Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
SurgX...
new Technology,
new
ESD
Protection.
®
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.
Dear Web Browser:
The following information describes the new line of Bussmann SurgX® ESD
suppressors. This innovative approach to ESD suppression offers the circuit
designer the advantages of low capacitance, low leakage current, high peak
current capability and fast response, at a very competitive price. The “zero
footprint” connector arrays also help you conserve valuable circuit board real
estate.
The Bussmann SurgX® manufacturing process is extremely flexible and
lends itself to custom configurations. If you require a special configuration
for a particular connector, application assistance, or samples for evaluation,
please feel free to contact one of the following individuals.
Ed Carter (314) 527-1613
Ernst Steinert
(314) 527-1368
Steve Whitney
(314) 527-1663
Application Engineering
(314) 527-1270
Thank you for your interest in these exciting new products. We look forward
to providing you with high performance, cost effective products to assist you
in meeting the requirements of IEC 1000-4.
Sincerely,
Steve Whitney
Manager, Product and Market Development
Board Level Technology Products
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
®
SurgX ... new Technology, new ESD
Today, more than ever, electron-
combine a new polymer technol-
ic design engineers are looking
ogy with our expertise in metal
for solid, reliable protection
film on ceramic deposition. The
against electrostatic discharge
result—SurgX—provides
Easily configured into custom
packages.
■
“Zero Footprint” connector
arrays.
■
Extremely fast response time.
■
Bi-directional.
the
(ESD).
designer these outstanding bene-
As the
fits in ESD protection:
micro-
■
electronic
■
Protection against high ESD
voltages and currents.
SurgX is ideal for high speed signal circuit applications where
industry
■
Extremely low capacitance.
ESD spikes can reach 45A @
moves
■
Very low leakage current.
15kV. It provides the designer
toward
■
Zero signal distortion.
with performance characteristics
that exceed the values in IEC
l o w e r
1000-4-2, the key international
operating voltages, steadily
standard
increasing circuit speeds,
f o r
and higher IC densi-
E S D
t ie s , t h e re i s
immunity.
a definite
requirement
Bussmann,
for
the world leader
ESD protection that is equally
in circuit protection
fast, small and reliable.
SurgX
products,
devices, is proud to offer SurgX
by
to design engineers as the
Bussmann, are tran-
most cost-effective, advanced
sient voltage sup-
technology in board-level ESD
pressors (TVS)
protection.
that
“
2
SurgX is ideal for
high speed signal
circuit applications
”
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Protection from Bussmann
ESD and IEC
1000-4-2 Test Conditions
IEC 1000-4-2 is widely recog-
Testing
Requirements
nized as the “yard stick” for eval-
All electronic equipment des-
uating ESD immunity. SurgX
Level
Contact
Discharge*
Mode Test
Voltage kV
Air
Discharge
Mode Test
Voltage kV
tined for Europe must be able to
1
2
2
surpasses the stringent require-
withstand ten (10) strikes of a
2
4
4
ments of this international stan-
simulated ESD waveform with tr
3
6
8
dard, in addition to meeting the
<1ns in contact discharge mode
4
8
15
requirements of MIL-STD-883C,
(preferred) at pre-selected points
and
S5.1
accessible during normal main-
(Human Body Model) and S5.2
tenance or usage. Testing must
(Machine Model).
be performed at one or more of
IEC 1000-4
four (4) severity levels, depend-
IEC 1000-4 is a series of specifi-
ing on the appropriate equip-
cations, written and mandated
ment category.
by
Waveform Parameters
ESD
the
Association
International
Electrotechnical
Commission
*Preferred mode of testing due to its
repeatability.
Level
Test Voltage
Level kV
First Peak of
Discharge
Current
Amps +-10%
tr
(ns)
30 ns
Current
Amps +- 30%
60 ns
Current
Amps +-30%
for electronic equipment. IEC
1
2
7.5
0.7 - 1
4
2
1000-4-2 is the specific standard
2
4
15
0.7 - 1
8
4
relating to ESD. The IEC 1000-4
3
6
22.5
0.7 - 1
12
6
standards were deemed neces-
4
8
30
0.7 - 1
16
8
(IEC), which defines electromagnetic compatibility requirements
sary by the regulatory agencies
within the European Union.
