Walt Disney World Swan & Dolphin Hotel, Orlando, FL USA, May 27–30, 2014
ITherm 2014 Organizing Committee
General Chair:
Program Chair:
Dr. Mehdi Asheghi, Stanford University
Dr. Madhusudan Iyengar, Google
Thermal Management Track:
Chair:
Dr. Thomas Brunschwiler, IBM Research – Zurich
Prof. Amy Fleischer, Villanova University
Co-Chair:
Dr. Saurabh Shrivastava, Panduit Corp.
Co-Chair:
Co-Chair:
Dr. Mike Ellsworth, IBM Corp.
Mechanics Track:
Chair:
Co-Chair:
Co-Chair:
Prof. S.B. Park, SUNY- Binghamton
Dr. Kamal Sikka, IBM Corp.
Dr. Ashish Gupta, Intel Corp.
Emerging Technologies Track:
Chair:
Dr. Kaustubh Nagarkar, General Electric Global Research
Co-Chair:
Dr. Karl Geisler, 3M Corp.
Co-Chair:
Dr. Pete de Bock, General Electric Global Research
Co-Chair:
Prof. Samuel Graham, Georgia Institute of Technology
Panel Discussions:
Chair:
Co-Chair:
Co-Chair:
Prof. Michael Ohadi, University of Maryland
Dr. Victor Chiriac, Qualcomm Inc.
Prof. Y.C. Lee, University of Colorado
Keynote and Technology Talk Speakers:
Chair:
Prof. Avram Bar-Cohen, University of Maryland and DARPA, USA
Co-Chairs:
Dr. Mehdi Asheghi, Stanford University, Dr. Madhusudan Iyengar, Google, Dr. Sandeep
Tonapi, Anveshak Technology and Knowledge Solutions, ITherm Executive Committee
Professional Development Course ITherm/ECTC:
Chair:
Dr. Mehdi Asheghi, Stanford University
Co-Chairs:
Dr. Gamal Refai-Ahmed, GE Global Research
ITherm Achievement Award:
Chair:
Prof. Sushil Bhavnani, Auburn University
Co-Chair:
Dr. Koneru Ramakrishna, Hewlett Packard
Co-Chair:
Prof. Ricky Lee, Hong Kong University of Science and Technology
1
Walt Disney World Swan & Dolphin Hotel, Orlando, FL USA, May 27–30, 2014
Exhibits:
Chair:
Co-Chair:
Dr. Gary B. Kromann, Freescale Semiconductor, Inc.
Paul Wesling, IEEE SF Bay Area Council
Poster Session:
Chair:
Dr. Milnes David, IBM Corp.
Co-Chair:
Dr. Sandeep Tonapi, Anveshak Technology and Knowledge Solutions
Coordinators: Susan Ansorge and Paul Wesling, IEEE SF Bay Area Council
Cutting Edge Vendor:
Chair:
Co-Chair:
Dr. Dustin W Demetriou, IBM Corp.
Dr. Pritish R Parida IBM Corp.
Administrator:
Webmaster:
Paul Wesling, IEEE SF Bay Area Council
Paul Wesling, IEEE SF Bay Area Council
ITherm Executive Committee
Prof. Dereje Agonafer
Prof. Cristina H. Amon
Cons. Prof. Mehdi Asheghi
Prof. Avram Bar-Cohen
Prof. Sushil H. Bhavnani
Prof. Yogendra K. Joshi
Dr. Gary B. Kromann
Prof. Alfonso Ortega
Dr. Koneru Ramakrishna
Prof. Baghat Sammakia
Dr. Tom Lee
Dr. Sandeep Tonapi
University of Texas at Arlington, USA
University of Toronto, Canada
Stanford University, USA
University of Maryland, USA
Auburn University, USA
Georgia Institute of Technology, USA
Motorola, USA
Villanova University, USA
Hewlett-Packard Company, Houston, TX USA
State University of New York at Binghamton, USA
Xilinx, Inc., San Jose, CA USA
Anveshak Technology and Knowledge Solutions, USA
3
5
6
Tuesday, May 27, 2014
8:00 AM – 5:15 PM
3:00 – 7:00 PM
3:30 – 4:30 PM
4:30 – 5:30 PM
6:00 – 7:00 PM
Session A1
Mockingbird 2
Chair:
Youmin Yu
Co-Chair:
Yoav Peles
Session A2
Pelican 2
Chair:
Zhihua Li
Co-Chairs:
K.N. Chiang
Huiyang Fei
Professional Development Courses at ITherm/ECTC
Conference Registration (Mockingbird Corner)
ASME K-16 Committee Meeting (Toucan)
2015 InterPACK/ICNMM Meeting, Open (Toucan)
ASME EPPD General Meeting, Open (Toucan)
Tuesday, May 27, 2014 (5:30 PM – 7:00 PM)
Device Level Thermal Management & Heat Spreading
A Reduced-Order Thermal Model with Application to Multi-Fin Field Effect
Transistor Structure Wangkun Jia, Brian Helenbrook, Ming-Cheng Cheng,
Clarkson University
POD Based Reduced Basis Element Method for Use in Thermal Modeling of
Integrated Circuits Daniel Meyer, Brian Helenbrook, Wangkun Jia, Ming-Cheng
Cheng, Clarkson University
A Physics-Based Compact Thermal Model for Multi-Gate Field Effect Transistor
Structures Jeffrey Smith, Wangkun Jia, Ming-Cheng Cheng, Clarkson University
Finite Element Thermal Analysis of Localized Heating in AlGaN/GaN HEMT Based
Sensors Minmin Hou, Chi-Chun Pan, Mehdi Asheghi, Debbie G. Senesky,
Stanford University
LED Packaging 1
A Review of LED Technology Trends and Relevant Thermal Management
Strategies James Pryde1, David Whalley2, Weeratunge Malalasekera2 :
1Loughborough University, 2Tamlite Lighting,
A Computational and Experimental Study on a Harsh Environment LED System for
Vehicle Exterior Lighting Applications Ferina Saati Khosroshahi1, Celal Sami
Tufekci2, Mehmet Arik1 : 1Ozyegin University, 2Yıldız Technical University
Parametric Design of a Low-Profile, Forced Convection Heat Sink for High-Power,
High-Density LED Arrays Karl Geisler, 3M
Numerical Modeling and Simulation of Laser Diode Diamond Microcoolers Kaiser
Matin1, Yan Zheng2, Avram Bar-Cohen3
1System Planning Corporation, 2Booz Allen Hamilton, 3DARPA/MTO
A Corrosion and Erosion Protection Coating for Complex Microchannel Coolers
used in High Power Laser Diodes
Tapan Desai1, Matthew Flannery1, Angie Fan1, Jens Weyant1, Henry Eppich2,
Keith Lang3, Richard Chin2, Aland Chin2 : 1Advanced Cooling Technologies, Inc.,
2Science Research Laboratory, Inc.
Session A3
Beyond Classical Scaling: Alternative Path towards Energy
Mockingbird 1 Efficient Systems, Chair: Muhannad Bakir
Orthogonal Scaling: The Future Path for Denser and Yet More Efficient Systems
Technology/
Thomas Brunschwiler, IBM Research
Science
3D Stacking as an Enabler for Low-Power High-Performance Computing
Invited Talks
Ayse K. Coskun, Boston University
7:00 – 9:00 PM ITherm Organizing Committee Dinner by Invitation (Osprey Ballroom)
7
8
Wednesday, May 28, 2014
Opens 6:30 AM Conference Registration (Mockingbird Corner)
7:00 – 8:00 AM Breakfast, Swan 6 Ballroom; bring coffee to 8AM session
Session B1
Mockingbird 2
Chair:
Rainer Dudek
Co-Chairs:
Gary Goth,
Jeff Darabi
Session B2
Pelican 2
Chair:
Arun Gowda
Co-Chair:
Luhua Xu
Session B3
Pelican 1
Wednesday , May 28, 2014 (8:00 AM – 9:30 AM)
Stacked Die & Multi-Chip-Module Thermal Management
Generic Thermal Modeling Study of the Impact of 3D-interposer Material and
Thickness Options on the Thermal Performance and Die-to-die Thermal Coupling
Herman Oprins and Eric Beyne, IMEC
Continued Frequency Scaling in 3D ICs through Micro-fluidic Cooling
Caleb Serafy, Ankur Srivastava, Donald Yeung, Dept. of ECE, Univ. of Maryland
Thermal Analysis and Optimization of 2.5D and 3D Integrated Systems with Wide
I/O Memory Andy Heinig, Robert Fischbach, Michael Dietrich, Fraunhofer IIS/EAS
Air Cooling Limits of 3D Stacked Logic Processor and Memory Dies Niru Kumari,
Rocky Shih, Sergio Escobar-Vargas, Tahir Cader, Alexander Govyadinov,
Sarah Anthony, Cullen Bash, Hewlett-Packard Co
Convolution Based Compact Thermal Model Application to the Evaluation of the
Thermal Impact of Die to Die Interface Including Interconnections Federica Lidia
Teresa Maggioni1, Herman Oprins2, Eric Beyne2, Ingrid De Wolf1, Martine
Baelmans3 : 1IMEC, KULeuven, 2IMEC, 3KULeuven
Packaging Materials - Pb-Free Solders
Micro-Mechanical Characterization of Lead-Free Solder Joints in Power
Electronics Samuel Jules1, David Ryckelynck1, Cecilie Duhamel1, Yves Bienvenu1,
Jean-Francois Bisson2, Renan Leon2 : 1MINES ParisTech, 2VALEO
The Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC305
Solder Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall,
Auburn University
Creep Test Method for Determination of Anand Parameters for Lead Free Solders
and Their Variation with Aging Mohammad Motalab, Munshi Basit, Jeffrey C.
