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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 46, NO. 4, NOVEMBER 2004
Electromagnetic Interference (EMI) Reduction
From Printed Circuit Boards (PCB) Using
Electromagnetic Bandgap Structures
Shahrooz Shahparnia, Student Member, IEEE, and Omar M. Ramahi, Senior Member, IEEE
Abstract—As digital circuits become faster and more powerful,
direct radiation from the power bus of their printed circuit boards
(PCB) becomes a major concern for electromagnetic compatibility
engineers. In such multilayer PCBs, the power and ground planes
act as radiating microstrip patch antennas, where radiation is
caused by fringing electric fields at board edges. In this paper, we
introduce an effective method for suppressing PCB radiation from
their power bus over an ultrawide range of frequencies by using
metallo-dielectric electromagnetic band-gap structures. More
specifically, this study focuses on the suppression of radiation
from parallel-plate bus structures in high-speed PCBs caused by
switching noise, such as simultaneous switching noise, also known
as Delta-I noise or ground bounce. This noise consists of unwanted
voltage fluctuations on the power bus of a PCB due to resonance
of the parallel-plate wave-guiding system created by the power
bus planes. The techniques introduced here are not limited to the
suppression of switching noise and can be extended to any wave
propagation between the plates of the power bus. Laboratory
PCB prototypes were fabricated and tested revealing appreciable
suppression of radiated noise over specific frequency bands of
interest, thus, testifying to the effectiveness of this concept.
Index Terms—Electromagnetic band gap (EBG) material, electromagnetic compatibility (EMC), electromagnetic interference
(EMI), switching noise.
I. INTRODUCTION
E
LECTROMAGNETIC radiation of high-speed digital and
analog circuits is considered one of the most critical challenges to the electromagnetic interference, compatibility and
reliability of electronic systems. The continuous decrease in
power supply and threshold voltage levels in CMOS based digital circuits increases their vulnerability to external electromagnetic interference. At the same time, the increase in clock and
bus speed increases the potential of the circuit to radiate, thus,
compromising its compatibility potential and also increasing
its security vulnerability. Switching noise is one of the major
concerns for electromagnetic compatibility (EMC) engineers in
modern designs [1], [2].
Manuscript received November 26, 2003; revised March 23, 2004. This work
was supported in part by the Department of Defense (DoD) MURI Program on
Effects of Radio Frequency Pulses on Electronic Circuits and Systems under
AFOSR Grant F496200110374, and in part by the CALCE Electronic Products
and Systems Center, University of Maryland at College Park.
The authors are with the Electrical and Computer Engineering Department,
CALCE Electronic Products and Systems Center, A. James Clark School of
Engineering, University of Maryland, College Park, MD 20742 USA (e-mail:
oramahi@calce.umd.edu).
Digital Object Identifier 10.1109/TEMC.2004.837671
Electromagnetic interference (EMI) is a complex mechanism
that takes place at different levels including the chassis, board,
component, and finally, the device level. Radiation sources typically include trace coupling, cables attached to the boards, components such as chip packages and heat sinks, power busses and
practically anything that can provide a low impedance current
path. As the speed of modern high-performance digital circuits
increases rapidly, their energy consumption increases as well.
The required energy is provided by power planes embedded in
the multilayer structure of the board. These power planes induce
radiation in a manner highly analogous to the way microstrip
antennas radiate. In microstrip patch antennas and in printed
circuit boards (PCB), radiation is induced by a time-varying
fringing electric field at the edges of the board. Recent studies
describe this phenomenon [3] and others characterize this phenomenon analytically and through numerical simulations [4].
In previous work, several techniques were used to reduce this
type of radiation. These methods include shielding, the placement of decoupling capacitors [5], [6], the use of embedded
capacitance [7], the placement of resistive terminations on the
edges of the board [8], employing lossy components throughout
the board [9], dividing power planes in power islands [10], via
stitching [11]–[13], or a combination of any of these techniques.
Among these methods, via stitching is the most common method
used in practice and its effectiveness has been quantified through
rigorous finite-difference time-domain (FDTD) simulation as
reported in [11]. All noise mitigation techniques, however, that
employ discrete capacitor components have a fundamental limitation due to the inherent inductance arising from the leads of the
capacitors (see [11] and references therein). For embedded capacitance, its relatively high cost and reliability considerations
reduces its practical use at this time.
