CMOS VCO`s For PLL Frequency Synthesis In GHz Digital Mobile

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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
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CMOS VCO’s for PLL Frequency Synthesis in
GHz Digital Mobile Radio Communications
Manop Thamsirianunt and Tadeusz A. Kwasniewski, Member, IEEE
Abstract— CMOS inductorless voltage controlled oscillator
(VCO) design is discussed with the emphasis on low-noise,
low-power, gigahertz-range circuits suitable for portable wireless
equipment. The paper considers three VCO structures—one
simple ring oscillator and two differential circuits. The design
methodology followed optimization for high-speed and low-power
consumption. The proposed linearized MOSFET model allows
the accurate prediction of the operating frequency while the
phase noise evaluation technique makes it possible to determine,
through simulation, the relative phase-noise performance of
different oscillator architectures. The measurement results of
three VCO’s implemented in 1.2-m CMOS technology confirm
with the simulation predictions. The prototype VCO’s exhibits
926-MHz operation with 083 dBc/Hz phase noise (@ 100 kHz
carrier offset) and 5 mW (5 V) power consumption.
Index Terms—CMOS oscillator, ECO, emitter coupled oscillator, linearized MOSFET model, multivibrator, phase locked loop,
phase noise simulation, PLL frequency synthesizer, relaxation
oscillator, ring oscillator, VCO, voltage controlled oscillator.
I. INTRODUCTION
T
HE rapid growth in the use of digital mobile communicators and wireless portable telephones (digital wireless)
has been met through steady reductions in cost, size, and
power consumption. For the terminal manufacturers to remain
competitive, terminal design remains a very challenging task
driven by consumer-market demands. The key technology
issues to be addressed relate to minimum complexity architecture, low power, and maximum use of very large scale
integration (VLSI). Currently, the implementation of digital
wireless components is of a strong research interest. Both
CMOS and BiCMOS implementation paths are considered.
Many of the recently reported implementations of frequency
synthesizers use a mixture of high-speed semiconductor technologies, as shown in Fig. 1. To date, the voltage-controlled
oscillator (VCO) and the dual-modulus prescaler are implemented in either bipolar or GaAs MESFET technologies, while
most of the low-frequency digital circuits are implemented
in CMOS technology. Although several CMOS frequency
dividers have been recently reported which exhibit operating
frequencies to a few gigahertz [1]–[3], there has been no report
to date on the use of on-chip GHz-range CMOS VCO’s in
wireless applications. Such conflicting mix of high and low
frequency technologies inhibits the realization of a complete
circuit integration and raises the component cost.
Manuscript received June 21, 1994; revised April 28, 1997.
M. Thamsirianunt is with Exar Corporation, Fremont, CA 94538 USA.
T. A. Kwasniewski is with the Department of Electronics, Carleton University, Ottawa, ON, K1S 5B6, Canada.
Publisher Item Identifier S 0018-9200(97)06317-8.
The availability of the submicron MOS process has resulted
in speeds of MOS phase-locked loops (PLL’s) that have
significantly increased compared with PLL’s of the past.
Recent papers indicate the potential for NMOS oscillators
that operate to GHz frequencies [4], [5]. The challenge then
is to develop CMOS analog-type circuits for high frequency
applications.
It is the objective of this work to demonstrate that a
gigahertz frequency range and milliwatt power consumption of
a monolithic CMOS VCO with good phase noise performance
can be achieved. Several novel high-frequency CMOS VCO
architectures are presented which have good potential to meet
the demand for low-cost fully integrated RF circuitry. When
used as components in PLL frequency synthesizers, these
CMOS VCO’s offer phase noise performance comparable to
known bipolar on-chip VCO designs [6]–[8]. A preliminary
ac MOS model for CMOS VCO was developed together with
the phase noise simulation technique for characterization of the
proposed VCO’s. The techniques have shown high correlation
between the simulation and the phase noise measurement of
the prototype VCO’s. Both techniques allow more accurate
VCO performance prediction and architecture comparison.
In comparison to other silicon bipolar on-chip VCO designs
in the past, the three implemented CMOS VCO architectures
are based on the operation of circuit parasitic capacitors. With
layout techniques, one of the VCO’s delivers phase noise level
better than 83 dBc/Hz at 100-kHz carrier offset. The VCO
designed with a fully differential architecture has phase noise
better than 114 dBc/Hz at 1-MHz offset from the carrier,
demonstrating performance comparable to those achieved with
LC on-chip Si bipolar designs [6].
