1/8 Seite rechts, 53 x 148 mm im Satzspiegel für Platzierung rechts unten TECHNOLOGY OF TOWORROW Neue Generation von integrierten passiven NetzwerkKomponenten – KPC • Widerstandswertebereich von 10 Ohm bis 1 MOhm • Toleranzen von ±5 % bis ±0.1 % • Temperaturkoeffizient von 100 ppm/K bis hinunter zu 10 ppm/K • Kapazitätswerte von 22 pF bis 250 pF • geeignet für Laptops, Speicher- und Filteranwendungen (EMI/RFI) Europe GmbH Kaddenbusch 6 D-25578 Dägeling/Itzehoe Phone +49 (0) 48 21/89 89-0 Fax +49 (0) 48 21/89 89 89 NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS) 7 4 IDENTIFICATION TYPE COATING COLOR MARKING KPC Black White Ink or Laser Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. FEATURES ■ Excellent performance and reliability due to thin film on silicon wafer technology and molded construction ■ Wide variations of standard packages like TSSOP, QSOP, SOIC, SOT ■ Excellent resistance matching, TCR tracking and stability characteristics ■ Fields of applications are EMI/RFI filtering, low pass filtering, computers and peripherals, automotives, analog instrumentations, IC testers, terminations, Pull-up/Pull-down ■ High integration saves board space and reduces overall assembly costs ■ Meets or exceeds IEC 60115-1, JIS C 5201-1 ■ Suitable for reflow soldering ■ Customer specific circuits on request TSSOP, QSOP, SOIC-N SOIC-W DIMENSIONS (mm) PACKAGE SYMBOL T16 T20 T24 Q16 Q20 Q24 N08 N14 N16 W16 W20 S03 PACKAGE TSSOP QSOP SOIC-N SOIC-W SOT-23 NUMBER OF PINS 16 20 24 16 20 24 8 14 16 16 20 3 A ± 0.2 5.00 6.50 7.80 4.90 B ± 0.2 C ± 0.2 D ± 0.1 6.40 1.00 0.65 F ± 0.1 G ± 0.1 H ± 0.2 J ± 0.2 K ± 0.1 R ± 0.2 TAPING Q’TY/REEL (pcs) – 2,500 0.76 1,000 – 3.000 0.23 0.635 5.99 4.40 0.33 0.25 8.66 4.83 8.66 9.91 10.44 12.70 2.92 E ± 0.1 0.20 1.60 0.20 1.47 0.84 0.66 0.18 3.81 0.52 1.27 10.36 2.40 2.30 0.95 0.41 0.23 1.91 0.44 0.13 0.76 0.64 0.51 7.62 0.53 1.30 0.11 GENERAL RATINGS FOR R- AND RC-NETWORKS PACKAGE / PIN COUNT TSSOP PACKAGE POWER RATING RESISTANCE 10 Ω ~ 1 kΩ RANGE R≥ 1.1 kΩ MAX. WORKING VOLTAGE RATED AMBIENT TEMP. OPERATING TEMP. RANGE QSOP T16 T20 T24 Q16 0.8 W 1.0 W 1.0 W 0.8 W Q20 SOIC Q24 N08 N14 1.0 W 1.0 W 0.4 W 0.6 W Power Rating 200 mW / Resistor Element* Power Rating 50 mW / Resistor Element* 100 V + 70° C – 40° C … + 125° C SOT23 N16 W16 W20 S03 0.8 W 1.0 W 1.2 W 0.1 W Above ratings are based on the thermal resistances using a multi-layer circuit board (EIA / JESD51). For mounting on a mono-layer board, power derating shall be needed. Please inquire of us about conditions. * Total power consumption of all elements should not exceed the package power rating. EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de Revision: 5. Nov. 2004 NETWORKS TECHNOLOGY OF TOMORROW RESISTORS, THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS RESISTOR NETWORKS RESISTANCE RANGE (E24) AND ABSOLUTE TOLERANCE CIRCUIT SCHEMATICS NUMBER OF PINS T.C.R. (ppm /K) 8, 14, 16 20, 24 E (±25) C (±50) B (±0.1%) C (±0.25%) T (±10) NETWORKS (PASSIVE COMPONENTS) RIA* 510Ω …100 kΩ 510Ω …100 kΩ 8, 14, 16 20, 24 RBA 3 SOT-23 Only RTY 1kΩ... 30kΩ 1kΩ... 30kΩ 510Ω ... 30kΩ 510Ω... 30kΩ 1kΩ ... 40kΩ 1kΩ ... 40kΩ 1kΩ...30kΩ 100Ω...100kΩ 51Ω... 200kΩ 1kΩ...40kΩ 100Ω...150kΩ 1kΩ ... 150kΩ 1kΩ... 150kΩ H (±100) F (±1%) 510Ω…100kΩ 510Ω…100kΩ 100Ω...510kΩ 100Ω... 510kΩ 51Ω...1MΩ H (±100) T (±10) E (±25) C (±50) H (±100) T (±10) E (±25) C (±50) D (±0.5%) 51Ω...200kΩ G (±2%), J (±5%) 510Ω…100kΩ 100Ω... 510kΩ 51Ω...1MΩ 51Ω... 1MΩ 30Ω... 1MΩ 1kΩ...30kΩ 100Ω...100kΩ 10Ω...1MΩ 1kΩ...30kΩ 100Ω...100kΩ 51Ω...200kΩ 30Ω...200kΩ 1kΩ...40kΩ 51Ω... 200kΩ 10Ω...200kΩ 1kΩ...40kΩ 100Ω...150kΩ 51Ω...200kΩ 100Ω...150kΩ 51Ω...200kΩ 30Ω...200kΩ 30Ω...200kΩ E (±25) RDA 16, 20 C (±50) R1=150Ω...10kΩ – – – – R1: R2=1:1...1:4 H (±100) 3 SOT-23 Only RTX E (±25) C (±50) – – – 100Ω...40kΩ 100Ω...40kΩ 51Ω...50kΩ 51Ω...50kΩ H (±100) Please contact KOA about your custom devices and circuits. (Different resistance combination available) Depending on the circuit and package, much higher resistances are possible. RNX *For RIA 20, 24 pin, 200 kΩ is the highest resistance. Relative Resistance Tolerance (Optional) : MInimum 0.05% Relative T.C.R. (Optional) : Minimum 5 ppm/K TYPICAL CHARACTERISTICS DERATING CURVE Rated Load at 70°C (Typical: 1kΩ, 8 resistors/package) For resistors operated at an ambient temperature of +70°C or above, the power rating shall be derated in accordance with the above derating curve. EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de Revision: 5. Nov. 2004 Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. CIRCUIT CODE NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS, THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS RESISTOR / CAPACITOR NETWORKS ■ Resistance tolerance: K (±10%), M (±20%) ■ Capacitance tolerance: M (±20%) ■ Capacitor voltage rating: 20 V ■ Operating temperature range: -40°C...