5.0mm x 6.0mm SURFACE MOUNT LED LAMP Package

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5.0mm x 6.0mm SURFACE MOUNT LED LAMP
AT T E N T I O N
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
lCHIPS CAN BE CONTROLLED SEPARATELY.
l SUITABLE
PROCESS.
FOR ALL SMT ASSEMBLY AND SOLDER
l AVAILABLE
KAAF-5060PBESEEVGC
BLUE / HYPER ORANGE /GREEN
Description
The Blue source color devices are made with InGaN on
SiC Light Emitting Diode.
The Hyper Orange source color devices are made with
ON TAPE AND REEL.
DH InGaAlP on GaAs substrate Light Emitting Diode.
l PACKAGE: 500PCS / REEL.
The Green source color devices are made with InGaN
on SiC Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
PAGE: 1 OF 6
Selection Guide
Dic e
P ar t N o .
KAAF-5060PBESEEVGC
Iv (m c d )
@ 30m A *50m A
L en s Ty p e
BLUE (InGaN)
HYPER ORANGE(InGaAIP)
GREEN (InGaN)
Mi n .
Ty p .
*650
*1000
Un its
Tes t C o n d i t i o n s
nm
I F =20mA
nm
I F =20mA
nm
I F =20mA
pF
VF=0V;f=1MHz
V
I F =20mA
uA
V R = 5V
110
WATER C LEAR
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2. * Luminous intensity with asterisk is measured at 50mA.
V i ew i n g
An g le
180
250
350
2θ1/2
100°
Electrical / Optical Characteristics at TA=25°°C
Sy m b o l
P ar am et er
D ev i c e
λpeak
Peak Wavelength
λD
D omi nate Wavelength
∆λ1/2
Spectral Li ne Half-wi dth
C
C apaci tance
VF
Forward Voltage
IR
Reverse C urrent
Blue
Hyper Orange
Green
Blue
Hyper Orange
Green
Blue
Hyper Orange
Green
Blue
Hyper Orange
Green
Blue
Hyper Orange
Green
All
Ty p .
Max .
465
630
520
470
621
525
25
20
38
110
25
45
3.7
2.0
4.0
4.3
2.5
4.5
10
Absolute Maximum Ratings at TA=25°°C
P ar am et er
Total Power di ssi pati on t [1]
D C Forward C urrent
Peak Forward C urrent [2]
Reverse Voltage
Operati ng/Storage Temperature
B lu e
30
160
5
Notes:
1.Within 350mW at all chips are lightened.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
H y p er Or an g e
350
50
30
195
5
Gr een
150
-40°C To +85°C
5
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
Un its
mW
mA
mA
V
PAGE: 2 OF 6
KAAF-5060PBESEEVGC
Blue
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
PAGE: 3 OF 6
Hyper Orange
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
PAGE: 4 OF 6
Green
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
PAGE: 5 OF 6
KAAF-5060PBESEEVGC
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAB9241
APPROVED : J. Lu
REV NO: V.6
CHECKED : Allen Liu
DATE: MAY/11/2003
DRAWN: F.Y.YUAN
PAGE: 6 OF 6
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