These EU standards are expected
In establishing IEC 1000-4, the
International Electrotechnical
recognized
pleted, the equipment must not
experience
to be adopted worldwide.
Commission
When the test has been com-
the
growing presence of electromagnetic interference (EMI) in a
world of systems and semicon-
any
permanent
damage or upset (data or processing errors). The waveforms are to be injected at or
along the equipment body
which is accessible in normal
set-up and operation.
ductors that are more susceptible to the damaging effect of
transient currents and voltages.
3
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
The Unique Benefits of SurgX
®
Response Time <1 nanosecond
Few factors are as important as the time SurgX takes to respond to the overvoltage of ESD; that is, the
time it takes SurgX to switch from an insulating state to a conductive state. Less than one nanosecond!
(Fig. 1) Because of this incredible response time, SurgX limits the voltage more effectively than gas
tubes, MOVs and most diodes. This means SurgX minimizes
Fig. 1 Generalized V-I Waveforms
Prospective Voltage
Trigger Voltage
the time that sensitive ICs are subjected to ESD overvoltage;
almost instantly, it limits voltage to the clamping level.
With SurgX, instrument circuits and sensitive components
Voltage
Across
TVS
are protected faster and with less overvoltage exposure.
Clamp Voltage
Clamp Voltage <60V
This is the voltage across the device after it has trigCurrent Through TVS
Peak Current
gered (Fig 1). The lower the clamping voltage—the closer it
is to normal operating voltage—the better. SurgX clamping
voltage can be selected as low as 60V. This value is ideal for
equipment operating at low voltages. It means less stress
during the clamp period, and greater IC protection.
Initiation
of ESD
Event
TVS
Triggers
Bi-Directional
SurgX responds to ESD pulses of either polarity in a circuit. This eliminates the need for back-to-back
protection required with uni-directional devices. (Fig. 2) This saves board space and the added cost
of a second uni-directional diode.
Fig. 2 Bi-Directional vs Uni-Directional
Bi-Directional
4
Uni-Directional
“
Few factors are as
important as the time
SurgX takes to respond
to the overvoltage
”
In normal operating conditions, SurgX is virtually invisible to the cir-
Fig. 3 Effects of Capacitance
cuit. (Fig. 3) Installed from signal line to ground, SurgX exhibits a
6
high impedance and low capacitance (<1pF @ 1 MHz) that makes it
5
transparent to high speed digital circuits. Signals are not distorted or
4
disrupted. With SurgX, waveform definition stays true, and high
speed input signals do not suffer.
VOLTS
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Zero Signal Distortion
SurgX
Baseline
3
10V Diode
2
Varistor
1
0
“Zero Footprint”
0
1
2
3
4
5 6
TIME (ns)
7
8
9
10
The most attractive application of SurgX is on multiple line connectors carrying signals to and from a piece of equipment. Arrays
installed between the connector and the circuit board—ahead of all
ICs—SurgX frees-up valuable board space normally earmarked for
discrete protective devices. SurgX makes more “real estate” available
to board designers, allowing them to reduce board size or add more
circuits and functions.
High Peak Current Capability
Recent research indicates that ESD overvoltage exceeds previously established values for both human body and machine
models. ESD overvoltage can range from <1kV to 15kV. Some
suppressors for ESD handle overvoltages up to 12kV. SurgX is
rated 15kV at 45A.
5
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
®
What is SurgX and How Does It Work?
SurgX is
conformally coated
with polyurethane.
The completed array
is ready for solder
attachment to an
RJ-11 connector.
•
•
•
•
•
•
Ground Pad
A metalization
is applied to
reconnect the
ground
electrode to the
ground pad.
•
•
Connector pin
holes are
punched in
“green” ceramic
tape which is
then fired.
•
•
SurgX products are designed
around a new technology in voltage-variable polymers. The unique
properties of this new class of
polymers are particularly applicable to ESD protection.
In a connector array application
(Fig. 4) SurgX is placed across a
signal line leading to an integrated
SurgX voltagecircuit and ground. The device
variable polymer
is deposited in
exhibits minimal capacitance
the micro-grooves.
(<lpF) and is invisible to the circuit
End view: Cross section during normal
SurgX Signal Line operation.
