PS9634
PS9634L
D
POWER TRANSISTOR
DRIVING BASE AMPLIFIER
BUILT-IN TYPE OPTOCOUPLER
DESCRIPTION
• HIGH INSTANTANEOUS COMMON MODE
REJECTION VOLTAGE
CMH = -1000 V/µs MIN, CML = 1000 V/µs MIN
The PS9634 is an optical linkage device mounting a GaAs
infrared LED on the light emitting side (input side), and a
photodiode and a signal processing circuit on the light receiving side (output side) on one chip. The device can directly drive
a power transistor of 15 A to 20 A class and may be used for
an inverter control air conditioner or general purpose inverter.
The PS9634L has formed leads for surface mounting.
UE
FEATURES
• HIGH POWER SUPPLY VOLTAGE (VCC)
VCC = 18 V
• HIGH RESPONSE SPEED
tPHL, tPLH = 5 µs MAX
• HIGH OUTPUT CURRENT
IO1 = 0.5 A (DC), 1.0 A (pulse) MAX
IN
• CAN BE SOLDERED BY INFRARED REFLOW
SOLDERING
ESD SENSITIVE
ELECTRICAL CHARACTERISTICS (TA = -20 °C to +80 °C, unless otherwise specified)
PART NUMBER
VF
Forward Voltage, IF = 5 mA, TA = 25 °C
IR
Reverse Current, VR = 5 V, TA = 25 °C
Ct
Capacitance Between Terminals
V = 0, f = 1.0 MHz, TA = 25 °C
Supply Voltage
UNITS
PS9634, PS9634L
MIN
V
TYP
MAX
1.1
1.4
µA
5
pF
V
30
5.4
15
VO1L*
Low Level Output Voltage (O1)
Vcc = 6 V, IO1 = 0.4 A, RL2 = 10 Ω, IF = 5 mA
V
VO2H*
High Level Output Voltage (O2)
Vcc = 6 V, IO2 = -0.4 A, IF = 5 mA
V
VO2L
Low Level Output Voltage (O2)
Vcc = 6 V, IO2 = 0.5 A, IF = 0
V
IO1L*
Leak Current (O1), Vcc = 13 V, IF = 0
µA
100
IO2L
Leak Current (O2), Vcc = 13 V, IF = 5 mA
µA
100
ICCH
High Level Supply Current
VCC = 6 V, IF = 5 mA, TA = 25 °C
VCC = 6 V, IF = 5 mA
mA
mA
8
12
16
Low Level Supply Current
VCC = 6 V, IF = 0, TA = 25 °C
VCC = 6 V, IF = 0
mA
mA
15
18
22
Input ON Current, Low ♦ High
Vcc = 6 V, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C
Vcc = 6 V, RL1 = 5 Ω, RL2 = 10 Ω
mA
mA
0.3
0.2
1.5
3.0
5.0
1011
SC
O
Output Characteristics
VCC
ICCL
IFLH*
0.25
4.5
0.4
5.0
0.25
0.4
RI-O
Insulation Resistance, RH = 40% to 60%, TA = 25 °C
Ω
tPLH*
Propagation Delay Time, Low ♦ High
Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C
µs
3
5
tPHL*
Propagation Delay Time, High ♦ Low
Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C
µs
3
5
CMH*
Instantaneous Common Mode Rejection Voltage
(Output "High"), TA = 25°C, VCM = 600 V (peak), IF = 5 mA
RL1 = 470 Ω, RL2 = 1 kΩ, ∆VO2H = 0.5 V
V/µs
-1000
CML*
Instantaneous Common Mode Rejection Voltage
(Output "Low"), TA = 25°C, VCM = 600 V (peak), IF = 0 mA
RL1 = 470 Ω, RL2 = 1 kΩ, ∆VO2L = 0.5 V
V/µs
1000
DI
Propagation Characteristics
PARAMETERS
NT
Input
Characteristic
SYMBOLS
*Note: See Figures 1-7 for test schematic.
California Eastern Laboratories
PS9634, PS9634L
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
UNITS
RATINGS
Reverse Voltage
Forward Current2
V
mA/A
6
30/1
Power Voltage
Output Current (O1)
Peak Output Current (O1)
Output Current (O2)
Peak Output Current (O2)
Output Voltage (O1)
Power Dissipation
Total Power Dissipation
Insulation Withstand Voltage3
Operating Temperature
Storage Temperature
V
A
A
A
A
V
mW
mW
Vr.m.s.
°C
°C
18
0.5
1.0
0.8
2.0
18
500
550
5000
-20 to +80
-55 to +150
PART NUMBER
SYMBOLS
PARAMETERS
IFLH
Input ON Current
VCC
Supply Voltage
IO1
Output Current (O1)
IO2
Output Current (O2)
TOP
Operating Temperature
TRUTH TABLE
10.16 MAX
4
1
OFF
Tr. 1
ON
OFF
Tr. 2
OFF
ON
7.62
6.5
3.8 MAX
0.65
1.27 MAX
1.34
0 to 15˚
0.50±0.10
DI
PIN CONNECTION (Top View)
PS9634
Signal processing circuit
1
2
8
Tr. 1
3
7
6
Tr. 2
4
5
6
5.4
0.1
0.1
0
8
0.2
0.2
25
10
15
0.3
0.3
50
PS9634L
10.16 MAX
8
5
1
4
1.
