NCP45521 9.5
10.5
0.5
13.5
—
Adj
Adj
Fault
DFN-8
ON Semiconductor
WLCSP-6
DFN-8
Page 15
MOSFETs for Power Conversion
ORing MOSFETs
Key Features
•Low RDS(on) for low
conduction loss
•30 V for IM bus ORing
•100 V for 48 V bus ORing
=
MOSFETs as ORing Diodes
Device
Configuration Polarity
VDS
(V)
VGS
(V)
RDS(ON) mΩ
VGS = 10 V VGS = 4.5 V
Typ
Typ
Qg
(nC)
Qgd
(nC)
RG
(Ω)
Package
NTMFS4H01N
Single
N
25
20
0.5
0.7
47
13
0.8
SO8-FL
NTMFS4H01NF
Int. Schottky
N
25
20
0.53
0.75
46
12
0.8
SO8-FL
NTMFS4H02N
Single
N
25
20
1
1.5
47
10
0.8
SO8-FL
NTMFS4H02NF
Int. Schottky
N
25
20
1
1.6
48
11
0.8
SO8-FL
NTMFS4C01N
Single
N
30
20
0.9
1.2
65
18
1
SO8-FL
NTMFS4931N
NTMFS5C404NL
NTMFS5C410NL
Single
Single
Single
N
N
N
30
40
40
20
20
20
0.85
0.56
0.71
1.2
0.85
1
62.1
81
66
10.1
23.8
22
0.7
---
NTP6410AN
Single
N
100 20
11
10
120
57
2.4
NTP6411AN
Single
N
100 20
12.7
---
100
47
3.1
SO8-FL
SO8-FL
SO8-FL
TO-220,
D2PAK
TO-220,
D2PAK
Isolated Topology DC-DC (Bricks)
Key Features
•Low RDS(on) for low conduction loss
•Low capacitance for low switching loss
•Integrated Schottky for low diode loss
Device
NTMFS4H01N
NTMFS4H01NF
NTMFS4H013NF
NTMFS4H02N
NTMFS4H02NF
NTTFS4H05N
NTTFS4H07N
NTMFS4C05N
NTMFS4C06N
NTMFS4C08N
NTTFS4C05N
NTMFS5C404NL
NTMFS5C410NL
NTMFS5C442NL
NTMFS5830NL
NTMFS5832NL
NTMFS5C604NL
NTMFS5C612NL
NTMFS5C646NL
NTMFS5844NL
NTTFS5820NL
NTTFS5826NL
Page 16
Configuration Polarity
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
Single
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
VDS
(V)
VGS
(V)
25
25
25
25
25
25
25
30
30
30
30
40
40
40
40
40
60
60
60
60
60
60
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
48 V
RDS(ON) mΩ
VGS = 10 V VGS = 4.5 V
Typ
Typ
0.5
0.53
0.7
1
1
2.6
3.7
2.7
3.2
4.6
2.9
0.56
0.71
2.2
1.7
3.1
0.93
1.2
3.8
10.2
10.1
19
0.7
0.75
1
1.5
1.6
3.8
5.4
4
4.8
6.8
4.1
0.85
1
3.4
2.6
5
1.25
1.65
5
13
13
25
Forward
Flyback
Push Pull
Half Bridge
Full Bridge
Vout
Qg
(nC)
Qgd
(nC)
Ciss
(pF)
Crss
(pF)
RG
(Ω)
47
46
28
47
48
9.8
6.1
14
11.6
8.4
14.5
81
66
22
60
25
52
41
15.7
15
15
8.4
13
12
7.5
10
11
2.7
1.7
5
4
3.3
5.5
23.8
22
5793
5706
3780
2672
2634
1232
768
1972
1683
1113
1988
12168
8862
3000
5880
2700
8900
6660
2164
1460
1462
850
241
237
150
111
109
51
32
59
40
39
71
79.8
116
28
500
250
40
45
17
96
96
50
0.8
0.8
1
0.8
0.8
1
0.8
1
1
1
1
---0.5
1.2
---0.62
0.62
1.5
32
12.7
12.7
10.9
5.1
8
8
3.9
Application
Secondary
Synchronous
Primary
Package
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
u8FL
u8FL
SO-8FL
SO-8FL
SO-8FL
u8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
SO-8FL
u8FL
u8FL
Networking Solutions
MOSFETs for Power Conversion
Non-Isolated Topology “Buck” DC-DC
