NiDI
Nickel
Development
Institute
Nickel
Alloys for
Electronics
A Nickel Development Institute
Reference Book Series N° 11 002
1988
NiDI
Nickel
Development
Institute
Nickel Development Institute (NiDI)
is the market development and
applications research organization of
the primary nickel industry. NiDl was
incorporated and organized in 1984. Its
headquarters are in Toronto, Canada.
NiDI's objective is sustained growth in
the consumption of nickel. Through a
network of a dedicated permanent staff
and key international consultants and
project contractors, NiDl carries out
market development activities, market
exploration, and applications-oriented
technical research relevant to the
achievement of its objective around the
world. It provides technical service to
nickel consumers and others concerned
with nickel, nickel alloys and their uses.
NiDI's principal marketing efforts are
directed toward the United States,
Western Europe, Japan and the newly
industrializing nations in Latin America,
the Pacific rim and the Indian subcontinent … those countries having the
greatest current consumption of nickel
and those having the greatest potential
for growth.
NiDI's information services are
available to designers, specifiers, and
educators as well as to nickel users.
Enquiries are welcomed from architects,
engineers, specification writers, and
others responsible for selection of
materials for manufacturing and
construction. NiDl cooperates with
colleges and universities by furnishing
relevant information and material for
engineering, materials science, and
industrial design education.
The material presented herein has
been prepared for the general information of the reader and should not be
used or relied upon for specific applications without first securing competent
advice.
While the material is believed to be
technically correct, NiDl, its members,
staff, and consultants do not represent
or warrant its suitability for any general
or specific use and assume no liability
or responsibility of any kind in
connection with the information herein.
Drawings and/or photographs of
equipment, machinery, and products
are for illustrative purposes only, and
their inclusion does not constitute
or imply any endorsement of the items
or of the companies that manufacture
or distribute them.
Foreword
Reliability, freedom from maintenance costs,
longer service and minimum production
rejects have become increasingly important to
designers and manufacturers of electronic and
electrical equipment.
In civilian communications and computers,
military equipment and industrial controls,
nickel alloys provide the combinations of
characteristics and properties that warrant
their review whenever new designs or design
modifications are being considered.
Nickel Alloys for Electronics is intended to
provide information that will be directly applicable to engineers and designers in evaluating and applying the nickel alloys that are
most useful to the electronics industry. The
Nickel Development Institute (NiDI) gratefully
acknowledges the cooperation of the many
companies who have contributed information
and background data.
The materials included in this reference book
are based on generic alloys that have industry
specifications and Unified Numbering System
(UNS) numbers. Proprietary alloys and
manufacturers thereof are not included.
Table of Contents
Page No.
Semiconductor Packaging, Lead Frame and Glass Sealing Alloys
42 Alloy (K94100)................................................................................................ 1
F 15 Alloy (K94610) ............................................................................................ 7
426 Alloy (K94760)............................................................................................ 10
46 Alloy (K94600).............................................................................................. 13
52 Alloy (N14052).............................................................................................. 16
Reference Data on Non-Metallic Materials................................................................. 19
Minimum Expansion Alloy
Invar (K93600)................................................................................................... 20
Nickel Beryllium (N03360) ........................................................................................... 23
Nickel
Nickel 200, 201, 205, 233, 270/290
(N02200, N02201, N02205, N02233, N02270/N02290)................................ 25
Copper-Base Connector and Spring Alloys
Copper Alloy C72500........................................................................................ 29
Copper Alloy C76200........................................................................................ 33
Copper Alloy C77000 ....................................................................................... 37
Spinodal Alloy
Copper Alloy C72900........................................................................................ 40
Stainless Steel Alloys AISI 301 and 304..................................................................... 46
Nickel Electroplating ..................................................................................................... 49
Standards and Specifications ...................................................................................... 62
Note—Numbers in parentheses are UNS (Unified Numbering System) Numbers; Copper
Development Association (CDA) and UNS Numbers for Copper-Base Alloys are identical.
42 Alloy*
Superior bend properties
at the temper used for
lead frames
Nickel and iron-nickel alloys were the
original commercial semiconductor
packaging metals. 42 Alloy lead frames
continue to be used widely for highreliability ceramic Cer-DIP and plasticpackaged devices where these advantages are important:
Important in making conventional 90° as well as J-bends.
Closest possible match to
thermal expansion of
alumina,
beryllia and
vitreous glass
Worldwide availability
There are no patents on 42
Alloy and it is made everywhere
semiconductor devices are
manufactured and packaged.
Extremely important in avoiding
cracks and breaks in soldered joints
(Fig. 3).
Intrinsically superior
strength and stiffness
Plateability
The much higher yield strength
and modulus of elasticity of 42
Alloy is important in minimizing
bent leads, especially in automatic
insertion (Fig. 1).
42 Alloy strip can be plated,
striped or spot-plated with nickel,
copper or lead-tin solder as well as
gold or silver.
Weldability
High softening and stress
relaxation temperatures
Iron-nickel alloys are welded
readily by spot, projection, seam,
stitch, flash and other resistance
and fusion processes. Alloy 42 is
also adaptable to ultrasonic and
thermocompression bonding and
electron-beam and laser welding.
Strength and stiffness are maintained completely during exposure
to soldering, burn-in and other
manufacturing steps where exposure to elevated temperatures is
possible (Fig. 2).
Cladding
Higher hardness at
temper used
Composite strip can be produced by cladding or inlaying 42
Alloy with copper, aluminum, gold
or silver to obtain combinations of
the best properties of two or more
alloys or metals, and to reduce
costs.
This is reflected in improved
lead frame strip surface.
No intermetallic
compounds
that can be harmful to
solderability
These characteristics add up to the use
of 42 Alloy wherever resistance to heat,
moisture or aggressive environments is
encountered, and where long life and
high reliability are called for. Properties of
42 Alloy are shown in Table 1.
High strength levels are
developed through cold work
alone.
*UNS K94100
1
Thermal Management in
Semiconductor Devices
and Printed Circuit Board
Assemblies
Limiting junction and average die
temperatures in microelectronic devices
and assemblies require consideration of
the chip and board designs, component
densities and external cooling systems.
These design factors plus the bulk
thermal conductivity of the ceramic or
epoxy package usually have more effect
than the thermal conductivity of the lead
frame material alone.
Thermal test boards and systems are
now widely used to test new device and
board designs and should be used to
determine whether the difference between the thermal conductivity of a 42
Alloy lead frame and a copper-base
frame is significant.
The high reliability and the superior
mechanical properties of 42 Alloy should
not be overlooked simply because the
thermal conductivity of the material is
not as high as the copper-base alloys.
2
Fig 1 Comparative yield strength levels of
42 Alloy vs C19400 at several tempers
3
Fig 2 Stress relaxation of high-strength
lead-frame alloys as measured by resistance to
softening [strip thickness 0.254 mm (0.010 in.)]
4
Fig 3 Linear thermal expansion of 42 Alloy,
99.5% beryllia and 94% alumina vs temperature
5
Table 1 Properties of 42 Alloy
Chemical Composition, %
Nickel
41.5
Cobalt
nominal
0.50
maximum
Chromium
0.25
maximum
Manganese
0.80
maximum
Silicon
0.30
maximum
Carbon
0.05
maximum
Aluminum
0.10
maximum
Phosphorus
0.025
maximum
0.025
maximum
Sulfur
Iron
Balance
Comparative Thermal Expansion Coefficient (Instantaneous)
42 Alloy (ASTM F 30 and Mil-I-23011)
4.0 to 4.7 × 10–6cm/cm/°C
6.7 to 7.4 × 10–6cm/cm/°C
10.5 × 10–6cm/cm/°C
2.2 to 2.6 × 10–6in./in./°F
3.7 to 4.1 × 10–6in./in./°F
5.8 × 10–6in./in./°F
Alumina, 94% Al2O3
7.2
4.0
96% Al2O3
7.5
4.1
99.5% Al2O3
7.6
4.2
Beryllia, 99.5% BeO
7.8
4.3
30-300 °C (86-572 °F)
30-450 °C (86-842 °F)
30-700 °C (86-1292 °F)
Ceramics - Typical, 25-700 °C (77-1292 °F)
Vitreous Glass-Typical, 25-300 °C (77-572 °F)
8.0
4.45
C19400 Copper-base Lead Frame Alloy-Typical
20-300 °C (68-572 °F)
16.9
9.3
Density
8.11g/cc
0.293 Ib/in.3
Melting Point
1425 °C
2597 °F
20-100 °C (68-212 °F)
14.7 W/(m • °K)
100.8 Btu • in./h • ft2 • °F
Electrical Resistivity 20 °C (66 °F)
63 microhm • cm
380 ohm • cmil/ft
Curie Temperature
375 °C
707 °F
Physical Properties
Thermal Conductivity
Mechanical Properties (Half-hard Temper)
Tensile Strength
Yield Strength, 0.2% offset
Elongation, % in 2 in.(5.08 cm)
Hardness (Vickers equivalent)
Modulus of Elasticity
Poisson's Ratio
790 MPa
720 MPa
115,000 psi
105,000 psi
5
170
144,000 MPa
21,000,000 psi
0.25
NOTE: By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
6
F 15 Alloy*
ASTM F 15 Alloy is a nickel-cobaltiron alloy specifically designed to match
the expansion of borosilicate glass (Fig.
4). The balance of nickel with cobalt in
this alloy results in the following special
characteristics and attributes:
Very low and uniform thermal expansion properties
High reliability under thermal shock
Excellent deep drawing and freedom from earing
Low outgassing
Resists attack by mercury
The properties of F 15 are shown in Table 2.
*UNS K94610
7
Fig 4 Linear thermal expansion of F 15 Alloy and
hard glass vs temperature
8
Table 2
Properties of F 15 Alloy
Chemical Composition, %
Nickel
29
nominal
Cobalt
17
nominal
Manganese
0.50
Silicon
0.20
maximum
Carbon
0.06
maximum
Balance
maximum
Iron
maximum
Aluminum, Magnesium, Zirconium and Titanium may be 0.10% each, maximum, but, total cannot exceed 0.20%
Thermal Expansion Coefficient
30-400 °C (86-752 °F)
4.60 to 5.20 × 10–6cm/cm/°C
2.6 to 2.9 × 10–6in./in./°F
30-450 °C (86-842 °F)
5.10 to 5.50 × 10 cm/cm/°C
2.8 to 3.1 × 10–6in./in./°F
Density
8.35 g/cc
0.302 lb/in.3
Melting Point
1450 °C
2642 °F
30 °C (86°F)
16.6W/(m • °K)
114.5 Btu • in./h • ft2 • °F
300 °C (632 °F)
20.3 W/(m • °K)
141 Btu • in./h • ft2 • °F
49 microhm • cm
294 ohm • cmil/ft
435 °C
815 °F
Tensile Strength
790 MPa
115,000 psi
Yield Strength, 0.2% offset
720 MPa
–6
Physical Properties
Thermal Conductivity
Electrical Resistivity
20 °C (68 °F)
Curie Temperature
Mechanical Properties (Half-hard)
105,000 psi
Elongation, % in 2 in.(5.08cm)
5
Hardness (Vickers equivalent)
210
Modulus of Elasticity
137,000 MPa
Poisson's Ratio
20,000,000 psi
0.30
NOTE: By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
9
426 Alloy*
426 Alloy (ASTM F 31) was
developed to match the thermal expansion characteristics of potash-soda-lead
glass such as Corning 0120 (Fig. 5). An
advantage of this glass-to-metal sealing
alloy is that a tight green oxide film is
formed by wet hydrogen annealing at
2050 °F, making a vacuum-tight seal. It
is used for such applications as glassed
windows, leads for compression seals
and relatively large-scale glass sealing
applications where the size limitations of
“dumet” (copper-coated 42 Alloy) make
that composite wire unsuitable.
Properties of 426 Alloy are shown in
Table 3.
*UNS K94760
10
Fig 5 Linear thermal expansion of 426 Alloy and
soft glass vs temperature
11
Table 3
Properties of 426 Alloy
Chemical Composition, %
Nickel
42
nominal
Chromium
5.6
nominal
Carbon
0.07
maximum
Manganese
0.25
maximum
Phosphorus
0.025
maximum
Sulfur
0.025
maximum
Silicon
0.30
maximum
Aluminum
0.20
maximum
Iron
Balance
Thermal Expansion Coefficient
30-350 °C (86-662 °F)
8.5 to 9.2 × 10–6 cm/cm/°C
4.7-5.1 × 10–6 in./in./°F
30-425 °C (86-797 °F)
9.7 to 10.4 × 10 cm/cm/°C
5.4-5.8 × 10–6 in./in./°F
Density
8.12 g/cc
0.294 Ib/in.3
Melting Pant
1425 °C
2597 °F
12.2 W/(m • °K)
82.8 Btu • in./h • ft2 • °F
95 microhm • cm
570 ohm • cmil/ft
295 °C
563 °F
Tensile Strength
790 MPa
115,000 psi
Yield Strength, 0.2% offset
720 MPa
–6
Physical Properties
Thermal Conductivity
20-100 °C (68-212 °F)
Electrical Resistivity
20 °C (68 °F)
Curie Temperature
Mechanical Properties (Half-hard)
105,000 psi
Elongation, % in 2 in.(5.08cm)
5
Hardness (Vickers equivalent)
210