To the best knowledge of the authors, this study presents
the first work on applying electromagnetic bandgap structures
(EBG) known also as high-impedance surfaces (HIS), to reduce
radiation from power busses of PCBs. HIS structures are periodic structures capable of preventing the propagation of electromagnetic surface waves within a frequency range. HIS structures have been initially introduced by Sievenpiper et al. in
[14], [15] in order to suppress surface waves in antenna applications. Some of their recent applications include microwave
filter design [16], microstrip and small antennas [17], [18] and
PCBs [19]. This paper introduces the novel concept of applying
HIS structures to electromagnetic interference (EMI) reduction
from power busses of PCBs. We show that for multilayer PCBs,
the presence of high-impedance surfaces between each pair of
0018-9375/04$20.00 © 2004 IEEE
SHAHPARNIA AND RAMAHI: EMI REDUCTION FROM PCB USING ELECTROMAGNETIC BANDGAP STRUCTURES
power planes can effectively shield the edges of the board and
therefore decrease the level of radiation from such edges. The
use of the HIS structures is not limited to EMI radiation suppression from power busses and it can be extended to radiation
suppression from signal layers as well.
The outline of this paper is as follows. Sections II and III
give brief overviews of switching noise, and electromagnetic
bandgap structures, respectively. Section IV introduces the
novel concept of suppressing electromagnetic radiation from
PCBs using HIS structures. This section includes design using
finite-element eigenmode and S-parameter simulations as
well as experimental results on PCBs embedded with the HIS
structures. Finally, Section V presents ultrawide-band radiation
suppression, expanding the concept introduced in Section IV to
multiple-band suppression, and again experimental results are
presented to show the effectiveness of the method.
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Fig. 1. Switching noise generation mechanism from a power bus in a
multilayer PCB.
II. SOURCES OF NOISE AND SWITCHING NOISE
Switching noise is usually caused by the high-speed timevarying currents needed by high-performance digital circuits.
The flow of these currents through vias between layers of a
PCBs, causes radiation. The radiated waves use the parallel
plates created by the power planes to propagate [4], [20]. Simultaneous switching noise (SSN) is an inductive noise created
while many outputs of a digital circuit switch at the same
time. SSN cannot be quantified in precise measure because
of its dependence on the geometry of the board and current
paths and various studies have concentrated on modeling this
phenomenon [21]–[23]. A very simple way of describing SSN
is by considering the following:
(1)
is the magnitude of the noise voltage,
is the
where
number of outputs (drivers) switching simultaneously,
is the
equivalent inductance through which the current must pass and
is the current that passes through each driver while switching.
When several signals switch at the same time the power planes
connected to the power supply must deliver the required cur. The existence of inducrent which has to pass through
tance on the path of the current introduces voltage fluctuations
on power planes which in turn affect the outputs of the drivers as
well as other signals throughout the board creating malfunctions
and false switching. This type of noise, referred to as Delta-I
noise or ground bounce, is considered a fundamental and critical problem in the design of high-speed PCBs [24].
The continuous and rapid increase of clock frequency is another source for switching noise. In fact high-speed small currents have an equivalent impact on switching noise as switching
of circuits that involve large amounts of current (simultaneous
switching). Fig. 1 shows a general schematic for the generation
of switching noise within a power bus of a PCB. A high-speed
or high-power (or both) logic gate that consumes power from
two parallel power planes is the first source. A via that passes
through these plane and is not necessarily connected to any of
them is another source of noise.
Electromagnetic waves generated by these sources of noise
use the parallel-plates to propagate and therefore induce noise
Fig. 2. EBG structure with its geometrical design features. PS is the patch
size, VD is the via diameter and GS is the gap size, VH is the via length and TH
is the distance between the two planes. (a) Lateral view. (b) Top view.
on other signals passing through the power bus (vias) and eventually radiate from the edges of the board.
In an equivalent circuit for this phenomenon, the high-speed
gate is replaced by a current source between the power planes
and it represents either a large time-varying switching current
driver (large ) or a fast time-varying switching circuit (small
) or even a combination of both.
is the impedance of the
signal generator used in simulations and experiments, usually
equal to 50 ohms.
III. ELECTROMAGNETIC BAND-GAP STRUCTURES
EBG structures initially introduced in [14], [15], and [25]
belong to a broad family of engineered materials called
meta-materials, which have been initially introduced for antenna applications because of their unique behavior. EBG
structures can satisfy a perfect magnetic conductor (PMC)
condition over a certain frequency band and impose a 0 reflection phase to normal incident waves, making them suitable
for applications such as coupling reduction between antennas
and antenna directivity improvement [26]. Although EBG
structures have been extensively studied, these studies have
focused on open structures (not enclosed in environments like
PCBs) and normal incident waves, such as antenna application,
therefore derived theories and models are only applicable to
such cases. For more information on open EBG structures the
reader is referred to [14]–[18], [25], [26] and references therein.
