Bibliography [1] T. Cho, “Anisotropy of Low Dielectric Constant Materials and Reliability of Cu/Low-k Interconnects,” . Austin, Texas: The University of Texas at Austin, 2000, pp. 168. [2] A. Deutsch, M. Swaminathan, M. Ree, C. Surovic, G. Arjavalingam, K. Prasad, D. McHerron, M. McAllister, G. Kopcsay, A. Giri, E. Perfecto, and G. White, “Measurement of Dielectric Anisotropy of BPDA-PDA Polyimide in Multilayer Thin-Film Packages,” IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, vol. 17, pp. 486-492, 1994. [3] F. Ip and C. Ting, “Dielectric Properties of Low Dielectric Constant Polymeric Materials,” Materials Research Society Symposium Proceedings, vol. 381, pp. 135-139, 1995. [4] S. Ramo, J. Whinnery, and T. V. Duzer, Fields and Waves in Communication Electronics. New York: John Wiley & Sons, 1965. [5] S. Adam, “Automatic Microwave Network Measurements,” Proceedings of the IEEE, vol. 66, pp. 384-391, 1978. [6] R. Hackborn, “An automatic network analyzer system,” Microwave Journal, vol. 11, pp. 45-52, 1968. [7] B. P. Hand, “Developing accuracy specifications for automatic network analyzer systems,” Hewlett-Packard Journal, vol. 21, pp. 16-19, 1970. [8] “Applying Error Correction to Network Analyzer Measurements,” HewlettPackard, Application Note 1287-3, May 1997. [9] B. Donecker, “Accuracy Predictions for a New Generation Network Analyzer,” Microwave Journal, vol. 27, pp. 127-141, 1984. [10] C. Matthee, “The Determination of the Uncertainty Associated with Measurements Performed Using a Vector Network Analyser,” presented at 177 1999 IEEE Africon 5th Conference in Africa: Electrotechnological Services for Africa, Cape Town, South Africa, September 28 - October 1, 1999, 1999. [11] G. Engen and C. Hoer, “Thru-Reflect Line”: An Improved Technique for Calibrating the Dual Six-Port Automatic Network Analyzer,” IEEE Transactions Microwave Theory and Techniques, vol. MTT-27, pp. 987-993, 1979. [12] C. Hoer and G. Engen, “Calibrating a Dual Six-Port or Four-Port for Measuring Two-Ports with any Connectors,” presented at IEEE-MTT-S International Microwave Symposium, Baltimore, Maryland, June 2-4, 1986, 1986. [13] R. Marks, “A Multiline Method of Network Analyzer Calibration,” IEEE Transactions on Microwave Theory and Techniques, vol. 39, pp. 1205-1215, 1991. [14] D. Williams and R. Marks, “Accurate Transmission Line Characterization,” IEEE Microwave and Guided Wave Letters, vol. 3, pp. 247-249, 1993. [15] D. Williams, “On-Wafer Impedance Measurement on Lossy Substrates,” IEEE Microwave and Guided Wave Letters, vol. 4, pp. 175-176, 1994. [16] D. Williams, J. Belquin, G. Dambrine, and R. Fenton, “On-Wafer Measurement at Millimeter Wave Frequencies,” presented at 1996 IEEE MTT-S International Microwave Symposium, San Francisco, California, June 17-21, 1996, 1996. [17] R. Marks and D. Williams, “Characterictic Impedance Determination Using Propagation Constant Measurement,” IEEE Microwave and Guided Wave Letters, vol. 1, pp. 141-143, 1991. [18] D. Williams and R. Marks, “Transmission Line Capaciatnce Measurement,” IEEE Microwave and Guided Wave Letters, vol. 1, pp. 243-245, 1991. [19] M. Janezic and D. Williams, “Permittivity Characterization from Transmission-Line Measurement,” presented at 1997 IEEE MTT-S 178 International Microwave Symposium, Denver, Colorado, June 8-13, 1997, 1997. [20] D. Williams, “Accurate Characteristic Impedance Measurement on Silicon,” presented at 1998 IEEE MTT-S International Microwave Symposium, Baltimore, Maryland, June 7-12, 1998, 1998. [21] J. Kasten, M. Steer, and R. Pomerleau, “Enhanced Through-Reflect-Line Characterization of Two-Port Measuring Systems Using Free-Space Capacitance Calculation,” IEEE Transactions on Microwave Theory and Techniques, vol. 38, pp. 215-217, 1990. [22] S. Goldberg, M. Steer, P. Franzon, and J. Kasten, “Experimental Electrical Characterization of Interconnects and