Control
Key Features
•Low RDS(on) for low conduction loss
•Low capacitance for low switching loss
•Integrated Schottky for enhanced light load efficiency
RDS(ON) mΩ
VGS = 10 V VGS = 4.5 V
Typ
Typ
Configuration
VDS
(V)
VGS
(V)
NTMFS4H01N
Single
25
20
0.5
NTMFS4H01NF
Int. Schottky
25
20
NTMFS4H013NF
Int. Schottky
25
20
NTMFS4H02N
Single
25
NTMFS4H02NF
Int. Schottky
25
NTTFS4H05N
Single
NTTFS4H07N
Single
NTMFS4C05N
NTMFS4C06N
Vin
Cin
Sync
PWM
Controller
Cout
Vout
Qg
(nC)
Qgd
(nC)
Ciss
(pF)
Crss
(pF)
RG
(Ω)
Application
Package
0.7
47
13
5793
241
0.8
Synchronous side
SO-8FL
0.53
0.75
46
12
5706
237
0.8
Synchronous side
SO-8FL
0.7
1
28
7.5
3780
150
1
Synchronous side
SO-8FL
20
1
1.5
47
10
2672
111
0.8
Synchronous side
SO-8FL
20
1
1.6
48
11
2634
109
0.8
Synchronous side
SO-8FL
25
20
2.6
3.8
9.8
2.7
1232
51
1
Control Side
u8FL
25
20
3.7
5.4
6.1
1.7
768
32
0.8
Control Side
u8FL
Single
30
20
2.7
4
14
5
1972
59
1
Synchronous side
SO-8FL
Single
30
20
3.2
4.8
11.6
4
1683
40
1
Synchronous side
SO-8FL
NTMFS4C08N
Single
30
20
4.6
6.8
8.4
3.3
1113
39
1
Synchronous side
SO-8FL
NTMFS4C09N
Single
30
20
4.6
6.8
10.9
5.4
1252
126
1
Synchronous side
SO-8FL
NTMFS4C10N
Single
30
20
5.8
8.9
9.8
3.7
987
162
1
Synchronous side
SO-8FL
NTMFS4C13N
Single
30
20
7.3
11.4
7.8
3.7
770
127
1
Synchronous side
SO-8FL
NTTFS4C05N
Single
30
20
2.9
4.1
14.5
5.5
1988
71
1
Control Side
u8FL
NTTFS4985NF
Int. Schottky
30
20
2.8
4.16
13.6
4.1
2075
46
1
Synchronous side
u8FL
NTTFS4C08N
Single
30
20
4.7
7.2
8.4
3.3
1113
39
1
Control Side
u8FL
NTTFS4C10N
Single
30
20
5.9
8.8
10.1
6.1
993
163
1
Control Side
u8FL
NTTFS4C13N
Single
30
20
7.5
11.2
7.8
3.7
770
127
1
Control Side
u8FL
Device
ON Semiconductor
Page 17
Thermal Management
8 GPIOs
Extensive Portfolio
SMBus Interface
RESET I/O
Local Sensors provide temperature information at
the device location
Remote Sensors provide temperature information
of a transistor located at a different position on the
board; also includes local sensor capability
4 PWM O/Ps
System
Voltages
+12 V
+5 V
+3.3 V
8 Tach Inputs
+2.5 V
+1.8 V
Fan Controllers integrate the temperature sensor
with a fan controller/monitor
System Monitors integrate combinations of
remote and/or local temperature sensing, voltage
monitoring, fan control & monitoring, reset control,
and GPIO functions
Fan Drive and Control
• 4 PWM Fan Drive Outputs
• 8 Tach Inputs
Fan2Max
+1.5 V
+1.25 V
+0.9 V
TDM1
Temperature
• Measures 4 Temp Zones
TDM2
VBatt
TDM3
1 Local
3 Remote
THERM I/O
Bi-directional
THERM Pins
Chassis Intrusion
ALERT O/P
Supply
Range
(V)
3 - 5.5
3 - 5.5
2.8 - 5.75
3 - 3.6
3 - 3.6
3 - 3.6
3 - 3.6
3 - 3.6
2.8 - 3.6
