Product End-of-Life Disassembly Instr uctions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP LD4700 47-inch Widescreen LCD Digital Signage Display Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 square cm 6 Batteries All types including standard alkaline and lithium coin or button style batteries 3 Mercury containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries 18 Liquid Crystal Displays (LCD) with a surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1 Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB / PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height 15 External electrical cables and cords 2 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants 0 Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Include the cartridges, print heads, tubes, vent chambers, and service stations. 0 0 Components, parts and materials containing refractory ceramic fibers EL-MF877-00 Template Revision A Page 1 Components, parts and materials containing radioactive substances 0 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) screw driver #2 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1 2 3 4 Unlock 10 screws to separate back cover assembly from cabinet assembly. [Fig.1] Separate back cover control connector from speaker PCB P2. [Fig.2] Detach tapes on harnesses and separate harnesses from module “A” , module “B”, SPK R P4. [Fig.3] 1) Unlock 2 screws to separate chassis from cabinet. 2) Unlock 4 screws to separate chassis from LCD module. [Fig. 4] 5 6 7 8 Disassemble the LCD module to the cabinet assy. [Fig. 5] Unlock 5 screws to separate plate from supporter. [Fig. 6] Unlock 6 screws to separate fan assembly from plate and unlock 6 screws to disassemble fan module from Bracket. [Fig. 7] 1) Separate LVSD harness from main P120. 2) Separate 12P harness from power PCB P205. 9 10 3) Separate 14P harness from power PCB P204. [Fig. 8] Unlock 3 screws to separate plate shield from Supporter [Fig. 9] 1) Separate 24P harness from main P201. 2) Separate SPK R 10P harness from main P101. 3) Unlock 1 screw to separate AC socket from supporter. 11 4) Unlock 7 screws to main PCB assembly from supporter. [Fig. 10] 1) Unlock 4 screws power PCB assembly from supporter. 12 13 2) Pull up the holder from power PCB Assembly. [Fig. 11] Unlock 2 screws to separate speaker PCB assembly from supporter. [Fig. 12] 1) Separate 10P harness from speaker PCB assembly. 14 15 16 2) Unlock 2 screws to separate the speaker PCB assembly from plate. [Fig. 13] Unlock 8 screws to separate plates. [Fig. 14] Unlock 6 screws to separate plates. [Fig. 15] Unlock 8 screws to separate plates. [Fig. 16] EL-MF877-00 Template Revision A Page 2 1.1 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below: [Fig.1] P2 CONTROL PCB in BACK COVER EL-MF877-00 Template Revision A [Fig.2] Page 3 “B” “A” P4 Separate harness from 2P HOLDER [Fig.3] [Fig.4] EL-MF877-00 Template Revision A Page 4 [Fig.5] [Fig.6] EL-MF877-00 Template Revision A Page 5 [Fig.7] 2 P204 3 P205 1 P120 [Fig.8] EL-MF877-00 Template Revision A Page 6 1 1 1 [Fig.9] P201 4 4 4 P101 SC100 4 4 4 4 3 [Fig.10] EL-MF877-00 Template Revision A Page 7 1 1 Pull up the Holder 1 1 [Fig.11] 1 [Fig.12] 1 EL-MF877-00 Template Revision A Page 8 [Fig.13] [Fig.14] EL-MF877-00 Template Revision A Page 9 [Fig.15] [Fig.16] EL-MF877-00 Template Revision A Page 10 Designation Capacitors Electrolytic Capacitors Main BD N/A 2 ea Inverter BD N/A 3 ea Power BD N/A 8 ea TCON BD N/A N/A (larger than 2.5cm) Procedures for panel lamp removal EL-MF877-00 Template Revision A Page 11 Method of Lamp Disassembly_LD420WUN-SAA1 Step 1 : Remove the Control Cover Shield Step 2 : Remove the Control PCB Step 5 : Uncover the Board Assy Step 3 : Remove the Top Case Step 4 : Detach the Tape Step6 : Remove the G/Panel & Optical Sheets Step 7 : Unhook the Supporter Side Disassembled EEFL Lamp Step 8 : Pull the Lamp with both hands Step 9 : Pull the Electrode