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General Note #1 :Different kinds of IC Packages
General Note #1 :Different kinds of IC
Packages
Image
Name
Ball Grid
Array aka
BGA
Click to expand
Description & Examples
BGA packages are used to permanently mount
devices such as microprocessors. A BGA can
provide more interconnection pins than can be
put on a dual in-line or flat package. The whole
bottom surface of the device can be used,
instead of just the perimeter.The leads are also
on average shorter than with a perimeter-only
type, leading to better performance at high
speeds.Soldering of BGA devices requires
precise control and is usually done by
automated processes. A BGA device is never
mounted in a socket in use.
The Plastic Quad Flat Pack, or PQFP, is an IC
package with leads extending from all four sides
Plastic Quad
of the package body. PQFP's are predominantly
Flat Package
square in shape, although rectangular variants
aka PQFP
do exist. The PQFP is just one of the many types
of the quad flat pack (QFP) package.
Ceramic
Column Grid
Array, or
CCGA
The Ceramic Column Grid Array, or CCGA, is a
square-shaped or rectangular ceramic package
that uses solder columns for external electrical
connection instead of leads or solder balls.
These solder columns are arranged in a grid or
array at the bottom of the ceramic package
body, hence the name 'ceramic column grid
array'. The CCGA is basically just a CBGA
package that has solder columns instead of
solder balls.
The Power Small Outline Package, or PSOP, is a
rectangular small outline IC package developed
by Amkor that integrates a copper heat slug in
its plastic body. The die is attached to this heat
slug, increasing the chip's ability to dissipate
heat and thus handle more power.
PSOP - Power
Small Outline
Package
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The Ceramic Dual In-line Package, or CerDIP is
CerDIP one of the most mature IC packages still in use
Ceremic Dual
today. It is a rectangular ceramic package that
In-line
has leads extending from both of its longer
Package
sides, thus forming two sets of in-line pins.
The Quad Flat No Leads package, or QFN, is a
very small square-shaped or rectangular
surface-mount plastic package with no leads. It
is basically a quad flat package, except for the
absence of leads protruding from its sides. Metal
pads or lands around the periphery of the
bottom of the QFN package serve as electrical
QFN - Quad
connection points to the outside world. Because
Flat No Leads
the QFN has no leads and has shorter bond wire
lengths, it exhibits less inductance than leaded
packages and therefore provides a higher
electrical performance. The QFN package also
includes an exposed thermal pad at the
package bottom to facilitate heat dissipation
from the die.
Ceramic
Package, or
Cerpack
The Ceramic Package, or Cerpack, is a
hermetically sealed rectangular ceramic
package that has leads extending from both of
its longer sides, thus forming two sets of in-line
pins. It is therefore a type of dual-in-line
package (DIP) like the CerDIP.
The Quarter Size Outline Package, or QSOP, is a
small rectangular surface-mount plastic
package with gull wing leads protruding out of
its longer sides.The QSOP comes in two
QSOP standard body widths: the narrow body QSOP
Quarter Size
which has a nominal body thickness of 150 mils
Outline
and the wide body QSOP which has a nominal
Package
body thickness of 300 mils. Typical QSOP lead
counts range from 16 to 28 leads for the narrow
body and 36 to 44 leads for the wide body. The
QSOP lead pitch is typically 25 mils.
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General Note #1 :Different kinds of IC Packages
The Ceramic Leadless Chip Carrier, or CLCC or
LCC, is a square or rectangular surface-mount
CLCC or LCC ceramic package that has no leads. For
Ceramic
electrical connection to the outside world, the
Leadless Chip
LCC instead uses flat metal contacts (or
Carrier
metallized castellations) known as pads around
the four sides of the package bottom.
Sidebraze
Package
The Sidebraze Package, is one of the most
mature IC packages still in use today. It is a
rectangular ceramic package that has leads
extending from both of its longer sides, thus
forming two sets of in-line pins. It is therefore a
type of dual-in-line package (DIP). Two other
widely used DIP's are the PDIP and the CerDIP.
CPGA Ceramic Pin
Grid Array
The Ceramic Pin Grid Array, or CPGA, is a square
or rectangular through-hole ceramic package
whose pins or leads are arranged in a square
array at the bottom of the package body. The
CPGA can either have a frit-sealed ceramic lid or
a solder-sealed metal lid.The CPGA is just one of
several types of the PGA package. The PGA is a
popular choice for devices with high I/O counts
such as microprocessors because of its high pin
density.
Small Outline Transistor (SOT) packages are
very small, inexpensive surface-mount
plastic-molded packages with leads on their two
Small Outline
long sides. Due to their low cost and low profile,
Transistor
SOT's are widely used in consumer electronics.
(SOT)
The SOT-23 and the SC-70 packages are two of
Package
the most widely used SOT packages today. Note
that aside from these two, there are many other
SOT package types used in the IC industry.