1.4 - 2.75
3 - 5.5
3 - 5.5
3 - 5.5
3 - 3.6
3 - 3.6
Temperature
Range
(°C )
-40 to +120
-40 to +125
-40 to +125
-40 to +120
-40 to +120
-40 to +120
-40 to +120
-40 to +120
-40 to +125
-40 to +125
-55 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
Local
Accuracy
(°C)
±3
±2.25
±2
±1.5
±1.5
±1.5
±1
±1
±1
±1.75
±1
±3
±3
±1
±1
Interface
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
Number
of
Addresses
3
2
8
3
3
1
8
8
2
2
9
2
2
2
9
NCT75
3 - 5.5
-55 to +125
±1
I2C/SMBUS
8
NCT275*
3 - 5.5
-55 to +125
±1
I2C/SMBUS
4
NCT203
1.4 - 2.75
-40 to +125
±1.75
I2C/SMBUS
1
Device
ADM1026
System ADT7462
Monitors NCT80
ADT7476
ADT7473
ADT7475
Fan
Controllers ADM1033
ADM1034
NCT72
NCT218
NCT210
Remote ADM1032
Sensors
ADT7461
ADT7481
ADT7483
Local
Sensors
SRC
(Ω)
—
2k
—
—
3k
—
1k
1k
1.5 k
150
—
—
3k
—
—
Remote
Accuracy
±3
±2.25
—
±1.5
±1.5
±1.5
±1
±1
±1
±1
±3
±1
±1
±1
±1
Remote
Channels
2
3
—
2
2
2
1
2
1
1
2
1
1
2
2
Fan
Channels
8
4
—
3
3
3
1
2
Voltage
TACH
Monitoring
Channels Channels
8
19
8
13
2
7
4
5
4
4
1
2
GPIOs
17
8
1
—
Package
LQFP-48
LFCSP-32
TSSOP-24
QSOP-24
QSOP-16
QSOP-16
QSOP-16
QSOP-16
DFN-8, WDFN-8
WDFN-8, WLCSP-8
QSOP-16
SOIC-8, MSOP-8
SOIC-8, MSOP-8
MSOP-10
QSOP-16
DFN-8, SOIC-8,
Micro8
CSP-6
DFN-8, SOIC-8,
Micro8
* Pending 2H14.
Page 18
Networking Solutions
EEPROMs for Configuration and Calibration
Features
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
•Broad density range: 1 kb to 2 Mb
•Wide operating Vcc range: 1.8/1.7 V to 5.5 V
•High endurance: 1 million program/erase cycles
•Wide temperature range: industrial and extended
EEPROMs
Data
Transmission
Standard
I2C
SPI
Microwire
Device
Density
Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
Package(s)
CAT24M01
CAT24C512
CAT24C256
CAT24C128
CAT24C64
CAT24C32
CAT24C16
CAT24C08
CAT24C04
CAT24C02
CAT25M02
CAT25M01
CAT25512
CAT25256
CAT25128
CAT25640
CAT25320
CAT25160
CAT25080
CAT25040
CAT25020
CAT25010
CAT93C86
CAT93C86B
CAT93C76
CAT93C76B
CAT93C66
CAT93C56
CAT93C46
CAT93C46B
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
2 Mb
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
1 kb
16 kb
16 kb
8 kb
8 kb
4 kb
2 kb
1 kb
1 kb
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
256k x 8
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
128 x 8
2k x 8 / 1k x 16
2k x 8 / 1k x 16
1k x 8 / 512 x 16
1k x 8 / 512 x 16
512 x 8 / 256 x 16
256 x 8 / 128 x 16
128 x 8 / 64 x 16
128 x 8 / 64 x 16
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8 / 1.65
1.8
1.8 / 1.65
1.8
1.8
1.8
1.8 / 1.65
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
1
1
1
1
1
1
0.4
0.4
0.4
0.4
10
10
20
20
20
20
20
20
20
20
20
20