Modulus of Elasticity
158,500 MPa
Poisson's Ratio
23,000,000 psi
0.28
NOTE: By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
12
46 Alloy*
This iron-nickel sealing alloy (ASTM
F 30) has been used extensively as
terminal bands for vitreous enameled
resistors and for sealing metallized
ceramics. It finds application for seals
that are not hydrogen annealed prior to
sealing to assure freedom from gas
pockets.
Properties of 46 Alloy are shown in
Table 4 and Fig. 6
*UNS K94600
13
Fig 6 Linear thermal expansion of 46 Alloy and
94% alumina vs temperature
14
Table 4 Properties of 46 Alloy
Chemical Composition, %
Nickel
46
nominal
Cobalt
0.50
Chromium
0.25
maximum
Manganese
0.80
maximum
Silicon
0.30
maximum
Carbon
0.05
maximum
Aluminum
0.10
maximum
Phosphorus
0.025
maximum
Sulfur
0.025
maximum
Iron
maximum
Balance
Thermal Expansion Coefficient
30-350 °C (86-662 °F)
7.1 to 7.8 × 10–6 cm/cm/°C
3.9 to 4.3 × 10–6 in./in./°F
30-500 °C (86-932 °F)
8.2 to 8.9 × 10–6 cm/cm/°C
4.6 to 4.9 × 10–6 in./in./°F
Density
8.24 g/cc
0.298 Ib/in.3
Melting Point
1425 °C
2597 °F
11.3 W/(m • °K)
79.2 Btu • in./h • ft2 • °F
Physical Properties
Thermal Conductivity
20–100 °C (68–212 °F)
Electrical Resistivity
20 °C (68 °F)
Curie Temperature
51 microhm • cm
310 ohm • cmil/ft
450 °C
842 °F
Mechanical Properties (Half-hard)
Tensile Strength
790 MPa
Yield Strength, 0.2% offset
720 MPa
115,000 psi
105,000 psi
Elongation, % in 2 in.(5.08cm)
5
Hardness (Vickers equivalent)
Modulus of Elasticity
210
158,500 MPa
Poisson's Ratio
23,000,000 psi
0.28
NOTE: By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
15
52 Alloy*
52 Alloy (ASTM F 30) has thermal
expansion characteristics that match
vitreous potash-soda-lead glass. Its
rate of thermal expansion is virtually
constant to about 565 °C (1050 °F)
(Fig. 7).
A modified 52 Alloy with higher nickel
(51-51.5%) exhibits the combination of
controlled expansion and magnetic
properties required for mercury-wetted
reed switches.
Properties of 52 Alloy are shown in
Table 5.
*UNS N14052
16
Fig 7 Linear thermal expansion of 52 Alloy and
soft glass vs temperature
17
Table 5 Properties of 52 Alloy
Chemical Composition, %
Nickel
Cobalt
50.5
nominal
.50
maximum
Chromium
0.10
maximum
Manganese
0.60
maximum
Silicon
0.30
maximum
Carbon
0.05
maximum
Aluminum
0.10
maximum
Phosphorus
0.025
maximum
0.025
maximum
Sulfur
Iron
Balance
Thermal Expansion Coefficient
30-450 °C (86-842 °F)
9.6 to 10.1 × 10–6 cm/cm/ °C
5.3 to 5.6 × 10–6 in./in./°F
30-550 °C (86-1022 °F)
10.2 to 10.7 × 10 cm/cm/°C
5.7 to 5.9 × 10–6 in./in./°F
30-450 °C
10.0 to 10.35 × 10–6 cm/cm/°C
–6
* Modified Alloy for Reed Switch Applications
Physical Properties
Density
8.30 g/cc
0.30 Ib/in.3
Melting Point
1425 °C
2597 °F
13.4 W/(m • °K)
93.6 Btu • in./h • ft2 • °F
43 microhm • cm
259 ohm • cmil/ft
510 °C
950 °F
Tensile Strength
790 MPa
115,000 psi
Yield Strength, 0.2% offset
720 MPa
Thermal Conductivity
20–100 °C (68–212 °F)
Electrical Resistivity
20 °C (68 °F)
Curie Temperature
Mechanical Properties (Half-hard)
105,000 psi
Elongation, % in 2 in.(5.08cm)
5
Hardness (Vickers equivalent)
Modulus of Elasticity
210
165,000 MPa
Poisson's Ratio
24,000,000 psi
0.29
NOTE: By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
18
Reference Data on Non-Metallic Materials
Nickel alloys are often used in electronic applications in conjunction with
non-metallic materials in sealing,
mounting and packaging. Table 6 summarizes the properties of some of the
non-metallic ceramics, glasses and
plastics used in these applications.
Table 6 Properties of Non-Metallic Materials
Material
Thermal Expansion
Coefficient,
cm/cm/°C × 10–6
Thermal Conductivity,
W/(m • °K)
Tensile
Strength,
psi
MPa
(25-700°C)
7.2
7.5
7.6
(25°C)
27.7
35.2
36.9
(300°C)
15.5
17.2
18.4
20.000
25.000
28.000
(140)
(170)
(190)
(25-700°C)
7.8
(25°C)
247
(300°C)
117
23.000
(160)
(25-150°C)
59
(25°C)
.587
10.000
(70)
(25-250°C)
22
(25°C)
.503
6.000
(40)
(–30 to +30°C)
21
(25°C)
.503
7.000
(50)
Alumina Ceramic
94% Al2O3
96% Al2O3
99.5% Al2O3
Beryllia Ceramic
99.5% BeO
Epoxy
Rigid, Filled
Silicone
Phenolic
Electrical Grade
Sealing Glasses
Type
Thermal Expansion Coefficient,
cm/cm/°C (in./in./°F) × 10–6
Temp Range,
°C (°F)
Vitreous
potash-soda-lead
(eg. Coming 0120)
borosilicate
(eg. Corning 7052)
lead-borate-zinc
(eg. Corning 7585)
borosilicate
(eg. Coming 9741)
0-300 (32-572)
25-400 (77-752)
0-300 (32-572)
25-441 (77-826)
0-270 (32-518)
25-set pt. (77-set pt.)
0-300 (32-572)
25 to set pt. (77-set pt.)
8.95 (4.97)
9.9 (5.5)
4.6 (2.56)
5.31 (2.95)
6.8 (3.83)
6.75 (3.94)
3.8 (2.1)
5.5 (3.1)
0-300 (32-572)
25-480 (77-896)
0-300 (32-572)
25-400 (77-752)
8.4 (4.67)
8.3 (4.61)
8.0 (4.44)
7.8(4.33)
Devitrefying
lead -zinc-borosilicate
(eg. Corning 7583)
lead-zinc-borosilicate
(eg. Corning 7589)
19
Invar*
The Invar alloys have the lowest thermal expansion of any metals or alloys in
the temperature range from ambient to
about 230 °C (446 °F). The properties of
Invar are shown in Table 7 and Fig 8.
The “super-Invar” modification (31.5 Ni,
4.5 Co) has nearly zero expansivity over
that range. Some of the applications for
Invar alloys include:
Low expansion side of thermostatic
bimetals
Precision measuring devices and
gauges
Clamps and fixtures requiring extreme
dimensional stability
Radar resonant cavities
Tanks and pipelines for liquefied gas
Special joints and washers
*UNS K93600
20
Fig 8 Linear thermal expansion of 42 Alloy,
Invar and carbon steel
21
Table 7 Properties of Invar
Chemical Composition, %
Nickel
Manganese
36
nominal
0.35
maximum
Silicon
0.30
maximum
Carbon
0.12
maximum
Iron
Balance
Thermal Expansion Coefficient
25-100 °C (70-212 °F)
1.18 × 10–6 cm/cm/°C
0.655 × 10–6 cm./cm./°C
25-200 °C (70-392 °F)
1.72 × 10 cm/cm/°C
0.956 × 10–6 in./in./°F
Density
8.05 g/cc
0.291 Ib/in.3
Melting Point
1425 °C
2597 °F
20-100 °C (68-212 °F)
10.5 W/(m • °K)
72 Btu • in./h • ft2 • °F
Electrical Resistivity 20 °C(66 °F)
82 microhm • cm
495 ohm • cmil/ft
Curie Temperature
280 °C
537 °F
Tensile Strength
450 MPa
65,000 psi
Yield Strength, 0.2% offset
275 MPa
–6
(See Expansion Curve, previous page)
Physical Properties
Thermal Conductivity
Mechanical Properties (Annealed)
40,000 psi
Elongation, % in 2 in.(5.08cm)
35
Hardness (Vickers equivalent)
Modulus of Elasticity
125
141,000 MPa
Poisson's Ratio
20,500,000 psi
0.29
NOTES: 1) By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult your supplier to
discuss the range of possibilities available.
2) Cold worked or machined Invar may require stress-relieving for high-precision applications:
a) 1525 °F - 30 min; water quench;
b) 600 °F - 1 h; air cool
c) 205 °F - 48 h; air cool
22
Nickel Beryllium Alloy*
This is basically a nickel-base beryllium
titanium alloy extensively used in springs,
contacts and connectors, diaphragms and
bellows, feather valves, clamps, clips and
bearing retainers.
It derives high strength from cold work
and age hardening and exhibits excellent
corrosion and fatigue resistance as
well as stress relaxation resistance,
wear and abrasion resistance.
It is readily formable before or after aging.
*UNS N03360
23
Table 8
Properties of Nickel Beryllium
Thermal Expansion Coefficient
13.9 × 10–6 cm/cm/°C
8.0 × 10–6 in/in/°F
Density
8.55 g/cc
0.309 Ib/in3
Thermal Conductivity
48 W(m• °K)
336 Btu⋅in/h⋅ft2⋅°F
20-550 °C (68-1022 °F)
Physical Properties
Electrical Conductivity
Soln. H.T. & Cold Rolled
4% IACS
Soln. H.T. & Age Hardened
7% IACS
Melting Point
1379 °C
2515 °F
Modulus of Elasticity
200,000 MPa
29,500,000 psi
Mechanical Properties (Typical)
Temper
Annealed
¼ Hard
½ Hard
Hard
Annealed + Aged
¼ Hard + Aged
½ Hard + Aged
Full Hard + Aged
Tensile Strength
MPa
ksi
655-895
758-1033
895-1207
1069-1310
1480 (min)
1585 (min)
1689 (min)
1860 (min)
95-130
110-150
130-175
155-190
215 (min)
230 (min)
245 (min)
270 (min)
Yield Strength
(0.2% offset)
MPa
ksi
276-482
448-860
792-1170
1032-1310
1033 (min)
1207 (min)
1380 (min)
1585 (min)
24
40-70
65-125
115-170
150-190
150 (min)
175 (min)
200 (min)
230 (min)
Elongation in
2 in. (50.8 mm),
%
Hardness,
HV
30
15
4
1
12
10
9
8
106-200
153-293
160-383
180-491
343-528
383-598
395-695
446-695
Nickel 200, 201, 205, 233, 270/290*
The intrinsic saturation induction
value for nickel 200 is about 6000 G,
for high purity nickel about 6200 G.
The initial permeability of nickel 200
is about 200 and the maximum
permeability is about 1000 at H = 20
Oe; for high purity nickel the values are
about 200 and 2000 to 3000, respectively,
at H = 1 Oe.
The coercivity of nickel has been
measured at 0.7 to 2.7 Oe, greatly
affected by fabrication and heattreatment.
Nickel has one of the largest
magnetostrictive effects available in
commercial materials and is extensively
used in devices when this is required.
The commercially pure nickels can be
obtained in several grades, with slightly
different compositional modifications
for special needs. All grades are
characteristically strong, ductile and
corrosion-resistant over a wide
temperature range.
Properties of nickel are shown in
Table 9 and Figs 9 and 10.
Typical applications of wrought nickel
include semi-conductor packaging cans,
high-temperature electrical leads,
magnetostrictive devices, battery plaques
and electron tube cathodes and anodes.
Nickel is readily deep drawn, spun,
coined, etched, welded and brazed.
Nickel is one of the three elements (iron
and cobalt are the others) that are strongly
magnetic at ambient temperatures.
Studies indicate that the magnetic
properties of really clean pure nickel films
are the same as for bulk nickel. The Curie
point for nickel (the temperature at which
the change from ferromagnetism to
paramagnetism occurs) is affect by prior
thermal and mechanical treatment and the
nature and amount of impurities present.
Most alloying elements (except cobalt and
iron) lower the Curie point.
*UNS N02200, N02201, N02205, N02233,
N02270/N02290
25
26
99.00 min
99.97 min
233
270/
290
201
99.00 min
99.00 min
200
205
Nickel (plus Co)
99.00 min
Nickel
Chemical Composition, %
Cu (max)
0.001
0.10
0.15
0.25
0.25
Fe (max)
0.005
0.10
0.20
0.40
0.40
0.001
0.30
0.35
0.35
0.35
Mn (max)
0.02
0.15
0.15
0.02
0.15
C (max)
0.001
0.10
0.15
0.35
0.35
Si (max)
0.001
0.008
0.008
0.01
0.01
S (max)
Table 9 Properties of Commercially Pure Nickel
0.001 Crmax
0.001 Mgmax
0.001 Crmax
0.001 Timax
0.005 Timax
0.01/0.1 Mg
0.01/0.08 Mg
0.01/0.05 Ti
Other
high purity, exceptionally free from
metallics, best thermal and electrical
conductivity. Useful for etching,
stamping and deep drawing
requirements.
tough, ductile, corrosion resistant,
general purpose nickel, formerly "A"
Nickel. Standard for many electrical
and electronic applications.
low carbon grade particularly suitable
to spinning and coining; low rate of
work hardening. Etching and deep
drawing grade.
specially selected to narrow chemical
analysis range; formerly Electronic
grade "A" Nickel.
specially produced at closely controlled
low residual element levels, used particularly for active cathodes. Specified
for deep drawn cans where Nickel
200 chemistry is not suitable.
Comments
Table 9 Properties of Commercially Pure Nickel (continued)
Thermal Expansion Coefficient
30-300 °C (86-572 °F)
30-450 °C (86-842 °F)
14.4 × 10–6 cm/cm/°C
14.9 × 10–6 cm/cm/°C
8.3 × 10–6 in./in./°F
8.3 × 10–6 in./in./°F
8.89 g/cc
0.321 lb/in.3
67 W/(m • °K)
79 W/(m • °K)
468 Btu • in./h • ft2 • °F
548 Btu • in./h • ft2 • °F
9.5 microhm • cm
7.5 microhm • cm
360 °C
1435-1450 °C
57 ohm • cmil/ft
45 ohm • cmil/ft
680 °F
2615-2640 °F
620/895 MPa
345/515 MPa
90,000-130,000 psi
50,000-75,000 psi
485/795 MPa
105/205 MPa
70,000-115,000 psi
15,000-30,000 psi
Physical Properties
Density
Thermal Conductivity
20-100 °C (68-212 °F)
Nickel 270:
Electrical Resistivity
20 °C (68 °F)
Nickel 270:
Curie Temperature
Melting Range
Mechanical Properties
Tensile Strength
cold worked
annealed
Yield Strength, 0.2% offset
cold worked
annealed
Elongation, % in 2 in.(5.08cm)
cold worked
annealed
Hardness (Vickers equivalent)
cold worked
annealed
Modulus of Elasticity
Tension
Torsion
Poisson’s Ratio (longitudinal)
ASTM method (longitudinal)
dynamic calc.
2-15
40-55
210 min
114 max
204 MPa
80 MPa
29,600,000 psi
11,600,00 psi
0.287
0.264
NOTE - These properties are typical of Nickel 200 (N02200). Properties of the other nickel grades differ slightly depending on their composition.
The significant differences in thermal and electrical conductivity values of nickel 270 (N02270) are noted.
NOTE - By controlling the processing variables, the mill can effect changes in the above mechanical properties. It is suggested that you consult
your supplier to discuss the range of possibilities available.
SPECIFICATIONS
Nickel 200 – ASTM B 160, B 161, B 162
Nickel 201 – ASTM B 160, B 161, B 162
SAE-AMS 5553
Nickel 205 – ASTM F 9, B 162
Nickel 233 – ASTM F 1, F 2, F 3, F 4
27
Fig 9 Thermal conductivity of nickel alloys
Fig 10 Linear thermal expansion of Nickel 200
28
Copper Alloy C72500
Resistance to Stress
Relaxation
C72500 is a copper-nickel-tin alloy
developed for electronic applications
where a combination of excellent
solderability, high strength and
resistance to stress relaxation is
required (Table 10 and Fig. 11).
Applications of C72500 include: connector
and relay springs, clips, lugs, spade terminals, wire wrap and posts and printed
circuit board card edge connector contact posts.
C72500 is superior to phosphor bronze
alloy C51000 in this important spring
property in the highly worked condition.
This advantage should also be true in
other common commercial tempers.
Directionality
Economical use can be made of