Suhling, Michael J. Bozack, Pradeep Lall, Auburn University
Effects of Aging on the Shear Cyclic Stress Strain and Fatigue Behaviors of Lead
Free Solder Joints Muhannad Mustafa, Jordan C. Roberts, Jeffrey C. Suhling,
Pradeep Lall, Auburn University
Nanomechanical Characterization of SAC305 Solder Joints – Effects of Aging
Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall,
Auburn University
High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High
Operating Temperatures Pradeep Lall1, Vikas Yadav1, Di Zhang1, Jeff Suhling1,
Sandeep Shantaram2 : 1Auburn University, 2Freescale Semiconductor
Wednesday , May 28, 2014 (8:00 AM – 9:30 AM)
LED Packaging 2
Developing a Standard Measurement and Calculation Procedure for High
Brightness LED Junction Temperature Mehmet Arık1, Kaustubh Kulkarni2,
9
10
Chair:
Huiyang Fei
Co-Chairs:
Zhihua Li
K.N. Chiang
Session B4
Mockingbird 1
Technology/
Science
Invited Talks
Osprey
Ballroom
Plenary
Talk
Session C1
Mockingbird 2
Chair:
Poh Seng Lee
Co-Chairs:
Mark Schultz,
Ankur Jain
Christina Royce3, Stanton Weaver4 : 1Ozyegin University, 2Exxon Mobile, 3Boston
Consulting, 4GE
Acceleration Factor Analysis of Aging Test on Gallium Nitride (GaN)-based High
Power Light-emitting Diode (LED) Yu-Hsiang Yang, Yen-Fu Su, Kuo-Ning Chiang,
National Tsing Hua University
Phosphor Temperature Reduction by Optimizing the Phosphor Configuration in
White Light-emitting Diode Package Run Hu, Jinyan Hu, Xiaobing Luo,
Huazhong University of Science and Technology
Understanding Heat Dissipation of a Remote Phosphor Layer in an LED System
Indika U. Perera and Nadarajah Narendran, Lighting Research Center
Power Electronics
Chair: Samuel Graham
Revolutionizing Power Electronics with Very High Frequency Power Conversion
Juan Rivas, Stanford University
Thermal Management and Reliability of Automotive Electric Traction Drive
Systems
Sreekant Narumanchi, National Renewable Energy Laboratory
Wednesday , May 28, 2014 (9:00 AM – 12:00 noon)
ITherm/ECTC Exhibits ( Dolphin Hotel, N. Hemisphere A – C)
Wednesday , May 28, 2014 (9:30 AM – 9:45 AM)
Coffee, Tea (brief break – bring with you to Plenary Session)
Wednesday , May 28, 2014 (9:45 AM – 10:45 AM)
Opening Remarks: Welcome by General Chair (Dr. Mehdi
Asheghi) & Program Chair (Dr. Madhu Iyengar )
Some Implications of Thermal Management Technologies on
the Performance of Airborne Systems
Dr. Mark J. Rosker, Raytheon Space and Airborne Systems
Wednesday , May 28, 2014 (11:00 AM – 12:30 PM)
3D: Back-Side & Interlayer Two-Phase Cooling 1
Analysis of Flow and Heat Distribution in a 3D Stack of Chips and Memories with
Back Side Two-Phase Cooling Brian D’Entremont, Jackson Marcinichen, John
Thome, EPFL / LTCM
Two Phase Convective Cooling for Ultra-High Power Dissipation in
Microprocessors, Peter Kottke, Thomas Yun, Craig Green, Yogendra Joshi, Andrei
Fedorov, Georgia Tech
Thermal and Electrical Effects of Staggered Micropin-Fin Dimensions for Cooling
of 3D Microsystems Thomas Sarvey, Yang Zhang, Yue Zhang, Hanju Oh,
Muhannad Bakir, Georgia Institute of Technology
High Vapor Quality Two Phase Heat Transfer in Staggered and Inline Micro Pin Fin
Arrays Alexander Reeser1, Avram Bar-Cohen2, Gad Hetsroni3 : 1Corvid
Technologies, 2University of Maryland, 3Technion-Israel Institute of Technology
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13
Session C2
Pelican 1
Chair:
Vadim Gektin
Co-Chairs:
Shiwani Thakur
Kaushik Mysore
Session C3
Pelican 2
Chair:
K.N.Chiang
Co-Chairs:
Huiyang Fei
Zhihua Li
Thermal Interface Materials & Thermal Underfills 1
Reducing Thermal Interface Impedance Using Surface Engineering
Hafez Raeisi Fard, Robert Karlicek, Joel Plawsky, Theodorian Borca-Tasciuc,
Rensselaer Polytechnic Institute
Study of the Compound Properties of Percolating and Neck-Based Thermal
Underfills Thomas Brunschwiler1, Florian Schindler-Saefkow2, Rachel Gordin3,
Gerd Schlottig1 : 1IBM Research – Zurich, 2AIMC – Angewandte Micro-Messtechnik
GmbH, 3IBM Research – Haifa
High Thermal Conductivity Ultra-High Molecular Weight Polyethylene (UHMWPE)
Films, Hadi Ghasemi, Nagarajan Thoppey, Xiaopeng Huang, James Loomis,
Xiaobo Li, Jonathan Tong, Jiajian Wang, Gang Chen, MIT
Predicting Thermo-Mechanical Degradation of First-Level Thermal Interface
Materials (TIMs) in Flip-Chip Electronic Packages Tuhin Sinha, Jeffrey A. Zitz,
Rebecca N. Wagber, Sushumna Iruvanti, IBM
Effect of Squeezing Conditions on the Particle Distribution and Bond Line
Thickness of Particle Filled Polymeric Thermal Interface Materials Mahmood, R
S. Shirazy1, Stéphanie Allard2, Martin Beaumier2, Luc G. Fréchette1 :
1Université
de Sherbrooke, 2IBM
LED Packaging 3
Development of Figures of Merit for Energy Efficient LED Lighting Systems
Muhammed Nasir Inan and Mehmet Arik, Ozyegin University
High Heat Flux Heat Pipe Embedded in Metal Core Printed Circuit Boards for LED
Thermal Management Daniel Pounds, Richard Bonner, Advanced Cooling
Technologies
Novel Polycarbonate Heat Sinks for Efficient Thermal Management
Nicolas Sunderland, Jim Lorenzo, Terry Davis, Bayer Material Science
Simulation and Measurement of Heat Flow in Recessed LED Fixtures Mounted in
a UL Box Thomas Dreeben and David Betts, Osram Sylvania
Wednesday , May 28, 2014 (11:00 AM – 12:30 PM)
Session C4
Mockingbird 1
Panel 1
Chair: Yogendra
Joshi , Co-Chair:
Mike Ohadi
Advances in Simulations & Technologies for Sustainable Data
Centers
Panelists:
1. Mark Seymour, Future Facilities
2. H. Ezzat Khalifa, Syracuse University
3. Alfonso Ortega, Villanova University
4. Saurabh Srivastava, Pauduit Corp
5. Nick Gangemi, Facility Gateway Corp.
Wednesday , May 28, 2014 (12:30 PM – 2:00 PM)
Swan 6
Ballroom
Lunch and ITherm 2014 Achievement Award Talk
Thermal and Mechanical Challenges in Microelectronics:
From Device to Data-Center-Room Level
Dereje Agonafer, University of Texas at Arlington
Wednesday , May 28, 2014 (1:30 PM – 6:00 PM)
ITherm/ECTC Exhibits ( Dolphin Hotel, N. Hemisphere A – C)
15
Session D1
Pelican 1
Chair:
Muhannad Bakir
Co-Chair:
Shankar Narayanan
Session D2
Pelican 2
Chair:
Jeffrey Suhling
Co-Chair:
Tuhin Sinha
Session D3
Mockingbird 2
Chair:
Myung Ki Sung
Co-Chairs:
Joseph Thalakkottor
H. Dhavaleswarapu
Wednesday , May 28, 2014 (2:00 PM – 3:30 PM)
3D: Interlayer Two-Phase Cooling 2
Piranha Pin-Fins (PPF): Voracious Boiling Heat Transfer by Vapor Venting from
Microchannels – System Calibration and Single-Phase Fluid Dynamics
Corey Woodcock1, Farzad Houshmand1, Joel Plawsky1, Michael Izenson2, David
Fogg2, Roger Hill2, Scott Phillips2, Yoav Peles1 : 1RPI, 2Creare
Nanoporous Evaporative Device for Advanced Electronics Thermal Management
Daniel F Hanks1, Zhengmao Lu1, S. Narayanan1, Kevin R Bagnall1, Rishi Raj2, Rong
Xiao3, R.Enright4, Evelyn Wang1 : 1MIT, 2IIT Patna, 3Exxon Mobile, 4Alcatel-Lucent
A Semi-analytical Approach for Optimized Design of Microchannel Liquid-cooled
ICs Arvind Sridhar, Mohamed Sabry, David Atienza, EPFL
Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and
Micro-Glass Capillaries Damena Agonafer, Ken Lopez, Yoonjin Won, James
Palko, Mehdi Asheghi, Juan Santiago, Kenneth Goodson, Stanford University
Liquid Cooling of a Hot Spot Using a Superhydrophilic Nanoporous Surface
Shailesh Malla1, Miguel Amaya1, Hyejin Moon1, Seung M. You2
1University of Texas at Arlington, 2University of Texas at Dallas
Packaging Materials
Mechanical and Thermal Properties of Copper Inverse Opals for Two-Phase
Convection Enhancement Yoonjin Won, Michael Barako, Damena Agonafer,
Mehdi Asheghi, Kenneth Goodson, Stanford University
Effects of Moisture Exposure on the Mechanical Behavior of Flip Chip Underfills in
Microelectronic Packaging Nusrat J. Chhanda, J. C. Suhling, Pradeep Lall,
Auburn University
Measurements of Interfacial Strengths in Underfilled Flip-Chip Electronic
Packages Using Wedge Delamination Method (WDM) Tuhin Sinha, Kamal K.
