SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Q2L Series - 3.3x3.3 QFN Pb e3 RoHS Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients. The series provides a low profile, chip scale surface mount solution that enables broadband equipment to comply with global regulatory standards while limiting the impact to broadband signals and board space. Features and Benefits • • • • • • Agency Approvals Agency Agency File Number E133083 Pinout Designation •F ails short circuit when surged in excess of ratings •2 nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 Low profile Small footprint Low capacitance Low voltage overshoot Low on-state voltage Does not degrade surge capability after multiple surge events within limit. Applicable Global Standards Not Applicable Schematic Symbol • TIA-968-A • GR 1089 Intra-building • TIA-968-B • IEC 61000-4-5 • ITU K.20/21 Enhanced Level • YD/T 1082 • ITU K.20/21 Basic Level • YD/T 950 • YD/T 993 • GR 1089 Inter-building Electrical Characteristics Part Number P0080Q22CLRP P0300Q22CLRP P0640Q22CLRP P0720Q22CLRP P0900Q22CLRP P1100Q22CLRP P1300Q22CLRP P1500Q22CLRP P1800Q22CLRP P2300Q22CLRP P2600Q22CLRP P3100Q22CLRP P3500Q22CLRP P4500Q22CLRP Marking P-8C P03C P06C P07C P09C P11C P13C P15C P18C P23C P26C P31C P35C P45C VDRM VS @lDRM=5µA @100V/µs V min V max 6 25 58 65 75 90 120 140 170 190 220 275 320 400 25 40 77 88 98 130 160 180 220 260 300 350 400 530 IH IS mA min mA max 50 50 150 150 150 150 150 150 150 150 150 150 150 150 800 800 800 800 800 800 800 800 800 800 800 800 800 800 Capacitance @1MHz, 2V bias IT VT@IT = 2.2 Amps A max V max pF min pF max 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 5 5 5 5 5 5 5 5 5 5 5 5 5 5 35 25 55 50 45 45 40 35 35 30 30 30 25 25 75 45 85 75 70 70 60 55 50 50 45 45 40 45 Notes: - Absolute maximum ratings measured at TA= 25ºC (unless otherwise noted). - Devices are bi-directional (unless otherwise noted). © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/11/14 Q2L Series - 3.3x3.3 QFN SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Series Surge Ratings C ITSM 50/60 Hz di/dt A min A min A/µs max 200 3 30 500 2x10 1 2x10 2 8x20 1 1.2x50 2 10x160 1 10x160 2 10x560 1 10x560 2 10x1000 1 10x1000 2 5x310 1 10x700 2 A min A min A min A min A min 500 400 200 150 100 - Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product. - IPP ratings applicable over temperature range of -40ºC to +85ºC - The device must initially be in thermal equilibrium with -40°C < TJ < +150°C Notes: 1 Current waveform in µs 2 Voltage waveform in µs 3 for surge rating of P4500Q22CLRP 10x700µs min=150A & typical=180A Thermal Considerations Package Symbol Parameter Value Unit 3.3 x 3.3 QFN TJ Operating Junction Temperature Range -40 to +150 °C TS Storage Temperature Range -65 to +150 °C R0JA Thermal Resistance: Junction to Ambient 120 °C/W V-I Characteristics tr x td Pulse Waveform IPP – Peak Pulse Current – %IPP +I IT IS IH IDRM -V +V VT VDRM VS tr = rise time to peak value td = decay time to half value Peak Value 100 Waveform = tr x td 50 Half Value 0 td tr 0 t – Time (µs) -I Normalized DC Holding Current vs. Case Temperature 10 IH 8 6 25 °C 4 IH (TC = 25ºC) 2.0 14 12 Ratio of Percent of VS Change – % Normalized VS Change vs. Junction Temperature 2 0 -4 -6 1.8 1.6 1.4 1.0 0.8 0.6 0.4 -8 -40 -20 0 -40 20 40 60 80 100 120 140 160 -20 0 20 40 60 80 100 120 140 160 Case Temperature (TC) - ºC Junction Temperature (TJ) – °C © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 25°C 1.2 2 Q2L Series - 3.3x3.3 QFN SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Soldering Parameters Pb-Free assembly (see Fig. 1) +150°C +200°C 60-180 secs. - Temperature Min (Ts(min)) - Temperature Max (Ts(max)) Pre Heat - Time (Min to Max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak) 3°C/sec. Max. TS(max) to