C72500 because the transverse and
longitudinal properties are quite similar,
allowing design freedoms. Directionality
is similar to the nickel-silver alloys.
Other Properties
Corrosion Resistance
Copper alloy C72500 combines
excellent corrosion resistance with
superior oxidation resistance at ambient
conditions. It is possible to eliminate a
protective plating for many uses
because of this combination of properties. Alloy C72500 wire has successfully
passed the test for electrolytic stresscorrosion cracking susceptibility to
nitrate salts in high-humidity conditions.
The alloy shows excellent resistance to
stress corrosion cracking in most
ammoniacal environments.
Fabricability
C72500 may be formed by any of the
conventional fabrication techniques. It
often does not require gold plating for
solderability; thus it is possible to
realize cost savings by selective plating
or cladding only in the contact areas.
C72500 is available in the following mill
forms: sheet, strip, plate, wire, and tubing.
Solderability
The corrosion and oxidation
resistance of C72500 imparts excellent
solderability. After exposure at 150°F
and 100% relative humidity for two
years, C72500 was still solderable.
Fatigue Strength
8
Reverse bending fatigue life at 10
cycles is comparable with other copperbase spring materials at equivalent
tempers. Higher levels of cold working
increases the fatigue strength of C72500
over similarly cold-worked phosphor
bronze.
29
Table 10 Properties of C72500
Chemical Composition, %
Nickel
9
nominal
Tin
2
nominal
Manganese
0.30
maximum
Iron
0.60
maximum
Zinc
0.50
maximum
Lead
0.05
maximum
Copper
Balance
Physical Properties
Density
0.321 lb/in.3
8.89g/cc
Melting Point
2064 °F
1129 °C
335 Btu • in./h • ft2 • °F
47.8 W/(m • °K)
Thermal Conductivity
at 68 °F (20 °C)
Electrical Conductivity
68 °F (20 °C)
11% IACS
Electrical Resistivity
68 °F (20 °C)
94 ohm • cmil/ft
15.6 microhm • cm
9.2 × 10–6 in./in./°F
16.6 × 10–6 cm/cm/°C
Thermal Expansion
77 °-572 °F (25 °-300 °C)
Mechanical Properties
Temper
(% Reduction)
Soft (0)
¼ Hard (11)
½ Hard (21)
Hard (37)
Ex-Hard (50)
Spring (60)
Super Spring
(~ 95)
Tensile
Strength,
ksi
MPa
55
60
70
82
87
95
115
380
415
480
565
600
655
790
Yield
Strength
@ .2% (offset) @ .01%
23
53
66
78
84
89
110
17
32
40
49
51
55
70
30
Elongation
in 2 in. (50.8 mm),%
37
20
6
2
1.5
1.5
1.5
Hardness
Hardness
HRB
Vickers
45
71
78
85
88
90
99
–
127
144
165
176
185
234
Fig 11 Mechanical properties of copper-nickel-tin alloy
C72500 (Composite average data vs rolling direction
for combined gages)
31
Fig 11 Mechanical properties of copper-nickel-tin alloy
C72500 (Composite average data vs rolling direction
for combined gages) (Continued)
32
Copper Alloy C76200
Directionality
C76200 is a nickel silver alloy (59Cu12Ni-29Zn) that has excellent cold
working characteristics and good ductility
in hard tempers (Table 11 and Fig. 12).
Applications of C76200 include currentcarrying springs for relays, condensers,
rheostats and other components and
assemblies where soldering, brazing and
plating are necessary.
There is little difference in the
transverse and longitudinal mechanical
properties of C762000 and it is
unnecessary to make allowances for
directionality in designing with this
alloy.
Fabricability
C76200 can be formed by any of the
conventional fabricating procedures.
It has excellent cold working
characteristics, retaining useful
formability after cold rolling to high
strength levels. Thus, parts requiring
severe bending, such as springs, which
would fracture in more brittle metals,
can be made in C76200.
Other Properties
Corrosion Resistance
C76200 has good resistance to
tarnishing and corrosion in industrial,
marine and rural atmospheres. The
nickel content of this alloy makes it
more resistant to stress-corrosion cracking than copper-zinc yellow brass.
Resilience and Stiffness
Solderability and Plateability
The relatively high modulus of
elasticity of C76200 (18,000 ksi) makes it
a spring material with the ability to
maintain good contact pressures and at
the same time can be displaced more
than steel without taking a permanent
set. This combination of properties
provides a damping characteristic
important in stacked springs used in
communications equipment where
minimum vibration is desired.
C76200 has good solderability and
can be joined readily with lead-tin
solders using conventional activate
resin fluxes. The minimal non-refractory
oxide film formed on C76200 is easily
removed for plating or brazing as well.
Fatigue Strength
Reverse bending fatigue life of C76200
8
alloy at 10 cycles is similar to that of
other copper-nickel-zinc alloys at
equivalent tempers (23000 to 33000 psi).
With its superior corrosion resistance,
the corrosion-fatigue life of C76200 is
superior to that of the copper-zinc
brasses in many environments.
Resistance to Stress
Relaxation
The behavior of C76200 is similar to
that of C77000. Recent 1000-hour tests
at room temperature have shown relaxation ranging from 0.5% under an initial
surface stress of 10.9 ksi (75 MPa) to
9.5% under an initial surface stress of
71 ksi (489 MPa).
33
Table 11 Properties of C76200
Chemical Composition, %
Copper
59
Nickel
12
nominal
nominal
Lead
0.10
maximum
Iron
0.25
maximum
Manganese
0.50
maximum
Total Other Elements
0.05
maximum
Zinc
Balance
Physical Properties
Density
0.310 Ib/in.3
8.58 g/cm3
Melting Point
1900 °F
1040 °C
864 Btu • in./h • ft2 • °F
41.9 W/(m • °K)
9% IACS
0.05 megmho • cm
115 ohm • cmil/ft
19 microhm • cm
8.5 × 10–6 /°F
16 × 10–6 /°C
Thermal Conductivity
68 °F (20 °C)
Electrical Conductivity
68 °F (20 °C)
Electrical Resistivity (annealed)
68 °F (20 °C)
Thermal Expansion
68°-572 °F (20°-300 °C)
Modulus of Elasticity (tension)
18,000,000 psi
124,000 MPa
Modulus of Rigidity
6,800,000 psi
46,800 MPa
Mechanical Properties (Typical)
Temper
(% Reduction)
Annealed (0)
¼ Hard (11)
½ Hard (21)
Hard (37)
Ex-Hard (50)
Tensile
Strength
ksi
MPa
58
400
73
505
83
570
98
675
108
745
Yield Strength
(0.5% Extension)
ksi
MPa
33
225
52
360
70
480
90
620
98
675
34
Elongation in
2 in. (50.8 mm),
%
44
35
18
4
2
Hardness
HRB
44
73
85
92
96
Vickers
86
132
164
188
220
Fig 12 Mechanical properties of
nickel-silver alloy C76200
35
Fig 12 Mechanical properties of
nickel-silver alloy C76200 (Continued)
36
Copper Alloy C77000
Directionality
C77000 is a nickel silver alloy (55Cu18Ni-27Zn) that work hardens to a yield
strength that is superior to that of most
other copper-base alloys (Table 12 and
Fig. 13). Applications of C77000 include
relay springs, multi-point circuit board
connectors and sockets, and low profile
soldered and wire-wrap sockets for
integrated circuits.
The transverse and longitudinal
properties of C77000 are quite similar
and, therefore, it is not necessary to
make allowances for directionality in
designing parts to be produced from this
alloy.
Fabricability
C77000 may be fabricated by all of the
conventional forming techniques. It has
excellent cold working characteristics.
C77000 is available in the following mill
forms: sheet, strip, tube, rod and wire.
Other Properties
Corrosion Resistance
C77000 has good resistance to
tarnishing and corrosion in industrial,
marine and rural atmospheres and in
fresh and saline waters. The alloy can
be used without a protective coating in
applications involving sliding of one surface over another. The nickel content of
this alloy increases its resistance to
stress corrosion cracking in ammoniacal
environments over that of simple copperzinc alloys of equivalent copper content.
Solderability
C77000 has good solderability and
can be joined readily with soft solders
using normal activated resin fluxes.
Fatigue Strength
8
Reverse bending fatigue life at 10
cycles is higher than that of the
phosphor bronzes at equivalent tempers.
Recent tests of C77000 hard temper
sheet showed a fatigue strength of
35 ksi 241 MPa (24.6 kgf/sq mm) at
8
10 cycles.
Resistance to
Stress Relaxation
C77000 occupies an intermediate
position between phosphor bronze and
beryllium copper in resistance to stress
relaxation at room temperature.
37
Table 12 Properties of C77000
Chemical Composition, %
Copper
55
nominal
Nickel
18
nominal
Lead
0.10
maximum*
Iron
0.25
maximum
Manganese
0.50
maximum
Total Other Elements
0.50
maximum
Zinc
Balance
* For rod and wire, maximum is 0.05%.
Physical Properties
Density
0.314 Ib/in.3
8.70 g/cm3
Melting Point
1930 °F
1055 °C
612 Btu • in./h • ft2 • °F
29.3 W/(m • °K)
5.5% IACS
0.0319 megmho • cm
189 ohm • cmil/ft
31.4 microhm • cm
9.3 × 10–6 /°F
16.7 × 10–6 /°C
Thermal Conductivity
68 °F (20 °C)
Electrical Conductivity
68 °F (20 °C)
Electrical Resistivity (annealed)
68 °F (20 °C)
Thermal Expansion
68°-572 °F (20°-300 °C)
Modulus of Elasticity (Tension)
18,000,000 psi
124,000 MPa
Modulus of Rigidity
6,800,000 psi
46,800 MPa
Mechanical Properties (Typical)
Temper
(% Reduction)
Annealed (0)
Hard (37)
Ex-Hard (50)
Spring (60)
Tensile
Strength
ksi
MPa
60
413
100
689
108
745
115
793
Yield Strength
(0.5% Extension)
ksi
MPa
27
185
85
585
90
620
–
–
38
Elongation in
2 in. (50.8 mm),
%
40
3
2.5
2.5
Hardness
HRB
55
91
96
99
Vickers
100
190
216
234
Fig 13 Mechanical properties
of nickel-silver alloy C77000
39
Spinodal Copper Alloy C72900
C72900 is a new copper-nickel-tin
alloy with exceptionally high elastic
strength levels, resistance to stress
relaxation at elevated temperatures,
excellent dimensional stability after forming and heat-treating and excellent
corrosion resistance. This combination
provides designers with new
possibilities for high-performance
miniaturized sockets, connectors,
springs and other precision-stamped
parts in electronics applications.
Properties are shown in Table 13 and
Figs. 14, 15, 16, and 17.
Excellent plateability, solderability,
corrosion resistance and nearly constant
electrical conductivity up to 250°C are
additional attributes.
Note.—Much of the data on C72900 is
from “Demands on Connectors Lead to
New Materials Development,” W.T.
Ward, Electronics , June 1984.
40
Table 13 Properties of C72900
Chemical Composition, %
Copper
77
nominal
Nickel
15
nominal
Tin
8
nominal
Manganese
0.05-0.30
Iron
0.50
maximum
Zinc
0.50
maximum
Columbium
0.10
maximum
Magnesium
0.15
maximum
Lead*
0.02
maximum
Density
0.323 lb/in.3
8.40 g/cm3
Melting Point
1742 °F
950 °C
612 Btu • in./h • ft2 • °F
29.7 W/(m • °K)
* 0.005 if hot rolled.
Physical Properties
Thermal Conductivity
68 °F (20 °C)
Electrical Conductivity
68 °F (20 °C)
7.8% IACS
0.043 megmho • cm
392 °F (200 °C)
7.3% IACS
0.041 megmho • cm
9.1 × 10–6 /°F
17 × 10–6 /°C
Modulus of Elasticity (Tension)
18,500,000 psi
127,000 MPa
Modulus of Rigidity
7,500,000 psi
51,700 MPa
Thermal Expansion
68°-572 °F (20°-300 °C)
Tensile Properties at Various Tempers
ASTM B601
Ultimate Tensile Strength
Temper
ksi
MPa
As rolled (after soln. treat & C.W.)
TB00
TD01
TD02
TD04
TD08
TD12
64-85
74-100
85-110
100-125
122-140
135-150
Yield Strength (.05% offset)
ksi
MPa
%E
441-585
509-689
441-758
689-861
840-965
930-1034
24-34
50-66
65-84
85-108
100-125
110-130
165-234
345-455
448-579
441-744
689-861
758-896
32
18
8
<2
<2
<2
105-135
120-146
130-154
145-167
160-184
165-197
723-930
827-1006
896-1061
999-1151
1102-1268
1137-1357
60-102
90-117
105-128
130-147
145-166
152-175
413-703
620-806
723-882
896-1013
999-1145
1047-1206
10
8
5
3
2
<2
110-125
120-133
130-142
140-155
150-178
758-861
827-916
869-978
965-1068
1034-1226
75-95
90-110
105-125
120-145
140-170
517-655
620-758
723-861
827-999
965-1171
26-36
20-30
14-24
8-16
2-10
Hardness
HR30N
Aged (after spinodal H.T.)
TX00
TS01
TS02
TS04
TS08
TS12
Mill Hardened
TM00
TM02
TM04
TM06
TM08
Note: Data from Connectors and Interconnections Handbook - Vol. 4., Electronic Connectors Study Group, 1983
41
36-44
43-48
47-52
50-55
52-58
Fig 14 Yield strength vs
ductility of C72900 alloy
42
Fig 15 Bend formability
of C72900 alloy
43
Fig 16 Thermal relaxation
of C72900 alloy
44
Fig 17 Electrical conductivity vs
temperature of C72900 alloy
45
Stainless Steel Alloys
AISI 301* and 304*
AISI 304 and 304L
AISI 301 and 304 are two widely-used
18Cr-8Ni stainless steels, work
hardenable to high strength levels and
with excellent corrosion resistance,
weldability and formability. The outstanding spring properties developed in
AISI 301 at both ambient and elevated
temperatures lead to its application in
non-current carrying springs of all sizes.
The corrosion resistance and fabricability
of AISI 304 lead to many uses as
structural members of components and
protective enclosures for system
assemblies where strength, toughness,
durability and protection from
aggressive and corrosive environments
are necessary. Composite stainless strip
using precious metal cladding, inlay or
plating makes it possible to obtain the
structural and spring properties of
stainless steel with the contact
properties of a highly conductive metal
stripe, spot or layer at an economical
cost.
Properties of AISI 301 and 304 are
shown in Table 14.
Type 304 (and its low-carbon variant
304L), the most widely used stainless
grade, will withstand ordinary rusting, is
immune to most food processing environments, organic chemicals, dyestuffs and
a wide variety of inorganic chemicals. It
resists many oxidizing acids (e.g., nitric
acid, cold concentrated sulfuric acid,
peracetic acid). It can be used in electronic packaging applications or as a structural or enclosure material for electronic or
electrical components and systems where
high reliability and protection from aggressive or corrosive environments are
necessary.
Type 304L is used where the regular
