Distributor of mechanical IC samples
(dummy components), test boards, kits and
SMD production tools and equipment.
Frequently Asked Questions
What are dummy components?*
What is a PCB Practice Kit?
Dummy components are the exact mechanical equivalent of
functional electronic components.
A PCB Practice Kit contains both the PC practice board and the
necessary dummy components so customers can conduct assembly process evaluation without using high-cost, live components and functional PC boards. Kits are available in a single pack
for employee hand soldering training or packaged for production equipment evaluation. Both X, Y Theta data and Gerber data
are available without charge.
Why use dummy components?
Dummies save money. In cases where only mechanical characteristics are required, dummy components can be used instead of
live functioning components. Since there is no expensive die
inside the package, the cost for performing mechanical testing is
significantly lower.
Who is Practical Components?
Practical Components is a team of dedicated electronic industry
professionals offering value pricing, on-time delivery, and superior service to our customers. The Practical Components team is
ready to provide project assistance in the areas of technical
component knowledge, drawings, component land patterns,
and PCB practice kits.
What other products are offered by
Practical Components?
In addition to dummy components, Practical carries solder training aids, tools and related equipment, IPC products and designs
custom printed circuit boards. Your sales representative can supply technical information and pricing on all our products.
Who uses dummy components?
Companies that are involved with electronic component assembly, testing, evaluation and employee training.
Contact Practical Components
If you have any additional questions concerning
Practical Components, our products or policies, please
contact us.
Practical Components, Inc.
re s s
Ad d
10762 Noel Street
w
e
N
Los Alamitos, CA 90720 USA
Tel: 1-714-252-0010
Fax: 1-714-252-0026
E-mail: klaphen@practicalcomponents.com
Web Site: www.practicalcomponents.com
!
Main E-mail.................................................................................klaphen@practicalcomponents.com
International Sales .......................... Deanne Herman / dherman@practicalcomponents.com
Sales ....................................................................... Russell Kido / rkido@practicalcomponents.com
Sales ...................................................................Staci Knight / sknight@practicalcomponents.com
Sales ...................................................................Lisa Laphen / llaphen@practicalcomponents.com
Technical Support ..........................................................techsupport@practicalcomponents.com
Accounting ..................................... Jacqueline Petesch / jpetesch@practicalcomponents.com
Purchasing ............................................ Heather Portillo / hportillo@practicalcomponents.com
President ..................................................... Kevin Laphen / klaphen@practicalcomponents.com
*Disclaimer: Dummy components are only to be used for evaluation and
testing purposes. Practical Components is not responsible for product
that is used as a “live” package using live die assembly. Dummy samples
are not to be used for 1st reliability testing.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
How To Place Your Order
Our sales staff is ready to serve you from 8:00 A.M. to
5 P. M. Pacific Standard Time, Monday through Friday. Our
fax lines are open 24 hours every day.
Fax and E-mail orders received after normal business hours
are processed the next business day. Please include your
telephone and fax numbers so we can confirm your order.
Bill / Remit to:
Practical Components, Inc.
PO Box 1037
Los Alamitos, CA 90720-1037 USA
Ship to:
Practical Components, Inc.
10762 Noel Street
Los Alamitos, CA 90720 USA
N
dd
ew A
re s s
!
Tel: 1-714-252-0010
Fax: 1-714-252-0026
E-mail: klaphen@practicalcomponents.com
Web Site: www.practicalcomponents.com
F.O.B. is Los Alamitos, CA USA
Product Liability: Practical Components’ sole obligation for products
that prove to be defective within 10 days of purchase will be replaced or
refunded. Practical Components gives no warranty either expressed or
implied and specifically disclaims all other warranties, including warranties for merchantability and fitness.
In no event shall Practical Components’ liability exceed the buyer’s
purchase price nor shall Practical Components be liable for any indirect
or consequential damages.
Shipment Damage: Merchandise is carefully packaged in compliance with carrier requirements. Claims for loss or damage in transit
must be made with the carrier by the customer. All shipments should
be unpacked and inspected immediately upon receipt. If damage does
not become apparent until shipment is unpacked, make a request for
inspection by the carrier’s agent. Failure to do so will result in the carrier
refusing to honor the claim.
Non-Catalog Items: Merchandise not listed in our catalog, if available
from our suppliers, may be subject to minimum order quantities and/or
special handling charges. Shipment is made as quickly as deliveries are
received from our suppliers. Special order products are sold on a nonreturnable basis.
Quotations: All items are subject to prior sale. A quote is valid for
30 days.
Dishonored Check Policy: If a check you give us as payment is dishonored for any reason by the bank or any other institution on which it is
drawn, you agree to pay us $20.00 as a service charge. In addition, you
agree to pay any other reasonable charges imposed by any check verification company or collection agency that we may use for collection.
Terms and Conditions
Prices/Quantities: Prices are subject to change without notice and
quantities may be limited.
Out Of Stock Items: Items not available for immediate shipment will
be shipped as they become available. Items not available at the end
of 90 days will be cancelled. The number of back-ordered days may be
extended beyond 90 days with customer approval.
Handling Charge: A $10.00 handling charge applies to all orders less
than $50.00.
Return Policy: Returns must be made promptly and accompanied
by a return authorization number. Please contact a customer service
representative to obtain a return authorization number. All returns must
be made within 30 days of date of invoice and accompanied by return
authorization number.
 Return freight charges must be prepaid.
 C.O.D. returns cannot be accepted.
 Return merchandise in original packaging and in
resalable condition.
 Please note that items returned due to customer error may be subject
to a restocking charge of 25%.
 Non-catalog items are not returnable.
Catalog Listings: Not all products listed in this catalog are maintained
in stock, and all product specifications for each product are current as
of the date of publication. Product listings, specifications and prices for
each product are subject to change without notice.
Terms: We accept Visa, MasterCard and American Express
(minimum order is $50.00).
Open Account: We bill on a net 30–day basis to customers with
approved credit.
Large Quantity Quotations: Practical Components will be happy to
quote quantities in excess of the amounts shown in the catalog.
Freight Charges: On open accounts, actual freight charges are added
to the invoice. A packing and handling fee of $4.50 is added to the order.
C.O.D accounts will have the freight charges pre-billed to the C.O.D. total
in addition to a $5.00 packing and handling charge.
Tray Charge: A $7.00 tray charge is added if customer orders less than a
full tray quantity.
Special Requirements: Please include specific instructions if you
require special packing, marking, shipping, routing or insurance.
*All prices are in US$.
Index
DUMMY COMPONENTS
Package on Package
Industry Acronyms
Industry Acronyms ........................................................................................43
Tape and Reel
Ball Grid Array
CTReels Empty Carrier Tape Reels ...........................................................46
Tape and Reel Specifications .....................................................................47
CVBGA Very Thin ChipArray® BGA—Amkor Technology................ 11
CTBGA ChipArray® Thin Core BGA—Amkor Technology ................12
CABGA ChipArray® BGA—Amkor Technology ....................................13
MLF
tsCSP Thin Substrate Chip Scale Pkg.—Amkor Technology ..........14
LGA Land Grid Array—Amkor Technology ..........................................15
MLF® MicroLeadFrame®—Amkor Technology ....................................16
Dual Row MLF®—Amkor Technology ....................................................17
Flip Chips
Quad Flat Packs
QFP Quad Flat Pack .......................................................................................25
LQFP Low Profile Quad Flat Pack..............................................................26
TQFP Thin Quad Flat .....................................................................................27
CQFP Ceramic Quad Flat Pack ...................................................................28
LCC Leadless Ceramic Carrier ....................................................................28
Dual Packages
PLCC Plastic Leaded Chip Carrier .............................................................29
SOIC/SOJ Small Outline Integrated Circuit ...........................................30
TSOP Type I & Type II Thin Small Outline Package.............................31
SSOP Small Shrink Outline Package ........................................................32
TSSOP Thin Shrink Small Outline .............................................................33
SMR Lead-Free Surface Mount Resistors...............................................34
SMC Lead-Free Surface Mount Ceramic Capacitors ........................35
SME Surface Mount Electrolytic Capacitors .........................................36
MELF Diodes Metal Electrode Face Component Diodes ................36
SMTA Surface Mount Molded Tantalum Capacitors .........................37
SMT Lead-Free Surface Mount Transistors ...........................................38
MELF Resistors Metal Electrode Leadless Face ...................................40
Through-Hole
PDIP Plastic Dual In-line Pkg. .....................................................................41
Through-Hole Glass Diodes .......................................................................41
TO Through-Hole Transistors ....................................................................42
Axial Leaded Resistors .................................................................................42
TOOLS & SUPPLIES
Vacuum Handling Tools.............................................................................. 84
Beau Tech Soldering Aids ...........................................................................85
Practical Production Tools
Flextac™ BGA Rework Stencil Kit ..............................................................86
Practical BGA Reballing Kit .........................................................................88
ABSTRACT
Abstract—Amkor
A Study on Package Stacking Process for
Package-on-Package (PoP) ........................................................................90
International Distributors ........................................................................ 96
3
Tools & Supplies
Passives, Resistors, Discretes
Custom PC Practice Boards and Kits .......................................................48
CircuitCAM™ Software—Aegis Industrial Software .........................49
Kit Identifier (component part/kit numbers) ......................................50
Single Pack Hand Solder Kits .....................................................................51
Traceability & Control Validation Kit—Aegis .......................................52
PC000 Lead-Free Zero-Ohm SMD Resistor Board and Kit ..............54
PC003 Solder Practice Board and Kit ......................................................55
SIR Test Board and Kit ...................................................................................56
PC005 BGA Variable Pitch and Array Board and Kits ........................57
PC007 MLF® Test Board and Kits...............................................................58
PC008 Solder Practice Board and Kits ....................................................60
PC009 Mixed Technology Board and Kit ...............................................62
PC011 BGA Fine Pitch Board and Kit .......................................................63
PC012 BGA Global Daisy-Chain Test Kit ................................................ 64
PC013 Through-Hole Solder Training Kits ............................................66
SMTA Saber Evaluation Board and Kit ....................................................67
PC014 IPC 9850 Attribute Defect Rate Kit .............................................68
PC015 Rework Kits..........................................................................................69
PC016 IPC Compliant Hand Soldering Kit .............................................70
PC020 Practical SMT Kit ...............................................................................71
PC031 Lead-Free Process Capability Validation Kit—Cookson ....72
PC200 PoP 14mm Board and Kit—Amkor Technology ...................74
PC200 PoP 12mm Board and Kit—Amkor Technology....................78
PC049 SMT/PTH Mixed Tech. Pb-Free Kit—Indium Corp. ...............79
Flip Chip Test Die Kits—FlipChip International ..................................80
PC2006 AIM Print Test Board and Kit—AIM .........................................82
WTK-1 Terminal and Wire Kit .....................................................................83
PC Boards & Kits
Flip Chips—FlipChip International ..........................................................18
Flip Chip Glossary—FlipChip International .........................................20
Daisy-Chain Patterns ....................................................................................21
PBGA 1.0mm Pitch—Amkor Technology ..............................................22
PBGA 1.5mm/1.27mm Pitch—Amkor Technology ............................23
SuperBGA®—Amkor Technology ..............................................................24
PC BOARDS & KITS
Dummy Components
PoP Package on Package —Amkor Technology .................................. 4
PoP
!
NEW
Dummy Components
Package on Package
Amkor is offering daisy chain samples of their award winning bottom
Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) and their top PoP
optimized for Package on Package (PoP) requirements. PoP has become
the solution of choice for an increasing number of mobile consumer
applications for 3D integration of logic and memory devices. Amkor’s
PSvfBGA is a high density fine pitch BGA package supporting logic or
ASIC devices including base band, application and image processors.
PoP stacking allows the OEM greater device, supplier and time to market
flexibility by sourcing the bottom and top devices from their preferred
logic and memory suppliers and then stacking the devices in the PWB
surface mount assembly flow. A wide range of leading wireless and mobile integrated device manufacturers are relying on Amkor’s technical
and industry leadership in PoP.
Stacked Package
PoP Package on Package—Mating Top and Bottom Daisy Chain Samples
Part Number
12mm Body Size
A-PoP128-.65mm-12mm-DC
A-PSvfBGA305-.5mm-12mm-DC
14mm Body Size
A-PoP152-.65mm-14mm-DC
A-PSvfBGA353-.5mm-14mm-DC
I/O Count
Pitch
Body
Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
128 (top)
305 (bottom)
.65mm
.5mm
12mm
12mm
18 x 18
23 x 23
Perimeter
Perimeter
160
160
152 (top)
353 (bottom)
.65mm
.5mm
14mm
14mm
21 x 21
26 x 26
Perimeter
Perimeter
126
126
Notes
















Part Number System
Fine pitch 0.5mm bottom package footprints
Stacked package heights of 1.2mm to 1.6mm available in a variety of
configurations (see Stack Up table on following pages)
Wafer thinning / handling < 100 µm
Consistent product performance and reliability
Package configurations compliant with JEDEC standards
Moisture Resistance Testing is JEDEC Level 3 @ 260 °C
Temp Cycle –55/+125 °C, 1000 cycles
HAST 130 °C, 85% RH, 96 hours
Temp/Humidity 85 °C/85%RH/1000 hours
High Temp Storage 150 °C, 1000 hours
Board level Thermal Cycle –40/+125 °C, 1000 cycles
Parts packaged in JEDEC matrix trays
PoPs are only available Pb-free (not Tin-Lead). Available alloys are:
SAC305, SAC405, SAC105 and SAC125Ni*
*SAC125Ni (1.2%Sn/0.5%Ag/.05%Cu/98.25%Ni) is only available for bottom packages.
It is recommended that parts be pre-baked at 125 °C for 48 hrs before
using parts regarding moisture concern.
PoP's are not available without solder balls.
See drawings on the following pages (5–10) for
additional technical data. Color coded version available on our website: www.practicalcomponents.com
Amkor
A-PSvfBGA305-.5mm-12mm
Package Stackable
Very Thin Fine Pitch BGA
Body Size
Pitch
I/O Count
(Bottom Side Only)
Ball Diameter
I/O Count
Ball Diameter
128
152
305
353
0.45mm
0.45mm
0.3mm
0.3mm
For recommended kits see
pages 74 and 78.
Please Note


Amkor supporting data is available on our website for: Board
Level Reliability (BLR), PoP application notes, PoP Stencil &
Stacking paper for SMT Conditions.
IMAPS and SMTA White Paper Articles for additional
supporting data available on our website:
www.practicalcomponents.com.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
4
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Package on Package (PoP)
!
NEW
12x12mm Stacked Daisy Chain
Dummy Components
Package on Package (PoP)
12x12mm, 0.65mm to pitch
Stacked Daisy Chain
12mm 305 PSvfBGA Bottom Package Design Dimensions
Foot print - top (b)
Package size (a)
0.27mm
Max die size (d)
Foot print - bottom (c)
Body (a)
Foot Print–top (b)
Foot Print–bottom (c)
Die (d)
Bond Fingers
Available
12 x 12mm
0.65 pitch, 128 ball
18 matrix, 2 row
0.5 pitch, 292 I/Os
23 matrix, 4 row
+ 12 NC + A1 ball 305 BGA
7.0 mm
332
PoP Daisy Chain 3 Net Design
Daisy chain netlist of PSvfBGA, Bottom
package balls.
Daisy chain netlist of top side (Top PoP to PSvfBGA 12
corner balls reserved for NC or additional supplies as
memory combinations may require).
L20 M20
Daisy chain netlist of top side (Top PoP to PSvfBGA
116 pin memory interface).
Bottom package called: Package Stackable
very thin fine pitch BGA (PSvfBGA).
M4 N4
* Color diagram of DC Net design available on our website.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
5
Package on Package (PoP)
!
NEW
12x12mm Stacked Daisy Chain
Dummy Components
PSvfBGA 305
(Bottom Package) Daisy Chain Nets
Top side of bottom package
Top package interface (top view) 0.65 mm pitch,
128 pads, 18x18 ball matrix
Bottom side of bottom package
(top view through package) 12x12mm,
0.5 mm PSvfBGA305, 23x23 ball matrix
1 2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
*
B
C
* Connected thru
bottom side (B)
D
E
Daisy chain pattern of
PSvfBGA—Top
memory pads
F
G
H
(B)
J
(A)
Connected thru
bottom side (A)
K
L
Top side 12 corner ball
DC net
M
N
P
R
T
U
V
Daisy chain pattern of PSvfBGA -Bottom BGAs
PoP + PSvfBGA
Daisy Chain Netlist
128 PoP (Top Package)
Daisy Chain Netlist
1
2
3
4
5
6
7
8
9
1
10 11 12 13 14 15 16 17 18
A
A
B
B
C
D
E
F
G
H
J
K
Top PoP package
Bottom side (top view
through package)
12x12 mm, 0.65 mm pitch
128 PoP
18x18 ball matrix
2 rows
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
* Connected thru
bottom side (B)
C
D
E
F
G
Top PoP
stacked on PSvfBGA
(top view through package
H
J
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
Daisy chain pattern for 12 corner balls (typically
reserved as NC for applications with no underfill, or
option to add additional I/O or memory supplies as
required for high density combinations)
2
Connected thru
bottom side (A)
Daisy chain pattern of Top package for
116I/O memory interface
Daisy chain netlist of
Top PoP and PSvfBGA.
* Color diagram of DC Net design available on our website.
6
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Package on Package (PoP)
!
NEW
12x12mm Stacked Daisy Chain
1 2
1-1
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
Stacked view of 3 DC Nets for
BLR testing
1 2
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-1
1-2
4-1
3-1
4-2
3-2
Dummy Components
PWB Netlist
Pattern for BLR Testing
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-2
4-1
3-1
4-2
3-2
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
PoP Overall Stack Up Example
B3
B2
B1
A2
A1
Symbol
Symbol
Unitpitch)
A1 (Ball, 0.5
A2 (4L laminate)
mm
B1 (Ball, 0.65
mm pitch)
B2 (2L laminate)
mm
B3 (Mold cap)
mm
Overall Pkg
height
mm
FBGA + PS-vfBGA
PoP +PSvfBGA
unit
Min
Max
Nom
Min
Max
0.150
0.250
0.200
mm
mm
0.340
0.300
0.150 0.260
0.250
mm
0.330
0.260 0.270
0.340 0.300
mm
0.240
0.210
0.270 0.180
0.330
mm
0.420
0.480
0.450
0.180
0.240
mm
1.378
1.542
1.460
0.420
0.480
Nom
0.200
A1 (Ball, 0.5 pitch)
A2 (4L laminate)
0.300
B1 (Ball, 0.65 pitch)
0.300
B2 (2L laminate)
0.210
B3 (Mold cap)
0.450
Overall Pkg Height
mm
1.378
1.542
1.460
B2 and B3 may vary depending on top memory FBGA (MCP) design rules.
be finalized
onrules.
top FBGA rules.
Stack
based
B2 and B3 may varyOverall
depending
on up
top to
memory
PoP (MCP)
design
Overall Stack up to be finalized based on top PoP rules.
* Color diagram of DC Net design available on our website.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
7
Package on Package (PoP)
!
NEW
Dummy Components
14x14mm Stacked Daisy Chain
Package on Package (POP)
14x14mm
Stacked Daisy Chain
14mm 353 PSvfBGA
Bottom Package Design Dimensions
Foot print - top (b)
Package size (a)
0.27mm
Max die size (d)
Foot print - bottom (c)
Body (a)
Foot Print–top (b)
Foot Print–bottom (c)
Die (d)
Bond Fingers
Available
14 x14 mm
0.65 pitch, 152 ball
21 matrix, 2 row
0.5 pitch, 340 I/Os
26 matrix, 4 row
+ 12 NC + A1 ball 353 BGA
8.9 mm
328 to 396
PoP Daisy Chain 3 Net Design
Daisy chain netlist of PSvfBGA, Bottom
package balls
Daisy chain netlist of top side (Top PoP to PSvfBGA 12
corner balls reserved for NC or additional supplies as
memory combinations may require).
M23 N23
Daisy chain netlist of top side (Top PoP to PSvfBGA 140 pin memory interface)
Bottom package called: Package Stackable very thin
fine pitch BGA (PSvfBGA)
M4 N4
* Color diagram of DC Net design available on our website.
8
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Package on Package (PoP)
!
NEW
14x14mm Stacked Daisy Chain
Dummy Components
PSvfBGA 353
(Bottom Package) Daisy Chain Nets
Bottom side (top view through package) 14x14mm,
0.5 mm PSvfBGA353, 26x26 ball matrix
12 15
15 18
16 19
17 20
18 21
19 22
20 23
21 24
23 26
24 25 26
31 42 53 64 75 86 97 108 11
9 12
10 13
11 14
1316
14 17
22 25
1 2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Top side—Top package interface (top view) 0.65 mm pitch,
152 pads, 21x21 ball matrix
1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Daisy chain pattern
of PSvfBGA—Top
memory pads
(B) (B)
(A) (A)
Top side 12
corner ball DC net
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern of PSvfBGA—Bottom BGAs
2
3
4
5
6
7
8
9
1
10 11 12 13 14 15 16 17 18 19 20 21
A
B
B
C
E
F
G
H
J
K
L
Connected
Connected
with with
bottom
bottom
side side
(A) (A)
Top PoP + PSvfBGA
Daisy Chain Netlist
A
D
Top side 12 corner
Connected
Connected
thru thru
ball DC net bottom
bottom
side side
(B) (B)
Top side 12 corner ball DC net
152 PoP
(Top Package) Daisy Chain Netlist
1
2 13 24 3 5 4 6 57 68 7 9 810 911 10
18 1719 1820 1921 20 21
12 11
13 12
14 1315 1416 15
17 16
A
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21
Connected with
bottom side (B)
C
Top PoP package
Bottom side (top view
through package)
14x14 mm, 0.65 mm 152 PoP
21x21 ball matrix
2 tiers
M
N
P
R
D
E
F
G
H
Daisy chain
pattern of Top
package for
140 I/O memory
interface
Top PoP
stacked on PSvfBGA
(top view through package)
J
K
L
Connected with
bottom side (A)
M
N
P
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern for 12 corner balls
(typically reserved as NC for applications with no
underfill, or option to add additional I/O or memory
supplies as required for high density combinations).
Daisy chain netlist of Top FBGA and PSvfBGA
* Color diagram of DC Net design available on our website.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
9
Package on Package (PoP)
!
NEW
Dummy Components
14x14mm Stacked Daisy Chain
Stacked View of 3 DC Nets
For BLR Testing
PWB Netlist Pattern
for BLR Testing
PWB (top view)
1 2
1-1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
3 4 5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1 2
1-1
1-2
3-1
4-1
3-2
4-2
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
3 4 5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1-2
3-1
4-1
3-2
4-2
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
PoP Overall Stack Up Example
B3
B2
B1
A2
A1
Symbol
Symbol
A1 (Ball, 0.5Unit
pitch)
A2 (4L laminate)
mm
B1 (Ball, 0.65
mmpitch)
B2 (2L laminate)
mm
B3 (Mold cap)
mm
Overall Pkgmm
height
FBGA + PS-vfBGA
PoP + PSvfBGA
unit
Min
Max
Nom
Min 0.150
Max
0.250
0.200
mm
mm
0.340
0.150 0.260
0.250 0.300
mm
0.330
0.260 0.270
0.340 0.300
mm
0.180
0.240
0.270
0.330 0.210
mm
0.420
0.480
0.180
0.240 0.450
mm
1.542
0.420 1.378
0.480 1.460
Nom
0.200
A1 (Ball, 0.5 pitch)
A2 (4L laminate)
0.300
B1 (Ball, 0.65 pitch)
0.300
B2 (2L laminate)
0.210
B3 (Mold cap)
0.450
Overall Package Height
mm
1.378
1.542
1.460
B2 and B3 may vary depending on top memory FBGA (MCP) design rules.
be finalized
on top
FBGA rules.
Overall
Stackon
uptop
tomemory
based
B2 and B3 may vary
depending
PoP (MCP)
design
rules.
Overall Stack up to be finalized based on top PoP rules.
* Color diagram of DC Net design available on our website.
10
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
CVBGA
!
NEW
Very Thin ChipArray® BGA
Dummy Components
ChipArray® (CVBGA) is a new package offering by Amkor that has a
0.4mm pitch. In addition to the standard core ChipArray® package
(CABGA and CTBGA), Amkor offers thinner mold cap thickness of
1.0mm max. By utilizing a thin core laminate, much denser routing can
be achieved, thereby enabling more I/O’s in a given footprint. Due to
their small size and I/O density, Amkor’s ChipArray® product family is
an excellent choice for new devices requiring a small footprint and low
mounted height.
CVBGA Very Thin ChipArray® BGA
Part Number
I/O Count
Pitch
Body Size
A-CVBGA97-.4mm-5mm
A-CVBGA360-.4mm-10mm
A-CVBGA432-.4mm-13mm
97
360
432
.4mm
.4mm
.4mm
5mm
10mm
13mm
Ball
Matrix
10 x 10
23 x 23
31 x 31





Quantity
Per Tray
624
250
160
Available Lead-Free Alloys
SAC405, SAC305 or SAC105
SAC405, SAC305 or SAC105
SAC405, SAC305 or SAC105
Part Number System
Notes

Ball
Alignment
Full Array
Perimeter
Perimeter
Parts are packaged in JEDEC trays.
All components are daisy-chained.
Moisture sensitivity is JEDEC level 3.
Solder ball material is available with Eutectic 63/37 SnPb.
Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 0.5% Cu (SAC405)
alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305) or (SAC105) 98.25%Sn/
1.2%Ag/0.5%Cu/.05%Ni.
New: CVBGA ,CTBGA and CABGA parts are available without solder
ball, which makes the package LGA. See page 15.
Body Size
Amkor
A-CVBGA-97-.4mm-5mm
ChipArray
Pitch
Very Thin
I/O Count
Ball Grid Array
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC305” or “SAC105” to end of part number for Lead-Free.
CABGA
®
ChipArray BGA
CTBGA
®
Thin ChipArray BGA
CVBGA
®
Very Thin ChipArray BGA
Body Size
1.5 mm (max.)
Body Size
Mold
Compound
1.0 mm (max.)
1.2 mm (max.)
Die Attach
Au Wire
Solder
Mask
Die
Side View
Top View
A1 Ball Corner
Via
Eutectic
Rigid Laminate
Ball Pitch
For kits see pages 60 and 63.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
Ball Pitch
Bottom View
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
11
CTBGA
Dummy Components
ChipArray® Thin Core Ball Grid Array
CTBGA ChipArray® Thin Core Ball Grid Array
Part Number
.5mm Pitch
A-CTBGA60-.5mm-5mm
A-CTBGA84-.5mm-6mm
A-CTBGA84-.5mm-7mm
A-CTBGA108-.5mm-7mm
A-CTBGA132-.5mm-8mm
A-CTBGA228-.5mm-12mm
.8mm Pitch
A-CTBGA49-.8mm-6mm
A-CTBGA49-.8mm-7mm
A-CTBGA64-.8mm-7mm
A-CTBGA64-.8mm-8mm
A-CTBGA128-.8mm-11mm
A-CTBGA160-.8mm-12mm
A-CTBGA176-.8mm-13mm
A-CTBGA192-.8mm-14mm
A-CTBGA208-.8mm-15mm
1.0mm Pitch
A-CTBGA100-1.0mm-11mm
A-CTBGA144-1.0mm-13mm
I/O Count
Pitch
Body Size
Bal
Matrix
Ball
Alignment
Quantity
Per Tray
60
84
84
108
132
228
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
5mm
6mm
7mm
7mm
8mm
12mm
8x8
10 x 10
12 x 12
12 x 12
14 x 14
22 x 22
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
792
608
476
476
360
189
49
49
64
64
128
160
176
192
208
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
6mm
7mm
7mm
8mm
11mm
12mm
13mm
14mm
15mm
7x7
7x7
8x8
8x8
12 x 12
14 x 14
15 x 15
16 x 16
17 x 17
Full Array
Full Array
Full Array
Full Array
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
608
476
476
360
207
198
160
476
126
100
144
1.0mm
1.0mm
11mm
13mm
10 x 10
12 x 12
Full Array
Full Array
207
160
Notes










Part Number System
Parts are packaged in JEDEC trays when available.
All components are available daisy-chained.
<0.12mm (5 mil) coplanarity.
Solder ball material is Eutectic 63/37 SnPb.
BT (Bismaleimide-Triazine) substrates or equivalent.
Package thickness is 1.2mm max for 0.8mm and 1.0mm pitch packages.
Package thickness is 1.1mm max for 0.5mm pitch packages.
New: CABGA, CVBGA and CTBGA parts are available without solder
balls, which makes the package LGA. See page 15.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/0.5% Cu
alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.25%Sn/
1.2%Ag/0.5%Cu/.05%Ni is also available.
Amkor
A-CTBGA60–.5mm–5mm
Body Size
Pitch
ChipArray
I/O Count
Thin Core Ball Grid Array
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC105” or “SAC305” to end of part number for Lead-Free.
®
For recommended kit see page 63.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
12
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
CABGA
ChipArray® Ball Grid Array
Dummy Components
ChipArray® (CABGA) packages are offered in laminate format and are
available as Ball Grid Array. The near chip size standard outlines offer
fixed body sizes and ball counts. Established SMT mounting processes and techniques are compatibly with ChipArray ®. The package
size and design provides ideal RF operation (low inductance) for high
speed applications requiring small footprints.
ChipArray® Ball Grid Array
Part Number
.5mm Pitch
A-CABGA40-.5mm-5mm
A-CABGA56-.5mm-6mm
.8mm Pitch
A-CABGA36-.8mm-6mm
A-CABGA49-.8mm-7mm
A-CABGA64-.8mm-8mm
A-CABGA100-.8mm-10mm
A-CABGA160-.8mm-12mm
A-CABGA176-.8mm-13mm
A-CABGA192-.8mm-14mm
A-CABGA208-.8mm-15mm
A-CABGA288-.8mm-19mm
1.0mm Pitch
A-CABGA100-1.0mm-11mm
A-CABGA144-1.0mm-13mm
A-CABGA196-1.0mm-15mm
A-CABGA256-1.0mm-17mm
I/O Count
Pitch
Body Size
Ball Matrix
Ball
Alignment
Quantity
Per Tray
Available
Lead-Free Alloys
40
56
.5mm
.5mm
5mm
6mm
8x8
10 x 10
Perimeter
Perimeter
624
408
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
36
49
64
100
160
176
192
208
288
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
6mm
7mm
8mm
10mm
12mm
13mm
14mm
15mm
19mm
6x6
7x7
8x8
10 x 10
14 x 14
15 x 15
16 x 16
17 x 17
22 x 22
Full Array
Full Array
Full Array
Full Array
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
608
476
360
250
198
160
476
126
84
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
100
144
196
256
1.0mm
1.0mm
1.0mm
1.0mm
11mm
13mm
15mm
17mm
10 x 10
12 x 12
14 x 14
16 x 16
Full Array
Full Array
Full Array
Full Array
207
160
126
90
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
SAC405, SAC105 or SAC305
Part Number System
Notes










Parts are packaged in JEDEC trays when available.
All components are available daisy-chained.
<0.12mm (5 mil) coplanarity.
Solder ball material is Eutectic 63/37 SnPb.
BT (Bismaleimide-Triazine) substrates or equivalent.
Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages.
Package thickness is 1.34mm max for 0.5mm pitch packages.
New: CABGA, CVBGA and CTBGA parts are available without
solder balls, which makes the package LGA. See page 15.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105)
98.25%Sn/1.2%Ag/0.5%Cu/.05%Ni is also available.
Amkor
A-CABGA40–.5mm–5mm
Body Size
Pitch
I/O Count
ChipArray®
Ball Grid Array
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC305” or “SAC105” to end of part number for Lead-Free.
Solder Ball Height
After Ball Attach
B
Solder Ball Diameter/Height
(As Received)
A
C
Diameter = Height
After Reflow
D
Motherboard
For recommended kits see pages
53, 62, 69 and 73.
Package Pitch
A
B
C
D
1.00/0.80mm
0.46mm
0.48m
(± 0.05mm)
0.36mm
(± 0.05mm)
0.30mm
(± 0.05mm)
0.50mm
0.30mm
0.32mm
(± 0.05mm)
0.19mm
(± 0.05mm)
0.17mm
(± 0.03mm)
Note: Typical motherboard non-solder mask defined pad:



0.50 pitch = 0.28
0.80 pitch = 0.30
1.00 pitch = 0.38
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
13
tsCSP
!
NEW
Dummy Components
Thin Substrate Chip Scale Package
Amkor’s tsCSP is a land grid array multi-row package (up to 3–rows of
lands) compatible with established CSP mounting processes. The nearchip-size standard outlines offer a broad selection of land pitch, count,
and body sizes. By utilizing a thin substrate, standard package height of
0.4mm to 0.6mm can be achieved. Amkor also offers very thin package
thickness less than 0.4mm.
The package uses Amkor’s ExposedPad™ technology as a thermal
enhancement by having the die attach paddle exposed on the bottom
of the package surface to provide an efficient heat path when soldered
directly to the PWB. These enhancements also enable stable ground by
use of down bonds or by electrical connection through a conductive
die attach material.
Amkor tsCSP packages, regardless of body sizes and thicknesses, utilize
streamlined, flexible manufacturing process which assures economical
packaging solutions. Amkor’s tsCSP is an excellent solution for devices
requiring high performance and ultra-thin chip scale applications.
tsCSP Thin Substrate Chip Scale Package
Part Number
Lead Count
Body Size
Pitch
A-tsCSP28-.5mm-4mm
A-tsCSP92-.5mm-7mm
A-tsCSP136-.5mm-8mm
A-tsCSP200-.5mm-10mm
A-tsCSP208-.5mm-15mm
28
92
136
200
208
4mm
7mm
8mm
10mm
15mm
.5mm
.5mm
.5mm
.5mm
.5mm
!
NEW
Notes