2.
3.
4.
5.
6.
7.
8.
Anode
Cathode
NC
NC
Output (O1)
Output (O2)
GND
VCC
7.62
6.5
3.8 MAX
0.05 to 0.2
4.55 MAX
2.8 MIN
mA
V
A
A
°C
IN
SC
O
5
ON
NT
OUTLINE DIMENSIONS (Units in mm)
8
UNITS MIN TYP MAX
LED
Notes:
1. Operation in excess of any one of these parameters may result in
permanent damage.
2. Peak forward current IFM: Pulse width = 100 µs; Duty Ratio = 1%.
3. When all input pins are connected to all output pins at TA = 25 °C
and RH = 60 %.
PS9634
PS9634,PS9634L
D
PARAMETERS
UE
SYMBOLS
Input
VR
IF/IFM
Output
VCC
IO1
IO1P
IO2
IO2P
VO1
PO
PT
BV
TOP
TSTG
RECOMMENDED OPERATING
CONDITIONS (TA = 25°C)
1.27
MAX
2.54
1.34±0.10
0.9±0.25
9.60±0.4
PS9634, PS9634L
MEASUREMENT CIRCUITS FOR ELECTRICAL CHARACTERISTICS
FIG. 2 (VO2H)
FIG. 1 (VO1L)
IF
IF
1
8
1
8
VCC
VCC
3
6
4
5
2
RL2
= 10 Ω
V VO1L
+
7
3
6
4
IO1
FIG. 3 (IO1L)
IO2
5
FIG. 4 (IO2L)
IF
IF
8
1
7
3
6
4
5
A
FIG. 5 (IFLH)
IO1L
NT
2
1
8
2
7
IN
VCC
3
6
4
5
VCC
A
IO2L
FIG. 6 (tPLH, tPHL)
IF variable
1
8
2
7
3
6
4
5
(tr, tf = 0.01µs)
VIN
1
VCC
-
6V
51 Ω
SC
O
V VO2 RL2
+
= 10 Ω
RL1 = 5 Ω
8
VCC
2
7
3
6
4
5
VIN
8
2
7
3
6
RL1 = 5 Ω
50 %
VOUT
50 %
tPLH
IF
1
RL2
= 10 Ω
VOUT
FIG. 7 (CMH, CML)
tPHL
VCC
DI
SW
V VO2H
+
D
7
UE
2
4
–
+
5
RL2
=1KΩ
VO2
100 V
VCM
GND
RL1
= 470 Ω
CMH (IF = 5 mA)
2V
VO2
VCM
0.5 V
CML (IF = 0)
PS9634, PS9634L
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
POWER DISSIPATION
vs. AMBIENT TEMPERATURE
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
20
10
0
25
50
75
100
300
150
0
25
50
75
100
IN
FORWARD CURRENT vs.
FORWARD VOLTAGE
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
100
600
Forward Current, IF (mA)
(550)
NT
450
300
150
SC
O
Total Power Dissipation, PT (mW)
450
Ambient Temperature, TA (°C)
Ambient Temperature, TA (°C)
0
25
50
75
25 ˚C
0 ˚C
-25 ˚C
-55 ˚C
10
1
0.1
0.01
0.6
100
0.8
1.0
1.2
1.4
Forward Voltage, VF (V)
NORMALIZED IFLH vs.
SUPPLY VOLTAGE
NORMALIZED IFLH vs.