carbon grade would be sensitized to intergranular corrosion, as by welding or hotforming during fabrication. Titanium- or
columbium-stabilized variants (e.g., Types
321 or 347) are used for elevated temperature service.
AISI 301
AISI 301 stainless steel, because of
its higher carbon and lower alloy content, can be work hardened to higher
strength levels than other austenitic
grades. It is widely used in electrical
and electronic spring applications
where excellent spring characteristics,
endurance limits and high stress
relaxation properties combined with
corrosion resistance are needed.
The effect of cold work on AISI 301
is shown in Fig. 18.
*UNS S30100 and S30400
46
Table 14 Properties of Stainless Steel
Chemical Composition, %
AISI 301
(S30100)
AISI 304
(S30400)
AISI 304L
(S30403)
Carbon
Manganese
Phosphorus
Sulfur
Silicon
Chromium
Nickel
0.15
2.00
0.045
0.030
1.00
16.00-18.00
6.00-8.00
0.08
2.00
0.045
0.030
1.00
18.00-20.00
8.00-10.50
0.03
2.00
0.045
0.030
1.00
18.00-20.00
8.00-12.00
Molybdenum
Iron
–
Bal.
–
Bal.
–
Bal.
Physical Properties of AISI 301 and 304
Melting Point
2550-2650 °F (1398-1454 °C)
Density lb/in3(kg/m3)
0.29 (8060)
Specific Heat btu/Ib/°F
0.12 (503)
(J/kg/K)32-212 °F(0-100 °C)
Thermal Conductivity btu/h/ft2/
ft/°F(J/kg/°K)212 °F(100 °C)
932 °F(500 °C)
9.4 (0.113)
12.4 (0.149)
Mean Coeff. of Thermal Expansion
x 10–6 /°F( × 10–6 /°C)
32-212 °F(0-100 °C)
9.6 (17.3)
32-600 °F(0-315 °C)
9.9 (17.9)
32-1000 °F(0-538 °C)
10.2 (18.4)
32-1200 °F(0-648 °C)
10.4 (18.8)
Modulus of Elasticity Tension, psi (MPa)
Torsion, psi (MPa)
29,000,000 (193,000)
12,500,000 (86,200)
47
max
max
max
max
max
Fig 18 Effect of cold work on
mechanical properties of
Type 301 stainless steel
48
Nickel Electroplating
Evaluation and Testing,
Preparation and Elimination of Rejects
Electrodeposited nickel is widely used
in electronic components and parts to
improve corrosion resistance as a
barrier underplate between a basis
metal and a gold or silver contact or
bonding area, to prevent migration of
aluminum dendrites or copper atoms
into the precious metal.
Corrosion and Porosity Tests
Examination of the coated part after
immersion in hot water for 2 to 5 hours
for rust is one technique used in studying the corrosion resistance of plated
steel. The number of rust spots in a
given area is then used as the qualification for accepting or rejecting the piece.
Modifications of this test include immersion for up to 5 hours in distilled water,
in distilled water saturated with carbon
dioxide, or in distilled water containing
0.5 per cent by weight sodium chloride,
at test temperatures of 82 to 85°C (180
to 185°F).
Several salt spray tests have been
used to simulate marine environments.
These tests are commonly used to
evaluate nickel and nickel-chromium
coatings on ferrous and non-ferrous
substrates. The salt spray tests are also
used as accelerated quality control tests
and are described in the following ASTM
standards:
The producer and end-user of a plated
article are always concerned with the
quality of the end-product. Methods that
measure the thickness, the adhesion,
and the corrosion resistance of the
coating are available as means of
quality control. Properties such as
porosity, ductility, tensile strength,
internal stress, hardness, and wear
resistance are important in industrial
nickel plating applications and can be
measured to control the quality of
electroplating articles.
Evaluation and Testing
1) Salt Spray (ASTM B 117).
Thickness
2) Acetic Acid-Salt Spray (ASTM
B 287).
Accurate methods for determining the
thicknesses of electrodeposited
coatings can be found in ASTM and
other national and international standards. Equipment is available for tests
involving magnetic (ASTM B 530), X-ray
fluorescence, magnetic inductance (ISO
2178), beta backscatter (ASTM B 567),
and coulometric (ASTM B 504)
measurements of thickness. Micrometer
readings are often used to determine the
thickness of a coating at a particular
point when the deposit thickness
exceeds 125 µm (0.005in). ASTM B 487
describes a method based on
metallographic examination of cross
sections of the plated object.
3) Copper-Accelerated Acetic AcidSalt Spray (CASS Test: ASTM B
368).
The ferroxyl test is another porosity
test which is employed for coatings on
ferrous metal substrates and involves
the formation of Prussian blue color
within exposed pits. The solution utilizes
sodium chloride and potassium ferricyanide as reagents to develop the
color.
The only truly satisfactory method of
establishing the relative performance of
various coating systems is by service
testing. Care should, therefore, be exercised in interpreting the results of
49
Ductility
accelerated corrosion tests. Once an
acceptable service life has been determined for a specific thickness and type
of coating, the performance of other
candidate coatings may be compared in
accelerated corrosion tests to the performance obtained with the coating for
which an acceptable service life has
been established.
Most of the tests that have been used
for evaluating the ductility of plated
coatings are rather qualitative in nature.
Two bend tests are described in ASTM B
489 and B 490. Both of these procedures
require a minimum amount of equipment.
Another method for measuring the
ductility of thick deposits is to determine the elongation of a specimen in
a tensile testing machine. This method
is limited to relatively thick foils of
controlled geometry and thickness.
A method specifically designed for
plated thin foils has been used and is
known as the hydraulic bulge test.
Hardness
Hardness measurements involve
making an indentation on the surface (or
cross section for thin coatings) of the
deposit. The indenter has a specified
geometry and is applied with a specified
load. In the case of industrial nickel
coatings, the most common hardness
determination is the Vickers method of
forcing a diamond point into the surface
under a predetermined load (normally
100). This provides a measure of that
surface to permanent deformation under
load. The figure obtained is not
necessarily related to the frictional
properties of the material nor to its
resistance to wear or abrasion.
Adhesion
The adhesion of a coating to the basis
material is important. In general, the
adhesion between a nickel coating and
the basis material exceeds the tensile
strength of the weaker material. As a
result, when a force is applied to a test
specimen which tends to pull the coating
away from the basis metal, separation
occurs within one of the two metals
rather than at the boundary between the
basis metal and the nickel coating. A
number of qualitative tests have been
used which utilize various forces applied
in a multitude of directions with regard
to the composite basis metal and
coating, such as hammering, filing,
grinding, and deforming.
Two tests are recommended in ISO
1456 and 1457. The first is a simple file
test where a sample is held in a vise and
the file is used at an angle of 45° in an
attempt to raise the deposit–poorly
adherent deposits are easily raised. The
second test involves heating the sample
or component in an oven (to 300°C
(572°F) for steel, 150°C (302°F) for zinc
alloys and 250°C (482°F) for copper
alloys), followed by quenching by water
at room temperature. The rapid contraction of the metal detaches any poorly
adherent deposit.
Tensile Strength
The measurement of the tensile
strength of an electrodeposited coating
is performed after the coating is
separated from the basis metal; and
the coating is then pulled in a tensile
machine. In general, plating plant
operators seldom perform this test.
Internal Stress
The magnitude of internal stress
obtained in deposits is determined by
plating onto one side of a thin strip of
basis metal and measuring the force
causing the strip to bend. One method
used in commercial practice involves
plating the exterior surface of helically
wound strip and measuring the resultant
change of curvature. Another method is
based on the flexure of a thin metal
disc.
50
receptivity to electroless nickel coating
as follows:
Preparation of Basis
Metals for Plating
1) Directly Coated – iron, cobalt,
nickel, platinum metals,
aluminum, beryllium and titanium
alloys (aluminum, beryllium and
titanium require special pretreatment and post-plating heat treatment to insure adequate adhesion.)
2) Indirectly Coated by Galvanic
Initiation – preliminary electrolysis or contact to a catalytic
metal is required for copper,
silver, gold, carbon, vanadium,
molybdenum, tungsten,
chromium, selenium, and
uranium.
3) Indirectly Coated by First
Nickel plating for engineering and
industrial uses requires a sound bond
between the substrate and the coating.
The coating should adhere tightly to the
basis material. A sound metallurgical
bond may be achieved on most
materials.
The selection of grinding, polishing,
pickling and conditioning treatments for
a variety of basis metals varies from one
material to another, and depends on the
initial surface condition of the metal. The
activating treatments which follow,
polishing and cleaning operations are
listed in Table 15 for the basis metals
most commonly plated. The ASTM standards referred to provide additional
information. Table 16 gives selected
procedures for the preparation of less
commonly plated basis metals which
are coated with nickel.
Units commonly used in the plating
industry are listed in Table 17.
Alloys containing lead, on the surface
or as part of the composition of the
metal being plated, can lead to poor
adhesion. The presence of lead can
be overcome by a cleaning cycle that
includes, for example, a combination of
fluoboric plus other mineral acids in the
acid part of the cleaning cycle.
Non-conductive plastics and other
materials can be plated by metallizing
the material, using etching and catalyzing techniques. The mechanism of adhesion between metal and plastic is not
fully known. A mechanical “locking” or
“keying” action may take place at the
plastic to metal interface and thereby
provides for a moderately adherent
deposit. Further information on plating of
plastics may be obtained by contacting
plating supply houses.
A clean surface is as essential in electroless nickel plating as it is in normal
electroplating. Certain metals, however,
cannot be coated directly with electroless nickel because they do not
catalyze the reduction of nickel. Metals
can be categorized with respect to
Striking with Copper or Other
Metal – bismuth, cadmium, tin,
lead, and zinc.
In the case of electroless nickel plating
on certain metals, heat treatment
improves the adhesion between the
coating and the substrate. For
aluminum, titanium, nickel, and steel
alloys, the following heat treatments are
recommended:
Aluminum & Alloys
Steel
Nickel & Alloys
Titanium
140°C
175°C
210°C
400°C
(284°F)
(347°F)
(410°F)
(752°F)
1h
3h
6h
1h
Elimination of Rejects
On average, platers are likely to lose
three per cent of output due to rejects.
Rejects arise mainly from the following
defects:
Blistering or detached plating
Pitting
Roughness
High stress and low ductility
Discoloration or poor mechanical properties at low-current-density areas
Burning (cracking) at high-currentdensity areas
Accidental damage
Poor preparation of the basis metal
51
Table 15 ASTM recommended practices for preparing metals for plating
Conditioning Step 1
Solution
Conditioning Step 2 (if needed)
Basis Metal
ASTM
Operation
Solution
Aluminum
alloys
B 253 Alkaline zincate
Immerse long
enough to deposit
.02 to .05 mg
Zn/ cm2
Copper alloys
B 281 Sulfuric or hydrochloric acid soln.
Acid dip
Iron castings
B 320 Sulfuric or hydrochloric acid soln.
Room temp
Brief dip
Cold water rinse
Lead alloys
B 319 Fluoborate dip
10% HBF4
Dip 10 to 15
seconds
Rochelle type
copper strike.
pH 10.2 to 10.5
Final Rinse
Before Plating
Operation
2
Deposit Cu at 258 A/m
(24 A/ft2) for 2 min then
129 A/m2(12 A/ft2) for 4 min
Double rinse
or spray
Single rinse
or spray
2
Anodic clean
Anodic at 646 to 1076 A/m2
(60 to 100 A/ft2) to remove
smut
Rinse, acid dip,
then cold water
rinse
Cold water rinse
and spray
2
Nickel
B 343 Acid nickel chloride 323 A/m (30 A/ft )
soln. 240 g/L
anodic 2 min
(32 oz/gal) plus
cathodic 6 min
HCI 94 mL/L (12 fl
oz/gal)
Stainless
steels
B 254 65% H2SO4
Cathodic 2 min
Acid nickel chloride
240 g/L (32 oz/gal)
plus HCI 94 mL/L
(12 fl oz/gal)
Cathodic 2 min at
1614 A/m2 (150 A/ft2)
None
Steels,
low carbon
B 183 Alkaline anodic
clean
Anodic at 6 volts
for 1 to 2 min.
Cold water rinse
4 to 10 vol per cent
H2SO4
Dip at room temp for
5 to 15 secs
Cold water rinse
Steels,
high carbon
B 242 Smut removal
Sodium cyanide
soln.
Dip or short
anodic treatment.
Rinse
H2SO4 250 to 1000 g/L
(34 to 134 oz/gal)
plus 125 g/L (17 oz/
gal) Na2SO4
Keep below 25 °C (77 °F)
Anodic at 1076 to
4304 A/m2 (100 to 400 A/ft2)
for not more than 60 sec
Fast rinse
Zinc alloys
B 252 Copper strike soln. Deposit 1.3 µm
Rochelle type
(50 millionths
in.) Cu
Cyanide copper
plating bath
Copper plate 5 µm (0.2 mil)
thick
Cold water
42-50%
Nickel-iron
alloys
25% H2SO4
21-26 °C
None
Anodic at 20 A/dm2
(200 A/ft2) for 3 min.
after onset of
passivity
Rinse
52
53
3. Alkaline clean
4. W
3. Alkaline clean
4. W
5. HF dip
219 mL/L
(28 fl oz/gal)
Time: 10 min
W = water rinse.
v/o = vol. %
W/o = wt. %
12. Heal for 1 h at
500 °C (930 °F)
15. Nickel plate
14. W
13. Cyanide copper
plate
7.6 µm (0.3 mil)
copper deposit
12. W
11. Dow zinc Immersion treatment
11. Dry
10. W
10. W
9. Activating dip
Phosphoric acid
20 v/o
NH4HF2 100 g/L
(13 oz/gal)
for electrodeposited Ni replace steps 9-11