Quantity
Per Tube
75
43
37
30
TBD
Pad Row
Triple Row
Triple Row
Part Number System
Amkor
Exposed die attach pad for superior thermal performance.
JEDEC MO-247 compliant: Plastic Quad No-lead Staggered
Multi-row Packages.
JEDEC Publication 94 Design Guide 4.19 compliant: Quad No-lead
Staggered and Inline Multi-row Packages.
Au/Ni and SnPb plating
Ultra thin: 0.4mm to 0.65mm.
Parts are packaged in tubes (standard).
Parts are available in trays or on tape and reel upon special request.
MLS = JEDEC Level 1 (depending on body size).
Package format similar to saw MLF.
92 lead is available DAPless version.
Power/Ground ring available only for 92ld, 200ld and 208ld.
Down bond available only for 136ld and 208ld.
Body Size
Pitch
Thin Substrate
Chip Scale Package
Lead Count
* Add “TR” to end of part number for Tape and Reel.
* Add “Sn” to end of part number for Lead-Free.
Exposed Die Pad
LGA Pad and Ring
D/A adhesive (No DAP)
Non-Exposed Die Pad
(For thin package and/or escape routing on board)
Au/Ni Plating for W/B
Cu plating
LGA Pad and Ring
MQFP
3.93 mm
A-tsCSP-208-.5mm-15mm
Down Bonding Pad
DAP
Au/Ni plating for SMT
Package Height Comparison
MQFP
2.33 mm
TQFP
1.6 mm
TQFP
TSOP
1.2 mm
TSSOP
1.1 mm
MLF
0.85 mm
tsCSP
0.65 mm
tsCSP
0.4 mm
For recommended kit see page 58.
14
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
LGA
!
NEW
Land Grid Array
Dummy Components
Amkor laminate ChipArray® packages are available without solder balls
upon special order. Packages available without solder balls include
CABGA, CTBGA and CVBGA. The same standard daisy-chained substrate
would be used based on open tooling.
LGA is another term used for parts without solder balls. The same BOM
(bill of material) is used when parts are assembled. LGA parts are used
to reduce package height, drop test performance in handheld applications, solder ball attach practice, socket insertion, P&P evaluation, reflow
profiling, enhance thermal cycle reliability and other purposes.
LGA solder interconnect if formed solely by solder paste applied at
board assembly because there are no solder balls attached to the LGA.
This results in a lower stand-off height of approximately 0.06mm to
0.10mm, depending on solder paste volume and PCB geometry. Laminate substrate is solder mask defined. Standard ball pad finish is NiAu.
Application notes available for supporting technical data.
Notes





Part Number System (use as an example when ordering)
Body sizes range from 5mm ~ 17mm.
Available pitches are .4mm, .5mm, .8mm and 1.0mm.
Parts packaged in trays (standard).
Parts available on Tape and Reel upon special request.
PoP, SBGA and PBGAs are not available without solder balls.
0.6 mm
1.10 mm–1.30 mm
0.80 mm–1.00 mm
2.71 mm–3.20 mm
Package Type
CTBGA-84-.5mm-.7mm-LGA
I/O Count
Pitch
Land Grid Array
(without solder balls)
Body Size
0.6 mm
1.1 mm–1.30 mm
1.92 mm–2.20 mm
Unmounted device profile (with balls on left, LGA on right)
For recommended kits see pages
53, 60, 62, 63, 69 and 73.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
15
MLF®
Dummy Components
MicroLeadFrame®
Amkor’s MicroLeadFrame® Package (MLF®) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact
to the PWB. The package also offers Amkor’s ExposedPad™ technology
as a thermal enhancement by having the
die attach paddle exposed on the bottom of the
package surface to provide an efficient heat path
when soldered directly to the PWB.
MLF®—MicroLeadFrame®
Part Number
.4mm Pitch
A-MLF48-6mm-.4mm
A-MLF88-10mm-.4mm
A-MLF100-12mm-.4mm
.5mm Pitch
A-MLF12-3mm-.5mm
A-MLF16-3mm-.5mm
A-MLF20-4mm-.5mm
A-MLF24-4mm-.5mm
A-MLF28-5mm-.5mm
A-MLF32-5mm-.5mm
A-MLF36-6mm-.5mm
A-MLF40-6mm-.5mm
A-MLF44-7mm-.5mm
A-MLF48-7mm-.5mm
A-MLF52-8mm-.5mm
A-MLF56-8mm-.5mm
A-MLF64-9mm-.5mm
A-MLF68-10mm-.5mm
A-MLF72-10mm-.5mm
.65mm Pitch
A-MLF8-3mm-.65mm
A-MLF16-4mm-.65mm
A-MLF20-5mm-.65mm
A-MLF28-6mm-.65mm
A-MLF32-7mm-.65mm
A-MLF44-9mm-.65mm
.8mm Pitch
A-MLF12-4mm-.8mm
A-MLF16-5mm-.8mm
A-MLF20-6mm-.8mm
A-MLF28-7mm-.8mm
Notes













Body Size
Pitch
Quantity
Per Tube
6mm
10mm
12mm
.4mm
.4mm
.4mm
50
30
25
12
16
20
24
28
32
36
40
44
48
52
56
64
68
72
3mm
3mm
4mm
4mm
5mm
5mm
6mm
6mm
7mm
7mm
8mm
8mm
9mm
10mm
10mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
100
100
75
75
60
60
50
50
43
43
37
37
33
30
30
8
16
20
28
32
44
3mm
4mm
5mm
6mm
7mm
9mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
100
75
60
50
43
33
12
16
20
28
4mm
5mm
6mm
7mm
.8mm
.8mm
.8mm
.8mm
75
60
50
43
Lead Count
48
88
100
!
NEW
!
NEW
Part Number System
Two MLF® designs are available: Punch or Saw (see the cross-section drawing).
Pin counts and body sizes change on an ongoing basis. Please call for
updated listing of available packages.
Body sizes ranging from 3 x 3mm to 12 x 12mm.
Eutectic solder plating is 85/15 Sn/Pb.
MLF® package is a near CSP plastic encapsulated package with a copper leadframe substrate.
Parts are packaged in tubes.
Parts are available in trays or on tape and reel upon special request.
Small size (50% space reduction as compared with TSSOP).
MLF®s are available daisy-chained (please call for more details).
Lead-free parts are available with 100% Matte Sn. Add “Sn” to end
of part number when ordering Lead-Free parts.
Moisture sensitivity level is JEDEC 1.
0.6mm to 1.5mm maximum height
For kits see pages
MLF® is also known as QFN, MCC or MLP.
58, 60, 69 and 73.
16
A-MLF12–3mm–.5mm
Amkor
MicroLeadFrame™
Pitch
Body Size
Lead Count
Cross-Sections MLF®
Solder
Plating
Mold
Compound
Gold
Wire
Die Attach
Material Ag Plating
Die
Cu
Leadframe
Down
Bond
Exposed
Die Paddle
Ground Bond
Individual Unit Design “Punch”
Gold Wire
Mold Compound
Die Attach
Material
NiPd
Plating
Die
Cu
Leadframe
Down
Bond
Exposed
Die Paddle
Ground Bond
MAP Design “Saw”
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
!
NEW
Dual Row MLF®
Dummy Components
Amkor’s new Dual Row MLF® (MicroLeadFrame®) package with 2 rows of
lands is a cost effective, high performance solution for devices requiring
up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN. The small size and weight, along with excellent
thermal and electrical performance, make the MLF® package an ideal
choice for handheld portable applications such as cell phones and PDAs
or any other application where size, weight and package performance
are required issues.
Dual Row MLF
Part Number
A-DualRowMLF108-9mm-.5mm
A-DualRowMLF116-9mm-.5mm
A-DualRowMLF124-10mm-.5mm
A-DualRowMLF132-10mm-.5mm
A-DualRowMLF148-11mm-.5mm
A-DualRowMLF156-12mm-.5mm
A-DualRowMLF164-12mm-.5mm
!
NEW
!
NEW
!
NEW
!
NEW
Lead Count
Body Size
Pitch
108
116
124
132
148
156
164
9mm
9mm
10mm
10mm
11mm
12mm
12mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
Part Number System
Notes:









Quantity
Per Tube
33
33
30
30
25
25
25
Parts are packaged in tubes (standard).
Parts are available in trays or on tape and reel upon special request.
Dual row MLF® offers enhanced thermal capability.
Dual Row MLF®s are available daisy-chained upon special request.
Process flow is same as standard “punch” MLF®.
Small size (reduce package footprint by 50% or more and improved RF
performance) and weight.
Moisture sensitivity level is JEDEC 1.
Solder plating finishes available are 85/15 SnPb and 100% Matte Sn.
Only dual pad row is available (not triple pad row). tsCSP package
family is available triple row for certain lead counts.
Amkor
A-DualRowMLF-108-9mm-.5mm
Pitch
Body Size
Dual Row MLF
Lead Count
* Add “TR” to end of part number for Tape and Reel.
* Add “Sn” to end of part number for Lead-Free.
MQFP
3.93 mm
SOIC
CABGA
SOT/SC
MQFP
2.33 mm
LQFP
TSOP
1.6mm
MLF
TSOP
TQFP TSSOP 0.9 mm
0.8 mm
1.2 mm 1.1 mm
0.6 mm
For recommended kit see page 58.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
17
Dummy Components
Flip Chip
FlipChip
International
Flip Chip describes the method of electrically connecting the die to the
package carrier. The package carrier, either substrate or leadframe, then
provides the connection from the die to the exterior of the package. The
interconnection between die and carrier in flip chip packaging is made
through a conductive bump that is placed directly on the die surface.
The bumped die is then flipped over and placed face down, with the
bumps connecting to the carrier. After the die is soldered, underfill is applied between the die and the substrate, around the solder bumps. The
underfill is designed to contract the stress in the solder joints caused by
the difference in thermal expansion between the silicon die and carrier.
UBM is the Al/NiV/Cu (under bump metallization) covering about 1%
of the wafer which is under the bumps only. Nitride passivation is an
invisible glass-like protective coating over 99% of the wafer, except
under the bumps. The bumps will not stick to the Nitride, only the UBM.
Nitride coating is standard for all Flip Chip wafers.
Flip Chips
PB18-250x250
PB18-500x500
FA10-200x200
FA10-400x400
FA10-600x600
Die Size
250 x 250 mils
500 x 500 mils
200 x 200 mils
400 x 400 mils
200 x 200 mils
400 x 400 mils
150 x 150 mils
Bump Pitch
Passivation Via
UBM Diameter
Bump Height
Bump Diameter
No. of Bumps
Final Metal Pad Size
Thickness Type
Metal Composition
457 µm, 18 mil
102 µm
178 µm
140 µm
190 µm
48
457 µm, 18 mil
102 µm
178 µm
140 µm
190 µm
96
254 µm, 10 mil
80 µm
102 µm
120 µm
135 µm
317
203 µm, 8 mil
73 µm
95 µm
98 µm
120 µm
88
457 µm, 18 mil
102 µm
152 µm
130 µm
160 µm
21
193 x 193 µm
193 x 193 µm
127 x 127 µm
115 x 115 µm
165 x 165 µm
—
98/1/1 Al/Cu/Si
98/1/1 Al/Cu/Si
98/1/1 Al/Cu/Si
Packaging
5" Wafer
200 x 200 mils
(344Die)
400 x 400 mils
(87 Die)
Sawed 5" Wafer
36 per tray 200 x 200
9 per tray 400 x 400
Waffle Pack
Call For
Availability
98/1/1 Al/Cu/Si
98/1/1 Al/Cu/Si
98/1/1 Al/Cu/Si
5" Wafer
200 x 200 mils
(344 Die)
5" Wafer
150 x 150 mils
(682 die)
5" Wafer
200 x 200 mils
(344 Die)
400 x 400 mils
(87 Die)
Sawed 5" Wafer
36 per tray 200 x 200
Waffle Pack
Sawed 5" Wafer
25 per tray 2" sq
Waffle Pack
Sawed 5" Wafer
25 per tray 2" sq
Waffle Pack
Call For
Availability
Call For
Availability
Call For
Availability
Part Numbers:
5" Wafer
Uncut Wafer* 250 x 250 mils
(243) Die
Tray
Sawed 5" Wafer
25 per tray 2" sq
Waffle Pack
For
Tape and Reel Call
Availability
5" Wafer
500 x 500 mils
(46 Die)
Sawed 5" Wafer
9 per tray 2" sq
Waffle Pack
Call For
Availability
Notes












PB08-200x200
PB08-400x400
PST02-150x150
Part Number System
* Die count represents expected yield per wafer.
All die is packaged in waffle pack trays unless otherwise specified.
All test wafers are currently 5" diameter and are 0.635mm thick.
Passivation is one-micron thick plasma Nitride with round
via openings.
The potential multiple is the number of die repeats on the wafer. With the wafer orientated flat down, a right hand coordinate
system applies.
Die size is from scribe line to center-to-center. Scribe width is 0.05mm
passivated. Each bump is electrically connected to one other bump
and isolated from all others to facilitate electrical test.
Bump pitch is defined as center-to-center distance between
passivation openings.
Bump height is defined as silicon surface to the top of the bump.
Bump diameter is defined as the maximum diameter.
UBM = Under Bump Metallurgy
Test board is not available for the PB06 package.
Lead-free parts are available with 95.5% Sn/ 3.5% Ag/ 1.0% Cu alloy.
Unbumped wafers are available upon special request.
PB=Perimeter Bump
FA=Full Array
(minus corner bumps)
PST02=Thermal Device
PB06-200x200
PB06-400x400
PB06-400x600
200 x 200
400 x 400
400 x 600
152µm, 6mil
89µm
—
85µm
112
PB18–250x250-EUT
Alloy Type
EUT=Eutectic (Sn/Pb)
LF2=PB Free
Die Dimensions
L x W (mil)
Pitch (mil)
 Add “WR” to end of part number for Wafer Cut and left in Seal Ring.
 Add “TR” to end of part number for die on Tape and Reel.
 Add “EUT” to end of part number for Eutectic.
 Add “LF2” to end of part number for Lead-Free.
 Add “W” to end of part number for Uncut Wafer.
 Add “unbumped” to end of part number for unbumped wafer/die.
Solder Bump
FCT Bump Structure
Al, Ni, Cu UBM
Die Passivation
Al Pad
Die
For kits see pages 71, 80 and 81 .
18
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
FlipChip
International
Flip Chip
Lead-Free Die
Flip Chips are used in evaluating assembly techniques, board continuity, temperature cycle life test evaluation, underfill processes and other
generic Flip Chip evaluations. When using Lead-Free Flip Chips, consideration needs to be given to the appropriate flux, underfill, temperature
profile, and pad finish for the assembly. Many companies are developing
and qualifying alternative pad finishes such as immersion Sn. Lead-Free
Flip Chips address the need for environmentally conscious assemblies as
well as Alpha particle tolerant packaging.



All Flip Chips are available Lead-Free with Alloy LF2 composition
95.5% Sn /3.5% Ag /1.0% Cu.
When ordering Lead-Free Flip Chips, add “LF2” to end of part number.
LF2 was introduced by FCT (the acronym is Lead-Free #2).
For kits see pages 71, 80 and 81.
Daisy-Chain Patterns
PB08-200x200
PB08-400x400
66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45
67
44
68
43
69
42
70
41
71
40
72
39
73
38
74
37
75
36
76
35
77
34
78
33
79
32
80
31
81
30
82
29
83
28
84
27
85
26
86
25
87
24
88
23
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
122
101 100
144
67
145
66
176
1
22
Die size: 5.08mm sq.
61
44
23
PB18-250x250
60
49
48
84
37
85
36
36 35 34 33 32 31 30 29 28 27 26 25
37
24
38
23
39
22
40
21
41
20
42
19
43
18
44
17
45
16
46
15
47
96
1
12
25
24
13
Die size: 12.70mm sq.
FA10-200x200
1
15
33
51
69
87
105
123
141
159
177
195
213
231
249
267
285
303
16
34
52
70
88
106
124
142
160
178
196
214
232
250
268
286
304
The PB08 daisy-chain test die is designed with an 8-mil (203µm) solder
bump pitch around the perimeter of the device. Each die contains 99 I/O
(44 daisy-chain pairs). The device comes in two sizes: 200mil x 200mil
and 400mil x 400mil. The PB08-400x400 device consists of a 4 PB08200x200 devices without the inner I/O’s bumped.
Die size: 10.16mm sq.
PB18-500x500
72
73
89
48
1
The PB18 daisy-chain test die is designed with an 18-mil solder bump
pitch around the perimeter of the device. Each die contains 48 I/O
(24 daisy-chain pairs). The device comes in two sizes: 250mil x 250mil
(6.35mm x 6.35mm) and 500mil x 500mil (12.7mm x 12.7mm). The PB18500x500 device consists of 4 PB18-250x250 devices without the inner
I/O’s bumped.
14
2
4
3
5
6
7
8
13
9 10 11 12
Die size: 6.35mm sq.
The FA10 daisy-chain test die is designed with a 10-mil pitch (254µm) array of solder bumps across the surface of the die. They are configured in
“quad” structures for versatile assembly and evaluation options. The array pattern is an 18 row x 18 column footprint minus four pairs of corner
bumps. The addition of a key bump in the upper left corner addresses
alignment requirements. Each die contains 317 I/O (158 daisy-chain
pairs). This device is offered with eutectic or Pb-free solder bumps.
PB06-200x200
1
112
85
317
Die size: 5.08mm sq.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
84
28
29
57
56
Die size: 5.08mm sq.
19
Dummy Components
About Lead-Free Flip Chips
Dummy Components
Flip Chip Glossary
FlipChip
International
Al/NiV/Cu Combination of thin film conductor layers that are sputtered and
then etched to form the UBM pads in FlipChip’s SFC, Repassivation, UltraCSP,
and Polymer Collar WLP flows. Also forms the redistribution runners in the
UltraCSP flow. Also known as one of the combinations of metals used to form the
Under-Bump-Metalurgy (UBM).
Maximum DNP DNP stands for Distance to Neutral Point. A maximum DNP is the
distance from the furthest I/O (solder bump) to the minimum stress point on the die.
For a symmetric array pattern, it is also the geometric center of the die.
Array A pattern of columns and rows. Used to describe bumps that are evenly spaced
in rows and columns all across the die surface and not just near the edges.
NSMD (Non-Solder Mask Defined) PCB Copper pads that are smaller than the
solder mask openings.
Array Pattern Number of rows and columns in a matrix-designed layout of solder
balls. Can be a fully formed array or may be partially depopulated, with the absence of
bumps toward the center of the array.
Pad Metal area on the die that the bump or wire is attached to (also see, Bond Pad).
Ball Diameter Diameter of the pre-formed solder sphere used in Wafer Level Packaging. Typical ball diameters are 300, 350, 400, and 500µm.
BCB (Benzocyclobutene) Dielectric coating that provides an additional passivation
layer on top of the IC passivation for Repassivation, Redistribution, UltraCSP, and
Polymer Collar WLP designs.
BCB1 Opening (Via) Opening in the first layer of BCB where IC aluminum pads will
be re-routed to facilitate a certain UltraCSP designs.
MDIF (Mask Design Information Form) FlipChip information form that provides FlipChip with a description of the wafer, the die, and how you would like to bump it.
Partial Die An incomplete die usually located on the edge of the wafer.
Passivation Uppermost layer on an IC. Used for circuit protection and cushioning.
Typically Nitride, Polyimide, Oxide, or Oxi-Nitride.
Peripheral The edge of the die. Used to describe bumps that are placed near the
edges of the die.
PO (Passivation Opening) Opening in the passivation over the I/O final metal
bond pads.
PCB Printed Circuit Board
BCB2 Opening (Via) Opening in the second layer of BCB which will define the metal
exposure (wettable area) of the UBM pad. BCB2 will cover all re-distribution traces to
protect metal runners from corrosion and physical damage.
Pitch The linear distance between the centers of two adjacent I/Os or bumps.
Bond Pad Exposed final metal portion of the device I/O (also see, Pad).
Repassivation Layer of Passivation added by FlipChip as part of the bumping process. This layer adds robustness and can correct inappropriate Passivation Openings
and Final Metal Pads. The repassivation layer is typically BCB or Spheron Polymer.
Bump A small metal alloy deposit on the die that is melted to a pad on the board to
form the electrical connection between the board and the die.
Bump Diameter The widest measurement through the center cross-section of a
re-flowed bump.
Bump Height Vertical measurement from the top of the device passivation to the
top of the bump after reflow (not yet attached to PCB substrate). After assembly, the
analogous measurement is called “stand-off height”.
Bump Shear Shear value (force measured in grams) and failure mode measured
during ball shear test.
Bump Standoff Height Measurement from FR4 surface to silicon surface.
Cu Pad Solder receiving pad on the substrate that is Cu etch-defined.
PIQ (Polyimide Isoindoro Quinazorindione) Dielectric polymer material used as a
passivation layer in some semiconductor devices.
RDL (Re-Distribution Line) Metal deposited at the same time as the UBM pad for the
purpose of re-routing I/O sites, for example from edge-distributed bond pads used
in wire-bonded applications, to an array layout. Also broadly used to describe the
process of rerouting I/O.
SMD (Solder Mask Defined) PCB pads that have solder-mask openings smaller than
the copper pads.
Solder Mask A layer of passivation material covered on top of outer-layer conductor (Cu) that has openings to allow solder wet to the Cu pads and prevents solder
bridging in the rest area. These openings are called Solder Mask Openings.
Die (Chip) A square or rectangular piece cut from the wafer that contains the
electrical pattern and is repeated in several rows and columns across the top surface
of the wafer.
Solder Paste Reflowable pre-mixed solder paste that is printed and formed into a
solder sphere. Provides the electrical connection between the die and the package
substrate or printed circuit board. Since it is premixed, it provides for excellent
composition control. Typically made up of two to four metals.
Die (Chip) Size The active silicon chip area bounded on the outside by the
scribe street.
Solder/Flux Ratio The volume ratio of flux to solder in the solder paste. A 50/50 ratio
of solder to flux is recommended.
Die (Chip) Stepping Distance The distance between one point on a die and the
same point on an adjacent die. This measurement takes into account both the die size
along with the width of the street.
Spheron™ New FlipChip WL-CSP product predominately used in high
frequency applications.
DNP Distance to neutral point. The distance from an I/O to the center of the die.
Maximum DNP defines the largest array size for a given process technology that will
meet the minimum thermal fatigue performance criteria as established by FlipChip.
EliteCSP A WLCSP product line that is specifically designed for bumping applications
that require rapid cycle times, quick time to market, low bumping costs, and high
temperature stability. Utilizes a plated Nickel UBM.
ESD (Electrostatic discharge) The release of static electricity from one surface to
another. Because IC devices and assemblies may be damaged by ESD, precautions are
taken to eliminate ESD in IC manufacturing and test areas.
Final Metal Uppermost metal layer in a device. This layer is usually covered with a
thick dielectric passivation.
Flip Chip A die that has bumps to create the electrical connection between
the die and the board. So called because the die has to be flipped over in order
to be assembled.
I/O The location of the signal interfaces that contacts to the “outside” world.
I/O Final Metal Bond Pad Same as I/O.
I/O Metal Pad Size Size of metal bond pad on an I/O, as manufactured during
normal IC processing.
20
Stencil Aperture Opening The laser-cut, Nickel Additive (E-Fab), Chemically Etched,
or Electroform aperture openings on the solder paste stencil.
Stepping Distance Linear measurements in both the x and y directions comprising die size and to the center of the scribe streets on all four sides. (see die
stepping distance).
Street The non-electrically active area on the wafer in between the die. Also known
as the Saw Street.
UBM (Under-Bump-Metallurgy) The metal stack that is deposited under the bump
as part of the solder bumping process. It has the combined features of adhesion
layer, diffusion barrier, wetting layer and oxidation protection layer. FlipChip uses
NiV/Cu. Al/NiV/Cu, or Al/NiV/Cu/Ti/NiV/Cu as the UBM
Wafer A round flat disk most often made of silicon that is patterned with several die
by semiconductor thin-films processing. Each wafer has a flat or notch cut into its
edge to help with aligning or orienting the wafer.
Wafer Map A representation of the wafer that notes where all of the defective die
are located.
Wire Bond The electrical connection consisting partially of a wire that bridges the
die to the board.
WLP Wafer level package
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Daisy-Chain Patterns
!
NEW
39
Daisy Chain “Even” Pattern
29
40
28
Example of daisy-chain “even” pattern for leadframe packages. Pin 1-2,
3-4, 5-6, 7-8, etc.
PLCC44
Internal Wire Bond
44
1
Continuity testing requires dummy components to contain
daisy-chain connections.
The standard daisy chain pattern for non-BGA IC’s is Even.
There is no standard daisy chain pattern for BGA, Flip Chip and
chip scale packages.
6
18
7
17
Get The Latest Lead-Free Information!
Pb
For the latest information on all of our products, package
outline drawings and daisy-chain (dog-bone) patterns,
please see our website www.practicalcomponents.com.
Want More Lead-Free Information?
For additional Lead-Free information see:
Experts Share Their Insights on Lead-Free
www.leadfreemagazine.com.
NOW
BLE!
AVAIL A
Pb-Free HASL PCB Finish
One of the most popular final finishes is known as Hot Air
Surface Leveling otherwise known as HASL. A viable lead free
HASL process utilizing the Nihon Superior SN100CL lead free
solder alloy is available.
Testing to date has shown that the SN100CL lead free HASL
process offers superior solderability to the final finishes on the
market today. All of the final finishes available on the market
today have both their merits and demerits. Many in the board
industry are concerned about switching from HASL to a less
forgiving final finish as they transition to the up and coming
lead free era. Our process should ease these concerns. This
process is also directed towards those who are not completely
satisfied with their current final finish. There are two major
lead free solder alloys on the market today: SN100CL and the
SAC alloy. The SN100CL nominal composition is a stabilized
eutectic tin copper. The SAC 305 alloy consists of tin, copper
and 3% silver.
The Advantages of SN100CL Lead-Free HASL
● A robust process.
● Improved shelf life compared to 63/37 (2).
● Minimal temperature increase in the solder pot
(Solder pot temp. est. 485-500ºF).
● No copper attack (e.g., copper traces, holes on circuit board).
● Minimal stainless steel attack. SAC 305 alloy rapidly attacks
Stainless Steel.
● Superior wetting yielding a more uniform and flat surface.
● Capable of handling very fine pitch due to excellent wetting.
● Compatible with both conventional 63/37 and lead free
final assembly.
● More economical (No Silver).
Call Practical for availability.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
21
PBGA
Dummy Components
Plastic Ball Grid Array
Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs
are designed for low inductance, improved thermal operation and
enhanced SMT-ability.
All PBGAs listed on this page are daisy-chained and
available lead-free.
PBGA Plastic Ball Grid Array 1.0mm Pitch
Part Number
I/O Count
Pitch
Body Size
Ball Matrix
A-PBGA144-1.0mm-13mm
A-PBGA156-1.0mm-15mm
A-PBGA160-1.0mm-15mm
A-PBGA196-1.0mm-15mm
A-PBGA208-1.0mm-17mm
A-PBGA256-1.0mm-17mm
A-PBGA288-1.0mm-23mm
A-PBGA289-1.0mm-19mm
A-PBGA324-1.0mm-19mm
A-PBGA324-1.0mm-23mm
A-PBGA484-1.0mm-27mm
A-PBGA516-1.0mm-31mm
A-PBGA580-1.0mm-35mm
A-PBGA676-1.0mm-27mm
A-PBGA680-1.0mm-35mm
A-PBGA928-1.0mm-40mm
A-PBGA1156-1.0mm-35mm
144
156
160
196
208
256
288
289
324
324
484
516
580
676
680
928
1,156
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
13mm
15mm
15mm
15mm
17mm
17mm
23mm
19mm
19mm
23mm
27mm
31mm
35mm
27mm
35mm
40mm
35mm
12 x 12
14 x 14
14 x 14
14 x 14
16 x 16
16 x 16
22 x 22
17 x 17
18 x 18
22 x 22
26 x 26
30 x 30
34 x 34
26 x 26
34 x 34
39 x 39
34 x 34
Notes













Ball
Alignment
Full Array
Perimeter
Perimeter
Full Array
Perimeter
Full Array
Perimeter
Full Array
Full Array
Perimeter
Perimeter
Perimeter
Perimeter
Full Array
Perimeter
Perimeter
Full Array
Quantity
Per Tray
160
126
126
126
90
90
60
84
84
60
40
27
24
40
24
21
24
Available
Lead-Free Alloys
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
SAC405, SAC305 or Sn3.5Ag
Part Number System
Overall thickness of 1.0mm pitch PBGA packages will vary (please call
for more details).
Parts are packaged in JEDEC trays.
Call for tape and reel quantity and availability.
Solder ball material is eutectic 63/37 SnPb.
All components are daisy-chained.
Daisy-chained connections are connections between I/O
(input/output) of the component.
BT (Bismaleimide-Triazine) substrates.
JEDEC MS-034 standard outlines.
Ball diameter varies (see chart).
BGA packages should be baked at 125ºC for 24 hours prior to assembly
to prevent delamination during the assembly process.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available.
Sn3.5Ag is also available (call for availability).
PBGA's are not available without solder balls.
Amkor
A-PBGA144–1.0mm–13mm
Plastic Ball
Grid Array
I/O Count
Body Size
Pitch
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
For kits see pages 56, 57, 58, 60,
63, 64, 73, 79 and 82.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
22
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
PBGA
Plastic Ball Grid Array
Some PBGAs are available
daisy-chained. All PBGAs are
available lead-free.
Dummy Components
Amkor Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly
processes and designs for low cost, high performance applications.
PBGAs are designed for low inductance, improved thermal operation
and enhanced SMT ability.
PBGA Plastic Ball Grid Array 1.5mm/1.27mm Pitch
Part Number
I/O Count
Pitch
Body Size
Ball Matrix
A-PBGA208-1.27mm-23mm*
A-PBGA217-1.27mm-23mm*
A-PBGA256-1.27mm-27mm*
A-PBGA272-1.27mm-27mm*
A-PBGA329-1.27mm-31mm
A-PBGA356-1.27mm-27mm*
A-PBGA388-1.27mm-35mm*
A-PBGA420-1.27mm-35mm
A-PBGA456-1.27mm-35mm
A-PBGA564-1.27mm-40mm*
208
217
256
272
329
356
388
420
456
564
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
23mm
23mm
27mm
27mm
31mm
27mm
35mm
35mm
35mm
40mm
17 x 17
17 x 17
20 x 20
20 x 20
23 x 23
20 x 20
26 x 26
26 x 26
26 x 26
30 x 30
Notes












Ball
Alignment
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Quantity
Per Tray
60
60
40
40
27
40
24
24
24
21
Available
Lead-Free Alloys
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
SAC405, or SAC305 or Sn3.5Ag
Part Number System
* = DC available
Parts are packaged in JEDEC trays.
Call for tape and reel quantity and availability.
Solder ball material is eutectic 63/37 SnPb.
Daisy-chained connections are connections between I/O
(input/output) of the component.
BT (Bismaleimide-Triazine) substrates.
JEDEC MS-034 standard outlines.
Ball diameter varies (see chart).
BGA packages should be baked at 125ºC for 24 hours prior to assembly
to prevent delamination during the assembly process.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for
SnAg availability)
PBGA‘s are not available without solder balls.
Amkor
A-PBGA208–1.27mm–23mm
Plastic Ball
Grid Array
I/O Count
Package
Pitch
PBGA
PBGA
PBGA
PBGA
1.00
1.00
1.27
1.50
0.50
0.63
0.76
0.76
(1)
(2)
Units = mm
Notes
Solder Ball
Land On
Package and
Board
Solder Ball
Height on
Package
(B)
Solder Joint
Height After
SMT*
(C)
0.45
0.45
0.63
0.63
0.40
0.55
0.60
0.60
0.32
0.48
0.52
0.52
*Assumptions:
Pitch
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
Mold Compound
Die Attach
Au Wire
Solder
Mask
Die
Via
Eutectic Solder Ball
Rigid Laminate
Note: Drawing not to scale.
Solder Ball Diameter/Height
(As Received)
Solder
Ball
Diameter
(A)
Body Size
B
A
Diameter = Height
Solder Ball Height
After Ball Attach
After Reflow
C
Motherboard
5 mils Solder Paste
Solder Mask Defined Pad
(1) applies to 13, 15 and 17mm packages.
(2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages.
For kits see pages 53 57, 60, 62,
64, 73 and 82.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
23
SBGA
Dummy Components
SuperBGA®
SuperBGA® (SBGA) package is a very low profile, high-power BGA. The IC
is directly attached to an integrated copper heatsink. Since the IC and
the I/O are on the same side, signal vias are eliminated.
SBGA SuperBGA® 1.27mm Pitch
Part Number
I/O Count
Pitch
Body Size
Ball Matrix
A-SBGA256-1.27mm-27mm
A-SBGA304-1.27mm-31mm
A-SBGA352-1.27mm-35mm
A-SBGA432-1.27mm-40mm
A-SBGA520-1.27mm-40mm
A-SBGA560-1.27mm-42.5mm
A-SBGA600-1.27mm-45mm
256
304
352
432
520
560
600
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
27mm
31mm
35mm
40mm
40mm
42.5mm
45mm
20 x 20
23 x 23
26 x 26
31 x 31
31 x 31
33 x 33
35 x 35
Notes
Ball
Alignment
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Quantity
Per Tray
40
27
24
21
21
12
12
Part Number System
Superior thermal performance.
 Light weight
 Low profile (1.4mm mounted)
 Moisture resistant (JEDEC level 3)
 JEDEC MO-192 standard outlines
 Enhanced electrical performance > 1 GHz
 Parts are packaged in JEDEC trays.
 Call for tape and reel quantity and availability.
 Solder ball material is eutectic 63/37 SnPb.
 BGA packages should be baked at 125°C for 24 hours prior to assembly
to prevent delamination during assembly process.
 Parts can be baked and dry-packed.
 All components are daisy-chained except for 520 I/O.
 Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also
available (call for availablity).
 SBGA‘s are not available without solder balls.
Amkor

A-SBGA256–1.27mm–27mm
SuperBGA
®
I/O Count
Pitch
 Add “TR” to end of part number for Tape and Reel.
 Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
Substrate
Die
Copper Heat Spreader
Copper Ring
Solder Balls
Wires
Mounting Surface
Encapsulant
Resin Dam (Part of Substrate)
Note: Drawing not to scale.
Solder Ball Height
After Ball Attach
Solder Ball Diameter/Height
(As Received)
B
A
Diameter = Height
Pb
Body Size
After Reflow
Looking for Lead-Free?
C
This symbol indicates that
lead-free parts are available!
Motherboard
Package
Pitch
A
B
C
SBGA
1.27
.76
.62
.52
All units in mm.
Assumptions: 5 mils solder paste. Solder mask defined pad. Typical
motherboard no solder mask defined pad:
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.



