Electronics Business Guide
Turning Printing Technologies into
Leading Edge Electronics Products
Display-Related
INDEX
Color Filters
P1
Copper Touch Panels
P2
Sur face Treatment Films
P3
Light Control Film “LC MAGIC”
P4
( Toppan TOMOEGAWA Optical Films Co., Ltd.)
We develop and manufacture display-related components including
color filters that give color to displays, various types of surface
treatment film that deliver high contrast by suppressing reflection on
displays, and modules and sensor film for touch panels.
Semiconductor-Related
INDEX
Color Filter Arrays (On-chip Color Filters)
P5
Photomasks for Semiconductors
P6
Large Size Photomasks
P8
LSI Design / LSI Turnkey Service
( Toppan Technical Design Center Co., Ltd.)
We develop and manufacture photomasks (circuit master
plates), which are essential to frontend processes in semiconductor manufacturing, provide LSI design services and wafer
processing services including color filter arrays for image
sensors, develop and manufacture semiconductor packaging
components used in backend processes, and various types of
etched product.
Molds for Nanoimprint Lithography
P9
Leadframes
P10
FC-BGA Substrates
P11
Etched Products
P12
Color Filters
A wide range of applications
from large televisions to smartphones
A color filter is a critical component that determines color
display image quality. In 1971, Toppan developed color
s tr i p e f i l te r s fo r v i d e o c a m e r a tu b e s by a p p l y i n g
microfabrication technology based on plate making in
printing. Since then, Toppan’s color filters are applied to
various products ranging from large televisions to tablets
and smartphones.
Color filter manufacturing process
The color image is created by light passing through a color filter.
Color filter
While there are a number of color filter manufacturing methods
used, the photolithography method (in which pigment-based
color resists are coated over a glass substrate, and exposure and
development are carried out) is now mainstream.
1
In order to prevent any backlight
leakage and mixture of RGB,
a black matrix is formed first.
2
Black matrix
Glass substrate
Color resist coating
Color resist is coated on the
entire glass substrate.
3
Enlarged view
Formation of black matrix (low reflection chrome and resin)
Color resist layer
Exposure
To make the pattern insoluble,
it is UV-cured by exposure
through a photomask.
Color filter structure
4
R
G
Black matrix
Development & baking
Repeat of steps
2
to
4
T h e c o l o r r e s i s t c o a ti n g,
exposure and development/
baking processes are repeated
for the other two colors.
5
Formation of ITO layer
ITO layer (transparent conductive
layer) is formed by the sputtering
method.
ITO layer (transparent conductive layer)
B
6
Glass substrate
Light
Photomask
After removal of unnecessary
portions on the color resist by
a developing solution, the
pattern is cured by baking.
As the basic structure of the color filter, red (R), green (G) and
blue (B) color resist patterns that allow transmission of light are
formed on a thin glass substrate first, together with a black matrix
that prevents defects such as light leakage while displaying black
color as well as any color mixture with an adjacent color resist.
Then, an ITO (Indium Tin Oxide) layer (transparent conductive
layer), which becomes the common electrode for an array
substrate, is formed over it.
ITO layer
(transparent conductive layer)
Semiconductor Related
Anti-reflection film
Polarizer
Glass substrate
Color filter
Liquid crystal
Glass substrate
Polarizer
Prism sheet
Diffusing plate
Light guiding plate
Reflector
Case
LED
RGB pattern
Display Related
Color LCD panel structure
PS process
Photo spacers (PS) are formed
to improve image quality by
precisely controlling the value
of the cell gap between two
pieces of glass (color filter and
thin film transistor array).
PS (photo spacer)
TOPPAN Electronics
1
Copper Touch Panels
“Total support” touch panel solutions that cover
every stage from planning to manufacturing
Toppan has developed copper sensor film for touch
panels, utilizing its microfabrication technologies
for electronics products. Improved operability,
increase in size, and decrease in weight, are
achieved by lowering the impedance level through
the use of copper as an electrode material.
Toppan supports a wide range of customer needs
with its integrated manufacturing system, which
covers ever y stage from planning/designing
through to module manufacturing.
Display Related
Copper touch panel concepts and structure
On the copper touch panel, X-Y coordinates are determined by
the capacitance change when a finger touches the touch sensor
(which has copper wires placed horizontally and vertically across
the panel surface).