Sikka, David N. Yannitty, Paul F. Bodenweber, IBM
Effects of Moisture Exposure on the Mechanical Behavior of Polycarbonate
Materials Used in Electronic Packaging Nusrat J. Chhanda1, Jeffrey C. Suhling1,
Sridhar Canumalla2 : 1Auburn University, 2Microsoft Corporation
Characterization of Cu Free Air Ball Constitutive Behavior using Microscale
Compression Test Sai S. Paranjothy1, Y. Singh1, A. Tippmann1, H.Y Lin1, Ganesh
Subbarayan1, D. Y. Jung2, B. Sammakia2: 1Purdue University,2Binghamton University
Nanoengineered Surfaces for Enhanced
Boiling/condensation and/or Hydrophilicity/ hydrophobicity
Numerical Simulations of Viscoelastic Flow over a Confined Cylinder in
Microchannels, Shenghui Lei and Kevin Nolan, Bell Labs
Experimental Characterization of Digitized Heat Transfer in Circular
Microchannels, Peter Zhang and Kamran Mohseni, University of Florida
Effect of Hydrodynamic and Thermal Slip on Droplet Based Thermal Management
Systems Joseph Thalakkottor and Kamran Mohseni, University of Florida
Capillary Force-Driven Fluid Flow of a Wetting Liquid in Open Grooves with
Different Sizes Tailian Chen, Gonzaga University
Nature-inspired Enhanced Microscale Heat Transfer in Macro Geometry
Aik Ling Goh1, Kim Tiow Ooi1, Ulrich Stimming2 : 1Nanyang Technological
University, 2TUM CREATE
16
17
Session D4
Mockingbird 1
Workshop
Session E1
Mockingbird 2
Chair:
Shakti Chauhan
Co-Chairs:
Stephanie Allard
Chandra Mohan
Session E2
Pelican 1
Chair:
Mark North
Co-Chair:
Krishna Kota
Wednesday , May 28, 2014 (2:00 PM – 3:30 PM)
Enabling the Industrial Internet - GE Technologies in
Advanced Packaging and MEMS
Chris Giovanniello1, Risto Tuominen2, Chris Keimel3, Arun Gowda3, Gamal RefaiAhmed3 : 1GE Ventures, 2GE Consultant, 3GE Global Research
Wednesday , May 28, 2014 (3:30 PM – 4:00 PM)
Coffee, Tea, Cold drinks (brief break – common area)
Wednesday , May 28, 2014 (4:00 PM – 5:30 PM)
Thermal Interface Materials & Thermal Underfills 2
Failure Analysis of Thermal Degradation of TIM During Power Cycling
Hongqing Zhang, Shidong Li, Hsichang Liu, Jay Bunt, Frank Pompeo, Kamal Sikka,
Kathryn Rivera, Hai Longworth, Chenzhou Lian, IBM
Thermal Performance and Reliability Characterization of Bonded Interface
Materials (BIMs) Douglas DeVoto1, Paul Paret1, Mark Mihalic1, Sreekant
Narumanchi1, Avram Bar-Cohen2, Kaiser Matin2 : 1National Renewable Energy
Laboratory, 2DARPA
Thermal Management of Electronic Components using Makrolon Polycarbonate
and Bayflex Polyurethane
Terry Davis, Dave Rocco, James Lorenzo, Bayer Material Science
Boron Nitride Nanoparticles-based Thermal Adhesives for Thermal Management
of High-Temperature Electronics Zach Coker, Hugo Diaz, Nandika D’Souza, TaeYoul Choi, University of North Texas
Carbon Based Thermal Interface Material for High Performance Cooling
Applications Ioan Sauciuc1, Rei Yamamoto2, Jelena Culic-Viskota1, Toru
Yoshikawa2, Syadwad Jain1, Michiaki Yajima2, Nick Labanok1, Christian AmoahKusia1 : 1Intel Corp, 2Hitachi Chemical
Two-Phase: Evaporation Fundamentals
Impact of Surface Enhancements upon Boiling Heat Transfer in a Liquid
Immersion Cooled High Performance Small Form Factor Server Model
Joshua Gess1, Sushil Bhavnani1, Bharath Ramakrishnan1, Wayne Johnson2, Daniel
Harris1, Roy Knight1, Michael Hamilton1, Charles Ellis1 : 1Auburn University,
2Tennessee Tech
Enhanced Pool-Boiling Heat Transfer and Critical Heat Flux Using Femtosecond
Laser Surface Processing Corey Kruse, Troy Anderson, Chris Wilson, Craig
Zuhlke, Dennis Alexander, George Gogos, Sidy Ndao, University of Nebraska Lincoln
Effects of Droplet Diameter on the Leidenfrost Temperature of Laser Processed
Multiscale Structured Surfaces Anton Hassebrook, Corey Kruse, Chris Wilson,
Troy Anderson, Craig Zuhlke, Dennis Alexander, George Gogos, Sidy Ndao,
University of Nebraska - Lincoln
Investigation of Flow Boiling Characteristics in Expanding Silicon Microgap Heat
Sink Tamanna Alam and Poh Seng Lee, National University of Singapore
Experimental Investigation on Boiling Heat Transfer Coefficient Enhancement
Using Grooves for Cooling of Electronic Devices
A Sathyabhama and S. P. Prashanth, NITK Surathkal
18
19
The Small Scale Systems Integration
and Packaging Center
A New York State Center of Excellence
nS3IP’s interdisciplinary teams of scientists
Vision
Connect industry and academia with a focus on systems integration
and packaging of electronics to enable manufacture of equipment
and devices that improve the way people live and interact with
their surroundings.
Mission
S3IP, in partnership with federal and state governments, industry
and academia, performs collaborative projects that advance
microelectronics research and development, ranging from
consultative testing and analysis work measured in hours, to multiyear research projects.
The S3IP Center of Excellence researchers and technologists
are experts in their fields and bring decades of industrial
experience. The center organizes this broad base of expertise with
infrastructure and co-located resources in the following areas:
n Electronics
Packaging
n Energy-Smart
n Flexible
n Energy
Electronic Systems
Electronics
Harvesting and Storage
and engineers will soon move into a new
$30 million, 114,000-square-foot building.
The two-story glass, metal and stone
building has versatile laboratory space and
offices that support Binghamton University’s
expanding industry partnerships. The
building is expected to meet the standards
for Leadership in Energy and Environmental
Design (LEED) platinum certification.
nS3IP, designated a New York State Center
of Excellence, tracks its contributions to
the state economy through reports from
industry partners. From 1996-2013, the
center contributed to $1.09 billion in
economic impact, with more than 1,100 jobs
retained and over 800 jobs created.
n The Small Scale Systems Integration
and Packaging Center has three unique,
multiuser laboratories. The Analytical and
Diagnostics Laboratory (ADL) offers stateof-the-art instrumentation for electron
microscopy, thermal analysis, X-ray analysis,
surface and interface analysis and more. The
Nanofabrication Laboratory (NLAB) focuses
on nano-scale research. The Reliability and
Failure Analysis Lab focuses on evaluating
reliability of electronic packaging and
determination of failure modes.
nS3IP is part of Binghamton University, the
For more information visit:
binghamton.edu/s3ip
premier public university in the Northeast.
Education and outreach are at the core of
many S3IP initiatives, including symposia and
courses in electronics packaging.
Session E3
Pelican 2
Chair:
Satish Chaparala
Co-Chair:
Mayur Sabale
Session E4
Mockingbird 1
Technology/
Science
Invited Talks
Session F1
Swan 6
Ballroom
Wednesday , May 28, 2014 (4:00 PM – 5:30 PM)
Modeling & Simulation 1
Impact of Replacing Sn-Ag Bumps with Cu Pillars on the BEOL Cu/Low-k Fracture
Under Reflow – A Computational Study Zaeem Baig, Tejas S Shetty, A. R.Nazmus
Sakib, Fahad Mirza, Dereje Agonafer, University of Texas, Arlington
Multi Objective Optimization of BEOL and FBEOL Structure in Flip Chip Package
during Die Attach Process Hardik Parekh, Fahad Mirza, Dereje Agonafer,
University of Texas, Arlington
Global-Local Finite Element Optimization Study to Minimize BGA Damage Under
Thermal Cycling Abhishek Deshpande, Hassan Khan, Fahad Mirza, Dereje
Agonafer, University of Texas at Arlington
The Effects of Silver Content and Solidification Profile on the Anand Constitutive
Model for SAC Lead Free Solders Munshi Basit, Mohammad Motalab, Jordan C.
Roberts, Jeffrey C. Suhling, Pradeep Lall, Auburn University
Characterization of Moisture and Thermally Induced Die Stresses in Flip Chip on
Laminate Assemblies Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling,
Richard C. Jaeger, Auburn University
Nanoengineered and Porous Microstructures for Enhanced
Thermal-Fluid Transport Properties, Chair: Mehdi Asheghi
Nanoengineered Surfaces for Enhanced Thermal-Fluid Transport Properties
Kripa Varanasi, MIT
Tailoring Porous Microstructures for High-Heat-Flux Vapor Chamber Applications
Justin Weibel, Purdue University
Wednesday , May 28, 2014 (5:30 PM – 7:00 PM)
Student Poster Session and Networking
Chair: Milnes David, Co-Chair: Sandeep Tonapi
… with food and drink
Wednesday , May 28, 2014 (7:00 PM – 8:30 PM)
Cutting-Edge Vendors and iPad Raffle
Chair: Dustin W Demetriou, Co-Chair: Pritish R Parida
Showcasing advanced technology from smaller companies who have
commercialized R&D. Featured companies:
Session F2
Mockingbird 1
•
•
•
•
•
Auras Technology
Future Facilities
Hitachi Chemical
LiquidCool Solutions
Innovative Research Inc
An iPad Mini will be raffled after each short talk.