Section II reviews important performance parameters of
VCO’s and their architecture comparison and describes an
analysis of timing jitter or phase noise of a parasitic-only
CMOS oscillator. Section III illustrates the three proposed
VCO architectures and their design techniques. The ac MOSFET model for use in CMOS VCO’s circuit simulation is
presented in Section IV with an evaluation of the proposed
model accuracy and phase noise simulation techniques. Finally, the experimental results and summary are presented in
Sections V and VI, respectively.
II. DESIGN
OF
MONOLITHIC VCO’S
A. Key Parameters
General requirements for a high-quality VCO include high
spectral purity, linear voltage-to-frequency transfer character-
0018–9200/97$10.00  1997 IEEE
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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Fig. 1. Typical building blocks for a modern RF PLL frequency synthesizer.
istic, and good frequency stability to power supply and temperature variation. However, for digital wireless, the VCO must
also have very low power consumption and low fabrication
cost as well. While high linearity and wide tuning range may
be necessary in some applications, in wireless communications
where bandwidths are limited to a few tens of megahertz,
tuning range and linearity do not present a problem. Longterm frequency stability as a function of temperature is less
problematic if the rate of change of frequency drift is within
the PLL bandwidth. The feedback action of the PLL suppresses
the frequency error with a magnitude that is a direct function of
the open loop gain. In effect, the significant VCO properties
that must be considered are spectral purity, high operating
frequencies while maintaining low power consumption, and
suitability for circuit integration.
V
B. High-Speed, Low-Noise VCO’s
A monolithic oscillator can be realized using i) a tuned
oscillator whose frequency is determined by reactive elements,
or ii) a relaxation oscillator, also called a multivibrator, which
operates by alternately charging and discharging an energy
storage element (usually a capacitor) between two initially
set threshold voltage levels. Most low phase-noise oscillators
often employ LC tank or resonant elements off chip due to
the difficulty in controlling process variations which can lead
to long-term frequency drift. Although current research has
shown possibilities of implementing on-chip LC VCO’s, the
achievable
values remain low (about five) [6]. Moreover,
the inductors built on silicon occupy a substantially larger area
compared to other on-chip VCO designs.
In contrast to LC VCO’s, a relaxation oscillators can be
an emitter coupled oscillator (ECO) as shown in Fig. 2(a), or
a simple ring oscillator in Fig. 2(b). Since relaxation VCO’s
do not require any external components for oscillation, they
are now becoming preferable in most high-frequency fully
integrated PLL circuits. However, due to the absence of high
passive component(s) in relaxation VCO’s, their free running
spectral purity is inferior. The relaxation VCO architectures
must have some forms of compensation, or use some special
techniques, to accommodate the wide tuning range [7].
(a)
(b)
Fig. 2. Multivibrator oscillators: (a) emitter coupled multivibrator and (b)
ring oscillator.
C. Comparison of Bipolar ECO’s and
MOS Relaxation Oscillators
So far, the emitter coupled multivibrator shown Fig. 2(a)
is the favored structure for high-speed PLL circuits. It is
known to have good temperature stability and operates at high
frequencies. Several papers including the ones by Sneep and
Verhoeven [7], Abidi and Meyer [11], and Martin [12] have
shown phase noise analyzes of relaxation oscillators based
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
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(a)
(b)
(c)
Fig. 3. Ring oscillator based on MOS inverter ring structure. (a) Ring oscillator and RC basic relaxation oscillator configuration, (b) generalized circuit
for noise analysis, and (c) CMOS inverter with its parasitic and equivalent circuit for an integrator.
upon ECO structures. These papers suggested techniques to
improve the phase noise performance. However, their analyzes
pointed out one common inherent drawback of the ECO’s—the
phase noise is inversely proportional to the tail current that
is used to charge and discharge the timing capacitor [see
, where
is the equivalent
Fig. 2(a)]. The product of
thermal noise resistance of the current source , indicates the
power consumption of the oscillator. In order to achieve a good
phase noise performance, a certain minimum power consumption in the current sources is unavoidable. Consequently, the
lower phase noise ECO’s are only achieved by maintaining
high current levels which are undesirable in our design goal.
As a result, a relaxation ring oscillator based on the construction of all MOS devices as opposed to an ECO structure
will be analyzed. The oscillation mechanism of a ring oscillator can be modeled as a basic RC relaxation oscillator,
as illustrated in Fig. 3(a) [9]. Each inverter in this ring can
be modeled as a Schmitt trigger and its associated timing
, and , that form the oscillator. Inverter
components
, and
that
ring oscillators consist of timing elements
can be circuit parasitics, and therefore result in a frequency
of oscillation that can be maximized in a given technology.
Although we appreciate the complexity of other VCO’s phase
noise predictions (such work has been reported by others),
we would like to present a simplified analysis which, in our
opinion, helps us gain an insight into the phase noise/circuit
parameters dependency. We begin by replacing the inverter
cell with a voltage comparator as modeled by a Schmitt
trigger as shown in Fig. 3(b). We postulate that at frequencies
considered, each inverter cell in fact is a transconductance
amplifier with its own circuit parasitics. From Fig. 3(b), the
period of the oscillation
is
(1)
At the threshold crossing point, the capacitor-charging current,
, can be expressed as
The random
fluctuation of
, where
is the threshold voltage of
or
the inverter, induces corresponding fluctuations in
(2)
Assuming all inverter stages are identical and operate in the
are functions of the device’s
saturation region, both and
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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
(a)
(a)
(b)
Fig. 5. VCO2 modified D-latch ring oscillator. (a) Proposed new D-latch for
VCO2 and (b) VCO2 pseudo-three-stage ring oscillator.
obtains
(5)
Equation (4) can now be rewritten as
(b)
Fig. 4. VCO1 simplified three-stage modified ring oscillator. (a) VCO1
three-stage ring oscillator and (b) short-channel effect in the MOSFET
saturation mode.
can be represented by
and
or
where
are all constant
coefficients, thus the phase noise in terms of fluctuations in
time , as a function of threshold voltage variation, may be
rewritten as
(6)
Because the oscillating frequency is proportional to the
frequency of each inverter, i.e.,
, therefore
geometries,
(3)
or
(4)
From (3) it can be seen that the timing jitter dependence on
threshold variation decreases with both device’s length ( ) and
device’s width ( ). Although the assumption was made that
does not depend on
, the above analysis can give some
insights into the power supply and substrate noise coupling
effects. Let us now consider the
dependence on
. One
(7)
to
The phase noise is defined as a ratio of
), therefore it can be shown that for a maximumspeed VCO scaling process, where
ratios remain constant, the phase noise sensitivity actually does not depend on
.
The rms voltage amplitudes of the input referred noise in
CMOS devices (in saturation mode) also depend on device
sizes. The thermal noise
is proportional to
while
or flicker noise is proportional to
. Scaling
the
and maintaining
constant) of
down (by decreasing
a design does not change the phase noise contributed by
the MOS device thermal noise. On the other hand, for a
given MOS technology, the designs that operate at frequencies
lower than the maximum, however, the phase noise due to
the thermal noise will be smaller (also true when power and
ratio increase). The flicker noise contribution might,
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
(a)
1515
(b)
(c)
Fig. 6. VCO3 (a) fully differential oscillator using double flip-flops, (b) the implemented circuit, and (c) redrawn with differential ring structure and
regenerative circuits.
(a)
(b)
Fig. 7. HSPICE equivalent circuit MOSFET. (a) Transient analysis and (b) ac analysis.
however, increase unless the gate capacitance value is kept
constant or larger. The same feature size CMOS processes
noise because of their
can experience differences in the
process variations. This factor could play a more important
noise contribution than the effect of
role in evaluating the
], hence the actual flicker noise amplitude
gate area [
could become a dominant factor in determining the VCO phase
noise performance.
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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Fig. 8. A proposed linear ac model for MOS devices in oscillator circuits.
(a)
(b)
Fig. 9. (a) Basic block diagram for representation of VCO in frequency
domain, and (b) model of an injected noise current for actual analysis in
oscillator circuit (Vn
noise input voltage).
(a)
=
The analysis above indicates a potential advantage of MOS
relaxation oscillators over classical bipolar multivibrators,
especially for a MOS relaxation oscillator structure that employs circuit parasitics. Parasitic MOS oscillator structures
allow greater circuit integration and lower power consumption.