+125°C PACKAGE POWER RATING Package Power Rating S03 0.2 W S06 0.225 W S14 0.225 W N08 0.4 W Q16 0.8 W Q20 1W Q24 1W Q28 1W W20 1.2 W Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PRODUCT CODE CIRCUIT SCHEMATICS RESISTANCE RANGE (E24) PACKAGES T.C.R. (ppm/K) CAPACITANCE RANGE (E24) DIODE BREAK-DOWN VOLTAGE ESD* WITHSTANDING VOLTAGE (HBM) ACA ACB ACC Q20 W20 Q24 10 Ω...1 kΩ ± 200 33 pF...250 pF – – TFA Q20 W20 10 Ω...1 kΩ ± 200 22 pF...250 pF – – TFB Q20 W20 10 Ω...1 kΩ ± 200 22 pF...250 pF ± 15 V ± 8 kV LFA Q20 W20 10 Ω...1 kΩ ± 200 22 pF...250 pF – – CRA CRB S03 S06 10 Ω...1 kΩ ± 200 22 pF...250 pF – – CTX S03 10 Ω...1 kΩ ± 200 22 pF...250 pF – – ±6V ± 16 kV EAA EAB EAD R1 1 kΩ 2.2 kΩ 4.7 kΩ R2 33 Ω 33 Ω 33 Ω EA ■ Q28 AA ■ Q24 AAA AAB AAC AAD 1 kΩ 2.2 kΩ 4.7 kΩ 4.7 kΩ 33 Ω 33 Ω 10 Ω 33 Ω Q20 APA APB APC APD 1 kΩ 2.2 kΩ 4.7 kΩ 4.7 kΩ 33 Ω 33 Ω 10 Ω 33 Ω AP ■ Q20 ± 200 EAA EAB EAD C 150 pF 150 pF 180 pF ± 200 AAA AAB AAC AAD 180 pF 220 pF 180 pF 180 pF ±6V ± 8 kV ± 200 APA APB APC APD 180 pF 220 pF 180 pF 180 pF – – USD Q16 R1 : 33 Ω R2 : 15 kΩ ± 200 47 pF ±6V ± 8 kV USU N06 R1 : 33 Ω R2 : 1.5 kΩ ± 200 47 pF ±6V ± 8 kV * Human Body Model (Mil-Std-883) C=100pF R=1.5kΩ Air discharge PERFORMANCE TEST ITEM Resistance to soldering heat Short time overload Moisture Resistance Rapid change of temperature HAST PERFORMANCE REQUIREMENTS MAXIMUM ∆ R (%+1Ω) MAXIMUM ∆ C (%+1pF) + 0.25 + 0.5 + 0.5 + 0.5 +1 +1 + 0.5 + 0.5 + 0.5 +1 TEST METHODS MIL-R-55342 4.7.7 MIL-R-55342 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 2atm, 121°C, 96hrs EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de Revision: 5. Nov. 2004 NETWORKS (PASSIVE COMPONENTS) RATING OF RESISTOR / CAPACITOR NETWORKS NETWORKS TECHNOLOGY OF TOMORROW DIODES THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS KPC DIODE NETWORKS RATING OF DIODE NETWORKS PRODUCT CODE CIRCUIT SCHEMATICS VBD / VF IF = 1 mA PACKAGE LEAKAGE CURRENT VR = 6.5 V CAPACITANCE @ 1 MHZ CHANNEL CLAMP. VOLTAGE H.B.M* ESD** VOLTAGE CAPABILITY MIN. MAX. MIN. MAX. MIN. MAX. TYP. MIN. EDA S03 16 V 27 V - 1 µA 1 pF 5 pF 15 V 16 kV EDB S06 16 V 27 V - 1 µA 1 pF 5 pF 15 V 16 kV DNA Q20 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 10 V 16 kV DN2 Q20 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 10 V 16 kV DN3 S06 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 10 V 16 kV DN4 S14 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 13 V 16 kV DN5 Q24 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 10 V 16 kV DN6 N08 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 13 V 16 kV DN7 Q24 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 13 V 16 kV DN8 S03 0.6 V 1.0 V 0.1 µA 2 µA 1 pF 5 pF 10 V 16 kV *Human Body Model (Mil-Std-883) C=100pF R=1.5kΩ Air discharge **IEC 61000-4-2 C=150pF R=330Ω Air discharge EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de Revision: 5. Nov. 2004 Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. NETWORKS (PASSIVE COMPONENTS) Absolute maximum ratings (Ta = +25°C) ■ Top= Operating temperature range: -40°C...+85°C ■ Vs= Supply voltage (Vp-Vn) : 8V ■ Continuous forward current : 50 mA NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS KPC TYPE DESIGNATION (HOW TO ORDER) RESISTOR NETWORKS (RIA, RBA, RBB) New Part No. (Pb-free) RIA Q20 RIA Q20 PRODUCT CODE PACKAGE SYMBOL RIA, RBA, RBB Package Type + Number of Pins * 1002 B F T.C.R. F: ±25ppm/K G: ±50ppm/K H: ±100ppm/K B B T TE 1002 B E B TERMINATION SURFACE MATERIAL TAPING NOMINAL RESISTANCE ABSOLUTE RESISTANCE TOLERANCE T.C.R. RATIO OF RESISTANCE TOLERANCE TE: embossed plastic B, C, D, F: 4 digits G, J: 3 digits T: Sn L: Sn/Pb T: ±10ppm/K E: ±25ppm/K C: ±50ppm/K H: ±100ppm/K B, C, D, F, G, J *Please see “PACKAGING” B, C, D, F, G “Blank”: not specified Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. RESISTOR NETWORKS (RDA) Old Part No. New Part No. (Pb-free) RDA Q20 RDA Q20 PRODUCT CODE PACKAGE SYMBOL RDA (Dual terminator network) Package Type + Number of Pins * B H T.C.R. F: ±25ppm/K G: ±50ppm/K H: ±100ppm/K T TE TERMINATION SURFACE MATERIAL TAPING 471J 511J 471J 511J H NOMINAL RESISTANCE NOMINAL RESISTANCE & TOLERANCE OF R1 & TOLERANCE OF R2 TE: embossed plastic G, J: 3 digits G, J: 3 digits T: Sn L: Sn/Pb T.C.R. E: ±25ppm/K C: ±50ppm/K H: ±100ppm/K *Please see “PACKAGING” RESISTOR NETWORKS (RNX, RTX, RTY) Old Part No. RNX Q20 New Part No. (Pb-free) RNX Q20 T TE PRODUCT CODE PACKAGE SYMBOL TERMINATION SURFACE MATERIAL TE: embossed plastic RNX, RTX, RTY Package Type + Number of Pins B * 5001 5001 KOA REFERENCE NUMBER TAPING T: Sn L: Sn/Pb *Please see “PACKAGING” RESISTOR / CAPACITOR NETWORKS (ACA, ACB, ACC, TFA, LFA) Old Part No. New Part No. (Pb-free) ACB Q20 B ACB Q20 T TE PRODUCT CODE PACKAGE SYMBOL TERMINATION SURFACE MATERIAL TAPING ACA, ACB, ACC, LFA, TFA Package Type + Number of Pins * 330M 470M 330M 470M NOMINAL RESISTANCE NOMINAL CAPACITANCE & TOLERANCE & TOLERANCE TE: embossed plastic 3 digits, M: ±20% T: Sn L: Sn/Pb Unit: pF / 3 digits 470 = 47pF M: ±20% *Please see “PACKAGING” DIODE NETWORKS (EDA, EDB, DNA, DN2, DN3, DN4, DN5, DN6, DN7, DN8) Old Part No. DN5 New Part No. (Pb-free) DN5 Q24 T TE PRODUCT CODE PACKAGE SYMBOL TERMINATION SURFACE MATERIAL TAPING Diode Networks EDA, EDB, DNA, DN2, DN3, DN4, DN5, DN6, DN7, DN8 Q24 Package Type + Number of Pins B T: Sn L: Sn/Pb * TE: embossed plastic *Please see “PACKAGING” Please contact KOA about ordering codes for products which are not mentioned above. Customer specific networks on request. EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de Revision: 5. Nov. 2004 NETWORKS (PASSIVE COMPONENTS) Old Part No. KOA Table of Contents Series ED(X) - PGD EDE - EDF TV(X) DN(X) SD(X) FSD GPR GSR TF(X) LFA AC(X) CTX RZA RIA RBA RD(X) RTX RTY Description Diode ESD Suppressors Diode ESD Suppressors 300 Watt TVS Diode Arrays Steering Diode Arrays / ESD Suppressors Steering Diode Arrays / ESD Suppressors Fast Switching Diode General Purpose Rectifier Diode – Leaded General Purpose Rectifier Diode – SMD R/C Low Pass “T” Filter Networks R/C Low Pass “L” Filter Network Series R/C AC Filter Networks PECL R/C Filter Termination Network Jumper Array Isolated Resistor Network Bussed Resistor Network SCSI & ECL Resistor Termination Networks PECL Resistor Termination Network Precision Voltage Divider Resistor Network Package Dimensions Appendix – Technology Summary Page 3-4 5–6 7–8 9 – 10 11 12 13 14 15 – 16 17 18 – 19 20 21 22 23 24 – 25 26 27 28 - 29 30 - 32 2 KOA ED(X) - PGD Bidirectional ESD / Transient Suppressors Features: Applications: (16kV) IEC 61000-4-2 rating Surface Mount Package High component Density ESD Suppression Transient Suppression Schematics: 3 2 1 EDA – (SOT23-3) 4 3 4 3 5 2 5 2 6 1 6 1 EDB – (SOT23-6) EDC – (SOT23-6) 4 3 2 2 5 1 EDD – (SOT23-5) 1 PGD – (MLP) Application: Gnd Transceiver Connector Vp (Transient) Vclamp 0v 3 Specifications:( Ta = 25oC ) EDA & EDB Symbol VBD IL CT VESD VPV Characteristic Diode breakdown voltage Leakage current Capacitance Channel clamp voltage Peak ESD voltage capability Min 16 Typ 20 +0.1 2.0 - Max 27 + 2.0 5.0 + 27.0 16 Units V uA pF V kV Test Condition IF = 1 ma 14v @ 1Mhz 8kV H.B.M. IEC 61000-4-2 Min 5.1 Typ 7.0 +0.1 1.5 - Max 10 + 2.0 3.0 + 7.0 16 Units V uA pF V kV Test Condition IF = 1 ma 5v @ 1Mhz 8kV event IEC 61000-4-2 EDC, EDD & PGD Symbol VBD IL CT VESD VPV Characteristic Diode breakdown voltage Leakage current Capacitance Channel clamp voltage Peak ESD voltage capability Package Information: P W d d S05 W S03 W d p d p S06 W P L P L L p L Dimensions in ( mm ): Package Code S03 S05 S06 1E Package Power 225 mw 225 mw 225 mw 100mw Number of Pins 3 5 6 2 L + 0.2 W + 0.2 p + 0.1 P + 0.1 2.90 2.90 2.90 1.1 2.30 2.80 2.80 0.75 0.95 0.95 0.38 1.90 1.90 0.33 Pkg. Height + 0.2 1.0 1.0 1.0 0.75 d + 0.1 0.43 0.43 0.43 0.35 Ordering Information: EDA S03 Type EDA EDB EDC EDD PGD Package Code From table above T Lead Plating T = 100% Tin TE 5V0 Taping Voltage TE = 7” reel 5V0 embossed tape 16V 4 KOA EDE / EDF Bidirectional ESD / Transient Suppressors Features: Applications: (16kV) IEC 