Copper touch panel concepts
ca acitance
ecrease
Semiconductor Related
CG ※1
X1
OCA ※2
X2
Y2
o
nger
PET film
OCA
X3
ith nger touch
ith
nger
ecrease
ca acitance
ca acitance
Y1
Y2
Y3
Schematic diagram
of sensor electrodes
• Total support from planning to manufacturing
The achievement of performance improvement in the capacitive
touch panel involves design know-how, including understanding
and controlling the changes in electrical characteristics. Toppan
has established an integrated production system from planning/
development through to module manufacturing, which facilitates
determining the sensor characteristics of touch panel. Toppan is
able to provide high-quality touch panel modules for control IC
and/or liquid crystal panel as a one-stop solution.
Touch Panel Module
Bezel Printing
2
PET film
※
※
Special features of Toppan copper touch panel
Touch Sensor
CG Co er Glass
CA
tical Clear A hesi e
Cross-section profile and operation concepts
Controller Substrate
Comparative advantages and technological development of the copper sensor
As copper has lower electric resistance and higher conductivity,
it can be used to ensure superior high-speed performance in
large-sized electrical devices.
Copper mesh thinning
8µm
5µm
3µm
• Sensor thinning
Toppan has manufactured the finest copper mesh in Japan, of
3μm diameter (μm: 1/1000 millimeter). The finer the copper line,
the less visible the sensor electrode becomes, which in turn
makes for dramatically improved display panel visibility. This type
of sensor is ideal for small-sized products such as tablet PCs.
• Double-sided patterning in a single process
Film pasting processes are rendered unnecessary, because the
wiring pattern is formed on both sides of the film at the same
time. The process is simplified, and wiring accuracy is improved.
Higher quality
Evolution of the structure of copper touch sensor
Blac ening
treatment
co
er
Traditional structure
Double-sided wiring on one film
Co er glass
Co er glass
CA
P T lm
CA
co
TOPPAN Electronics
er
co
er
P T lm
CA
er
P T lm
2
CA
co
Protection lm
Surface Treatment Films
Improvement of display image visibility
Surface treatment film is an optical film applied to the front
surface of a display in order to minimize reflection of
external light. Various types of surface treatment film can
be provided for different applications, examples of which
include low reflection (LR) film that has excellent antireflection properties, anti-static performance and high
contrast; and anti-glare (AG) film that controls reflection
with excellent anti-glare properties. In addition, such film
ef fe ctive l y prote cts the display by preve nting the
accumulation of dust and enhancing strength and
durability.
Toppan Tomoegawa Optical Films Co., Ltd. manufactures
and sells Toppan’s surface treatment film.
LR
(Low Reflection)
CHC
(Clear Hard Coat)
AG
(Anti Glare)
Reflectance
0.7%~1.0%
4.0%
—
Hard coat
Hard coat (CHC)
Hard coat (AG)
Base film
Base film
Base film
Display Related
Product Type
LR layer
AS layer
Structure
Features
Main applications
∙Highly uniform interference
∙High strength
∙Low cost
•TV, monitor, notebook PC, etc.
Structure of surface treatment film
Surface treatment film
With film
∙Reflection prevention
∙Lineup of low haze products
Semiconductor Related
∙High contrast (color reproducibility)
∙Low reflectivity
∙High antistatic performance
∙High dirt resistance
Without film
Preventing light reflection (LR)
The film structure is designed so that the light reflected at the
boundary between the anti-reflection layer and the base film has
the same amplitude as, but the opposite phase to the light reflected
on the surface of the anti-reflection layer. Reflection is reduced as
the two different lights cancel each other out due to interference.
Base film
Surface reflected light Boundary reflected light (anti-phase)
Hard coat layer
Outside light
Anti-reflection layer
Anti-reflection layer
Preventing screen glare (AG)
Within the hard coat layer formed over the base film, microparticles
whose light refractive index differs from that of its resin are
deployed. As such particles disperse external light, glare on the
screen is diminished.
Base film
Negation by interference
Surface reflected light
Outside light
Scattered light
Microparticles
Hard coat layer
(anti-glare)
Boundary reflected
light (anti-phase)
Base film
TOPPAN Electronics
3
Light Control Film“LC MAGIC”
Used in a wide variety of fields,
including constructions and automobiles
Light Control Film is a functional film, which can
instantaneously switch from being transparent to
opaque or vice versa, by turning on/off the electric
current.