However, the maximum oscillation frequency is related to
device speed and device sizing, and therefore parasitic-only
MOS oscillators have to be optimized for speed through
architecture and layout techniques.
D.
of CMOS Relaxation Oscillators
The multivibrator has only one energy storage element, i.e.,
a capacitor which by its nature results in a low- oscillator. In
comparison to LC VCO’s, the equivalent of a multivibrator
is 1/4 [13].
One of the primary design goals in the CMOS VCO design
was to obtain a high
factor without the use of LC tank
circuits. The use of inverter integrators in a ring oscillator can
provide higher equivalent
than for a regular single stage
relaxation oscillator. Section IV presents an approach which,
by replacing the nonlinear delay stages with a linear models,
allows prediction of the oscillating frequency of a CMOS
VCO.
(b)
Fig. 10. Circuit used and frequency response for VCO1 (Input amplitude
10 A).
In
=
III. HIGH-SPEED, LOW-POWER CMOS OSCILLATOR DESIGN
A number of circuit techniques have been recently reported
to improve the frequency stability and linearity of inductorless CMOS oscillators. For example, a VCO with improved
linearity and jitter improvement was reported by Wakayama
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
Fig. 11.
Fig. 12.
VCO1 frequency response of the altered inverter 1 device sizes (Input amplitude In
Simplified simulation setup for phase noise prediction technique.
[14], while a CMOS VCO with temperature compensation
was reported by Flynn [15]. These techniques demonstrate
that CMOS oscillators are good prospects for achieving performance comparable to Si bipolar oscillators. Although the
use of external circuits has been shown to result in improved
oscillator characteristics, it has been at the expense of increased power consumption and decreased operating speed.
Therefore, the speed of the CMOS oscillator has been to
date the limiting factor that restricts its use to only low-tomid-frequency applications. The development of techniques
to improve speed while maintaining low power is therefore
the major challenge in a CMOS oscillator design.
A. Design Guidelines
Placing the highest priority on speed implies that the CMOS
oscillator must be constructed using the simplest structures,
such as an odd-number inverter ring oscillator based upon
an RC relaxation oscillator, as described in Section II. To
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= 10 A).
obtain high speed performance and low power the VCO design
methodology follows the guidelines below.
• Minimize all parasitics by using the circuits with minimum complexity.
• Choose those architectures which enable circuits to operate at maximum speed.
• Utilize unavoidable parasitics; no external reactive elements.
To improve noise performance, the following techniques are
also incorporated.
• Employ a switching waveform with sharpest rising and
falling edge [11].
• Balance timing of the waveform for a 50% duty cycle
[16].
• Minimize the number of stages for the ring oscillator [12].
• Use a symmetrical layout design [4].
B. Proposed VCO Circuits
1) VCO1—Modified Ring Oscillator: The oscillator of
Fig. 4(a) shows a simplified version of the proposed threestage ring oscillator employing a single-inverter delay cell.
The frequency control is achieved by directly controlling the
current through a series transistor of one inverter stage. The
two remaining inverters are connected to form a closed-loop
ring. The circuit contains the least number of components
required for a functional relaxation oscillator.
The unique frequency control mechanism of the oscillator
exploits short-channel effect of the controlling transistor to
control the overall circuit delay. This scheme adopts a gradual
monotonic increase in the current of transistor
around
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Fig. 13.
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Simulated VCO spectra demonstrating phase noise correlations.
the saturation region for a linear voltage to frequency control.
Most mobile radio frequency bands are limited to a few tens
of megahertz, therefore the operation of the VCO along the
boundary of the saturated delay cell can be utilized.
2) VCO2—Modified D-Latch Ring Oscillator: Using the
self-oscillating behavior of the D-latch circuit in [2] [see
Fig. 5(a)], it is possible to realize a high-frequency oscillator.
The arrangement needed to construct this type of oscillator is
shown in Fig. 5(b), where a cross-coupled D-latch is combined
with two loop inverter rings.
and
are used in this configuration to replace two
complete inverters resulting in a pseudo-three-stage differential
ring oscillator structure. Because the D-latch is a sequential
input [shown in the schematic of
circuit, when the
] is held high (logic 1) state transition occurs,
Fig. 5(b) as
enabling the rings to start oscillation. The dc level of
should be held higher than the CMOS threshold level (
)
is inversely
in order to start the oscillation. The dc level of
and
, hence
proportional to the channel resistance of
the transition time in the latch or frequency of oscillation can
.
be changed by varying the
3) VCO3—Fully Differential Ring Oscillator: As indicated
in Section II, the standard emitter-coupled multivibrator design
has conflicting design rules which dictate that the oscilla-
tor consume high power in order to reduce phase noise.
However, this standard approach has been modified to accommodate MOS implementations [4]. NMOS versions of this
emitter-coupled-like oscillator, fabricated in a 0.75- m-NMOS
process, show the use of grounded parasitic timing capacitors.
A wide tuning range and maximum oscillating frequency of
1 GHz was achieved. A CMOS version of this architecture was
explored and suggested but no details relating to the analysis
nor implementation were given.
Fig. 6 shows our proposed structure for a CMOS implementation. The oscillator was constructed using a constant currentcharge-discharge scheme. The latching operation which alternates the state of two current controlled inverters was
achieved by the use of NOR double flip-flops. To understand
the operation of the architecture, NOR flip-flops are broken
down to a simple inverter level by viewing the structure as
a two-loop differential ring oscillator, as shown in Fig. 6(b).
It is clear that the rings are formed by common three-stage
ring oscillators.
To appreciate the presence of the differential ring configuration in the VCO, Fig. 6(b) has been redrawn to Fig. 6(c). The
fully differential inverter rings were formed using two crosscoupled five-stage ring oscillators via regenerative inverter
latches. Regenerative circuits are known for their potential for
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
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speed improvement. In this aspect it also reduces the switching
inconsistency of the ramp waveform across the parasitic timing
capacitors in a relaxation oscillator.
Although this VCO design is based on a proposed architecture found in the literature [4], significant optimization effort
was required to achieve the desired low noise and maximum
oscillating frequency. A simplified schematic of the complete
VCO is shown in Fig. 6(b).
C. VCO Implementation and Circuit/Layout Optimization
This section describes the implementation issues of the
proposed VCO’s presented in the previous section. The VCO
circuits were optimized in both schematic and layout level
prior to fabrication. Simulations and optimizations of the
preliminary design for all three VCO’s were carried out
at the schematic level using transient analysis to find the
maximum possible oscillating frequency. Simulations showed
that optimized circuits and device sizing had to be made
through an iterative process due to the dynamic interaction
between the loop ring component. The circuits were laid
out using a 1.2- m double-poly double-metal N-well CMOS
technology. The layout was custom designed and reoptimized
to achieve symmetrical waveform and the largest swings
throughout the circuits. The layout of VCO1, VCO2, and
VCO3 circuits including buffer circuits have active areas of
84 m
50 m, 142 m
58 m, and 127 m 76 m,
respectively.
IV. FREQUENCY DOMAIN ANALYSIS OF A CMOS VCO USING
THE DEVELOPED MOS MODEL AND PHASE NOISE SIMULATION
A. Proposed MOS Model for AC Analysis
The traditional approach to the design of relaxation-based
oscillators depends solely on the time domain analysis.
Section II refers to some of the existing analytical methods.
The CMOS GHz-range oscillator design issue should,
however, address the fact that speeds at which the circuits
operate result in a switching behavior far from what is called
a digital switching. Specifically, one observes continuously
changing node voltages. The high/low states, if reached, occur
for only a short period of time. In fact, the waveforms closely
resemble sinusoidal shapes.
Considering also the fact that the class of circuits of interest,
namely ring oscillators, exhibits the positive feedback, it is
more accurate and meaningful if the analysis is linearized
and performed in the frequency domain. The problem can
be classified as a large signal frequency domain analysis.
Consider the SPICE ac model of the MOSFET transistor
shown in Fig. 7(b) [17]. The model components depend on the
transistor biasing point. This model, when used for ac analysis,
requires a fixed biasing voltage and does not hold for large
signal analysis. Following the approach used in the nonlinear
circuit analysis [18] and microwave circuit analysis [19], we
investigated the possibility of replacing the full nonlinear
model by a simplified linear model of Fig. 8.