61000-4-2 rating Surface Mount Package High component Density ESD Suppression Transient Suppression Schematics: Isolated Bussed 1 1 EDF –20, 16, 14, 8 pin EDE – 20, 16, 14, 8 pin Application: Gnd Transceiver Connector Vp (Transient) Vclamp 0v 5 Specifications:( Ta = 25oC ) EDE & EDF Symbol VBD IL CT VESD VPV Characteristic Diode breakdown voltage Leakage current Capacitance Channel clamp voltage Peak ESD voltage capability Min 5.1 Typ 7.0 +0.1 1.5 - Max 10 + 2.0 3.0 + 7.0 16 Units V uA pF V kV Test Condition IF = 1 ma 5v @ 1Mhz 8kV event IEC 61000-4-2 Package Information: L a p c w W H Dimensions in ( mm ): Package Code N08 N14 N16 W16 W20 Package Power 0.4 w 0.6 w 0.8 w 1.0 w 1.2 w Number of Pins 08 14 16 16 20 L + 0.2 W + 0.2 w + 0.2 H + 0.2 p + 0.1 a + 0.1 c + 0.1 4.83 8.66 9.91 10.44 12.70 5.99 5.99 5.99 10.36 10.36 3.81 3.81 3.81 7.62 7.62 1.60 1.60 1.60 2.40 2.40 1.27 1.27 1.27 1.27 1.27 0.41 0.41 0.41 0.41 0.41 0.66 0.66 0.66 0.66 0.66 Ordering Information: EDE N16 Type EDE EDF Package Code From table above L Lead Plating L = SnPb T = 100% Tin TEB 5V0 Taping Voltage TEB = 5V0 13” reel embossed tape 6 KOA TV(X) 300 Watt Transient Voltage Suppressor Features: Applications: (16kV) IEC 61000-4-2 rating 8/20 us transient rating Four working voltages (5, 12, 15, 24) Narrow SOIC package (8 & 14 pin) Transient / ESD Suppression LAN/WAN Peripherals Set-Top Boxes Schematics: TVA TVB TVC 1 1 1 TVC – 8 pin SOIC TVB – 8 pin SOIC TVA – 14 pin SOIC Application: Bidirectional Unidirectional Gnd Transceiver Gnd Transceiver Connector Connector Vp (Transient) Vclamp 0 v 7 Specifications:( Ta = 25oC ) Rating Peak Pulse Power (8/20 us) Operating Temp. Range Soldering Temperature Symbol PPK TJ TL Value 300 -55 to +125 260 (10 sec.) 5V Volt Characteristics (5V0) Symbol Characteristic VBD Reverse breakdown voltage IL Reverse leakage current CT Capacitance VC Channel clamp voltage IPP Peak pulse current Min 6.0 Min 13.3 Max Typ Max 1 120 20 12 15 Volt Characteristics (15V) Symbol Characteristic VBD Reverse breakdown voltage IL Reverse leakage current CT Capacitance VC Channel clamp voltage IPP Peak pulse current Min 16.7 Typ Max 1 75 24 10 24 Volt Characteristics (24V) Symbol Characteristic VBD Reverse breakdown voltage IL Reverse leakage current CT Capacitance VC Channel clamp voltage IPP Peak pulse current Package Information: Typ 10 350 10 17 12 Volt Characteristics (12V) Symbol Characteristic VBD Reverse breakdown voltage IL Reverse leakage current CT Capacitance VC Channel clamp voltage IPP Peak pulse current Min 26.7 1 Units Watts o C o C Typ Max 1 50 43 5 Units V uA pF V Amps Test Condition IF = 1 ma @ VBD = 5v @ 1Mhz 8 / 20us, 1 Amp 8 / 20 us Units V uA pF V Amps Test Condition IF = 1 ma @ VBD = 12v @ 1Mhz 8 / 20us, 1 Amp 8 / 20 us Units V uA pF V Amps Test Condition IF = 1 ma @ VBD = 15v @ 1Mhz 8 / 20us, 1 Amp 8 / 20 us Units V uA pF V Amps Test Condition IF = 1 ma @ VBD = 24v @ 1Mhz 8 / 20us, 1 Amp 8 / 20 us L a p c w W H Dimensions in ( mm ): Package Code N08 N14 Package Power 0.4 w 0.6 w Number of Pins 08 14 L + 0.2 W + 0.2 w + 0.2 H + 0.2 p + 0.1 A + 0.1 c + 0.1 4.83 8.66 5.99 5.99 3.81 3.81 1.60 1.60 1.27 1.27 0.41 0.41 0.66 0.66 Ordering Information: TVA N14 Type TVA TVB TVC Package Code From table above L Lead Plating L = SnPb T = 100% Tin TEB 24V Taping Voltage TEB = 5V0, 12V 13” reel 15V, 24V embossed tape 8 KOA DN(X) Steering Diode Arrays – ESD Suppressors Features: Applications: Fast Reverse Recovery Time Fast Turn on Time Low Capacitance SMD Packages 16kV IEC61000-4-2 capable Signal Termination Signal Conditioning ESD Suppression Transient Suppression Schematics: 1 1 1 DN3 – 6 pin DN2 – 20 pin DNA – 20 pin 1 1 1 DN4 – 4 pin DN5 – 24 pin DN6 – 8 pin DN8 – 3 pin DN9 – 8 pin 1 1 DN7 – 24 pin 9 Absolute Maximum Ratings: ( Ta = 25oC ) Symbol TOP VS IF Parameter Operating temperature Supply voltage (rail to rail) Continuous forward current * Value -40 to +85 8 50 Units 0 C V mA * One diode conducting. Electrical Ratings: ( Ta = 25oC ) Symbol VF VR IL CT VPV Characteristic Forward voltage Reverse breakdown voltage Reverse leakage current Capacitance Peak ESD voltage capability Application: Min 0.6 7.2 + 0.1 1.0 Max 0.95 + 2.0 5.0 16 (ESD Suppression) Transient + Rail Test Condition IF = 50 ma IR = 1 ma 7.1v @ 1Mhz IEC 61000-4-2 ( Signal Conditioning ) Signal Ringing Transient suppressed + Rail Receiver Driver Units V V uA pF kV Ringing Eliminate Driver Receiver - Rail or GND - Rail or GND Package Information: d d S03 W d S14 W L Package Code S03 S14 S06 N08 W20 Q20 Q24 L p p p S06 W Number of Pins 3 4 6 8 20 20 24 N08 – W20 – Q20 – Q24 W L L Total Power 225 mw 225 mw 225 mw 400 mw 1200mw 1000mw 1000mw p d L + 0.2 W + 0.2 p + 0.1 2.92 2.92 2.92 4.83 12.70 8.66 8.66 2.30 2.30 2.80 5.99 10.36 5.99 5.99 1.91 1.91 0.95 1.27 1.27 0.635 0.635 Pkg. Height + 0.2 0.95 0.95 0.95 1.60 2.40 1.60 1.60 d + 0.05 0.43 0.43 0.43 0.41 0.41 0.25 0.25 Ordering Information: DNA Type DNA DN2 DN3 DN4 DN5 DN6 DN7 DN8, DN9 Q20 Package S03 = 3 pin SOT23 S14 = 4 pin SOT23 S06 = 6 pin SOT23 N08 = 8 pin Narrow SOIC W20 = 20 pin Wide SOIC Q20 = 20 pin QSOP Q24 = 24 pin QSOP L TEB Lead Plating Taping T = 100% Tin L = SnPb TEB = 13” reel, embossed tape TE = 7” reel, embossed tape 10 KOA SD(X) Switching Diode Networks Package 3 A 2 1 SOT - 23 1 Absolute Maximum Ratings: ( Ta = 25oC ) Parameter Symbol Continuous Reverse Voltage DC Forward Current Peak Forward Surge Current Electrical Ratings: ( Ta = 25oC ) Symbol Characteristic Reverse Breakdown Voltage Reverse Voltage Leakage Current VBR IR Diode Capacitance Forward Voltage CD Min VDC mAdc mAdc Max Units Vdc uAdc pF mV Reverse Recovery Time Trr Thermal Characterisitcs: Parameter Symbol Value PD R0ja Tj, Tstj 225 500 -55 to +150 Total Power Dissipation (FR4) Thermal Resistance – Junction Ambient Junction and Storage Temperature 1 Units 50 1 3 855 1000 1250 6.0 VF 2 75 215 450 80 ns 3 D Value VR IF IFM 2 1 3 C 3 B 2 Test Condition IBR = 100 uAdc VR = 75 @ 1500C VR = 75 @ 250C VR = 0, f = 1 Mhz IF = 10 mAdc IF = 50 mAdc IF = 150 mAdc IF = IR = 10 mAdc RL = 100 ohms Units mW C/W 0 C 0 IF (ma) 0 0 TA=850C TA=25 C TA=-40 C 100 10 1 0 0 0.5 Ordering Information: SDA Type SDA, SDB SDC, SDD S03 Package S03 = SOT-23 1.0 1.5 2.0 VF L Lead Plating T = Tin L = SnPb TE Taping 7" reel 11 KOA FSD Fast Switching Diode Package: DO-35 Dimensions in (mm) B Dim. L B D c c D L Absolute Maximum Ratings: ( Ta = 25oC ) Parameter Symbol Continuous Reverse Voltage DC Forward Current Peak Forward Surge Current Value Units 75 200 450 VDC mAdc mAdc VR IF IFM Electrical Ratings: ( Ta = 25oC ) Symbol Characteristic Reverse Breakdown Voltage Reverse Voltage Leakage Current VBR IR Diode Capacitance Forward Voltage CD Min Max 75 100 5.0 3 720 850 1000 4.0 VF Units Vdc uAdc Reverse Recovery Time Trr Thermal Characterisitcs: Parameter Symbol Value PD R0ja Tj, Tstj 500 556 -55 to +150 Total Power Dissipation (FR4) Thermal Resistance – Junction Ambient Junction and Storage Temperature Min. 25.4 3.03 1.52 0.46 pF mV ns Max. ----4.44 2.29 0.56 Test Condition IBR = 100 uAdc VR = 75 @ 1500C VR = 75 @ 250C VR = 0, f = 1 Mhz IF = 5 mAdc IF = 10 mAdc IF = 100 mAdc IF = IR = 10 mAdc RL = 100 ohms Units mW C/W 0 C 0 IF (ma) TA=850C 100 TA=250C TA=-400C 10 1 0 0 0.5 1.0 1.5 2.0 VF Ordering Information: FSD Type FSD D35 L Package Lead Plating D35 = T = Tin DO-35 L = SnPb T52 Taping 52mm tape R Packaging R = reel A = ammo 12 KOA GPR General Purpose Rectifier Package: DO-41 Dimensions in (mm) B Dim. L B D c c D L Min. 27.9 4.05 2.30 0.75 Max. ----5.20 2.70 0.87 Absolute Maximum Ratings: Parameter Sym. Max. repetitive Peak Reverse Voltage Max. DC Blocking Voltage Max. RMS Voltage Peak Surge Current VRRM VDC VRMS IFSM Type 050 Type 100 Type 200 Type 400 Type 600 Type 800 Type 1000 Unit 50 50 35 100 100 70 200 200 140 400 400 280 600 600 420 800 800 560 1000 1000 700 V V V 8.3ms half sine-wave + rated Load Max. Average Forward Current Max. Instantaneous Forward Voltage @ 3.0 A Max. DC Reverse Current @ 200 3.0 IO VF 1.2 5 1000 IR Rated DC Blocking Voltage Junction Capacitance A A V @ 250C @ 1250C uA CJ @ 80% VRRM Max. Thermal Resistance Reverse Recovery Time Operating Junction Temperature TJA TRR TJ 30 50 4 ~ to ~ -55 0 +150 pF C/W uS 0 C Characteristics: Forward Characteristic Reverse Characteristic Current Derating A uA A 10 100 4.0 TA= 250C 1 3.0 TA=250C 10 2.0 0.1 1 0 0.1 1.0 0 0.5 1.0 1.5 0 0 2.0 VF 25 50 100 150 25 50 100 150 200 Ambient Temp. (0C) % Rated VR Ordering Information: GPR Type GPR D41 Package D41 = DO-41 L Lead Finish L=SnPb T52 Taping T52 = 52mm Tape R 050 Packing R=Reel A=Ammo Voltage 050, 100, 200 400, 