Toppan’s Light Control Film “LC MAGIC” owns world
highest level of transparency and light blocking
property, having multiple functions such as image
projection screen. It is expected to be used in a
wide variety of fields, including constructions such
as housing, offices and commercial facility, as well
as automobiles and aircraft.
Display Related
Features of light control film “LC MAGIC”
●Provides globally top level transparency and shielding property,
as well as superb infrared rays cutting function.
(Opaque : more than 65% of infrared rays is cut.)
●Easy to apply to curved surfaces or glass because it is extremely thin
(film thickness of around 0.1mm).
●Can be shipped in roll form with width of 1,200mm; needs for
large sizes are supported.
Semiconductor Related
●Realizes lower voltage/lower power consumption.
(Driving voltage : 12~60V)
●By changing the voltage , gradual and progressive display of different
gradations between “transparent” and “opaque” is possible.
●Can be processed into a diverse range of shapes by scissors, etc.
(enabling excellent design quality)
●Wide range of color variation is possible, including black.
●Can be used as screen or signage by projecting high-definition video.
▲Switch instantly between transparent and opaque
Line-up of products
＜Normal Mode＞
“Opaque” when the power is off (without electric
current), “transparent” when the power is
on(with electric current).
Example of use
World's first
＜Reverse Mode＞
World’s first light control film which is “transparent”
when the power is off(without electric current).
●Windows, partitions for housing, offices
and public facility
●Projected screen, signage for
commercial facility and event venues
●Windows, sunroofs of automobile and
aircraft
OFF
4
ON
OFF
ON
（no electric current）
（with electric current）
（no electric current）
（with electric current）
Opaque
Transparent
Transparent
Opaque
TOPPAN Electronics
Color Filter Arrays (On-chip Color Filters)
Increasing demand for smartphones,
digital cameras and security devices
Color filter arrays are necessary for providing color for
CMOS image sensors and small display devices such as
LCOS. Demand for such products is rapidly increasing,
along with an expansion of markets for items such as
smartphones, digital cameras, automobile devices, and
security cameras.
Because a color filter for red, green and blue (RGB) as the
three primary colors of light is formed on each photodiode
generated on a silicon wafer, it is called an “on-chip color
filter.” Such filters are essential components to input color
images. In addition, micro lenses are formed on the color
filter for the purposes of enhancing light converging
capabilities and sensitivity.
Effect of micro lens
An image sensor consists of a large number of small elements called pixels. Each pixel
further consists of a photodiode and light transfer unit. Although the photodiode
generates electric signals once it receives light, it does not produce any color images
since the element reacts only to light and dark. Accordingly, a color filter is formed on the
photodiode, enabling detection of light strength received and perception of the image as
a color image.
By changing the light direction through the
effect of the lens, a higher volume of light
can be converged onto the photodiode.
SEM image of micro lenses
1.82μm
Semiconductor Related
Chip
Display Related
What is an image sensor?
(Example)
Color Filter Arrays
Micro lens
Micro lens array
Light
Planarization layer
Color filter
Wafer on which a color filter is formed
When light is shone, color can be seen by reflection.
World’s leading color filter array supplier
Toppan provides high-quality color filter arrays to image sensor
manufacturers. By fully utilizing color filter technologies,
semiconductor-related technologies and other leading edge
technologies that Toppan has accumulated, we provide highly
reliable products to satisfy each customer’s needs. We have 3
production bases: Kumamoto in Japan; Shanghai in China; and
Taoyuan in Taiwan.
Light shielding layer
Electrode
Photodiode
Silicon substrate
Toppan SMIC Electronics (Shanghai) Co., Ltd.
To p p a n S M I C E l e c t r o n i c s ’
production site is located in
Zhangjiang High Technology Park,
which has good access to Shanghai
Pudong International Airport.
Toppan Chunghwa Electronics Co., Ltd.
Kumamoto
Shanghai
Our Taiwanese manufacturing site is
located in Padeh City in Taoyuan
County, which is conveniently accessible from Taoyuan International
Airport.
Taoyuan
TOPPAN Electronics
5
Photomasks for Semiconductors
What is a photomask?
A photomask is an essential device used as the
master plate in the manufacturing process for
semiconductor chips such as LSI. Circuit patterns
drawn by electron beams or laser beams are
etched onto composite quartz glass on which a
metal (such as chrome) light shielding film is
formed.
Enlarged image of
photomask surface
Display Related
How is a photomask used?