by following:
11. Electroless nickel
(Dow process)
10. W
9. Hydrofluoric dip
54 mL/L
(7 fl oz/gal)
10 minutes
8. W
7. Dow #5 etch
6. W
2. Outgas at 980 °C
(1800 °F)
2h in Hydrogen
2. W
12. Nickel plate
11. W
10. Nickel strike
240 g/L (32 oz/gal)
NiCl2 • 6H2O
94 mL/L
(12 fl oz/gal)
HCI
2
C.D. 538 A/m
2
(50 A/ft )
Cathodic
9. Dip in 50 v/o HCI
8. W
7. Chromium plate
(low contraction)
CrO3 404 g/L
(54 oz/gal)
Sulfate 1/100
2
C.D. 8070 A/m
2
(750 A/ft )
82 °C (180 °F)
6. W
5. Alternate anodic etch
CrO3 100 g/L
(13.4 oz/gal)
Na2Cr2O7 11 g/L
(1.3 oz/gal)
Time: 2 min
21-24 °C (70-75 °F)
2
C.D. 3766 A/m
2
(350 A/ft )
5. Anodic etch
H2SO4(96%) 50v/o
H2PO4(85%) 50v/o
Tine: 2-3 min
2
C .D. 215-1076 A/m
2
(20-100 A/ft )
1. Prepare fresh surface by grinding
1. Degrease and
descale
Molybdenum
16. Heat at 760 °C
(1400 °F) for
2 min
15. Dry
14. W
11. Nickel plate
12. W
11. Nickel strike
Acid NiCl2
10. Etch
HCl (40%) 50 v/o
9. W
8. Chromium plate
CrO3 403 g/L
(54 oz/gal)
Sulfate 1/100
2
C. D. 10760 A/m
(1000 AM)
Temp. 85 °C (185 °F)
7. W
6. Activate
HF (48%) 12.5 v/o
Acetic
(99%) 87.5 v/o
Soak 10-15 min
Connect A.C.
60 cycle 10 mm
2
at 161-323 A/m
2
(15-30 A/ft )
5. Dry
4. W
3. Bright dip
HF (48%) 18.5 v/o
HNO3 (70%) 1 v/o
Temp. 21-24 °C
°
(70-75 F)
½ to 2 min
2. W.
1. Degrease
Titanium
Uranium
9. W
7. Nickel strike
Acid NiCl2
2
60 sec at 430 A/m
2
(40 A/ft )
9. Nickel plate
10. Nickel plate in
Wafts bath
8. W
6. Spray rinse
5. W
7. Neutralize in satd
soln of sod.
bicarbonate
6. Rinse and spray
5. W
4. Dip in clean conc
HNO3 60 sec
at 70 °C (158 °F)
3. Soak in conc HNO3
8 min at 95 °C
(203 °F)
2. W
1. Cathodic alkaline
clean
4. W
3. Chromium plate
Standard soln 100
1 ratio
Time: 20-30 sec
Temp 4957 °C
(120-135 °F)
2
C.D. 2152 A/m
2
(200 A/ft )
2. W
1. Anodic Electropolish trisodium
phosphate 15 w/o
Time: 10-60 sec
Temp 49 °C (120 °F)
Tungsten
Vanadium
Alkaline clean
soak at 82-93 °C
(180-200 °F)
7. Nickel plate
Watts–pH 4.0
60 °C (140 °F)
2
C.D. 54-1076 A/m
2
(5-100 A/ft )
6. W
5. Catholic treatment In
2 w/o H2SO4
Time: 5-15 sec
°
Temp. 24-29 C
°
(70-85 F)
2
C.D. 108-1076A/m
2
(10-100 A/ft )
4. W
3. Etch in 10 w/o HF
2. W
1
Table 16 Preparation of Basic Metals Less Commonly Plated
Magnesium
9. Nickel plate
Watts bath
8. W
7. Nickel strike
Nickel sulfate
142 g/L
(19 oz/gal)
Mg sulfate 75 g/L
(10 oz/gal)
Am. chloride 15g/L
(2 oz/gal)
Boric acid 15 g/L
(2 oz/gal)
Wetting agent
pH 5.5
30 min
32 °C (90 °F)
2
C.D. 161 A/m
2
(15 A/ft )
6. W
5. Add dip
conc HNO3
2 minutes
27-32 °C
(80-90 °F)
4. W
3. Anodic pickle
Phosphoric 10 v/o
Hydrochloric 2 v/o
2 min
27 °C (80 °F)
2
538-1076 A/m
2
(50-100 A/ft )
2. W
1. Degrease
Beryllium
Zirconium
Descale
Nickel plate
Watts bathsod. acetate
15 g/L (2 oz/gal)
pH 4-0
No wetting agent
9
12. Heat at 677 °C
(1250 °F) for
30 min in vacuum
11. Dry
10. W
W
Etch (U.S 2.711.389)
NH4F 36 g/I
(4.8 oz/gal)
HF 148%) 31 g/L
(41 oz/gal)
Time. 1-3 min
Temp 38 °C (100 °F)
W
Chemical polish
(U.S. 2.711.364)
NH4HF2 100 g/L
(13.3 oz/gal)
HNO3(70%) 40v/o
H2SiF6(48%) 20v/o
Time 45-180 sec
Temp 38 °C (100 °F)
W
Alkaline clean
8
7
6
5
4
3
2. Outgas at 204 °C
(400 °F) 2-4 h
1
Table 17 SI Units for the Plating Industry
To convert from
A to B
B to A
Multiply by
Quantity
A
Conventional unit
B
SI unit
Coating
thickness
mil (= .001 in.)
(in.)
µm
mm
Coating
weight
mg/in.2
2
mg/in.
2
oz/in.
oz/ft2
g/m2
2
mg/cm
2
kg/m
kg/m2
1.55
0.155
43.9
0.305
Current
density
A/ft
A/in.2
2
A/in.
A/m2
A/m2
2
A/cm
10.76
1550
0.155
.0929
6.45 × 10–4
6.45
2
As/m - µm
1530
6.55 × 10
Plating rate
2
Ah/ft - mil
2
3
Volume
gallon
Mass
concentration
oz/gal
m
L
mL
g/L
3
kg/m
Volume
concentration
fl oz/gal
mL/L
3
cm /L
fl oz
Pressure
1000 psi
25.4
25.4
.00379
3.79
29.6
2
MPa (MN/m )
ASTM Committee B 08, Subcommittee 1.
54
.0394
.0394
0.645
6.45
.0228
3.28
–4
264
0.264
.0338
7.49
0.134
7.81
0.128
6.89
0.145
Too low a concentration of wetting
agent
Blistering or Detached Plating
Process blisters which occur during,
or immediately after, plating on zincbased diecastings are generally due to
subsurface porosity and surface
imperfections such as cold shuts and
local sites of corrosive attack that
sometimes occur on stored, unplated
diecastings. The components should be
carefully inspected by the plater before
acceptance for plating. Unplated
diecastings should be wrapped if they
are to be stored for long periods.
Lack of adhesion may be due to:
Other causes of pitting are:
The presence of organic contaminants
Presence of copper ions and other
inorganic contaminants
Incomplete cleaning of the basis
metal
Incomplete solution of additions of the
leveling agent coumarin which, at
plating temperatures, forms oily
globules which settle on the work to
form characteristically wide, shallow
pits
Incomplete removal of grease, oil or
oxides
Formation of metal soaps from
polishing compounds
Roughness
This is caused by the incorporation in
the deposit of insoluble particles present
in the solution. These particles arise
from:
Films of silica from cleaning
solutions or chromate trapped in
damaged coatings on racks and then
returned to the cleaning solution
Incomplete cleaning
Incorrect application of such
intermediate deposits as cyanide
copper, acid copper and acid
chloride solutions
Detached flakes of deposit from the
racks
Dust carried into the vat by air currents
and the air-agitation pipes
Pitting
Metallic residues from the anode
Most pitting is caused by adhesion of
air or hydrogen bubbles to the work. Air
bubbles occasionally appear in a solution which has been heated after standing cold for some time, during which it
dissolves air. The cure is to heat the
solution above its normal operating
temperature for a short period to expel
the air. If air leaks into the filtration
system and forms bubbles within a
critical range of size, these will cling to
the cathode and cause pitting.
Pitting from adherent hydrogen
bubbles can result from:
Insoluble salts in the solution caused
by incorrect composition or
contamination
Airborne dust can be controlled by
installing the surface-preparation and
polishing workshops well away from the
plating area, providing an adequate
supply of clean air, removing dirt from all
areas near and above the vats and
protecting the vats against condensation
droplets which tend to carry dissolved
dirt into the solution.
Anode residues must be retained
within the anode bags. Escape of
residues into the solution can be caused
by:
A solution which is chemically out of
balance
Too low a pH
Inadequate agitation
Faulty bags or bags of inferior quality
Incorrect racking of complicated
components
Disturbance of the bags
55
Accidentally raising the solution level
above the normal working level (this
may cause the solution to wash over
the top of anode baskets)
High- or Low-CurrentDensity Effects
Discoloration or inadequate
mechanical properties can be caused in
low-current-density areas as a consequence of metallic contamination of the
solution. The effects can be examined
systematically by plating over a
reproducible range of current densities
on a Hull-cell cathode under standard
conditions. Burning may occur at highcurrent-density areas as a result of
phosphate entering the solution via
contaminated activated carbon. When
phosphate has been introduced accidentally the maximum current density
2
2
should be reduced to 4.0 A/dm (40 A/ft )
to minimize burning.
Burning can also be caused if the full
rectifier output is applied to the lowest
components on a rack being lowered
into the solution. This can be avoided by
applying a reduced current during
immersion.
Pieces of nickel which drop to the
bottom of the vat and become bipolar,
where they dissolve in the solution
and, since they are outside the anode
bags, their residues are released into
the solution
Anodes should always be withdrawn
slowly from the plating solution to avoid
disturbing any residues and, for the
same reason, never stood on the floor.
Formation of insoluble salts in solutions due to incorrect composition can
be prevented by regular analysis. Hard
water used for topping-up can form
insoluble calcium sulfate which tends to
deposit on the anodes, anode bags and
around the holes in the air-agitation
pipes. In hard-water areas the installation of deionizing or water-softening
plant should be considered.
Continuous filtration at a rate which
turns over the plating solution at least
once per hour should be used during
plating operations.
Accidental Damage
Reduction of accidental damage
through mishandling is mostly a question
of educating operators and of providing
a clear and uncluttered working area.
Often work is handled less carefully
when piecework schemes are operated.
An additional bonus for low rejects is
sometimes offered to reward careful
working.
When rejects are to be recovered for
re-plating, it is important that they
should also be handled with care to
minimize polishing requirements.
High Stress and Low Ductility
Unacceptable values of deposit stress
and inadequate ductility result from
having addition agents out of balance,
or from organic or inorganic impurities.
Impaired Brightness
This can be caused by:
Defects Arising from
Incorrect Mechanical
Preparation
Lack of balance between the addition
agents making up the brightener
system, which should be referred to
the supplier
Plated components are often rejected
for inadequate polishing. For example,
the overall standard of polishing may be
too low or the polished surface may
cover hidden defects such as pores and
holes which have been “flowed over” by
Metallic or organic contamination
Incorrect pH level, current density or
operating temperature
Too thin a deposit
56
the polisher and which reappear during
cleaning and/or etching processes prior
to nickel plating. These rejects can often
be prevented by proper inspection.
Whenever possible, the plating solution
should be passed through a separate
plating compartment where certain metallic
impurities such as zinc, lead and copper
can be plated out continuously by lowcurrent-density electrolysis.
A few of the sources of organic
impurities are:
Specification Not Met
The most frequent cause of failure to
meet specification, particularly when
using racks, is the application of too low
a plating current and/or too short a
plating time, giving too thin a deposit.
Another cause, often combined with low
average thickness, is non-uniform
distribution of current, leading to insufficient deposit in low-current-density
areas.
Poor electrical contact can also cause
thin deposits and attention should
therefore be paid to the cleanliness of
the anode and cathode bars, the anode
hooks and contacts of racks.
Quality can only be maintained by
tests which include regular checks of
thickness.
Breakdown of leveling or brightening
agents
Accidental introduction of lubricating
oils or greases from overhead
conveyors
Oil-contaminated compressed air
supply
Extracts from rubber tanks and hoses
Rack coatings
Filter cloths and anode bags
Buffing media
Accidental contamination by oil or
grease is particularly serious when
wetting agents are used in the solution,
since visual detection and subsequent
physical removal from the surface are
impossible.
In the case of organic contamination, the
usual method of purification is as follows:
the solution is pumped to an auxiliary tank
where it is digested with 6 g/L (1 oz/gal)
of activated carbon for several hours. Two
such treatments at half strength are more
effective than one treatment at full strength.
After treatment, the solution is filtered
before use.
To overcome the inconvenience of
batch purification, modern bright nickel
solutions may be continuously purified by
passing the solution through a filter
packed with activated carbon up to 1 g/L
(1 lb/100 gal). The organic brighteners
are so chosen that their decomposition
products may be removed by the carbon
without the simultaneous removal of
undecomposed brightener agents.
In low-current-density purification of
solutions containing organic addition
agents, the breakdown and consumption
of brighteners per ampere hour can
Purification of Solutions
Very small amounts of metallic and
organic impurities in the solution can
impair the appearance or mechanical
properties of the deposit. For good
quality plating, solutions must be maintained in a state of high purity.
A few of the many sources of metallic
impurities are:
Drag-over from preceding treatments
Components which have fallen off
racks and are allowed to remain in
the vat
Corrosion products from surrounding
equipment and steel roof girders
Tools dropped into the vat
Impure nickel salts and anodes
Metallic contamination is usually from
zinc, iron and copper and even in low
concentrations these have undesirable
effects. Table 18 lists the common
metallic impurities and suggests
methods for their removal from various
types of nickel plating solution.
57
Table 18 Effects of Impurities in Nickel Plating
Solutions and Methods of Purification
Impurity
Chromium
Range
investigated,
PPM
Chromiumiii
0-250
0-50
Solution
Watts
pH 2.2
No effect
up to 50
ppm;
thereafter
deposits
are
smoother
and finer
grained
Watts
pH 5.2
All
deposits
rough
0-250
Co-Ni
pH 3.75
0-125
Organic
pH 3.2
Chromate*
0-70
Appearance
No effect
up to 75
ppm;
thereafter
organic
deposits
become
milky and
Co-Ni
deposits
become
more
highly
stressed
Watts
pH 2.2
Whitens
deposit
0-15
Watts
pH 5.2
Deposits
rough,
due to
precipit-,
ated Cr iii
Whitening of
deposit
0-40
Co-Ni
pH 3.75
Unaffected
0-35
Organic
pH 3.2
Unaffected
Adhesion
































































