Contents
Corporate Principles
・・・・・・・
3
Organization
・・・・・・・
4
Milestones
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5
Company Information
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6
Okayama Technology Center
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7
Apprecia Formosa Inc.
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8
Apprecia Electronics (Shanghai) Inc.
・・・・・・・
9
Products
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10
※ Our company name "Apprecia" is named after "Appreciation"
Revision: 2016/09/20
2
Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Corporate Principles
From a Human Perspective
With human kindness and outstanding creativity, and through an
inexhaustible spirit, to contribute to the creation of an abundant
future society - That is Apprecia Technology's management
philosophy.
As a development corporation, Apprecia Technology is constantly
pursuing the leading technology for the good of people.
Spirit
■The unwavering spirit that compels us to pursue every possibility
and push through any circumstance without giving up is the spirit of
Apprecia Technology that supports our growth as a corporation.
■ The creative spirit that is always developing new products
through technical innovation and lays the foundation for Apprecia
Technology's strength as a corporation that will continue to
constantly evolve.
■We consider the spirit of technology for people that contributes
to the prosperity of society and the enrichment of Apprecia
Technology's social responsibility as a corporation.
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Organization
Board of Directors
China Subsidiary
Apprecia Electronics (Shanghai) Inc.
Taiwan Subsidiary
Apprecia Formosa Inc.
General Administration
Okayama General Administration
and Logistics
Sales
Research & Development
Products Engineering
President
Board of Directors
Directors
President
Toshio Ikeda
Senior Managing Director
Shigeo Kameyama
Managing Director
Shuji Ueda
Managing Director
Hirotaka Shibata
Director
Koji Oka
Director
Osamu Nakamura
Director
Rui Mitamura
Auditor
Auditor
Shoji Yamamoto
Toshio Ikeda / President
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Milestones
1991
Aug.
Established “m・FSI Ltd.” as FSI International representative in Japan
1999
Jul.
Became an exclusive distributor in Japan for the CMP slurry distribution products
of BOC Edwards (current Air Liquide Electronics U.S. LP)
Built Okayama Technology Center equipped class 10 cleanroom
2000
Sep.
Shipped the first MX2000™ Slurry Distribution System
2003
Jun.
Acquired semiconductor equipment division of Nisso Engineering
2007
Feb.
Shipped the first PSYRION® Phosphoric Acid Reclaim System
Jun.
Shipped the first iSIS™1200J Slurry Distribution System
2007
Sep.
Shipped the first NISON® Vesper SiN Etching Control System
2008
Jan.
Named Apprecia Technology Inc. replacing m・FSI
2009
Jul.
Established Apprecia Formosa Inc. in Taiwan
2010
May
Shipped the first TIGRIS®200 Cassetteless Wet Station
Oct.
Shipped the first TIGRIS®300 Cassetteless Wet Station
2011
Nov.
Established Apprecia Electronics(Shanghai)Inc. in China
2013
Jan.
Joined TAZMO group
2014
Dec.
Merged TAZMO Taiwan with Apprecia Formosa Inc.
Started distribution of the TAZMO products and maintenance service
2015
Apr.
Delivered large capacity PSYRION® System to a major device manufacturer
2016
Mar.
Released the VAP200™/VAP300™ Lift Off Systems
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Company Information
Company Name
Apprecia Technology Inc.
Head Office
Ichigo Takadanobaba Building 5F, 1-29-8 Takadanobaba,
Shinjuku-ku, Tokyo 169-0075, Japan
Tel. +81-3-6233-9150 Fax. +81-3-6233-9730
Okayama Technology Center
Okayama Research Park, 5311, Haga,
Kita-ku, Okayama-shi, Okayama 701-1221, Japan
Tel. +81-86-286-9300 Fax. +81-86-286-9400
Yokkaichi Support Center
3-16-803, Kunoshiro-cho,
Yokkaichi-shi, Mie 510-0072, Japan
Tel.059-337-8337
Foundation
1991/9/1
President
Toshio Ikeda
Employees
90 (as of Jan. 2016)
Capital
JPY 100 million
Major Business
Sale, Manufacturing and R&D of process technology for Semiconductor Equipments
Major Products
Cleaning / Surface conditioning equipments etc.
Major Share Holder
TAZMO CO.,LTD.
Subsidiaries
Apprecia Formosa Inc.
Apprecia Electronics (Shanghai) Inc.
● Overseas Network
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Okayama Technology Center
Okayama Technology Center provides semiconductor process development and product demonstration capabilities as well as
design/prototyping/verification activities with the latest metrology tools in class 10 / 450m2 clean room environment.
Here we bring the best solutions to customers through the latest value-added technology development (on a daily basis).