CQFP Ceramic
Quad Flat
Pack
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The Ceramic Quad Flat Pack, or CQFP, is a
ceramic IC package with leads extending from
all four sides of the package body. CQFP's are
predominantly square in shape, although
rectangular variants do exist. The CQFP is just
one of the many types of the quad flat pack
(QFP) package.
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The Single-in-Line Package, or SIP, is an IC
package that has a single row of leads
protruding from the bottom of its body. It is not
Single-in-Line
as widely used as dual-in-line packages such as
Package (SIP)
the PDIP and the CerDIP because of its limited
number of pins. SIP's are often used in
packaging networks of multiple resistors.
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D2PAK or
DDPAK Double
Decawatt
Package
The Double Decawatt Package, or D2PAK or
DDPAK is the successor to the DPAK package,
which was designed by Motorola to encase
discrete high-power devices. The D2PAK is
bigger than the DPAK, and comes in several
versions with different terminal counts. The
D2PAK, which has a flat heat sink at the back, is
basically the surface-mount equivalent of the
TO-220 through-hole package and is therefore
sometimes referred to as 'SMD-220'. The D2PAK
is also known as 'TO-263'.
SOIC - Small
Outline
Integrated
Circuit
The 'Small Outline Integrated Circuit', or SOIC, is
a small rectangular surface-mount
plastic-molded integrated circuit package with
gull wing leads. The leads protrude from the
longer edge of the package. It is one of the most
commonly used surface mount packages today.
D3PAK Decawatt
Package 3
The Decawatt Package 3, or D3PAK, is a bigger
version of the D2PAK package. Just like the
D2PAK (and the DPAK, the D2PAK's
predecessor), the D3PAK is a surface-mount
plastic-molded package intended for high-power
discrete devices. The D3PAK is also known by
other names such as 'TO-268' and 'Discrete
Package 3'.
SOJ: Small
Outline
J-Lead
Package
The 'Small Outline J-Lead Package', or SOJ, is a
small rectangular surface-mount plastic-molded
integrated circuit package with J-formed leads.
The leads protrude from the longer edge of the
package. The SOJ is also sometimes referred to
as 'SOIJ', or J-leaded small outline IC package.
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General Note #1 :Different kinds of IC Packages
The Dual Flat No Leads package, or DFN, is a
very small square-shaped or rectangular
surface-mount plastic package with no leads.
Metal pads or lands along two sides of the
DFN - Dual
bottom of the DFN package serve as electrical
Flat No Leads
connection points to the outside world. The DFN
is similar to the QFN, except that the latter has
lands all around the periphery of the package
instead of just two sides like the DFN.
DPAK Decawatt
Package
The Decawatt Package, or DPAK, is an IC
package developed by Motorola to encase
discrete high-power devices. The DPAK is also
known as the 'TO-252'. The acronym 'DPAK' can
also stand for the term 'Discrete
Package'.DPAKs can have 3 or 5 terminals.
The Shrink Plastic Dual In-line Package, or SPDIP,
is a rectangular plastic package with leads
SPDIP extending from both of its long sides, thus
Shrink Plastic forming two sets of in-line pins. The SPDIP is
Dual-in-Line actually just a 'shrink' version of the PDIP. As
Package
such, the SPDIP provides a smaller package size
compared to a standard PDIP for the same lead
count.
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FBGA Fine-Pitch
Ball Grid
Array
The Fine Pitch Ball Grid Array, or FPBGA or FBGA,
is a smaller version of the ball grid array (BGA)
package. As in all BGA packages, FBGA's use
solder balls that are arranged in a grid or array
at the bottom of the package body for external
electrical connection. However, the FBGA is
near-chip-scale in size, with a smaller and
thinner body than the standard BGA package.
As its name implies, it also features a finer ball
pitch (smaller distance between balls).
SSOP Shrink Small
Outline
Package
The Shrink Small Outline Package, or SSOP, is a
smaller or 'shrunk' version of the SOIC package,
having a compressed body and a tightened lead
pitch.
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The J-Leaded Ceramic Chip Carrier, or JLCC, is a
JLCC square or rectangular surface-mount ceramic
J-Leaded
package that has J-formed leads around its
Ceramic Chip
periphery. The plastic-molded equivalent of the
Carrier
JLCC is the PLCC.
TDFN - Thin
Dual Flat No
Leads
The Thin Dual Flat No Leads package, or TDFN,
is a very small and thin square-shaped or
rectangular surface-mount plastic package with
no leads. Instead of leads, it uses metal pads
along two sides of the package body for
electrical connection to the outside world. It is
basically a thinner version of the dual flat no
leads (DFN) package.
LFBGA - Low
Profile
Fine-Pitch
Ball Grid
Array
The Low-Profile Fine Pitch Ball Grid Array, or
LFPBGA, is a smaller version of the ball grid
array (BGA) package. It is basically an FBGA
package that has a package height ranging from
1.2 mm and 1.7 mm. It is therefore thicker than
the TFBGA and the VFBGA.