21
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partners.
India: 020-24349691, 020-24349651
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CONTACT
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www.anveshak.com
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Thursday, May 29, 2014
Opens 6:30 AM Conference Registration (Mockingbird Corner)
7:00 – 8:00 AM Breakfast, Swan 6 Ballroom; bring coffee to 8 AM session
Thursday , May 29, 2014 (8:00 AM – 9:30 AM)
Session G1
Heat Pipes & Two-Phase Condensation
Pelican 1
Chair:
Justin A Weibel
Co-Chair:
Peter DeBock
Thermal Management of Surveillance Equipment Electronic Components Using
Pulsating Heat Pipes
Roger Riehl and Liomar Cachuté, National Institute for Space Research - INPE/Brazil
Performance Evaluation of Ultra-thin Polymer Pulsating Heat Pipes
Susumu Ogata, Eiji Sukegawa, Takahiro Kimura, Fujitsu Laboratories Ltd
Flat Heat Pipe Performance Thresholds at Ultra-Thin Form Factors
Yashwanth Yadavalli, Justin A Weibel, Suresh V Garimella, Purdue University
Increasing Heat Transfer during Condensation on Surfaces via Lubricant
Impregnation Sushant Anand1, Adam Paxson1, Konrad Rykaczewski2, Kripa
Varanasi1 : 1MIT, 2ASU
Experimental Study of a Pulsating Heat Pipe Using Nanofluid as a Working Fluid
Miguel Gonzalez and Yoon Jo Kim, Washington State University Vancouver
Session G2
Rack Level Cooling: From Air to Hybrid Cooling
Mockingbird 2
Experimental Characterization of Pressure Drop in a Server Rack
Sami Alkharabsheh1, Bahgat Sammakia1, Bruce Murray1, Saurabh Shrivastava2,
Roger Schmidt3 : 1SUNY Binghamton, 2PANDUIT Corp, 3IBM Corp
Local and Global Dimensional CFD Simulations and Analyses to Optimize ServerFin Design for Improved Energy Efficiency in Data Centers
Hidetomo Sakaino, NTT Energy and Environment Systems Labs
Air-Water Hybrid Cooling for Computer Servers: A Case Study for Optimum
Cooling Energy Allocation
Xiaojin Wei, Gary Goth, Peter Kelly, Randy Zoodsma, Allan VanDeventer, IBM
Improving Cooling Efficiency of Servers by Replacing Smaller Chassis Enclosed
Fans with Larger Rack-Mount Fans
Bharath Nagendran1, Shreyas Nagaraj1, John Edward Fernandes1, Richard
Eiland1, Dereje Agonafer1, Veerendra Mulay2
1The University of Texas at Arlington, 2Facebook Inc.
Thermal Performance Modeling of Hybrid Liquid-Air Cooled Servers
Roy Zeighami1, Winston Saunders2, Henry Coles3, Steve Branton4
1Cisco, 2Intel, 3Lawrence Berkeley National Lab, 4Asetek, Inc.
An Overview of the IBM zEnterprise EC12 Processor Cooling System
Gary Goth, Robert Mullady, Randy Zoodsma, A. Cory VanDeventer, Donald Porter,
Peter Kelly, IBM
Chair:
Niru Kumari
Co-Chairs:
Hamza Erden,
Nikhil Lakhkar
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Session G3
Pelican 2
Chair:
Nam Seo Goo
Co-Chair:
Dereje Agonafer
Session G4
Mockingbird 1
Technology/
Science
Invited Talks
Chair:
Suzana Prstic,
Co-Chairs:
Avijit Bhunia,
Amy Marconnet
Modeling & Simulation 2
Fatigue Life Prediction for Solder Interconnects in IGBT Modules by Using the
Successive Initiation Method Nilesh Ghodke, Dipesh Kumbhakarna, Satej
Nakanekar, Sandeep Tonapi, Anveshak Technology and Knowledge Solutions
Effect of Underfill Design Parameters on Die Cracking in Flip Chip on Flexible
Substrates Mayur Sabale, Kiran Vinerkar, Shiwani Thakur, Sandeep Tonapi,
Anveshak Technology and Knowledge Solutions
Simulations of Damage and Fracture in ULK Under Pad Structures during Cu
Wirebond Process Kritika Upreti1, Hung-Yun Lin1, Ganesh Subbarayan1, Dae
Young Jung2, Bahgat Sammakia2 1Purdue University, 2Binghamton University
A Model for the Free (Top) Surface Deformation of Through-Silicon Vias
Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh, Purdue University
Temperature Cycling Performance of Ball Grid Array Packages Under Thermal
Enabling Load Guruprasad Arakere, Milena Vujosevic, Jeffrey Cook, Intel
Corporation
Nanophononic Materials:
Control of Thermal Transport by Phonon Engineering
(8:00 AM – 8:45 AM)
Nanophononic Metamaterial: Energy Harvesting with Nanoscale Heat Brakes
Bruce L. Davis and Mahmoud I. Hussein, University of Colorado Boulder
(8:45 AM – 9:00 AM)
Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams
Woosung Park1, Amy Marconnet2, Takashi Kodama1, Joonsuk Park1, Robert
Sinclair1, Mehdi Asheghi1, Kenneth Goodson1 :
1Stanford University, 2Purdue University
(9:00 AM – 9:30 AM)
Phononics: Nanoengineering Materials for Thermal Transport
Amy Marconnet, Purdue University
Thursday, May 29, 2014 (9:00 AM – 12:00 noon)
ITherm/ECTC Exhibits ( Dolphin Hotel, N. Hemisphere A – C)
Thursday, May 29, 2014 (9:30 AM – 9:45 AM)
Coffee, Tea (brief break – bring with you to Plenary Session
Thursday, May 29, 2014 (9:45 AM – 10:45 AM)
Plenary
Talk
Osprey Ballroom
Thermal Issues and Alternative Solution
Related to 'Fabrication' and 'Operation' of
Monolithic 3D ICs ,
Zvi Or-Bach, MonolithIC 3D Inc
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Session H1
Pelican 2
Chair:
Amir Shooshtari
Co-Chairs:
Parisa Foroughi
Shankar
Devasenathipathy
Thursday, May 29, 2014 (11:00 AM – 12:30 PM)
Single-Phase Cooling
Tailored Parallel Micro-channel Cooling for Hot Spot Mitigation
Stephen Solovitz and Matthew Lewis, Washington State University Vancouver
Pressure Drop and Heat Transfer Characteristics of Square Pin Fin Enhanced
Microgaps in Single Phase Microfluidic Cooling
Zhimin Wan and Yogendra Joshi, Georgia Institute of Technology
Micro-fluidic Silicon Cooling Devices for Particle Tracking Detectors Giulia
Romagnoli1, Jan Buytaert1, Raphael Dumps1, Andrea Francescon1, Oscar Augusto
De Aguiar Francisco1, Kaitlin Howell2, Alessandro Mapelli1, Georg Nuessle3, Paolo
Petagna1 : 1CERN, 2Ecole Polytechnique Fédérale de Lausanne, 3Université
Catholiques de Louvain
Mixed Convection Heat Transfer in a Partially Heated Parallel Plate Vertical
Channel Hasan Celik and Moghtada Mobedi,
Izmir Institute of Technology
Direct Liquid Cooling of Bare Die Packages Using a Microchannel Cold Plate
Tolga Acikalin and Christopher Schroeder, Intel Corporation
Forced Pulsatile Flow to Provoke Chaotic Advection in Wavy Walled
Microchannel Heat Sinks
Hassanali Ghaedamini, Poh Seng Lee, Chiang Juay Teo,
National University of Singapore
Session H2
Rack Level Cooling: Single Phase & Heat Exchangers
Mockingbird 2
Transient Effectiveness Characteristics of Cross Flow Heat Exchanger in Data
Center Cooling Systems
Tianyi Gao1, Bahgat Sammakia1, James Geer1, Alfonso Ortega2, Roger Schmidt3
1Binghamton University, 2Villanova University, 3IBM Corporation
Numerical and Compact Models to Predict the Transient Behavior of Cross-flow
Heat Exchangers in Data Center Applications
Marcelo del Valle and Alfonso Ortega, Villanova University
Flow Rate and Inlet Temperature Considerations for Direct Immersion of a Single
Server in Mineral Oil
Richard Eiland1, John Fernandes1, Marianna Vallejo1, Dereje Agonafer1,
Veerendra Mulay2 : 1University of Texas at Arlington, 2Facebook Inc.
Flow Network Analysis of the IBM Power 775 Supercomputer Water Cooling
System
Michael J. Ellsworth, Jr., IBM Corporation
Experimental Characterization and Modeling of a Water-Cooled Server Cabinet
Kourosh Nemati, Bruce Murray, Bahgat Sammakia, Binghamton University
Experimental Investigation of Direct Attach Microprocessors in a Liquid-Cooled
Chiller-less Data Center
Mark Schultz, Michael Gaynes, Pritish Parida, Timothy Chainer, IBM
Chair:
Aparna Vallury
Co-Chairs:
Jim VanGilder,
Sukhvinder Kang
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Session H3
Pelican 1
Chair:
Suzana Prstic
Co-Chair:
Avijit Bhunia
Session H4
Mockingbird 1
Technology/
Invited Talks
Thursday, May 29, 2014 (11:00 AM – 12:30 PM)
Nanoscale Heat Transport
Thermal Conduction in Nanoporous Copper Inverse Opal Films
Michael Barako1, Jeffrey Weisse1, Shilpi Roy1, Takashi Kodama1, Thomas
Dusseault1, Munekazu Motoyama2, Mehdi Asheghi1, Fritz Prinz1, Xiaolin Zheng1,
Kenneth Goodson1 1Stanford University, 2Nagoya University
Characterization of Phase-Change Layer Thermal Properties Using a MicroThermal Stage, Scott Fong, Rakesh Jeyasingh, Mehdi Asheghi, Kenneth Goodson,
H.-S. Philip Wong, Stanford University
Inverse Opals for Fluid Delivery in Electronics Cooling Systems, Thomas J.