Signal Line
Electrode
Electrode
E a c h
Signal Line
Electrode
signal pin
(1 of 5)
electrode
Ground
Ground Electrode
contacts
Electrode
the
SurgX
Substrate
Micro-grooves
material which
are formed,
forms
a
path
to
the
ground pin.
separating the
signal line
Under normal operating voltages
and ground
(typically 3 to 15V), the high
electrodes.
impedance of SurgX insulates
each signal pin from ground.
However, when an ESD event
occurs, the unique polymer material rapidly switches (<l nanosecCoplanar electrode
metalization is
ond) to a conductive state when
deposited on the
the trigger voltage is reached. The
top side of the
voltage across the signal line colsubstrate.
lapses to the clamping level, and
Ag/Pd solder pads
current is shunted through SurgX
are deposited on
to ground. When the overvoltage
the bottom side of
the substrate and
event ends, the circuit returns to
the metalization is
its normal operating state as
“pulled through”
SurgX switches to high resistance
the hole to provide
a conductive via to
and “invisibility.”
the top side.
Fig. 4
Signal
Line In
SurgX ESD suppressors by Bussmann utilize proven metal film on ceramic
deposition techniques and an advanced voltage-variable polymer technology.
The coplanar electrode design results in a low capacitance, high performance
solution to ESD protection.
Supply Voltage
Normal
Current
Signal
Line Out
Normal
Current
IC
Chip
ESD
TVS
ESD
TVS
Current flow under surge
conditions
6
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Specifications and Performance
Performance Comparison
SurgX is a circuit protection
device, exclusively designed for
the fast, transient overvoltages
associated with ESD*. Its function
is similar to that of a gas discharge
tube. These devices display one
basic characteristic: when a sufficient overvoltage occurs they
exhibit a dramatic increase in
their ability to conduct electrons.
The difference is performance.
SurgX, as shown in Table I, simply
out-performs other ESD protective devices. In addition to its outstanding performance, it should
be noted that SurgX, can be configured as “zero footprint” arrays,
thus freeing-up valuable circuit
board “real estate.”
Table I Performance Comparison
Substrate: Ceramic
■ Electrodes: Silver-palladium
■ End termination finish: Nickel
barrier (3.88 -4.3µm), followed
by 90/10 tin - lead (5.1 - 10.2µm),
surface mount packages only
■ ESD barrier: SurgX polymeric
material
■ Encapsulant: polyurethane
Environmental Specifications
Dry heat: 96 hours @ 85oC
■ Humidity: 96 hours @ 85% RH,
60oC
■ Thermal shock: -55oC to 85oC,
1 hour cycle, 10 cycles
■ Vibration: MIL-STD202, Method
204, Test Condition C, (55 to
2000 Hz, 10Gs)
■ Solderability: withstands 60 seconds above 200oC; 260oC maximum
■ Solder leach resistance and terminal adhesion per EIA-576
■
Custom
Arrays
Response Time
(10-9 seconds)
Gas Tube
500-5000
50-250
1-4
10-12
NO
Diode
<1
10-600
50-1000
10-4
NO
MOV
1-30
6-200
400-1000
10-6
NO
SurgX
<1
40-120
<1
10-10
YES
(Signal Line to Common)
TYPE A
General Purpose
TYPE B
Telecom
Continuous
Operating Voltage
24VDC
60VDC
40V typical
60V max.
150V typical
300V max.
80V typical
120V max.
300V typical
450V max.
1pF max.
1pF max.
100pA typical
100pA typical
Peak Current2,3
45A
maximum
45A
maximum
ESD Withstand2
500 pulses
minimum
500 pulses
minimum
Electrical Characteristics
Clamping Voltage2,3
Mechanical Specifications
■
Leakage
Clamping
Capacitance
Voltage (V) (pF) @1 MHz. Current (A)
Device
Trigger Voltage2
Capacitance4
Leakage Current5
1. Voltages are peak to peak, unless noted otherwise. 4. Measured @ 1MHz.
2. Per IEC 1000-4-2, 15kV @ 45A, direct discharge. 5. Measured at rated continuous operat3. Measurement made 30ns after initiation of pulse.
ing voltage.
*SurgX is not intended for protection
against lightning transients, or continuous overvoltages, nor is it intended for
“production floor” ESD problems.