24
0.50 Pitch – 0.28
0.80 Pitch – 0.30
1.00 Pitch – 0.38
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
QFP
Quad Flat Pack
Daisy-Chain And Lead-Free Parts Available!
PCB coplanarity is established. Coplanarity ensures the last lead can
be placed on the board. The standard for QFP coplanarity is ±4 mils.
PowerQuad2® and PowerQuad4® QFPs are also available from Amkor.
PowerQuad®s offer exceptional thermal and electrical performance that
is designed with solid copper heatsink. Call Practical for more details.
QFP Plastic Quad Flat Pack
Part Number
.40mm Pitch
QFP256-28mm-.4mm-2.6
.50mm Pitch
QFP64-10mm-.50mm-3.2
QFP64-10mm-.50mm-3.9
QFP100-14mm-.5mm-3.2
QFP100-14mm-.5mm-3.9
QFP128-14x20mm-.5mm-3.2
QFP128-14x20mm-.5mm-3.9
QFP208-28mm-.5mm-2.6
QFP208-28mm-.5mm-3.2
QFP240-32mm-.5mm-2.6
QFP304-40mm-.5mm-2.6
.65mm Pitch
QFP52-10mm-.65mm-3.2
QFP52-10mm-.65mm-3.9
QFP80-14mm-.65mm-3.2
QFP80-14mm-.65mm-3.9
QFP100-14x20mm-.65mm-3.2
QFP100-14x20mm-.65mm-3.9
QFP144-28mm-.65mm-2.6
QFP144-28mm-.65mm-3.2
QFP160-28mm-.65mm-2.6
QFP160-28mm-.65mm-3.2
QFP160-28mm-.65mm-3.9
.80mm Pitch
QFP44-10mm-.8mm-3.2
QFP44-10mm-.8mm-3.9
QFP64-14mm-.8mm-3.2
QFP64-14mm-.8mm-3.9
QFP80-14x20mm-.8mm-3.2
QFP80-14x20mm-.8mm-3.9
QFP120-28mm-.8mm-2.6
QFP120-28mm-.8mm-3.2
QFP128-28mm-.8mm-2.6
QFP128-28mm-.8mm-3.2
1.00mm Pitch
QFP52-14mm-1.0mm-3.2
QFP52-14mm-1.0mm-3.9
QFP64-14x20mm-1.0mm-3.2
QFP64-14x20mm-1.0mm-3.9
Number Body
of Pins Size
Body
Thickness
Lead Pitch
Footprint
Quantity
Per Tray
Tape
Width
Tape
Pitch
Quantity
13" Reel
Available
Lead-Free Finishes
256
28mm sq
3.37mm
.40mm
2.6mm
24
44
40
200
Sn or SnBi
64
64
100
100
128
128
208
208
240
304
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
32mm sq
40mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.4mm
3.8mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
2.6mm
96
96
84
84
66
66
24
24
24
12
24
24
32
32
44
44
44
44
56
n/a
24
24
24
24
32
32
40
40
44
n/a
500
500
350
350
200
200
200
200
250
—
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
52
80
80
100
100
144
144
160
160
160
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
28mm sq
28mm sq
28mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.37mm
3.37mm
3.37mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
3.2mm
3.9mm
96
96
84
84
66
66
24
24
24
24
24
24
24
32
32
44
44
44
44
44
44
44
24
24
24
24
32
32
40
40
40
40
40
500
500
350
350
200
200
200
200
200
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
44
44
64
64
80
80
120
120
128
128
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
28mm sq
28mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.37mm
3.37mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
3.2mm
96
96
84
84
66
66
24
24
24
24
24
24
32
32
44
44
44
44
44
44
24
24
24
24
32
32
40
40
40
40
500
500
350
350
200
200
200
200
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
52
64
64
14mm sq
14mm sq
14 x 20mm
14 x 20mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
1.00mm
1.00mm
1.00mm
1.00mm
3.2mm
3.9mm
3.2mm
3.9mm
84
84
66
66
32
32
44
44
24
24
32
32
350
350
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Notes





Part Number System
All QFPs are standard in JEDEC trays.
Tray quantities may vary.
Parts available on Tape and Reel upon
special request.
Lead-free parts are available with SnBi or 100% Matte Sn finish.
PowerQuad® 2 & 4 thermal parts available. Call for availability.
Quad
Flat Pack
QFP44–10mm–.8mm–3.9mm
Lead
Footprint
Body
Lead Pitch
Size
 Add “TR” to end of part number for Tape and Reel.
 Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
Number of Pins
For kits see pages 53, 57, 60, 62,
64, 73 and 82.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
25
Dummy Components
Quad Flat Pack (QFP) components have four sides with leads extending from the component body on all four sides. QFP components come
packaged in trays or on tape and reel to protect the component leads
that can be easily damaged. An important measurement for QFPs is
coplanarity. When the first lead from the component is placed on the
LQFP
Dummy Components
Low Profile Quad Flat Pack
Low Profile Quad Flat Pack (LQFP) packages provide the same benefit
of the metric QFP packages, but are thinner (body thickness of 1.4mm)
and have a standard lead-frame footprint (2.0mm lead footprint).
Daisy-Chain And Lead-Free Parts Available!
LQFPs help to solve issues such as increasing board density, die shrink
programs, thin end-product profile and portability. Lead counts range
from 32 to 256. Body sizes range from 7 x 7mm to 28 x 28mm. Copper
lead-frames are used for the LQFP package. Lead pitches available for
LQFP package are 0.4mm, 0.5mm, 0.65mm and 0.8mm.
PowerQuad® 2 and 4 LQFPs are available. Call
Practical for more details.
LQFP Low Profile Quad Flat Pack 1.4mm Thick
Part Number
.4mm Pitch
LQFP64-7mm-.4mm-2.0
LQFP120-14mm-.4mm-2.0
LQFP128-14mm-.4mm-2.0
LQFP176-20mm-.4mm-2.0
LQFP216-24mm-.4mm-2.0
LQFP256-28mm-.4mm-2.0
.5mm Pitch
LQFP48-7mm-.5mm-2.0
LQFP64-10mm-.5mm-2.0
LQFP100-14mm-.5mm-2.0
LQFP128-14x20mm-.5mm-2.0
LQFP128-20mm-.5mm-2.0
LQFP144-20mm-.5mm-2.0*
LQFP160-24mm-.5mm-2.0
LQFP176-24mm-.5mm-2.0*
LQFP208-28mm-.5mm-2.0*
.65mm Pitch
LQFP52-10mm-.65mm-2.0
LQFP80-14mm-.65mm-2.0
LQFP100-14x20mm-.65mm-2.0
.8mm Pitch
LQFP32-7mm-.8mm-2.0
LQFP44-10mm-.8mm-2.0
LQFP64-14mm-.8mm-2.0
Number
of Pins
Body
Size
Lead
Pitch
Quantity
Per Tray
Tape
Width
Tape
Pitch
Quantity
Per Reel
Available
Lead-Free Finishes
64
120
128
176
216
256
7mm sq
14mm sq
14mm sq
20mm sq
24mm sq
28mm sq
.4mm
.4mm
.4mm
.4mm
.4mm
.4mm
250
90
90
60
40
24
16mm
32mm
32mm
44mm
44mm
44mm
12mm
24mm
24mm
24mm
32mm
40mm
1,000
750
750
500
500
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
48
64
100
128
128
144
160
176
208
7mm sq
10mm sq
14mm sq
14 x 20mm
20mm sq
20mm sq
24mm sq
24mm sq
28mm sq
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
250
160
90
72
60
60
40
40
36
16mm
24mm
32mm
44mm
44mm
44mm
44mm
44mm
44mm
12mm
24mm
24mm
32mm
24mm
24mm
32mm
32mm
40mm
1,000
1,000
750
500
500
750
500
500
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
80
100
10mm sq
14mm sq
14x20mm
.65mm
.65mm
.65mm
160
90
72
24mm
32mm
44mm
24mm
24mm
32mm
1,000
750
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
32
44
64
7mm sq
10mm sq
14mm sq
.8mm
.8mm
.8mm
250
160
90
16mm
24mm
32mm
12mm
24mm
24mm
1,000
1,000
750
Sn or SnBi
Sn or SnBi
Sn or SnBi
Notes







Part Number System
* = Available as an ExposedPad™ L/TQFP Package by Amkor. The
ExposedPad™ L/TQFP can increase heat dissipation by as much as 110%
over a standard L/TQFP. The ExposedPad™ L/TQFP is a cost effective,
high frequency leadframe solution to thermal management when the
die attach pad is soldered to the PCB.
All LQFPs are standard in trays.
LQFPs have a body thickness of 1.4mm.
Tray quantity may vary.
Tape type is plastic.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with SnBi or 100% Matte Sn finish.
Low Profile
Quad Flat Pack
LQFP48–7mm–.5mm–2.0
Number of Pins
Body
Size
Lead
Footprint
Lead Pitch
 Add “TR” to end of part number for Tape and Reel.
 Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
For recommended kits see pages
58, 60, 69, 71, 73, 79, and 82.
For drawings, please visit our web site at
www.practicalcomponents.com.
26
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
TQFP
Thin Quad Flat Pack
Dummy Components
Thin Quad Flat Pack (TQFP) packages provide the same benefit of the
metric QFP package, but are thinner (body thickness of 1.0mm) and have
a standard lead-frame footprint (2.0mm lead footprint). TQFPs are helping to solve issues such as increasing board density, die shrink programs,
thin end-product profile and portability. Lead counts range from 32 to
176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames
are used for the TQFP package. Lead pitches available for TQFP package
are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.
TQFP Thin Quad Flat Pack 1.0mm Thick
Number
of Pins
32
32
40
44
48
52
64
64
64
80
80
100
120
128
128
144
176
Part Number
A-TQFP32-5mm-.5mm-2.0*
A-TQFP32-7mm-.8mm-2.0*
A-TQFP40-5mm-.4mm-2.0*
A-TQFP44-10mm-.8mm-2.0*
A-TQFP48-7mm-.5mm-2.0 *
A-TQFP52-10mm-.65mm-2.0 *
A-TQFP64-7mm-.4mm-2.0*
A-TQFP64-10mm-.5mm-2.0*
A-TQFP64-14mm-.8mm-2.0 *
A-TQFP80-12mm-.5mm-2.0 *
A-TQFP80-14mm-.65mm-2.0*
A-TQFP100-14mm-.5mm-2.0*
A-TQFP120-14mm-.4mm-2.0 *
A-TQFP128-14mm-.4mm-2.0*
A-TQFP128-20mm-.5mm-2.0 *
A-TQFP144-20mm-.5mm-2.0 *
A-TQFP176-20mm-.4mm-2.0 *
Body
Size
5mm sq
7mm sq
5mm sq
10mm sq
7mm sq
10mm sq
7mm sq
10mm sq
14mm sq
12mm sq
14mm sq
14mm sq
14mm sq
14mm sq
20mm sq
20mm sq
20mm sq
Lead
Pitch
.5mm
.8mm
.4mm
.8mm
.5mm
.65mm
.4mm
.5mm
.8mm
.5mm
.65mm
.5mm
.4mm
.4mm
.5mm
.5mm
.4mm
Notes








Footprint
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
Quantity
Per Tray
360
250
360
160
250
160
250
160
90
119
90
90
90
90
60
60
60
Tape
Width
16mm
16mm
16mm
24mm
16mm
24mm
16mm
24mm
32mm
24mm
32mm
32mm
32mm
32mm
44mm
44mm
44mm
Part Number System
* = Available as an Exposed Pad L/TQFP Package by Amkor. The
ExposedPad™ L/TQFP can increase heat dissipation by as much as 110%
over a standard L/TQFP. The ExposedPad™ L/TQFP is a cost effective,
high frequency leadframe solution to thermal management when the
die attach pad is soldered to the PCB.
TQFP is available in die up configurations in 1.0mm thickness only.
5 x 5mm to 20 x 20mm body size (JEDEC Standard).
32 to 176 lead counts.
Copper leadframes.
1.0mm body thickness for TQFP.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with SnBi or 100% Matte Sn finish.
Tape
Pitch
12mm
12mm
12mm
16mm
12mm
16mm
12mm
16mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
Quantity
Per Reel
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
750
1,000
750
750
750
750
500
500
500
Lead
Footprint
Lead Pitch
Body Size
A-TQFP32-5mm-.5mm-2.0
Amkor
Thin Quad Flat Pack
Number of Pins
 Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
 Add “TR” to end of part number for Tape and Reel.
 Add “LF” to end of part number for Lead-Free, i.e Sn or SnBi.
TQFP Package
Cu Leadframe
Die Attach
Adhesive
Mold
Compound
Au Wire
1.0mm
Die
Die Attach Pad
Exposed Pad L/TQFP Package
Mold
Compound
Cu Leadframe
Die Up (Standard)
Au Wire
Die Attach
Exposed Pad
Mold
Compound
Die
Die
Exposed Pad
Die Attach
Die Up (Standard)
Cu Leadframe
Au Wire
Die Down (Inverted)
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
27
CQFP
Ceramic Quad Flat Pack
Dummy Components
CQFPs are hermetic packages consisting of true pieces of dry pressed
ceramic surrounding a uniformed leadframe with tie bar attached. Lead
counts for this package range from 14 to 304, with lead pitch ranging
from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be
solder-coated by special request. Lids are optional for CQFPs, which are
sealed over the package cavity at temperatures from 400° to 460° C.
CQFP Ceramic Quad Flat Pack
Part Number
52CQFP-19.0mm-1.27mm
68CQFP-24.1mm-1.27mm
84CQFP-16.5mm-.65mm
100CQFP-19.0mm-.65mm
132CQFP-24.1mm-.65mm
144CQFP-26.6mm-.65mm
172CQFP-29.2mm-.65mm
196CQFP-32.0mm-.50mm
Body Size
(Inch)
.750" sq
.950" sq
.650" sq
.750" sq
.950" sq
1.050" sq
1.150" sq
1.260" sq
Number
of Pins
52
68
84
100
132
144
172
196
Notes










(mm)
19.0mm sq
24.1mm sq
16.5mm sq
19.0mm sq
24.1mm sq
26.6mm sq
29.2mm sq
32.0mm sq
Pitch
1.27mm
1.27mm
.65mm
.65mm
.65mm
.65mm
.65mm
.50mm
Part Number System
52CQFP–19.0mm–1.27mm
I/O Count
CQFPs are available with or without combo lid.
Pins are flat (sandwiched) with tie bar.
Parts are packaged in non-JEDEC trays.
Due to the custom nature of the package, body size and dimensions
can change without notice.
Parts available with a daisy-chain configuration upon request.
Other ceramic packages available upon request.
Glass or epoxy seal.
Footprint compatible with plastic QFP packages.
EIAJ and JEDEC standards.
Lead-frames are embedded into the glass to create both internal die
connection and external PCB connection.
Ceramic Quad
Flat Pack
Lead Pitch
Body Size
LCC
Leadless Ceramic Carrier
This surface mount package consists of a ceramic base that has metalized castellations/pads on the sides and bottom of the package. LCC
packages have pads on all four sides of the package. Lids for LCCs can be
either metal or ceramic. Lids are attached after die attach. This allows for
a hermetically sealed environment for the die.
LCC Leadless Ceramic Carrier
Part Number
16LCC-1.27mm-7.36x8.96mm
20LCC-1.27mm-8.90mm
28LCC-1.27mm-11.5mm
32LCC-1.27mm-11.4x14.0mm
40LCC-1.00mm-10.1mm
44LCC-1.27mm-16.5mm
48LCC-1.00mm-14.2mm
52LCC-1.27mm-19.0mm
68LCC-1.27mm-24.11mm
84LCC-1.27mm-29.2mm
Number of
Castellations
16
20
28
32
40
44
48
52
68
84
Notes





(mm)
7.36 x 8.96mm
8.90mm sq
11.50mm sq
11.40 x 14.00mm
10.10mm sq
16.50mm sq
14.20mm sq
19.00mm sq
24.11mm sq
29.20mm sq
Pitch
1.27mm
1.27mm
1.27mm
1.27mm
1.00mm
1.27mm
1.00mm
1.27mm
1.27mm
1.27mm
Part Number System
LCCs are available with or without combo lid.
Gold castellations are standard, but can be solder-tinned
with 100% Sn or SnPb alloy.
Parts are packaged in non-JEDEC trays.
Parts available with a daisy-chain configuration upon request.
Other types of ceramic packages not listed in catalog are available
upon request.
28
Body Size
(Inch)
.350" x .285"
.350" sq
.450" sq
.550" x .450"
.400" sq
.650" sq
.560" sq
.750" sq
.950" sq
1.150" sq
Number of
20LCC–1.27mm–8.90mm
Castellations
Leadless
Pitch
Ceramic Carrier
Body Size
For recommended kit see page 56.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
PLCC
Plastic Leaded Chip Carrier
Daisy-Chained And Lead-Free Parts Available!
Dummy Components
Plastic Leaded Chip Carriers (PLCC) are four-sided “J” Leaded Plastic
body packages. Lead counts range from 20 to 84. PLCC packages can be
square or rectangle. Body sizes range from .35" to 1.15". PLCCs are JEDEC
standard compliant. The PLCC “J” Lead configuration requires less board
space versus equivalent gull leaded components.
PLCC Plastic Leaded Chip Carrier
Part Number
(In Tubes)
PLCC20T
PLCC28T
PLCC32T
PLCC44T
PLCC52T
PLCC68T
PLCC84T
Pin Count
Body Size
20
28
32
44
52
68
84
8.8mm
11.4mm
11.4 x 13mm
16.5mm
19.0mm
24.1mm
29.2mm
Quantity
Per Tube
48
38
30
27
24
18
15
Part Number
(Tape and Reel)
PLCC20TR
PLCC28TR
PLCC32TR
PLCC44TR
PLCC52TR
PLCC68TR
PLCC84TR
Notes








Tape Width
Tape Pitch
16mm
24mm
24mm
32mm
32mm
44mm
44mm
12mm
16mm
16mm
24mm
24mm
32mm
36mm
Quantity
13" Reel
1,000
750
750
450/500
450
230/250
250
Part Number System
Plastic Leaded Chip Carrier
All PLCCs have “J” leads.
Standard lead pitch is 1.27mm (50 mils).
PLCCs are to JEDEC standards.
Tube quantity may vary.
13" reels are standard.
Parts available on Tape and Reel.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with 100% Matte Sn finish.
Packaging
Number of Pins
 Packaging: T=Tubes, TR=Tape and Reel.
 Add “Sn” to end of part number for Lead-Free.
Mold
Compound
Au Wire
J-Formed
Cu Leadframe
Die
For kits see pages 53, 55, 60, 62,
67, 70, 71, 79 and 82.
Die Attach Adhesive
Die Attach Pad
Z
G
A
H
PLCC20T
Y
X
Full Radius Optional
S J L
E
B
D C
P
W
Heel
L
T
Grid
Placement
Courtyard
C
PLCC Component Dimensions
Component
Identifier
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
L (mm)
Min
9.78
12.32
17.40
19.94
25.02
30.10
S (mm)
Max
10.03
12.57
17.65
20.19
25.27
30.35
Min
5.78
8.32
13.40
15.94
21.02
26.10
W (mm)
Max
6.53
9.07
14.15
16.69
21.77
26.85
Min
0.33
0.33
0.33
0.33
0.33
0.33
T (mm)
Max
0.53
0.53
0.53
0.53
0.53
0.53
Min
1.50
1.50
1.50
1.50
1.50
1.50
A (mm)
Max
2.00
2.00
2.00
2.00
2.00
2.00
Min
8.89
11.43
16.51
19.05
24.13
29.21
B (mm)
Max
9.04
11.58
16.66
19.20
24.33
29.41
Min
8.89
11.43
16.51
19.05
24.13
29.21
Max
9.04
11.58
16.66
19.20
24.33
29.41
J (mm)
Ref
7.87
10.41
15.49
18.03
23.11
28.19
H (mm)
Max
4.57
4.57
4.57
5.08
5.08
5.08
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
PLCC Land Patterns
Component
Identifier
Z (mm)
G (mm)
X (mm)
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
10.80
13.40
18.40
21.00
26.00
31.20
6.40
9.00
14.00
16.60
21.60
26.80
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
8.60
11.20
16.20
18.80
23.80
29.00
D (mm)
Ref
5.08
7.62
12.70
15.24
20.32
25.40
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
Placement Grid
(No. of Elements)
24 x 24
30 x 30
40 x 40
44 x 44
54 x 54
66 x 66
29
SOIC/SOJ
Dummy Components
Small Outline Integrated Circuit
Small Outline Package (SOP/SOJ) body size was compressed and the
lead pitch tightened to obtain a smaller version SOP. This yields an IC
package that is a significant reduction in the size (compared to stan-
dard package). All IC assembly processes remain the same as with our
standard SOPs.
SOIC/SOJ Small Outline Integrated Circuit
Number
of Pins
8
14
16
16
20
24
28
28
32
Part Number
SO8GT-3.8mm*
SO14GT-3.8mm
SO16GT-3.8mm
SO16GT-7.6mm
SO20GT-7.6mm
SO24GT-7.6mm*
SO28GT-7.6mm
SO28JT-7.6mm
SO32JT-7.6mm
Lead
Style
Gull
Gull
Gull
Gull
Gull
Gull
Gull
J-Lead
J-Lead
Body
Width
3.8mm
3.8mm
3.8mm
7.6mm
7.6mm
7.6mm
7.6mm
7.6mm
7.6mm
Notes





Quantity
Per Tube
100
50
48
46
38
31
25
26
25
Tape
Width
12mm
16mm
16mm
16mm
24mm
16mm
24mm
24mm
24mm
Tape
Pitch
8mm
8mm
8mm
12mm
12mm
12mm
12mm
12mm
12mm
Quantity
13" Reel
2,500
2,500
2,500
1,000
1,000
1,000
1,000
1,000
750
Part Number System
Small Outline
Integrated Circuit
* = Available as an ExposedPadTM SOIC package by Amkor.
ExposedPadTM can increase heat dissipation by as much as
110% over standard packages.
Standard lead pitch is 1.27mm.
Tube quantity may vary.
Parts available on Tape and Reel.
Lead-free parts are available with 100% Matte Sn finish.
Number of Pins
Lead Style
Body Width
Packaging
 Lead Style: G=Gull Wing, J=J-Leaded.
 Packaging: T=Tubes, TR=Tape and Reel.
 Add “Sn” to end of part number for Lead-Free.
For kits see pages 53, 55, 60, 62, 67,
68, 69, 70, 71, 73 and 79.
B
Die Attach
Cu Leadframe Adhesive
SO14GT–3.8mm
D
Grid
Placement
Courtyard
Mold
Compound Au Wire
A
Die
S
L
C
G
Die Attach Pad
Exposed Pad
P
H
W
E
Y
X
SOIC Component Dimensions
Component
Identifier
JEDEC
Number
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
MS-012 AA
MS-012 AB
MS-012 AC
MS-013 AA
MS-013 AC
MO-119 AB
L (mm)
Min
Max
5.80
6.30
5.80
6.30
5.80
6.30
10.00
10.65
10.00
10.65
10.29
10.64
S (mm)
Min
Max
3.26
4.55
3.26
4.55
3.26
4.55
7.46
8.85
7.46
8.85
8.21
9.01
W (mm)
Min
Max
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.36
0.51
Min
0.40
0.40
0.40
0.40
0.40
0.53
T (mm)
Max
1.27
1.27
1.27
1.27
1.27
1.04
A (mm)
Min
Max
3.80
4.00
3.80
4.00
3.80
4.00
7.40
7.60
7.40
7.60
7.40
7.60
B (mm)
Min
Max
4.80
5.00
8.55
8.75
9.80
10.00
10.10
10.50
12.60
13.00
18.08
18.39
H (mm)
Min
Max
1.35
1.75
1.35
1.75
1.35
1.75
2.35
2.65
2.35
2.65
2.34
2.64
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
SOIC Land Pattern Dimensions
30
Component
Identifier
Z (mm)
G (mm)
X (mm)
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
7.40
7.40
7.40
11.40
11.40
11.40
3.00
3.00
3.00
7.00
7.00
7.00
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
5.20
5.20
5.20
9.20
9.20
9.20
D (mm)
Ref
3.81
7.62
8.89
8.89
11.43
16.51
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Placement Grid
(No. of Grid Elements)
12 x 16
20 x 16
22 x 16
22 x 22
28 x 24
38 x 24
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Z
TSOP
Thin Small Outline Package
Dummy Components
Thin Small Outline Packages (TSOP) are thin body size components;
thickness is 1.0mm. TSOP packages have four sides and are rectangular.
Type I TSOPs have the leads protruding from the width portion of the
package. Type II TSOPs have the leads protruding from the length portion of the package. Lead counts range from 28 to 54. Package body size
ranges from 8x11.8mm to 12x20mm.
TSOP Thin Small Outline Package – Type I
Number
of Pins
28
28
32
32
40
40
48
Part Number
TI-TSOP28-8.1x11.8mm-.55mm
TI-TSOP28-8x20mm-.5mm
TI-TSOP32-8x11.8mm-.5mm
TI-TSOP32-8x18.4mm-.5mm
TI-TSOP40-10x14mm-.5mm
TI-TSOP40-10x18.4mm-.5mm
TI-TSOP48-12x18.4mm-.5mm
Body Size
8.1 x 11.8mm
8 x 20mm
8 x 11.8mm
8 x 18.4mm
10 x 14mm
10 x 18.4mm
12 x 18.4mm
Lead
Pitch
.55mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
Quantity
Per Tray
234
156
234
156
160
120
96
Tape
Width
24mm
32mm
24mm
32mm
32mm
32mm
32mm
Tape
Pitch
12mm
12/16mm
12mm
12/16mm
12/16mm
16mm
16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
1,000
1,000
Tape
Pitch
16mm
16mm
16mm
16mm
16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
TSOP Thin Small Outline Package – Type II
Part Number
TII-TSOP40/44-10.16x18.42mm-.8mm
TII-TSOP44-10.16x18.42mm-.8mm
TII-TSOP44/50-10.16x20.95mm-.8mm
TII-TSOP50-10.16x20.95mm-.8mm
TII-TSOP54-10.16x22.22mm-.8mm
Number
of Pins
40/44
44
44/50
50
54
Body Size
10.16 x 18.42mm
10.16 x 18.42mm
10.16 x 20.95mm
10.16 x 20.95mm
10.16 x 22.22mm
Notes






Lead
Pitch
.8mm
.8mm
.8mm
.8mm
.8mm
Quantity
Per Tray
135
135
135
117
108
Tape
Width
32mm
32mm
32mm
32mm
44mm
Part Number System
Standard packaging is in JEDEC trays or tape and reel
(quantities may vary).
Body dimensions are measured by body length and width.
Type I means that pins extend from the narrow end (the width) of
the body.
Type II means that pins extend from the wide end (the length) of
the body.
Parts available on Tape and Reel upon special request.
Lead-free parts are available with 100% Matte Sn or SnBi.
Type I or Type II
TI–TSOP28–8.1x11.8mm–.5mm
Thin Small
Outline Package
Number
of Pins
Lead
Pitch
Body Size
 Add “T” to end of part number for Tray.
 Add “TR” to end of part number for Tape and Reel.
 Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
TYPE I
TYPE II
For recommended kits see
pages 58, 67 and 71.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
31
SSOP
Dummy Components
Small Shrink Outline Package
The Small Shrink Outline Package (SSOP) body size is compressed and
the lead pitch is tightened to obtain a small version of the standard SOIC
packages. Lead counts range from 8 to 64. Body sizes are 209 and 300
mils. The SSOP package is JEDEC and EIAJ compliant. The package leads
are solder plated.
SSOP Small Shrink Outline Package
Part Number
SSOP14T-5.3mm
SSOP16T-5.3mm
SSOP20T-5.3mm
SSOP24T-5.3mm
SSOP28T-5.3mm
SSOP48T-7.6mm
SSOP56T-7.6mm
Number
of Pins
14
16
20
24
28
48
56
Body Width
Pitch
5.3mm
5.3mm
5.3mm
5.3mm
5.3mm
7.6mm
7.6mm
.65mm
.65mm
.65mm
.65mm
.65mm
1.27mm
1.27mm
Notes








Quantity
Per Tube
100
80
62
66
47
30
26
Tape Width
Tape Pitch
16mm
16mm
16mm
16mm
16/24mm
32mm
32mm
12mm
12mm
12mm
12mm
12mm
12/16mm
12/16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
1,000
500
Part Number System
Tube quantity may vary.
Parts available on Tape and Reel upon special request.
209 and 300 mil body widths.
JEDEC and EIAJ package outline standard compliance.
High-conductivity copper leadframes.
Eutectic solder plating is 85/15 Sn/Pb.
Moisture sensitivity is JEDEC level 3.
Lead-free available with 100% Matte Sn alloy.
Small Shrink
Outline Package
SSOP20T–5.3mm
Number of Pins
Body Width
Packaging
 Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
 Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
 Add “Sn” to end of part number for Lead-Free.
Mold
Compound
Au Wire
Cu Leadframe
Pb
Looking for Lead-Free?
This symbol indicates that
lead-free parts are available!
For kits see pages 60, 71, 79 and 82.
Die
Die Attach Adhesive
Cu Leadframe
Die Attach
Adhesive
Die Attach Pad
DiMold
Compound Au Wire
Die
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
Exposed Pad
Exposed Pad
Note: Drawings not to scale.
32
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
TSSOP
Thin Shrink Small Outline Package
Dummy Components
The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes,
smaller lead pitches and package thickness (0.9mm thick) than standard
SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts
range from 8 to 80. This package conforms to JEDEC package outlines.
Parts are also available as an ExposedPad™ package.
TSSOP Thin Shrink Small Outline Package
Part Number
A-TSSOP8T-3.0mm
A-TSSOP8T-4.4mm
A-TSSOP10T-3.0mm
A-TSSOP14T-4.4mm
A-TSSOP16T-4.4mm
A-TSSOP20T-4.4mm
A-TSSOP24T-4.4mm
A-TSSOP28T-4.4mm
A-TSSOP28T-6.1mm
A-TSSOP32T-6.1mm
A-TSSOP38T-4.4mm
A-TSSOP38T-6.1mm
A-TSSOP44T-4.4mm
A-TSSOP48T-4.4mm
A-TSSOP48T-6.1mm
A-TSSOP56T-4.4mm
A-TSSOP56T-6.1mm
A-TSSOP64T-6.1mm
A-TSSOP80T-6.1mm
Number
of Pins
8
8
10
14
16
20
24
28
28
32
38
38
44
48
48
56
56
64
80
Body
Width
3.0mm
4.4mm
3.0mm
4.4mm
4.4mm
4.4mm
4.4mm
4.4mm
6.1mm
6.1mm
4.4mm
6.1mm
4.4mm
4.4mm
6.1mm
4.4mm
6.1mm
6.1mm
6.1mm
.65mm
.65mm
.5mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.5mm
.65mm
.5mm
.4mm
.5mm
.4mm
.5mm
.5mm
.4mm
Notes









Tape
Width
12mm
12/16mm
12mm
12/16mm
12/16mm
16mm
16mm
16mm
24mm
24mm
16mm
24mm
24mm
16mm
24mm
24mm
24mm
N/A
N/A
Pitch
Tape
Pitch
8mm
8mm
8mm
8mm
8mm
8/12mm
8/12mm
8/12mm
12mm
12mm
8/12mm
12mm
12mm
8mm
12mm
12mm
12mm
N/A
N/A
Quantity
Per Tube
98
100
98
96
96
74
62
50
50
44
50
39
42
50
39
42
35
28
28
Quantity
Per Reel
2,500
1,000/2,500
2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
N/A
N/A
Part Number System
0.9mm body thickness for 4.4 and 6.1mm body widths.
0.85mm body thickness for 3.0mm body width.
JEDEC package outline is standard.
High conductivity copper leadframes.
Very low-stress mold compound.
Tube quantity may vary.
Parts available on Tape and Reel upon special request..
All pin counts listed are available as an ExposedPad™package.
Lead-free available with 100% Matte Sn alloy.
 Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
 Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
 Add “Sn” to end of part number for Lead-Free.
ExposedPad™ TSSOP Package
Cu Leadframe
Mold
Compound
Au Wire
Mold
Compound
Die
Cu Leadframe
Exposed Pad
Die
Die Attach Adhesive
ExposedPad™ Notes

Die Attach Pad
Body
Width
Packaging
Number
of Pins
ExposedPad™
Thin Shrink Small
Outline Package
TSSOP Package
Au Wire
A-ePadTSSOP8T-3.0mm
Amkor
Die Attach Adhesive



Solder plated exposed metal die pad.
Highly conductive copper leadframe.
Up to 60% improvement in Theta JA (compared to standard TSSOP).
Overall height is 1.1mm.
For recommended kit see page 55.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
33
SMR
Dummy Components
Lead-Free Surface Mount Resistors
Surface Mount Resistors (SMR) are best suited for commercial industrial
and automotive applications. Chip Resistors are suitable for a wide range
of solder processes, and are ideal for high-speed electronic assembly
equipment. Chip Resistor body size range from 01005 to 1210. Seveninch reels are standard, but eleven and thirteen-inch reels are available
upon special request. Paper carrier tape is standard for Chip Resistors.
In addition, Zero-Ohm Chip Resistors have a copper wire internally. This
creates a short condition. Zero-Ohm Chip Resistors can be used to check
for continuity after soldering.
SMR Surface Mount Resistors—Lead-Free
Body Size
(Inch)
.01” x .005”
.02” x .01”
.04” x .02”
.06” x .03”
.08” x .05”
.12” x .06”
.12” x .10”
Part Number
01005SMR-PA-Sn-0
0201SMR-PA-Sn-0
0402SMR-PA-Sn-0
0603SMR-PA-Sn-0
0805SMR-PA-Sn-0
1206SMR-PA-Sn-0
1210SMR-PA-Sn-0
0402
0603
1005
1608
2012
3216
3225
Notes





Tape
Width
8mm
8mm
8mm
8mm
8mm
8mm
8mm
Metric
(mm)
0.4 x 0.2mm
0.6 x .03mm
1.0 x 0.5mm
1.6 x 0.8mm
2.0 x 1.2mm
3.2 x 1.6mm
3.2 x 2.6mm
Tape
Pitch
2mm
2mm
2mm
4mm
4mm
4mm
4mm
Quantity
7” Reel
20,000
15,000
10,000
5,000
5,000
5,000
4,000
0402SMR–PA
Tape Type
Part Number System
Surface mount resistors come packaged on paper carrier tape and 7"
reels (larger quantities are available upon request).
Plastic carrier tape is non-standard for surface mount resistors.
The numeric section of the part number refers to the physical
body size (in inches) of the component. For example: Part number 0402SMR-PA has a body size of .04" length by .02" width.
Chip resistor arrays are available (call for availability).
Resistors are now only available standard lead-free with
100% Sn over Ni.
Body Size in Inches
Surface Mount Resistor
 Tape Type: PA=Paper Tape, PL=Plastic Tape.
L
W
C
For kits see pages 53, 54, 55, 60, 62, 67,
68, 69, 70, 71, 73, 79 and 82.
C
H
d
d
SMR Component Dimensions
Metric
0402
0603
1005
1608
2012
3216
3225
34
Inch
01005
0201
0402
0603
0805
1206
1210
L
0.4 +/– 0.02
0.6 +/– 0.03
1.0 +/– 0.05
1.6 +/– 0.1
2.0 +/– 0.1
3.2 +/– 0.15
3.2 +/– 0.15
W
0.2 +/– 0.02
0.3 +/– 0.03
0.5 +/– 0.05
0.8 + 0.15 – 0.05
1.25 +/– 0.10
1.6 +/– 0.15
2.5 +/– 0.15
H
0.12 +/– 0.02
0.23 +/– 0.03
0.35 +/– .05
0.45 +/– 0.10
0.55 +/– 0.10
0.55 +/– 0.10
0.55 +/– 0.15
c
0.1 +/– 0.03
0.1 +/– 0.05
0.2 +/– 0.1
0.3 +/– 0.1
0.4 +/– 0.2
0.5 +/– 0.25
0.5 +/– 0.25
d
0.1 +/– 0.03
0.15 +/– 0.05
0.25 + 0.05 – 0.10
0.3 +/– 0.1
0.4 +/– 0.2
0.5 +/– 0.25
0.5 +/– 0.25
* Unit weight/pc.
—
0.16mg
0.6mg
2mg
5mg
9mg
16mg
Unit: mm *Values for reference
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
SMC
Lead-Free Surface Mount Ceramic Capacitors
tape. Larger size reels are available upon special request. Practical Components has lead-free PCB test boards available for the 01005 through
1206 case sizes.
SMC Surface Mount Ceramic Capacitors—Plastic Tape
Part Number
Body Size
Body Size
Tape Width
Tape Pitch
0805SMC-PL-Sn
1206SMC-PL-Sn
1210SMC-PL-Sn
1812SMC-PL-Sn
1825SMC-PL-Sn
.08" x .05"
.12" x .06"
.12" x .10"
.18" x .12"
.18" x .25"
2.0 x 1.2mm
3.2 x 1.6mm
3.2 x 2.6mm
4.5 x 3.2mm
4.5 x 6.4mm
8mm
8mm
8mm
12mm
12mm
4mm
4mm
4mm
8mm
8mm
Quantity
7" Reel
4,000
3,000
4,000
1,100
1,000
Lead-Free
Plating
Sn
Sn
Sn
Sn
Sn
SMC Surface Mount Ceramic Capacitors—Paper Tape
Part Number
Body Size
Body Size
Tape Width
Tape Pitch
01005SMC-PA-Sn
0201SMC-PA-Sn
0402SMC-PA-Sn
0603SMC-PA-Sn
0805SMC-PA-Sn
1206SMC-PA-Sn
.01" x .005"
.02" x .01"
.04" x .02"
.06" x .03"
.08" x .05"
.12" x .06"
0.4 x 0.2mm
0.6 x 0.3mm
1.0 x 0.5mm
1.6 x 0.8mm
2.0 x 1.2mm
3.2 x 1.6mm
8mm
8mm
8mm
8mm
8mm
8mm
2mm
2mm
2mm
4mm
4mm
4mm
Notes