Photomask manufacturing process
Semiconductor Related
Using ultraviolet light, the semiconductor
circuit pattern formed on the surface of a
photomask is transferred onto the photo
resist (photosensitive resin) that is coated over
the surface of a silicon wafer. The pattern is
usually reduced to a quarter size through
reduction lenses on the stepper (exposure
device).
Photoresist (photosensitive resin) is uniformly
coated over the surface of a photomask blank.
Then an LSI circuit pattern is drawn by using an
electron beam or a laser beam.
Absorber Layer
Glass Substrate
Photomask
Blank
Reduction
lenses
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
Electron Beam
Photoresist (photosensitive resin)
Absorber Layer
Photomask
Silicon wafer
Exposure process
An absorber layer with a thickness of tens of
nanometers is formed by depositing a substance
such as chrome on the quar tz substrate. The
quartz substrate in this state is called a photomask
blank.
2 Exposure (Patterning)
Ultraviolet
rays
A
A
1 Photomask Blanks
Glass Substrate
3 Development
The portions of resist exposed to the electron beam
are removed through the development process
(positive tone resist). Depending on the type of
resist, there are cases in which non-exposed
portions of resist are removed (negative tone resist).
Absorber Layer
Glass Substrate
4 Etching
The portions where resist was removed by the
development process and the absorber layer is
exposed are then etched through a chemical
reaction by dry etching.
Glass Substrate
5 Resist Removal
A photomask is completed upon removal of the
resist and cleaned, and is finally shipped after
passing several strict inspection processes.
Glass Substrate
6
TOPPAN Electronics
Photomask
Year
2013
2014
2015
2016
2017
2018
Half Pitch (nm)
28
26
24
22
20
18
14
Lithography
193i
Logic node
Logic node (nm)
10
193i
193i
Toppan’s technology development
for leading edge photomasks
7
EUV
193i
28nm
193i
Production
22/20
nm
193i
Production
14nm
193i
10nm
193i
EUV
193i
EUV
193i
Toppan regards the establishment of
leading edge photomask technologies
a s o n e o f i t s to p p r i o r i t i e s . B y
concentrating human resources and
equipment at the Asaka Plant
(Saitama, Japan) and Dresden Plant
(Germany) as technological
development sites, we aim to enhance
the efficiency of development and
differentiate our technologies from
those of competitors. In addition, we
are actively tackling the joint
d e ve l o p m e n t of m o r e ex te n s i ve
technologies with semiconductor
manufacturers as well as various
equipment, material and software
manufacturers.
EUV
Development
Production
Development
Production
193i
Display Related
Research
Development
Production
7nm
Research
EUV
Development
Production
Roadmap of Toppan’s photomask technology development
Examples of Toppan’s Leading Edge Technologies
Examples of Photomasks We Supply
EUV lithography (Extreme Ultra Violet Lithography)
OMOG (Opaque MoSi on Glass) is a new type of
photomask blank (substrate material for photomask)
developed by Toppan after a fundamental review of
materials and structure. A fine pattern on a wafer that
previously could be achieved only with a halftone type
mask has been successfully formed with a binary type
mask using a relatively simple manufacturing process.
Now, OMOG has become the industry standard.
This is a next generation exposure technology using
extreme ultraviolet rays of extremely short wavelength.
It is expected to be a promising technology for the
development of LSIs for the 1x nm generation and
beyond. EUV lithography employs 13.5 nm wavelength.
Because light of such wavelength is absorbed into
every type of substance, including glass, the existing
mask material, it is necessary to shift the technology
from transmission type optics to reflection type optics.
∙Semiconductors
∙Light guiding channels, optical devices
∙MEMS
∙LED
∙Gray tone masks (3-D mask)
∙For accuracy control of equipment
∙For evaluation of resist
∙Resolution test charts
SMO (Source Mask Optimization)
This is a technology to enable much finer fabrication
of semiconductors with the existing lithographic
technology by optimizing both the power distribution of
light used for exposure on the wafer and pattern shapes
on a photomask at the same time. It is expected to be
a technology allowing the continuous use of the current
mainstream liquid immersion lithographic technology for
the 22 nm line width and beyond.