600, 800, 1000 13 KOA GSR General Purpose Rectification Diode Features: • Glass Passivated • Flammability Classification 94V-0 • Cathode Band Identification • Low Profile • Built in Strain Relief DO-214AC (SMA) Absolute Maximum Ratings: Parameter Sym. Max. repetitive Peak Reverse Voltage Max. DC Blocking Voltage Max. RMS Voltage Peak Surge Current VRRM VDC VRMS IFSM Type 050 Type 100 Type 200 Type 400 Type 600 Type 800 Type 1000 Unit 50 50 35 100 100 70 200 200 140 400 400 280 600 600 420 800 800 560 1000 1000 700 V V V 8.3ms half sine-wave + rated Load Max. Average Forward Current Max. Instantaneous Forward Voltage @ 1.0 A Max. DC Reverse Current @ 30 1.0 IO VF 1.1 5 50 IR Rated DC Blocking Voltage Junction Capacitance A A V @ 250C @ 1250C uA CJ @ 80% VRRM 5 Max. Thermal Resistance Reverse Recovery Time Operating Junction Temperature TJA TRR TJ 75 0 85 2 ~ to ~ -55 +150 pF C/W uS 0 C Characteristics: Forward Characteristic Reverse Characteristic A Current Derating uA 100 100 10 10 A 1.00 0.75 TJ=1000C 1 1 0.1 0.1 0.50 0.25 TJ=250C 0 0.01 0 0 0.5 1.0 1.5 0 2.0 VF 25 50 % Rated VR 100 150 25 50 100 150 200 Ambient Temp. (0C) Ordering Information: GSR Type 050 Voltage L Lead Finish TE Taping TE = 7” L = SnPb T = Tin Plastic Tape 14 KOA TF(X) R/C Filter Networks Features: Applications: Thin Film Construction Surface Mount Package Stable Resistor Technology High component Density Signal Termination Signal Conditioning Low Pass Filter T Filter Schematics: TFB – 24 pin TFB – 20 pin TFA – 20 pin Application: ( Filter Configuration ) Gnd 200 pF Driver 25 ohms 25 ohms Receiver 15 Specifications: Resistor Tolerance Resistance Range Power Rating / Resistor (700C) Temp. Coefficient Capacitor Tolerance Capacitance Range Cap. Voltage Rating * ESD Rating – IEC 61000-4-2 * Diode breakdown voltage (@1ma) Operating Temp. (0C) +/- 10% 10 to 1,000 ohms 100 mW +/- 200 ppm +/- 20% 33pF to 400 pF 20 V 4kV 6.5 v Min. -55 ~ +125 * Applies to the TFB device only. Package Information: L a p c w W H Dimensions in ( mm ): Package Symbol Q20 Q24 W20 Total Power 1 watt 1 watt 1.2 watts Number of Pins 20 24 20 L + 0.2 W + 0.2 w + 0.2 H + 0.2 p + 0.1 a + 0.1 c + 0.1 8.66 8.66 12.70 5.99 5.99 10.36 3.81 3.81 7.62 1.60 1.60 2.40 0.635 0.635 1.27 0.25 0.25 0.41 0.66 0.66 0.66 Ordering Information: TFB Q24 Type Package Code TFA TFB From table above L TEB 250 Lead Plating Taping T = 100% Tin L = SnPb TEB = 13” reel embossed tape Resistor Value 2 digits + multiplier K / 201 Tolerance Capacitor K = 10% Value M Tolerance M = 20% 2 digits + multiplier 16 KOA LFA L Filter Resistor / Capacitor Network Specifications: Resistor Tolerance Temp. Coefficient (ppm/0C) Resistor Power Rating (700C) Capacitor Tolerance Cap. Voltage Rating Power Rating / Package (700C) Operating Temp. (0C) +/- 10% +/- 200 100 mW +/- 20% 20 V 1W -55 ~ +150 KOA 0212 LFAQ20 250K/201M Schematic: 1 Standard Circuit Elements: Standard Packages Available: R = 10 ohm ~ 1K ohm (Std. E24 values) C = 22pF ~ 250pF (Std. E24 values) QSOP / WSOIC Ordering Information: LFA Series Q20 Package Q20-QSOP W20-WSOIC L TEB 500 K / 101 M Lead Finish L= SnPb Tape & reel 13” embossed plastic tape - Resistance value and tolerance - Capacitance value and tolerance Std. EIA value code + tolerance code K= +10% & M= +20% 500K = 50 ohm + 10% 101M = 100pF + 20% 17 KOA AC(X) Resistor / Capacitor Filter Networks Features: Applications: Thin Film Construction Surface Mount Package Stable Resistor Technology High component Density Signal Termination Signal Conditioning DC Current Blocking Schematics: Single Common 4 Commons 6 Commons ACB – 20 pin ACC – 20 pin ACD – 24 pin Application: ( Parallel Termination ) VTerm 50 ohms Driver 100 pF Receiver 18 Specifications: Resistor Tolerance Resistance Range Power Rating / Resistor (700C) Temp. Coefficient Capacitor Tolerance Capacitance Range Cap. Voltage Rating Operating Temp. (0C) +/- 10% 10 to 1,000 ohms 100 mW +/- 200 ppm +/- 20% 33pF to 400 pF 20 V -55 ~ +125 Package Information: L a p c w W H Dimensions in ( mm ): Package Code Q20 Q24 W20 Package Power 1 watt 1 watt 1.2 watts Number of Pins 20 24 20 L + 0.2 W + 0.2 w + 0.2 H + 0.2 p + 0.1 a + 0.1 c + 0.1 8.66 8.66 12.70 5.99 5.99 10.36 3.81 3.81 7.62 1.60 1.60 2.40 0.635 0.635 1.27 0.25 0.25 0.41 0.66 0.66 0.66 Ordering Information: ACB Q20 Type