Quantity
7" Reel
15K~20K
15,000
10,000
4,000
5,000
4,000
Lead-Free
Plating
Sn
Sn
Sn
Sn
Sn
Sn
Part Number System
Tape Type
0402SMC–PA
Body Size in Inches
Surface mount capacitors come on standard 7" reels (larger quantity
reels are available upon request).
Plastic carrier tape is non-standard for some carrier sizes.
The numeric section of the part number refers to the physical
body size (in inches) of the component. For example: Part number
0805SMC-PL has a body size of .08" length by .05" width.
Chip capacitor arrays are available. Call for details.
Capacitors are now only available standard lead-free with 100% Sn
over Ni. SnPb is available upon request based on availability.
Surface Mount Ceramic Capacitor
 Tape Type: PA = Paper Tape, PL = Plastic Tape
L
C
T
W
X
S
For kits see pages 68 and 70.
H
Grid
Placement
Courtyard
G
Y
Z
SMC Component Dimensions
Component Dimensions
(mm) (in)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
3216 (1206)
3225 (1210)
4532 (1812)
L (mm)
Min
0.57
0.90
1.45
1.80
3.00
3.00
4.20
S (mm)
Max
0.63
1.10
1.75
2.20
3.40
3.40
4.80
Min
—
0.30
0.45
0.30
1.50
1.50
2.30
W (mm)
Max
—
0.65
0.97
1.11
2.31
2.31
3.46
Min
0.27
0.40
0.65
1.05
1.40
2.30
3.00
T (mm)
Max
0.33
0.60
0.95
1.45
1.80
2.70
3.40
Min
—
0.10
0.20
0.25
0.25
0.25
0.25
H (mm)
Max
0.33
0.60
0.85
1.10
1.35
1.35
1.35
Max
—
0.30
0.50
0.75
0.75
0.75
0.95
SMC Land Pattern Dimensions
Component Identifier
(mm) (in)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
3216 (1206)
3225 (1210)
4532 (1812)
Z (mm)
G (mm)
X (mm)
0.72
2.20
2.80
3.20
4.40
4.40
5.80
0.26
0.40
0.60
0.60
1.20
1.20
2.00
0.32
0.70
1.00
1.50
1.80
2.70
3.40
Y (mm)
Ref
0.23
0.90
1.10
1.30
1.60
1.60
1.60
C (mm)
Ref
0.49
1.40
1.70
1.90
2.80
2.80
3.90
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
Placement Grid
(No. of Grid Elements)
—
2x6
4x6
4x8
4 x 10
6 x 10
8 x 12
35
Dummy Components
Surface Mount Multilayer Ceramic (SMC) capacitors come in case sizes
ranging from 01005 to 2225. The most popular case sizes are listed in the
table below. Parts on tape and reel are available on paper tape or plastic
SME
Dummy Components
Surface Mount Electrolytic Capacitors
Surface Mount Electrolytic (SME) capacitors are measured according to
the diameter of the can mounted on top of the terminations. Sizes range
from 3mm to 24mm in diameter. The most popular sizes are listed below.
Please call if different sizes are needed. These components come packaged on plastic embossed carrier tape. Standard reel sizes are 15".
SME Surface Mount Electrolytic Capacitors
Part Number
Body Size
Tape Width
Tape Pitch
3mm-SME-PL-Sn
4mm-SME-PL-Sn
5mm-SME-PL-Sn
6.3mm-SME-PL-Sn
8mm-SME-PL-Sn
10mm-SME-PL-Sn
18mm-SME-PL-Sn
3mm
4mm
5mm
6.3mm
8mm
10mm
18mm
12mm
12mm
12mm
16mm
16mm
24mm
44mm
8mm
8mm
12mm
12mm
12mm
16mm
32mm
Notes



Part Number System
Body Size
Surface mount electrolytic capacitors come standard on 15" reels.
Components are measured by the diameter of the electrolytic can.
Lead-free available with 100% Sn.
Lead spacing and wire diameter
øD
4
5
6.3
8
8
10
18
Quantity
15" Reel
2,000
2,000
1,000
1,000
1,000
500
125
L
5.3±0.2
5.3±0.2
5.3±0.2
6.3±0.3
10±0.5
10±0.5
16.5
A
B
4.3
5.3
6.6
8.4
8.4
10.4
19.0
4.3
5.3
6.6
8.4
8.4
10.4
21.0
0.3 Max
Unit: mm
C
2.0
2.3
2.7
3.4
3.0
3.3
6.5
W
0.5±0.8
0.5±0.8
0.5±0.8
0.5±0.8
0.7±1.1
0.7±1.1
1.2±0.3
P
1.0
1.5
2.0
2.3
3.1
4.7
6.7
3mm–SME–PL
Plastic Carrier Pack
Surface Mount
Electrolytic Capacitor
A±0.2
0.4±0.2
C±0.2
øD±0.5
B±0.2
P
C±0.2
L
W
MELF Diodes
Metal Electrode Face Components
Metal Electrode Face Components (MELF) have metallized terminals at
each end of a cylindrical body. MELF components are designed to fit the
same footprints as flat components i.e., 0805 (.08" x .05") and the 0603
(.06" x .03"). MELF packages are available on plastic tape and reel.
MELF Metal Electrode Face Component Diodes
Part Number
Body Size
SOD80-TR-Sn
1.4 x 3.4mm
SOD80 Package is also known as LL-34 or DO-213AA.
SM1-TR-Sn
2.6 x 5.0mm
Package is also known as LL-41 or DO-213AB.
Quantity
7" Reel
2,500
Tape Width
Tape Pitch
8mm
4mm
Quantity
13" Reel
10,000
1,500
12mm
4mm
5,000
Part Number System
Notes

MELF Diodes are cylindrical glass or plastic packages with Sn
termination for lead-free.
Package
Dimension A
Dimension B
36
SOD80 (LL34)
3.4mm
1.5mm
SM1 (LL41)
5.0mm
2.8mm
Device/Package
A
SOD80–TR
Tape and Reel
B
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
SMTA
Lead-Free Surface Mount Tantalum Capacitors
Dummy Components
Surface Mount Molded Tantalum Capacitors (SMTA) are polarized capacitors with solderable terminations. Surface Mount Tantalum packages are
identified by case size i.e.: A, B, C and D. These case sizes stand for metric
footprints of length and width. For example: A = 3.2 x 1.6mm; B = 3.5 x
2.8mm; C = 6.0 x 3.2mm; D = 7.3 x 4.3mm.
SMTA Surface Mount Tantalum Capacitors
Part Number
Body Size
Case Size
Tape Width
Tape Pitch
1608SMTA-PL-Sn
3216SMTA-PL-Sn
3528SMTA-PL-Sn
6032SMTA-PL-Sn
7343SMTA-PL-Sn
1.6 x .85mm
3.2 x 1.6mm
3.5 x 2.8mm
6.0 x 3.2mm
7.3 x 4.3mm
R (smaller than A case)
A
B
C
D
8mm
8mm
8mm
12mm
12mm
4mm
4mm
4mm
8mm
8mm
Notes







Quantity
7” Reel
500
2,000
2,000
500/750
500/750
Part Number System
Body Size in
3216SMTA–PL
Millimeters
Surface Mount
Tantalum Capacitor
Components are molded, surface mount tantalums.
Conformal coated tantalums are available.
Please call for availability of mil-spec surface mount tantalums.
Standard reel size is 7" (larger sizes are available upon request).
All tantalum capacitors are on plastic carrier tape.
Tantalums are now available as standard lead-free with 100% Sn finish.
SnPb is available upon request based on availability.
Plastic Carrier Pack
C
H2
H1
W1
W2
S
L
T
2 Places
X
Y
G
Z
Grid
Placement
Courtyard
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
37
SMT
Dummy Components
Lead-Free Surface Mount Transistors
SOT package is a rectangular surface mount transistor diode with three
or more gull-wing leads. The leads are on the two length sides of the
package. SOT packages are JEDEC compliant. Popular sizes are the
SOT23, DPAK, SOT223 and SOT89.
For kits see pages 53, 55, 60,
62, 67, 68, 69 and 73.
SMT Surface Mount Transistors
Number
of Pins
3
3
5
6
3
5
6
4
3
3
Part Number
SC90-TR-Sn
SOT323-TR-Sn
SOT353-TR-Sn
SOT363-TR-Sn
SOT23-TR-Sn
SOT25-TR-Sn
SOT26-TR-Sn
SOT143-TR-Sn
SOT89-TR-Sn
SOT223-TR-Sn
DPAK-TR-Sn
D2PAK-TR-Sn
Body Size
"W"
1.6mm
2.0mm
2.0mm
2.0mm
2.9mm
2.9mm
2.9mm
2.9mm
4.5mm
6.5mm
6.5mm
10.0mm
Body Leads
"L"
1.6mm
2.1mm
2.1mm
2.1mm
2.4mm
2.8mm
2.8mm
2.5mm
4.0mm
7.0mm
9.5mm
15.2mm
SC-75A
SC-70
SC-88A / SOT325
SC-88 / SOT326
TO-236AB
SC-74A
SC-74
TO-253AA
SC-62 / TO-243AA
SC-73 / TO-261AA
SC-63 / TO-252-AA
TO-263AB
Notes





Tape
Width
8mm
8mm
8mm
8mm
8mm
8mm
8mm
8mm
12mm
12mm
16mm
24mm
SC Device
Tape
Pitch
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
8mm
8mm
8mm
12mm
Quantity
Per Reel
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
1,000
1,000
2,500
800/1,000
Part Number System
SC90
(3)
W
0.5
0.3
(2)
Packaging
L
0.2
(1)
SOT326–TR
Transistor Package
Carrier pack is plastic for surface mount transistors.
Tape type is plastic.
Parts only available on Tape and Reel.
Tin-Lead solder plating available upon request based on availability.
Lead-free available with 100% Sn alloy.
0.5
SOT323
1.0
(1)
1.6
(3)
0.3
0.65
1.3 2.0
0.65
(2)
0.2
0.8
(1) Emitter (Source)
(2) Base (Gate)
(3) Collector (Drain)
1.25
(1) Emitter (Source)
(2) Base (Gate)
(3) Collector (Drain)
1.6
2.1
0.2
0.55 0.7
0.15
0.7 0.9
0.15
0~0.1
0.1 Min.
0~0.1
0.1~0.4
Each lead has same dimensions
SOT63
SOT53
0.2
(3)
(4)
0.2
(2)
(5)
0.65
1.3 2.0
0.65
(3)
(4)
(2)
(5)
(6)
(1)
1.3
2.0
1.25
2.1
2.1
0.7
0.9
0.7 0.9
0.15
0~0.1
0~0.1
0.1 Min.
Each lead has same dimensions
38
0.65
(1)
1.25
0.15
0.65
0.1 Min.
Each lead has same dimensions
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
SMT
Lead-Free Surface Mount Transistors
SOT23
SOT25
(1)
0.95
(3)
(2)
(3)
0.36
1.9 2.9
0.95
(2)
1.3
0.95
(5)
0.95
1.9 2.9
1.6
(1) Emitter (Source)
(2) Base (Gate)
(3) Collector (Drain)
2.4
0.95
(1)
(4)
Dummy Components
0.4
2.8
1.1
0.45
0.15
0.15
0~0.1
.3 ~ .6
Each lead has same dimensions
0~0.1
0.2 Min.
Each lead has same dimensions
SOT26
Top View
(6)
SOT143
(1)
0.3
0.95
1.9
0.95
(2)
(5)
.004(0.10)
.005(0.13)
2.9
.079(2.01)
.003(0.08)
.005(0.13)
.037(0.94)
.043(1.09)
1.6
2.8
0.8
0.15
3
4
15°
6°
(3)
(4)
.110(2.79)
.118(3.00)
.047(1.19)
.051(1.30)
.098(2.49)
Max.
2
1
.014(0.36)
.018(0.46)
.071(1.80)
.030(0.76)
.033(0.84)
1.1
0~0.1
0.3~0.6
SOT223
Each lead has same dimensions
0.5
.001(0.03)
.004(0.10)
(1)
1.5
15°
(2)
0.5
1.6
1.5
4.5
1.5
5.5
2.3
D2PAK
1.5
Inches
E
V
5.1 6.5
0.9
(3)
0.65
2.3
0.8 Min.
1.5
0.5
2.5
9.5
0.5
A
S
C0.5
1.0
.181(4.60)
C
B
(2)
0.9
.091(2.31)
Notes:
1. Dimensioning and tolerancing per ANSI
Y14.5M, 1982.
2. Controlling Dimension:
Inch.
(1)
2.3
.033(0.84)
.041(1.04)
.024(0.61)
.031(0.79)
0.75
.264(6.71)
.287(7.29)
.130(3.30)
.146(3.71)
15°
.009(0.23)
.013(0.33)
(3)
0.4
(1) Base (Gate)
(2) Collector (Drain)
0.4
(3) Emitter (Source)
DPAK TO-252
.114(2.90)
.122(3.10)
.063(1.60)
.067(1.70)
2.5
1.0
0.4
3.0
0°-7°
4.0
SOT89
Top View
.248(6.30)
.264(6.71)
-T-
J
G
3 PL D
0.13(0.005) M T
Min.
Max.
Min.
Max.
A
0 .340
0. 380
8. 64
9. 65
B
0 .380
0. 405
9. 65
10. 29
C
0 .160
0. 190
4. 06
4. 83
D
0 .020
0. 035
0. 51
0. 89
E
0 .045
0. 055
1. 14
G
K
H
Millimeters
Dim.
0 .100 BS C
1. 40
2 .5 4 B SC
H
0 .080
0. 110
2. 03
J
0 .018
0. 025
0. 46
0. 64
K
0 .090
0. 110
2. 29
2. 79
S
0 .575
0. 625
14. 60
15. 88
V
0 .045
0. 055
1. 14
1. 40
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
2. 79
39
MELF Resistors
Dummy Components
Metal Electrode Leadless Face
Metal Electrode Leadless Face (MELF) Resistors are round or cylindrical
in shape. They are available in embossed plastic tape on 7" reels. The
terminals on MELF resistors are force-fitted steel caps with Sn plated
termination. Parts are also available in Zero-Ohm value. Land pattern
sizes for MELF resistors are the same as SMD chip resistor.
MELF Metal Electrode Leadless Face Component Resistors
Body Size
(Inch)
.08" x .05"
.12" x .06"
.14" x .06"
.23" x .09"
Part Number
0805SMR-MELF-PL-Sn
1206SMR-MELF-PL-Sn
1406SMR-MELF-PL-Sn
2309SMR-MELF-PL-Sn
(mm)
2.0 x 1.27mm
3.0 x 1.5mm
3.56 x 1.5mm
5.84 x 2.29mm
Notes






Tape Width
Tape Pitch
8mm
8mm
8mm
12mm
4mm
4mm
4mm
4mm
Quantity
7" Reel
3,000
2,000
3,000
1,500
Part Number System
MELF is the acronym for Metal Electrode Leadless Face.
90/10 solder plated end caps.
Suitable for reflow and wave soldering.
Meets or exceeds EIAJ–8009, EIA–PDP–100.
Force fitted steel caps are tin plated. SnPb is available upon request
based on availability.
Tape type is plastic.
D3
C
L
Body Size in Inches
Tape Type
Cylindrical MELF Type
Carbon Film Resistor
Surface Mount Resistor
Size Code Dimensions
Case Size
D1
0805SMR–MELF-PL
L
C Min
D1
D2 Max
D3 Max
0805
2.0±0.1
(0.079±0.004)
0.3
(0.012)
1.25±0.05
(0.049±0.002)
1.35
(0.053)
0.07
(0.003)
1406
3.5±0.2
(0.138±0.008)
1.45±0.10
(0.057±0.004)
1.55
(0.061)
0.10
(0.004)
1206
3.2±0.2
(0.126±0.008)
1.55±0.15
(0.061±0.006)
1.75
(0.069)
0.10
(0.004)
2309
5.9±0.2
(0.232±0.008)
2.2±0.10
(0.087±0.004)
2.40
(0.094)
0.15
(0.006)
D2
0.5
(0.02)
Unit: mm (Inch)
40
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
PDIP
Plastic Dual In-Line Package
Plastic Dual In-Line Packages (PDIP) are long-established industry
standard through-hole packages.
PDIP Plastic Dual In-Line Package
Quantity
Per Tube
8
14
16
18
20
24
.360"
.750"
.750"
.900"
1.030"
1.250"
50
25
25
21
18
15
24
28
32
40
48
1.250"
1.450"
1.650"
2.060"
2.430"
15
13
11
9
7
Notes






Daisy-Chain Available
300 mil wide body
PDIP8-300
PDIP14-300
PDIP16-300
PDIP18-300
PDIP20-300
PDIP24-300
600 mil wide body
PDIP24-600
PDIP28-600
PDIP32-600
PDIP40-600
PDIP48-600
Body Size
(body length in inches)
Dummy Components
Part Number
Number
of Pins
Part Number Description
Plastic Dual
In-Line Package
Eutectic solder plating finish is 85% Sn/15% Pb.
High conductivity copper leadframe.
JEDEC standard compliant.
Parts packaged in anti-static 20" tubes.
Lead-free available with 100% Sn Matte alloy.
Pitch is 100 mils.
PDIP8-300
Number of Pins
Die Attach Adhesive
Body Width (Mils)
Mold Compound
Au Wire
Cu Leadframe
Die
PDIP Cross-Section
For kits see pages 53, 55,
62, 69, 70, 73 and 79.
Die Attach Pad
Through-Hole Glass Diodes
Axial Leaded Through-hole Glass Diode package has been in use for
over 50 years in the electronics industry. The body of these parts are
glass and the package is hermetically sealed. The “DO” prefix is a JEDEC
designation for through-hole diodes. The 34 and 35 references case size.
These type of components are packaged on ammo pack or bulk. In most
cases, these parts are sold as training aids to teach new operators how
to solder.
Axial Leaded Through-Hole Glass Diode
References
(JEDEC)
DO-34
DO-35
Part Number
DO-34
DO-35
Case Size
(Inch)
(mm)
0.0629" x 0.1197" 1.6 x 3.04mm
0.0728" x 0.1673" 1.85 x 4.25mm
(EIAJ)
SC-40
Notes




Lead
Diameter
.55mm
.56mm
Part Number System
b
Max
D
Max
G1
Max
L
Min
mm
0.55
1.6
3.04
25.4
Packaging
Body Size
 Add “Ammo” to end of part number for Ammo T&R.
 Add “B” to end of part number for bulk.
(1)
DO-34
Unit
DO-34-B
Glass Diode
Part is hermetically sealed glass package.
Axial leaded (2 leads).
Parts are packaged Ammo pack (5K per reel) or bulk.
Lead-free available with 100% Sn alloy.
b
D
L
G1
L
(1)
DO-35
Unit
b
Max
D
Max
G1
Max
L
Min
mm
0.56
1.85
4.25
25.4
b
D
L
G1
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
L
41
TO
Through-Hole Transistors
Dummy Components
TO type components are through-hole transistors. These are basic electronic components developed in the last forty years. There are many
additional types of TO components not listed. TO components come
packaged in tubes, bulk, and tape and reel. Not all components types
are available in all packaging styles. Please call for availability. Parts are
available lead-free with Sn finish.
TO Through-Hole Transistors
Part Number
Number of Pins
Case Material
TO5-3-B
TO18-3-B
TO92-3-B
TO220-3-B
3
3
3
3
Metal
Metal
Plastic
Plastic
Part Number System
8.51
9.4
8.0
8.51
TO5
Transistor Package
TO92
17.0
EBC
(1) Emitter
(2) Base
(3) Collector
5.08 Typ.
2.54Typ.
Lead #1
ECB
(1) Emitter
(2) Collector
(3) Base
Lead #3
45°
0.71
0.86
Lead Codes
0.74
1.14
Pin
1
2
SCR
C
G
Transistor E
B
MT1 G
TRIAC
Dimensions: mm
2.8
ø3.1
2.5 Min.
12.7 Min.
Lead #2
7.0
1.8
4.8
4.5
10.0
TO220
3.7
4.8
12.7
Minimum
3 Leads
0.41
0.53
Packaging
Number of Pins
6.1
6.6
1.02
Maxium
TO5–3–B
3
A
C
MT2
0.5
12.0
8.0
5.0
2.5
13.5 Min.
0.45
2.3
5
0.8
0.55
2.54
(1) (2) (3)
1.3
Dimensions: mm
(1) Base
(2) Collector
(3) Emitter
For kits see pages 53, 62,
69, 70, 73 and 79.
Dimensions: mm
(1) (2) (3)
Axial Leaded Resistors
Axial Leaded Resistors are through-hole mounted components. The
Practical Components part numbering system for this type of component is based on wattage ratings, i.e.; 1/2 watt = 1/2-W-AR-3.5x9.5MM.
AR components are available in bulk, tape and reel or ammo pak.
Axial Leaded Resistors
Part Number
Type
1/8-W-AR-1.6X3.7mm-TR
1/4-W-AR-2.3X6.5mm-TR
1/2-W-AR-3.5X9.5mm-TR
CF 1/8
CF 1/4
CF 1/2
Dimensions (mm)
L
3.00 ± 0.1
6.35 ± 0.5
8.51 ± 0.5
Notes



C
3.5 Max
7.1 Max
9.52 Max
D
1.70 ± 0.2
2.30 ± 0.3
3.00 ± 0.3
I
28.0 ± 3.0
28.0 ± 3.0
28.0 ± 3.0
d
0.45 ± 0.05
0.60 ± 0.05
0.60 ± 0.05
Part Number System
Parts are conformal coated resistors—carbon film type.
TR = Tape and Reel
Lead-Free and Zero-Ohm value parts available
I
Wattage Size
1/8–W–AR–1.6x3.7mm–TR
Axial Resistor
Package
Tape and Reel
Body Size
L
ød
øD
For kits see pages 53, 62,
69, 70, 73 and 79.
C
42
2.6
2.54
(1) (2) (3)
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Industry Acronyms
Autoclave
Aniosotropic Conductive Adhesive
Applied Computational Electromagnetics Society
Aircraft Equipment Monitor
Acceleration Factor
American Institute of Aeronautics and Astronautics
Accelerated Life Test
Active Matrix Liquid Crystal Display
American National Standards Institute
Average Outgoing Quality
Actual Outgoing Quality Level
Accelerated Product Qualification
Aviation Rulemaking Advisory Committee
Aerospace Recommended Practice
Application Specific Integrated Circuit
Application Specific Standard Component
Application Specific Standard Product
Accelerated Stress Test
Accelerated Thermal Cycling AWGIECQ Avionics
Working Group
a-Si
Amorphous Silicon
BEM
Boundary Element Method
BGA
Ball Grid Array
BME
Base Metal Electrode
BT
Bismaleimide Triazine
BV
Breakdown Voltage
CA
Contract Assembly or Contract Assembler
CAGR
Compound Annual Growth Rate
CALCE™ Computer Aided Life Cycle Engineering
CB
Citizens Band
CBGA
Ceramic Ball Grid Array
CCA
Circuit Card Assembly
CCD
Charge Coupled Device
CCGA
Ceramic Column Grid Array
CDM
Charged Device Model
CECC
Cenelec Electronic Components Committee
CFEM
Conventional Finite Element Method
CFF
Conductive Filament Formation
CL
Confidence Level
CLPT
Classical Laminated Plate Theory
CM
Contract Manufacturing or Contract Manufacturer
CMM
Component Maintenance Manual
CMOS
Complementary Metal Oxide Semiconductor
COB
Chip on Board
COF
Chip on Flex
COGS
Cost of Goods Sold
COTS
Commercial Off The Shelf
Cpk
Process Capability Index
CPLD
Complex Programmable Logic Device
CR
Contact Resistance
CRT
Cathode Ray Tube
CSAM
C-mode Scanning Acoustic Microscopy
CSP
Chip Scale Package
CTE
Coefficient of Thermal Expansion
DBC
Direct Bond Copper
DBGA
DBS
DBTF
DFR™
DIP
DL
DMSMS
DOE
DOF
DRAM
DSCC
DUT
DWV
ECL
ECM
ECMP
EDA
EDRAM
EDS
EEPLD
EFIS
EIA
ELD
EMC
EMC
EMCS
EMI
EMS
EN
EOL
EP
EPLD
EPSC
ESD
ESEM
ESR
ESS
EU
FAA
FADEC
FAR
FBGA
FCC
FCOB
FCOC
FCOF
FDTD
FEA
FED
FEM
FET
FFF
FFOP
FMEA
FMECA
Dimple Ball Grid Array
Direct Broadcast Satellite
Design-Build-Test-Fix
Design for Reliability
Dual In-line Package
Design Life
Diminishing Manufacturing Sources and Material Shortages
Design of Experiment
Degrees of Freedom
Dynamic Random Access Memory
Defense Supply Center Columbus
Device Under Test
Dielectric Withstanding Voltage
Emitter-Coupled Logic
Electrochemical Migration
Electronic Component Management Plan
Electronic Design Automation
Embedded Dynamic Random Access Memory
Electron Disruptive Spectroscopy
Electrically Erasable Programmable Logic Device
Electronic Flight Instrumentation System
Electronic Industry Association
Electroluminiscent Displays
Electromagnetic Compatibility
Encapsulated Molding Compound
Electromagnetic Compatibility Society
Electromagnetic Interference
Electronic Manufacturing Services
Euro Norms (European Standards
End of Life
Energy Partitioning
Erasable Programmable Logic Device
Electronics Products and Systems Center/Consortium
Electrostatic Discharge
Environmental Scanning Electron Microscope
Equivalent Series Resistance
Environmental Stress Screening
European Union
Federal Aviation Agency
Full Authority Digital Engine Control
Federal Aviation Regulations
Fine pitch ball grid array
Federal Communications Commission
Flip Chip On Board
Flip Chip On Ceramic
Flip Chip on Flex
Finite Difference Time Domain
Finite Element Analysis
Field Emission Displays
Finite Element Method
Field Effect Transistor
Form Fit and Function
Failure-Free Operating Period
Failure Mode and Effect Analysis
Failure Mode Effect and Criticality Analysis
Courtesy of CALCE www.calce.umd.edu
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
43
Dummy Components
AC
ACA
ACES
AEM
AF
AIAA
ALT
AMLCD
ANSI
AOQ
AOQL
APQ
ARAC
ARP
ASIC
ASSC
ASSP
AST
ATC
Dummy Components
Industry Acronyms
FPGA
FRACAS
FSDT
FTA
GA
GAL
GEM
GIDEP
GPC
GPWS
HALT
HASS
HAST
HBM
HDL
HDTV
HM
HSDT
HSOP
HTCC
HTOL
HTRB
HTS
HTTP
I/O
IC
IDDQ
IDSA
IDT
IEC
IECQ
IEEE
IFE
IGBT
IMA
IP
IPC
IPD
IR
IRC
Isat
ITO
JAN
JAR
JEDEC
LCA
LCCC
LC
LCD
LCM
LGA
LIF
LIGA
Field Programmable Gate Array
Failure Reporting, Analysis and Corrective Action System
First-order Shear Deformable Theory
Fault Tree Analysis
Gate Array
Generic Array Logic/Lattice
Generalized Emulation of Microcircuits
Government Industry Data Exchange Program
Government Procurement Committee
Ground Proximity Warning System
Highly Accelerated Life Test
Highly Accelerated Stress Screening
Highly Accelerated Stress Test
Human Body Model
Hardware Description Language
High Definition Television
Health Monitoring
Higher-order Shear Deformable Theory
Small Outline Package with a Heat Sink
High Temperature Cofired Ceramic
High Temperature Operation Life
High Temperature Reverse Bias
High Temperature Storage
Hyper-Text Transfer Protocol
Input/Output
Integrated Circuit
Quiescent Current
Incremental Damage Superposition Approach
Integrated Device Technology
International Electrotechnical Commission
International Electrotechnical Commission Quality
Assessment System for Electronic Components
Institute of Electrical and Electronic Engineers
In-Flight Entertainment
Integrated Gate Bipolar Transistor
Integrated Modular Avionics
Intellectual Property
Institute for Interconnecting and Packaging Electronic Circuit
Integrated Passive Devices
Infra Red/Insulation Resistance
International Resistive Company
Saturation Current
Indium tin oxide
Joint Army Navy
Joint Aviation Regulation
Joint Electron Device Engineering Council
Logic Cell Array
Leadless Ceramic Chip Carrier
Liquid Crystal
Liquid Crystal Display
Life Consumption Monitoring
Land Grid Array
Low Insertion Force
Acronym from German words for lithography, electroplating,
and molding
LM
LOT
LPCC
LRM
LRU
LSI
LTB
LTOL
LVCES
LVT
LWDT
MAX
MBGA
MCM
MDRR
MDSDT
MEMS
MFG
MFOP
MLCC
MLD
MM
MMC
Mn
MOCA
MoL
MoM
MOS
MOSFET
MRP
MSL
MTBF
MTBUR
MTTF
NCMS
NEC
NEMI
NEMP
NFEM
NFF
NIF
NRE
NSWC
OEM
OLED
OOR
PAL
PASIC
PBGA
PBT
PC
PC FAB
PCB
PCM
PCN
Life Margin
Life of Type
Leadless Plastic Chip Carrier
Line Replaceable Module
Line Replaceable Unit
Large Scale Integration
Last Time Buy
Low Temperature Operating Life
Low Volume Complex Electronic System
Low Voltage (BiCMOS) Technology
Layer-Wise Deformable Theory
Multiple Array Matrix
Metal Ball Grid Array
Multi-Chip Module
Multi-Domain Rayleigh Ritz
Material Dependent Shear Deformable Theory
MicroElectroMechanical Systems
Mixed Flowing Gases
Maintenance Free Operating Period
Multilayer Ceramic Capacitor
Minimum Life Desired
Machine Model
Metal Matrix Composite
Metal level number n
Mitigation of Obsolescence Cost Analysis
Method of Lines
Method of Moments
Metal Oxide Semiconductor
Metal Oxide Semiconductor Field Effect Transistor
Maintenance Recovery Period
Moisture Sensitivity Level
Mean Time Between Failures
Mean Time Between Unscheduled Removals
Mean Time to Failure
National Center for Manufacturing Sciences
Numerical Electromagnetic Code
National Electronics Manufacturing Initiative Inc.
Nuclear Electromagnetic Pulse
Nested Finite Element Method
No Fault Found
Normal Insertion Force
Non-Recurring Engineering
Naval Surface Warfare Center
Original Equipment Manufacturer
Organic Light Emitting Diodes
Ordered Overall Range
Programmable Array Logic
Programmable Application Specific Integrated Circuit
Plastic Ball Grid Array
Parasitic Bipolar Transistor
Pre-Conditioning
Printed Circuit Fabrication
Printed Circuit Board
Phase Change Material
Product Change Notice
Courtesy of CALCE www.calce.umd.edu
44
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Industry Acronyms
Precision Devices Incorporated
Product Discontinuance Notice
Plasma Displays Panel
Partial Element Equivalent Circuit
Primary Flight Control
Pin Grid Array
Prognostic Health Monitoring
Programmable Logic Array
Plastic Leaded Chip Carrier
Physics of Failure
Proof of Screen
Parts Per Million
Plastic Quad Flat Pack
Power Spectral Density
Punch Through
Plated-Through Hole
Plated-Through Via
Printed Wiring Assembly
Printed Wiring Board
Lead Zirconate Titanate
Quad Flat Pack
Qualified Manufacturer List
Qualified Part List
Quality Reliability Durability
Range Distribution Function
Drain to Source On Resistance
Reliability Enhancement Test
Radio Frequency
Radio Frequency Interference
Relative Humidity
Root mean square
Return On Investment
Room Temperature
Safety and Arming Tin
Silver Copper (SnAgCu)
Society of Automotive Engineers
Scanning Acoustic Microscope
Simulation Assisted Reliability Assessment
Super Ball Grid Array
Standard Cell
Scalable Complementary Metal Oxide Semiconductor
Spectral Domain Approach
Stress-Driven Diffusive Voiding
Shop Discardable Unit
Shielding Effectiveness
Scanning Electron Microscope
Signal Integrity
Semiconductor Industry Association
Stress Induced Leakage Current
Surface Mount
Standard Microcircuit Drawing
Surface Mount Technology
System-On-Chip
Small Outline Integrated Circuit
System-On-Package / Small Outline Package
SOWIC
SPC
SPICE
SPLD
SRAM
SRU
SUBM
TAB
TBGA
TC
TCAS
TCTF
TDDB
TEM
TFT
Tg
TH
THB
TI
TLM
TMM
TS
TSMC:
TTF
TTL
UBGA
UV
VCO
VDCEP
VHDL
VHSIC
VLSI
VQ
Vt
WEEE
WLP
xPyM
ZIF
Small Outline Wide Integrated Circuit
Statistical Process Control
Simulation Program with Integrated Circuit Emphasis
Simple Programmable Logic Device
Static Random Access Memory
Shop Replaceable Unit
Submicron
Tape Automated Bonding
Tape Ball Grid Array
Temperature Cycle
Traffic-alert Collision Avoidance System
Time-, Cycles-to Failure
Time-Dependent Dielectric Breakdown
Transverse Electromagnetic
Thin film transistor
Glass Transition Temperature
Through Hole
Temperature, Humidity and Bias
Transfer Impedance
Transmission Line Matrix
Thermo -Mechanical Microstructural
Thermal Shock
Taiwan Semiconductor Manufacturing Corporation
Time to Failure
Transistor-Transistor Logic
Micro Ball Grid Array
Ultraviolet
Voltage Controlled Oscillator
Volume Driven Commercial Electronic Product
VHSIC Hardware Description Language
Very High-Speed IC
Very Large Scale Integration
Virtual Qualification
Threshold Voltage
Waste from Electrical and Electronic Equipment
Wafer Level Package
x Polysilicon and y Metal
Zero Insertion Force
Dummy Components
PDI
PDN
PDP
PEEC
PFC
PGA
PHM
PLA
PLCC
PoF
POS
PPM
PQFP
PSD
PT
PTH
PTV
PWA
PWB
PZT
QFP
QML
QPL
QRD
RDF
RDSON
RET
RF
RFI
RH
RMS
ROI
RT
S&A
SAC
SAE
SAM
SARA™
SBGA
SC
SCMOS
SDA
SDDV
SDU
SE
SEM
SI
SIA
SILC:
SM
SMD
SMT
SOC
SOIC
SOP
Courtesy of CALCE www.calce.umd.edu
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
45
CTReels
Dummy Components
Empty Carrier Tape Reels
When only the physical characteristics of the tape matter, we offer
empty carrier tape reels in a variety of widths and pitches. Empty carrier
tape reels are plastic embossed or paper carrier tape with sealed cover
tape to simulate running parts without the cost and mess during feeder
applications. CTReels are a cost saving alternative compared to actual
parts on tape.
Empty Carrier Tape Reels
Part Description
Reel Size
Tape Width
7"x8mm-CTR-PA
7"
8mm
7"x8mm-CTR-PL
7"
8mm
7"x12mm-CTR-PL
7"x16mm-CTR-PL
13"x8mm-CTR-PA
13"x8mm-CTR-PL
13"x12mm-CTR-PL
7"
7"
13"
13"
13"
12mm
16mm
8mm
8mm
12mm
13"x16mm-CTR-PL
13"
16mm
13"x24mm-CTR-PL
13"
24mm
13"x32mm-CTR-PL
13"
32mm
13"x44mm-CTR-PL
13"
44mm
13"x56mm-CTR-PL
13"
56mm
13"x72mm-CTR-PL
13"
72mm
Notes