3
4
3
4
2
2
2
4
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8; WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
Application Specific EEPROMs
Data
Transmission
Standard
Device
Density
Organization
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
I2C
I2C
2
I C/SMBus
CAT24C208
CAT34C04*
CAT34TS04
8 kb
4 kb
4 kb
1024 x 8
512 x 8
512 x 8
2.5
1.7
2.2
5.5
5.5
5.5
0.4
1
1
I2C
CAT34C02
2 kb
256 x 8
1.7
5.5
0.4
I2C/SMBus
CAT34TS02
2 kb
256 x 8
3.0
3.6
0.4
Package(s)
Notes
SOIC-8
UDFN-8
TDFN-8, UDFN-8
UDFN-8, TDFN-8,
TSSOP-8
TDFN-8, UDFN-8
VESA™ dual-port serial EEPROM
Serial Presence Detect (SPD) I2C EEPROM for DDR4 DIMM
4 kb SPD EEPROM w/ Temperature Sensor for DDR4 DIMM
Serial Presence Detect (SPD) I2C EEPROM for DDR3 DIMM
2 kb SPD EEPROM w/ Temperature Sensor for DDR3 DIMM
* Pending 4Q14.
ON Semiconductor
Page 19
Signal Conditioning
Low Voltage, Low Power Operational Amplifiers
Sensor Buffering
Sensor/
Accelerometer
Sensor/
Accelerometer
MCU
Operational Amplifiers
Device
Page 20
Description
Package(s)
LMV301
Single 1.8 V RRO CMOS Op Amp
SC-70
LMV321
Single 2.5 V RRO Op Amp
SC-70, SOT-23
LMV324
Quad 2.5 V RRO Op Amp
TSSOP-14, SOIC-14
LMV358
Dual 2.5 V RRO Op Amp
SOIC-8, Micro8, uDFN-8
LMV821
Single 2.5 V RRO Op Amp
SC-70
LMV824
Quad 2.5 V RRO Op Amp
TSSOP-14, SOIC-14
LMV931
Single 1.8 V RRIO CMOS Op Amp
TSOP-5, SC-70
LMV981
Single 1.8 V RRIO CMOS Op Amp with EN
uLLGA-8
LMV982
Dual 1.8 V RRIO CMOS Op Amp with EN
uQFN-10
NCS2001
Single 0.9 V Op Amp
SOT-23, SC-70
NCS2004
Single RRO Op Amp
SC-70
TLV271
Single RRO Op Amp
TSOP-5
Networking Solutions
Signal Conditioning
Switching Devices
ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook
computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0.
2nd LCD
Display
LCD
Panel
VGA Switch
Docking Station Connector
External
Graphics
Processor
TMDS
DisplayPort
Switch
HDMI/DVI
Switch
LAN Switch
Internal
Graphics
Processor
PCIe
Switch
Gigabit LAN
Transceiver
North Bridge
(ICH)
South Bridge
(MCH)
USB Power/
Data Switch
Audio
Amp
Stereo Switch
Processor
Codec
Mic Switch
Server Implementation
ON Semiconductor
Device
Interface
Data Rate
NCN3612B
NCN3411
NCN2612B
NCN2411
NS3L500
NCN7200
NCN1188
NS5S1153
NLAS7242
NLAS52231
NLAS4684
PCIe 3.0, DisplayPort 1.2
PCIe 3.0
PCIe 2.0, DisplayPort 1.1
PCIe 2.0
Gigabit Ethernet
Gigabit Ethernet
USB 2.0 / MHL
USB 2.0
USB 2.0
Audio
Audio
8 Gb/s
8 Gb/s
5 Gb/s
5 Gb/s
1 Gb/s
1 Gb/s
2.25 Gb/s
480 Mb/s
480 Mb/s
36 MHz
9.5 MHz
No
Quiescent
Channels Current
12
8
12
8
11
11
2
2
2
2
2
250 μA
200 μA
250 μA
200 μA
250 μA
380 μA
21 μA
21 μA
1 μA
1 μA
180 nA
Page 21
Digitally Programmable Potentiometers for Trimming and Calibration