The use of EBG structures to suppress SSN in PCBs was
first reported in [19]. A similar concept was also introduced
in [27]. Fig. 2 shows a typical EBG structure, the simplest of
them, which is characterized by periodic vias (with diameter
size VD) connected together through a conductive (metallic)
surface, and metallic patches on the top of these vias. The size
of these patches is denoted as PS in Fig. 2, they are separated by
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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 46, NO. 4, NOVEMBER 2004
Fig. 3. Lateral view of the diagram for the switching noise model which
includes the HIS structures as a ribbon around the board (only two rows are
shown).
gaps of size GS from each other and by a via of length VH from
the plane that they are connected to. The structure is periodic
and it is located between two parallel
with period
metallic plates with distance TH from each other. The whole
structure acts as a band-stop filter by suppressing surface waves
within a predictable range of frequencies. This frequency range
is a function of the geometrical features of the structure (such
as periodicity, patch size, gap size, via diameter, via length and
also board thickness) as well as the dielectric material used in
the printed circuit board as substrate. To the best knowledge of
the authors, at this point there is no equation available in the
literature that gives a good relationship between the geometrical features of the structure on the one hand, and the center
frequency and band-stop region on the other. Section IV gives
some insight on design methodologies used for EBG structures.
IV. EMI SUPPRESSION USING EBG SURFACES
In this paper, an EBG structure introduced in [25] is used for
the purpose of EMI mitigation in PCBs. The proposed technique consists of placing a ribbon of HIS around the board
connected to one of the power planes. If the internal circuits
generate switching noise with a frequency within the band-stop
region of the HIS ribbon, the presence of the ribbon prevents
waves generated within the parallel plate, from radiating from
the sides of the board. Fig. 3 shows a diagram illustrating the
lateral view of a board employing this concept.
A. Design Through Simulation
In earlier works on HIS structures in PCBs [19], [27], in early
design stages, approximation techniques and models developed
for designing HIS structures in antenna systems [25] were used.
Since, these models assume normal incident waves they are not
applicable for parallel-plate (PCB) related applications. This includes the simple model introduced in [25], which is derived
assuming a resonance circuit that involves two patches and the
vias that connect them through a conductive plane. In the case of
HIS in parallel-plates such resonant circuit is composed of the
top plate, a single patch, the corresponding via and the plane that
connects the vias together. In fact this circuit provides a lowimpedance path to high-frequency currents in the power-planes
therefore shorting the planes (resonance) at the physical location of the patches within the band-stop frequency range, thus,
suppressing radiation.
Fig. 4. Simulation setup for S-parameter simulation. Waves generated on port
1 do not reach port 2 within the band-stop region. (a) Top view of the mid layer
(patch layer). (b) Sideview which includes the sources as a replacement for the
SMA connectors used in experiments.
In order to design HIS structures, the only two methods that
have been successfully used so far, are S-parameter simulations
and dispersion diagrams.
Fig. 4 shows a diagram of the model used for S-parameter
simulations. The model consists of two ports and a two-dimensional (2-D) periodic HIS structure located between them. Since
the presence of the HIS structure between the ports prevents
wave propagation between them within a frequency range, the
parameter, a representative for the transferred power, will
reflect the effect of the HIS structure.
Another tool widely used for the study of periodic structures
is the dispersion diagram. In a 2-D periodic structure in the
– plane, due to symmetry and periodicity, redundant propagation vectors can be grouped in a region known as Brillouin zone
and
(respectively, the and compo[28]. By tracing
nents of the propagation constant) as variables, on the border of
the irreducible zone, using eigenmode simulation the frequency
of different propagating modes are calculated. For the simple
patches of the HIS structure used in this work, this region is
shown at the left upper corner of Fig. 5. In this diagram, the
bandgap is represented by the frequency range in which there is
and
no propagating mode for any values of
In summary, S-parameter derivation through full-wave
simulations and dispersion diagram extraction using periodic
boundary conditions and eigenmode simulation using a commercial CAD tool by Ansoft Company (HFSS) have shown to
be very effective in designing and implementing HIS structures.
