PRODUCT DATA SHEET
OnChip
EMF1101
Packaged EMI Filter with ESD Protection Diode
Features
Applications
· Low pass EMI filters with excellent attenuation
at high frequencies
· ESD protection at 15KV per IEC61000
· Offered in 4, 6 or 8 channels in small form-factor
TDFN package with 0.5mm and 0.4mm pad pitch
· RoHS Compliant in Lead-Free Version
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Cellular Handsets
PDA
MP3 Players
PC & Notebooks
Smart Cards
Digital Cameras
Product Description
The EMF1101 Array is a pi-style Capacitor-Resistor-Capacitor EMI/RFI Filter with integrated
Diodes for electrostatic discharge (ESD) protection. Housed in miniature TDFN and UDFN
Packages this product is available in 4, 6 & 8 channels filters. This device has a cut-off
frequency of 105MHz and can be used in applications with data rates up to 80Mbps.
TDFN and UDFN packages come in 8-lead (4-channel), 12-lead (6-channel) and 16-lead (8channel); and are available both in 0.4mm and 0.5mm pad pitch. The 0.4mm pitch package
provides a 40% PCB space savings compared to the 0.5mm format.
Schematic for Each Line (4, 6 or 8 lines per device)
R
Input
Output
C
C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
RATED
MAXIMUM
TYPICAL
MINIMUM
STANDREVERSE
BREAKDOWN
FORWARD
OFF
LEAKAGE
VOLTAGE
VOLTAGE
VOLTAGE
CURRENT
CUT-OFF
MINIMUM
FREQUENCY
ATTENUATION
RESISTANCE CAPACITANCE
50-OHMS
@ 800 to 3,000
R +/-20%
C +/-20%
SOURCE &
MHz
LOAD
EMF1101-04
6 Volts
7 Volts
0.1 uA
0.8 Volts
-25dB
105 MHz
200-ohms
15-pF
EMF1101-06
6 Volts
7 Volts
0.1 uA
0.8 Volts
-25dB
105 MHz
200-ohms
15-pF
EMF1101-08
6 Volts
7 Volts
0.1 uA
0.8 Volts
-25dB
105 MHz
200-ohms
15-pF
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 1 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
Number of Channels/Package Options
4-channel; 8-pin TDFN & UDFN
TOP VIEW
Pin 1
Marking
.
6-channel; 12-pin TDFN & UDFN
BOTTOM VIEW
8 7 6 5
1 2 3 4
x4D
GDN
PAD
1 2 3 4
TOP VIEW
BOTTOM VIEW
12 11 10 9 8 7
12 11 10 9 8 7
.
Pin 1
Marking
8 7 6 5
GDN
PAD
x6D
1 2 3 4 5 6
1 2 3 4 5 6
8-channel; 16-pin TDFN & UDFN
Pin 1
Marking
TOP VIEW
BOTTOM VIEW
16 15 14 13 12 11 10 9
16 15 14 13 12 11 10 9
.