Dusseault, Julie Gires, Michael T. Barako, Yoonjin Won, Damena D. Agonafer,
Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson, Stanford University
CHF Enhancement of Al2O3, TiO2 and Ag Nanofluids and Effect of Nucleate Pool
Boiling Time, Mehmed Sitki Ulcay, HVCC
Thermal Characterization of Nanostructured Superlattices of TiN/TaN:
Applications as Electrodes in Phase Change Memory Aditya Sood, Sukru Burc
Eryilmaz, Rakesh Jeyasingh, Jungwan Cho, Mehdi Asheghi, H.-S. Philip Wong,
Kenneth E. Goodson, Stanford University
Mobile Thermal Management
Chair: Dr. Victor Chiriac
Ponniah Ilavarasan, Intel Mobile Communication Group
Ashish Gupta, Intel Assembly & Test Technology Development
Thursday, May 29, 2014, 2014 (12:30 PM – 2:00 PM)
Swan 6 Lunch & Luncheon talk
Ballroom Sustainability: Its Physics and Natural
Constructal Design, Adrian Bejan, Duke University
Session J1
Mockingbird 2
Chair:
Veerendra Mulay
Co-Chair:
Pritish Parida
Thursday, May 29, 2014, , 2014 (1:30 PM – 4:00 PM)
ITherm/ECTC Exhibits ( Dolphin Hotel, N. Hemisphere A – C)
Thursday, May 29, 2014, 2014 (2:00 PM – 3:30 PM)
Data Center: Air Cooling with Containment
Numerical Investigation of Underfloor Obstructions in Open-Contained Data
Center with Fan Curves Husam Alissa1, Sami Alkharabsheh1, Siddharth Bhopte2,
Bahgat Sammakia1 : 1Binghamton University, 2Microsoft
Parametric Analysis for Thermal Characterization of Leakage Flow in Data Centers
Zhihang Song, Bruce Murray, Bahgat Sammakia, Binghamton University
Cooling Performance of Ceiling-Plenum-Ducted Containment Systems in Data
Centers, Jim VanGilder and Xuanhang (Simon) Zhang, Schneider Electric
Benefits of Properly Sealing a Cold Aisle Containment System
Yasin Makwana, Andrew Calder, Saurabh Shrivastava, Panduit
Effectiveness of Rack-Level Containment in Removing Data Center Hot-spots
Chris Onyiorah1, Richard Eiland1, Dereje Agonafer1, Roger Schmidt2
1The University of Texas at Arlington, 2IBM
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Session J2
Pelican 1
Chair:
Amy Marconnet
Co-Chairs:
Mehmet Arik,
Sung Ki Kim
Session J3
Pelican 2
Chair:
Je-Young Chang
Co-Chair:
Fatemeh
Hassanipour
Session J4
Mockingbird 1
Panel 2
Chair:
Suresh Sitaraman
Co-Chair: SB Park
Thursday, May 29, 2014, 2014 (2:00 PM – 3:30 PM)
Air Heat Sinks and System Level Cooling
Thermal Optimization of An Air-Cooling Heat Exchanger Utilizing ManifoldMicrochannels Martinus A. Arie, Amir H. Shooshtari, Serguei V. Dessiatoun,
Michael Ohadi, University of Maryland, College Park
Analysis for Upper Limit of Air Cooling by Engineered Porous Metal Heat Sinks
Ninad Trifale , Eric Nauman, Kazuaki Yazawa, Purdue University
Understanding the Impact of Flow Bypass on the Overall Pressure Drop of Air
Cooled Heat Sinks Krishna Kota1 and Mohamed Awad2
1New Mexico State University, 2Mansoura University
Modal Control of Unstable Boiling States in Three-dimensional Nonlinear Poolboiling Systems Rob van Gils, Michel Speetjens, Hans Zwart, Henk Nijmeijer,
Eindhoven University of Technology
Enhancing Thermal Performance in Embedded Computing for Ruggedized Military
and Avionics Applications Darren Campo, Jens Weyant, Bryan Muzyka,
Advanced Cooling Technologies, Inc
Phase Change Materials
The Influence of Nanoparticle Loading and Surfactant on the Viscosity of
Nanoenhanced Energy Storage Materials
Rebecca Weigand and Amy S. Fleischer, Villanova University
Double-Sided Cooling and Transient Thermo-Electrical Management of Silicon on
DCB Assemblies for Power Converter Modules: Design, Technology and Test
Bernhard Wunderle1, Martin Springborn2, Daniel May2, Charles-Alix Manier3,
Mohamad Abo Ras4, Raul Mrossko5, Hermann Oppermann3, Tobias Xhonneux6,
Tristan Caroff7, Wilhelm Maurer8, Radoslava Mitova9 :1TU Chemnitz / Fraunhofer
ENAS, 2TU Chemnitz, 3Fraunhofer IZM, 4Berliner Nanotest & Design GmbH, 5AMIC
GmbH, 6Taipro Engineering, 7CEA LITEN, 8Infineon Technologies, 9Schneider Electric
Modeling Temperature Development of Li-Ion Battery Packs in Hybrid Refuse
Truck Operating at Different Ambient Conditions
Paul Tiberiu Coman and Christian Veje, Southern Denmark University
A Parametric Study of Microporous Metal-Matrix Phase-Change Material
Composite Heat Spreaders for Transient Thermal Applications
Srilakshmi Lingamneni, Mehdi Asheghi, Kenneth Goodson, Stanford University
Phase Change Material-Based Heat Sinks and their Geometry Optimization for
Heat Transfer Enhancement , Jinyan Hu, Run Hu, Xiaobing Luo, Huazhong
University of Science and Technology
3D Microsystems: Fabrication, Reliability, and Thermal
Challenges and Future Directions
Panelists:
Phil Garrou, Consultant
Li Li, Cisco Systems
Eric Beyne, IMEC
Thursday, May 29, 2014, 2014 (3:30 PM – 4:00 PM)
Coffee, Tea, Cold drinks (brief break – common area)
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Session K1
Mockingbird 2
Thursday, May 29, 2014, 2014 (4:00 PM – 5:30 PM)
Jet & Spray Cooling
Chair:
Mark Spector
Co-Chairs:
Tuhin Sinha,
Unni Vadakkan
Effect of Actuator Deflection on Heat Transfer for Low and High Frequency
Synthetic Jets, Muhammad Ikhlaq, O. Ghaffari, Mehmet Arik, Ozyegin University
An Investigation into Momentum and Temperature Fields of a Meso-Scale
Synthetic Jet
Omidreza Ghaffari1, M. Baris Dogruoz2, Mehmet Arik1 :
1Ozyegin University, 2Cisco Systems
Visualization of Bubble Behavior for Jet Impingement Cooling with Phase Change
Feng Zhou, Shailesh Joshi, Ercan Dede, Toyota Research Institute of North America
Influence of Micro-scale Aspects and Jet-to-jet Interaction on Free-surface Liquid
Jet Impingement for Micro-jet Array Cooling,
Herman D. Haustein1, J. Joerg2, Wilko Rohlfs2, Reinhold Kneer2 1Tel Aviv
University, 2Augustinerbach RWTH University
Session K2
Reliability 1
Pelican 2
Chair:
Pradeep Lall
Co-Chair:
Susan Smith
Session K3
Pelican 1
Chair:
Ryan Enright
Co-Chair:
Vincent Gambin
Thermo-mechanical Behavior and Reliability Issues for High Temperature
Interconnections
Rainer Dudek1, Peter Sommer1, Ralf Doering1, Timo Herberholz2, Andreas Fix2,
Bettina Seiler3, Sven Rzepka1
1Fraunhofer ENAS, 2Robert Bosch GmbH, 3CWM GmbH
The Study of Vibrational Performance on Different Doped Low Creep Lead Free
Solder Paste and Solder Ball Grid Array Packages,
Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto Raj, Derrick
Stone, John Evans, George Flowers, Jeff Suhling, Auburn University
Reliability of Flip Chip on Flexible Substrates under Drop Impact
Mohasin Mulla, Kalpesh Bonde, Mayur Sabale, Shiwani Thakur, Sandeep Tonapi,
Anveshak Technology and Knowledge Solutions
Optimizing Package Flatness & Load for Improved Thermal/Mechanical
Performance,
Susan Smith, Jeffory Smalley, Tao Liu, Intel Corporation
Event-Based Use Conditions Method for Thermo-Mechanical Reliability Risk
Assessment
Ioan Sauciuc, Sanjay Goyal, Min Pei, Tannaz Harirchian, Maritza Tse, Robert
Kwasnick, Shantanu Tripathi, Alena Matusevich, Intel Corporation
Near Junction Thermal Transport
Understanding Parasitic Effects to Improve the "3ω" Measurement of GaN
HEMTs Thermal Impedance
Mustafa Avcu1, Raphael Spmmet1, Guillaume Callet2, Jean Pierre Teyssier1,
Raymond Quere1 : 1XLIM-Limoges university, 2UMS
Analytical Thermal Model for HEMTs with Complex Epitaxial Structures
Kevin Bagnall, Omair Saadat, Tomas Palacios, Evelyn Wang, MIT
Electro-thermo-mechanical Transient Modeling of Stress Development in
AlGaN/GaN High Electron Mobility Transistors (HEMTs)
Jason Jones1, Matt Rosenberger2, William King2, Rama Vetury3, Eric Heller4,
Donald Dorsey4, Samuel Graham1 : 1Georgia Tech, 2University of Illinois, 3RFMD,
4Air Force Research Lab
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Experimental Development of a Near Junction Microchannel Heat Spreader
Stan Weaver1, Gary Mandrusiak1, Nannan Chen1, Oliver Boomhower1, Joleyn