7
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Standard Outlines
Standard Surface Mount Outlines
Dimensions: mm (inches)
Outline Designation: SOT23
Outline Designation: 3216
3
2.80
(.110)
1.30 ±.10
(.051 ±.004)
3.20 ±.20
(.126 ±.008)
Equivalent
Circuit
1
1.90 ±.10
(.075 ±.004)
2
0.56
(.022)
3
1.60
(.063)
4.30 ±.10
(.169 ±.004)
.51 ±.25
(.020 ±.010)
1.49
(.059)
0.55
(.022)
2.20
(.087)
Recommended
Land Pattern
0.55
(.022)
1.60 ±.20
(.063 ±.008)
1
0.30
(.012)
2
0.56
(.022)
1.90
(.075)
2.98
(.117)
1.09 ± .25
.10 )
(.043 ±.010
.004 )
2.20
(.087)
1.40
(.055)
1.09 ± .25
.10 )
(.043 ±.010
.004)
0.90 ±.10
(.035 ±.004)
0.95
(.037)
Recommended
Land Pattern
Outline Designation: 8X
Outline Designation: 3X
4.00
(.157)
9
7
6
7.00
(.276)
3.50
(.138)
3.10
(.122) 4
.38
(.015)
1
2
0.40
(.016)
1
2
2.30
(.091)
3
2.10
(.083)
5 (0.50
.020)
10
4.50
(.177)
.40
(.016)
8
3
0.80
(.031)
4
0.30
(.012)
4
.80
(.031)
Equivalent
Circuit
4.60
(.181)
1
2
.25
1.09± .10
.010
(.043± .004
)
3
1.09 ±.25
.10
(.043 ±.010
.004 )
0.40
(.016)
3.10
(.122)
1.50
(.059)
1.10
(.043)
3.50
(.138)
2.20
(.087)
0.40
(.016)
1.10
(.043)
0.51
(.020)
4.50 6.70
(.177) (.264)
2.20
(.087)
1.10
(.043)
.80
(.031)
0.36
(.014)
3.86
(.152)
2.30
(.091)
Recommended
Land Pattern
0.80
(.031)
4.60
(.181)
Equivalent
Circuit
9
For the most recent
product data, call
Bussmann Information Fax:
314.527.1450
and request Document #3602.
8
0.56
(.022)
0.58
(.023)
1.91
(.075)
0.56
(.022)
0.35
(.014)
7
6
10
5
1
0.45
(.018)
8
2
3
4
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Standard Connector Array Outlines
Dimensions: mm (inches)
19
18
17
16
15
Outline Designation: DSUB37
0.89
(.035)
DIA.HOLE
TYPICAL 37
Outline Designation: DSUB9
GROUND
ELECTRODE
CONNECTION
54.91
(2.162)
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0.89
(.035)
DIA.HOLE
TYPICAL 9
5
8.36
(.329)
37
36
35
34
33
32
31
30
29
28
27 26
25
24
23
22
21
GROUND
ELECTRODE
CONNECTION
13.61
(.536)
4
3
2
1
5.38
(.212)
20
1.09 ± .25
.10 )
(.043 ±.010
.004)
1.78
(.070)
TYPICAL 37
1.38
(.0545)
9
8
7
2.84
(.112)
1.09 ± .25
.10 )
(.043 ±.010
.004 )
6
2.74
(.108)
1.78 DIA.
(.070) TYPICAL 9
1.32
(.052)
2.54
(.100)
2.84
(.112)
2.77
(.109)
2.77
(.109)
1
2
1.37
(.054)
19
1.27
(.050)
Equivalent
Circuit
20
21
1
2
3
Equivalent
Circuit
Outline Designation: DSUB25
GROUND
ELECTRODE
CONNECTION
DIA.HOLE
TYPICAL 25
12
11
10
9
8
7
6
5
4
3
24
23
22
21
20
19
18
17
16
2
15
8
8.43
(.332)
0.89
(.035)
DIA.HOLE
TYPICAL 6
3
9
GROUND
ELECTRODE
CONNECTION
2
1
6.15
(.242)
1
8.36
(.329)
25
7
Outline Designation: RJ11
38.30
(1.508)
13
5
37
6
0.89
(.035)
4
6
5
4
14
1.09 ± .25
.10 )
(.043 ±.010
.004)
1.09 ± .25
.10 )
(.043 ±.010
.004)
2.03
(.080)
1.78
(.070)
TYPICAL 25
1.38
(.0545)
1.68
(.066)
