CallforPapers
20171stElectronDevicesTechnologyandManufacturingConference(EDTM)
20171stElectronDevicesTechnology
andManufacturingConference(EDTM)
h:p://ewh.ieee.org/conf/edtm/2017
Submissiondeadline:November4th,2016
AtToyamaInternaBonalConferenceCenter,Toyama,Japan
February28thtoMarch2nd,2017
WhyEDTMhasbeenstarted:
System performance conBnues to grow, even though device scaling is saturated. Based on
strongmanufacturingtechnologies,AsiahasstrongpotenBaltotakeaniniBaBveforsystem
integraBon. Deep-dive discussions among technical communiBes on materials, processes,
anddevicesareaimedtoacceleratemanufacturinginnovaBonsthroughthisforum.
IEEEElectronDevicesTechnologyandManufacturingConference(EDTM):TheInauguralEDTM(ElectronDevices
Technology and Manufacturing) is a full three-day conference to be held at Toyama InternaHonal Conference
Center,JapanfromFebruary28thtoMarch2nd,2017,fullysponsoredbytheIEEEElectronDevicesSociety(EDS).
AssemiconductortechnologyscalingchallengesconHnuestogrow,soshouldtheindustriescollaboraHveefforts
toovercomethemmustincrease. EDTMisintendedtoserveasaforumfortheelectrondevicescommunityto
collaborateontopicsrangingfromdevices,materials,andtools,tocreatenewandinnovaHvetechnologies.EDTM
willprovidethefollowingnewformats.
SteeringCommi,ee(EDS):
SamarK.Saha
1.Technicalsessions
AlbertZ.H.Wang
EDTM2017andbeyondwillhaveastrongspecifictechnicalfocus,andthis
PaulK.L.Yu
year’s focus being on devices and process technologies for advanced
FernandoGuarin
applicaHons, IoE (Internet of Everything) and related low-power devices,
RaviM.Todi(Chair)
advanced memories, sensors, actuators, MEMS, bio.-chips, passive devices,
SubramanianIyer
andalltypesof(exploratory)devicesrelatedtoadvanceapplicaHonsandIoE. Papers/Posters on materials and processes for enabling above-menHoned LocalEDTMExCom(Japan):
devices building in heterogeneous integraHon such as 2.1, 2.5 and 3D ShujiIkeda(teisoluHons)
AkiraToriumi(Univ.ofTokyo)
structuresusingwafer-levelpackagingprocess(e.g.)areofgreatfocus.
EDTMaimsforhighestquality,andallpapersacceptedwouldbesubjectto KazunariIshimaru(Toshiba)
HitoshiWakabayashi(TokyoTech)
IEEE-EDS standard review processes and conference publishing guidelines.
SeiichiroKawamura(JST)
Accepted and presented papers will be published in EDTM proceedings. A KeijiIkeda(Toshiba)
selected number of high impact EDTM papers would be invited for the IriyaMuneta(TokyoTech.)
consideraHonofpublicaHonintheIEEEJournalofElectronDevicesSociety(J- MasaakiNiwa(TohokuUniv.)
EDS) as extended version of EDTM conference papers following the IEEE HiroAkinaga(AIST)
KenUchida(KeioUniv.)
publicaHonpolicyandJ-EDSauthor-guidelines.
ShintaroYamamichi(IBMJapan)
2.EducaBon
ü  Tutorials: We will provide both the basic and advanced programs. Basic JiroYumgami(Hitachi-Kokusai)
programwillbepresentedinlocallanguage.
Secretariat:
ü  Postersessions:Primarilyintendedforyoungengineersandstudents.The Ms.MayumiTakita
bestposterwillbeawardedintheconference.
(JTBCommunicaHonDesign,Inc.)
ü  Shortcourses:Willbringhighlevelprograms.
edtm@jtbcom.co.jp
3.ExhibiBon
GiventhestrongsemiconductormanufacturingbaseinAsia,weintendto
offer exhibits that will demonstrate products and technology. All of the
exhibitors will have an opportunity to offer technical insight and share their
knowhow.Moreover,wehopetoofferForumMakingSessiontoengageand
allowdeeperdiscussionsbetweendevice,material,andequipmentengineers
andtechnologists.