As an example of the type of results obtained using the above
mentioned two methods, we show in Fig. 5 the dispersion diagram for a periodic structure with patch size of 5 mm, via diameter of 0.8 mm, via length of 1.54 mm, board thickness of
SHAHPARNIA AND RAMAHI: EMI REDUCTION FROM PCB USING ELECTROMAGNETIC BANDGAP STRUCTURES
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TABLE I
RESULTS FROM THE DISPERSION DIAGRAMS AND S-PARAMETER
SIMULATIONS WITH VARIOUS PATCH SIZES KEEPING GS = 0:4 mm,
VD = 0:8 mm, VL = 1:54 mm, TH = 3:08 mm AND
ITS PERMITTIVITY (ASSUMED TO BE 4.1) FIXED
Fig. 5. Dispersion diagram for an infinitely periodic structure with PS =
5 mm, VD = 0:8 mm, VL = 1:54 mm, GS = 0:4 mm on commercial FR-4
(" = 4:1) derived by HFSS simulation using periodic boundary conditions.
Fig. 6. S-parameters (S ) diagram for an EBGc with PS = 5 mm, VD =
0:8 mm, VL = 1:54 mm, GS = 0:4 mm on commercial FR-4 (" = 4:1)
derived by HFSS simulation using periodic boundary conditions.
3.08 mm, gap size of 0.4 mm on commercial FR-4 derived by
parameter for the
simulation using HFSS. Fig. 6 shows the
same structure when implemented as the model in Fig. 4. From
both simulations, it is clear that the stop-band lies approximately
between 4 and 8 GHz.
The results of simulations on various HIS structures are
tabulated in Table I. By taking into account that the bandwidth of simulated structures is approximately two-third of
the center frequency (66% fractional bandwidth), and that the
switching noise power is mostly concentrated in frequencies
below 6 GHz [27], HIS structures can be designed so that their
band-stop region overlaps the desired suppression frequency.
For lower center frequencies, HIS structures with larger patches
are needed, which in some cases may seem impractical. This
can be compensated by other HIS structures, rather than the
simple one [25], [29] in order to get the same bandwidth or
even multiple bandwidths with smaller periods (patch sizes and
distances) or by modifying the other design parameters such as
the substrate material.
In addition, it should also be noted that the concept of radiation suppression from PCBs using HIS structures is effective
regardless of the stack up of power planes in the multilayer
printed circuit board (GVGV, GVVG, etc.) as it is applied
to every couple of power bus layers (VDD-GND) rather that
(GND-GND) like in the stitching method. Specifically, by
adding HIS structures between VDD-GND planes, radiation
caused by SSN as well as noise generated by vias that pass
2
Fig. 7. The board (6.5 cm 10 cm) fabricated on commercial FR4. A ribbon
of four rows of HIS structures around the board with similar patches simulated
in Figs. 5 and 6. The source of noise (excitation point) is in the middle of the
board.
through them is being suppressed. By adding HIS structures
between GND-GND or VDD-VDD pairs of planes, radiation
caused by noise generated by the vias that pass through them
is being suppressed as noise propagation due to SSN does not
exist in such pair of planes.
B. Fabrication and Measurements
HIS structures used in PCBs are fabricated using commercial
PCB manufacturing technology. In experimental stages in order
to avoid the cost of blind vias, the PCBs were constructed
by compressing a double-sided PCB like the one shown in
Fig. 7 and a single-sided PCB involving one of the power
planes together.
Exhaustive full-wave simulations conducted on HIS structures show that extending the vias of the structures to the other
plane (removing the copper around the hole on the other plane
to avoid the shorting of the two planes, therefore creating an
anti-pad) and shrinking the thickness of the board to practical
multilayer sizes (0.15 to 1 mm [30]) does not have appreciable
effect on the bandgap. Therefore in practical applications, design parameters can be modified in order to achieve the same
performance as thicker prototypes, with and without blind vias,
making their fabrication inexpensive and practical.
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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 46, NO. 4, NOVEMBER 2004
Fig. 8. Experimental setup for S measurements for boards under test (BUT).
One of the ports is connected to BUT and the other one to a monopole antenna.
Fig. 10. Measured S for the structure in Fig. 7 within a power bus
configuration, at test point TP1, with and without the HIS structure.
Fig. 9.
Location of different test points (TP) in all experiments.