Brewer1, Robert Davis1, Ramakrishnan Vetury2, Haldane Henry2
1General Electric Global Research, 2RF Micro Devices
Wafer-Level Packaging Method Incorporating Embedded Thermal Management
for GaN-Based RF Front-Ends Alexandros Margomenos, Florian Herrault, Eric
Prophet, Miroslav Micovic, Melanie Yajima, Colleen Butler, Keisuke Shinohara,
David Brown, Andrea Corrion, Ara Kurdoghlian, Ross Bowen, Michael Wetzel,
Charles McGuire, Robert Grabar, David Chow, HRL Laboratories,LLC
Session K4
Mockingbird 1
Panel 3
Chair:
Victor Chiriac
Co-Chair:
Y.C. Lee
Session L1
Mockingbird 1
Technology/
Science
Invited Talks
Thermal Challenges of Smart Phones, Tablets, Phablets and
Beyond
Panelists:
John Thome, EPFL Switzerland
Raghav Mahalingam, Nuventix
Ken Goodson, Stanford University
Ponniah Ilavarasan, Intel Corp
Yogi Joshi, Georgia Tech
Mark Hartman, Outlast Technologies
Thursday, May 29, 2014, 2014 (6:00 PM – 8:00 PM)
Embedded Cooling of High Power Components (DARPA Gen-3)
Co-Chairs: Prof. Suresh Garimella, Dr. Kamal Sikka, Prof. Avi
Bar-Cohen
Evaporative Microfluidic Cooling of HPC Module, T. Chainer, IBM
Thermal Transport in Diamond Substrates, Kenneth Goodson, Stanford University
Two-Phase Heat Transfer in Microchannels, Y. Peles, RPI
Multi-scale Modeling of Evaporative Cooling Systems, J.A. Weibel, Purdue
Thermoelectric Remediation of Hot Spots, B. Yang, University of Maryland
Digital Liquid Delivery for Hot Spot Cooling S.M. You, UT-Dallas
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Friday, May 30, 2014
7:00 - 9:00 AM Conference Registration (Mockingbird Corner)
7:00 – 8:00 AM Breakfast, Swan 6 Ballroom; bring coffee to 8AM session
Friday, May 30, 2014 (8:00 AM – 9:30 AM)
Session M1
Thermal Modeling Methodologies
Toucan 1
Transient Thermal Analysis of the Microprocessor System One-Dimensional
Thermal Network with Power Estimation Equation,
Koji Nishi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2
1AMD Japan Ltd., 2Toyama Prefectural University
Using State-Space Models for Accurate Computations of Transient Thermal
Behavior of Electronic Packages
Gokul Shankaran1, Baris Dogruoz2, Ryan Magargle1
1Ansys Inc., 2Cisco Systems Inc.
Latest Developments of Compact Thermal Modeling of System-in-Package
Devices by means of Genetic Algorithm
Eric Monier Vinard1, Valentin Bissuel1, Najib Laraqi2, Cheikh Tidiane Dia2
1Thales Global Services, 2University of Paris Ouest - Laboratory LTIE
Thermal Modeling Improvements Using Substrate ECAD Integration
Vibhash Jha and Torsten Hauck, Freescale Semiconductor
Chair:
Arvind Sridhar
Co-Chair:
Zhihang Song
Session M2
Fans & Pumps / Thermosyphons & Refrigeration
Toucan 2
Efficiency Optimization for a Frictionless Air Flow Blade Fan – Design Study
Ralph Karl Benjamin Schacht1, Alexander Hausdorf1, Bernhard Wunderle2, Sven
Rezepka3, Bernd Michel3
1Brandenburg Technical University Cottbus-Senftenberg, 2Technical University
Chemnitz, 3Fraunhofer ENAS
Towards Development of a Passive Datacenter Cooling Technology: On-Server
Thermosyphon Cooling Loop under Dynamic Workload
Jackson Marcinichen, Sylwia Szczukiewicz, Nicolas Lamaison, John Thome, EPFL /
LTCM
A Mechanical Micropump for Electronic Cooling
Bin Duan, Tinghui Guo, Mingqing Luo, Xiaobing Luo, Huazhong University of
Science and Technology
Thermal Performance of Dual Piezoelectric Cool Jet for Ultra-Thin Mobile
Applications
Andrew McNamara1, Ali Akbar Merrikh1, Chris Jaggers1, Gamal Refai-Ahmed2 :
1AMD, 2GE Global Research
A Review of Challenging Issues in the Integration of Absorption Refrigeration and
Organic Rankine Cycle into the Data Center Cooling System
Khosrow Ebrahimi, Gerard Jones, Amy Fleischer, Villanova University
Chair:
Yoonjo Kim
Co-Chairs:
Reza Khiabani
Saket Karajgikar
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Friday, May 30, 2014 (8:00 AM – 9:30 AM)
Session M3
Mockingbird 2
Chair:
Satish Kumar
Co-Chair:
Satej Nakanekar
Session M4
Mockingbird 1
Panel 4
Chair:
Avi Bar-Cohen
Co-Chair:
Kaiser Matin
Session N1
Mockingbird 2
Chair:
David Copeland
Co-Chairs:
Dustin Demetriou,
Ashish Sinha
Power Electronics
Novel Power Electronics 3D Heat Exchanger, Kevin Bennion, Justin Cousineau, Jason
Lustbader, Sreekant Narumanchi, National Renewable Energy Laboratory
Advanced Liquid Cooling for a Traction Drive Inverter Using Jet Impingement and
Microfinned Enhanced Surfaces Scot Waye, Sreekant Narumanchi, Mark Mihalic,
Gilbert Moreno, Kevin Bennion, Jana Jeffers, NREL
The Effect of Cooling from Surface of Power Si MOSFET on Hot Spot Temperature
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka,
Toyama Prefectural University
Thermal Management of an IGBT Module Using Two Phase Cooling Neha Malu, Disha
Bora, Satej Nakanekar, Sandeep Tonapi, Anveshak Technology and Knowledge Solutions
Thermal Characterization of IGBT Modules Used in Hybrid Electric Vehicles
Harichandra Lambate, Satej Nakanekar, Sandeep Tonapi,
Anveshak Technology and Knowledge Solutions
Innovations in Thermal Packaging Materials
Panelists:
Diamond Coatings and Vias, Andrew Koehler, NRL
Nanoemulsions, Bao Yang, Univ of Maryland
Polymer TGPs, Y. C. Lee, Univ of Colorado
Compliant NanoThermal Interface Material, David Shaddock, GE
ANCER: Coatings for Passivation of Microchannel Coolers,
Matt Flannery, ACT
Diamond-Metal Composites, Brent Wagner, GTRI
Friday, May 30, 2014 (9:45 AM – 11:15 AM)
Data Center: Efficiency and Heat Recovery
Impact of ASHRAE Environmental Classes on Data Centers
Milnes P. David and Roger Schmidt, IBM
Detailed and Reduced Order Modeling of Steady State Counterflow Mechanical
Draft Cooling Towers for Analysis of Data Center Energy Efficiency
Kayvan Abbasi, Aaron P. Wemhoff, Alfonso Ortega, Villanova University
Data Center Cold Aisle Set Point Optimization through Total Operating Cost
Modeling
Brandon Rubenstein and Matthew Faist, Microsoft
Energy Saving Potential of Low-Temperature Cooling of Computers
H. Ezzat Khalifa1, Hamza Salih Erden1, Romain Bonabe de Rouge2
1Syracuse University, 2INSA Strasbourg
An Exergy-Based Analysis of the Effects of Rear Door Heat Exchange Systems on
Data Center Energy Efficiency
Aaron P. Wemhoff and Alfonso Ortega, Villanova University
The Plenum Concept: Improving Scalability, Security, and Efficiency for Data
Centers
Daniel Hackenberg, ZIH, TU Dresden
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Friday, May 30, 2014 (9:45 AM – 11:15 AM)
Session N2
Toucan 1
Chair:
Qian Han
Co-Chair:
Chang-Chun Lee
Session N3
Toucan 2
Chair:
Ryan Enright
Co-Chair:
Vincent Gambin
Session N4
Mockingbird 1
Technology/
Science
Invited Talks
Reliability II
Effect of Solder Joint Size on Fatigue Life of WL-CSP under Accelerated Thermal
Cycling Using FEM
Nupur Bajad, Harshada Kulkarni, Satish Dhole, Shiwani Thakur, Sandeep Tonapi,
Anveshak Technology and Knowledge Solutions
Assessing Solder Interconnect Reliability of Control Boards in Power Electronic
Systems using Physics-of-Failure Models
David Squiller1, Elena Mengotti2, Patrick McCluskey1
1University of Maryland, College Park, 2ABB Corporate Research, Switzerland
Reliability of Solid-State Lighting Electrical Drivers subjected to WHTOL
Accelerated Aging
Pradeep Lall1, Peter Sakalaukus1, Lynn Davis2 : 1Auburn University, 2RTI Int’l
Damage Mechanisms in Copper-Aluminum Wirebond Under High Temperature
Operation
Pradeep Lall1, Shantanu Deshpande1, Luu Nguyen2, Masood Murtuza2
1Auburn University, 2Texas Instruments
SSL and LED Life Prediction and Assessment of CCT Shift
Pradeep Lall1, Peter Sakalaukus1, Junchao Wei1, Lynn Davis2 : 1Auburn University,
2RTI International
Near Junction Thermal Transport: Diamond
Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN
Jungwan Cho1, Kenneth Chu2, Pane Chao2, Craig McGray3, Mehdi Asheghi1,
Kenneth Goodson1 1Stanford University, 2BAE Systems, 3Modern Microsystems, Inc.