Tape Pitch
2mm
4mm
2mm
4mm
8mm
12mm
4mm
4mm
8mm
8mm
12mm
12mm
16mm
20mm
24mm
12mm
16mm
24mm
16mm
20mm
24mm
32mm
36mm
40mm
40mm
44mm
24mm
Standard
Pocket
0402SMR
0805SMR
0402SMR
0805SMR
1812SMC
SO16-7.6mm
0805SMR
0805SMR
SO8-3.8mm
SO14-3.8mm
SO16-7.6mm
SO20-7.6mm
PLCC28
LQFP-12mm
PBGA-13mm
T1-TSOP32
T1-TSOP32
PLCC44
T11-TSOP54
TBD
LQFP-20mm
PBGA-23mm
TBD
TBD
PBGA-35mm
QFP-32mm
TBD
Pockets
Per Reel
10,000
5,000
10,000
5,000
1,000
500
10,000
10,000
2,500
2,500
1,000
1,000
750
750
500
1,000
1,000
750
500
1,000
750
250
250
200
250
250
300
Tape Type
Paper
Paper
Plastic
Plastic
Plastic
Plastic
Paper
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Part Number System
Taped to EIA 481 standards.
Reels come standard with Heat Seal Cover Tape.
PSA available upon request (pressure sensitive adhesive).
10–100g peel back pressure for 8mm carrier tapes.
10–130g peel back pressure for 12–56mm carrier tapes.
10–150g peel back pressure for 72mm carrier tapes.
Additional pocket types available upon request.
Additional widths and pitches may be available, call for details.
Plastic carrier tape is standard. Paper carrier tape is special order.
Reel Size and
7"x8mm-CTR–PA
Tape Width
Carrier Tape Reel
Tape Type
 Tape Type: PA = Paper, PL = Plastic
Label
Top Cover Tape
Sprocket Hole
Cavity
Carrier Tape
46
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Tape and Reel Specifications
Part Description
Tape
Width
Tape
Pitch
Reel
Size
Qty Per
Reel
Tape
Type
Part Description
Tape
Width
Tape
Pitch
Reel
Size
Qty Per
Reel
Tape
Type
8mm
2mm
7"
20,000
Paper
TSSOP28TR-4.4mm
16mm
8/12mm
13"
1,000
Plastic
8mm
2mm
7"
10,000
Paper
TSSOP28TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0402SMR-PA
8mm
2mm
7"
10,000
Paper
TSSOP32TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0603SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP38TR-4.4mm
16mm
8/12mm
13"
1,000
Plastic
0805SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP38TR-6.1mm
24mm
12mm
13"
1,000
Plastic
1206SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP44TR-4.4mm
24mm
12mm
13"
1,000
Plastic
1210SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP48TR-4.4mm
16mm
8mm
13"
1,000
Plastic
0201SMC-PA
8mm
2mm
7"
15,000
Paper
TSSOP48TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0402SMC-PA
8mm
2mm
7"
10,000
Paper
TSSOP56TR-4.4mm
24mm
12mm
13"
1,000
Plastic
0603SMC-PA
8mm
4mm
7"
4,000
Paper
TSSOP56TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0805SMC-PA
8mm
4mm
7"
4,000
Paper
T1-TSOP28-8.1x11.8mm-.55mm
24mm
12mm
13"
1,000
Plastic
1206SMC-PA
8mm
4mm
7"
4,000
Paper
T1-TSOP28/32-8x18.4mm-.5mm
32mm
12/16mm
13"
1,000
Plastic
0805SMC-PL
8mm
4mm
7"
4,000
Plastic
T1-TSOP32-8x18.4mm-.5mm
32mm
12/16mm
13"
1,000
Plastic
1206SMC-PL
8mm
4mm
7"
3,000
Plastic
T1-TSOP40-10x18.4mm-.5mm
32mm
16mm
13"
1,000
Plastic
1210SMC-PL
8mm
4mm
7"
3,000
Plastic
T1-TSOP48-12x18.4mm-5mm
32mm
16mm
13"
1,000
Plastic
1812SMC-PL
12mm
8mm
7"
1,000
Plastic
T11-TSOP20/26-7.6x17.4mm-1.27mm
24mm
12mm
13"
1,000
Plastic
1825SMC-PL
12mm
8mm
7"
1,000
Plastic
T11-TSOP24/28-10.16x18.41mm-1.27
32mm
16mm
13"
1,000
Plastic
3mm-SME-PL
12mm
8mm
13"
2,000
Plastic
T11-TSOP32-10.16x20.95mm-1.27mm
32mm
16mm
13"
1,000
Plastic
4mm-SME-PL
12mm
8mm
13"
2000
Plastic
T11-TSOP40/44-10.16x18.42mm-.8mm
32mm
16mm
13"
1,000
Plastic
5mm-SME-PL
12mm
12mm
13"
1,000
Plastic
T11-TSOP44-10.16x18.42mm-.8mm
32mm
16mm
13"
1,000
Plastic
6.3mm-SME-PL
16mm
12mm
13"
1,000
Plastic
T11-TSOP44/50-10.16x20.95mm-.8mm
32mm
16mm
13"
1,000
Plastic
8mm-SME-PL
16mm
12mm
13"
1,000
Plastic
T11-TSOP50-10.16x20.95mm-.8mm
32mm
16mm
13"
1,000
Plastic
10mm-SME-PL
24mm
16mm
13"
500
Plastic
T11-TSOP54-10.16x22.22mm-.8mm
44mm
16mm
13"
1,000
Plastic
18MM-SME-PL
44mm
32mm
13"
125
Plastic
T11-TSOP66-12.7x22.22mm-.5mm
44mm
16mm
13"
1,000
Plastic
3216SMTA-PL
8mm
4mm
7"
2,000
Plastic
T11-TSOP86-10.16X22.22mm-.65mm
44mm
16mm
13"
1,000
Plastic
3528SMTA-PL
8mm
4mm
7"
2,000
Plastic
PLCC20TR
16mm
12mm
13"
1,000
Plastic
6032SMTA-PL
12mm
8mm
7"
500
Plastic
PLCC28TR
24mm
16mm
13"
750
Plastic
7343SMTA-PL
12mm
8mm
7"
500
Plastic
PLCC32TR
24mm
16mm
13"
750
Plastic
SC90-TR (supermini)
8mm
4mm
7"
3,000
Plastic
PLCC44TR
32mm
24mm
13"
450
Plastic
SOT323-TR
8mm
4mm
7"
3,000
Plastic
PLCC52TR
32mm
24mm
13"
450
Plastic
SOT353-TR
8mm
4mm
7"
3,000
Plastic
PLCC68TR
44mm
32mm
13"
230/250
Plastic
SOT363-TR
8mm
4mm
7"
3,000
Plastic
PLCC84TR
44mm
36mm
13"
250
Plastic
SOT23-TR
8mm
4mm
7"
3,000
Plastic
QFP-10mm sq.
24mm
24mm
13"
500
Plastic
SOT25-TR
8mm
4mm
7"
3,000
Plastic
QFP-14mm sq.
32mm
24mm
13"
350
Plastic
SOT26-TR
8mm
4mm
7"
3,000
Plastic
QFP-14x20mm
44mm
32mm
13"
500
Plastic
SOT143-TR
8mm
4mm
7"
3,000
Plastic
QFP-28mm sq.
44mm
40mm
13"
200
Plastic
SOT89-TR
12mm
8mm
7"
1,000
Plastic
QFP-32mm sq.
56mm
44mm
13"
200
Plastic
SOT223-TR
12mm
8mm
7"
1,000
Plastic
LQFP/TQFP- 5mm sq.
16mm
12mm
13"
1,000
Plastic
DPAK-TR
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 7mm sq.
16mm
12mm
13"
1,000
Plastic
D2PAK-TR
24mm
12mm
13"
800/1,000
Plastic
LQFP/TQFP- 10mm sq.
24mm
16/24mm
13"
1,000
Plastic
SO8GTR-3.8mm
12mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 12mm sq.
24mm
20/24mm
13"
1,000
Plastic
SO14GTR-3.8mm
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 14mm sq.
32mm
24mm
13"
750
Plastic
SO16GTR-3.8mm
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 14x20mm
44mm
32mm
13"
500
Plastic
SO16GTR-7.6mm
16mm
12mm
13"
1,000
Plastic
LQFP/TQFP- 20mm sq.
44mm
24mm
13"
500
Plastic
SO20GTR-7.6mm
24mm
12mm
13"
1,000
Plastic
LQFP/TQFP- 24mm sq.
44mm
32mm
13"
500
Plastic
SO28GTR-7.6mm
24mm
12mm
13"
1,000
Plastic
PBGA-13mm sq.
24mm
24mm
13"
500
Plastic
SO28JTR-7.6mm
24mm
12mm
13"
1,000
Plastic
PBGA-15mm sq.
24mm
24mm
13"
500
Plastic
SSOP8TR-5.3mm
12mm
8mm
13"
2,500
Plastic
PBGA-17mm sq.
24mm
24mm
13"
500
Plastic
SSOP14TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-23mm sq.
44mm
32mm
13"
250
Plastic
SSOP16TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-27mm sq.
44mm
32mm
13"
250
Plastic
SSOP20TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-35mm sq.
56mm
40mm
13"
250
Plastic
SSOP24TR-5.3mm
16mm
12mm
13"
1,000
Plastic
CTBGA/CABGA-5mm sq.
12mm
8mm
13"
1,000
Plastic
SSOP28TR-5.3mm
16/24mm
12mm
13"
1,000
Plastic
CTBGA/CABGA-6mm sq.
16mm
8mm
13"
1,000
Plastic
SSOP48TR-7.6mm
32mm
12/16mm
13"
1,000
Plastic
CTBGA/CABGA-7mm sq.
16mm
12mm
13"
1,000
Plastic
SSOP56TR-7.6mm
32mm
12/16mm
13"
500
Plastic
CTBGA/CABGA-8mm sq.
16mm
12mm
13"
1,000
Plastic
TSSOP8TR-3.0mm
12mm
8mm
13"
2,500
Plastic
CTBGA/CABGA-9mm sq.
16mm
12mm
13"
1,000
Plastic
TSSOP8TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
CTBGA/CABGA-10mm sq.
24mm
12mm
13"
1,000
Plastic
TSSOP10TR-3.0mm
12mm
8mm
13"
2,500
Plastic
CTBGA/CABGA-11mm sq.
24mm
16mm
13"
1,000
Plastic
TSSOP14TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
CTBGA/CABGA-12mm sq.
24mm
16mm
13"
1,000
Plastic
TSSOP16TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
CTBGA/CABGA-14mm sq.
24mm
24mm
13"
500
Plastic
TSSOP20TR-4.4mm
16mm
8/12mm
13"
1,000/2,500
Plastic
CTBGA/CABGA-17mm sq.
24mm
24mm
13"
500
Plastic
TSSOP24TR-4.4mm
16mm
8/12mm
13"
1,000/2,500
Plastic
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
Dummy Components
01005SMR-PA
0201SMR-PA
47
Custom PC Practice Boards and Kits
Design Custom PC Practice Boards Or Complete
Kits To Meet Your Specific Requirements.
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components will help you design custom practice PC boards
or complete kits. Use the building blocks below to create your board
and start saving time and money using dummy parts and a PCB practice
kit. Please contact your service representative for more information.
Practical PC boards are non solder mask defined.
Board Material
 FR4 (140° Tg)
 Polyimide
 FR5
 BT
 IS-410
 170Tg
PC Boards & Kits
Stencil
 Metal mask stencil is
used for solder printing,
which is available
for custom or
Practical board.
 Stencils manufactured by
Soldermask, Inc.
Board Size/Thickness






Fiducials/Tooling Holes
4" x 5.5" (standard)
2.5" x 2.5"
3" x 3"
8" x 5.5"
.062" thick (2 layers)
Other
 Fiducials are used to
orient the position of
each individual
component to populate
the board
 Tooling holes are
.125" diameter
 Doughnut (local and
global)
Gerber Data
LPI/Solder Mask
 LPI is a photo liquid
imageable solder mask
that will not interfere
with solder paste
screen printing
X, Y and Theta Data
 Software data used to
create a metal mask
stencil for solder paste
application
 Software used to
calibrate pick and place
machines for placement
of components to PCB
Surface Pad Finishes
HASL
Pb Free HASL
IMSN (Immersion Tin)
IMAG (Immersion Silver)
ENIG (Immersion Gold
over Electroless Nickel)
®
 OSP (ENTEK CU-106A HT)





Delivery
 Standard delivery is
estimated 6 to 8 weeks
 Expedited delivery
is available
Parts for PC Board








Capacitor
QFP
Transistor
TSOP
SOIC
BGA
PLCC
Tantalum








Resistor
LQFP
CABGA
SBGA
TQFP
MLF
TSSOP
SSOP






CTBGA
CVBGA
Dual Row MLF
tsCSP
PoP
Other
Final Product
PCB Practice Kit
48
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
CircuitCAM™ Software
Rapidly prepare off-line machine programs and
color-coded assembly documentation from
CAD or Gerber data.
Practical Components’ goal is to provide value to our customers by
saving time when setting up board test runs. Our partnership with Aegis
Industrial Software provides our customers digitized data files for use
with Practical’s complete line of PCB test boards. Using Aegis’ CircuitCAM
software, customers save an enormous amount of time when setting up
both manual stations and automated equipment.
Customer support for installation and use of CircuitCAM and
CheckPoint is provided directly by Aegis. Please call your Practical sales
representative to request additional information.
BOM
CAD/GERBER
Software
Data Files and
Includ
With All Kit ed
s!
Virtual Factory Modeling
Total and Simplified CAD Support
Import board location data from CAD, Gerber, scanned boards, and from
select machine sources. Import for any CAD type takes a single click.
Knowledge of CAD formats is not required.
Visual Documentation
Expedite documentation development for both circuit board and
mechanical assemblies with drawing templates, automatic color coding,
cropping, annotation, OLE, clipboard, and multimedia. CircuitCAM is the
fastest tool to provide operators with the documents they need to do
their jobs effectively.
Machine Programming
CircuitCAM supports virtually all process, assembly, and inspection
systems. Through an industry leading network of over 25 machine OEM
partnerships, AEGIS offers comprehensive and user-friendly off-line programming for all types of SMT and through-hole insertion equipment.
Machine Programs
Visual Aids/Instructions
All Practical Components kits come with:
CircuitCAM is an integral component to Aegis’ Fusion
system, a scalable suite of NPI and MES Solutions. Other
integrated manufacturing tools include:







CheckPoint—BOM Importing and Revision Control
Web-based Paperless Documentation
Web-based Work In Process (WIP) Tracking
Web-based Quality Data Collection and Analysis
Web-based Line Monitoring and Supervisory Dashboard
Web-based Materials Setup Verification and Control
Aegis DataMiner—Ad hoc data analysis, charting & reporting





Demonstration versions of CircuitCAM and Checkpoint
Ready-to-run CircuitCAM Project Files (CPFs)
BOM, Gerber, GenCAD, and XY Centroid Files
Assembly Documentation Samples and Templates
Installation Instructions and User Manuals
For assistance with the installation and use of CircuitCAM and
Checkpoint, please contact an Aegis sales representative at:
Aegis Industrial Software
www.aiscorp.com
sales@aiscorp.com
(215) 773-3571 (phone)
(215) 773-3572 (fax)
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
49
PC Boards & Kits
Create a graphical routing of your plant’s assets and the processes
performed at each step. Each point in this routing is associated to a
user-defined documentation layout (template) and to a machine
programming interface gateway. Model your entire discrete assembly
process flow, from prep, assembly, inspection, test, and final assembly;
out through packout and shipping.
Kit Identifier
PC Boards & Kits
Component Part Number
01005SMR-PA-0
0201SMR-PA-0
0402SMC-PA
0402SMR-PA-0
0603SMC-PA
0603SMR-PA-0
0805SMC-PA
0805SMR-PA-0
1/2-W-AR-3.5x9.5mm-TR
1/4-W-AR-2.3x6.5mm-TR
1206SMC-PA
1206SMR-Melf
1206SMR-PA-0
1210SMR-PA-0
6032SMTA-PL
68LCC
A-CABGA36-.8mm-6mm-DC
A-CVBGA360-.4mm-10mm-DC
A-CVBGA432-.4mm-13mm-DC
A-DualRowMLF156-12mm-.5mm-DC
A-tsCSP208-.5mm-15mm-DC
A-CTBGA84-.5mm-7mm-DC
A-CTBGA228-.5mm-12mm-DC
A-MLF8-3mm-.65mm-DC
A-MLF16-5mm-.8mm-DC
A-MLF20-5mm-.65mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF32-7mm-.65mm-DC
A-MLF44-7mm-.5mm-DC
A-MLF48-7mm-.5mm
A-MLF68-10mm-.5mm-DC
A-PBGA1156-1.0mm-35mm-DC
A-PBGA156-1.0mm-15mm-DC
A-PBGA160-1.0mm-15mm-DC
A-PBGA192-1.0mm-17mm-DC
A-PBGA196-1.0mm-15mmDC
A-PBGA208-1.0mm-17mm-DC
A-PBGA208-1.0mm-17mm-non DC
A-PBGA208-1.27mm-23mm-DC
A-PBGA217-1.27mm-23mm-DC
A-PBGA240-1.27mm-23mm-DC
A-PBGA249-1.27mm-23mm-DC
A-PBGA256-1.0mm-17mm-DC
A-PBGA256-1.27mm-27mm-DC
A-PBGA272-1.27mm-27mm-DC
A-PBGA288-1.0mm-23mm-DC
A-PBGA300-1.27mm-27mm-DC
A-PBGA304-1.27mm-31mm-DC
A-PBGA316-1.27mm-27mm-DC
A-PBGA324-1.0mm-23mm-DC
A-PBGA329-1.27mm-31mm-DC
A-PBGA352-1.27mm-35mm-DC
A-PBGA356-1.27mm-27mm-DC
A-PBGA388-1.27mm-35mm-DC
A-PBGA416-1.0mm-27mm-DC
A-PBGA484-1.0mm-27mm-DC
A-PBGA580-1.0mm-35mm-DC
A-PBGA676-1.0mm-27mm-DC
A-PBGA680-1.0mm-35mm-DC
A-QFP240-32mm-.5mm-2.6mm
A-T1-TSOP32-8x20mm-.5mm
A-TSSOP20T-4.4mm
Axial Electrolytic, 5x11
BQFP100-22.6mm-.636mm
CKO5
DIP14
DIP16
50
Kit Part Number

DIP20-DC
DO35
DPAK(TO252)
LQFP100-14mm-.5mm-2.0mm
LQFP120-14mm-.4mm-2.0
LQFP160-24mm
LQFP176-24mm-.5mm-2.0mm
LQFP32-7mm-.8mm-2.0
LQFP64-14mm-.8mm-2.0
LQFP64-7mm-.4mm-2.0
LQFP144-20mm-.5mm-2.0
Mono Capacitor - .200" lead space
PB08-200x200 Flip Chip
PBGA169-1.5mm-23mm-DC
PLCC20
PLCC28
PLCC44
PLCC68
PLCC68-DC
QFP100-14x20mm-.65mm-3.2mm
QFP100-14x20mm-.65mm-3.9mm-DC
QFP144-28mm-.65mm-2.6mm
QFP208-28mm-.5mm-2.6mm
QFP208-28mm-.5mm-2.6mm-DC
QFP256-28mm-.4mm-2.6mm-DC
QFP64-14mm-.8mm-3.9mm
QFP44-10mm-.8mm-3.2mm
QFP44-10mm-.8mm-3.9mm
QFP48-12mm-.8mm-3.3mm
QFP52-10mm-.65mm-3.9mm
SO8-3.8mm
SO14-3.8mm
SO16-3.8mm
SO16-5.6mm
SO16-7.6mm-DC
SO18G-7.6mm
SO20-7.6mm
SO44G-13.3mm
SOD80
SOT143-TR
SOT23-TR
Spacer, CKO5
SSOP14T-5.3mm
SSOP16-3.8mm
SSOP20T-5.3mm-DC
SSOP20T-5.3mm
SSOP28T-5.3mm
SSOP8T-5.3mm
Sticky Tape (double sided)
T05
T11-TSOP54-10.16X22.22mm-.8mm
T11-TSOP44-10.16X18.42mm-.8mm
Terminal Holder Board, TB1
Terminal, Bifurcated
Terminal, Gold Cup
Terminal, Hook
Terminal, Pierced
Terminal, Turret
TO18
TO5/18 Spacer
Wire, 20 guage
Wire, 22 guage
Wire, 26 guage




























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Component Part Number
PC000
PC003
PC007
PC008
PC009
PC011
SABER
PC012
PC013
PC014
PC015
PC016
PC020
PC031
WTK-1
PC049
PC2006
SIR
Kit Part Number
PC000
PC003
PC007
PC008
PC009
PC011
SABER
PC012
PC013
PC014
PC015
PC016
PC020
PC031
WTK-1
PC049
PC2006
SIR
Component Part Numbers / Kit Numbers
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Note
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Not all components listed are available Pb-free. Please contact
Practical to verify availability when ordering Pb-free kits.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Single Pack Hand Solder Kits
The kits listed below are for Hand Assembly. Each kit is prepackaged as
an individual kit. Each component is bagged and labeled for identification. The test board is also individually bagged. Both kit and test board
are put in a cardboard box that identifies the kit contents. Kits can be
customized to meet specific needs. Please call regarding availability of
Lead-Free single pack soldering kits.
Reference List for Single Pack Kits
IPC
Reference
Kit Part Number
Description
10680
13100
13200
13100
12041
15850
15848
15923
15924
15212
15213
15214
15215
15216
15217
15218
16620
16621
19284
15220
15082
15073
15075
15074
PC003
PC007T-0-01
PC007B-0-01
PC007K-0-01
PC009
PC011-0-01
PC012-0-01
PC012T-0-01
PC012B-0-01
PC013-K
PC013-BTK
PC013-RWTK-1
PC013-RK
PC015-0-01-STD
PC015-0-01-RWK
PC016-0-01
PC020-T
PC020-B
PC020-K
WTK-1
PB18-250x250-001
PB18-500x500-001
PB08-200x200-001
FA10-200x200-001
Hand Solder Kit, 2.5" square
MLF Hand Assembly Kit
SMT Hand Assembly Kit (T/LQFP, TSOP, BGA ,tsCSP, DualRowMLF)
MLF / Fine Pitch SMT (top and bottom)
Mixed Technology Kit
Fine Pitch BGA Kit (0.4, 0.5, 1.0mm)
Global BGA Test Kit (1.0mm and 1.27mm pitch)
Global BGA Test Kit (topside only, 1.0mm pitch)
Global BGA Test Kit (bottomside only, 1.27mm pitch)
Through Hole Kit (with wires and terminals)
Through-Hole Kit (no wires or terminals)
Recertification Kit (with wires and terminals)
Recertification Kit (no wires or terminals)
Rework Kit (unassembled)
Rework Kit (assembled)
Mixed Tech Kit
Practical SMT Kit (topside only)
Practical SMT Kit (bottomside only)
Practical SMT Kit (top and bottom)
Wires and Terminals (with or without holder)
FlipChip Kit, 250 mils square, 18 mil pitch
FlipChip Kit, 500 mils square, 18 mil pitch
FlipChip kit, 200 mils square, 8 mil pitch
FlipChip kit, 200 mils square, 10 mil pitch
Pb
Looking for Lead-Free?
This symbol indicates that
lead-free parts are available!
J-Std-001
J-Std-001
J-Std-001
J-Std-001
7711/7721
7711/7721
J-Std-001 Rev d
Page
Number
55
58
58
58
62
63
65
65
65
66
66
66
66
69
69
70
71
71
71
83
80
80
81
81
PC Boards & Kits
Part Number
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
51
Traceability & Control Validation Kit
Practical Components and Aegis Industrial Software, the leader in
Manufacturing Information Management Systems, have partnered
together to offer a traceability and control kit designed to validate your
entire manufacturing process and provide the potential for rich product
and process traceability detail.
Traceability and process control are no longer requirements reserved
for manufacturers in regulatory or specific market segments. Today, all
manufacturers who aspire to achieve or to maintain a ‘world class’ status
must deliver some degree of traceability. Until now, there has not existed
a common language regarding the nature of traceability or its levels. Nor
was there a means to benchmark such capability or to communicate its
nature to customers or regulatory agencies in a common manner.
The new Traceability & Control Validation Kit provides the physical materials and the procedural guide to determine your factories traceability
and control capability, and then rate the results in a formalized matrix.
These ratings can be used to demonstrate your capabilities, communicate to customers or auditors, or to provide a start point on a path to
improve your capabilities and track progress along the way.
PC Boards & Kits
Benchmark Your Traceability and Control
Rate your traceability and control far beyond simple component traceability. Using the procedural guide and materials provided in this kit,
a manufacturer can test and validate two key elements of traceability;
control mechanisms to assure process execution is proper even under
high-change conditions, and the resultant reporting scope and depth
their traceability systems will deliver. This dual approach of validating
process control and visibility yields a comprehensive assessment of
your capabilities.
Communicate Your Capability
Manufacturers all over the world have been searching for a way to
convey to their customers or auditors their traceability capability. In the
past, it has been impossible without a common rating system or even
a generalized agreement on the maximum range of what traceability
entails. One party may believe traceability is simple lot traceability of
components while another may include all quality, test, packaging and
machine data feeds from the entire process.
The purpose of this kit is to produce a common rating on the scale from
simple traceability to the very advanced. The scale can then be used
to communicate your capabilities in a uniform manner to those who
require this information.
Improve What You Measure
The rating scale will also help manufacturers who are continuously looking for ways to improve their factory operations. Through uniformed
measurements, a roadmap can be developed to improve your plant to
even greater levels of traceability. By measuring your abilities today, this
kit can help create a defined path to the future.
52
!
NEW
Technical Basis
As the only solution provider of information systems delivering such
scope of control and traceability, Aegis has the unique technical experience to deliver such a kit in conjunction with Practical Components.
Aegis’ methods of rating traceability have been concurrently developed
with, and adopted by, many of the leading manufacturers in the industry. Now your enterprise can benefit from over 6 years of definition and
usage in factories all over the world to rate your systems and processes
against this scale.
Use this Kit’s Materials and Procedural Guide to Determine Your
Traceability and Control Capability in the Following Categories:
Traceability Validation
Production and Release Authentication History
Process Documentation History
Consumable Lots Used at Every Process Step
Tooling ID’s Used at Every Process Step
Component Lot Traceability From Automated Mounters
Component Lot Traceability From Hand Insertion
PCB Panel and Image Record Integrity
Route History and Cycle Rate
Operator ID at Every Process Step
Process and Product Content Deviation Notices
Pin, Component and Product Quality Indictment/Diag./Repair
Test and Measurement Records
Parametric Data Records
Machine Events and Alarms
Box-Build Genealogy
Packaging and Shipment Genealogy
Process Control Supporting Proper Traceability
Assured Identifier Acquisition on Conveyorized Line
PCB Panel to Image Mapping Control
Assured Documentation and Version Dispatch to Station
Consumable Validation Line Control
Tooling Validation and Line Control
Feeder/Component Validation and Line Control
Route Sequence Enforcement
Packout Control
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Traceability & Control Validation Kit
PC009-40 Traceability & Control Validation Kit
Part Number
*Customer to choose between CABGA36 vs. PBGA256 upon order. Board
material is IS-410 with ImAg finish.
PC009-40 Traceability & Control Validation Kit
The PCB009 board is presented in a rotated 4-up panel to address the
challenges of multi-up assemblies for surface mount and through-hole
insertion processes. Both the panel and each image is directly laser
marked* with a barcode for serial identification. Barcode labels are also
included with the kit. Use of this panel provides for:




An identification label containing barcode details are found on each
reel, tray, and tube, providing knowledge of incoming material part
number relationships. The label includes an AGI (Aegis Global Identifier)
that serves as a unique identifier for each material instance. Below is
an example:

Establishing Panel ID-to-Image ID relationships
Proofing WIP tracking and Route Enforcement
Proofing Graphic Defect Collection and Repair
Verifying Circuit Image Ordering Across Machines
Verifying Placement Accuracy on Rotated Images
Note: A sample iServer database that contains a fully defined PC009
assembly example is available to existing Aegis customers with
FUSION systems.
*Laser marking services provided by Conveyor Technologies Incorporated (CTI). CTI Systems is a leading manufacturer of SMT connecting
conveyors and peripherals, including label and laser marking solutions.
Tel: (919) 776-7227
www.conveyor-technologies.com
The kit also includes the following items to support the control and
validation processes:





Guide for performing validation steps
Adhesive labels for each board and panel
Label files for use with Dymo Label Writer printers
Sample ECN/Deviation notices in PDF format for validating change
notification processes
Additional material labels with AGI numbers for affixing to
tooling , consumables and other materials that require validation in
order to build product
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
53
PC Boards & Kits
0603SMR-TR
0805SMR-TR
1206SMR-TR
6032SMTA-TR
*A-CABGA36-.8mm-6mm-DC
*A-PBGA256-1.27mm-27mm-DC
PLCC44
PLCC68
QFP208-28mm-.5-2.6mm-DC
QFP44-10mm-.8mm-3.2
SO16GT-3.8mm
SOD80-TR
SOT23-TR
1/2 Watt Axial Resistor
1/4 Watt Axial Resistor
5 x 11 Axial Electrolytic
CK05
DIP16T
DO35
TO5
PCB009-Aegis-ImAg
Kit Order Number:
Quantity
Quantity Per Kit
Per Board
(10 Panels)
20
800
20
800
20
800
10
400
1
40
1
40
1
40
1
40
1
40
1
40
4
160
10
400
10
400
5
200
5
200
2
80
5
200
4
160
5
200
5
200
4-up array
40 boards
PC009-40-MES-ImAg
!
NEW
Lead-Free Zero-Ohm SMD Resistor Kit
REVISED
The PCB000 test board has land patterns for 01005, 0201, 0402, and 0603
Zero Ohm Lead-Free SMD Resistors. Each component pad is connected
in series (daisy-chained) to the next pad. When zero ohm value resistors
are placed on the pad, the result is a line of continuity. This test board
can be used for placement accuracy evaluation with any type of compo-
[Rev. B]
nent matching the physical size of the pads. Each component type has
2,000 pads, except for 01005 pad size which has 165 pads for Pick-nPlacement purposes only with four different pad spacing. There are also
48 pads for 01005 to test for continuity.
PC Boards & Kits
PCB000 Zero-Ohm Test Board
P/N PCB000© 2ØØØ PRACTICAL COMPONENTS, INC.
Board size: 8" x 5.5", .062" thick, IS-410 board material. Standard
finish is Immersion Silver.
Board finishes available are:
ENIG, OSP-HT and Pb-free HASL.
SMD Resistors with Zero-Ohm value, and SMD Capacitors can be used on
this test board. Customers can mix and match components and quantities to create a custom kit. Please contact your Practical Components
sales representative for details.
PC000 SMD Lead-Free Zero-Ohm Resistor Kits
Part Description
*01005SMR-PA-0-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
PCB000-Zero Ohm Board
Kit Order Number (Lead-Free):
Quantity Per
5 Kits
1,000
10,000
10,000
10,000
5
PC000-0-5-LF
Quantity Per
10 Kits
2,000
20,000
20,000
20,000
10
PC000-0-10-LF


* 01005SMR-PA-0-Sn part is not included in kit. Can be added to
kit-build upon request for additional price.
Gerber and X, Y Theta data included at no charge.
Digitized files provided by Aegis Software included at no charge.
54
Quantity Per
20 Kits
3,500
40,000
40,000
40,000
20
PC000-0-20-LF
Quantity Per
25 Kits
4,300
50,000
50,000
50,000
25
PC000-0-25-LF
Quantity Per
50 Kits
8,500
100,000
100,000
100,000
50
PC000-0-50-LF
Order numbers for individual items
Notes