1.52 DIA.
(.060) TYPICAL 6
2.84
(.112)
2.54
(.100)
2.54
(.100)
2.77
(.109)
2.77
(.109)
1
2
1.02
(.040)
1.24
(.049)
1
13
2
3
Equivalent
Circuit
14
15
25
Equivalent
Circuit
4
5
6
9
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Application
SurgX is applicable to most signal line circuits. It is applied as a surface mount device, or as an array between the circuit
board and connector. SurgX is not applicable on lines where lightning or load switching transients are present.
TYPE A SurgX is ideal for computers and computer-related equipment, such as modems, keyboards and printers. It is also
applicable in telecommunications equipment where ringing signals are not present.
TYPE B SurgX is designed for telecommunications equipment where ringing signals are present.
High Frequency Instrumentation
Data Bus
In From
Peripheral
Device
Bussmann
8X Surface
Mount Array
To
Logic
Circuitry
High
Frequency
Signal Input
High
Frequency
Preamplifier
Driver/
Receiver
IC
Out
Out To
Peripheral
Device
From
Logic
Circuitry
Universal Serial Bus Protection
Ferrite Bead
USB Port
V BUS
Power
Management
and USB ICs
D+
D-
3
2
Bussmann
SurgX
3X-ESD-A
1
Gnd
Ferrite Bead
4
“
10
SurgX is applicable
in telecommunications
equipment ...
”
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
How To Order
-ESDTrigger Voltage:
(See page 7)
A = Type A
General Purpose
150V Trigger
B = Type B
Telecom
300V Trigger
Outline Designation:
(See pages 8-9)
Packaging:
TR1/= 3,000 pcs,
TP1/= 500 pcs,
tape and reel
(surface mount
versions only)
Eg. TR1/3216-ESD-A
Custom
Configurations
The coplanar approach used by Bussmann to
produce SurgX ESD suppressors is an
SP1/= 10 pcs,
tray pack
(connector
array versions
only)
Connector Array
Surface Mount
Component
Connector Type,
Manufacturer,
Part Number, Drawing
Package Outline Preferred
(EIA/JEDEC Standard)
sample
pack
extremely flexible process which lends itself to
Which pins are signal lines to be protected?
Which pins are ground lines?
customization. Our expertise in metal film
deposition and dicing techniques—employed
over the last decade for manufacturing dis-
Environmental Spec
crete and array overcurrent protection
devices—is now being applied to SurgX. What
Number of Prototypes and Timing
does this mean to you? It means Bussmann
can supply custom solutions to your specific
Estimated Annual Usage and Timing
design problems. How do you get started? It’s
simple: just provide us with the following
Target Price
information and we will give you an immediate firm quotation covering tooling and prototype charges, as well as
production piece
SurgX
Supply Contact Information:
Name, Title, Company,
Address, City, State, Zip Code,
Phone, Fax, e-mail
•
prices. Our tooling charges and
turn-around time will
pleasantly surprise you.
Send To:
Bussmann Division, Cooper Industries
Attn: Application Engineering
P.O. Box 14460
St. Louis, MO 63178
Fax 314-527-1607
11
Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: (650) 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com
Get the latest, most up-to-date specification data on products listed in this bulletin by calling
Bussmann Information FAX.
BIF is a simple to use automated fax response system. No need to wait for normal business hours, BIF is
available around the clock for your convenience. All you need is a touch-tone telephone and a fax machine
to get the most recent specification data when you want it.
The SurgX BIF document is No. 3602. To get the most recent version, simply call 314-527-1450 and follow
the prompts. In a matter of minutes the data will be faxed to you. It’s that simple!
Bussmann
Visit us on the web at http://www.bussmann.com
© 1997 Cooper Industries, Bussmann Division P.O. Box 14460 St. Louis, MO 63178-4460 314-527-3877 Fax 1-800-544-2570
This bulletin is intended to clearly present comprehensive product data and provide technical information that will
help the end user with design applications. Bussmann reserves the right, without notice, to change design or
construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the
right to change or update, without notice, any technical information contained in this bulletin. Once a product has
been selected, it should be tested by the user in all possible applications.
Bulletin: SurgX.497