Semiconductor Related
OMOG mask (Advanced Binary Mask)
R&D / New Technologies
∙Molds for nanoimprint
∙Silicon stencil mask
∙Masks for EUV lithography
Mask for EUV lithography
Toppan’s global network
In order to provide the globalizing
semiconductor market with prompt and
meticulous services, Toppan established a
m a n u f a c t u r i n g n e t wo r k of e i g h t s i te s
throughout the world. As one of the world’s
le ading supplie rs of photomasks, it is
implementing development and manufacture
of high quality photomasks in three regions
of North America, Europe and Asia/Pacific
where the demand for semiconductors is
remarkable.
North America
Toppan’s photomask sites
Santa Clara
Burlington
Round Rock
Europe
Asia / Pacific
Ichon
Akihabara / Asaka
Dresden
Kyoto / Shiga
Shanghai
Taoyuan
Corbeil
Shingapore
is the joint
*Burlington
development site
with GLOBALFOUNDRIES
TOPPAN Electronics
7
Large Size Photomasks
By making the best use of its ultrafine microfabrication
technologies, Toppan manufactures and sells reliable,
high-definition photomasks not only for semiconductors
but also for items such as LCDs.
Display Related
Photomasks for LCD
Various large size photomask types
A photomask for an LCD is the master mask
used for forming the pattern on color filters.
With a trend towards larger liquid cr ystal
displays, photomasks for LCDs are also
required to be larger, with higher precision.
While manufacturing and using photomasks for
LC D s i n - h o u s e by u t i l i z i n g i t s u l t r a f i n e
microfabrication technologies just as with
semiconductors, Toppan also sells them to
liquid crystal panel makers.
Toppan provides large size photomasks to
va r i o u s s e c to r s i n c l u d i n g d i s p l ay s,
semiconductors, industry and R&D.
Examples of Supply
∙Color filter masks for organic EL
∙Masks for MEMS ∙Masks for IC (bump)
∙Masks for thermal heads
∙Master masks for high-definition printing
∙Masks for R&D
Semiconductor Related
LSI Design / LSI Turnkey Service
Toppan Technical Design Center Co., Ltd.
http://www.toptdc.com/en/
LSI design service
Flow of Turnkey Service
LSI Design
Interface A
System Design
Interface B
RTL Design
Interface C
Logic Composition
P
Photomask
Manufacture
Mass
production
Final Tests
ance
g
Support
Wafer Tests
to LSI
Prototype Packaging
s sur
hippin
Wafer Process
lit y A
Interface E
Layout Design
Q ua
Interface D
LSI) S
TOPPAN Electronics
This is a solution-based business
aiming to provide a total range of
services, from circuit design to
Customer
LSI prototype and mass production
based on the each customer’s
requirements and specifications.
Its strengths in the analog field
include wireless communication
technologies, high-speed
transmission technologies,
sensor circuits, and power
circuits. In the digital field,
the company has expertise
in low power consumption
technologies.
Product (LSI)
T hrou g h c o ll a bo rati o ns
with par tners with their
own particular strengths,
w e r e s p o n d to c l i e n t s’
requests for custom LSIs.
ustom
8
LSI turnkey service
roduc
t (C
As an LSI design
partner of various
semiconductor
manufacturers,
the company has
been providing
LSI development
and design services for about 40 years.
Development per formed in the past
encompasses a wide variety of fields,
including analog, memor y, LCD, LED
drivers, and microcomputer logic. For
development of RF and analog mixed
s i g n a l i n p a r t i c u l a r, a w e a l t h o f
technologies including power circuit,
amplifier circuit, high frequency LSI, and
system LSI digital mixed macro have
been accumulated. The company prides
itself on industry-leading technical knowhow.
Toppan Technical Design Center Co., Ltd. is a group of engineers who
are responsible for Toppan’s LSI design business. They carry out
development and design for LSIs based on various LSI-related
technologies such as memory, digital and analog technologies.
Molds for Nanoimprint Lithography
Supplying highly fine precision templates (molds) for
next-generation micro fabrication technologies
Nanoimprint lithography is a microfabrication technology used to
transfer patterns that measure a few dozen nanometers by placing
resin between a mold and a substrate and hardening the resin. Its
process is so simple that it is expected to enable inexpensive and
highly repeatable mass volume manufacturing of microstructures.
Toppan develops and produces high-precision molds for
nanoimprint lithography, applying lithography technologies that
have been developed in the company’s semiconductor photomask
business and hot emboss technologies used for optical disc
production.
Mold
Resin
Display Related
Substrate
Methods of nanoimprint lithography
Nanoimprint lithography can be roughly classified into two types: “UV method” and “Thermal Method.”