The Thin Profile Fine Pitch Ball Grid Array, or
TFBGA, is a thinner version of the FBGA package.
TFBGA - Thin Like all BGA packages, TFBGA's use solder balls
Profile
that are arranged in a grid or array at the
Fine-Pitch
bottom of the package body for external
Ball Grid
electrical connection. The TFBGA is
Array
near-chip-scale in size and features ball pitch
values that are even tighter than those of the
FBGA.
The Thin Quad Flat No Leads package, or TQFN,
is a very small and thin square-shaped or
rectangular surface-mount plastic package with
TQFN - Thin
no leads. Instead of leads, it uses metal pads
Quad Flat No
around the periphery of the bottom of the
Leads
package body for electrical connection to the
outside world. It is basically a thinner version of
the quad flat no leads (QFN) package.
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General Note #1 :Different kinds of IC Packages
LGA - Land
Grid Array
The Land Grid Array, or LGA, is a package that
uses metal pads for external electrical
connection instead of leads (as in the pin grid
array) or solder balls (as in the ball grid array).
These metal pads, which are called 'lands', are
arranged in a grid or array at the bottom of the
package body, hence the name 'land grid array'.
The grid arrangement of the lands of the LGA
package allows it to have a high land count,
making it a popular packaging option for
devices with high I/O requirements.
TQFP - Thin
Quad Flat
Pack
The Thin Quad Flat Pack, or TQFP, is a
surface-mount IC package with gull wing leads
on all four sides of the package body. It is
basically a thinner version of the MQFP and
LQFP.
LQFP - Low
The Low Profile Quad Flat Pack, or LQFP, is a
Profile Quad surface-mount IC package with leads extending
Flat Pack
from all four sides of the package body.
The Thin Small Outline Package, or TSOP, is a
rectangular IC package with a thickness of 1.0
TSOP - Thin mm. There are two types of TSOP's. The Type I
Small Outline TSOP has its leads protruding from the shorter
Package
edges of the package. The Type II TSOP has its
leads protruding from the longer edges of the
package.
MLP - Micro
Leadframe
Package
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The Micro Leadframe Package, or MLP, is a
JEDEC-compliant, very thin, near-CSP
square-shaped or rectangular surface-mount
plastic package uses metal pads instead of
leads for electrical connection to the outside
world. The MLP belongs to the same 'no leads'
package family as the QFN and the DFN.
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TSSOP - Thin
Shrink Small
Outline
Package
The Thin Shrink Small Outline Package, or
TSSOP, is a rectangular surface mount plastic
package with gull-wing leads. It has a smaller
body and smaller lead pitch than the standard
SOIC package. It is also smaller and thinner than
a TSOP with the same lead count.
MQFP Metric Quad
Flat Pack
The Metric Quad Flat Pack, or MQFP, is a
surface-mount IC package with gull wing leads
on all four sides of the package body.
The Ultra Thin Dual Flat No Leads package, or
UTDFN, is a very small and thin square-shaped
or rectangular surface-mount plastic package
UTDFN - Ultra
with no leads. Instead of leads, it uses metal
Thin Dual
pads along two sides of the package body for
Flat No Leads
electrical connection to the outside world. It is
basically a thinner version of the thin dual flat
no leads (TDFN) package.
The Micro Small Outline Package, or micro-SOP
or MSOP, is a very small rectangular plastic
MSOP - Micro
package with gull wing leads protruding out of
Small Outline
its longer sides. The MSOP is a miniaturized
Package
version of the SSOP package, having a smaller
footprint than the latter.
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General Note #1 :Different kinds of IC Packages
The Ultra Thin Quad Flat No Leads package, or
UTQFN, is a very small and thin square-shaped
UTQFN or rectangular surface-mount plastic package
Ultra Thin
with no leads. Instead of leads, it uses metal
Quad Flat No pads around the periphery of the package body
Leads
for electrical connection to the outside world. It
is basically a thinner version of the thin quad
flat no leads (TQFN) package.
he Plastic Dual In-line Package, or PDIP, is one of
PDIP - Plastic the most mature plastic IC packages still in use
Dual-in-Line today. It is rectangular in shape and has leads
Package
extending from both sides along its length, thus
forming two sets of in-line pins.
The Very Small Outline Package, or VSOP, is one
VSOP - Very of several smaller versions of the SOIC package,
Small Outline having a compressed body and a tightened
Package
pitch for its gull wing leads. Another smaller
version of the SOIC is the SSOP.
The Plastic Leaded Chip Carrier, or PLCC is a
four-sided plastic package that has “J” leads
around its periphery. These “J” leads occupy
PLCC - Plastic
less board space than the gull-wing leads that
Leaded Chip
other packages like the SOIC have. PLCC lead
Carrier
counts range from 18 to 84. PLCC packages can
either be square or rectangular in shape. The
ceramic equivalent of the PLCC is the JLCC.
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