Unaffected
provided
correct
plating
conditions
were
maintained
Unaffected
if pH and
iii
Cr content are
carefully
controlled
Ductility
corrosion
resistance
in
salt-spray
test
Hardness




































Throwing
power
Decrease
after
12.5-25
ppm
Decrease
at all
concentrations
Decrease
after
5 ppm
Increase
with
increasing concentralion
Decrease
after 50
ppm
Slight
increase:
(max at
12.5
ppm)
Decrease
after 25
ppm
Decrease
(min at
12 ppm)
9-16%
decrease
Decrease
at all
concentrations
Substantial
increase in
thick
deposits at
high concentrations;
otherwise
no great
change
Decrease
55-85%
decrease
Increase
(43% at
15 ppm)
As for
pH 2.2
solution
Slight
increase
33-60%
decrease
25-50%
decrease
58
 Mainly

 decrease
 but

 variable


Slight
increase
General
decrease
in
corrosion
resistance
Slight
increase
Slight
decrease
Slight
increase
Slight
decrease

 at all thick nesses
 and con
centrations
Slight
decrease
Slight
increase
Removal
technique
Removal by
electrolytic
means is
unsatisfactory.
Reduction
of Crvi to
Criii, using
nickel metal
at low pH
(< 3.0) and
agitating.
Criii is removed by
raising the
temperature
to 75 °C
(165 °F) for
several
hours and
precipitating
at high pH
(5.2-5.5),
using
nickel
carbonate
Table 18 Continued
Impurity
Copper
Range
investigated,
ppm
0-100
Solution
Watts
pH 2.2
Watts
pH 5.2
Co-Ni
pH 3.75
Organic
pH 3.2
Iron
0-200
Appearance













Watts
pH 5.2
Organic
pH 3.5
At 10
ppm
milky;
at higher
concentration
deposits
dull and
rough
Whitens
deposit at
concentrations
of 10200 ppm,
Some
brightness
50-200
ppm
Watts
pH 2.2
Co-Ni
pH 3.75
50 ppm
causes
blackening in
lowcurrentdensity
areas








Unaffected
up to
200 ppm
Adhesion
Unaffected
up to
100 ppm








 Un affected
 up to 200
 ppm


Ductility
Decreases
as copper
content
increases
above
10-25
ppm
Decreases
at 2550 ppm
Unaffected
up to
200 ppm
Decreases
at 2550 ppm
Hardness
Max
(+86%)
at about
75 ppm;
less significant
increases
for other
solutions


 Increase
 to max at
 10-25

 ppm; de crease
 to min at
 50 ppm

 then in crease
 at higher
 concen
 trations


Corrosion
resistance
in
salt-spray
test
Small
amounts
cause
large reduction in
corrosionresistance
(50% reduction at
40 ppm
for all
solutions)
Slight
changes
only in
thin
deposits
Unaffected
10-20%
increase
at 25
ppm.
Slight
changes
only, at
all thicknesses
Table 18 Continued on Next Page
59
Throwing
power
Insignificant
changes
at all
concentrations
and in
all
solutions













 Insig nificant
 changes












Removal
technique
Lowcurrentdensity
treatment.
At 0.2
A/dm2
2
(2 A/ft )
Ni: Cu ratio
of deposit is
twice that
obtained at
0.1 A/dm2
(1 A/ft2); at
0.3 A/dm2
(3 A/ft2) it
is 15 times
as great.
High-pH
treatment
(pH 6.0);
reduces Cu
to 15 ppm
but with
loss of
nickel
Oxidation
with H2O2
(1% by
volume of
3% H2O2)
and high
pH (5.55.7) with
NiCO3
No loss of
nickel
Also by lowor highcurrentdensitytreatment
Impurity
Zinc
Range
Investigated,
PPM
0-300
Appearance
Solution
Watts
pH 2.2
Darkening in
lowcurrentdensity
areas
above 10
ppm,
Brightening in
highcurrentdensity
areas at 300
ppm
Watts
pH 5.2
Darkening
above
10 ppm
Co-Ni
pH 3.75
Gradual
change
to dull
deposit at
300 ppm
Organic
pH 3.2
Lead
0-15**
Wafts
pH 2.2
Watts
pH 5.2
Co-Ni
pH 3.75
Organic
pH 3.2
Improved
brightness at
150-300
ppm but
darkness
in lowcurrentdensity
areas


























Pronounced
levelling
and
brightening
effects
even at
low
concenttration.
Blackening in
lowcurrentdensity
areas at
20 ppm;
otherwise
some
levelling
Adhesion
























































Ductility










 Gradual
 decrease











Unaffected
up to 300
ppm













 Un affected











Little
change
until
300 ppm,
at which
concentration
deposit
becomes
unusable
Corrosion
resistance
in
salt-spray
test
Hardness























General
increase;
greater
at pH 2.2
than at
pH 5.2
Increase:
(max at
25 ppm)
Unaffected
Max
5 ppm
Min
15 ppm
Decrease
General
increase
(50% at
20 ppm)
Unaffected
Decrease
Increase
(12% at
10 ppm).
Decrease








































































Throwing
power
General
decrease
General
improvement;
greatest
change in
corrosionresistance
(10-60%
increase)
up to
50 PPM
General
slight increase in
corrosionresistance,
especially
in thicker
deposits
Slight
decrease
(8% at
20 ppm)
From
25 ppm
improve ment
Removal
technique
By lowcurrentdensity
treatment at
0.2-0.4
2
A/dm
(2-4 A/ft2),
down to
1 ppm
Cannot be
removed by
high pH
treatment
without
much loss
of nickel













