Elite Material Co., Ltd.
Preliminary Technical Data
http:\\www.emctw.com
EM-355(S) / EM-355B(S)B
Processing Guideline
1. Oxide Treatment
EM-355(S) is compatible with most of oxide treatment used by PCB industry as below.
Oxide Treatment
Bake Suggestion
Black Oxide chemically reduced
with DMAB*
95-105oC (203-221oF)
35-45 Minutes
100-120oC (212-248oF)**
30-60 Minutes
Oxide Replacement
*DMAB: Dimethylamine Borane
**For some critical condition, the additional baking after oxide replacement can improve the drying
effectiveness and enhance the thermal reliability performance.
The oven bake suggestions above are general suggestions from of a particular supplier of reduced oxide and
oxide replacement chemistry. Higher baking temperature and longer baking time can degrade the coating’s
acid resistance and/or reduce the peel strength between resin and copper surface after oxide treatment. It is
recommended that the PWB fabricator test these suggestions to verify their performance in their particular
applications. Each fabricator should consult its coating supplier for specific bake suggestions.
2. Prepreg Thickness
Below table is unclad laminate thickness of EM-355(S).
Pressed Prepreg thickness on various constructions could be calculated by equation A. Butter coat
thickness should be maintained at least 5 μm for better adhesion.
Type
R/C(%)
106
106
1067
1067
1067
1078
1078
1080
1080
1080
1080
1086
1086
1086
2113
2113
3313
3313
3313
2116
2116
2116
2116
1501
1501
7628 / 7629
7628 / 7629
71±3.0
73±3.0
71±3.0
73±3.0
75±3.0
63±3.0
69±3.0
63±3.0
65±3.0
69±3.0
71±3.0
63±3.0
65±3.0
69±3.0
57±3.0
59±3.0
55±3.0
57±3.0
59±3.0
53±3.0
55±3.0
57±3.0
59±3.0
49±3.0
51±3.0
44±3.0
48±3.0
100% pressed
thickness(mil)
2.1
2.3
2.5
2.8
3.0
3.0
3.8
3.0
3.3
3.8
4.1
3.4
3.6
4.1
4.1
4.4
4.0
4.3
4.5
4.9
5.2
5.5
5.9
7.0
7.4
7.9
8.6
H : prepreg thickness after filling
inner layer pattern
H0 : unclad laminate thickness
R : residual copper ratio
T : copper thickness
Rev: 2015 Jun
1
Elite Material Co., Ltd.
Preliminary Technical Data
http:\\www.emctw.com
3. Press Cycle
General press cycle for normal construction of multilayer PWB:
>180°C (material temperature) x 60 min for board thickness<3.0mm.
Curing
For board thickness >3mm, please contact local customer service for further assistance.
The material should reach a peak temperature of 195°C at least.
Material
Heat Rise
1.7 ~2.6°C/min (from 80°C to 155°C).
Kiss pressure 5~7 kgf/cm2 (70~100 psi).
Apply middle pressure and ramp up slowly to full pressure is preferable.
Pressure
Apply full pressure 25~32 kgf/cm2 (360 ~ 460 psi) when the material temperature reaches
100°C-120°C. Pressure could be reduced from full pressure to kiss pressure in multiple steps
after 50~60 % curing stage is reached for stress relief.
Cooling Rate
< 2°C/min, is preferable starting from 190°C to 120°C.
Please contact our customer service for setting suitable press cycle if necessary.
Note
The attached graph is for reference purpose only and may require further adjustment depending
on the board size, thickness and complexity.
4. Prepreg storage (Shelf life)
EM-355(S)B should be stored under 23℃, RH 55％ for 3 month shelf life.
Rev: 2015 Jun
2
Elite Material Co., Ltd.
Preliminary Technical Data
http:\\www.emctw.com
5. Drilling Parameter
Drill Size
Spindle
In-feed
Retract
SFM
Chip Load
mm
Krpm
In/Min
In/Min
0.25
120
60.1
500
309.21
0.50
750
Prefered
0.30
110
63.0
500
340.13
0.57
1000
Prefered
0.35
110
74.8
500
396.82
0.68
1000
Prefered
0.40
99
78.7
500
408.16
0.80
1000
Prefered
0.45
88
78.7
500
408.16
0.89
1000
Prefered
0.50
80
78.7
500
412.28
0.98
1000
Prefered
0.55
72
78.7
500
408.16
1.09
1200
Prefered
0.60
66
78.7
500
408.16
1.19
1200
Prefered
0.65
61
78.7
500
408.68
1.29
1200
Prefered
0.70
57
78.7
500
411.25
1.38
1200
Prefered
0.75
53
78.7
500
409.71
1.49
1500
Prefered
0.80
50
78.7
500
412.28
1.57
1500
Prefered
surface feet/Min (mil /rev)
Enter board
Max Hit
(LE Sheet)
Notes:
1. UC type drill bit is recommended.
2. Total stack height depends on effective flute length of drill bit. Sufficient space for chip
removing should be kept to ensure that chips could be removed entirely.
3. Peck drill is depending on following situations, at least 2 steps is highly recommended.
3.1 thick board with drill holes (high A/R)
3.2 >=2 stack height of thinner board such as 1.2mm or 1.6mm board thickness
3.3 with CAF requirement
3.4 wicking less than 50um criteria
4. The above is just for reference. Modification and adjustment should be done to ensure that
hole wall roughness is less than 1.2 mil and nail head is less than 1.5x.
6. Post baking after deburr
Bake the boards at 170℃ for 2hrs after drilling ( deburr ) is recommended to
promote better hole wall reliability.
Rev: 2015 Jun
3
Elite Material Co., Ltd.
Preliminary Technical Data
http:\\www.emctw.com
7. Smear Removal
(1) Chemical Desmear: The typical sweller type glycol ether is prefer, cyclic amine
solvent sweller such as n-methyl pyrolidone (NMP) is not recommended.
(2) The typical desmear weight loss is as below figure shown.
EM-355(S)
Note: Please note that there are several factors would influence the hole wall
cleanness such as drilling parameters, build up thickness, aspect ratio,
it is necessary to adjust the proper parameter based on above factors.
It is recommended to confirm the hole wall quality by SEM.
Over desmear will cause crazing growth, reduce CAF resistance capability
and induce delamination, please review cross-section carefully before
any adjustment.
(3) The following pictures show that the surface of hole wall is rough enough without
any smear existing on the resin surface after desmear.
Before desmear
After desmear
The above process recommendations are intended for general review purposes. Process adjustments may
be required to achieve optimum results in your specific manufacturing environment.
Rev: 2015 Jun
4