RH0
Features
SCL
SDA
•No drift over time or temperature
•No changes due to mechanical stress or shock
•Systems can be calibrated real-time, in the field
•Broad portfolio provides for selection of optimal
number of pots and taps
PC BUS
INTERFACE
CAT5120/1/2
CAT5110
CAT5112
CAT5114
CAT5115
CAT5118/9
CAT5123
CAT5124
CAT5125
CAT5126
CAT5127
CAT5128
CAT5111
CAT5113
CAT5116
CAT5132
CAT5133
CAT5136/7
CAT5138
CAT5140
CAT5171
CAT5172
CAT5221
CAT5411
CAT5419
CAT5261
CAT5269
CAT5271
CAT5273
CAT5241
CAT5401
CAT5409
CAT5251
CAT5259
Page 22
RH2
RH3
WIPER
CONTROL
REGISTERS
RW0
RW1
WP
A0
A1
A2
A3
RW2
CONTROL
LOGIC
NONVOLATILE
DATA
REGISTERS
RW3
RL0
Device
RH1
RL1
RL2
RL3
Number of
Pots
Number of
Taps
Resistance
(kΩ)
Buffered
Wiper
Interface
Packages
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
4
4
4
4
4
16
32
32
32
32
32
32
32
32
32
32
32
100
100
100
128
128
128
128
256
256
256
64
64
64
256
256
256
256
64
64
64
256
256
10; 50
10; 50; 100
10; 50; 100
10; 50; 100
10; 50; 100
10; 50; 100
10
50
10
10
10
10; 50
10; 50; 100
1; 10; 50; 100
32
10; 50; 100
10
50
10
50; 100
50; 100
50
2.5; 10; 50; 100
2.5; 10; 50; 100
2.5; 10; 50; 100
50; 100
50; 100
50; 100
50
2.5; 10; 50; 100
2.5; 10; 50; 100
2.5; 10; 50; 100
50; 100
50; 100
No
No
Yes
Yes
No
No
No
No
No
OTP
Yes
No
Yes
Yes
Yes
Yes
Yes
No
No
Yes
No
No
Yes
Yes
Yes
Yes
Yes
No
No
Yes
Yes
Yes
Yes
Yes
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
Up/Down
I2C
Up/Down
I2C
I2C
I2C
I2C
SPI
I2C
SPI
I2C
SPI
I2C
I2C
I2C
I2C
SPI
I2C
SPI
I2C
SC-70; SOT-23
SC-70; SOT-23
MSOP-8; PDIP-8; SOIC-8; TSSOP-8
MSOP-8; PDIP-8; SOIC-8; TDFN-8; TSSOP-8
MSOP-8; PDIP-8; SOIC-8; TSSOP-8
SC-70; SOT-23
SOT-23
SOT-23
SOT-23
MSOP-8; TDFN-8
MSOP-8
SOT-23-8
MSOP-8; PDIP-8; SOIC-8; TSSOP-8
MSOP-8; PDIP-8; SOIC-8; TSSOP-8
MSOP-8; PDIP-8; SOIC-8; TSSOP-8
MSOP-10
MSOP-10
SC-70
SC-70
MSOP-8
SOT-23-8
SOT-23-8
SOIC-20W; TSSOP-20
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
MSOP-10
MSOP-10
SOIC-20W; TSSOP-20
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
SOIC-24W; TSSOP-24
Networking Solutions
Surge Protection
For lower data-rates (10/100BASE-T, xDSL), ON Semiconductor
offers a combination of crowbar devices known as thyristor surge
protector devices (TSPD), and transient voltage suppressor (TVS)
devices similar to those used in ESD protection. TSPDs offer
the advantage of lower clamping voltages and possess higher
surge current capability, for both common and differential mode
protection.
30
25
Voltage (V), Current (A)
ON Semiconductor provides solutions for protecting against
surge strikes, induced by a lighting strike or power-cross fault.