• UV Nanoimprint Method
The UV nanoimprint method replicates patterns by pressing the pattern on the mold
against UV-curable resin, which is then hardened by UV irradiation.
Working at normal temperature is possible, giving this method the unique nature of
allowing a high level of precision in the replication of patterns.
• Thermal Nanoimprint Method
The thermal nanoimprint method replicates patterns by pressing the pattern on the
mold strongly against thermoplastic resin, which is then cooled after being heated.
Direct processing is possible for a variety of products if they are made of materials that
are softened by heating.
Mold types
• Nickel molds
Quartz molds are mainly used in the UV nanoimprint method.
Quartz is used as the material for semiconductor photomasks.
It is characterized by high rigidity and flatness.
In addition, it is possible to form multilevel structures that are
expected to be utilized in high-definition patterns at the level of
a few dozen nanometers, and in the semiconductor/electronic
device fields.
High-definition pattern examples
Multi-layer structure pattern examples
45nm 90nm
55nm
40nm
600nm
Lines and Spaces
Dot patterns
190nm
90nm
Dual Damascene structure
• Silicon molds
Silicon molds are mainly used in the thermal nanoimprint method.
Patterns are drawn with an electron beam on a silicon substrate
that has been coated with photosensitive resin. Dry etching is
then used to make the patterns deeper.
In addition to forming patterns with a high aspect ratio, it is
possible to form curved patterns used in the formation of microlenses, and a type of tapered mold that is called a “moth-eye,”
and is used in the formation of anti-reflection structures.
High-aspect-ratio pattern examples
Spherical patterns
Tapered shape
Semiconductor Related
• Quartz molds
Nickel molds are mainly used in the thermal nanoimprint
method.
The mold is fabricated by attaching electrolyzed nickel ion to
the master plate through an electroforming process and then
peeling it off.
Nickel mold fabrication process
Master plate
Seed layer
formation
Nickel electroplating
Peeling off
Nickel mold
Base material Curable resin
The material used for molds is metal, giving it high durability
and elasticity, thereby making it possible to wrap it around a
cylinder. This makes it suitable for print transfer to substrates
that have a large surface area.
(Nickel mold maximum size: 1,900 mm x 1,500 mm)
Examples of pattern transfer with a nickel mold
Wedged shape
Meshed shape
Large-area type
(short-side: 30μm)
Pillar-shape
(diameter: 1μm,
height: 5μm)
1μm
3μm
TOPPAN Electronics
9
Leadframes
Of fer ing var ious leadf rames by ut ilizing
advanced etching technologies
A leadframe is a thin metal plate used in semiconductor packages
such as IC and LSI. While it supports and fixes an IC chip, its other
role is to function as connection pins when the chip is mounted on
a p r i nte d w i r i n g b o a rd. T h e l e a d f r a m e m a x i m i ze s c h i p
performance with functions such as heat diffusion, and enables it
to be operated for long periods of time.
Due to demand for smaller electronic devices with higher
performance, applications and demand for semiconductors for
products including digital home appliances and automobiles are
expanding rapidly. Similarly, demands for semiconductor
packages with a higher pin count, smaller size and enhanced
performance are also increasing. By fully utilizing its advanced
etching technologies built up over many years, Toppan is actively
developing a variety of leadframes with an eye on such market
trends.
Display Related
Structure of semiconductor package and leadframe
IC chip
Resin
Gold wire
Semiconductor Related
Leadframe
Pin
Line-up of products
• Fine Pitch Leadframe
• Improved Resin Adhesion Package
Smaller packages can be produced by
reducing gaps between inner leads.
Leadframes with these fine pitches
e n a b l e t h e r e d u c ti o n of g o l d w i r e
consumption and enhance reliability.
Roughening treatment (micro etching)
helps to improve resin adhesion. This
te c h n o l o g y h a s b e e n a d o p te d f o r
semiconductor packages for automobiles
that require much greater reliability.
110 μm pitch
• Downset Leadframe
• Caulking Leadframe
• Leadframe with Heat Spreader
• QFN Substrate
Downset leadframes that employ
c o m p l ex f a b r i c ati o n te c h n o l o g i e s,
including bus bar, power ring and leaping,
contribute to improved performance as
well as to the replacement of BGA with
leadframes.
This is a leadframe combined with a
heat spreader, enabling finer pitch.