Anisotropic and Nonhomogeneous Thermal Conduction in 1 µm Thick CVD
Diamond Aditya Sood, Jungwan Cho, Karl D. Hobart, Tatyana Feygelson, Bradford
Pate, Mehdi Asheghi, Kenneth E. Goodson, Stanford University
Analysis and Characterization of Thermal Transport in GaN HEMTs on Diamond
Substrates David Altman1, Matthew Tyhach1, Samuel Kim2, James McClymonds2,
Samuel Graham2, Jungwan Cho3, Kenneth Goodson3, Daniel Francis4, Firooz Faili4,
Felix Ejeckam4, Steven Bernstein1 : 1Raytheon, 2Georgia Tech, 3Stanford, 4Element6
Diamond for Enhanced GaN Device Performance
Felix Ejackman1, Daniel Francis1, Firooz Faili1, Joe Dodson1, Daniel Twitchen1,
Bruce Bolliger1, Dubravko Babic2 : 1Element Six, 2University of Zagreb
Evaluation of Thermal Resistance of AlGaN/GaN Heterostructure on Diamond
Substrate
Deep C. Dumka and Tso-Min Chou, TriQuint
Advances in Pool Boiling
Chair: Prof. Satish Kandlikar
Revival of Pool Boiling For High Heat Flux Dissipation
Satish Kandlikar, Rochester Institute of Technology
Engineered Microstructures for Fluid Self-propulsion During Boiling
and Condensation
Vinod Narayanan, Oregon State University
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Friday, May 30, 2014 (11:15 AM – 12:45 PM)
Session P1
Toucan 1
Vapor Chambers & Immiscible Liquid-Gas Flow
Session P2
Mechanics of Packaging
Chair:
Baris Dogruoz
Co-Chair:
Ram Ranjan
Toucan 2
Chair:
Sandeep Tonapi
Co-Chair:
Hongqing Zhang
Session P3
Mockingbird 2
Chair:
Sidy Ndao
Co-Chair:
Shankar
Devasenathipathy
Transient Wall Temperature Measurements of Two-Phase Slug Flow in a
Microchannel Farzad Houshmand and Yoav Peles, Rensselaer Polytechnic Institute
Simulating the Evaporation of Pinned Water Microdroplets with Implementation
of a Surface Concentration Distribution
Kevin Gleason and Shawn Putnam, University of Central Florida
Mass Transport Characteristics and Theoretical Performance Limits of Micropillar
Wicks Saitej Ravi, David Horner, Saeed Moghaddam, University of Florida
Enhanced Performance of a Thermal Ground Plane Utilizing an Inorganic Aqueous
Solution Armin Karimi, Sean Reilly, Ivan Catton, UCLA
Understanding the Impact of Temperature Variations on Measurement of the
Stress Dependent Parameters of Bipolar Junction Transistors Safina Hussain,
Richard Jaeger, Jeffrey Suhling, Bogdan Wilamowski, Michael Hamilton,
Parameshwaran Gnanachchelvi, Auburn University
Mechanism Investigation on Die Tilt in Die Attach Process Based on Minimal Free
Energy Theory Huai Zheng, Yiman Wang, Lan Li, Xiaobing Luo,
Huazhong University of Science & Technology
Analysis of Asperity Dominated Contacts in Nanoelectromechanical Relays Using
Thin Films Kimberly Harrison, C. Dalvi, M. Asheghi, R. Howe, Stanford University
Material Behavior of SAC305 under High Strain Rate at High Temperature
Pradeep Lall1, Di Zhang1, Vikas Yadav1, Jeff Suhling1, Sandeep Shantaram2
1Auburn University, 2Freescale Semiconductor
The Application of Through Silicon Vias (or TSVs) for High Power and
Temperature Devices Ajinkya Ranade, Ross Havens and Krishnaswami Srihari
Binghamton University
Thermal Characterization Methods
Nanosecond Time-resolved Visualization of Short Pulse Laser Ablation Processes
for Various Laser Beam Profiles Hong Duc Doan1, Naoki Iwatani1, Hiroyasu
Sasaki2, Satoshi Matsumura2, Kazuyoshi Fushinobu1
1Tokyo Inst of Technology, 2NAC Imaging Technology
Limitations and Accuracy of Steady State Technique for Thermal Characterization
of Thermal Interface Materials and Substrates Mohamad Abo Ras1, Daniel May2,
Ralph Schacht3, Thomas Winkler1, Sven Rzepka4, Bernd Michel4, Bernhard
Wunderle2 : 1Berliner Nanotest und Design GmbH, 2Chemnitz University of
Technology, 3Brandenburg University of Technology, 4Fraunhofer Institute for
Electronic Nano Systems
Investigation of Thermal Interface Materials Using Phase-Sensitive Transient
Thermoreflectance Technique Xuhui Feng, Charles King, Douglas DeVoto, Mark
Mihalic, Sreekant Narumanchi, National Renewable Energy Laboratory
Transient Thermal Imaging Characterization of a Die Attached Optoelectronic
Device on Silicon Kazuaki Yazawa1, Dustin Kendig1, Kadhair Al-hemyari2, Ali
Shakouri3 : 1Microsanj LLC., 2Intel Corp., 3Purdue University
Reliability of MEMS Devices under Multiple Environments Pradeep Lall1, Amrit
Abrol1, Lee Simpson2, Jessica Glover2 : 1Auburn University, 2US Army AMRDEC
45
MICROSANJTM is a leading provider of high-­‐resolution transient thermal imaging systems and services for commercial and research applications. Systems are based on optical thermoreflectance and advanced software algorithms for the thermal analysis of today’s advanced electronic and optoelectronic devices. Why Microsanj •
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First commercially available thermal imaging system based on thermoreflectance
Extensive experience and expertise in device thermal imaging and analysis
Consulting and testing services available
Offer broad range of thermoreflectance thermal imaging systems
Microsanj Thermal Imaging Solutions • Best spatial and temporal resolution and excellent temperature resolution
• User-­‐friendly SanVIEWTM software
• Lowest cost imaging solution compared to alternative approaches
Applications •
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Detect and locate thermal hot spots
Validate thermal models
Optimize manufacturing processes for thermal performance
Analyze static and time-­‐dependent thermal events
Key Customers • ATN Japan
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• Birck Nanotechnology Center •
• BSW Test Systems AG
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China Academy of Sciences
Chip Test Solutions
Design Engineering Inc. (DEI) Hittite Microwave
Infinera
Intel Corporation
•
•
•
•
•
Instituto de Microelectronica de Barcelona
Mellanox-­‐Kotura
Nanyang Technological University of
Singapore
National University of Singapore
Radiant Optronics Pte
Raytheon
Silicon Image
University of California at Santa Barbara
CONTACT INFORMATION Tel: +1 408 256 1255 Website: www.microsanj.com Fax: +1 408 470 7539 E-­‐mail: info@microsanj.com 3287 Kifer Road, Santa Clara, California, 95051 USA 47
Session P4
Mockingbird 1
Panel 5
Chair:
Dave Altman
Co-Chair:
Patrick McCluskey
Swan 6
Ballroom
Session Q1
Mockingbird 1
Chair:
Nishi Ahuja
Co-Chair:
Yasin Makwana
Friday, May 30, 2014 (11:15 AM – 12:45 PM)
Innovative Solutions for Thermally-Limited Systems
Panelists:
Integrating Diamond Substrates for Increased Device Power Density,
Firooz Faili, Element Six Technologies
Microfluidic Channels and Vias in Chip Stacks, M. Bakir, Georgia Tech
Diamond Vias in Microelectronic Substrates, Vincent Gambin,
Northrop Grumman
Micro-Enabled Surfaces and Fluid Distribution in Substrates,
M. Ohadi, University of Maryland
Mesofabricated Microcoolers, Geoff Campbell, Science Research
Laboratory
Friday, May 30, 2014 (12:45 PM – 2:15 PM)
Organizing Committee Recognition Luncheon
Friday, May 30, 2014 (2:15 PM – 3:45 PM)
Data Center: Modeling & Control
Further Exploration of a Compact Transient Server Model
Zachary Pardey and James VanGilder, Schneider Electric
Development of an IT Equipment Lumped Capacitance Parameter Database for
Transient Data Center Simulations
Dustin Demetriou1, Hamza Erden2, H. Ezzat Khalifa2, Roger Schmidt1
1IBM, 2Syracuse University
Dynamic Models for Server Rack and CRAH in a Room Level CFD Model of a Data
Center
Sami Alkharabsheh1, Bahgat Sammakia1, Saurabh Shrivastava2, Roger Schmidt3 :
1SUNY Binghamton, 2PANDUIT Corporation, 3IBM Corporation
Real Time Thermal Management Controller for Data Center
Shu Zhang1, Tianyu Zhou1, Nishi Ahuja2, Gamal Refai-Ahmed3, Yongzhong Zhu1,
Guofeng Chen1, Zhihua Wang1, Weiwei Song1
1BAIDU System Department, 2Intel Cloud Platform Group/ Data Center Group, 3GE
Global Research
Rapid Modeling of Air Flow through Perforated Tiles in a Raised Floor Data Center
Vaibhav Arghode and Yogendra Joshi, Georgia Institute of Technology
Investigation of Exergy Destruction in CFD Modeling for a Legacy Air-Cooled Data
Center
Luis Silva-Llanca1, Alfonso Ortega1, Kamran Fouladi1, Marcelo del Valle1,
Vikneshan Sundaralingam2
1Villanova University, 2Georgia Institute of Technology
48
Friday, May 30, 2014 (2:15 PM – 3:15 PM)
Session Q2
Toucan 1
Chair:
Nachiket Raravikar
Co-Chair:
Amy Marconnet
Session Q3
Toucan 2
Chair:
Sruti Chigullapalli
Co-Chair:
Anandaroop
Bhattacharya
Graphene and CNT Thermal Characterization & Applications
Characterization of Thermal Transport in Multiwalled Carbon Nanotube Using FIB
Irradiation
Koji Takahashi and Hiroyuki Hayashi, Kyushu University
Carbon Nanotube Arrays for Coupled Electromagnetic and Thermal Management
in High Power Electronics: Influence of Microstructuration and Stress Investigated
by IR Thermography
Aline Emplit and Isabelle Huynen,
ICTEAM institute, Université catholique de Louvain
Cross Plane Thermal Conductance of Graphene-Metal Interfaces
Pablo Vasquez Guzman, Aditya Sood, Michal Mleczko, Benjamin Wang, H.S. Philip
Wong, Yoshio Nishi, Mehdi Asheghi, Kenneth E. Goodson, Stanford University
Graphene-Enhanced Phase Change Materials for Thermal Management of Battery
Packs
Pradyumna Goli and Alexander A. Balandin, University of California Riverside
Thermoelectrics
Performance Evaluation of Silicon Nanowire Arrays Based Thermoelectric
Generators
Kam Lee, David Brown, Satish Kumar, Georgia Institute of Technology
Thermoelectric Performance Model Development and Validation for a Selection
and Design Tool
Thomas Nunnally, Devin Pellicone, Nathan Van Velson, James Schmidt, Tapan
Desai, Advanced Cooling Technologies, Inc.