GDN
PAD
018D4or5
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
Pin Assignments
4-Channel
Description
6-Channel
8-Channel
1
8
1
12
1
16
Filter + ESD Channel 1
2
7
2
11
2
15
Filter + ESD Channel 2
3
6
3
10
3
14
Filter + ESD Channel 3
4
5
4
9
4
13
Filter + ESD Channel 4
5
8
5
12
Filter + ESD Channel 5
6
7
6
11
Filter + ESD Channel 6
7
10
Filter + ESD Channel 7
8
9
Filter + ESD Channel 8
Device Ground
GND PAD
OnChip Part Number Pkg Type
EMF1101-04D4R
TDFN-8 (0.4mm)
C & R Values
15-pF / 200-ohms
EMF1101-04D5R
TDFN-8 (0.5mm)
15-pF / 200-ohms
EMF1101-04U4R
UDFN-8 (0.4mm)
15-pF / 200-ohms
EMF1101-06D4R
TDFN-12 (0.4mm) 15-pF / 200-ohms
EMF1101-06D5R
TDFN-12 (0.5mm) 15-pF / 200-ohms
EMF1101-06U4R
UDFN-12 (0.4mm) 15-pF / 200-ohms
EMF1101-08D4R
TDFN-16 (0.4mm) 15-pF / 200-ohms
EMF1101-08D5R
TDFN-16 (0.5mm) 15-pF / 200-ohms
EMF1101-08U4R
UDFN-16 (0.4mm) 15-pF / 200-ohms
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 2 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
VALUE
Operating Temperature
-40°C to 85°C
Storage Temperature
-55°C to 150°C
Soldering Temperature for 10 seconds
265
UNITS
°C
°C
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
R
PARAMETER
CONDITIONS
Resistance
MIN
TYP
MAX
UNITS
160
0
24
200
240
Ω
30
36
pF
Total Channel Capacitance
At 2.5VDC Reverse Bias, 1MHz,
30mVAC
C
Capacitance C1
At 2.5VDC Reverse Bias, 1MHz,
30mVAC
15
pF
VDIODE
Standoff Voltage
IDIODE=10μA
6.0
V
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=+3.3V
0.1
1.0
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
CTOTAL
VESD
RDYN
fC
A1GHz
In-system ESD Withstand Voltage
Notes 2 and 3
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-42 Level 4
Dynamic Resistance
Positive
Negative
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
±30
kV
±15
kV
2.3
0.9
Ω
Ω
110
MHz
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
Channel R = 100Ω,
Channel C = 15pF
Absolute Attenuation @ 1GHz from 0dB
Level
ZSOURCE = 50Ω, Z LOAD = 50Ω,
DC Bias = 0V; Notes 1, 4 and 5
35
dB
ZSOURCE = 50Ω, Z LOAD = 50Ω,
DC Bias = 0V; Notes 1, 4 and 5
30
dB
A800MHz - Absolute Attenuation @ 800MHz to
6GHz
5.6
-1.5
6GHz from 0dB Level
TA=25°C unless otherwise specified.
ESD applied to input and output pins with respect to GND, one at a time.
These parameters are guaranteed by design and characterization.
Attenuation / RF curves characterized by a network analyzer using microprobes.
These parameters are NOT guaranteed by design, characterization and production.
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 3 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
(Normalized)
Capacitance
Typical Diode Capacitance vs. Input Voltage
DC VOLTAGE
Filter Capacitance vs. Input Voltage
(Normalized to capacitance at 2.5VDC and 25°C)
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 4 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-08 Mechanical Specifications (1.7mm x 1.35mm x 0.75mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 5 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-08 Mechanical Specifications (2mm x 2mm x 0.75mm, pitch 0.5mm)
*This package is compliant with JEDEC standard MO-229, variation
VCCD-3 with exception of the D2 and E2 dimensions as called out in
the table above and the r1 dimension which is not specified in the
MO-229 standard.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 6 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
uDFN-08 Mechanical Specifications (1.7mm x 1.3mm x 0.5mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 7 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-12 Mechanical Specifications (2.5mm x 1.35mm x 0.75mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 8 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-12 Mechanical Specifications (3mm x 1.35mm x 0.75mm, pitch 0.5mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 9 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
uDFN-12 Mechanical Specifications (2.5mm x 1.35mm x 0.5mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 10 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-16 Mechanical Specifications (2.8mm x 1.35mm x 0.75mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 11 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
TDFN-16 Mechanical Specifications (4mm x 1.6mm x 0.75mm, pitch 0.5mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 12 of 13
PRELIMINARY DATA SHEET
OnChip
EMF1101
uDFN-16 Mechanical Specifications (3.3mm x 1.35mm x 0.5mm, pitch 0.4mm)
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
EMF1101 data sheet Rev 1.doc
www.OnChip.com
Page 13 of 13