TL - Ramp-up Rate 3°C/sec. Max. Reflow - Temperature (TL) (Liquidus) +217°C - Temperature (tL) 60-150 secs. Peak Temp (TP) +260(+0/-5)°C Time within 5°C of actual Peak Temp (tp) 30 secs. Max. Ramp-down Rate 6°C/sec. Max. Time 25°C to Peak Temp (TP) 8 min. Max. Do not exceed +260°C Figure 1 TL TS(max) tL Ramp-down Preheat TS(min) tS 25 time to peak temperature (t 25ºC to peak) 100% Matte-Tin Plated Body Material UL recognized epoxy meeting flammability classification 94V-0 Time Environmental Specifications High Temp Voltage Blocking 80% Rated VDRM (VAC Peak ) +125°C or +150°C, 504 or 1008 hrs. MIL-STD-750 (Method 1040) JEDEC, JESD22-A-101 Temp Cycling -65°C to +150°C, 15 min. dwell, 10 up to 100 cycles. MIL-STD-750 (Method 1051) EIA/JEDEC, JESD22-A104 Biased Temp & Humidity 52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/ JEDEC, JESD22-A-101 High Temp Storage +150°C 1008 hrs. MIL-STD-750 (Method 1031) JEDEC, JESD22-A-101 Low Temp Storage -65°C, 1008 hrs. Thermal Shock 0°C to +100°C, 5 min. dwell, 10 sec. transfer, 10 cycles. MIL-STD-750 (Method 1056) JEDEC, JESD22-A-106 Resistance to Solder Heat +260°C, 30 secs. MIL-STD-750 (Method 2031) Moisture Sensitivity Level 85%RH, +85°C, 168 hrs., 3 reflow cycles (+260°C Peak). JEDEC-J-STD-020, Level 1 Copper Alloy Terminal Finish Critical Zone TL to TP Ramp-up Physical Specifications Lead Material tP TP Temperature Reflow Condition Can be A or B Dimensions — 3.3x3.3 QFN BOTTOM VIEW TOP VIEW Dimensions C A E J B END VIEW A B C E F H J K1 K2 M1 M2 N1 N2 F H 1.50 (.059”) SIDE VIEW 2.54 (.100”) 1.27 (.050”) N2 N1 M1 K1 M2 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 K2 Recommended Soldering Pad Outline (Reference Only) 3 Inches Millimeters Min Max Min Max 0.126 0.126 0.075 0.011 0.088 0.035 0.000 0.004 0.004 0.063 0.045 0.095 0.082 0.134 0.134 0.083 0.019 0.096 0.043 0.008 0.012 0.012 0.071 0.053 0.103 0.090 3.200 3.200 1.900 0.285 2.230 0.900 0.000 0.100 0.100 1.610 1.153 2.420 2.080 3.400 3.400 2.100 0.485 2.430 1.100 0.200 0.300 0.300 1.810 1.353 2.620 2.280 Q2L Series - 3.3x3.3 QFN SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Part Numbering Part Marking P xxx 0 Q22 C L RP Terminals on Back TYPE P=SIDACtor REEL PACK MEDIAN VOLTAGE RoHS COMPLIANT CONSTRUCTION VARIABLE IPP RATING XXXX XXXXX Part Marking Code (Refer to Electrical Characteristics Table) Date code PACKAGE TYPE Packing Options Package Type Description Quantity Added Suffix Industry Standard Q22 3.3x3.3 QFN Tape and Reel Pack 5000 RP EIA-481-D Tape and Reel Specifications — 3.3x3.3 QFN Reel Dimension C A D N W1 B Tape Leader and Trailer Dimensions END CARRIER TAPE START COVER TAPE Symbols Description A B C D N W1 A0 B0 D0 D1 E1 E2 Reel Diameter Drive Spoke Width Arbor Hole Diameter Drive Spoke Diameter Hub Diameter Reel Inner Width at Hub Pocket Width at Bottom Pocket Length at Bottom Feed Hole Diameter Pocket Hole Diameter Feed Hole Position 1 Feed Hole Position 2 Feed Hole Center Pocket Hole Center 2 Pocket Depth Feed Hole Pitch Component Spacing Feed Hole Center Pocket Hole Center 1 Carrier Tape Thickness Embossed Carrier Tape Width Cover Tape Width F TRAILER 160mm MIN LEADER 400mm MIN K0 P0 P1 Tape Dimension Items D0 P0 P2 T CARRIER TAPE D1 T W B0 F E2 W W0 K0 P2 E1 P1 W0 Inches Millimeters Min Max Min N/A 12.992 N/A 0.059 N/A 1.50 0.504 0.531 12.80 0.795 N/A 20.20 1.969 N/A 50.00 0.488 0.567 12.40 0.138 0.146 3.50 0.138 0.146 3.50 0.059 0.063 1.50 0.059 N/A 1.50 0.065 0.073 1.65 0.400 0.408 10.15 Max 330.0 N/A 13.50 N/A N/A 14.40 3.70 3.70 1.60 N/A 1.85 10.35 0.215 0.219 5.45 5.55 0.039 0.153 0.311 0.051 0.161 0.319 1.00 3.90 7.90 1.30 4.10 8.10 0.077 0.081 1.90 2.05 0.010 0.014 0.25 0.35 0.453 0.484 11.50 12.30 0.358 0.366 9.10 9.30 A0 COVER TAPE © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 4 Q2L Series - 3.3x3.3 QFN