The model linearization was obtained by taking average
values of MOSFET parameters with reasonable assumptions
for the operating point of MOS transistors. Since
is a
Fig. 14. VCO voltage-to-frequency transfer characteristic curves.
parameter that is a function of biasing voltage, maximum
results at
equal to 5 V for NMOS and 5 V for PMOS
(assuming the full swing of the CMOS inverter). The model
was linearized by removing the diodes, as shown in Fig. 7(a).
An acceptable approximation was achieved through several
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Fig. 15.
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Spectra traces of VCO’s outputs at 1 kHz resolution bandwidth and the waveforms.
simulation trials by setting the operating point for ac analysis
at midpoint, i.e.,
equal to 2.5 and 2.5 V for NMOS and
PMOS transistors, respectively. At these voltages, it is certain
that both transistors are fully on, resulting in approximated
linear values for elements
, and
.
Some of the elements shown in Fig. 8 are bias dependent,
and
are a function of the device operating
while
state (on, switching, off). The worst case linearized value [20]
which leads to a conservative result (high side capacitance)
.
estimates
Fig. 9(a) shows a linearized feedback system with the
) transfer
disturbance ( ) to the input ( ). The output (
function can be expressed by
(8)
The stability analysis can be performed with frequency
domain simulation for which we propose to use the model
shown in Fig. 9(b). The capacitor
is the actual circuit
capacitance at an arbitrarily selected node of the oscillator.
is the sum of a voltage developed
Note that the voltage
by injecting the current
and the voltage present on
on
in absence of . It is of interest to note that the transfer
function results in the node output impedance—a parameter
used in the microwave circuit analysis.
B. Validation of the Proposed AC MOS
Model Through Simulation
To establish the validity of the proposed model, ac SPICE
as input and
simulation was conducted using injected noise
the node voltage as output
. The VCO1 circuit was used
as an experimental prototype for developing the linearized ac
model parameters.
The model development procedure can be described as
follows. After the fixed bias parameters of each MOS device were obtained from the SPICE transient analysis output
(
, and
), they were recalculated and used
in the linearized ac MOS model. The linearized MOS models
are then encapsulated in subcircuits and used to replace all
existing MOS transistors.
The ac analysis simulation results (Fig. 10) with the developed linearized MOS model indicated a peak frequency of
760.32 MHz as compared with 759.90 MHz that was obtained
by the transient analysis (SPICE Model). To verify the accuracy of the developed model, different device sizes were simulated. The inverter 1 layout of the VCO1 circuit was changed,
with both the n and p MOS six times larger than those of the
original circuit. The extracted layout simulation was then performed, and the transient analysis indicated an oscillating frequency of 673.40 MHz or 88.61% of the original circuit. New
device parameters extracted from SPICE were then used to replace the ac MOS model parameters for ac simulation. The ac
response of the oscillator produced a peak frequency of 701.45
MHz or 92.20% of original circuit, as illustrated in Fig. 11.
The VCO2 and VCO3 were also verified with the linearized
model. The simulated oscillating frequency results in ac analysis were also in close agreement with those of their transient
analyzes. The results indicate that the proposed linearized
model can indeed be used to predict the oscillating frequency.
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
(a)
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noise source used here was 100-mV sinusoidal signal at
1-MHz offset from the oscillator’s center frequency. The
SPICE transient analysis output was processed to obtain the
corresponding power spectrum.
In order to obtain comparable results, each VCO was
simulated under the same conditions. These include the oscillating frequency, sampling frequency, simulation step size,
and number of points in the power spectrum density (PSD)
analysis. However, since VCO3 has a maximum oscillating
frequency of 520 MHz, a less extreme oscillating frequency
for VCO3 of 500 MHz was chosen instead.
Fig. 13 shows the resulting PSD’s for the three oscillators.
It is worth noting that the PSD’s do not indicate the absolute
phase noise figures due to the nonlinear behavior of the CMOS
oscillator which extricates the analysis of absolute system
noise gain. The topic of phase noise modeling in a CMOS
ring oscillator is of our great research interest. Even some
commercially available phase noise simulation programs to
date still require calibration against the actual measurement.
Therefore, the proposed simulation is intended only to compare
and correlate the phase noise results among the implemented
VCO’s. The top plots are the PSD’s of the VCO’s in free
running condition. The bottom plots show the PSD’s after
the noise was superimposed on the power supply. It can
be interpreted from the power spectra that each VCO has
a different degree of sensitivity to power supply noise. The
VCO1 spectrum shows the widest area of modulation around
its center frequency, while VCO2 exhibits less susceptibility
to noise. Finally, VCO3 demonstrates the best noise rejection
among the three VCO’s.