Package Code ACB ACC From table above ACD L TEB 500 Lead Plating Taping T = 100% Tin L = SnPb TEB = 13” reel embossed tape Resistor Value 2 digits + multiplier K / 101 Tolerance Capacitor K = 10% Value M Tolerance M = 20% 2 digits + multiplier 19 KOA CTX PECL Termination Network Specifications: Resistor Tolerance TCR (ppm/0C) Capacitor Tolerance Capacitor Voltage rating Resistor Power Rating (700C) Operating Temp. Range (0C) +/-10% +/- 200 +/-20% 20 v 100mW -55 ~ +150 Marking “ CTX ” Schematic: 2 C1 R2 1 R1 R2 3 Standard Circuit Elements: Standard Packages Available: R = 10 ohm ~ 1K ohm (Std. E24 values) C = 22pF ~ 250pF (Std. E24 values) SOT-23 Ordering Information CTX S03 Series Package S03 = SOT-23 L Lead Finish L= SnPb TE Packaging 7” reel embossed plastic tape XXXX Circuit value code - Defined by KOA * Contact KOA for your specific circuit requirements. 20 KOA RZA Jumper Network Specifications: Resistor (maximum) Temperature Coefficient (ppm/0C) Maximum Working Voltage (volts) Power Rating (700C) Operating Temp. Range (0C) 25 milliohms + 100 100 800mW -50 ~ +150 KOA 0212 RZAQ24 Schematic: 16 Pin 20 Pin 1 1 24 Pin 1 Standard Packages Available: QSOP / NSOIC / WSOIC Ordering Information: RZA Series RZA N 16 Package Pins Q = QSOP 08 W = WSOIC 14 N = NSOIC 16 20 24 L TEB Terminals Packaging L = SnPb 13” reel T = Tin embossed tape 21 KOA RIA Precision Resistor Networks Specifications: Resistor Tolerance (+) Temperature Coefficient (ppm/0C) TCR Tracking (ppm/0C) Value Range (ohms) Maximum Working Voltage (volts) Resistor Power Rating (700C) Operating Temp. Range (0C) + 5% + 100 10 10 ~ 47K 100 100mW -50 ~ +150 KOA 0212 RIAQ24 203J Environmental: Test Name Resistor to Soldering Heat Short Time Overload Moisture Resistance Thermal Shock H.A.S.T. Test Condition MIL-R-55342 4.7.7 MIL-R-55342 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 2 Atm., 1210C, 96 hrs. Spec. + 0.25% + 0.50% + 0.50% + 0.50% + 1% Schematic: 16 Pin 20 Pin 1 24 Pin 1 1 Standard Circuit Elements: Standard Packages Available: 10 ohms ~ 47K ohms QSOP / NSOIC / WSOIC (Std. E24 values) Ordering Information: RIA Series N 16 Package Pins Q = QSOP 08 W = WSOIC 14 N = NSOIC 16 20 24 L TEB Terminals Packaging L = SnPb 13” reel T = Tin embossed tape XXX Value Std. EIA value code J Tolerance J = +5% G = +2% H TCR +100ppm 101 = 100 ohms * Contact KOA for special ratio tolerance and TCR needs 22 KOA RBA Precision Resistor Networks Specifications: Resistor Tolerance (+/-) Temperature Coefficient (PPM/0C) TCR Tracking (PPM/0C) Value Range (ohms) Maximum Working Voltage (volts) Resistor Power Rating (700C) Operating Temp. Range (0C) + 5% + 100 10 10 ~ 47K 100 50mW -50 ~ +150 KOA 0212 RBAQ24 202J Environmental: Test Name Resistor to Soldering Heat Short Time Overload Moisture Resistance Thermal Shock H.A.S.T. Test Condition MIL-R-55342 4.7.7 MIL-R-55342 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 2 Atm., 1210C, 96 hrs. Spec. + 0.25% + 0.50% + 0.50% + 0.50% + 1% Schematic: 16 Pin 20 Pin 1 24 Pin 1 1 Standard Circuit Elements: Standard Packages Available: 10 ohms ~ 47K ohms QSOP / WSOIC / NSOIC (Std. E24 values) Ordering Information: RBA Circuit Type Q 24 Package Pins Q = QSOP 08 W = WSOIC 14 N = NSOIC 16 20 24 L Terminals L = SnPb T = Tin TEB Packaging 13” reel embossed tape XXX Value Std. EIA value code J Tolerance J = +5% G = +2% H TCR +100 ppm 101 = 100 ohms 23 KOA RD(X) SCSI & ECL Termination Networks Features: Applications: Thin Film Construction Surface Mount Package Stable Resistor Technology High Resistor Density Application Specific Design ECL Signal Termination SCSI Signal Termination Schematics: ECL Terminator SCSI Terminator R1 R2 R1 R2 R2 R1 R1 RDB – 20 pin RDA – 20 pin Application: (ECL Termination) ( SCSI Termination ) VCC VCC 220 330 + Signal + Signal 330 150 Gnd - Signal 330 Gnd GND GND 24 Specifications: + 5% + 100 10 ~ 10,000 100 50mW -50 ~ +125 Resistor Tolerance Temperature Coefficient (ppm/0C) Value Range (ohms) Maximum Working Voltage (volts) Resistor Power Rating (700C) Operating Temp. Range (0C) KOA 0212 RDBW20 250J/201J Environmental: Test Name Resistor to Soldering Heat Short Time Overload Moisture Resistance Thermal Shock H.A.S.T. Test Condition MIL-R-55342 4.7.7 MIL-R-55342 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 2 Atm., 1210C, 96 hrs. Spec. + 