AMBIENT TEMPERATURE
DI
1
0.5
8
10
Normalized to 1.0
at TA = 25 ˚C
VCC = 6 V
1.2
1.1
1.0
0.9
0
6
1.6
1.3
Normalized to 1.0
at VCC = 6 V
TA = 25 ˚C
4
TA = 100 ˚C
75 ˚C
50 ˚C
Ambient Temperature, TA (°C)
1.5
Normalized IFLH, ∆IFLH
(500)
D
30
UE
Power Dissipation, PD (mW)
600
Normalized IFLH, ∆IFLH
Maximum Forward Current, IF (mA)
40
12
14
Supply Voltage, VCC (V)
16
18
0.8
-20
0
20
40
60
Ambient Temperature, TA (°C)
80
PS9634, PS9634L
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
LOW LEVEL SUPPLY CURRENT
vs. SUPPLY VOLTAGE
HIGH LEVEL SUPPLY CURRENT
vs. SUPPLY VOLTAGE
25 ˚C
10
80 ˚C
5
6
8
10
12
14
16
18
80 ˚C
15
12.5
10
Supply Voltage, VCC (V)
SC
O
VCC = 6 V
TA = 25 ˚C
10 -2
10-1
10 0
12
14
16
0.3
0.25
0.3 mA
0.2
0.15
0.1
0.1 mA
0.05
VCC = 6 V
0
-20
0
20
40
60
Ambient Temperature, TA (°C)
LOW LEVEL OUTPUT VOLTAGE
vs. OUTPUT CURRENT
LOW LEVEL OUTPUT VOLTAGE
vs. AMBIENT TEMPERATURE
DI
10 -1
10 -2
10-2
VCC = 6 V
TA = 25 ˚C
10-1
Output Current (O2), IO2 (A)
18
IO1 = 0.5 mA
Output Current (O1), IO1 (A)
10 0
10 -3
10
IN
NT
10 -2
8
LOW LEVEL OUTPUT VOLTAGE
vs. AMBIENT TEMPERATURE
10 0
10 -1
6
Supply Voltage, VCC (V)
LOW LEVEL OUTPUT VOLTAGE
vs. OUTPUT CURRENT
10 -3
4
Low Level Output Voltage (O1), VO1L (V)
4
Low Level Output Voltage (O1), VO1L (V)
25 ˚C
17.5
7.5
0
Low Level Output Voltage (O2), VO2L (V)
TA = -20 ˚C
20
D
TA = -20 ˚C
UE
Low Level Supply Current, ICCL (mA)
22.5
100
Low Level Output Voltage (O2), VO2L (V)
High Level Supply Current, ICCH (mA)
15
80
0.5
VCC = 6 V
IO2 = 0.6 A
0.4
0.3
0.4 A
0.2
0.1
0.1 A
0
-20
0
20
40
60
Ambient Temperature, TA (°C)
80
PS9634, PS9634L
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
HIGH LEVEL OUTPUT VOLTAGE
vs. AMBIENT TEMPERATURE
5
4.5
4
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
NT
3
80 ˚C
25 ˚C
-20 ˚C
tPLH
SC
O
Propagation Delay Time, tPHL, tPLH (µs)
-20 ˚C
2
5
10
15
20
25
30
Forward Current, IF (mA)
SAFE OPERATING AREA (Tr1)
*1) One Pulse
*2) On the
epoxy board
5
IO2 MAX. (Pulse)
1
2
s
m
)
*1
10
m
s
s
m
)
*1
1
0
10
1
D
C
DC
(T
A
=
0.2
80
s
VCC MAX.
DI
IO2 MAX. (DC)
0.5
)
*1
Output Current (O2), IO2 (A)
10
*1
)
*2
)
˚C
)*
2)
0.1
0.3
0.5
1
2
5
10
Output Voltage (O2), VO2 (V)
-0.6 A
5.0
4.9
4.8
4.7
4.6
VCC = 6 V
4.5
-20
0
20
40
60
80
5
VCC = 6 V
RL1 = 5 Ω
RL2 = 10 Ω
tPHL
-0.4 A
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
5
4
IO2 = -0.1 A
5.1
IN
PROPAGATION DELAY TIME
vs. FORWARD CURRENT
25 ˚C
5.2
Ambient Temperature, TA (°C)
Output Current (O2), IO2 (A)
TA = 80 ˚C
5.3
D
VCC = 6 V
TA = 25 ˚C
UE
High Level Output Voltage (O2), VO2H (V)
5.5
Propagation Delay Time, tPHL, tPLH (µs)
High Level Output Voltage (O2), VO2H (V)
HIGH LEVEL OUTPUT VOLTAGE
vs. OUTPUT CURRENT
20 30
VCC = 6 V
RL1 = 5 Ω
RL2 = 10 Ω
IF = 5 mA
4.5
4
tPHL
3.5
tPLH
3
2.5
2
-20
0
20
40
60
Ambient Temperature, TA (°C)
80
PS9634, PS9634L
TAPING SPECIFICATIONS (Units in mm)
10.4 ± 0.1
D
IN
12.0 ± 0.1
0.3
UE
7.5 ± 0.1
1.55 ± 0.1
4.3 ± 0.2
10.3 ± 0.1
1.55 ± 0.1
16.0 ± 0.3
2.0 ± 0.1
4.0 ± 0.1
1.75 ± 0.1
Tape Outline and Dimensions
NT
Tape Direction
SC
O
Reel Outline and Dimensions
1.5
2.0 ± 0.5
φ80.0 ± 5.0
R1.0
φ330
φ13.0 ± 1.0
DI
φ21.0 ± 0.8
+2.0
16.4 -0.0
PS9634, PS9634L
RECOMMENDED SOLDERING CONDITIONS
235 °C or below (plastic surface)
30 seconds or less
Three
Rosin flux containing a small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
UE
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
120 to 160 ˚C
60 to 90 s
(preheating)
IN
to 30 s
NT
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
D
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 °C
• Number of reflows
• Flux
Time (s)
SC
O
CAUTION: Avoid removing the residual flux with water after the first reflow process.
DI
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
Peak temperature 235˚ C or below
260 °C or below (molten solder temperature)
10 seconds or less
One
Rosin flux containing a small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
12/04/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE