Celebrating 25 years of manufacturing excellence, the SEMI Advanced
Semiconductor Manufacturing Conference continues to fill a critical need in our industry. The
conference provides a venue for industry professionals to network, learn and share knowledge on
new and best-method semiconductor manufacturing practices and concepts. Solving the challenges
presented by semiconductor manufacturing has been a combined effort by users, device makers,
equipment and materials suppliers and academia. ASMC provides an unparalleled platform for
semiconductor professionals to network and learn the latest in the practical application of
advanced manufacturing strategies and methodologies. And with more than 37 hours of
technical presentations and over 90 speakers covering all aspects of advanced
semiconductor manufacturing, this is a must attend event! This year’s conference is co-chaired by
Israel Ne'eman, Applied Materials and Oliver Patterson, IBM Microelectronics.
HIGHLIGHTS
•
Keynote: Dr. John Lin, General Manager of Operations, VP, G450C (TSMC assignee)
Taiwan Semiconductor Manufacturing Company, Ltd.
•
Keynote: Dr. Mukesh Khare, Director, Semiconductor Technology Research, IBM Research
•
Keynote: Dean W. Freeman, Vice President, Research, Gartner
•
Tutorials:
Directed Self Assembly (DSA)
Michael A. Guillorn, PhD, Research Staff Member, Manager Nanofabrication and Electron
Beam Lithography, IBM T. J. Watson Research Center
Silicon Photonics
Dr. Haisheng Rong, Sr. Research Scientist, Intel Corporation
•
Panel: 25 Years of Semiconductor Manufacturing: Accomplishments, Current
Challenges, Future Directions - From the Internet to the Internet of Things
Moderator: Paul Werbaneth, 3D InCites
Panelists:
Daniel Armbrust, Chief Executive Officer, SEMATECH
Dr. Lynn Fuller, Professor, Microelectronics Dept., Rochester Institute of Technology
Dave Gross, Director, Manufacturing Systems Technology, GLOBALFOUNDRIES
William Miller, Sr. Director of Engineering, Qualcomm
Charlie Pappis, Group VP, General Manager, Applied Global Services, Applied Materials
WHO ATTENDS ASMC?
Over 300 attendees from 14 countries attend ASMC. Attendees cover the spectrum of advanced
semiconductor manufacturing including IC manufacturing, equipment manufacturing, materials
supplier, technology, operations, process engineering, product management, and academia.
TECHNICAL SPONSORS
For SPONSORSHIP Opportunities
Please contact Marlene Sibley at msibley@semi.org or 1.408.943.6988.
REGISTER
www.semi.org/asmc2014
SPONSORS
TECHNICAL SESSIONS (IN PARALLEL)
Session 1—Yield Enhancement
Chairs: Larry Pulvirent, GLOBALFOUNDRIES; Raymond van Roijen,
IBM
Session 7—Defect Inspection I
Chairs: Jeanne Bickford, IBM; Jeff Barnum, KLA-Tencor
Session 2 —Advanced Metrology I
Chairs: Sathish Veeraraghavan, KLA-Tencor; Alok Vaid,
GLOBALFOUNDRIES
Session 8—Equipment Reliability and Productivity
Enhancement
Chairs: Stefan Radloff, Intel Corporation; Gary Green, Alphray;
Adrienne Pierce, Edwards Vacuum
Session 3—3D/TSV
Chairs: Sagar Kekare, KLA-Tencor; James Lu, RPI; Thuy Tran-Quinn,
IBM
Session 9—Contamination Free Manufacturing (CFM)
Chairs: Chris Long, IBM; Matt Wagner, Pall Microelectronics
Session 4A—Advanced Process Control (APC)
Chairs: Agnes Roussy, EMSE; Philippe Campion, STMicroelectronics
Session 4B—Factory Optimization
Chairs: Dave Gross, GLOBALFOUNDRIES; Thomas Beeg,
GLOBALFOUNDRIES
Session 5—Interactive Poster Session
Chairs: Alan Brightman, Edwards Vacuum; Thanas Budri, Texas
Instruments; Russell Dover, Lam Research; Eric Eisenbraun, CNSE;
Larry Hennessy, CHM2 Hill; Dick James, Chipworks; Jason J.