Cooling Heat Flux, COP, and Cost Optimization of Integrated Thermoelectric
Microcoolers with Variation of Thermoelectric Properties
Yee Rui Koh, Kazuaki Yazawa, Ali Shakouri, Purdue University
Thermal Design Analysis and Performance Test of a 1kW Thermoelectric Battery
Cooler
Seo Young Kim1, Keunhee Lee2, Sunghoon Park2, Jaehoon Kim3
1KIST, 2MISJ, Inc., 3KB Auto Tech
49
Walt Disney World Swan & Dolphin Hotel, Orlando, FL USA, May 27–30, 2014
List of Reviewers
Kayvan Abbasi
Hirokazu Abe
Yoshiyuki Abe
Tolga Acikalin
Nazmiye Acikgoz
Dereje Agonafer
Damena Agonafer
Keduse Agonafer
Francesco Agostini
Nishi Ahuja
Sandeep Ahuja
Tamanna Alam
Sami Alkharabsheh
Jonathan Allison
Kevin Anderson
Sai Ankireddi
Dion Antao
Vaibhav Arghode
Mehmet Arik
Kevin Bagnall
Vaibhav Bahadur
Supreet Bahga
Nupur Bajad
Nikhil Bajaj
Roozbeh Bakhshi
Muhannad Bakir
Karthik Balasubramanian
David Ballard
Debjyoti Banerjee
In Cheol Bang
Michael Barako
John Beatty
Jaana Behm
Kevin Bennion
Kanthi Bhamidipati
Anandaroop Bhattacharya
Sushil Bhavnani
Avijit Bhunia
Karthik Bodla
Kalpesh Bonde
Disha Bora
Huseyin Bostanci
Tom Bougher
Elah Bozorg-Grayeli
Thomas Brunschwiler
Qingjun Cai
Levi Campbell
Edvin Cetegen
Pramod Chamarthy
Satish Chaparala
Shakti Chauhan
Hongqiang Chen
Kuoming Chen
H. C. Cheng
Nusrat Chhanda
Kuo-Ning Chiang
Tz-Cheng Chiu
Junghyun Cho
Kyosung Choo
Prakriti Choudhary
Kuang-Han Chu
Baratunde Cola
David Copeland
Ayse Coskun
Bo Dan
Jeff Darabi
Milnes David
Taryn Davis
Peter deBock
Dustin Demetriou
Serguei Dessiatoun
Shankar Devasenathipathy
Satish Dhole
Jay Dirner
John Ditri
Baris Dogruoz
Thomas Dreeben
Rainer Dudek
Mahsa Ebrahim
Zack Eckblad
Feras Eid
Ryan Enright
Hamza Erden
Huiyang Fei
Jianshen Feng
Dino Ferizovic
Amy Fleischer
Parisa Foroughi
Vincent Gambin
Harish Ganapathy
Karl Geisler
Vadim Gektin
Dhruv Gelda
Joshua Gess
Nilesh Ghodke
Rajat Ghosh
Nitin Goel
Pradyumna Goli
Nam Seo Goo
Ashok Gopinath
Arun Gowda
Sam Graham
Craig Green
John Guinn
Martin Hagenbuechle
Renee Hale
Qian Han
John Hartenstine
Tomoyuki Hatakeyama
Christopher Healey
Josh Heppner
Chau Ho
Cy Ho
Marc Hodes
Ming-Che Hsieh
JS Hsu
Ron Hunadi
Mahmoud Ibrahim
Muhammed NasirInan
Richard Jaeger
Morten Jensen
CM Jha
Vibhash Jha
Hanqing Jiang
Ashutosh Joshi
Satish Kandlikar
Sukhvinder Kang
Saket Karajgikar
Sumanjeet Kaur
Roger Kempers
Vik Khanikar
Yoon Jo Kim
Philseok Kim
Joo Kim
Sungki Kim
Graham Kirk
Roy Knight
Krishna Kota
Shrenik Kothari
Peter Kottke
Jan Krajniak
Gopi Krishnan
Martin Kuball
Harshada Kulkarni
Pramod Kumar
Niru Kumari
Yi-Shao Lai
Nikhil Lakhkar
John Lawler
Jaeseon Lee
Walt Disney World Swan & Dolphin Hotel, Orlando, FL USA, May 27–30, 2014
List of Reviewers
Ted Lee
Hyungsoon Lee
CC Lee
Poh-Seng Lee
Gilbong Lee
Chang-Chun Lee
YC Lee
Guangyin Lei
Shenghui Lei
Calvin Li
Zhihua Li
Hung-Yun Lin
Srilakshmi Lingamneni
Dong Liu
Tao Liu
Kelly Lofgreen
Patrick Loney
Randall Lowe Jr
Xiaobing Luo
Jun Ma
Federica Maggioni
Nayandeep Mahanta
Neha Malu
Gary Mandrusiak
Amy Marconnet
Shalabh Maroo
Kaiser Matin
Jason Matteson
Alan Mcallister
Ali Akbar Merrikh
Karumbu Meyyappan
Nenad Miljkovic
Jeff Milkie
Rajat Mittal
Michael Mleczko
Rahima Mohammed
Eric Monier-Vinard
Sung-won Moon
Ali Moslemi
Veerendra Mulay
Mohasin Mulla
Bharathkrishnana Muralidharan
Poornima Mynampati
Kaushik Mysore
Kaustubh Nagarkar
Youngsuk Nam
Shankar Narayanan
Nadarajah Narendran
Sidy Ndao
Tung Nguyen
Chunjian (Charles) Ni
Koji Nishi
Travis North
Mark North
Susumu Ogata
Nicole Okamoto
Herman Oprins
Yi Pan
Rahul Panat
Pritish Parida
Ilchung Park
Ah-Young Park
Adam Pautsch
Stan Pecavar
Yoav Peles
Suzana Prstic
James Pryde
Shawn Putnam
Awni Qasaimeh
Weilin Qu
Xiaopeng Qu
Ram Ranjan
Nachiket Raravikar
Alexander Reeser
Roger Riehl
Frank Robinson
Brandon Rubenstein
Mayur Sabale
Mohamed M. Sabry
Mehdi Saeidi
Todd Salamon
Jaime Sanchez
Aravind Sathyanarayana
Chris Schroeder
Mark Seymour
Amip Shah
Binoy Shah
Austin Shelnutt
Saurabh Shrivastava
Dhruv Singh
Vikrant Singh
Ashish Sinha
Tuhin Sinha
Jeff Smalley
Stephen Solovitz
Zhihang Song
David Song
Michel Speetjens
Jason Stafford
Roger Stout
Jeffrey Suhling
Daming Sun
Koji Takahashi
Babak talebanpour
Abhishek Tambat
Enes Tamdogan
John Taphouse
Steve Taylor
Viktoria Temesvary
Shiwani Thakur
Joseph Thalakkottor
Naveenan Thiagarajan
Sivasubramanian
Thirugnanasambandam
Ernie Thurlow
Sandeep Tonapi
Bradley Urban
Unni Vadakkan
Aparna Vallury
Sanjay Vijayaraghavan
Alessandro Vincenzi
Zhimin Wan
Peng Wang
Scot Waye
Xiaojin Wei
Justin Weibel
Aaron Wemhoff
Weihao Weng
Jens Weyant
Ross Wilcoxon
Changyeon Won
Casey Woodrum
Mei-Ling Wu
Berhard Wunderle
Jie Xu
Luhua Xu
Naga Sivakumar Yagnamurthy
Hongfei Yan
Linlin Yang
Kaz Yazawa
Liang Yin
Seok Ho Yoon
Peter Zhang
Hongqing Zhang
Ron Zhang
Simon Zhang
Jing Zhang
Yuan Zhao
Amir Ziabari