Fig. 7 shows a picture of a printed circuit board fabricated
to test the proposed radiation suppression concept and Fig. 8
is a diagram that shows the experimental setup used to characterize such boards. The signal was fed to the parallel-plate environment through an SMA connector to the middle of the board
using a vector network analyzer (VNA). The amount of radiation from the edges of the board is measured by measuring the
as a representative for the radiated
scattering parameters
power at various test points around the board, also shown in the
diagram of Fig. 8. These test points were chosen to show the
omni-directional suppression property of the proposed design.
As shown in the diagram of Fig. 8 a monopole probe (length
4 cm, diameter 3 mm made of copper) connected to the other
cable of the analyzer through a SMA connector represents the
receiver in this experimental setup.
The area with no HIS structure in Fig. 7 has been kept minimal in order to maximize the radiated energy received by the
receiving antenna. In a practical scenario, a 5-mm patch HIS
structure with four rows of HIS resides in a 2-cm-wide ribbon
around the PCB. For a 20 10 cm board this is 28% of the
PCB area. The presence of the HIS structure in this region implies some PCB design constraints for the PCB designers, in
a similar way that placing decoupling capacitors on the board
does. Considering the fact that components can reside on top
of the structures and also that their power supply can be connected directly to the patches, it is most likely that for practical
applications their impact is minimal. In fact, the assumption is
that our technique does not impose an enlargement of the actual
PCBs, but rather the HIS structures are being implanted into the
border side of an already designed PCB with appropriate modifications. We emphasize that, although the concept of radiation
Fig. 11. Measured S for the structure in Fig. 7 within a power bus
configuration, at test point TP2, d1 = 3:25 cm, with and without the HIS
structure.
suppression using HIS structures is general, patch sizes larger
than 5 mm are not practical, thus, more complex HIS structures
such as the one mentioned in [14], [19], [25], and [29] need to
be used for low frequencies.
Figs. 10–14 show the results of these measurements. A wide
gap from 4 to 10 GHz (as predicted from the simulations shown
in Figs. 5 and 6) shows an average suppression of 30 dB within
this gap in comparison to the case without the HIS. Higher attenuation than predicted at higher frequencies is highly likely due
to dissipation in the FR4 substrate and to higher, but not significant, bandgaps created by the structure. The plot of measured
for a reference board without the HIS structures is also included for comparison.
V. WIDE-BAND EMI REDUCTION
Widening the suppression band-gap can be accomplished
by using cascaded high-impedance surfaces (CHIS) with different structures around the board, creating an ultrawide-band
stop band for the propagating wave. As an example, we consider the configuration shown in Fig. 15 with a board size of
SHAHPARNIA AND RAMAHI: EMI REDUCTION FROM PCB USING ELECTROMAGNETIC BANDGAP STRUCTURES
585
Fig. 15. Cascading two HIS structures with different configurations (5 and 10
mm patches, four rows each, with the other dimensions similar to the ones in
Fig. 5), for an ultrawide-band suppression of radiation from the edges of the
PCB.
Fig. 12. Measured S for the structure in Fig. 7 within a power bus
configuration, at test point TP3, d2 = 5cm, with and without the HIS structure.
Fig. 16. Measured S for the structure in Fig. 15 within a power bus
configuration, at test point TP1, with and without the HIS structure.
Fig. 13. Measured S for the structure in Fig. 7 within a power bus
configuration, at test point TP4, d3 = 5cm, with and without the structure.
Fig. 14. Measured S for the structure in Fig. 7 within a power bus
configuration, at test point TP5, d4 = 5:1cm, with and without the HIS
structure.
20.6 16.6 cm, and a signal source positioned at the center
and connected to the board through an SMA connector. In this
configuration, an HIS structure with a patch size of 10 mm (HIS
Type 2) and other parameters similar to the patches of Fig. 7
(and therefore period of 10.4 mm) is added to a structure with
a patch size of 5 mm (HIS Type 1). Cascading HIS structures
is based on the same concept of cascading filter stages in order
to achieve larger bandwidths (either pass-band or stop-band),
multiple bands or larger attenuation. This concept was first
introduced in [31] for ultrawide-band suppression of switching
noise in PCBs but the same idea can be used here since the
noise generation mechanism is identical. Fig. 16 shows the
response for this configuration, at test point
measured
1 shown in Fig. 9. Due to the omni-directional suppression
property of the HIS structures already shown in the previous
section, measurements at other test points reflect the same radiation suppression behavior. These experimental results show
that an additional gap between 2 and 4 GHz is introduced by
the added structure (with a period of 10.4 mm). This property
is especially relevant to cases in which the suppression of a
fundamental frequency is as important as the suppression of
the harmonics of that frequency. As an example, as illustrated
in Fig. 16, the design in Fig. 15 is capable of suppressing not
only a noise at 3 GHz but also its second and third harmonics
at 6 and 9 GHz, creating ultrawide-band suppression radiation
from PCBs employing such design.