Mazzotti, IBM; Kazunori Nemoto, Hitachi High Tech; Jan Rothe,
GLOBALFOUNDRIES; Patrick Varekamp, IBM; Naomi Yoshida,
Applied Materials
Session 6—Advanced Metrology II
Chairs: Alok Vaid, GLOBALFOUNDRIES; Amiad Conley, Applied
Materials
Session 10—Data and Yield Management
Chairs: Franz Heider, Infineon; Dieter Rathei, D R Yield
Session 11—Discrete Power Devices/Emerging
Technologies
Chairs: George Kong, Peregrine Semiconductor; Rob Pearson,
Rochester Institute of Technology
Session 12—Advanced Patterning/DFM
Chairs: Jacek Tyminski, Nikon Research; Anton deVilliers, Tokyo
Electron
Session 13—Advanced Equipment and Materials I
Chairs: Russell Dover, Lam Research; Brett Williams, ON
Semiconductor
Session 14—Defect Inspection II
Chairs: Jennifer Braggin, Entegris; Anand Subramani, KLA-Tencor
Session 15—Advanced Equipment and Materials II
Chairs: Holly Magoon, Nikon; Scott Lantz, Intel Corporation
ATTENDEE REGISTRATION
Full Conference Pricing
SEMI/IEEE Members
Non Members
Speakers/Presenters (code required)
Before May 7, 2014
US $550.00
US $695.00
US $405.00
After May 7, 2014
US $650.00
US $795.00
US $480.00
Buy Three Get One Free: Register three or more from the same company and the fourth registrant is free (only applies to non-discounted
rates.)
Full registration includes all conference activities, including sessions, workshop, tutorials, receptions and proceedings. Per day and student pricing
available. Airfare and hotel accommodations are not included.
Cancellation Policy
Cancellations received on or before May 7, 2014 will be fully refunded. After this date, only substitutions are accepted with a written note from
the registered attendee.
COMPANIES ATTENDING IN 2013
3D InCites, Advanced Ion Beam Technology, Advantest, Air Liquide Electronics US, Air Products, AIS Automation Dresden GmbH, Alphray, Applied Materials, Applied Seals North America,
ASML, ATMI, Atotech USA, AZ Electronic Materials USA, Brewer Science, Inc., Brion (ASML), Brooks Instrument, Capovani Brothers Inc., Carl, Zeiss SMT GmbH, CH2M HILL, ChemTrace,
Chipworks, Cleanpart, CNSE, CNW-Courier Network, COLANDIS GmbH, Corning Inc., D R Yield software & solutions, DAS Environmental Expert GmbH, Dow Chemical Company, EAH
Jena, Ebara Technologies, Inc., Edwards, EMSE, Entegris, FEI, Fraunhofer IISB, G450C / CNSE, Gemcity Engineering, GLOBALFOUNDRIES, Greater Rochester Enterprise, Greene Tweed &
Co., Hermes Microvision Inc., Hitachi, HMI, HSEB Dresden GmbH, IBM, IC Insights, imec, Inficon, Infineon Technologies, Intel, JSR Micro, KLA-Tencor, Lam Research, Lasertec USA, Lattice
Semiconductor Corporation, Linde, Liola Technologies, LSIS, Macronix, Marcy NanoCenter, Matheson, Mattson Technology, Microchip Technology Inc., Mirero Inc., MIT, MKS Instruments,
MSP Corporation, Georgia Tech, Global 450mm Consortium, Nantero, National Taipei University of Technology, NewPath Research, Nikon, Northeastern University, Nova Measuring
Instruments, NxEdge, NY Loves Nanotech, Oerlikon USA, ON Semiconductor, Ortner, Osaka University, OSRAM Opto Semiconductors, Pall Corporation, PEER Group GmbH, Peregrine
Semiconductor, Peter Wolters GmbH, Photronics, Portland State University, Praxair Electronics, Qualcomm, RASIRC, Rensselaer Polytechnic Institute, Rochester Institute of Technology,
RPI, Rudolph Technologies, Rutgers University, Samsung Electronics, Schott AG, SEMATECH, Semiconductor Smart Solutions, Semilab USA, Semsysco, SMC Corporation of America, Solid
State Technology, Solvay Fluorides LLC, STMicroelectronics, Systema Systementwicklung Dipl.-Inf. Manfred Austen GmbH, Taiwan Semiconductor Manufacturing Company Ltd., Tepper
School of Business at Carnegie-Mellon, Texas Instruments, Three Way, Times Union, Tohoku University, TOK America, Tokyo Electron America, Tokyo Electron Ltd., Trident, an ITW
Company, TSMC, TU Dresden. ULVAC Technologies, Inc., UMC, Univ. Michigan / Applied Materials, University of Salerno, Valqua America, Watlow Electric Manufacturing Company,
Xradia, Inc., Zygo Corporation
CONTACT US
For additional information, including the most recent event schedule, please email Margaret Kindling, mkindling@semi.org or visit
www.semi.org/asmc2014.
Updated 3/31/14