Quantity Per
15 Kits
3,000
30,000
30,000
30,000
15
PC000-0-15-LF
Part Description
Order Numbers
01005SMR-PA-0-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
PCB000-Zero Ohm Test Board
16463
12200
16069
16070
TBD (customer to specify finish)
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Solder Practice Board and Kit
Tin-Lead and Lead-Free Kits are available
The PC003 hand solder practice kit is a low cost, effective kit for training
and testing employees. This double-sided board has pads for 13 different components: One through-hole Dip14 and twelve surface-mount
components. Each item is individually bagged and tagged for easy identification. Kits consist of PLCCs, SOICs, TSSOPs, SOTs, Passives, and QFPs
with 0.5mm and 0.65mm pitch. This low cost kit is ideal for classroom
training and practice. IPC-A-610 Rev D compliant. Kit is available with
Tin-Lead or Lead-Free components.
PCB003 Solder Practice Board
IPC Compliant
Single Pack Kit
PC003 Solder Practice Board Kit
(Tin-Lead and Lead-Free components available)
Part Number
PC Boards & Kits
Top View—Board
size: 2.5" x 2.5"
PCB003 Board (customer to specify finish)
QFP208-28mm-.5mm-2.6mm
QFP44-10mm-.8mm-3.2mm
QFP100-14x20mm-.65mm-3.2mm
PLCC44
SO8GT-3.8mm
SO20GT-7.6mm
SOT23
SOT143
TSSOP20-4.4mm
0603SMR
0805SMR
1206SMR
DIP14T
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
Quantity
Per Kit
1
1
1
1
1
1
1
3
2
2
6
3
6
1
PC003
PC003-LF
Note


Standard finish
is HASL finish,
IS-410 board
material.
Other board
finishes available
are: ImAg, ENIG,
and Pb free HASL.
Gerber Data and X, Y Theta Data are available at no charge.
Lead-Free parts are available with Sn finish.
Software
Data Files and
Includ
With All Kit ed
s!
Bottom View
Order Number: PCB003 Rev B (Board Only)
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
55
SIR Test Board and Kit
REVISED
[Rev. A]
The Practical SIR board is double sided board to characterize fluxes by
determining the degradation of electrical insulation resistance of rigid
printed wiring board specimens after exposure to the specified flux. This
test is carried out at height humidity and heat conditions. The board
contains pads for LCC68 and A-PBGA208-1.0mm-17mm components. Kit
is available Tin-Lead or Lead-Free (see note.)
PC Boards & Kits
SIR Test Board
Standard finish is ImAg. IS-410 board material.
Order Number: PCB-SIR (Board Only)
SIR Kits
Part Description
68LCC-1.27mm-24.1mm
A-PBGA208-1.0mm-17mm-DC
Kit Order Number: (Tin-Lead)
Kit Order Number:(Lead-Free)
Quantity Per
1 Kit
4
2
SIR-0-01
SIR-0-01-LF
Quantity Per
5 Kits
20
10
SIR-0-05
SIR-0-05-LF
Quantity Per
10 Kits
40
20
SIR-0-10
SIR-0-10-LF
Notes


Gerber and X, Y Theta data included at no charge.
PBGA is available Lead-Free with SAC305 or SAC405 solder ball alloy’s.
LCC is only available with Au castellations which is standard.
56
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
BGA Variable Pitch and Array Board
Mix and match components to configure your custom kit.
Practical Components is now offering a “one-of-a-kind” BGA
Variable Pitch and Array PC Board. Each board contains matrices for the
most popular ball pitches found on BGAs and CSPs. The use of full matrices allows maximum flexibility for placing parts with full, staggered,
or perimeter configurations. Each board has a mixture of even and odd
matrices to enable placement, using automatic equipment, of the highest ball counts available.
KLAPHEN@PRACTICALCOMPONENTS.COM
FAX: 714.252.0026
FAX: 714.252.0026
Top View
Bottom View
Order Number: PCB005 (Board Only)
Notes




Kits can be configured to the customer’s requirements.
Gerber Data and X, Y Theta Data are available if required at
no charge.
Digitized files provided by Aegis Software included at no charge.
Pad dimensions:
 1.0mm pitch = 24 mil pad diameter
 1.27mm pitch = 28–30 mil pad diameter
 1.5mm = 28–30 mil pad diameter
 0.5mm = 11 mil pad diameter
 0.8mm = 18–19 mil pad diameter
 0.75mm = 18 mil pad diameter
Available as a
Single Pack Kit
Please call your Practical Components’ sales representative to identify
components available for the PCB005 Test Board.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
57
PC Boards & Kits
PHONE: 714.252.0010
PHONE: 714.252.0010
Standard finish is Immersion Silver.
WWW.PRACTICALCOMPONENTS.COM
PCB005 Variable Pitch and Array Board
MLF® Test Board and Kits
REVISED
[Rev. A]
Lead-Free and Tin-Lead Kits Available!
This new PCB007 MicroLeadFrame® (MLF®) Test Board is two test boards
in one. The top side of the board consists of daisy-chained MLF® pads.
Amkor’s new MLF® packages are a near CSP plastic encapsulated package with a copper leadframe substrate. MLF® packages have perimeter
pads on the bottom of the package. Thermal enhancement is provided
by Amkor’s ExposedPad™ technology.
The test board front side has land patterns for MLF® package sizes in
varying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and
0.8mm. The MLF® side of the PCB007 board is designed to help customers become more familiar with the placement and process characteristics of MLF® packages. The wide assortment of pad sizes and pitches provide a comprehensive overview of MLF® packages. Daisy-chain patterns
PCB007 MLF Test Board
on the PCB007 board complement the patterns on the components,
allowing continuity to be tested (except for TSOP‘s and T/LQFP120).
The bottom side of the PCB007 Test Board provides a variety of SMD
component types. The bottom of the board has T/LQFP component with
0.4mm pitch, pads for the PBGA256 component with a 1.00mm pitch
and two TSOP Type II components with 0.8mm pitch. Board also has
new tsCSP208 component with 0.5mm pitch and new DualRowMLF156
component with 0.5mm pitch. Standard board finish for the PCB007 is
Immersion Silver. Other finishes are available upon request. Standard
board thickness is 0.062". Customers always have the option of mixing
and matching components to suit their requirements.
Available as a
PC Boards & Kits
Single Pack Kit
Standard finish is Immersion Silver IS-410
board material.
Other board finishes available are: ENIG,
OSP-HT, and Pb free HASL.
Top view—
Board size: 8" x 5.5"
Software
Data Files and
Includ
With All Kit ed
s!
Bottom view
58
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
MLF® Test Board and Kits
PC007 MLF® Kits
(Lead-Free Option Available)
Part Description
Kit Order Number (Top and Bottom):
A-MLF8-3mm-.65mm-DC
A-MLF16-5mm-.8mm-DC
A-MLF20-5mm-.65mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF32-7mm-.65mm-DC
A-MLF44-7mm-.5mm-DC
A-MLF68-10mm-.5mm-DC
A-T/LQFP120-14mm-.4mm-2.0
A-tsCSP208-.5mm-15mm-DC
A-DualRowMLF156-12mm-.5mm-DC
PBGA256-1.0mm-17mm-DC
T11-TSOP44-10.16x18.42mm-.8mm
T11-TSOP54-10.16x22.22mm-.8mm
PCB007 Test Board
Part Description
Part Description
Kit Order Number (Top Only):
A-MLF8-3mm-.65mm-DC
A-MLF16-5mm-.8mm-DC
A-MLF20-5mm-.65mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF32-7mm-.65mm-DC
A-MLF44-7mm-.5mm-DC
A-MLF68-10mm-.5mm-DC
PCB007 Test Board
Quantity Per
5 Kits
PC007K-0-05
75
120
120
160
50
100
140
30
15
15
30
30
30
5
Quantity Per
10 Kits
PC007K-0-10
150
240
240
320
100
200
280
60
30
30
60
60
60
10
Quantity Per
20 Kits
PC007K-0-20
300
480
480
640
200
200
560
120
60
60
120
120
120
20
Quantity Per
50 Kits
PC007K-0-50
750
1,200
1,200
1,600
500
1,000
1,400
300
150
150
300
300
300
50
Quantity Per
1 Kit
PC007B-0-01
6
3
3
6
6
6
1
Quantity Per
5 Kits
PC007B-0-05
30
15
15
30
30
30
5
Quantity Per
10 Kits
PC007B-0-10
60
30
30
60
60
60
10
Quantity Per
20 Kits
PC007B-0-20
120
60
60
120
120
120
20
Quantity Per
50 Kits
PC007B-0-50
300
150
150
300
300
300
50
Quantity Per
1 Kit
PC007T-0-01
15
24
24
32
10
20
28
1
Quantity Per
5 Kits
PC007T-0-05
75
120
120
160
50
100
140
5
Quantity Per
10 Kits
PC007T-0-10
150
240
240
320
100
200
280
10
Quantity Per
20 Kits
PC007T-0-20
300
480
480
640
200
200
560
20
Quantity Per
50 Kits
PC007T-0-50
750
1,200
1,200
1,600
500
1,000
1,400
50
Notes






Kit quantities are subject to change.
Mix and match components and quantities to create a custom kit.
Please contact your sales representative for details.
Components supplied in kits (except for TSOP‘s and T/LQFP120) have
pairs of leads shorted together in a daisy-chain pattern that result in
a line of continuity when combined with the shorted pairs of pads on
the board. Continuity test pads on the board allow the end user to
verify electrical connections at solder joints and to identify electrical opens.
Gerber and X, Y Theta data included at no charge.
Digitized files provided by Aegis Software included at no charge.
PBGA is available with SAC305 or SAC405 Lead-Free solder ball alloy’s.
Available as a
PC Boards & Kits
Kit Order Number (Bottom Only):
A-T/LQFP120-14mm-.4mm-2.0
A-tsCSP208-.5mm-15mm-DC
A-DualRowMLF156-12mm-.5mm-DC
PBGA256-1.0mm-17mm-DC
T11-TSOP44-10.16x18.42mm-.8mm
T11-TSOP54-10.16X22.22mm-.8mm
PCB007 Test Board
Quantity Per
1 Kit
PC007K-0-01
15
24
24
32
10
20
28
6
3
3
6
6
6
1
Lead-Free Part Number List
Part Description
A-MLF8-3mm-.65mm-DC-Sn
A-MLF16-5mm-.8mm-DC-Sn
A-MLF20-5mm-.65mm-DC-Sn
A-MLF28-7mm-.8mm-DC-Sn
A-MLF32-7mm-.65mm-DC-Sn
A-MLF44-7mm-.5mm-DC-Sn
A-MLF68-10mm-.5mm-DC-Sn
A-T/LQFP120-14mm-.4mm-2.0-Sn
PBGA256-1.0mm-17mm-DC-SnAgCu
T11-TSOP44-10.16x18.42mm-.8mm-Sn
T11-TSOP54-10.16x22.22mm-.8mm-Sn
PCB007 Test Board (customer to specify board finish)
Single Pack Kit
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
59
Solder Practice Board and Kits
REVISED
[Rev. H]
A universal PCB to meet all your needs.
Rework practice, solder training and evaluation, and for testing and
calibration of pick-and-place machines.
Lead-Free Option Available!
Order Number: PCB008 Rev H (Board Only)
PCB008 Solder Practice Board
Software
Data Files and
Includ
With All Kit ed
s!
PC Boards & Kits
Standard finish is
Immersion Silver. IS410 board material.
Other board finishes
available are: ENIG,
OSP-HT, and Pb-free
HASL.
Top view—
Board size: 5.5" x 8".
Bottom view—
Board size: 5.5" x 8".
60
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Solder Practice Board and Kits
Choose from the kits below or create your own custom configuration.
Tin-Lead Components List
(included in a complete kit)
Lead-Free Components List
(included in a complete kit)
MLF68-10mm-.5mm-DC-Sn
PBGA256-1.0mm-17mm-DC-LF
CVBGA97-.4mm-5mm-DC-LF
PBGA388-1.27mm-35mm-DC-LF
QFP44-10mm-.8mm-3.9mm-Sn
QFP100-14x20mm-.65mm-3.9mm-DC-Sn
QFP208-28mm-.5mm-2.6mm-DC-Sn
QFP256-28mm-.4mm-2.6mm-DC-Sn
LQFP100-14mm-.5mm-2.0mm-Sn
PLCC20-Sn
PLCC44-Sn
PLCC68-Sn
SO8-3.8mm-Sn
SO14-3.8mm-Sn
SO20-7.6mm-Sn
SSOP20-5.3mm
01005SMR-Sn
SOT23-TR-Sn
SOT143-TR-Sn
0201SMR-Sn
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
PCB008 Board (customer to specify finish)
Number
Per Board
2
2
2
2
2
2
2
2
1
2
2
2
4
4
4
3
200
4
4
180
52
42
36
32
1
Part Number
MLF68-10mm-.5mm-DC
PBGA256-1.0mm-17mm-DC-LF
CVBGA97.4mm-5mm-DC-LF
PBGA388-1.27mm-35mm-DC-LF
QFP44-10mm-.8mm-3.9mm
QFP100-14x20mm-.65mm-3.9mm-DC
QFP208-28mm-.5mm-2.6mm-DC
QFP256-28mm-.4mm-2.6mm-DC
LQFP100-14mm-.5mm-2.0mm
PLCC20
PLCC44
PLCC68
SO8-3.8mm
SO14-3.8mm
SO20-7.6mm
SSOP20-5.3mm
01005SMR
SOT23-TR
SOT143-TR
0201SMR
0402SMR
0603SMR
0805SMR
1206SMR
PCB008 Board-HASL finish
PC Boards & Kits
Number
Per Board
2
2
2
2
2
2
2
2
1
2
2
2
4
4
4
3
200
4
4
180
52
42
36
32
1
Part Number
Component Quantities In Each Kit
Quantity of Parts Per Kit
Boards
PBGA169
1
2
6
12
12
24
24
48
48
96
1
6
12
24
48
1
2
6
12
Kit Order Number
PC008-BGA-1
PC008-BGA-6
PC008-BGA-12
PC008-BGA-24
PC008-BGA-48
PC008-QFP-1
PC008-QFP-6
PC008-QFP-12
PC008-QFP-24
PC008-QFP-48
PC008-BGA/QFP-1
PC008-BGA/QFP-6
PBGA225
2
12
24
48
96
2
12
Kit Order Numbers
Kit Order Number
(complete kit—top and bottom)
PC008K-1
PC008K-6
PC008K-12
PC008K-24
PC008K-48

PBGA352
2
12
24
48
96
Kit Order Number
(top side of kit only)
PC008-TOP-1
PC008-TOP-6
PC008-TOP-12
PC008-TOP-24
PC008-TOP-48
2
12
QFP100-.65mm
QFP208-.5mm
QFP256-.4mm
2
12
24
48
96
2
12
2
12
24
48
96
2
12
2
12
24
48
96
2
12
Notes





Gerber Data and X, Y Theta Data are available if required at no charge.
Digitized files provided by Aegis Software included at no charge.
Kit is available with Lead-Free components (for Tin-Lead and
Lead-Free kits). Substitutions may occur depending on availability of
lead-free finishes and alloys.
PBGAs are available with SAC305 or SAC405 Lead-Free alloys.
CVBGA is available with SAC105, SAC305 or SAC405 Lead-Free alloys.
Add “LF” to end of Kit Order Number when ordering Lead-Free kits.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
61
Mixed Technology Board and Kit
The PC009 Mixed Technology kit has surface mount components and
through-hole components. This kit’s primary use is for hand soldering
but is also available as machine run upon special request. Tin-Lead and
Lead-Free components available. Through-hole components are placed
in close proximity to surface mount components to represent real soldering situations. Components are individually bagged and identified
for component recognition.
Tin-Lead and Lead-Free Kits Available
PCB009 Mixed Technology Board
Order numbers for individual items
PC Boards & Kits
Part Description
A-PBGA256-1.27mm-27mm-DC-SAC405 or SAC305 **
A-CABGA36-.8mm-6mm-DC-SAC405 or SAC305 or SAC105 **
QFP208-28mm-.5mm-2.6mm-DC-Sn
SOT23-TR-Sn
PLCC44-Sn
PLCC68-Sn
SOD80-TR-Sn
SO16GT-3.8mm-Sn
6032SMTA-TR-Sn
0805SMR-TR-Sn
1206SMR-TR-Sn
0603SMR-TR-Sn
QFP44-10mm-.8mm-3.2-Sn
DIP16T-Sn
1/4 Watt Axial Resistor-Sn
1/2 Watt Axial Resistor-Sn
CK05-LF
T05-Sn
5 x 11 Axial Electrolytic-LF
DO35-LF
Board size: 4" x 5.5". Standard finish is Immersion Silver (also available with HASL, OSP-HT
finish). IS-410 board material.
PC009 Mixed Technology Kits
(Tin-Lead and Lead-Free parts)
Hand Assembly
Part Description
PCB009 Mixed Technology Board
SMD Components
A-PBGA256-1.27mm-27mm-DC **
A-CABGA36-.8mm-6mm-DC **
QFP208-28mm-.5mm-2.6mm-DC
SOT23-TR
PLCC44
PLCC68
SOD80-TR
SO16GT-3.8mm
6032SMTA-TR
0805SMR-TR
1206SMR-TR
0603SMR-TR
QFP44-10mm-.8mm-3.2
Through-Hole Components
DIP16T
1/4 Watt Axial Resistor
1/2 Watt Axial Resistor
CK05
T05
5 x 11 Axial Electrolytic
DO34 or DO35
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
62
Quantity Per
1 Kit
Machine Run
Quantity Per Quantity Per
Quantity Per
5 Kits
10 Kits
20 Kits
5
10
20
Quantity Per
50 Kit
50
1
1
1
10
1
1
10
4
10
20
20
20
1
5
5
5
50
5
5
50
20
50
100
100
100
5
4
5
5
5
5
2
5
PC009-0-01
PC009-0-01-LF
20
25
25
25
25
10
25
PC009-0-05
PC009-0-05-LF
10
10
10
100
10
10
100
40
100
200
200
200
10
20
20
20
200
20
20
200
80
200
400
400
400
20
50
50
50
500
50
50
500
200
500
1,000
1,000
1,000
50
40
50
50
50
50
20
50
PC009-0-10
PC009-0-10-LF
80
100
100
100
100
40
100
PC009-0-20
PC009-0-20-LF
200
250
250
250
250
100
250
PC009-0-50
PC009-0-50-LF
Available as a
Single Pack Kit
Kit available
with Tin-Lead or
Lead-Free parts.
Notes




**BGA/CABGA Packages are not
included in kit. Either BGA or
CABGA can be added to kit upon
request.
Mix and match components and
quantities to create a custom kit.
Gerber Data and X, Y Theta Data
are available at no charge.
Not all parts are available leadfree.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
BGA Fine Pitch Board and Kit
REVISED
[Rev. D]
Tin-Lead and Lead-Free Available
The PC011 BGA Kit contains Amkor daisy-chained fine pitch BGAs. The
daisy-chain PCB011 test board contains patterns for the 0.4mm pitch,
0.5mm pitch and 1.0mm pitch CSP/BGA components. Amkor BGA type
components on the board are the CTBGAs, CVBGAs and PBGAs. The
PCB011 test board is double sided. This test board is designed to help
the end user become familiar with smaller BGA body sizes and pitches.
Components come in standard JEDEC trays. Kit component quantities
are for one side of the board only.
PCB011 BGA Fine Pitch Board
PC Boards & Kits
Standard finish is Immersion Silver ENIG or OSP-HT finish.
IS-410 board material.
Part Description
A-CTBGA84-.5mm-7mm-DC-SnAgCu
A-CTBGA228-.5mm-12mm-DC-SnAgCu
A-CVBGA360-.4mm-10mm-DC-SnAgCu
A-CVBGA432-.4mm-13mm-DC-SnAgCu
A-PBGA196-1.0mm-15mm-DC-SnAgCu
A-PBGA676-1.0mm-27mm-DC-SnAgCu
PCB011-Amkor BGA Test Board
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
Quantity Per
1 kit
12
6
4
4
4
3
1
PC011-0-01
PC011-0-01-LF
Board size: 8" x 5.5"
PC011 BGA Kits
Quantity Per
5 kits
60
30
20
20
20
15
5
PC011-0-05
PC011-0-05-LF


Gerber and X, Y Theta data included at no charge.
Digitized files provided by Aegis Software included at no charge.
Lead-free parts available as standard finish. Kit components are available with SAC305 or SAC405 solder ball alloy’s for PBGAs. CVBGA and
CTBGA are available with SAC305, SAC405 or SAC105
Available as a
Single Pack Kit
Quantity Per
15 kits
180
90
60
60
60
45
15
PC011-0-15
PC011-0-15-LF
Quantity Per
20 kits
240
120
80
80
80
60
20
PC011-0-20
PC011-0-20-LF
Order numbers for individual items
Notes

Quantity Per
10 kits
120
60
40
40
40
30
10
PC011-0-10
PC011-0-10-LF
Part Description
Order Number
A-CTBGA84-.5mm-7mm-DC-SnAgCu
A-CTBGA228-.5mm-12mm-DC-SnAgCu
A-CVBGA360-.4mm-10mm-DC-SnAgCu
A-CVBGA432-.4mm-13mm-DC-SnAgCu
A-PBGA196-1.0mm-15mm-DC-SnAgCu
A-PBGA676-1.0mm-27mm-DC-SnAgCu
PCB011-Amkor BGA Test Board
31317
30640
31281
32182
30609
30726
15875
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
63
BGA Global Daisy-Chain Test Kit
Tin-Lead and Lead-Free Available!
PCB012 BGA Global Daisy-Chain Test Board
Standard finish
is Immersion
Silver.
IS-410 board
material.
PC Boards & Kits
Other board
finishes available are: ImAg,
ENIG, OSP-HT,
and Pb Free
HASL
Top view—
Board size:
8" x 5.5"
Bottom view
64
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
BGA Global Daisy-Chain Test Kit
Tin-Lead and Lead-Free Available!
The New PCB012 Global Daisy-Chain test board has 25 different BGA
land patterns. Board pads accommodate BGA components ranging
from 15mm square to 35mm square. The PCB012 test board has 1.00mm
and 1.27mm pitch pads. BGA components placed on this test board
range from 156 to 1,156 balls. Daisy-chain patterns on the PCB012 board
compliment the patterns on the components, allowing continuity to be
tested. Each pad on the board has multiple daisy-chain patterns. These
multiple daisy-chained pads allow different ball-count PBGA compo-
nents to be placed on the same pad. Each pattern has test points to
check for continuity. There are ball-count to test-point legends on the
board. Standard finish for the PCB012 board is Alpha Level Silver flash.
Other finishes are available upon request. Standard board thickness
is 0.062". The board is double-sided with different pad sizes on the
top and bottom. Customers can mix and match components to suit
their requirements.
PC012 BGA Global Daisy-Chain Kit
Quantity Per
5 Kits
Quantity Per
10 Kits
Quantity Per
20 Kits
Quantity Per
50 Kits
A-PBGA156-1.0mm-15mm-DC
A-PBGA160-1.0mm-15mm-DC
A-PBGA192-1.0mm-17mm-DC
A-PBGA208-1.0mm-17mm-DC
A-PBGA288-1.0mm-23mm-DC
A-PBGA324-1.0mm-23mm-DC
A-PBGA416-1.0mm-27mm-DC
A-PBGA484-1.0mm-27mm-DC
A-PBGA676-1.0mm-27mm-DC
A-PBGA580-1.0mm-35mm-DC
A-PBGA680-1.0mm-35mm-DC
A-PBGA1156-1.0mm-35mm-DC
A-PBGA208-1.27mm-23mm-DC
A-PBGA217-1.27mm-23mm-DC
A-PBGA240-1.27mm-23mm-DC
A-PBGA249-1.27mm-23mm-DC
A-PBGA256-1.27mm-27mm-DC
A-PBGA272-1.27mm-27mm-DC
A-PBGA300-1.27mm-27mm-DC
A-PBGA316-1.27mm-27mm-DC
A-PBGA356-1.27mm-27mm-DC
A-PBGA304-1.27mm-31mm-DC
A-PBGA329-1.27mm-31mm-DC
A-PBGA352-1.27mm-35mm-DC
A-PBGA388-1.27mm-35mm-DC
PCB012 Test Board
Kit Order Number:
5 Pads
Per Board
5
25
50
100
250
5 Pads
Per Board
5
25
50
100
250
4 Pads
Per Board
4
20
40
80
200
2 Pads
Per Board
2
10
20
40
100
2 Pads
Per Board
2
10
20
40
100
3 Pads
Per Board
3
15
30
60
150
3 Pads
Per Board
3
15
30
60
150
2 Pads
Per Board
2
10
20
40
100
2 Pads
Per Board
2
10
20
40
100
1
PC012-0-01
5
PC012-0-05
10
PC012-0-10
20
PC012-0-20
50
PC012-0-50
PC Boards & Kits
Quantity Per
1 Kit
Part Description
Notes





Kit quantities are subject to change.
Mix and match components and quantities to create a custom kit.
Please contact your sales representative for details.
Board is double sided (top side for 1.0mm pitch packages / bottom side
for 1.27mm pitch package)
Gerber and X, Y Theta data included at no charge.
Digitized files provided by Aegis Software included at no charge.
Available as a
Single Pack Kit
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
65
Through-Hole Solder Training Kits
PC013 Kits—Choose from four kits!
The PC013 hand solder practice kit is an effective way to evaluate or train employees and
students. This versatile board comes with a variety of through-hole components and each kit
is conveniently boxed and the components are
individually bagged and labeled for easy iden-
tification. It is available in several different options to meet each company’s requirements.
Kits come standard with an SO16 resistor
network, but can be upgraded to a Flat Pack
16. Always in stock and ready for shipment,
this kit is ideal for classroom settings.
Kit is available with Tin-Lead and
Lead-Free parts.
PCB013 Board
Available as a
Single Pack Kit
PC Boards & Kits
Basic Through-Hole Kit
Board size: 3" x 4", IS-410 board material. Other board finishes
available: HASL, ImAg, ENIG, and OSP-HT.
Complete Though-Hole Kit
Part Number
PCB013
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-5.6mm
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
66
Quantity
Per Kit
2
15
15
15
15
15
10
4
20
20
20
18
6
10
4
14
4
3'
3'
3'
PC013-K
PC013-K-LF
Part Number
Quantity
Per Kit
PCB013 (customer to
specify finish)
DO35
AE-5x12
CK05
CK05 Spacer
1/2-W-AR
1/4-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-5.6mm
Order Number: (Lead-Free)
Order Number:(Tin-Lead)
2
Note

SO16GT-5.6mm is not available Lead-Free.
Recertification Kit With
Wires And Terminals
Part Number
PCB013
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-5.6mm
20 Gauge Wire
26 Gauge Wire
Order Number: (Tin-Lead)
Order Number: (Lead-Free)
Quantity
Per Kit
1
5
5
5
5
5
2
1
6
6
5
3
2
2
2
4
1
5'
5'
PC013-RWTK-1
PC013-RWTK-1-LF
10
4
20
20
18
20
6
10
4
14
4
PC013-BTK -LF
PC013-BTK
Recertification Kit
Part Number
PCB013
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-5.6mm
Order Number: (Tin-Lead)
Order Number: (Lead-Free)
Quantity
Per Kit
1
2
1
6
6
5
3
2
2
2
4
1
PC013-RK
PC013-RK-LF
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
SMTA Saber Evaluation Board and Kit
Tin-Lead or Lead-Free Available!
SMTA Saber Evaluation PC Board
DISTRIBUTED BY:
PRACTICAL COMPONENTS, INC.
10762 NOEL STREET
LOS ALAMITOS, CA 90720
P: (714) 252-0010
F: (714) 252-0026
WWW.PRACTICALCOMPONENTS.COM
The SMTA Saber Evaluation Kit.
Practical Components is licensed by SMTA to distribute the Saber
Evaluation PC Board. The Saber Board includes land patterns for a
wide variety of JEDEC and EIAJ components.
The Saber Board is used to evaluate:






P&P equipment
Reflow process
Component placement accuracy
Cleanliness
Speed and accuracy of component placement
Solder paste screening
Notes



Gerber Data and X, Y Theta Data are available if required at
no charge.
Digitized files provided by Aegis Software included at no charge.
Lead-free parts are available.
PC Boards & Kits
Order Number: PCB-SABER (Board Only)
Standard board finish is Immersion Silver
IS-410 board material.
Other board finishes available are: ENIG,
OSP-HT, and Pb Free HASL
Available as a
Single Pack Kit
Top/bottom view (double-sided)
Board size: 3.875" x 5.375".
SMTA Saber Board Kits
Part Number
PCB-Saber (see chart for avail. finishes)
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
1210SMR-Sn
SOT23-Sn
DPAK(TO252)-Sn
SO16GT-3.8mm-Sn
SO20GT-7.6mm-Sn
PLCC68-Sn
T1-TSOP32-8x18.4mm-.5mm-Sn
QFP208-28mm-.5mm-2.6mm-Sn
QFP100-140x20mm-.65mm-3.9-DC-Sn
BQFP100-.636mm
PBGA169-1.5mm-23mm-DC-SnAgCu
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
Quantity Per
1 Kit
1
34
31
21
20
14
24
2
3
1
1
1
1
1
1
1
SMTA-Saber-1
SMTA-Saber-1-LF
Quantity Per
24 Kit
24
1,000
1,000
500
500
500
1,000
48
100
24
24
24
24
24
24
24
SMTA-Saber-24
SMTA-Saber-24-LF
Quantity Per
48 Kits
48
1,632
1,488
1,008
960
672
1,152
96
144
48
48
48
48
48
48
48
SMTA-Saber-48
SMTA-Saber-48-LF
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
Quantity Per
96 Kits
96
4,000
3,000
2,000
2,000
2,000
3,000
200
288
96
96
96
96
96
96
96
SMTA-Saber-96
SMTA-Saber-96-LF
67
IPC 9850 Attribute Defect Rate Kit
IPC 9850 Kit
PC Boards & Kits
Attribute Defect Rate Kit checks out pick and place machines.
IPC-9850 includes test methods for determining various SMT placement
equipment attributes, including repeatability, accuracy and attribute
defects. Each of these tests requires specific material and this new test
board and kit from Practical Components provides the solution for
conducting the attribute rate defect
testing. The applicable section from
IPC-9850 is 4.1, where attribute
defects are defined as components
placed upside down, tombstoned, on
side, missing or extra part, damaged
lead(s), damaged part(s), completely
off land, or wrong polarity. Testing
requires the placement of 88,000
components on 20 boards to attain
reasonably accurate test results.
Practical Components 9850 Kit will
provide you with enough components and boards to meet this
guideline. While IPC-9850 requires
the placement of components on
sticky tape (included), these boards
can also be printed with solder paste
and reflowed.
IPC Compliant
PCB014 Board
Each board contains the lands
(multiple orientations) for 4,400
components (440 SOT23s, 440 SO8s,
880 0603SMCs, 880 0603 SMRs, 880
0402SMCs and 880 0402SMRs). Test
material is available from Practical as single boards or complete
kits with all the necessary dummy
components. On request, this board
comes with demonstration versions of CircuitCAM and CheckPoint
manufacturing software, ready-torun CircuitCAM Project Files (CPFs)
and Gerber and X, Y Theta data at no
extra charge.
PC014 Kit (IPC 9850)
Part Description
SOT23-TR
SO8GTR-3.8mm
0402SMC-PA
0402SMR-PA
0603SMC-PA
0603SMR-PA
Sticky Tape
PCB014
Kit Order Number:
Quantity Per
5 Kits
3,000
2,500
10,000
10,000
8,000
5,000
1 Roll
5
PC014-0-05
Quantity Per
10 Kits
6,000
5,000
10,000
10,000
12,000
10,000
2 Rolls
10
PC014-0-10
Board size: 11" x 11", .062" thick. High Temp 170Tg board
material. Standard board finish is HASL.
Quantity Per
20 Kits
12,000
10,000
20,000
20,000
20,000
20,000
3 Rolls
20
PC014-0-20
Notes


Gerber Data and X, Y Theta Data are available, if required, at no charge.
Digitized files provided by Aegis Software included at no charge.
68
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Rework Kits
PC015 Rework Kit Conforms to IPC 7711/7721
Standards for reworking.
Kit is available with Lead-Free and
Tin/Lead components!
The PC015 Kit is ideal for rework training or evaluating current rework
procedures. This kit contains 2 fully populated boards and replacement
components to enable removing and replacing ½ of the components.
Reworked solder joints can then be visually compared to original solder
joints (on components not reworked) on the same board. Kit includes 2
boards which allows one to be used practice and one to be used evaluation. This kit conforms to the IPC 7711 and 7721 standards for reworking.
It contains a wide range of components from Through-Hole to Chip
Scale. Each kit is conveniently boxed with the replacement components
individually bagged and labeled for easy identification. Forget looking
for scrap boards for training purposes. Tin-Lead and Lead-Free components available.
PCB015 Board
This kit is perfect for classroom settings and can also be ordered
unassembled as a standard hand solder.
IPC Compliant
Available as a
Single Pack Kit
PC Boards & Kits
Contains boards populated
with components.
Standard board finish is
HASL or Immersion Silver.
IS-410 board material
Board size:
3.5" x 5.5"
PC015 Rework Kit Assembled
PC015 For Hand Assembly Kit
Part Number
Quantity Per Kit
Part Number
Quantity Per Kit
PCB015-Assembled
LQFP64-14mm-.8mm-2.0
LQFP32-7mm-.8mm-2.0
PLCC28T
SOT23
0603SMR
0805SMR
1206SMR
SOD80
SO14GT-3.8mm
1/4-W-AR
CK05 w/Standoff *see note
DIP14
TO5 w/Standoff
TO18 w/Standoff
MLF16-5mm-.8mm
A-CABGA36-.8mm-6mm-DC
Kit Order Number: (Tin-Lead)
Kit Order Number:(Lead-Free)
2
2
2
4
6
6
6
6
6
4
6
6
3
3
6
2
2
PC015-01
PC015-01-LF
PCB015-Standard
LQFP64-14mm-.8mm-2.0
LQFP32-7mm-.8mm-2.0
PLCC28
SOT23
0603SMR
0805SMR
1206SMR
SOD80
SO14GT-3.8mm
1/4-W-AR
CK05 *see note
CK05 Spacer
DIP14
TO5
TO18
TO5/18 Spacer
MLF16-5mm-.8mm-DC
A-CABGA36-.8mm-6mm-DC
Kit Order Number: (Tin-Lead)
Kit Order Number:(Lead-Free)
1
2
2
4
6
6
6
6
6
4
6
6
6
3
3
6
9
2
2
PC015-0-01-Std
PC015-0-01-Std-LF

*CK05 may be substituted with Radial Mono.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
69
IPC Compliant Hand Soldering Kit
PCB016 Board
Tin-Lead and Lead-Free Kits Available
PC016 Soldering Kit Conforms
to J-STD-001D Specifications
The PC016 Mixed Technology Kit is an effective and economical way to
train and evaluate students and employees. This kit contains a variety of
standard Surface Mount and Through-Hole components with traces to
simulate real world situations. Each kit comes individually boxed with all
components bagged and labeled for easy identification. Conforms to IPC
J-STD-001D standard for soldering. In stock and ready to ship, this kit is
perfect for classroom settings.
Available as a
Single Pack Kit
IPC Compliant
PC Boards & Kits
Board size: 3" x 4", .062 thick, IS-410 board material.
HASL and Immersion Silver finish is available.
PC016 Hand Soldering Kit
PC016 Lead-Free Hand Soldering Kit
Part Description
Quantity Per Kit
Part Description
Quantity Per Kit
PCB016
1/4-W-AR
TO5
TO5 Spacer
DO35
CK05 *see note
CK05 Spacer
DIP16
0805SMR
1206SMR
1206SMC
SOD80
SO14GT-3.8mm
QFP100-14x20mm-.65mm-3.2
PLCC20
Turret Terminals
Bifurcated Terminals
Pierced Terminals
Hook Terminals
Gold Cup Terminals
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
Kit Order Number: (Tin-Lead)
Kit Order Number: (Lead-Free)
2
4
4
4
4
4
4
4
4
4
4
4
2
2
2
4
4
4
4
4
3'
3'
3'
PC016-0-01
PC016-0-01-LF
PCB016
1/4-W-AR-Sn
TO5-Sn
TO5 Spacer
DO35-LF
CK05-LF *see note
CK05 Spacer
DIP16-Sn
0805SMR-Sn
1206SMR-Sn
1206SMC-Sn
SOD80-Sn
SO14-3.8mm-Sn
QFP100-14x20mm-.65mm-3.2mm-Sn
PLCC20-Sn
Turret Terminals
Bifurcated Terminals
Pierced Terminal
Hook Terminals
Gold Cup Terminals
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
Kit Order Number:
2
4
4
4
4
4
4
4
4
4
4
4
2
2
2
4
4
4
4
4
3'
3'
3'
PC016-0-01-LF
Note

*CK05 may be substituted with Radial Mono.
70
J-STD-001D is world-recognized as the sole industry-consensus standard
covering soldering materials and processes. This revision now includes
support for lead free manufacturing, in addition to easier to understand
criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three
classes of construction are included. Full color illustrations are provided
for clarity. This standard fully complements IPC-A-610D.
60 pages—Released February 2005.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Practical SMT Kit
The Practical PC020 SMT Kit has a wide variety of surface mount components. The PC board is double-sided. The top side consists of Tin/Lead
QFPs, SOICs, SSOP, TSOP and Flip Chip. Lead Pitch ranges from .65mm to
.4mm. Line traces are built into the board to simulate live PC boards. This
test board is an excellent tool for machine placement evaluation and rework training for fine pitch components. PC020T consists of components
for the top side of the board only.
The bottom side of the board (not pictured) consists of 500 0805 pads
and 500 1206 pads. Pads can be used for capacitors or resistors. Both the
1206 and 0805 pads are daisy-chained Zero Ohm Resistors that can be
placed on the board to perform continuity test. This side of the PC board
can be used to test high-speed passive component placement. The
PC020B consists of components for the bottom side of the board only.
The part number for both top and bottom side is PC020TB. This 4" x 5.5"
size test board comes with a standard HASL finish.
This kit is only available Tin/Lead (not Lead-Free)
PCB020 Board
PC Boards & Kits
Board size: 4" x 5.5", IS-410 board
material. HASL finish. Only
Tin/Lead parts available (not
Lead-Free)
PC020 SMT Kits
Part Description
PCB020
PB08-200x200
SSOP8T-5.3mm
QFP48-12mm-.8mm
PLCC20
SSOP16T-3.8mm
LQFP160-24mm
QFP52-10mm
SO44GT-13.3mm
SO18GT-7.6mm
T11-TSOP40/44-400 mil
0805SMR
1206SMR
Kit Order Number
Quantity Per
1 Kit
1
6
6
1
1
2
2
2
2
2
2
500
500
PC020-0-01
Quantity Per
5 Kits
5
30
30
5
5
10
10
10
10
10
10
2,500
2,500
PC020-0-05
Quantity Per
10 Kits
10
60
60
10
10
20
20
20
20
20
20
5,000
5,000
PC020-0-10
Quantity Per
20 Kits
20
120
120
20
20
40
40
40
40
40
40
10,000
10,000
PC020-0-20
Notes

Gerber Data and X,Y Theta Data are available if required at
no charge.