0.2% + 0.2% + 0.2% + 0.2% + 0.5% Package Information: L p d W20 – Q20 W Package Code W20 Q20 Package Power 1.2 watts 1.0 watts Number of Pins 20 20 L + 0.2 W + 0.2 p + 0.1 12.70 8.66 10.36 5.99 1.27 0.635 Pkg. Height + 0.2 2.40 1.60 d + 0.05 0.41 0.25 Ordering Information: RDA Q20 L TEB 331 J / 221 J H Type Package Lead Plating Taping R1 value / R2 value TCR RDA RDB W20 = 20 pin Wide SOIC Q20 = 20 pin QSOP T = 100% Tin L = SnPb TEB = 13” reel embossed tape Value = 2 digits + multiplier Tolerance code = J H = 100ppm 25 KOA RTX PECL TERMINATOR Specifications: Resistor Tolerance TCR (Std.) TCR Tracking (Min) Working Voltage Insulation Resistance (Min) Power Rating / Resistor (700C) Operating Temp. Range (0C) + 1% or + 5% + 100 ppm/0C + 10 ppm/0C 100v Max 1010 Ω 100mW -55 ~ +150 Marking “ RTX “ Environmental: Test Name Resistance to Soldering Heat Short Time Overload Moisture Resistance Thermal Shock Life H.A.S.T. Schematic: Test Condition MIL-R-55342 π 4.7.7 MIL-R-55342 π 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 MIL-STD-202 method 108 2 Atm., 1210C, 96 hrs. Resistor + 0.25% + 0.50% + 0.25% + 0.25% + 0.50% + 0.50% (top view) 2 R1 R2 1 3 Package: SOT-23 Ordering Information: RTX S03 Series RTX Package S03 = Sot-23 L Lead Finish L= SnPb T= TE Packaging TE = 7” reel embossed tape XXXX Value Code Specifies the customer defined Values, Tolerance, and TCR characteristics. Generated by KOA Tin 26 KOA RTY Precision Voltage Divider Specifications: Resistor Tolerance Ratio Tolerance TCR (ppm/0C) TCR Tracking (ppm/0C) Working Voltage (volts) Insulation Resistance (ohms) Power Rating / Resistor (700C) Operating Temp. Range (0C) + 0.1% ~ + 1% + 0.1% ~ + 1% + 25 ~ + 100ppm + 5 ppm Min. 100v Max 1010 Ω Min 100mW -55 ~ +150 marking “ RTY “ Environmental: Test Name Resistance to Soldering Heat Short Time Overload Moisture Resistance Thermal Shock Life H.A.S.T. Schematic: Test Condition MIL-R-55342 π 4.7.7 MIL-R-55342 π 4.7.5 MIL-STD-202 method 103 MIL-STD-202 method 107 MIL-STD-202 method 108 2 Atm., 1210C, 96 hrs. Resistor + 0.25% + 0.50% + 0.25% + 0.25% + 0.50% + 0.50% (top view) 2 R1 1 R2 3 Package: SOT-23 Ordering Information: RTY S03 Series RTY Package S03 = Sot-23 L Lead Finish L= SnPb TE Packaging TE = 7” reel embossed tape XXXX Value Code Specifies the customer defined Values, Tolerance, and TCR characteristics. Generated by KOA 27 Package Options p d W p p d e SOT-23 W d SOT-143 L W p d e SOT-235 W e SOT-236 L L L H c Dimensions in ( mm ) : Package Symbol S03 S14 S35 S36 Package SOT-23 SOT-143 SOT-235 SOT-236 Number of Pins 3 4 5 6 L + 0.2 W + 0.2 H + 0.2 p + 0.1 e + 0.1 c + 0.1 2.92 2.92 2.92 2.92 2.30 2.30 2.30 2.80 0.95 0.95 0.95 0.95 1.91 1.91 1.91 1.91 0.95 0.95 0.95 0.53 0.53 0.53 0.53 KOA d + 0.05 0.43 0.43 0.43 0.43 28 Package Options L a p c w W H Dimensions in ( mm ): Package Symbol Q16 Q20 Q24 Q28 M08 N08 N14 N16 W16 W20 Package QSOP QSOP QSOP QSOP MSOP SOIC-N SOIC-N SOIC-N SOIC-W SOIC-W Number of Pins 16 20 24 28 08 08 14 16 16 20 L + 0.2 W + 0.2 w + 0.2 H + 0.2 p + 0.1 a + 0.1 c + 0.1 4.90 8.66 8.66 10.00 3.00 4.83 8.66 9.91 10.44 12.70 5.99 5.99 5.99 5.99 4.88 5.99 5.99 5.99 10.36 10.36 3.81 3.81 3.81 3.81 3.00 3.81 3.81 3.81 7.62 7.62 1.60 1.60 1.60 1.60 1.00 1.60 1.60 1.60 2.40 2.40 0.635 0.635 0.635 0.635 0.650 1.27 1.27 1.27 1.27 1.27 0.25 0.25 0.25 0.25 0.30 0.41 0.41 0.41 0.41 0.41 0.66 0.66 0.66 0.66 0.66 0.66 0.66 0.66 0.66 0.66 KOA 29 Technology Focus What we excel in ! Application Specific Circuits Requiring the Integration of : • Thin Film Resistors (1%, 5%, 10% ) • Thin Film Capacitors ( 10%, 20% ) • Small Signal Diodes ( low capacitance, switching, detection, and ESD suppression ) • ESD Diodes • TVS Diodes • Small Signal Switching Transistors Capabilities Technology that can be integrated Resistors Diodes ( TaN ) Value Range -------- 10 Ω ~ 1Meg Ω Schottky Tolerance ----------- +/- 10%, 5%, 1%, Bipolar TCR ------------------ +/- 100 ppm Zener TCR Matching ------ +/- 5 ppm TVS Capacitors Value Range (dielectric = silicon oxide / silicon nitride) : 10pF ~ 500 pF Toleance : +/- 10% , +/- 20% Transistors * Small signal switching NPN PNP Packaging Roadmap YEAR - - - - - - - - - - - - - - - - - - > 2000 2002 2004 2005 ( % ) of Total Units Shipped 100% 0% SOIC QSOP SOT 0.5 mm Flip Chip 0.3mm Flip Chip Mixed Technology IC