By applying blackening treatment or
roughening treatment, adhesion to the
mold resin can be improved.
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TOPPAN Electronics
This is a heat radiation type leadframe
that is best for power semiconductors
and other items that require highly
effective heat radiation. Heat spreaders
are fixed onto the leadframe by the
caulking method.
This is a type of substrate for QFN (Quad
Flat No-Lead Package) corresponding
to the demand for smaller semiconductor
packages. It meets market demand with
its high precision half-etching technology.
FC-BGA Substrates
(High Density Semiconductor Package Boards)
Satisfying diversified requirements with buildup wiring board technology
An FC-BGA (Flip Chip-Ball Grid Array) substrate is a high
density semiconductor package board that enables higher
speed LSI chips with more functions.
As a result of Toppan’s independently developed microfabrication technologies and build-up wiring board
technology, a super high density wiring structure has been
created. In the areas of microprocessors and graphic
processors for PCs, servers and game devices, as well as
LSIs for digital home appliances, Toppan comprehensively
supports customers’ needs from substrate design to
manufacture. Solutions for lead-free and halogen-free
products are also available.
Technologies that support higher density
• Hyper Build-up
IC chip
Under filling
Line/space = 12/12 μm
Land/Via = 85/55μm
Semiconductor Related
In terms of power strengthening and
signal quality, high-end products such as
highly functional processors require
build-up technology with a higher layer
count specification. Using the filled via
hole technology that enabled the
optimization of manufacturing conditions,
Toppan guarantees reliability of interlayer
connections.
FC bump
Solder ball
• Higher Pin Count / Ultra Fine Wiring
Structure of FC-BGA substrate
This type of substrate is excellent in terms of its narrow pitch,
electric characteristics and heat radiation due to a structure that
combines IC chip connecting FC pads with bumps (FC bumps)
on the substrate side.
Solder resist
Display Related
Structure of semiconductor package and FC-BGA substrate
FC pad
FC bump
It is high-precision patterning technology
that supports the increasing demand for
higher density wiring. Based on Toppan’s
copper plating technology that has been
cultivated through the manufacture of
substrates for super computers that
n e e d str ic t im p e d a nc e c o ntro l, th e
t h i c k n e s s of c o n d u c to r s h a s b e e n
successfully made uniform, allowing
super-fine wiring with little fluctuation.
Line/space = 10/10 μm
Pitch = 120μm
Build-up layer
Core layer
Build-up layer
Hole filling resin
Ball pad
Line-up of products
Wiring density
Coreless FC-BGA
• Narrow Pitch FC Bumps
With a trend toward smaller bumps with
narrower pitch, Toppan has adopted
various advanced production methods in
addition to the high-resolution silkscreen
printing process and successfully
developed a pre-soldering method that
minimizes fluctuation. Through a stable
s u p p l y of s u c h s o l d e r, we s u p p o r t
c u s t o m e r s’ h i g h y i e l d c o m p o n e n t
mounting.
Pitch = 120μm
FC-BGA(fine pitch core)
of New Packaged
• Development
Substrates
FC-SiP
FC-MCM
FC-CSP
Mass production ready
FC-BGA
Mass production being prepared
Demands for higher speed devices and
smaller packages are driving needs for
new substrate technologies. To respond
to such needs, Toppan is actively tackling
the development of substrates with new
structures such as coreless substrates.
Layer count
TOPPAN Electronics
11
Etched Products
Applied to electronic components,
jigs and plated accessories
Etching is a process involving the selective removal
of some portions of metal material by chemical
corrosion. Using metal etching technology, Toppan
manufactures and sells various products in addition
to semiconductor package-related products. This
technology is applied to a variety of fields which
include various parts for electronic products, such
as antennas for smartcards, inner and exterior
parts of devices, and decorative products such as
metal bookmarks and calendars.
Display Related
Applications of “half-etching”
Half etching refers to etching one side of the metal surface to a given depth. As the etching shape is different from one side to the other,
new functions are added to the metal filter, including removal of particles or changing the current speed.
Semiconductor Related
contamination removal /
separation
contamination removal / separation,
camouflaging of external appearance
flow rate control
light quantity control
flow rate control
Metal mask for OLED display
This is a metal mask used for depositing RGB and electrodes on low molecular OLED displays.