V. EXPERIMENTAL RESULTS AND DISCUSSIONS
A. VCO’s Performance
(b)
Fig. 16. (a) Power dissipation as a function of oscillating frequency and (b)
frequency of oscillation as a function of supply voltage.
C. Phase Noise Simulation
A phase noise analysis of an oscillator can be achieved
by adapting the method outlined by Sneep and Verhoeven
[7]. Although this method gives fairly accurate phase noise
predictions for the oscillator circuits that use a physical timing
capacitor, it is expected that parasitic capacitors present in
the high-speed VCO designs would complicate the theoretical
analyzes. As a result, the conventional phase noise analysis and
noise source modeling for the types of our proposed VCO’s
may not be the most pragmatic method for prediction.
The simplicity of the phase noise simulation technique
proposed here comes from the fact that a spectrally pure
VCO (high- oscillator) will reject noise regardless of its
origin [21]. As a result, we can verify the phase noise of
an oscillator by determining the noise rejection ratio from the
oscillator output power spectrum. Fig. 12 shows the simplified
simulation setup for the technique proposed. The modulated
The VCO tuning range, power consumption, phase noise
response, and the effect of power supply variation were
measured and compared with simulation results. The plots of
the voltage-frequency transfer characteristics (or VCO tuning range) of the three VCO’s are shown in Fig. 14. For
comparison, the simulation results for each VCO are also
included (dotted line). The VCO1, VCO2, and VCO3 minimum–maximum oscillating frequency measured at 320–926,
225–600, and 100–500 MHz, respectively. The VCO spectrum
outputs and waveforms are shown in Fig. 15.
Fig. 16(a) shows the VCO’s power consumption. The top
and middle curves, the power consumed by VCO3 and VCO2,
show that the dissipated power is a linear function of frequency. VCO2 and VCO3 dissipate a maximum power of 14
and 20.2 mW, respectively. Test results of VCO1 showed
that the fabricated chip delivered 16% higher speed than
the results obtained from simulation. The VCO1’s maximum
power dissipation measured at 9.4 mW. However, if the power
dissipated by pad capacitance and buffer (3.92 mW, at 820
MHz) are excluded, then the core circuit would consume only
5 mW of power. It should be noted that the devices do not drive
50- impedance because the design intent is to fully integrate
the VCO into a PLL system in contrast to a discrete device
implementation which mandates all 50- interfaces. Electro-
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1522
Fig. 17.
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Measured VCO1, VCO2, VCO3 residue FM/SSB phase noise using HP3804A.
magnetic interference (EMI) and radiation are also minimized
because of shorter on-chip interconnects. The VCO’s were
also measured for their oscillation frequencies as a function
of supply voltage ( ) as shown in Fig. 16(b). Note here that
the VCO1 has the highest sensitivity to power supply noise
because the structure is single-ended. It is necessary to include
on-chip supply decoupling capacitors.
Measurement of phase noise was done by placing the
oscillator in a PLL phase noise measurement system. All
measurements were performed through bonded IC’s, packaged
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THAMSIRIANUNT AND KWASNIEWSKI: CMOS VCO’S FOR PLL FREQUENCY SYNTHESIS
Fig. 18.
1523
Test setup for verification of phase noise prediction technique.
with a standard ceramic 68-pin PGA type. Although onchip buffer circuits were used to condition the output signal
from the core circuits, a substantial level of attenuation of
the oscillator output was unavoidable due to the effect of
huge bonding pad capacitance and package parasitics. The
oscillator’s output was amplified by a high-input-impedance
amplifier before connecting to the 50- measurement system.
VCO1, VCO2, and VCO3 phase noise were measured at
their highest oscillating frequencies and plotted on the top,
middle, and bottom charts of Fig. 17, respectively. The phase
noise at 100 kHz offset from carrier frequencies shows that
VCO1 had the highest noise levels at 83 dBc/Hz, followed
by VCO2 at 87 dBc/Hz. VCO3 delivered the lowest phase
noise response among the three, at 90 dBc/Hz. Note that
the phase noise measurements obtained from the test setup
were predicted to be worse than the actual values due to the
additional amplifier and interconnections.