Common interfaces found in a wide variety of consumer and
telecommunications/networking equipment are the RJ45 interface
for the 10/100BASE-T and 1000BASE-T Ethernet protocols and
the RJ11 interface for xDSL protocols. RJ45 consists of four pairs
of differential data lines, each carrying a maximum data rate of
250 Mbps in a 1000BASE-T configuration, while RJ11 consists
of a single differential data pair. These interfaces are often surge
rated to an intra-building standard. Protection for these interfaces
mainly consist of ensuring that transverse (metallic or differential)
surge strikes do not damage sensitive downstream chips such
as PHYs. Differential protection is achieved by connecting shunt
protection elements from line-to-line (for each pair of lines)
that transfer the incoming hostile surge energy back towards
the source. This is different from common mode protection as
elements are connected line-to-GND and shunt the surge energy
to GND.
ESD1014 V(t)
ESD1014 I(t)
Competitor V(t)
Competitor I(t)
20
15
10
5
0
-10
0
10
20
30
40
50
Time (μs)
60
IPP
IH
IT
VC VBR VRWM IR
IBO
Voltage
VD
90
TVS clamping devices support surge levels for the 8/20 μs pulse
and are commonly used on the tertiary or PHY-side to capture and
safely dissipate any residual surge pulses. Pictured in the figure
above is a time-domain plot of the 8/20 μs surge current applied
to the ESD1014 TVS from ON Semiconductor. Also shown are
time-domain response voltages, clearly showing the superiority
of the ON Semiconductor solution in comparison to a competing
device.
Current
TSPD
TSPD
80
Example of V & I plots in an 8/20 μs surge
IPPS
ITSM
IT
IDRM
70
VDRM VBO
I
IR VRWM VBR VC
IT
V
TVS
IPP
ON Semiconductor
Page 23
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Two & Four Pairs, Low Capacitance Surge and ESD Protection
The 10/100BASE-T, 1000BASE-TX, and Gigabit Ethernet (GigE) interfaces operating at higher rates are susceptible to ESD strikes,
cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
Features
Typical Application
CLC03
8
TPOPD
C1
C+
VDD
C5
ESD1014
TPOND
BLC03
RJ45
TRANSFORMER
C5
8
TPONC
C1
8
TPOPC
B+
VDD
1
•Compatible with Gigabit Ethernet and beyond
•Enhanced protection for downstream electronics
•Accommodates operating transients above 3.3 V
•Small form-factor allows integration into connectors
TPONB
C1
ALC03
ESD1014
TPOPB
A+
VDD
C5
1
Benefits
TPONA
C1
1
1000BASE-T
ETHERNET TRANSCEIVER
TPOPA
8
1
•Wide range of voltages and capacitance values for
tertiary protection
•Vclamp (25 A surge) < 11 V
•IEC 61000-4-2 rating > 30 kV
•No latching danger
•Surge rating maintained to 125°C
D+
VDD
C5
DLC03
Line Side : LC03-6 (optional)
Transformer Side: ESD1014
Protection against metallic (transverse) strikes
Typical Application
SRDA3.3
8
1
VDD
Through Board
TRANSFORMER
A+
MX4+ TR4+
MDI_A+
A–
MX4– TR4–
MDI_A–
VDD
RJ45
B+
MCT4 TCT4
B–
10/100BASE-T
LINE
DRIVER
C+
C–
D+
D–
CHASSIS
GND
Transformer Side – SRDA3.3
Line-to-Line protection against metallic strikes
With ESD1014
Transient Voltage Suppressors
Device
Data Lines
2 pair ESD Only
NUP4114H
10/100/1000BASE-TX, GigE
1 pair
SRDA3.3
10/100BASE-T
2 pair
ESD1014
1000BASE-TX, GigE
1 pair Line Side
LC03-6
10/100/BASE-T, GigE
Page 24
Typical
ESD
Surge IPP Line-Line Contact
VDC Max 8/20 ms Capacitance Rating
(V)
(A)
(pF)
(±kV) Package
5.0
12*
0.4
13
TSOP-6
3.3
25
4
8
SOIC-8
3.3
25
1.5
30
UDFN-10
5.0
100
8
30
SOIC-8
Signal Integrity for Gigabit Ehternet
Networking Solutions
T1/E1, T3/E3, and xDSL Ports
Surge protection for GR-1089, TIA-968-A, ITU-T and IEC 61000-4-5
T1/E1 links (< 2 Mbps), T3/E3 links (< 43 Mbps) and xDSL lines (< 52 Mbps) are susceptible to ESD strikes, cable-discharge events
and lightning-induced transients.