Address
Okayama Research Park, 5311, Haga, Kita-ku, Okayama-shi, Okayama 701-1221
Site Area
8,554m2
Total Floor Area
3,614m2
Inspection room
Cleanroom (Class 10)
Inspection room
This is for 300mm-based product demonstration and process development/characterization utilizing a variety of measurement
and inspection tools such as particle and film thickness measurement tools.
Cleanroom (C10)
This class 10 cleanroom is for customer demonstration and process development activities.
Research & Development Room
This is for product maintenance training class for customers or verification tests for electrical/ control systems.
Cleanroom (C1000)
This class 1000 cleanroom is for customer demonstration and in-house tests of CMP slurry delivery systems
and hardware verification tests for primary Apprecia products.
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Apprecia Formosa Inc.
Location
8F-1, No.100, Sec. 1, Jiageng 11th Rd., Zhubei City, Hsingchu County, Taiwan (R.O.C)
Tel. +886-3-550-0141 Fax. +886-3-550-0142
Foundation
July, 2009
Business
Sales and Technology Service for Semiconductor equipment
Products
Coater, Developer, Bonder, Debonder,, EFEM, Single Cleaning System, Batch Cleaning
System, H3PO4 Reclaim System,
A variety of remodeling work for cleaning system
Employees
25
Site Office /
Taichung City and Tainan City
Sales Branch
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Apprecia Electronics (Shanghai) Inc.
Location
Room 316A, Cimic Tower, 800th. Shangcheng Rd., Shanghai City, China
TEL:+86-21-22065398 FAX:+86-21-22065399
Foundation
November, 2011
Business
Semiconductor, electronic products and accessories sales and technology service
Products
Coater, Developer, Bonder, Debonder, EFEM, Single Cleaning System, Batch Cleaning
System, H3PO4 Reclaim System,
A variety of remodeling work for cleaning system
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.
Products
Apprecia Technology offers a variety of clean and etch products including NISON® series and PSYRION® for semiconductor and
wafer manufacturers worldwide.
Phosphoric Acid Reclaim System
PSYRION®
H3PO4 life-cycle management is critical due to Si compounds precipitation over time by consecutive
SiN etch process.
PSYRION® provides H3PO4 reclaim capability by removing the Si compounds with Apprecia’s unique
technology and contribute to environmental measure and COO improvement.
SiN Etching Control System
NISON® VESPER
A change in SiN etch selectivity against SiO2 is an another issue due to Si compounds precipitation over
time.
NISON® VESPER enables to manage the etch selectivity in addition to H3PO4 reclaim capability. It
realizes to reduce tool down time and chemicals consumption at the same time.
SiN Etching Processor
NISON® 1800
NISON®1800 is highly valued from market as critical high-temp chemical circulation system for SiN etch
process. It provides digitized process control for better accuracy.
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Products
Single Wafer Etching/Cleaning System CENOTE®
CENOTE® is a multipurpose single wafer cleaning system with the multiple cup design. It provides
high-purity wafer surface cleaning and precise etching by continuously dispensing ultra clean fluid as
well as accurate controls of variable chemicals, blending ratios, flow rates and temperatures. A
simultaneous treatment on both sides of wafer prevents backside contamination and enables to skip
post-treatment processes for backside of the wafer.
The continuous processing at each cup with the multipule cup design provides high throughput. The
processing modules for acid chemicals, base chemicals and organic solvents are available and its
configuration can be flexibly designed in accordance with customers needs. CENOTE® can be
configured with the atomized spray, the ultrasonic spray etc. and is compatible with wide range of
wafer diameters such as 3-inch to 12-inch.
Lift Off System VAP200™/VAP300™
VAP200™/VAP300™ system has an unique process design with the batch immersion cleaning
modules and the single wafer cleaning modules and is suitable for stripping of photoresists and
other films. A combination of batch cleaning at the immersion tanks and precision cleaning at the
single wafer processing chambers enables efficient tact time and clean strip processing. It also
provides high temperature chemical processing and high pressure spray processing. An
explosion-proof design which is compatible with variable organic solvents is available and enables
efficient cleaning processing with intermediate rinse with the isopropyl alcohol (IPA) etc.
VAP200™/VAP300™ is compatible with wide range of wafer diameters such as 4-inch to 12-inch.
Batch Immersion Etching/Cleaning System TIGRIS® /CIMANTO®
TIGRIS® 300 and TIGRIS® 200 are high-performance batch type 200mm/300mm immersion
cleaning and etching system, added our original technology to specifications of the
industry-standard. Process management using variety of monitors realizes high quality process.
In addition, NISON® VESPER or PSYRION®, phosphoric acid reclaiming system which are
environmental friendly and achieve reduction of chemical usage, both systems can be combined as
an option. Further, to meet a wide range of needs, its process module can be lay out flexibly.
CIMANTO® is the lineup for Si wafer production, and/or wafers under 8 ".
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Copyright©2009-2016 Apprecia Technology Inc. All rights reserved.