CallforPapers
20171stElectronDevicesTechnologyandManufacturingConference(EDTM)
Papersinthefollowingareasarerequested
Subcommi,eeonDevicesandManufacturingfor“CloudandEdge”
Papers are solicited in all areas of device and manufacturing enhancing cloud and edge
compuHng. High-performance devices include CMOS technology, plaform technologies, stand-alone
andembeddedmemorytechnologies,interconnects,opHcalinterconnects,compoundsemiconductors,
low-dimensionalsystemsincluding2Dmaterials,nanowires,nanotubes,andquantumdots,3D-IC.The
devices for edge compuHng correspond to ultra-low power devices, energy harvester, RF devices,
sensors, sensor networks, display, and actuators, MEMS, power devices, flexible and stretchable
electronics,printedelectronics,organicandinorganicdisplays.
Papers are also solicited on the manufacturing issues on process control, manufacturability, yield
improvements,andfailureanalysisandrelatedconsideraHons.
Subcommi,eeonPackagingandManufacturingfor“CloudandEdge”
Papers are solicited in all areas of advanced packaging and package-related manufacturing
technologies for both cloud and edge applicaHons of IoT. Especially, heterogeneous integraHon
technologies;suchas2.1D,2.5Dand3DintegraHons,wafer-levelpackagingandpanel-levelpackaging
are strongly encouraged. Breakthrough technologies in ultra-fine-pitch interconnecHon, sub-micron
package-levelwiring,opHcal/wirelessinterconnect,power/sensordevicepackaging,controlinthermalexpansioncoefficientandthermalmanagementarealsorecommended.Packagedesignmethodology
and technique for miniaturizaHon of IoT edge sub-systems, and the manufacturability of all the
technologies above are of course interested. Emerging topics, such as bio-compaHble package,
neuromorphicinterconnecHon,andflexible/bendablepackageareverymuchwelcome.
Subcommi,eeonProcess,Tools,andManufacturing
Papers are solicited in all areas of process, tools, and manufacturing systems with novel sensing
technologiesandarHficial-intelligenceanddeep-learningalgorithms.Processandequipmentincluding
process module, process integraHon and process control, and equipment that improve device
performance, reliability, yield or enabling new product are also solicited. The topics are substrates,
isolaHontechnologies,integraHonofheterogeneouschannelmaterials,dielectricsandmetalelectrodes
forgatestacksandMIMcapacitors,shallowjuncHons,andsilicides,lowdielectricconstantmaterials,
contactandviaprocesses,mulH-pajerningandEUVlithography,self-assemblytechniques,deposiHon
techniquesincludeCVD,ALDandPVD,dryandwetetchtechniques,cleaning,planarizaHon,integraHon
process for sensors, MEMS, RF devices, and photonics electronics, and process and tool design or
processcontroltechniquestoreducevariaHonorimprovereliabilityoryield.
Subcommi,eeonMaterials
Papers are solicited in all areas of materials to achieve the higher performance and
manufacturability. Materials for the deposiHon of films of semiconductor, magneHcs, ferroelectrics,
insulators,metals,liquidcrystalsarehighlywelcome.Andtoachievetheirstructures,theresist,organic
films, etching gas, and CMP materials and their chemical materials, gas chemistries, wafers, filament,
phase change memory materials, cost down, reliability, high yield, manufacturability are also in our
scope. InnovaHve materials for sensor and actuator achieving cloud and edge compuHng are highly
welcome.
Subcommi,eeonReliability&Modeling
Papers are solicited in all areas of numerical, analyHcal (including compact/SPICE) and staHsHcal
modeling and simulaHon of electronic, opHcal or hybrid devices, their interconnect, and 2D / 3D
integraHon; in context of materials, fabricaHon processes, and devices, e.g. advanced physical
phenomena (quantum mechanical and non-staHonary transport phenomena, ballisHc transport);
Mechanicalorelectro-thermalmodelingandsimulaHon;Teststructuresandmethodologies;Front-end
and back-end manufacturing processes; 3D integraHon and wafer-level packaging; Reliability of
materials, processes, and devices; Advanced interconnects; ESD, latch-up, sol errors, noise and
mismatchbehavior,hotcarriereffects,biastemperatureinstabiliHes,andEMI;Defectmonitoringand
control;Manufacturingyieldmodeling,DFM,analysisandtesHng.