TVS Features
Benefits
•Capable of all T1/E1 and xDSL voltages with a variety of
capacitance values, for driver-side protection
•Required data-rates are supported by TSPDs
•TVS devices provide high levels of tertiary protection without
latching
TSPD Features
•Cline <14 pF for 50 A surge under 8/20 µs (NP0080TA
series)
TIP
VOICE
(POTS)
RING
xDSL
MODEM
SL15
x2
Typical xDSL + POTS Application
Thyristor Surge Protection Devices
Device
NP0080TA Series
VDRM
(V)
8-16
VBO
(V)
9.5-18
VT
(V)
—
CO
(pF)
11-13
IH
(mA)
50
Surge IPP,
10/1000 ms
(A)
50 (8/20 ms)
Package
TSOP-5
Transient Voltage Suppressors
Device
SRDA3.3
SRDA05
LC03-6
SL05 to SL24
ON Semiconductor
VDC Max
(V)
3.3
5.0
5.0
5 to 24
Surge IPP,
8/20 ms
(A)
25
23
100
5 to 17
Line-Line
Capacitance
(pF)
4.0
5.0
8.0
3.5
ESD
Contact Rating
(kV)
±8
±8
±30
±8
Package
SOIC-8
SOIC-8
SOIC-8
SOT-23
Page 25
Electronic Fuses for Inrush Current Limiting on Power Buses
5 V and 12 V Power Bus Protection
Features
VCC
•Low RDS(ON), high operating and trip currents
(IOP, ITRIP)
•Overvoltage protection
•Precise ITRIP control
•Slew rate control
•Thermal shut-down
•EN pin for synchronizing multiple eFuses
•Outperforms poly-fuses:
–Tighter spec tolerances
–Lower resistance
–Shorter trip-time
–Superior repeatability
•High efficiency with high current capability
•eFuses in parallel achieve practically any desired level of
IOP and ITRIP
Enable/
Fault
Charge
Pump
Enable
Source
Thermal
Shutdown
Current
Limit
UVLO
Voltage
Clamp
ILimit
dV/dt
Control
dV/dt
GND
Typical Feature Set for eFuse
3 V Power Bus
SATA
Power
3.3 V
NIS5431
3.3 V
3.3 V
GND
RLIM
ENABLE
GND
5 V Power Bus
GND
5V
RLIM
NIS545x
5V
5V
NIC - Media Type Independent
Small Form Factor
Pluggable Module
GND
3 V Power
ENABLE
GND
NIS5431
RLIM
12 V
NIS5232
12 V
3.3 V
PCIe
12 V
12 V Power Bus
Network Interface Card Application
Device
NIS5112
NIS5132
NIS5232
NIS5135
NIS5450*
NIS5451*
NIS5452*
NIS5431*
Hard Drive/Solid State Drive Application
Input Voltage
(V)
Output Clamping Voltage
(V)
ITRIP Trip Current
(A)
RDS(ON)
(mW)
Adjustable ITRIP
Auto Recovery
Latching
Package
-0.6 to 18
-0.6 to 18
-0.6 to 18
-0.6 to 18
-0.6 to 14
-0.6 to 14
-0.6 to 14
-0.6 to 14
15
15
15
6.65
5.85
5.5
5.85
3.85
2.5
3.5
4
3.5
3.1
1.6
2.1
1.6
28
44
44
68
40
40
40
45
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SOIC-8
DFN-10
DFN-10
DFN-10
WDFN-10
WDFN-10
WDFN-10
WDFN-10
* Pending 4Q14.
Page 26
Networking Solutions
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