ZOFLEX® ZL60.1 Pressure-Activated Conductive Rubber

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ZOFLEX® ZL60.1 Pressure-Activated Conductive Rubber
ZOFLEX® ZL60.1 is a pressure sensitive conductive rubber with a shore A hardness of 60. Its resistance
change with pressure is very drastic: the material is at high resistance state>30MΩ when pressure is below the
actuation pressure; the material is at very low resistance state (can be as low as 0.5Ω or less) when pressure is
equal or above the actuation pressure. It has many applications such as conductive rubber keypads,
mechanical pressure switches and RF gaskets (used in RFI/EMI shields) etc… Its unique pressure activated
conductivity simplifies product design since it can rest on the conductive media without creating electrical
shorts. Compared to typical carbon pills (0.15” diameter, 0.015” thick), it has similar actuation force (<200g)
but has lower contact resistance (200Ω typical for carbon pills), and does not create potential shorts due to
carbon residue accumulation on PCB traces or any conductive material. It can be used in harsh environment
such as outdoor, marine, heat and humidity etc…
Data
0-15V
>30MΩ
0.5Ω
0.2W/cm2
60
-40°C to 220°C
40%
4kg/cm2 or 57 psi
1.6g/cm3
Conditions
DC or AC
25°C
25°C
1cm2, 1mm thick
25°C
-25°C
25°C
25°C
200
60
160
50
Resistance (ohm)
Resistance (ohm)
Chracteristic
Operating Voltage Range
Resistance Without Pressure
Min. Resistance Under Pressure
Max. Continuous Power Dissipation
Shore A Hardness
Thermal Operating Range
% Elongation
Max. Pressure
Density
120
80
40
0
30
20
10
0
0
1
2
3
4
Pressure (kg/cm2)
Sample thickness: 1mm
Fig.1: Resistance change with pressure
during a press stroke
Preliminary
40
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0
20
40
60
80
100
Time (min)
Sample thickness: 1mm
Pressure: 1.8kg/cm2 or 25.5psi
Fig.2: Resistance change over time
under constant pressure
2003 Xilor Inc. All Rights Reserved.
The information contained above is considered accurate. However, no warranty is expressed or implied regarding the accuracy of the data, the results to be obtained from the use thereof, or that
any such use will not infringe upon a patent. User shall determine the suitability of the product for the intended application and assume all risk and liability whatsoever in connection therewith.
ZOFLEX® ZL60.1 Pressure-Activated Conductive Rubber
Application notes:
1. Attaching ZL60.1 to a metal plate:
Method A : RTV silicone adhesive/sealant can be used to bond ZL60.1 to a metal plate. Please make sure
that silicone adhesive does not cover the contact area between the metal plate and ZL45.1.
1.Make sure the surfaces are clean.
2.Apply a thin bead of silicone
3.Cure at 25°C for ~1-2 hrs
4.Cure at 45°C for ~4-5 hrs
Metal Plate
ZL60.1
Silicone Adhesive
Method B: Our FL series of Liquid Conductive Rubber can be used to bond ZL60.1 to a metal plate. It
can be applied in the same fashion as silicone adhesive/sealant or it can cover the entire contact area if
desired.
Method C: Double-sided tape can be used to make a frame on the metal plate and then place ZL45.1
inside the frame.
2. Attaching ZL60.1 to an interdigital “finger” pad on PCB:
Method A: RTV silicone adhesive/sealant can be used to bond ZL60.1 to a PCB. Please make sure that
silicone adhesive does not cover the contact area between the interdigital finger pad and ZL60.1.
ZL60.1
Interdigital
finger pad
PCB
Silicone Adhesive
Method B: Double-sided tape can be used to make a frame on PCB and then place ZL60.1 inside the frame.
3. Wire attachment: Wires can be attached to the metal plates or interdigital “finger” pads after ZL60.1 is attached.
Note: For surface areas larger than 1in 2 , to prevent rubber from forming a vacuum with the metal plate
or PCB, some relief holes should be punched in the rubber, for example:
Solid Sheet
Preliminary
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Sheet w/ Relief Holes
2003 Xilor Inc. All Rights Reserved.
The information contained above is considered accurate. However, no warranty is expressed or implied regarding the accuracy of the data, the results to be obtained from the use thereof, or that
any such use will not infringe upon a patent. User shall determine the suitability of the product for the intended application and assume all risk and liability whatsoever in connection therewith.
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