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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 46, NO. 4, NOVEMBER 2004
ACKNOWLEDGMENT
The authors acknowledge the anonymous reviewers whose
comments improved the quality of this paper.
REFERENCES
Fig. 17.
Efficacy range of different radiation reduction methods.
VI. DISCUSSION AND CONCLUSIONS
This study introduces the novel concept of using electromagnetic bandgap structures for the suppression of electromagnetic
radiation generated by high-speed and high-current switching,
also known as switching noise, from power busses of PCBs.
Simulation and experimental results prove the effectiveness of
this method in suppressing radiation from PCBs in a range of
frequencies over which the conventional methods are not effective (0.5 GHz and up). The tradeoff for the improved performance provided by the HIS structures is the addition of an extra
metallized layer. In Fig. 17, we illustrate the efficacy frequency
range of different radiation suppression methods, emphasizing
the fact that the simple HIS structures presented in this paper
are targeting the 0.5–10 GHz range, therefore pushing the limit
of previous methodologies. Since simple HIS structures have
impractical geometrical sizes in the 500 MHz to 2 GHz frequency range, more complex HIS structures such as the one presented in [14], [19], [25], and [29] need to be employed. In addition, in view of the ongoing miniaturization of electronic systems the implementation of this method requires the availability
of miniaturized HIS structures with appropriate patch sizes, although the concept introduced in this paper can be generally
applied regardless of the size of the HIS structures. If wideband
radiation reduction from hundreds of MHz to few GHz needs
to be achieved a combination of different methods is the best
solution.
HIS structures can also be applied to the same range of frequencies for which conventional methods are used (i.e., up to
few hundred megahertz). To provide noise suppression for the
megahertz range, the simple HIS patches used through this work
can be used, but as explained earlier, the patch sizes will become possibly impractical. Therefore, for practical purposes, if
one wants to use the HIS structures for noise suppression in the
megahertz range, more complex HIS structures need to be considered. Alternatively, one can use a combination of the techniques introduced here with conventional methods [19].
Ultrawide-band suppression of such radiation is achieved by
cascading different configurations of high-impedance surfaces.
The significance of ultrawide-band suppression lies in the fact
that CHIS structures provide a practical way to suppress radiation not only at the fundamental frequency of the noise but
also its harmonics. PCB prototypes were designed, developed
and tested showing unprecedented level of EMI reduction over
an ultrawide-band of frequencies that can encompass the clock
frequency and its immediate harmonics.
[1] R. Senthinatan and J. Price, Simultaneous Switching Noise of CMOS
Devices and Systems. Norwell, MA: Kluwer, 1994.
[2] S. Radu and D. Hockanson, “An investigation of PCB radiated emissions from simultaneous switching noise,” in Proc. IEEE Int. Symp.
Electromagnetic Compatibility, vol. 2, Seattle, WA, Aug. 1999, pp.
893–898.
[3] T. H. Hubing, “Printed circuit board EMI source mechanisms,” in Proc.
IEEE Int. Symp. Electromagnetic Compatibility, vol. 1, Boston, MA,
Aug. 2003, pp. 1–3.
[4] M. Leone, “The radiation of a rectangular power bus structure at multiple
cavity-mode resonances,” IEEE Trans. Electromagn. Compat., vol. 45,
pp. 486–492, Aug. 2003.
[5] V. Ricchiuti, “Power-supply decoupling on fully populated high-speed
digital PCBs,” IEEE Trans. Electromagn. Compat., vol. 43, pp. 671–676,
Nov. 2001.
[6] S. Radu, R. E. DuBroff, J. L. Drewniak, T. H. Hubing, and T. P. Van
Doren, “Designing power bus decoupling for CMOS devices,” in Proc.
IEEE Int. Symp. Electromagnetic Compatibility, vol. 1, Denver, CO,
Aug. 1998, pp. 375–380.
[7] M. Xu, T. H. Hubing, J. Drewniak, T. Van Doren, and R. E. DuBroff,
“Modeling printed circuit boards with embedded decoupling capacitance,” in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Montreal, QC, Canada, Aug. 13–17, 2001, pp. 515–520.
