ZOFLEX® ZL60.1 Pressure-Activated Conductive Rubber ZOFLEX® ZL60.1 is a pressure sensitive conductive rubber with a shore A hardness of 60. Its resistance change with pressure is very drastic: the material is at high resistance state>30MΩ when pressure is below the actuation pressure; the material is at very low resistance state (can be as low as 0.5Ω or less) when pressure is equal or above the actuation pressure. It has many applications such as conductive rubber keypads, mechanical pressure switches and RF gaskets (used in RFI/EMI shields) etc… Its unique pressure activated conductivity simplifies product design since it can rest on the conductive media without creating electrical shorts. Compared to typical carbon pills (0.15” diameter, 0.015” thick), it has similar actuation force (<200g) but has lower contact resistance (200Ω typical for carbon pills), and does not create potential shorts due to carbon residue accumulation on PCB traces or any conductive material. It can be used in harsh environment such as outdoor, marine, heat and humidity etc… Data 0-15V >30MΩ 0.5Ω 0.2W/cm2 60 -40°C to 220°C 40% 4kg/cm2 or 57 psi 1.6g/cm3 Conditions DC or AC 25°C 25°C 1cm2, 1mm thick 25°C -25°C 25°C 25°C 200 60 160 50 Resistance (ohm) Resistance (ohm) Chracteristic Operating Voltage Range Resistance Without Pressure Min. Resistance Under Pressure Max. Continuous Power Dissipation Shore A Hardness Thermal Operating Range % Elongation Max. Pressure Density 120 80 40 0 30 20 10 0 0 1 2 3 4 Pressure (kg/cm2) Sample thickness: 1mm Fig.1: Resistance change with pressure during a press stroke Preliminary 40 www.zoflex.com 0 20 40 60 80 100 Time (min) Sample thickness: 1mm Pressure: 1.8kg/cm2 or 25.5psi Fig.2: Resistance change over time under constant pressure 2003 Xilor Inc. All Rights Reserved. The information contained above is considered accurate. However, no warranty is expressed or implied regarding the accuracy of the data, the results to be obtained from the use thereof, or that any such use will not infringe upon a patent. User shall determine the suitability of the product for the intended application and assume all risk and liability whatsoever in connection therewith. ZOFLEX® ZL60.1 Pressure-Activated Conductive Rubber Application notes: 1. Attaching ZL60.1 to a metal plate: Method A : RTV silicone adhesive/sealant can be used to bond ZL60.1 to a metal plate. Please make sure that silicone adhesive does not cover the contact area between the metal plate and ZL45.1. 1.Make sure the surfaces are clean. 2.Apply a thin bead of silicone 3.Cure at 25°C for ~1-2 hrs 4.Cure at 45°C for ~4-5 hrs Metal Plate ZL60.1 Silicone Adhesive Method B: Our FL series of Liquid Conductive Rubber can be used to bond ZL60.1 to a metal plate. It can be applied in the same fashion as silicone adhesive/sealant or it can cover the entire contact area if desired. Method C: Double-sided tape can be used to make a frame on the metal plate and then place ZL45.1 inside the frame. 2. Attaching ZL60.1 to an interdigital “finger” pad on PCB: Method A: RTV silicone adhesive/sealant can be used to bond ZL60.1 to a PCB. Please make sure that silicone adhesive does not cover the contact area between the interdigital finger pad and ZL60.1. ZL60.1 Interdigital finger pad PCB Silicone Adhesive Method B: Double-sided tape can be used to make a frame on PCB and then place ZL60.1 inside the frame. 3. Wire attachment: Wires can be attached to the metal plates or interdigital “finger” pads after ZL60.1 is attached. Note: For surface areas larger than 1in 2 , to prevent rubber from forming a vacuum with the metal plate or PCB, some relief holes should be punched in the rubber, for example: Solid Sheet Preliminary www.zoflex.com Sheet w/ Relief Holes 2003 Xilor Inc. All Rights Reserved. The information contained above is considered accurate. However, no warranty is expressed or implied regarding the accuracy of the data, the results to be obtained from the use thereof, or that any such use will not infringe upon a patent. User shall determine the suitability of the product for the intended application and assume all risk and liability whatsoever in connection therewith.