 General
 improve ment




























General
slight
decrease
Variable
at different concentrations.
Slight
increase
By lowcurrent
density
treatment,
0.1 A/dm2
(1A/ft2) to
minimum of
2.5 ppm
By high-pH
treatment
(pH 5.56.0). Some
nickel also
precipitated at the
higher pH
*In all tests with chromate impurity some Criii was also present. The concentration of Criii was kept below 40 ppm.
**Higher concentrations of Pb are possible, especially in solutions containing organic additions and having a high chloride content.
60
occur at a rate about 3 times that occurring at the work. Thus if 1 per cent of
the total plating current is used in lowcurrent-density electrolysis, an extra 3
per cent of brighteners may be used. It
pays to avoid excessive destruction of
brighteners by controlling the purification process so as to keep the level of
metallic impurities just below the level
at which they adversely affect the
appearance or properties of the deposit.
Severe Organic Contamination
In some cases of contamination by
organic substances, filtration through
activated carbon will not bring the solution back to working condition. In these
circumstances all organic substances in
the solution must be destroyed. Production must be stopped and a small
amount of potassium permanganate
solution added (0.25–0.75 ml/L of a one
gram per litre solution of KMnO 4 ). For
heavy contamination a stronger solution
of KMnO 4 may be necessary. The
amount and strength required can be
determined by trials with a small quantity
of plating solution by adding permanganate until the color changes.
When decomposition of the permanganate is complete, the precipitated
manganese dioxide must be filtered off
before plating is restarted. If possible
the treatment is best carried out in a
separate tank to avoid deposition of
manganese dioxide on the tank walls,
on the anode bags, and so on. This
treatment should only be carried out on
a proprietary solution after consultation
with the plating supplier.
61
Standards and Specifications
The most important standards
and specifications in this area are
those promulgated by the American
Society for Testing and Materials
(ASTM), Federal Government and
Semiconductor Equipment and
Materials Institute (SEMI).
Copies of these documents are
included in the following order:
ASTM F 15 Iron-Nickel-Cobalt
Sealing Alloy
ASTM F 30 Iron-Nickel Sealing
Alloys
ASTM F 31 42% Nickel - 6%
Chromium - Iron Sealing Alloy
MIL-I-23011 Iron-Nickel Alloys for
Sealing to Glasses
and Ceramics
MIL-M-38510 Microcircuits,
General Specification
for (Sections dealing
with lead frames and
plating or finishes)
QQ-N-290
Nickel Plating (Electrodeposited)
SEMI G2
Metallic Leadframes
for Cer-DIP Packages
SEMI G4
Integrated Circuit
Leadframe Materials
Used in the Production of Stamped
Leadframes
SEMI G22
Ceramic Pin Grid
Array Packages
62
Designation: F 15–78 (Reapproved 1983)
Reprinted, with permission, from the Annual Book of ASTM Standards,
copyright American Society for Testing and Materials, 1916 Race Street,
Philadelphia, PA 19103.
Standard Specification for
IRON-NICKEL-COBALT SEALING ALLOY1
This standard is issued under the fixed designation F 15; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (ε) indicates an editorial change since the last revision or reapproval.
1. Scope
3.1.5 Certification if required.
1.1 This specification covers an iron-nickelcobalt alloy, containing nominally 29% nickel,
17% cobalt, and 53% iron, in the forms of
wire, rod, bar, strip, sheet, and tubing, intended primarily for sealing to glass in electronic
applications.
1.2 The values stated in inch-pound units
are to be regarded as the standard.
4. General Requirements
4.1 The material shall be commercially
smooth, uniform in cross section, in composition, and in temper; it shall be free of scale,
corrosion, cracks, seams, scratches, slivers,
and other defects as best commercial practice will permit.
5. Chemical Requirements
5.1 The material shall conform to the
requirements as to chemical composition
prescribed in Table 1.
2. Applicable Documents
2.1 ASTM Standards:
B 95 Test Method for Linear Expansion
2
of Metals
E 3 Methods of Preparation of Metallo3
graphic Specimens
E 8 Methods of Tension Testing of
4
Metallic Materials
E 18 Test Methods for Rockwell Hardness
and Rockwell Superficial Hardness of
4
Metallic Materials
E 112 Methods for Determining Average
3
Grain Size
F 14 Practice for Making and Testing
5
Reference Glass-Metal Bead-Seal
F 140 Practice for Making Reference
Glass-Metal Butt Seals and Testing
for Expansion Characterisitics by
5
Polarimetric Methods
F 144 Practice for Making Reference
Glass-Metal Sandwich Seal and
Testing for Expansion Characteristics
5
by Polarimetric Methods
6. Surface Lubricants
6.1 All lubricants used during cold-working
operations, such as drawing, rolling, or spinning, shall be capable of being removed
readily by any of the common organic
degreasing solvents such as, for example,
trichloroethylene.
7. Temper
7.1 The desired temper of the material shall
be specified in the purchase order.
7.2 Tube —Unless otherwise agreed upon
by the supplier or manufacturer and the
purchaser, these forms shall be given a
final bright anneal by the manufacturer and
supplied in the annealed temper.
7.3 Strip and Sheet —These forms shall be
supplied in one of the tempers given in Table
2 or in deep-drawing temper, as specified.
3. Ordering Information
3.1 Orders for material under this
specification shall include the following
information:
3.1.1 Size,
3.1.2 Temper (Section 7),
3.1.3 Surface finish (Section 11),
3.1.4 Marking and packaging (Section 17),
and
1
This specification is under the jurisdiction of ASTM
Committee F-1 on Electronics and is the direct responsibility of
Subcommittee F01.03 on Metallic Materials.
Current edition approved Jan. 27,1978. Published March
1978. Originally published as F15 — 61 T. Last previous edition
F15 — 77.
2
Discontinued, see 1985 Annual Book of ASTM Standards , Vol 14.02
3
Annual Book of ASTM Standards, Vol 03.03.
4
Annual Book of ASTM Standards, Vol 03.01.
5
Annual Book of ASTM Standards. Vol 10.04.
63
F 15
11.1.3
11.1.4
11.1.5
11.1.6
7.4 Wire and Rod—These forms shall be
supplied in one of the tempers given in Table
3 as specified. Unless otherwise specified, the
material shall be bright annealed and supplied
in temper A (annealed).
Centerless grinding (rod),
Belt polishing,
Cold rolling, and
Wire drawing.
12. Thermal Expansion Characteristics
8. Grain Size
12.1 The average linear coefficients of thermal expansion shall be within the limits specified in Table 4
8.1 Strip and sheet for deep drawing shall
have an average grain size not larger than
ASTM No. 5 (Note 1), and no more than 10%
of the grains shall be larger than No. 5 when
measured in accordance with Methods E 112.
13. Test for Thermal Expansion
13.1 Heat the specimen in a hydrogen
atmosphere for 1 h at 900°C, followed by 15
min at 1100°C. Between the 900 and 1100°C
heat-treatment periods, the specimen may be
cooled to room temperature if desired. Cool
the specimen from 1100 to 200°C in the
hydrogen atmosphere at a rate not to exceed
5°C/min.
13.2 Reheat the specimen to 500°C in the
dilatometer and determine the coefficient of
thermal expansion from the cooling curve.
13.3 Determine the thermal expansion
characteristics in accordance with Test
Method B95.
NOTE 1—This corresponds to a grain size of 0.065 mm,
2
or 16 grains/in. of image at 100 ×.
9. Hardness
9.1 Deep-Drawing Temper—For deep drawing, the hardness shall not exceed 82 HRB for
material 0.100 in. (2.54 mm) and less in
thickness and 85 HRB for material over 0.100
in. in thickness when determined in accordance with Methods E 18.
9.2 Rolled and Annealed Tempers—
Hardness tests when properly applied can be
indicative of tensile strength. Hardness scales
and ranges for these tempers, if desirable,
shall be negotiated between supplier and purchaser.
NOTE 2—Although not required, the thermal expansion
match between the alloy and a glass may be evaluated by
preparing and testing an assembly in accordance with
Practices F14, F140 or F144, whichever glass-metal seal test
is appropriate.
10. Tensile Strength
14. Transformation
10.1 Sheet and Strip;
10.1.1 Tensile strength shall be the basis for
acceptance or rejection for the tempers given
in Table 2 and shall conform with the
requirements prescribed.
10.1.2 Tension test specimens shall be
taken so the longitudinal axis is parallel to the
direction of rolling and the test shall be performed in accordance with Methods E 8.
10.2 Wire and Rod;
10.2.1 Tensile strength shall be the basis for
acceptance or rejection for the tempers given
in Table 3 and shall conform with the
requirements prescribed.
10.2.2 The test shall be performed in accordance with Method E 8.
14.1 The temperature of the gamma-toalpha transformation shall be below –78.5°C
when the material is tested in accordance with
Section 15. However, for material whose
smallest dimension is over 7/8 in. (22.2 mm),
some localized transformation, acceptable to
the purchaser, may be tolerated.
15. Test for Transformation
15.1 Cut the specimen from any part of the
material, but preferably including the entire
cross section, degrease it, then heat treat it
as described in 13.1. When cool, polish the
cross section of the specimen and etch (Note
3) it in accordance with Method E3. Then
subject the specimen to the temperature
produced by an excess of dry ice in acetone
0
(–78.5 C) for at least 4 h. After the lowtemperature treatment, examine the specimen
at a magnification of 150× for the presence of
the acicular crystals characteristic of the alpha phase. Because these crystals may oc-
11. Surface Finish
11.1 The standard surface finishes available
shall be those resulting from the following
operations:
11.1.1 Hot rolling,
11.1.2 Forging,
64
F 15
cur only in small localized areas, examine
carefully the entire polished cross section.
15.2 Specimens that show no transformation and that show partial transformation are
illustrated in Figs. 1 and 2, respectively.
dimensions prescribed in Table 8.
16.3 Cold-Drawn Tubing—Cold-drawn tubing, available either as seamless or welded,
shall conform to the permissible variations
prescribed in Table 9.
NOTE 3—A suggested etchant is a solution of three parts
by volume of concentrated hydrochloric acid and one part of
concentrated nitric acid saturated with cupric chloride
(CuCl 2 ·2H 2 0). This etchant is more effective when allowed to
stand for 20 min after mixing. After several hours it loses its
strength and should be discarded at the end of the day.
Etching is best accomplished by swabbing the specimen
with cotton soaked with the etchant. Etching is usually complete when the surface of the metal appears to have turned
dull.
17. Packaging and Marking
17.1 Packaging shall be subject to agreement between the purchaser and the seller.
17.2 The material as furnished under this
specification shall be identified by the name
or symbol of the manufacturer and by melt
number. The lot size for determining
compliance with the requirements of this
specification shall be one heat.
18. Investigation of Claims
16. Dimensions and Permissible Variations
16.1 Cold Rolled Strip-Cold–rolled strip shall
conform to the permissible variations in
dimensions prescribed in Tables 5, 6, and 7.
16.2 Round Wire and Rod–Wire and rod
shall conform to the permissible variations in
Table 1
Table 3
Chemical Requirements
Composition,
%
53A
29A
17A
0.50
0.20
0.04
0.10B
0.10B
0.10B
0.10B
0.20
0.20
0.20
Element
Iron, nominal
Nickel, nominal
Cobalt, nominal
Manganese, max
Silicon, max
Carbon, max
Aluminum, max
Magnesium, max
Zirconium, max
Titanium, max
Copper, max
Chromium, max
Molybdenum, max
A
18.1 Where any material fails to meet the
requirements of this specification, the material
so designated shall be handled in accordance
with a mutual agreement between the
purchaser and the seller.
Temper
Designation
A
B
C
D
E
of Thermal Expansion, A
µm/m•°C
30 to 400
30 to 450
4.60 to 5.20
5.10 to 5.50
A
The following typical thermal expansion data
for the alloy covered by these specifications are
given for information only:
coefficient of thermal expansion given in Table 4.
The total of aluminum, magnesium, zirconium, and titanium shall not
exceed 0.20%.
Table 2 Tensile Strength Requirements
for Sheet and Strip
A
B
C
D
E
Temper Name Tensile Strength, ksi (MPa)
annealed
¼ hard
half hard
¾ hard
hard
85 (585) max
85 to 105 (585 to 725)
95 to 115 (655 to 795)
105 to 125 (725 to 860)
125 (860) min
Temperature Range, °C
The iron, nickel and cobalt requirements listed are nominal. They shall
Temper
Designation
Tensile Strength, ksi (MPa)
Table 4 Coefficients of Thermal
E
i
Average Linear Coefficient
be adjusted by the manufacturer so that the alloy meets the requirements for
B
Tensile Strength Requirements
for Wire and Rod
82 max (570 max)