B. Measurement of Spectral Purity in the
Presence of Power Supply Noise
Verification of the phase noise prediction technique in
Section IV-C was performed using the configuration depicted
in Fig. 18. The test bed consisted of the VCO circuit board,
a bias tee circuit, and other necessary measuring equipment.
The VCO’s source supply ( ) was ac modulated through the
bias tee circuit, while the VCO tuning input was driven by a
clean dc source. A voltage divider across the terminals of dry
battery cells allowed adjustment of dc voltage.
A single tone sinewave signal of 13 mV at 10 kHz,
100 kHz, and 1 MHz was added to the 5-V dc regulated
supply for testing. Fig. 19 shows the output spectra of the three
VCO circuits with 100-kHz signal modulation. The observed
spectra exhibit unavoidable amplitude modulation effect, the
side bands at 100 kHz offset from the center frequency
because the VCO output buffer did not use a dedicated
power supply. The noise rejection capability of the three
circuits is not as pronounced as in the simulation (Section IIIB). The simulation results show that VCO3 had the highest
noise rejection capability followed by VCO2 and VCO1. The
measured results also follow the order of noise rejection
capability. One should also consider that the measurement
results include all the noise sources in the physical circuit.
Their effect will mask the spread of the center frequency peak
which is due to the added sinusoidal noise source.
Fig. 19. Measured VCO spectral output before and after adding power
supply noise.
TABLE I
MEASUREMENT RESULTS: SUMMARIZED PERFORMANCE FROM
THE VCO DESIGN, * INCLUDING THE OUTPUT BUFFER
CIRCUIT, PAD, AND PACKAGE CAPACITANCE ( 2.77 PF)
Table I summarizes the measured performance parameters
of the three VCO’s and the photomicrograph of the chip is
shown in Fig. 20.
VI. CONCLUSION
Three high-speed CMOS VCO’s were presented which
simultaneously achieve high operating frequency and good
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1524
Fig. 20.
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 10, OCTOBER 1997
Die photomicrograph.
phase noise through the use of several innovative architectural and circuit design techniques. These circuits, through
simulation and measurement, demonstrated performance and
speed in a gigahertz range which to date has not been realized
in a conventional CMOS process. The maximum oscillating
frequency and phase noise results were superior to any previously reported CMOS VCO’s. As well, the power consumption
was lower than that of any VCO’s previously reported in
compatible technologies. The proposed VCO’s required no external components yet exhibited good phase noise performance
comparable to LC on-chip oscillators facilitated using a high
level of integration.
The authors are currently working on the evaluation of
a complete fractional-N synthesizer [23]. Such a synthesizer
might exhibit power consumption below 10 mW, one gigahertz
maximum operating frequency, and be suitable for use in the
personal communication devices.
ACKNOWLEDGMENT
The authors are grateful for the assistance of Canadian
Microelectronics Corporation (CMC) for fabrication support.
Also, the support of the Canadian International Development
Agency (CIDA), the Telecommunication Research Institute of
Ontario (TRIO), and Micronet are gratefully acknowledged.
The authors are indebted to the members of Carleton’s VLSI
for Telecommunication Research Group, T. Kenny and Dr. M.
Copeland for their support of this work, and M. Abou-Seido
for his contribution to the AC model development.
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Manop Thamsirianunt received the B.E. degree
in electronics from King Mongkut’s Institute of
Technology (KMITL), Thailand, in 1988 and the
M.E. degree in electronics from Carleton University,
Ottawa, Canada, in 1993.
Since 1993, he has been working in the area of integrated circuit design for communications. His research interests include PLL’s, clock recovery, and
low-power/high-speed analog circuit techniques. He
is now with the Communications Department at
EXAR Corporation, Fremont, CA, where he designs
mixed-signal chips for network and transmission interfaces.
Tadeusz A. Kwasniewski (M’86) obtained the
Ph.D. and M.S. degrees from the Institute of Nuclear
Research and Warsaw University of Technology,
Poland, in 1974 and 1980, respectively.
He worked as a Research and Development
Engineer in the Warsaw Institute of Nuclear
Research and VOEST Alpine in Austria. In 1983, he
joined Lakehead University and in 1985, Carleton
University, Ottawa, Canada. His research interests
include CMOS radio circuits and signal processing
architectures.
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