Discontinuities in High-Speed Digital Systems,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 14, pp. 761-765, 1991. [23] S. Lipa, M. Steer, A. Morris, and P. Franzon, “Comparison of Methods for Determining the Capacitance of Planar Transmission Lines with Application to Multichip Module Characterization,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, pp. 247-252, 1993. [24] R. Marks and D. Williams, “Correspondence - Accurate Experimental Characterization of Ineterconnects: A Discussion of “Experimental Electrical Characterization of INterconnects and Discontinuities in High-Speed Digital Systems”,” IEEE Transactions on Components, Hybrids, Manufacturing Technology, vol. 15, pp. 601-604, 1992. [25] M. Steer and M. Harward, “Experimental Determination of On-Chip Interconnect Capacitances,” SEMATECH, Technology Transfer 95072905AXFR, August 31, 1995. [26] M. Steer, P. Franzon, A. Glaser, B. Biswas, and S. Lipa, “Experimental Determination of On-Chip Interconnect Capaciatnces Final Report,” North Carolina State University 1997. 179 [27] P. A. Rizzi, Microwave Engineering Passive Circuits. Englewood Cliffs, NJ: Prentice Hall, 1988. [28] Pozar, Microwave Engineering. New York: Addison-Wesley, 1990. [29] H. Wheeler, “Transmission-line properties of a strip on a dielectric sheet on a plane,” IEEE Transactions on Microwave Theory and Techniques, vol. MTT25, pp. 631-647, 1977. [30] K. C. Gupta, R. Garg, and I. J. Bahl, Microstrip Lines and Slotlines. Norwood, MA: Artech House, 1979. [31] B. Wadell, Transmission Line Design Handbook. Norwood, MA: Artech House, 1991. [32] E. Tuncer and D. Neikirk, “Highly Accurate Quasi-Static Modeling of Microstrip Lines Over Lossy Substrates,” IEEE Microwave and Guided Wave Letters, vol. 2, pp. 409-411, 1992. [33] A. E. Ruehli, “Inductance Calculations in a Complex Integrated Circuit Environment,” IBM Journal of Research and Development, pp. 470-481, 1972. [34] E. Tuncer, B.-T. Lee, and D. P. Neikirk, “Interconnect Series Impedance Determination Using a Surface Ribbon Method,” presented at IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Nov. 2-4, 1994. [35] Hewlett-Packard, HP Test & Measurement 1999 Catalog, 1999. [36] R. J. Friar and D. P. Neikirk, “Experimental Determination of the Importance of Inductance in Sub-Micron Microstrip Lines,” presented at 1999 International Interconnect Technology Conference, San Francisco, May 2426, 1999. [37] G. M. Bragg, Principles of Experimentation and Measurement. Englewood Cliffs, New Jersey: Prentice-Hall, 1974. [38] S. J. Kline and F. A. McClintock, “Describing Uncertainties in Single-Sample Experiments,” Mechanical Engineering, vol. 75, pp. 3-8, 1953. 180 [39] G. Borse, “Numerical Differentiation,” in FORTRAN 77 and Numerical Mehtods for Engineers. Boston: PWS-Kent, 1991, pp. 365-369. [40] A. Karamcheti and R. Friar, “Final Report on TCAD Model/Validation for Interconnect Performance (Project ID: S85),” SEMATECH 1998. 181 VITA Robert James Friar was born in Boston, Massachusetts on November 21, 1971, the son of Susan Sommers Friar and James Lewis Friar. His family moved to Los Alamos, New Mexico in 1976, and Mr. Friar graduated from Los Alamos High School in 1990. He entered the University of Illinois at Urbana-Champaign the same year, majoring in Electrical Engineering. During the summers of 1991 through 1994, he worked as an undergraduate research assistant at Los Alamos National Laboratory. Mr. Friar received the degree of Bachelor of Science from the University of Illinois at Urbana-Champaign in May, 1994. He entered the Graduate School at the University of Texas at Austin in August, 1994. Mr. Friar received his Masters of Science in Engineering in May 1997. Mr. Friar was married to Kendra Kay Smith on August 5, 1995. Permanent Address: 1525 Palm Valley Boulevard #1206 Round Rock, Texas 78664 This dissertation was typed by the author. 182