Digitized files provided by Aegis Software included at no charge.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
71
Lead-Free Process Capability Validation Kit
Cookson Electronics Lead-Free Process
Capability Validation Program
Practical Components and Cookson Electronics are teaming up to offer
a new Lead-Free Process Capability Validation Program. This program
consists of lead-free components and test boards from Practical Components, with Cookson Electronics’ analytical evaluation and process
capability validation services to the IPC and J-STD requirements.
Definition of Cookson Electronic Materials Included
The CE Analytics Test Kit consists of: PCB test boards with IS-410 laminate, various lead-free compatible pad finishes (ENTEK® PLUS™ CU-106AHT and Alpha-LEVEL™ Immersion Silver), industry standard lead-free
components, ALPHA™ OM-338 (M13) lead-free solder paste and ALPHA™
Telecore + cored wire, and process application guidelines.
Alpha-LEVEL™ is an immersion silver finish applied to circuit board
solder pads that develops a dense uniform silver deposit and provides
excellent Pb free soldering, reliability, and contact resistance.
The CE Analytics laboratory services include:
�� Lead-Free Process Capability Validation, comprised of:
PC Boards & Kits



Macro and microscopic inspection and analysis of processed assemblies compared to IPC and J-STD requirements.
Validation Report with recommendations for process optimization,
if applicable
CE Analytics Lead-Free Process Capability Validation Certificate.
�� Voiding Analysis
�� Macroscopic Examination of Processed Assemblies (non-destructive)
�� Microscopic Examination of Solder Connection Integrity.
Draw on CE Analytics expertise to validate your lead-free process
capabilities. You can reduce the cost, time, and worry associated with
converting to lead-free by using the new CE Analytics Lead-Free Process
Capability Validation. It is an easy three-step procedure:
�� Order the CE Analytics Lead-Free Test Kit, which includes boards, materials and components to set up and run a lead-free SMT, Thru-Hole,
Mixed Technology or Rework process.
�� Order a service package from CE Analytics and send in your processed
boards. In return, you will receive a detailed laboratory analysis, report, recommendations for optimization if applicable, and a Lead-Free
Process Capability Validation Certificate.
�� Run your lead-free process with confidence.
For More Information
For more information concerning price, delivery and how to order
the new CE Analytics Lead-Free Process Capability Validation go to
www.alphametals.com/lead_free/validation.html or contact Cookson
Electronics at 1-877-664-6263. To contact your Practical Components
sales representative about the CE Analytics Lead-Free Test Kit call
714-252-0010 or check our web site www.practicalcomponents.com.
72
IS-410 is a CAF resistant, lead-free assembly compatible laminate and
prepreg system that is ideal for high-density designs requiring multiple
soldering steps. IS-410 materials contain a unique resin technology that
offers exceptional IST thermal performance and reliability.
ALPHA® OM-338 (M13) is a broad latitude lead-free solder paste providing the lowest cost of ownership proven through a wide print process
window performance, ultra-fine pitch printing capability (0.25mm circles
and 0.4 mm pitch components) and excellent voiding resistance exceeding IPC7095 Class III standards.
ALPHA® Telecore Plus is a low residue core solder wire designed for
no-clean soldering applications that must meet all appropriate Bellcore
specifications. The unique blend of rosin and proprietary activators
provides rapid wetting while leaving minimal, optically clear, completely
inert residue.
Electroless Nickel/ Immersion Gold (ENIG) is a leading immersion
finish delivering excellent coverage, uniformity and mechanical strength
for good solderability. Low temperature operation allows for good solder mask compatibility. The finish has a long shelf-life and can withstand
multiple thermal cycles.
ALPHA® CUT Laser Cut Stencils are designed and manufactured to provide the ultimate stencil printing performance for most surface mount
requirements, particularly when used in conjunction with ALPHA® Solder
Pastes or ALPHA® Surface Mount Adhesives. The stencils are manufactured using a CAD/CAM driven high precision XY-laser cutting process.
Order Numbers
Stencils are sold separately as follows:


For PCB030 board design:
 Order Number: 82632 (29" x 29" size, 5mil thick)
 Order Number: 82633 (20" x 20" size, 5mil thick)
For PCB031 modified board design:
 Order Number: 134863 (29" x 29" size, 5mil thick)
 Order Number: 134864 (20" x 20" size, 5mil thick)
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Lead-Free Process Capability Validation Kit
Board Design Revised To Include Throughhole Components.
PCB031 Cookson Lead-Free Validation Board
PCB031 PC Board Chart
PCB Board (optional–customer to choose board finish)
PCB031-ENTEK (CU-106A-HT)
PCB031-AlphaLevel (Immersion Silver)
PCB031-ENIG (Electroless Nickel/Immersion Gold)
PC031 Cookson Lead-Free
Capability Validation Kit
Part Number
Notes







* See PC board chart above to specify board finish.
Gerber Data and X,Y Theta Data are available if required at
no charge.
Digitized files provided by Aegis Software.
All parts included in kit are lead-free.
Laminate board material is IS-410.
2-layer (.062" thickness).
Finishes available: ENTEK® CU-106A-HT, Alpha Level
Immersion Silver and ENIG (Electroless Nickel over Gold).
PC Boards & Kits
PCB031
0201SMR-Sn
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
1210SMR-Sn
SOT23-Sn
.200" Radial Mono Cap
SO16GT-3.8mm-Sn
SO20GT-7.6mm-Sn
PDIP16T-Sn
1/4-W-AR-Sn
TO-5-Sn
QFP256-28mm-.4mm-Sn
QFP100-14x20mm-.65mm-Sn
A-PBGA256-1.0mm-17mm-Sn/Ag/Cu
A-PBGA208-1.27mm-23mm-Sn/Ag/Cu
LQFP80-10mm-.4mm-Sn
LQFP100-14mm-.5mm-Sn
SOD80-Sn
CABGA36-6mm-.8mm-Sn/Ag/Cu
MLF48-7mm-.5mm-Sn
Kit Order Number:
Quantity
Per 24 Kits
24
1,250
1,000
1,000
1,000
1,000
500
500
120
72
24
72
240
96
24
24
24
24
24
24
250
24
43
PC031-0-24
Board size: 3.875" x 5.375".
Order Number: PCB031 (board only—customer to specify board finish upon
order. See PC board chart.)
Notice:
A limited number of PC030 SMT kits and boards are available.
Please call for availability.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
73
PoP (Package on Package) 14mm Board and Kit
Lead-Free Test Kit
!
NEW
This PoP 14mm Test Board and Kit is designed as a
test vehicle for the new Amkor (PSvfBGA) 14x14 353 PoP
package. PoP packages from Amkor focus on high
density logic devices.
PCB200 14mm Board
PoP packages are designed for products such as cell
phones, digital cameras and other mobile applications
benefiting from the combination of stacked packages
and small footprint technology. This test board enables
the end user to test their process applications on the top
and bottom PoP components.
With daisy-chain patterns in both packages and the
PCB200 Board, customers are able to check for continuity
to guarantee the integrity of their process.
PC Boards & Kits
Notes








Board size is 132 x 77mm, 8–layers, .039" thick,
no microvias.
Board material is IS-410 High Temp. 180Tg.
Standard board finish is OSP Entek CU-106A-HT.
15 daisy-chain pad placements for 14x14 353
PSvfBGA component.
Immersion Silver board finish is available upon special
request. MOQ may apply.
Gerber and X,Y Theta data included at no charge.
See page 8 for available solder ball alloy’s for PoP
components. SAC305, SAC405, SAC105 and SAC125Ni
is available.
12mm PC board and PoP components available
(see page 15).
Practical Components is the
exclusive distributor of
Amkor Technology Mechanical Components.
Order Number: PCB200-14mm (board only)
Order Number: 31290 A-PoP152-.65mm-14mm-DC-LF-SAC105 (top component only)
Order Number: 31291 A-PSvfBGA353-.65mm-14mm-DC-LF-SAC125Ni (bottom component only)
74
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Package on Package (PoP) Test Board and Kit
14x14mm Stacked Daisy Chain
!
NEW
14mm 353 PSvfBGA
Bottom Package Design Dimensions
Foot print - top (b)
Package size (a)
0.27mm
Max die size (d)
Foot print - bottom (c)
Foot Print–top (b)
Foot Print–bottom (c)
Die (d)
Bond Fingers
Available
14 x14 mm
0.65 pitch, 152 ball
21 matrix, 2 row
0.5 pitch, 340 I/Os
26 matrix, 4 row
+ 12 NC + A1 ball 353 BGA
8.9 mm
328 to 396
PC Boards & Kits
Body (a)
PoP Daisy Chain 3 Net Design
Daisy chain netlist of PSvfBGA, Bottom
package balls
Daisy chain netlist of top side (Top PoP to PSvfBGA 12
corner balls reserved for NC or additional supplies as
memory combinations may require).
M23 N23
Daisy chain netlist of top side (Top PoP to PSvfBGA
140 pin memory interface)
Bottom package called: Package Stackable very thin
fine pitch BGA(PSvfBGA)
M4 N4
* Color diagram of DC Net design available on our website.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
75
Package on Package (PoP) Test Board and Kit
14x14mm Stacked Daisy Chain
!
NEW
PSvfBGA 353
(Bottom Package) Daisy Chain Nets
Bottom side (top view through package) 14x14mm,
0.5 mm PSvfBGA353, 26x26 ball matrix
PC Boards & Kits
1 2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Top side—Top package interface (top view) 0.65 mm pitch,
152 pads, 21x21 ball matrix
12 15
15 18
16 19
17 20
18 21
19 22
20 23
21 24
23 26
24 25 26
31 42 53 64 75 86 97 108 11
9 12
10 13
11 14
1316
14 17
22 25
1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Daisy chain pattern
of PSvfBGA—Top
memory pads
(B) (B)
(A) (A)
Top side 12
corner ball DC net
2 13 24 3 5 4 6 57 68 7 9 810 911 10
18 1719 1820 1921 20 21
12 11
13 12
14 1315 1416 15
17 16
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern of PSvfBGA—Bottom BGAs
Top side 12 corner
Connected
Connected
thru thru
ball DC net bottom
bottom
side side
(B) (B)
Connected
Connected
with with
bottom
bottom
side side
(A) (A)
Top side 12 corner ball DC net
152 PoP
(Top Package) Daisy Chain Netlist
1
2
3
4
5
6
7
8
9
Top PoP + PSvfBGA
Daisy Chain Netlist
1
10 11 12 13 14 15 16 17 18 19 20 21
A
A
B
B
C
D
E
F
G
H
J
K
L
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21
Connected with
bottom side (B)
C
Top PoP package
Bottom side (top view
through package)
14x14 mm, 0.65 mm 152 PoP
21x21 ball matrix
2 tiers
M
N
P
R
D
E
F
G
H
Daisy chain
pattern of Top
package for
140 I/O memory
interface
J
K
L
Connected with
bottom side (A)
M
N
P
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern for 12 corner balls
(typically reserved as NC for applications with no
underfill, or option to add additional I/O or memory
supplies as required for high density combinations).
Top PoP
stacked on PSvfBGA
(top view through package)
Daisy chain netlist of Top PoP and PSvfBGA
* Color diagram of DC Net design available
on our website.
76
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Package on Package (PoP) Test Board and Kit
14x14mm Stacked Daisy Chain
!
NEW
Stacked View of 3 DC Nets
For BLR Testing
PWB Netlist Pattern
for BLR Testing
PWB (top view)
1 2
1-1
3 4 5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1 2
1-1
1-2
3-1
4-1
3-2
4-2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
3 4 5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1-2
3-1
4-1
3-2
4-2
PC Boards & Kits
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
PoP Overall Stack Up Example
B3
B2
B1
A2
A1
Symbol
Symbol
Unit
A1 (Ball, 0.5 pitch)
A2 (4L laminate)
mm
B1 (Ball, 0.65mm
pitch)
B2 (2L laminate)
mm
B3 (Mold cap)
mm
Overall Pkg height
mm
FBGA + PS-vfBGA
PoP + PSvfBGA
unit
Min
Max
Nom
Max 0.200
0.250
mmMin 0.150
mm0.150
0.260
0.340
0.250 0.300
mm0.260
0.270
0.330
0.340 0.300
mm0.270
0.180
0.240
0.330 0.210
mm0.180
0.420
0.480
0.240 0.450
mm0.420
1.378
1.542
0.480 1.460
Nom
0.200
A1 (Ball, 0.5 pitch)
A2 (4L laminate)
0.300
B1 (Ball, 0.65 pitch)
0.300
B2 (2L laminate)
0.210
B3 (Mold cap)
0.450
Overall Pkg Height
mm
1.378
1.542
1.460
B2 and B3 may vary depending on top memory FBGA (MCP) design rules.
on top
FBGA rules.
Stack up
to be
finalized
baseddesign
B2 and B3 may Overall
vary depending
on top
memory
PoP (MCP)
rules.
Overall Stack up to be finalized based on top FBGA rules.
* Color diagram of DC Net design available on our website.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
77
PoP (Package on Package) 12mm Board and Kit
Lead-Free Test Kit
!
NEW
PCB200 12mm Board
This PoP 12mm Board and Kit is designed as test vehicle
for the new Amkor (PSvfBGA) 12x12 305 PoP package. PoP
packages from Amkor focus on high density logic devices.
PoP packages are designed for products such as cell
phones, digital cameras and other mobile applications
benefiting from the combination of stacked packages
and small footprint technology. This test board enables
the end user to test their process applications on the top
and bottom PoP components.
With daisy-chain patterns in both packages and the
PCB200 Board, customers are able to check for continuity
to guarantee the integrity of their process.
PC Boards & Kits
Notes







Board size is 132 x 77mm, 8-layers, .039" thick, no microvias.
Board material is IS-410 High Temp 180Tg.
Standard board finish OSP Entek CU-106A-HT.
Immersion Silver finish is also available upon special
request. MOQ may apply.
15 daisy-chain pad placements for 12x12
305 PoP component.
Gerber and X,Y Theta data included at no charge.
See page 8 for available solder ball alloy’s for PoP
components. SAC305, SAC405, SAC105 and
SAC125Ni is available.
Practical Components is the
exclusive distributor of
Amkor Technology Mechanical Components.
Order Number: PCB200-12mm (board only)
Order Number: 31288 A-PoP128-.65mm12mm-DC-SAC105 (top component only)
Order Number: 31289 A-PSvfBGA305.5mm-12mm-DC-SAC125Ni (bottom component only)
78
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
SMT/PTH
Mixed Technology Pb-Free Kit
Indium Corporation SMT/PTH Mixed Technology Pb-Free Kit Practical
Components and Indium Corporation are introducing a new Lead-Free
SMT/Through-hole Mixed Technology test board and kit. The PCB049
Board can be used to evaluate the following conditions:










PCB049 Board
Solder paste wetting and spread.
Solder paste slump performance.
Solder perform Pin-in-Paste performance.
Wave flux hole fill performance.
P&P equipment and placement accuracy.
Reflow process capabilities.
Effectiveness of cleaning processes.
Surface Insulation resistance (SIR).
Surface finish interaction factors.
Pb-Free Underfill performance.
PC Boards & Kits
Board size: 8" x 12", FR4 170Tg board material.
Standard board finish is ImAg.
PC049 Indium Lead-Free Kit
Part Number
A-PBGA256-1.0mm-17mm-DC-LF
LQFP64-7mm-.4mm-2.0-DC-Dc
A-QFP208-28mm-.5mm-2.6-DC-Sn
A-QFP100-14x20mm-.65-3.9-DC-Sn
A-SSOP20T-5.3mm-DC-Sn
A-SO16GT-7.6mm-DC-Sn
A-PLCC68T-DC-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
1206SMR-PA-0-Sn
A-PDIP20T-7.6mm-DC-Sn
A-DIP16T-7.6mm-Sn
0805SMR-PA-0-Sn
1/4W-AR-Sn
TO5-Sn
Kit Order Number:
Quantity Per
24 Kits
48
48
48
48
72
72
48
1,200
3,000
3,000
2,000
144
24
1,000
168
96
PC049-0-24-LF
Order
Number
30555
31016
31120
31014
30682
16081
30597
16641
16631
16632
16634
30737
16496
16633
10685
16743
For details on evaluation techniques and material performance requirements, contact Chris Anglin of Indium Corporation at 1-800-4-INDIUM or
Test-Kit@Indium.com.
For complete information this kit or other Lead-Free solutions please
contact your Practical Components representative at 1-714-252-0010.
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
79
Flip Chip Test Die Kits
FlipChip
International
With an increasing number of I/O’s on Integrated
Circuits and accompanying requirements for high
performance, flip chip type components become
a compelling technology for potential users. Flip
Chip Technology test die are combined with factory
designed test boards to provide customers the ability to test a variety of die specs, bump pitches and
bump counts. Both components and test boards are
daisy-chained for continuity.
Laminate Board
Laminate board is double-sided board. One side has
10 pads for the PB18-250x250, the other side has 10
pads for the PB18-500x500.
Substrate Information
PC Boards & Kits
Board Type—High Temp FR4 (Tg = 176 °C); Board
Thickness—0.031" or 0.062"; Layers—4 (top, bottom,
ground, power) inner layers nonfunctional; Copper
Conductor—1 oz. Cu; Solder Mask—Taiyo PSR-4000;
Test Site Die—10 (250 x 250 mil2) sites on one side
of the board; Pitch—18 mil; Minimum Line—6 mil;
Maximum Space—12 mil; Test Site Die—10 (500 x 500
mil2) sites on one side of the board; Pitch—18 mil;
Minimum Line—6 mil; Maximum Space—12 mil.
Order Number: PB18-250x250 Laminate
Note

Board finish is Organic Solderability Preservative
(OSP).OSP, also known as ENTEK® (CU-106A-HT), is
a high performance, copper protective coating for
use on printed wiring board, which replaces hot
air solder leveling (HASL) and other metallic PWB
surface finishes. ENTEK® PLUS maintains surface
planarity and inhibits copper oxidation. Technical
data is on file upon request.
Available as a
Single Pack Kit
PB18-250x250 Kits
Part Description
PB18-250-DC
PB18-250/500 Laminate
Kit Order Number:
Quantity Per
1 Kit
10
1
PB18-250-001
Quantity Per
5 Kits
50
5
PB18-250-005
Quantity Per
10 Kits
100
10
PB18-250-010
Quantity Per
15 Kits
150
15
PB18-250-015
Quantity Per
20 Kits
200
20
PB18-250-020
PB18-500x500 Kits
Part Description
PB18-500-DC
PB18-250/500 Laminate
Kit Order Number:
Quantity Per
1 Kit
10
1
PB18-500-001
Quantity Per
5 Kits
50
5
PB18-500-005
Quantity Per
10 Kit
100
10
PB18-500-010
Quantity Per
15 Kits
150
15
PB18-500-015
Notes



The PB18-250x500 Laminate board is double sided with 10 pads on each
side. 10 pads for the PB18-250x250 and 10 pads for the PB18-500x500.
Digitized files provided by Aegis Software included at no charge.
Lead-free parts are available.
80
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Flip Chip Test Die Kits
Laminate Board
Laminate board is double-sided. One side has 10
pads for the PB8-2x2 (the back side is no longer
available for the PB8-4x6, this part has been
discontinued).
Substrate Information
Board Type—High Temp FR4; Board Thickness—
0.062"; Layers—4 (top, bottom, ground, power)
inner layers nonfunctional; Copper Conductor—1/4
oz. or 1/2 oz. Cu; Solder Mask—Taiyo PSR-4000; Test
Site Die—10 (200 x 200 mil2) sites on one side of
the board; Pitch—8 mil; Minimum Line—4mil; Minimum Space—4 mil; Wettable Cu Pad—4 x 8 mil2
(defined using a solder mask); Purpose— Flip Chip
on FR-4 board with daisy-chain structure. Board for
400x400 die size is not available.

Board finish is OSP (Entek CU-106A-HT)
Order Number: PB08-2x2-Laminate
Board Size: 3.5" x 5.5"
Part Description
PB08-200x200-DC
PB08 Laminate Board
Kit Order Number:
Quantity Per
5 Kits
50
5
PB08-2x2-005
Quantity Per
10 Kits
100
10
PB08-2x2-010
Quantity Per
15 Kits
150
15
PB08-2x2-015
PC Boards & Kits
PB08-200x200 Kits
Quantity Per
1 Kit
10
1
PB08-2x2-001
Quantity Per
20 Kits
200
20
PB08-2x2-020
Laminate Board
Laminate is only available for FA10-2x2. Singlesided pattern.
Substrate Information
Board Type—High Temp FR4; Board Thickness—
0.031"; Layers—4 (top, bottom, ground, power)
inner layers nonfunctional; Copper Conductor—1/4
oz. or 1/2 oz. Cu; Solder Mask—Taiyo PSR-4000;
Test Site Die—10 (200 x 200 mil2) sites on one
side of the board; Pitch—10 mil array; Minimum
Line—4 mil; Minimum Space—4 mil; Wettable Cu
Pad—5 mil diameter, round; Through-Hole Via—8
mil drill, 10 mil; capture pad. Board for 400x400
die size is not available.
Order Number: FA10-2x2-PCB
Board Size: 3.5" x 5.5"
FA10-200x200 Kits
Part Description
FA10-200x200-DC
FA10 Laminate
Kit Order Number:
Quantity Per
1 Kit
10
1
FA10-2x2-001
Note


Quantity Per
5 Kits
50
5
FA10-2x2-005
Quantity Per
10 Kits
100
10
FA10-2x2-010
Available as a
The FA10 Laminate board is single sided.
Digitized files provided by Aegis Software included at no charge.
Single Pack Kit
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
81
AIM Print Test Board and Kit
REVISED
The AIM print test board was designed to include many printing challenges which are commonly encountered on manufacturers assemblies.
BGA pads have circular and square pad design to test paste release. AIM
has included the standard IPC slump test pattern in order to further
challenge the properties of any product tested thereon. This print pattern is more real life and more accurate to predict slump since individual
pads are used instead of one pad that is common in the “thermometer”
method. There is a number on the board indicating the distances between pads so a hard number can be used for paste evaluations.
[Rev. A]
Common pad sizes were incorporated into the layout including 1206,
0805, 0402, and 0201 rectangular pads for discrete components. These
pads have varying distance between them so the user can determine
solder beading of paste. Four 250 x 250mil pads are available to be
utilized with various aperture styles in order to allow for wetting tests.
There are also several fine pitch QFP pads designed to check for the
propensity of any given product to cause bridging and to confirm the
existence of torn prints, peaking (dog ears), or bridging.
PC Boards & Kits
PCB2006 AIM Print Test Board
Board material is IS-410.
Standard finish: ImAg.
Board size: 8.5" x 6".
PC2006 AIM Test Kit
Notes


Digitized gerber files provided by Aegis Software includes at
no charge.
Kit available with Tin/Lead and Pb-free components.
Software
Data Files and
Includ
With All Kit ed
s!
82
Part Number
Quantity Per 20 Kits
A-T/LQFP144-20mm-.5mm-2.0
A-PBGA388-1.27mm-35mm-DC
A-LQFP64-7mm-.4mm-2.0
A-SSOP14T-5.3mm
A-PLCC20T
A-QFP144-28mm-.65mm-2.6
A-PBGA256-1.0mm-17mm-DC
A-PBGA196-1.0mm-15mm-DC
A-PBGA1156-1.0mm-35mm-DC
A-QFP44-10mm-.8mm-3.2mm
A-QFP64-14mm-.8mm-3.2mm
A-LQFP176-24mm-.5mm-2.0mm
A-PLCC68T
A-QFP240-32mm-.5mm-2.6mm
A-SSOP28T-5.3mm
A-SSOP20T-5.3mm
0603SMR
0805SMR
1206SMR
PCB2006 Rev A
Kit Order Number:
40
20
80
40
40
20
20
20
20
20
20
20
20
20
60
60
144
134
1206
20
PC2006-0-20
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Terminal and Wire Kit
The WTK-1 Kit includes everything needed to train and practice your
wire soldering skills. This kit contains three different gauges of wire
and five styles of terminals representative of what is available in the
marketplace. Our kit also comes standard with a Terminal Holder to keep
everything in place while soldering. Each kit comes individually packaged with all components bagged and tagged for easy identification.
Perfect for classroom settings.
.078 Dia.
Hole
.112 Dia.
Quantity
Per Kit
1
5
5
5
5
5
3'
3'
3'
TB01 — Terminal Holder
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
22 Gauge Wire
20 Gauge Wire
26 Gauge Wire
.112 Dia.

Kit is available without terminal holder.
.250
.460
.145 Dia.
.025 .114
.145 Dia.
Order
Number
11229
11228
11224
11227
11226
11225
16163
16164
16162
TB-01 Terminal Holder
Turret Terminal
.587
.047
.313
.178
.125 Dia.
.155
.050
.239
Hook Terminal
.170
.089 Dia.
12° Ref
R.060
.147
.062 Dia.
Hole
Bifurcated Terminal
.040 Dia.
Hole
.072 Dia.
.100
.126
PC Boards & Kits
Note
0.75
.187 Dia.
WTK-1 Kit
Part Description
0.46
.158
.312
.060 Dia.
Knurl
Available as a
Single Pack Kit
.025
.053
.020
.162
.718
.025
Square
Pierced Terminal
.510
Gold Cup Terminal
Measurements are in inches.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
83
Soldering Aids
Orange Sticks
Double Beveled Ends (7" x 5/32")
Beau Tech orange sticks are
made of high quality nonresin wood which will not
contaminate solder and component leads. Natural wood
is among the best material
that does not generate static
charge, thus is safe to use in
any ESD sensitive area. They
are effective, yet inexpensive
tools coming in packages of 100.
Applications

ESD SAFE




Use to position and hold Through-Hole and Surface Mount components for soldering and desoldering.
Use to bend component leads.
Use to guide wire on the board.
Use to break solder bridges.
Use to probe for loose components.
Order Number: SH-83 (Package of 100)
Package of 100
Vacuum Handling Tools
Practical LP20™ Handling Tool







Practical Handi-Vac® Vacuum Handling Tool
Price competitive (least expensive handling tool).
Perfect tool for handling small devices.
Measuring less than 2-1/2" (without needle).
Will lift up to 500 grams securely.
Will accept all the same needle and suction cups
from larger handling tools.
Includes 1 angled needle with 1/4" suction cup and
1 straight needle with 1/8" suction cup.
Static-safe and economical.
Order Number: LP20









ESD SAFE



Practical LP200™ Handling Tool

Tools & Supplies






No batteries to replace.
Fits in your pocket like a pen.
Perfect for handling surface mount components.
Vacuum cup rubber is ESD safe.
No vacuum hoses or power cords to get in your way.
Includes 3 angled needles with 1/4", 3/8" and 1/8" cup.
Made in the USA.
Order Number: LP200
Order Number: HV-KIT-ESD
ESD SAFE
Practical Pen-Vac® Vacuum Handling Tool









ESD SAFE
An inexpensive tool that no assembler should be without.
Good for handling surface mount components.
Selection of four probes with vacuum cups. Includes one 1/4" cup, one
3/8" cup and two 1/8" cups.
12.7mm
(1/2")
ESD safe with antistat treatment.
Vacuum-cup rubber is ESD safe.
69.85mm
(2 3/4")
Easily handles up to 3–ounce objects.
No batteries to replace.
Totally self-contained vacuum.
Can be included in all of your tool kits.
Cups can be mounted directly to tool.
Replaces tweezers for many applications.
Made in the U.S.A.



Fits in your pocket like a pen.
Perfect for handling surface mount components.
No vacuum hoses or power cords to get in your way.
Cups can be mounted directly to tool.
Includes two 1/4" cups, two 3/8" cups and two 1/8" cups.
Quick change luer lock fitting.
Length
Vacuum-cup rubber ESD safe.
146mm (5 3/4")
No batteries to replace.
Quick Change
Luer Lock Fitting
Blue aluminum body.
1/4"
1/8"
Lifts up to 500 grams.
Has rear storage cap.
Made in the U.S.A.
Order Number: V8901-LMS-ESD
84
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
ESD SAFE
12.7mm
(1/2")
Rear
Storage Cap
3/8"
Soldering Aids
Tools for the Latest Developments in Component
and Assembly Technologies
1 MilProbes for Ultra Fine Pitch Rework—
BGA, Flip Chip, TAB, COB, etc.
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex
shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either
straight (SH-341) or 50º angled at 5 mil from the point (SH-316). The different tip geometry allows the tips to reach between all circuit leads and
traces under a microscope.
Soldering Aid Kits
These Beau Tech kits contain the most popular tools. The vinyl cases
keep the tools clean, handy, and safe from damage. The clear vinyl front
allows easy selection of the tool to be used. The kits will also keep your
bench more organized. Selection of a kit denotes a true crafts person
and seeker of value.
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Kit Contents




SH-241, 10 MilProbe
SH-216, 10 MilProbe
Teflon Tip Protectors
Vinyl Case
Order Number: SH-222
(Minimum Order: 1)
Four-Piece TH/SMT RocHard 25 MilProbe Kit
Kit Contents

I MilProbe (SH-316) cleaning 3 mil pitch TAB substrate.