How OLED Metal Mask is used (cross-section profile)
Glass substrate
Fluorescent pixel
Metal mask
Thermal deposition source (Heat source)
12
Thickness
0.030~0.200mm(t)
Pitch Precision
±0.005mm / Thickness, 0.030mm(t); at 470 x 700mm area
Aperture
Precision
±0.003mm / Thickness, 0.030mm(t)
Minimum
Aperture Size
0.030mm / Thickness, 0.030mm(t)
0.050mm / Thickness, 0.050mm(t)
TOPPAN Electronics
OLED metal mask requires precise aperture control and a surface
structure that allows efficient deposition of emitted pixels. Toppan
utilizes its advanced processing technologies to control the metal
etching effectively to build the metal masks.
Production Sites and Offices
We Provide the Best Possible Solutions
by Making Use of our Extensive Global Network.
Europe
U.S.A.
Japan & Asia
Toppan’s network for Electronics Business spans the globe.
We manufacture the highest quality products in optimal locations and delivery them to customers in a timely manner.
Japan
Planning, development and sales of electronics products
Electronics Division (Taito, Tokyo)
Nagoya Sales Office / Kyoto Sales Office / Nishinihon Sales Office
Research and development of electronics products
Toppan Technical Research Institute (Sugito, Saitama, etc.)
Asia
Manufacturing and sales of color filter arrays (on-chip color filters)
TOPPAN SMIC ELECTRONICS (SHANGHAI) CO., LTD.
(Shanghai, China)
Manufacturing and sales of photomasks for semiconductors
TOPPAN PHOTOMASKS COMPANY LIMITED, SHANGHAI
(Shanghai, China)
Manufacturing of electronics products
TOPPAN ELECTRONICS PRODUCTS CO., LTD.
Niigata Plant / Toyama Plant / Asaka Plant / Shiga Plant / Mie Plant (Kameyama) /
Mie Plant (Hisai) / Kumamoto Plant
LSI design, system development and LSI turnkey service
TOPPAN TECHNICAL DESIGN CENTER CO., LTD.
Hokkaido Design Center / Asaka Design Center / Kyoto Design Center /
Fukuoka Design Center
Manufacturing and sales of surface treatment (anti-reflection) films
TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD. (Taito, Tokyo)
Sales of electronics products
SHANGHAI TOPPAN INTERNATIONAL TRADING CO., LTD.
(Shanghai, China)
Sales of electronics products
TOPPAN ELECTRONICS (TAIWAN) CO., LTD. (Taipei, Taiwan)
Manufacturing and sales of photomasks for semiconductors and
color filter arrays (on-chip color filters)
TOPPAN CHUNGHWA ELECTRONICS CO., LTD. (Taoyuan, Taiwan)
Hsinchu Sales Office (Hsinchu, Taiwan)
Kyoto Office / Shiga Plant / Shizuoka Plant
Manufacturing and sales of photomasks for semiconductors
Development, manufacturing and sales of small-and medium-sized TFT LCDs
ORTUS TECHNOLOGY CO., LTD. (Hino, Tokyo)
Kochi Plant
TOPPAN PHOTOMASKS KOREA LTD. (Icheon, Korea)
Sales of semiconductor-related products
TOPPAN SEMICONDUCTOR SINGAPORE PTE. LTD.
(Singapore)
Europe
Manufacturing and sales of photomasks for semiconductors
TOPPAN PHOTOMASKS GERMANY GmbH (Dresden, Germany)
Research and development of photomasks for semiconductors
U.S.A.
Manufacturing and sales of photomasks for semiconductors
TOPPAN PHOTOMASKS, INC. (Round Rock, Texas, U.S.A.)
Round Rock Site (Round Rock, Texas, U.S.A.)
Santa Clara Site (Santa Clara, California, U.S.A.)
ADVANCED MASK TECHNOLOGY CENTER GmbH & CO. KG
(Dresden, Germany)
Manufacturing and sales of photomasks for semiconductors
TOPPAN PHOTOMASKS FRANCE S.A.S. (Corbeil, France)
Please refer to our website for further information
such as addresses and contact details.
http://www.toppan.co.jp/electronics/english/profile/
On this page, the term “sales” is used as a general term covering all sales activities (including market research, customer service, and sales support, etc.)
TOPPAN Electronics
13
1, Kanda Izumi-cho, Chiyoda-ku, Tokyo 101-0024, Japan
http://www.toppan.co.jp/english/
Printed in Japan
©TOPPAN 2016. 6 K Ⅱ