[8] I. Novak, “Reducing simultaneous switching noise and EMI on
ground/power planes by dissipative edge termination,” IEEE Trans.
Adv. Packag., vol. 22, pp. 274–283, Aug. 1999.
[9] T. M. Zeeff and T. H. Hubing, “Reducing power bus impedance at resonance with lossy components,” IEEE Trans. Adv. Packag., vol. 25, pp.
307–310, May 2002.
[10] T. Hubing, J. Chen, J. Drewniak, T. V. Doren, Y. Ren, J. Fan, and R. E.
DuBroff, “Power bus noise reduction using power islands in printed circuit board designs,” in Proc. Int. Symp. Electromagnetic Compatibility,
Seattle, WA, Aug. 1999, pp. 1–4.
[11] X. Ye, D. M. Hockanson, M. Li, Y. Ren, W. Cui, J. L. Drewniak, and R.
E. DuBroff, “EMI mitigation with multilayer power bus stacks and via
stitching of reference planes,” IEEE Trans. Electromagn. Compat., vol.
43, pp. 538–548, Nov. 2001.
[12] X. Wu, M. H. Kermani, and O. M. Ramahi, “Mitigating multi-layer
PCB power bus radiation through novel mesh fencing techniques,” in
Proc. Topical Meeting Electrical Performance Electronic Packaging,
Princeton, NJ, Oct. 2003, pp. 207–210.
[13] X. Ye, D. M. Hockanson, M. Li, W. Cui, S. Radu, J. L. Drewniak, T.
P. VanDoren, T. H. Hubing, and R. E. DuBroff, “The EMI benefits of
ground plane stitching in multi-layer power bus stacks,” in Proc. IEEE
Int. Symp. Electromagnetic Compatibility, vol. 2, Washington, DC, Aug.
2000, pp. 833–838.
[14] D. Sievenpiper, L. Zhang, R. F. J. Broas, N. G. Alexopolous, and E.
Yablonovitch, “High-impedance electromagnetic surfaces with a forbidden frequency band,” IEEE Trans. Microwave Theory Tech., vol. 47,
pp. 2059–2074, Nov. 1999.
[15] D. Sievenpiper and E. Yablonovitch, “Eliminating surface currents
with metallodielectric photonic crystals,” in Proc. IEEE Int. Microwave
Symp., vol. 2, Baltimore, MD, June 1998, pp. 663–666.
[16] H. Hsu, M. J. Hill, J. Papapolymerou, and R. W. Ziolkowski, “A
planar X-band electromagnetic band-gap (EBG) 3-pole filter,” IEEE
Microwave Wireless Components Lett., vol. 12, pp. 255–257, July
2002.
[17] F. Yang and Y. Rahmat-Samii, “Microstrip antennas integrated with electromagnetic band-gap (EBG) structures: A low mutual coupling design
for array applications,” IEEE Trans. Antennas Propagat., vol. 51, pp.
2936–2946, Oct. 2003.
[18] J. McVay, A. Hoorfar, and N. Engheta, “Radiation characteristics of microstrip dipole antennas over a high-impedance metamaterial surface
made of Hilbert inclusions,” in Proc. IEEE Int. Microwave Symp., vol.
1, Philadelphia, PA, June 2003, pp. 587–590.
SHAHPARNIA AND RAMAHI: EMI REDUCTION FROM PCB USING ELECTROMAGNETIC BANDGAP STRUCTURES
[19] T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high
impedance surface,” IEEE Microwave Wireless Components Lett., vol.
13, pp. 21–23, Jan. 2003.
[20] S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and
W. Temmerman, “Study of the ground bounce caused by power plane
resonances,” IEEE Trans. Electromagn. Compat., vol. 40, pp. 111–119,
May 1998.
[21] S. Chun, M. Swaminathan, L. D. Smith, J. Srinivasan, Z. Jin, and M. K.
Iyer, “Modeling of simultaneous switching noise in high speed systems,”
IEEE Trans. Adv. Packag., vol. 24, pp. 132–142, May 2001.
, “Physics based modeling of simultaneous switching noise in high
[22]
speed systems,” in Proc. 50th Electronic Components Technology Conf.,
Las Vegas, NV, May 2000, pp. 760–768.