SH-116, 25 MilProbe
SH-117, 25 MilProbe
SH-123, 25 MilProbe
SH-141, 25 MilProbe
Vinyl Case
Order Number: SH-125
(Minimum Order: 1)
Overall dimensions of the 1 MilProbe,
straight and angled version.
Available Models: SH-316 (50º Angled)
SH-341 (Straight)
SH-322 (Kit including both SH-316 and SH-341)



MilProbe Selection Guide
A = 1 MilProbes, B = 10 MilProbes, C = 25 MilProbes
Application
Testing Solder Joint &
Wire Bonding Strength
Straightening Leads &
Wires
Cleaning Leads & Traces
Applying Epoxy
Kit Contents
Standard Aids



Miniature Aids


Pitch Size
2-10 mil
10-15 mil
15-25 mil
25-30 mil
30+ mil
Through-Hole
A
A, B
B
B, C
C
C
A
A, B
B
B, C
C
C
A
A
B
B
C
C
A
A
B
B
C
C
SH-20A Straight Flat Reamer/
Straight Fork Tip
SH-20B Angled Flat Reamer
Reamer/Straight Fork Tip
SH-20K Stainless Steel Brush/
Beveled Scraper Blade
Tools & Supplies

The probe tip is strong and long lasting since it is made of special,
proprietary alloy to achieve maximum strength.
The hex shape stainless steel handle provides a easy grasp of the tool
when operating under a microscope. It also prevents the tool from rolling on the work bench.
To further increase the comfort of using the tool, a foam sleeve that
goes onto the handle is available as an optional part.
The 1 MilProbe comes with a protection cap and a vinyl pouch. The
cap keeps the tip from damage and keeps the operator from injury.
The pouch provides additional protection to the tip and provides a
convenient way of storing and carrying the 1 MilProbe.
Six-Piece Standard/Miniature Soldering Aid Kit


SH-20C Straight Flat Reamer/
Straight Fork Tip
SH-20D Angled Flat Reamer Reamer/Straight Fork Tip
SH-20G Stainless Steel Brush/Beveled Scraper Blade
Vinyl Case
Order Number: SH-120 (Minimum Order: 1)
The new inspection mirror meets clean room requirements yet is
sufficiently economical for non-clean room.
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
85
Flextac™ BGA Rework Stencil Kit
Flextac™ BGA Rework Stencil Kit
includes 20 different sizes of BGA
rework stencils, a spatula handle
and three sizes of spatula blades.
There are a total of 40 stencils in kit
(2 stencils per type). Replacement
blades are available (see tool kit list
for order number).
If you’ve been using metal stencils for BGA rework, we have some great
news for you. Flextac™ BGA Rework Stencils…a creative new product
that is a major improvement over what you may be using now. These
flexible solder paste stencils are laser cut from high quality, anti-static
polymer film with a residue-free adhesive backing. Because they are
self-sticking, no tape or fixturing is needed. The adhesive seals around
each BGA pad to prevent solder paste from bleeding under the stencil
when the paste is applied. Flextac™ Stencils are easy to use and leave no
residue on the board surface.
Application

Features and Benefits




Tools & Supplies
Current BGA rework stencils are fabricated from metal and require fixturing or taping to position them and hold them in place. Metal stencils
warp easily, and if the circuit board has undulations in the board surface,
the metal stencil will not sit flat. Since there is no gasket-like seal, solder
paste can easily bleed under metal stencils when paste is applied with
a squeegee. Also solder paste can spill out over the sides of flat metal
stencils contaminating the circuit board surface. Metal stencils require
tedious stencil cleaning. To use metal stencils effectively, a high level of
operator skill is required.
To use, the operator folds the pre-scored side tabs and then peels off the
cover film from the bottom side of the stencil. The operator holds the
side tabs while placing the Flextac™ Stencil in position. If it is not correctly positioned, it can simply be removed and repositioned. The side
tabs also serve as solder dams preventing overspill. No external taping
or fixturing is used. Next the operator applies a small dab of solder paste
and uses a standard squeegee to spread the paste. Since the residue-free
adhesive seals around each BGA pad, the operator can make as many
passes as necessary with the squeegee to assure proper aperture filling.
The Flextac™ Stencil is then peeled up leaving a perfect deposit of solder
on each pad. Although Flextac™ Stencils are disposable, they can be
used several times.
86
Applying solder paste for BGA rework.



Residue-free adhesive backing seals around BGA pads to prevent
solder paste bleed.
Laser cut ensures precise aperture size.
Disposable—eliminates tedious stencil cleaning.
Flexible—conforms to board surface.
Fold-up sides for easy placement and solder paste containment.
Low cost.
Packaged in a handy ESD safe carrying case
Kit Part Number
Description
201-3120
Flextac™ BGA Rework Stencil Kit
Note

Custom pattern stencils are available as special order with up to 2,600
holes per stencil. Please call Practical for quotation.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Flextac™ BGA Rework Stencil Kit
Flextac™ BGA Rework Stencil Kits—each kit includes 2 stencils per ball count
PBGA
Ball Count
119
196
225
256
256
256
272
292
304
324
352
357
361
388
432
484
560
625
672
676
Part Number
B6-119-1422-127
B4-196-1515-100
B6-225-2727-150
B4-256-1717-100
B8-256-2121-127
B6-256-2727-127
B6-272-2727-127
B6-292-2727-127
B8-304-2125-127
B4-324-2323-100
B6-352-3535-127
B6-357-2525-127
B8-361-2525-127
B6-388-3535-127
B6-432-4040-127
B4-484-2323-100
B6-560-4242-127
B8-625-3232-127
B4-672-2727-100
B4-676-2727-100
Body Size
Pitch
Aperture Size
14 x 22mm
15mm
27mm
17mm
21mm
27mm
27mm
27mm
21 x 25mm
23mm
35mm
25mm
25mm
35mm
40mm
23mm
42.5mm
32.5mm
27mm
27mm
1.27mm
1.0mm
1.5mm
1.0mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.0mm
1.0mm
.020" (0.508mm)
.020" (0.508mm)
.025" (0.635mm)
.020" (0.508mm)
.032" (0.813mm)
.025" (0.635mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.025" (0.635mm)
.025" (0.635mm)
.020" (0.508mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
.020" (0.508mm)
Ball Pattern
(matrix)
7 x 17 Full Array
14 x 14 Full Array
15 x 15 Full Array
16 x 16 Full Array
16 x 16 Full Array
20 x 20 P4-Row
20 x 20 P4-Row + 4x4 center
20 x 20 P4-Row + 6x6 center
16 x 19 Full Array
22 x 22 P4-Row + 6x6 center
26 x 26 P4-Row
19 x 19 Full Array
19 x 19 Full Array
26 x 26 P4-Row + 6x6 center
31 x 31 P4-Row
22 x 22 Full Array
33 x 33 P5-Row
25 x 25 Full Array
26 x 26 Full Array
26 x 26 Full Array
Part Number System
Pitch
B6-119-1422-127
Stencil Thickness
in Mils
Ball Count
Body Size
Hand tools included in kit
Part Number
Description
115-3514
115-3502
115-3504
115-3506
115-3508
Spatula (1 piece)
Squeegee Blade Handle (1 piece)
Squeegee Blade—12mm (1 piece)
Squeegee Blade—27mm (1 piece)
Squeegee Blade—35mm (1 piece)
Part Number
B6-208-2323-127
B6-241-2323-127
B4-324-1919-100
B6-420-3535-127
B8-475-2532-127
B6-540-4242-127
B6-552-2525-100
B8-624-3232-127
B4-1156-3535-100
PBGA
Ball Count
208
241
324
420
475
540
552
624
1,156
Body Size
Pitch
Aperature Size
23mm
23mm
19mm
35mm
25 x 32mm
42.5mm
25mm
32.5mm
35mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.0mm
.025" (0.635mm)
.025" (0.635mm)
.020" (0.508mm)
.025" (0.635mm)
.030" (0.762mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
Tools & Supplies
Other PBGA stencils available (not included in kit)
Each item includes set of 10 stencils which depends on part number
Ball Pattern
(matrix)
17 x 17 P4-Row
17 x 17 P5-Row + 3x3 center
18 x 18 Full Array
26 x 26 P5-Row
19 x 25 Full Array
32 x 32 P5-Row
24 x 24 Full Array
25 x 25 Full Array
34 x 34 Full Array
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
87
Practical BGA Reballing Kit
The Practical BGA Reballing Kit features patented stencils and holder
to manually rework BGA components to original condition. Restore
costly BGAs to original condition using hot air rework stations or tools.
Simply squeegee on flux, pour on solder balls and rework with hot air!
BGA-Holder
Stencil
Ball Matrix
BGA5
BGA64
BGA81
BGA144
BGA297
BGA144
BGA192
BGA144
BGA196
BGA121
BGA180
BGA134
BGA289
BGA169
BGA100
BGA180
BGA208
BGA256
BGA156
BGA196
BGA160
BGA324
BGA121
BGA216
BGA324
BGA257
BGA257
BGA257
BGA361
BGA225
BGA144
BGA256
BGA208
BGA225
BGA441
BGA169
BGA208
BGA384
BGA484
BGA289
BGA196
BGA169
BGA196
BGA225
BGA121
BGA144
BGA324
BGA260
BGA529
BGA225
BGA256
BGA169
BGA196
8x8
9x9
12 x 12
21 x 21
13 x 13
16 x 16
12 x 12
14 x 14
11 x 11
16 x 16
16 x 16
17 x 17
13 x 13
10 x 10
18 x 18
17 x 17
18 x 18
14 x 14
14 x 14
14 x 14
18 x 18
11 x 11
18 x 18
18 x 18
19 x 19
19 x 19
19 x 19
19 x 19
15 x 15
12 x 12
16 x 16
16 x 16
15 x 15
21 x 21
13 x 13
16 x 16
22 x 22
22 x 22
17 x 17
14 x 14
13 x 13
14 x 14
15 x 15
11 x 11
12 x 12
18 x 18
18 x 18
23 x 23
15 x 15
16 x 16
13 x 13
14 x 14
BGA10
BGA11
BGA12
BGA14
BGA15
BGA16
Tools & Supplies
BGA17
BGA18
BGA19
BGA21
88
Body Size
(mm)
5x5
5x5
10 x 10
11 x 11
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
15 x 15
15 x 15
15 x 15
15 x 15
15 x 15
15 x 15
15 x 15
15 x 15
16 x 16
16 x 16
16 x 16
16 x 16
16 x 16
16 x 16
16 x 16
16 x 16
17 x 17
17 x 17
17 x 17
17 x 17
17 x 17
17 x 17
18 x 18
18 x 18
18 x 18
18 x 18
19 x 19
19 x 19
19 x 19
19 x 19
19 x 19
19 x 19
19 x 19
19 x 19
21 x 21
21 x 21
21 x 21
21 x 21
Pitch
(mm)
0.50
0.50
0.80
0.50
0.80
0.80
0.80
0.80
1.00
0.80
0.80
0.80
1.00
1.27
0.80
0.80
0.80
1.00
1.00
1.00
0.80
1.27
0.80
0.80
0.80
0.80
0.80
0.80
1.00
1.27
1.00
1.00
1.00
0.80
1.27
1.00
0.80
0.80
1.00
1.27
1.27
1.27
1.27
1.50
1.50
1.00
1.00
0.80
1.27
1.27
1.50
1.50
Stencils and holders are available separately, so you can purchase only
the stencils and stencil holders you need. All the standard stencils and
holders are available as a kit for one of the easiest and least expensive
BGA repair solutions.
BGA-Holder
BGA23
Stencil
Ball Matrix
BGA220
BGA255
BGA400
BGA676
BGA208
BGA217
BGA225
BGA289
BGA324
BGA196
BGA225
BGA256
BGA324
BGA240
BGA376
BGA456
BGA484
BGA168
BGA784
BGA548
20 x 20
16 x 16
20 x 20
26 x 26
17 x 17
17 x 17
15 x 15
17 x 17
18 x 18
14 x 14
15 x 15
16 x 16
22 x 22
17 x 17
22 x 22
22 x 22
22 x 22
17 x 17
28 x 28
26 x 26
Body Size
(mm)
21 x 21
21 x 21
21 x 21
21 x 21
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
23 x 23
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
Pitch
(mm)
1.00
1.27
1.00
0.80
1.27
1.27
1.27
1.27
1.27
1.50
1.50
1.27
1.00
1.27
1.00
1.00
1.00
1.27
0.80
0.80
Practical BGA Reballing Kit
Stencil
Ball Matrix
BGA25
BGA357
BGA361
BGA961
BGA576
BGA256
BGA292
BGA272
BGA256
HBGA256
BGA225
BGA676
BGA316
BGA456
BGA324
BGA672
BGA388
BGA1089
BGA441
BGA289
BGA400
BGA352
BGA783
BGA304
BGA329
BGA380
BGA432
BGA900
BGA896
BGA556
BGA575
BGA1444
BGA400
BGA576
HBGA304
BGA480
BGA1681
BGA1024
BGA625
BGA441
BGA1020
HBGA420
BGA484
BGA529
BGA313
BGA352
BGA356
BGA452
BGA676
BGA729
BGA787
BGA1089
BGA1156
BGA456
BGA388
HBGA352
BGA1148
BGA1152
BGA728
19 x 19
19 x 19
31 x 31
24 x 24
16 x 16
20 x 20
20 x 20
20 x 20
20 x 20
15 x 15
26 x 26
20 x 20
26 x 26
20 x 20
26 x 26
26 x 26
33 x 33
21 x 21
17 x 17
20 x 20
20 x 20
28 x 28
23 x 23
23 x 23
24 x 24
24 x 24
30 x 30
30 x 30
30 x 30
24 x 24
38 x 38
20 x 20
24 x 24
23 x 23
26 x 26
41 x 41
32 x 32
25 x 25
21 x 21
32 x 32
26 x 26
22 x 22
23 x 23
13 x 13
26 x 26
26 x 26
26 x 26
26 x 26
27 x 27
32 x 32
33 x 33
34 x 34
26 x 26
26 x 26
26 x 26
34 x 34
34 x 34
27 x 27
BGA27
BGA29
BGA31
BGA33
BGA35
Body Size
(mm)
25 x 25
25 x 25
25 x 25
25 x 25
25 x 25
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
27 x 27
17 x 27
27 x 27
29 x 29
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
31 x 31
33 x 33
33 x 33
33 x 33
33 x 33
33 x 33
33 x 33
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
Pitch
(mm)
1.27
1.27
0.80
1.00
1.50
1.27
1.27
1.27
1.27
1.50
1.00
1.27
1.00
1.27
1.00
1.00
0.80
1.27
1.50
1.27
1.27
1.00
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
0.80
1.50
1.27
1.27
1.27
0.80
1.00
1.27
1.50
1.00
1.27
1.50
1.50
2.54
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
1.27
1.27
1.00
1.00
1.27
BGA-Holder
BGA37,5
BGA40
BGA42,5
BGA45
BGA13x8
BGA13x15
Stencil
Ball Matrix
BGA492
BGA516
HBGA504
BGA672
BGA1849
BGA479
BGA456
BGA352
BGA680
BGA584
BGA552
BGA480
BGA2116
BGA1369
BGA841
BGA576
BGA838
BGA957
BGA1172
BGA1312
BGA564
BGA596
BGA656
BGA658
BGA600
BGA680
BGA1517
BGA432
BGA2401
BGA1521
BGA961
BGA676
BGA860
BGA560
BGA1704
HBGA560
BGA1696
BGA2500
BGA1764
BGA1089
BGA784
BGA1600
BGA652
BGA90
BGA165
26 x 26
26 x 26
27 x 27
26 x 26
43 x 43
26 x 26
26 x 26
26 x 26
34 x 34
29 x 29
29 x 29
29 x 29
46 x 46
37 x 37
29 x 29
24 x 24
29 x 29
31 x 31
39 x 39
39 x 39
30 x 30
30 x 30
30 x 30
30 x 30
31 x 31
39 x 39
39 x 39
31 x 31
49 x 49
39 x 39
31 x 31
26 x 26
42 x 42
33 x 33
42 x 42
33 x 33
42 x 42
50 x 50
42 x 42
33 x 33
28 x 28
40 x 40
35 x 35
6 x 15
15 x 11
Body Size
(mm)
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
35 x 35
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
40 x 40
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
42.5 x 42.5
45 x 45
8 x 13
15 x 13
Pitch
(mm)
1.27
1.27
1.27
1.27
0.80
1.27
1.27
1.27
1.00
1.27
1.27
1.27
0.80
1.00
1.27
1.50
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.27
0.80
1.00
1.27
1.50
1.00
1.27
1.00
1.27
1.00
0.80
1.00
1.27
1.50
1.00
1.27
0.80
1.00
Tools & Supplies
BGA-Holder
Notes



Stencils and holders available individually.
Custom stencils and holders are available for additional price. Call
Practical for quotation.
Kit can be special quoted with multiple stencils and holders. Call
Practical for quotation.
Kit Contents for 150-X BGA Kit




Fluxpen
Vial of 50,000 Solder Balls.Choice of 20 mil, 25 mil or 30 mil solder
spheres.Choice of Sn63/Pb37 or Sn10/Pb90 solder alloy.
1 standard holder (component specific).
1 standard stencil (component specific).
Kit Order Number: 150-X BGA Reballing Kit
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
89
A Study on Package Stacking Process for
Package-on-Package (PoP)
A Study on Package Stacking Process for Package-on-Package (PoP)
Akito Yoshida, Jun Taniguchi, *Katsumasa Murata, *Morihiro Kada, **Yusuke Yamamoto,
***Yoshinori Takagi, ***Takeru Notomi, ***Asako Fujita
Amkor Technology Inc. 1900 South Price Road, Chandler, AZ 85248
*Sharp Corporation 2613-1, Ichinomoto-cho, Tenri, Nara 632-8567, Japan
**Panasonic Factory Solutions Co., Ltd. 441-13 Nagahasu Tateishi-cho, Tosu, Saga 841-8585, Japan
***Senju Metal Industry Co., Ltd. 23 Senju-Hashido-Cho, Adachi-ku, Tokyo 120-8555, Japan
E-mail : ayosh@amkor.com, jtani@amkor.com, phone : 480-821-2408 ext. 5746, fax : 480-855-6345
*E-mail : murata.katsumasa@sharp.co.jp, kada.morihiko@sharp.co.jp, phone : +81-743-65-2779, fax : +81-743-65-4084
**E-mail : yamamoto.usuke@jp.panasonic.com, phone : +81-942-84-5601, fax : +81-942-84-5620
***E-mail : ytakagi@senju-m.co.jp, tnoutomi@senju-m.co.jp, afujita@senju-m.co.jp,
phone : +81-3-3888-4019, fax : +81-3-5244-1763
Abstract
This paper outlines package stacking process guidelines for
a Package-on-Package (PoP) configuration. PoP stacks
currently in production or development consist of a bottom
package containing a high performance logic device designed
to receive a mating top package typically containing high
capacity or combination memory devices. System
manufactures achieve lowest cost and maximum logistical
benefits, when these two components are sourced from
different IC device suppliers then stacked in the final board
assembly flow. Thus, the package stacking process is a key
technology in order for system manufacturers to be able to
select the top and bottom components from various suppliers.
This is because each package may have a different warpage
trend from room temperature to reflow temperature.
In this study, Sharp’s Chip Scale Package (top CSP) was
mounted on Amkor’s bottom CSP to enable package stacking
in order to know if packages from two suppliers can get a
good solder joint after stacking. The top package is 152 balls
CSP with 0.65mm pitch, and a 2-row format. The bottom CSP
is 352 balls with 0.5mm pitch and a 4-row format. In both
cases, the package size is 14mm x 14mm. Flux and solder
paste provided by Senju Metal Industry were tested to stack
the packages and mount them on test boards using a multifunctional placement machine manufactured by Panasonic
Factory Solutions. While selecting the top package with
minimum warpage, both at room and reflow temperature, we
varied the warpage amount from 50 to 150 um for the bottom
package by changing the die size and then investigating the
solder joint. The result showed that even in the case where the
bottom package had large warpage, the solder joint of the topto-bottom package was well formed by the fluxing process.
However, we observed open solder joints between the bottom
package and the test board when the conventional screen
printing method was used. Prior to the board mounting, we
applied the solder paste dipping process to the solder ball of
the bottom package. This solder paste was newly developed to
optimize rheology and powder size for package stacking.
90
Using the solder paste dipping process, the solder joint yield
was much improved even when the bottom package was
warped. Using this solder paste dipping process for the top
package, the same effect will be expected if the top package
has a large warpage.
Figure 1: Structure of SCSP and PoP
Stacked die CSP
PoP
Prospects
• IDM ownership
• Lo w package p rofile
available with advanced
wafe r thinning technology
• SMT line infrastructure
• Lo w packag ing cost with
small substrate consumption
Prospects
• OEM Ownership
• Flexib le me mory selection,
i.e. me mory density
adjustment by switching
stacked me mory package
and mult iple memory
suppliers
• Tested at individual
package level for Known
Good Device
Concerns
• KGD required for high
product yield
• Single -sourced product
• Ne w develop ment needed
to change stacked device
Concerns
• Package pro file
• Infrastructure for package
stacking
Table 1: Comparison of SCSP vs. PoP
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
A Study on Package Stacking Process for Package-on-Package (PoP) (cont.)
Introduction
Further
miniaturization,
lightening,
and
higher
performance have been strongly demanded by a rapid growth
of portable equipment in recent years, especially in the cellular
phone arena. Basic telecommunication functions are no longer
adequate in our advanced information society which now
demands the functions of a small, portable terminal that
supports a worldwide communication needs. According to
these demands, the system requires a very high memory
density and an application processor is added where more
memory devices are also connected. As a result, 3D
packaging has become a mainstream technology [1], [2].
The features of Stacked die CSP (SCSP) vs. PoP are
compared in Figure 1 and Table 1. At first, to achieve the
miniaturization with high performance for the semiconductor
package, SCSP (where two or more dies are assembled in one
package) was developed and it is now widely accepted in
many cell phones because the requirement of function has
been increasing even though the size of phones continues to
decrease. As a solution, to put multiple memory devices into a
limited space, stacked die technology has become inevitable
because there is no area remaining in the xy-direction. PoP has
been researched as an alternative to SCSP which also achieves
mounted space savings on the board. PoP facilitates the
stacking of die from different suppliers and from mixed device
technologies. It also allows for burn-in and testing, prior to
stacking, in order to save good die. In the case of SCSP, even
if one of the stacked dice fails electrically, all of the assembled
good dies are also lost.
In order to adopt PoP sourced by many device
manufacturers, the package stacking process needs to be
carefully developed. The process should enable package-topackage connection with a higher yield even though both the
top and bottom packages have warpage. We have evaluated a
newly developed package stacking process with a solder paste
using top and bottom packages sourced from different
suppliers.
Test vehicle and package warpage
Cross-sections of the top and bottom packages are shown
in Table 2 and Figure 2 is a picture of the package surface of
the bottom CSP. The bottom package has Cu pads on the top
surface along the molded area so that another package(s) can
be stacked. Using the advanced packaging technologies, this
package stackable CSP has been developed for package-onpackage configuration [3] [4]. 100 µm thick die and ultra low
loop wire profiles were applied. Also, top gate molding was
selected in order to maximize the number of Cu pads for
interconnecting a top package around the finished mold cap
area. Using a standard solder ball size of 0.30 mm for this
0.50 mm pitch CSP, the overall package profile height, after
board mounting, is 0.8 mm assuming a 0.27 mm mold cap
thickness and 4-layer thin core substrate. Therefore, a 0.65
mm pitch CSP having 0.4 mm solder ball stand-off height can
be stacked on top of it.
For this study, only the die size of the bottom package was
varied to alter the warpage while one die size was applied to
the top package in order to minimize the variables of the test
vehicles. Due to individual unit mold format and the thin core
substrate, warpage can be large in cases where the Coefficient
of Thermal Expansion (CTE) of the mold compound is not
well balanced with other packaging materials. Figure 3 shows
the relationship between the temperature and the package
warpage of the test vehicles measured by the shadow moiré
method. It is clear that the warpage is strongly dependent on
the die size for the bottom package due to CTE mismatch. In
these cases, the warpage was convex at room temperature and
turned concave during reflow temperature, which can be
explained by the CTE mismatch among the die, the molding
compound, and the substrate. The package structure is
considered to consist of the upper portion where the die and
molding compound are located, and the lower portion which is
the substrate. If the die size is big, the CTE of the upper
portion is much smaller than the substrate. Therefore, the
package shows convex warpage, after cooling from the stress
free point (~175°C at mold cure) to room temperature. At
reflow temperature, on the other hand, the warpage turns
concave. In cases when the die size is relatively small, the
effective CTE of the upper portion becomes higher but still
low compared with the substrate. As a result, the warpage
trend is the same with any size of die though the warpage
amount is different. As for the top package, the CTE of each
material is well balanced; this kept the package flat through
the whole range of temperatures.
Top CSP
Unit (mm)
Bottom CSP
14.0x14.0
Package size
14.0x14.0x0.60t
Encapsulation 10.9x10.9x0.27t
14.0x14.0
0.14t
Substrate
0.30t
0.40t
Solder ball
0.23t
Fixed, 2 die
Die size
Variable, 1 die
Table 2: Cross section for the test vehicle
Figure 2: Bottom CSP package surface feature
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91
A Study on Package Stacking Process for Package-on-Package (PoP) (cont.)
Item
Concave (-)
Convex (+)
200
(um)
150
100
Top CSP
50
0
-50
Bottom CSP
small die
middle die
large die
-100
-150
-200
25'C
183'C
260'C
183'C
25'C
Dipping
flux
Dipping
paste
(new)
Screen
printing
paste
(ref)
Viscosity (Pas)
20
30
200
TI index
0.4
0.8
0.6
Powder size (um)
---
5 – 25
30
Flux content (%)
---
20
11
Reflow condition
Air
Air
Air
Table 3: Paste and flux property
Screen paste solder
Figure 3: Warpage for the test vehicles
In this experiment, a 0.45mm diameter solder ball with a
0.3mm Cu pad was used for the package-to-package
connection. By calculation, the solder ball height of the top
package before and after stacking was 0.40mm and 0.34mm
respectively. Because the mold cap is 0.27mm thick for the
bottom package and it shows a concave warpage at reflow
temperature, the mold cap did not interfere with the package
stacking process.
Dipping flux and solder paste
Because the bottom package has a mold cap, the screen
printing method is not available for the package stacking
process. It is necessary to supply flux or paste under the solder
ball of the top package in order to remove the oxide film to
connect top and bottom packages at reflow. In this
experiment, one kind of flux and a newly developed solder
paste were used [5]. The property of these materials and the
solder paste usually used with the screen printing is referred to
in Table 3. The viscosity for the conventional screen printing
paste is too large for the top CSP solder ball dipping and the
resulting amount of solder transcript is not enough. A lower
viscosity and higher transcript is necessary to transcribe the
right amount of solder on the ball to achieve stable stacking
yield. A new dipping solder paste was designed for better
transcription and soldering. As shown in Table 3, using 30 Pa
s (Pascal seconds) low viscosity, 0.8 thixotropic index with 525um powdery grain size, this new dipping paste improved the
solder transcription. Figure 4 is a photograph showing how
much the solder paste was transcribed after dipping in the new
solder paste compared with a conventional screen printing
paste. Sn3.0Ag0.5Cu was selected as a common lead free
solder composition.
92
Dipping paste solder
Figure 4: Solder paste transcription
Process Flow
Table 4 shows the process flow we studied in this
experiment [6]. Three kinds of process flow were compared.
As mentioned before, because the screen printing was not
applicable to the solder joint between the top and bottom
packages, the dipping process has been adopted. Flux dipping
has been a conventional method for package stacking [7]. A
dipping flux and the newly developed dipping solder paste
were evaluated for package stacking. Furthermore, dipping of
the bottom package into the solder paste was also examined
because the test vehicle displayed a large warpage at a high
temperature. For package stacking, an auto stacking
equipment with dipping station was used. This machine is
capable of +/-35um placement accuracy and all ball
recognition of the packages. Reflow was performed with a
typical convection reflow oven.
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
A Study on Package Stacking Process for Package-on-Package (PoP) (cont.)
Screen print
Bottom CSP
mount
Process #1,2
Top CSP
stack
Process #1
(flux dip)
Process #3
(solder dip)
The package stacking was carried out by using the abovementioned test vehicle and the dipping material. The dip
thickness was set to be 150um and 250um at the dipping stage
of a multi-functional placement machine. The solder paste of
Sn3.0Ag0.5Cu was screen printed by a 120um thick metal
mask on 0.28mm NSMD (Non Solder Mask Defined) pads of
a test board. A conventional reflow profile with a 240C peak
temperature was applied to the board assembly including
package stacking. After that, 10 units per each condition were
mechanically peeled off, and the number of balls displaying
open joints was counted. Figure 5 is a photograph of an
example observed after the sample was peeled off.
Process #2, 3
(solder dip)
Reflow
Process
Screen print on board
#1
#2
#3
x
x
x
Dip bottom CSP to
Paste
Place bottom CSP
x
x
x
Flux
Paste
Paste
Stack top CSP on bottom
x
x
x
Reflow
x
x
x
Dip top CSP to
Figure 5: Open solder joints
Results and discussion
Table 4: Experimental process flow
Experimental procedure
As variables, we studied warpage of the bottom package,
dipping material, dipping depth, and the process flow. The test
matrix is seen in Table 5.
Top
Bottom Bottom Process Dipping Sample
CSP
CSP
CSP
flow
depth
size
warpage die size warpage
25um
small
50um
middle
100um
large
150um
Table 5: Test matrix
#2
#3
#2
#3
#1
#2
#2
#3
150um
150um
150um
150um
150um
150um
250um
150um
10
10
10
10
10
10
10
10
1. Influence by package warpage
The number of open solder joints when the warpage of the
bottom package is changed is shown in Table 6. It was
observed that only in cases when the bottom package had a
large die, meaning it displayed large warpage (150um) at
reflow temperature, were open joints generated between the
bottom package and the test board. All of the solder joints
between the top and bottom packages were well formed. The
open joints were located at the corner of the package, which
was caused by the fact that the bottom package generated the
concave warpage which parted the solder balls around the
package corners from the screen printed solder paste on the
board at reflow temperature. In order to confirm this, the
warpage trend of the bottom package was monitored under
various temperatures as shown in Figure 6. In fact,
disconnection at corners was observed under high
temperature.
The main reason open solder joints were observed only
between the bottom package and the test board and not
between packages may be explained as follows. Although the
bottom package showed large (150um) warpage with a large
die, the warpage of the area where the solder balls were
located was small. Using the shadow moiré measurements, it
was observed that while the area around the Cu pads on the
top side showed only a 50um warpage, the corresponding area
(solder balls) on the bottom side showed around a 100um
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93
A Study on Package Stacking Process for Package-on-Package (PoP) (cont.)
warpage. In this experiment, a 120um thick metal mask was
utilized to screen the solder paste in order to mount the bottom
package on the board, this generates about a 60um thick
solder since half of it is made from flux. Compared with a
100um warpage of the bottom side, this thickness was not
sufficient to get a good connection for all of the solder balls.
As a result, open solder joints were located at the corners of
the bottom package by the difference of the height of the ball.
On the top side of the bottom package, however, the warpage
was 50um and the top package was almost flat throughout the
package stacking joints. The dipping solder paste was enough
to get good joints with a very high yield. This mechanism is
shown in figure 7.
Bottom Process Dipping # of open joints
bottom CSP
CSP
flow
depth
top CSP
-towarpage
-tobottom CSP board
50um
#2
150um
0 / 1520
0 / 3520
100um
#2
150um
0 / 1520
0 / 3520
150um
#2
150um
0 / 1520
16 / 3520
Table 6: Number of open joints vs. package warpage
Figure 6: Bottom CSP warpage at high temperature
Figure 7: Mechanism of open joints
2. Stacking by flux dipping vs. solder paste
The stacking yield that resulted from different dipping
materials was examined by using the sample that showed the
largest warpage. The yield did not depend on the dipping
material in this experiment and a 100% joint yield was
obtained between the top and bottom packages by different
test conditions. However, we have seen the difference at the
bottom package to the test board joint. The results are
summarized in Table 7.
The joint yield was similar when comparing the dipping
material, i.e. flux vs. solder paste. In both cases, the rate of
94
open joints was between 0.5 and 1.0% with a 150um dipping
depth setting. But when the solder paste dipping was
thickened to 250um, the open joints increased to 2.0%
between the bottom package and the board. In any case, the
top-to-bottom package joints were all well formed. The cause
is not yet clear but may be related to the surface tension of the
transcribed solder. Because of the surface tension from the
large amount of the transcribed solder, the substrate of the
bottom package may be pulled up during reflow. This might
influence timing to solder hardening.
Bottom Process Dipping # of open joints
CSP
flow
depth
top CSP
bottom CSP
warpage
-to-tobottom CSP board
150um
#1
150um
0 / 1520
27 / 3520
#2
150um
0 / 1520
16 / 3520
#2
250um
0 / 1520
70 / 3520
Table 7: Number of open joints vs. dipping material
3. Stacking process method
Table 8 shows the stacking yield dependence on the
stacking process method with solder paste dipping. While
process #2 was a solder paste dipping only to the top package,
the dipping paste was applied to both of the top and bottom
packages in process #3. For the bottom package with less than
100um warpage, either process showed 100% good solder
joints at top-to-bottom package joints and bottom package-totest board joints. However, in case of the bottom package
having 150um warpage, the joint yield for process #3 was
better than that for #2. This can be explained by the role of the
newly developed solder paste which supplemented the
insufficient solder amount in order to enable secure
connection of the solder between the bottom package and
board. In this experiment, we used a rather flat top package
and we did not see any open joints between packages
regardless of the process flow or material. However, in realworld scenarios, there exists a variety of warpage for both the
top and bottom packages. It may be concluded that Process #3
is the best solution to achieve stable package stacking yield
with many package combinations.
Bottom Process Dipping # of open joints
CSP
flow
depth
top CSP
bottom CSP
warpage
-to-tobottom CSP board
50um
#2
150um
0 / 1520
0 / 3520
#3
150um
0 / 1520
0 / 3520
100um
#2
150um
0 / 1520
0 / 3520
#3
150um
0 / 1520
0 / 3520
150um
#2
150um
0 / 1520
16 / 3520
#3
150um
0 / 1520
0 / 1520
Table 8: Number of open joints vs. process flow
Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com
A Study on Package Stacking Process for Package-on-Package (PoP) (cont.)
Conclusions
From this experimental study, it was understood that the
amount of package warpage during reflow heating is
intimately related to the package stacking yield on board.
Because the bottom package for PoP is very thin (in order to
keep the total mounted height low), the warpage variation is
large from room temperature to reflow temperature due to
CTE mismatch among the die, molding compound and
substrate in the package. Heat behavior characteristics will
have to be evaluated in the developmental phase. Moreover,
because the reflow conditions and the materials are different
depending on the end customer, planning and communication
during the developmental phase is needed more than ever
before.
A solder paste was newly developed for the package
stacking purpose. This paste has a property showing sufficient
transcription solder volume and steady transcription ability by
controlling the viscosity and the thixotropic index with proper
solder powder size. It was confirmed that sufficient solder is
transferred to the CSP balls by the dipping method.
Several package stacking methods were examined to
investigate which process is most suitable. In this experiment,
the solder joints between the top and bottom packages were
well formed in all process conditions even though the bottom
package displayed large warpage. However, when the bottom
package showed large warpage, some open solder joints were
observed at the bottom package-to-board joint in the cases
when only the top package was dipped (either in flux or solder
paste). Thus, in the even that the bottom package demonstrates
large warpage, it was determined that 100% good joints may
be achieved by applying the newly developed solder to the top
and bottom packages.
References
1. M. Kada, “ Stacked CSP / A Solution for System LSI ”
Chip Scale International (1999)
2. M. Kada and L. Smith, “Advancements in Stacked Chip
Scale Packaging (S-CSP) Provides System in a Package
Functionality for Wireless and Handheld Applications,”
Pan Pacific Microelectronics Symposium (2000)
3. Akito Yoshida, et. al., “Key Assembly Technology for
3D Packaging – Stacked-Die and Stacked Package,”
International Wafer Level Packaging Conference (2004)
4. Moody Dreiza, et. al, “Stacked Package-on-Package
Design Guidelines,“ International Wafer Level Packaging
conference (2005)
5. Y. Takagi, T.Notomi, and A. Fujita, “Charactreristics of
New Solder Paste for 3-D Package”, MAP&RTS (2005)
6. U. Yamamoto, “The Issues and The Future Vision of 3-D
Jisso,”, MAP&RTS (2005)
7. Akito Yoshida, et. al., “Design and Stacking of An
Extremely Thin Chip-Scale Package,” Electronic
Components and Technology Conference (2003)
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95
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