[23] O. M. Ramahi, V. Subramanian, and B. Archambeault, “Simple and
efficient finite-difference frequency-domain algorithm for study and
analysis of power plane resonance and simultaneous switching noise in
printed circuit boards and chip packages,” IEEE Trans. Adv. Packag.,
vol. 26, pp. 191–198, May 2003.
[24] S. H. Hall, G. W. Hall, and J. A. McCall, High-Speed Digital System
Design: A Handbook of Interconnect Theory and Design Practices, 1st
ed. New York: Wiley, 2000.
[25] D. F. Sievenpiper, “High-impedance electromagnetic surfaces,” Ph.D.
dissertation, Dept. Elect. Eng., Univ. Calif., Los Angeles, Los Angeles,
CA, 1999.
[26] A. Aminian, F. Yang, and Y. Rahmat-Samii, “In-phase reflection and EM
wave suppression characteristics of electromagnetic band gap ground
planes,” in Proc. IEEE Antennas and Propagation Society Int. Symp.,
vol. 4, Columbus, OH, June 2003, pp. 430–433.
[27] R. Abhari and G. V. Eleftheriades, “Metallo-dielectric electromagnetic
bandgap structures for suppression and isolation of the parallel-plate
noise in high-speed circuits,” IEEE Trans. Microwave Theory Tech., vol.
51, pp. 1629–1639, June 2003.
[28] L. Brillouin, Wave Propagation in Periodic Structures, Electric Filters
and Crystal Lattices. New York: McGraw-Hill, 1946.
[29] T. Kamgaing, “High-impedance electromagnetic surfaces for mitigation
of simultaneous switching noise in high-speed circuits,” Ph.D. dissertation, Dept. Elect. Comput. Eng., Univ. Maryland, College Park, MD,
2003.
[30] C. F. Coombs, Coomb’s Printed Circuits Handbook, 5th ed. New York:
McGraw-Hill, 2001.
[31] S. Shahparnia and O. M. Ramahi, “Simultaneous switching noise mitigation in printed circuit boards using cascaded high-impedance surfaces,”
IEE Electron. Lett., vol. 40, pp. 98–99, Jan. 2004.
587
Shahrooz Shahparnia (S’00) received the B.Sc. and
M.Sc. degrees in electrical engineering from Sharif
University of Technology, Tehran, Iran, in 1995
and 1998, respectively, and is currently working
toward the Ph.D. degree in electrical and computer
engineering at the University of Maryland, College
Park.
From 1995 to 2000, he worked in industry as an
electrical engineer involved in the design and implementations of a wide variety of circuits and systems.
In 2000, he joined the University of Maryland and in
the summer of the same year he worked as an intern for the Information Sciences
Institute, University of Southern California, Arlington, VA. His current research
includes electromagnetic band-gap structures (EBG), microwave circuits, signal
integrity (SI), electromagnetic compatibility and interference (EMC/EMI) and
suppression of simultaneous switching noise (SSN).
Omar M. Ramahi (S’86–M’90–SM’97) received
the B.S. degree in mathematics and electrical and
computer engineering with highest honors from
Oregon State University, Corvallis, OR in 1984, and
the M.S. and Ph.D. degrees in electrical and computer engineering from the University of Illinois at
Urbana-Champaign in 1986 and 1990, respectively.
From 1990 to 1993, he held a visiting fellowship
position at the University of Illinois at Urbana-Champaign. From 1993 to 2000, he worked at Digital
Equipment Corporation (presently, Compaq Computer Corporation), where he was a member of the Alpha Server Product
Development Group. In August of 2000, he joined the faculty of the James
Clark School of Engineering at the University of Maryland at College Park,
where he is a faculty member of the Mechanical Engineering Department,
Electrical and Computer Engineering Department, and the CALCE Electronic
Products and Systems Center. He has served as a consultant to several companies and is a cofounder of EMS-PLUS, LLC and Applied Electromagnetic
Technology, LLC. He has been instrumental in developing computational
techniques to solve a wide range of electromagnetic radiation problems in
the fields of antennas, high-speed devices, and circuits and electromagnetic
compatibility and interference (EMC/EMI). His research interests include
experimental and computational EMI/EMC studies, high-speed devices and
interconnects, biomedical applications of electromagnetics, novel optimization
techniques, and interdisciplinary studies linking electromagnetic application
with new materials. He has authored or co-authored over 140 journal and
conference papers and presentations. He is a coauthor of the book EMI/EMC
Computational Modeling Handbook (Norwell, MA: Kluwer, 1998).
Dr. Ramahi is a member of the Electromagnetics Academy.