75 to 90 (520 to 630)
85 to 100 (590 to 700)
95 to 110 (660 to 770)
100 min (700 min)
65
Temperature Range, °C
Average Linear Coefficient of
Thermal Expansion, µm/m•°C
30 to 200
30 to 300
30 to 400
30 to 450
30 to 500
30 to 600
30 to 700
30 to 800
30 to 900
5.5
5.1
4.9
5.3
6.2
7.9
9.3
10.4
11.5
F 15
Table 5 Permissible Variations in Thickness of Cold-Rolled Strip
NOTE—Measurement shall be made at least 3/8 in. (9.5 mm) from the edge of strip over 1 in. (25.4 mm) wide.
Specified Thickness, in. (mm)
Permissible Variations in Thickness for Width Given, ± in. (mm)
Over 3 to 6
Over 6 to 12
Over 12 to 16
Under 3 (76)
(76 to 152)
(152 to 305)
(305 to 406)
0.002 (0.051)
0.002 (0.051)
0.002 (0.051)
0.002 (0.051)
0.0015 (0.038)
0.0015 (0.038)
0.001 (0.025)
0.001 (0.025)
0.001 (0.025)
0.001 (0.025)
0.001 (0.025)
0.00075 (0.019)
0.0005 (0.013)
0.160 to 0.100 (4.06 to 2.54), incl
0.099 to 0.069 (2.51 to 1.75), incl
0.068 to 0.050 (1.73 to 1.27), incl
0.049 to 0.035 (1.24 to 0.89), incl
0.034 to 0.029 (0.86 to 0.74), incl
0.028 to 0.026 (0.71 to 0.66), incl
0.025 to 0.020 (0.64 to 0.51), incl
0.019 to 0.017 (0.48 to 0.43), incl
0.016 to 0.012 (0.41 to 0.31), incl
0.011 to 0.0101 (0.28 to 0.26), incl
0.010 to 0.0091 (0.25 to 0.23), incl
0.009 to 0.006 (0.23 to 0.15), incl
Under 0.006 (0.15)
0.003 (0.076)
0.003 (0.076)
0.003 (0.076)
0.0025 (0.064)
0.002 (0.051)
0.0015 (0.038)
0.0015 (0.038)
0.001 (0.025)
0.001 (0.025)
0.001 (0.025)
0.001 (0.025)
0.00075 (0.019)
0.0005 (0.013)
0.004 (0.102)
0.003 (0.076)
0.003 (0.076)
0.003 (0.076)
0.0025 (0.064)
0.002 (0.051)
0.002 (0.051)
0.0015 (0.038)
0.0015 (0.038)
0.001 (0.025)
0.001 (0.025)
...
...
0.004 (0.102)
0.004 (0.102)
0.003 (0.076)
0.003 (0.076)
0.0025 (0.064)
0.002 (0.051)
0.002 (0.051)
0.002 (0.051)
0.0015 (0.038)
0.0015 (0.038)
0.001 (0.025)
...
...
Table 6 Permissible Variations in Thickness Across Width of Strip
Maximum Variation in Thickness Across Width of
Strip, Within Those Provided for in Table 4 for Edge Measurements for
Widths and Thicknesses Given, in. (mm)
Over 5 to 12
Over 12 to 24
5 (127) and Under
(127 to 300)
(300 to 600), incl
in.
mm
in.
mm
in.
mm
Specified Thickness
in.
mm
0.005 to 0.010, incl
Over 0.010 to 0.025, incl
Over 0.025 to 0.065, incl
Over 0.065 to , 3/16, excl
0.17 to 0.03, incl
0.03 to 0.06, incl
0.06 to 0.16, incl
0.16 to 0.48, excl
0.00075
0.001
0.0015
0.002
0.0191
0.025
0.038
0.051
0.001
0.0015
0.002
0.0025
0.025
0.038
0.051
0.064
0.0015
0.002
0.0025
0.003
0.038
0.051
0.064
0.076
Table 7 Permissible Variations in Width of Cold-Rolled Strip Supplied in Coils
Permissible Variations in Width for Widths Given, ± in. (mm)
Specified Thickness, in.
(mm)
0.187 to 0.161 (4.75 to 4.09)
0.160 to 0.100 (4.06 to 2.54)
0.099 to 0.069 (2.51 to 1.75)
0.068 (1.73) and under
Under ½ to
3/16 (12.7 to
4.8)
½ to 6
(12.7 to
152)
Over 6 to
9 (152 to
229)
Over 9 to
12 (229 to
305)
Over 12 to Over 20 to
20 (305 to 2315/16 (508
to 608)
508)
...
0.010 (0.25)
0.008 (0.20)
0.005 (0.13)
0.016 (0.41)
0.010 (0.25)
0.008 (0.20)
0.005 (0.13)
0.020 (0.51)
0.016 (0.41)
0.010 (0.25)
0.005 (0.13)
0.020 (0.51)
0.016 (0.41)
0.010 (0.25)
0.010 (0.25)
0.031 (0.79)
0.020 (0.51)
0.016 (0.41)
0.016 (0.41)
66
0.031 (0.79)
0.020 (0.51)
0.020 (0.51)
0.020 (0.51)
F 15
Table 8 Permissible Variations in Diameter of Wire and Rod
Permissible Variations in
Diameter, ± in. (mm)
Specified Diameter, in. (mm)
Wire (Coiled, Spooled or Straight Lengths)
0.002
0.0044
0.008
0.015
0.020
0.031
0.041
0.061
0.081
0.126
0.157
to 0.0043
to 0.0079
to 0.0149
to 0.0199
to 0.0309
to 0.0409
to 0.0609
to 0.0809
to 0.1259
to 0.1569
to 0.250
(0.05 to 0.110)
(0.111 to 0.202)
(0.20 to 0.379)
(0.38 to 0.507)
(0.51 to 0.786)
(0.79 to 1.04)
(1.04 to 1.548)
(1.55 to 2.056)
(2.06 to 3.199)
(3.20 to 3.99)
(4.00 to 6.35)
0.0002
0.00025
0.0003
0.0004
0.0005
0.0006
0.0007
0.0008
0.001
0.0015
0.002
(0.005)
(0.006)
(0.008)
(0.010)
(0.013)
(0.015)
(0.018)
(0.020)
(0.025)
(0.038)
(0.051)
Rod, Centerless Ground Finish (Straight Lengths)
0.030 to 0.0549
0.055 to 0.1249
0.125 to 0.499
0.500 to 0.999
1.000 to 1.625
1.626 to 1.749
1.750 to 1.999
2.000 to 4.000
(0.76 to 1.396)
(1.40 to 3.174)
(3.18 to 12.70)
(12.7 to 25.37)
(25.4 to 41.28)
(41.30 to 44.40)
(44.45 to 50.77)
(50.80 to 101.60)
0.0005
0.001
0.0015
0.002
0.0025
0.003
0.004
0.005
(0.013)
(0.035)
(0.038)
(0.051)
(0.064)
(0.08)
(0.10)
(0.13)
Table 9 Permissible Variations in Dimensions of Standard Tubing
Permissible VariationsA
Specified Outside Diameter, in. (mm)
Under 0.093 (2.36)
0.093 to 0.187 (2.36 to 4.76), excl
0.187 to 0.500 (4.76 to 12.70), excl
0.500 to 1.500 (12.70 to 38.10), excl
A
Outside Diameter,
in. (mm)
Inside Diameter, in.
(mm)
+ 0.002 (0.05)
– 0.000
+ 0.003 (0.08)
– 0.000
+ 0.004 (0.10)
– 0.000
+ 0.005 (0.13)
– 0.000
+ 0.000
– 0.002 (0.05)
+ 0.000
– 0.003 (0.08)
+ 0.000
– 0.004 (0.10)
+ 0.000
– 0.005 (0.13)
Any two of the three dimensional tolerances listed may be specified.
67
Wall
Thickness, ±
%
10
10
10
10
F 15
150×
Figure 1. Normal Annealed Specimen Showing No Transformation
68
F 15
150 ×
Figure 2. Partially Transformed Specimen
The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted
in connection with any item mentioned in this standard. Users of this standard are expressly advised that determination
of the validity of any such patent rights, and the risk of infringement of such rights, are entirely their own responsibility.
This standard is subject to revision at any time by the responsible technical committee and must be reviewed every
five years and if not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard
or for additional standards and should be addressed to ASTM Headquarters. Your comments will receive careful
consideration at a meeting of the responsible technical committee, which you may attend. If you feel that your comments
have not received a fair hearing you should make your views known to the ASTM Committee on Standards, 1916 Race St.,
Philadelphia, Pa. 19103.
69
Designation: F 30—85
Reprinted, with permission, from the Annual Book of ASTM Standards,
copyright American Society for Testing and Materials, 1916 Race Street,
Philadelphia, PA 19103.
Standard Specification for
IRON-NICKEL SEALING ALLOYS 1
This standard is issued under the fixed designation F 30; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (ε) indicates an editorial change since the last revision or reapproval.
1. Scope
4. General Requirements
1.1 This specification covers iron-nickel
alloys that are intended primarily for sealing to
glass in electronic applications.
4.1 The material shall be commercially
smooth, uniform in cross section, in composition, and in temper; it shall be free from scale,
corrosion, cracks, seams, scratches, slivers,
and other defects as best commercial practice
will permit.
NOTE 1—Some of these alloys may be used for sealing
to ceramics, but this specification in its present form is not
intended to cover material for metal-to-ceramic seals.
5. Chemical Composition
5.1 The material shall conform to the
requirements as to chemical composition
prescribed in Table 1.
1.2 The values stated in inch-pound units
are to be regarded as the standard.
2. Applicable Documents
2.1 ASTM Standards:
E 18 Test Methods for Rockwell Hardness
and Rockwell Superficial Hardness of
2
Metallic Materials
E 29 Practice for Indicating Which Places
of Figures Are to Be Considered Signifi3
cant in Specified Limiting Values
E 112 Method for Determining Average
3
Grain Size
F 14 Practice for Making and Testing
4
Reference Glass-Metal Bead-Seal
F 140 Practice for Making Reference
Glass-Metal Butt Seals and Testing for
Expansion Characteristics by Polari4
metric Methods
F 144 Practice for Making Reference
Glass-Metal Sandwich Seal and Testing
for
Expansion
Characteristics
by
4
Polarimetric Methods
6. Surface Lubricants
6.1 All lubricants used in processing shall
be thoroughly removed. Protective coatings
present on the material as shipped shall be
readily removable by any of the common
organic degreasing solvents, for example,
trichloroethylene.
7. Temper
7.1 The desired temper of the material shall
be specified on the purchase order. Unless
otherwise specified, wire, rod, and tubing shall
be given a final bright anneal by the manufacturer. Strip and sheet shall be annealed
properly to develop deep drawing properties.
For deep drawing the hardness shall not
exceed Rockwell B 82 for material 0.100 in.
(2.54 mm) and less in thickness, and B 85 for
material over 0.100 in. thick when determined
in accordance with Test Methods E 18.
3. Ordering Information
3.1 Orders for material under this specification shall include the following information:
3.1.1 Size,
3.1.2 Temper (Section 6),
3.1.3 Surface finish (Section 8),
3.1.4 Marking and packaging (Section 15),
and
3.1.5 Certification, if required.
1
This specification is under the jurisdiction of ASTM
Committee F-1 on Electronics and is the direct responsibility
of Subcommittee F01.03 on Metallic Materials.
Current edition approved Aug. 30, 1985. Published October 1985. Originally published as F30 – 77. Last previous
edition F30 – 77.
2
Annual Book of ASTM Standards, Vol 03.01.
3
Annual Book of ASTM Standards, Vol 03.03.
4
Annual Book of ASTM Standards, Vol 10.04.
70
F 30
8. Grain Size
13. Test for Porosity
8.1 Strip and sheet for deep drawing applications shall have an average grain size not
larger than ASTM No. 5 (Note 3) and no more
than 10% of the grains shall be larger than
No. 5 when measured to accordance with
Method E 112. For materials less than 0.005
in. (0.13 mm) in thickness the grain size shall
be such that there are no less than 4 grains
across the thickness.
13.1 Machine the specimen in accordance
with Fig. 1. Degrease and slightly pickle the
specimen in a 1 + 1 hydrochloric acid solution
containing an inhibitor at a temperature of
65°C; then wash and dry it at 105 to 110°C.
Heat treat the specimen at 1100°C for 30 min.
in wet hydrogen and allow it to cool in this atmosphere.
13.2 Connect the tubulation of the test fixture, Fig. 2, to a helium leak detector. The sensitivity of the leak detector shall be such that
-9
3
a leak of 1 × 10 cm /s measured at 20°C
and 1 atm pressure, will give a deflection of
at least 5% of full scale. Exhaust the test fixture, and test the specimen for leakage by
probing all of the exposed surface with a
helium jet. If leakage is found, squirt alcohol
all around the specimen-to-neoprene seal to
make certain that the leak is through the
specimen and not at the gasket seal. Make
this test within 24 h after the specimen is
removed from the heat-treating furnace.
NOTE 2—This corresponds to a grain size of 0.065 mm
2
or 16 grains/in. of image at 100 x.
9. Surface Finish
9.1 The standard surface finishes available
shall be those resulting from the following
operations:
9.1.1 Hot-rolling,
9.1.2 Forging,
9.1.3 Centerless grinding (rod),
9.1.4 Belt polishing,
9.1.5 Cold rolling, and drawing, and
9.1.6 Wire drawing.
14. Dimensions and Permissible Variations
10. Thermal Expansion Characteristics
14.1 Cold-Rolled Strip—Cold-rolled strip
shall conform to the permissible variations in
dimensions prescribed in Tables 3, 4, and 5.
14.2 Round Wire and Rod—Wire and rod
shall conform to the permissible variations in
dimension prescribed in Table 6.
14.3 Cold-Drawn Tubing—Cold-drawn tubing, available either as seamless or welded,
shall conform to the permissible variations
prescribed in Table 7.
10.1 The average linear coefficients of
thermal expansion shall be within the limits
specified in Table 2.
11. Test for Thermal Expansion
11.1 Determine the thermal expansion
characteristics with a precision dilatometer
after heat treating the specimen as follows:
11.1.1 Heat the specimen in a hydrogen atmosphere for 1 h at 900°C and then cool it
from 900 to 200°C at a rate not exceeding
5°C/min.
11.1.2 Reheat the specimen to 25°C above
the highest temperature specified for the thermal expansion and determine the expansion
from the cooling curve. See Method E 228.
11.2 The thermal expansion match between
the alloy and a glass may be evaluated by
testing the assembly in accordance with Practices F 14, F 140, or F 144.
15. Rounding Results
15.1 Observed or calculated values
obtained from analysis, measurements, or
tests shall be rounded in accordance with
Recommended Practice E 29, to the nearest
unit in the last right place of figures used in
expressing the specified limit.
16. Packaging and Package Marking
16.1 Packaging shall be subject to agreement between the purchaser and the seller.
16.2 The material as furnished under this
specification shall be identified by the name
or symbol of the manufacturer and by melt
number. The lot size for determining
compliance with the requirements of this
12. Porosity in Bar or Rod
12.1 Specimens from bar or rod ½ in. (12.7
mm) in diameter or over, when tested in accordance with Section 12, shall show no
leakage in the helium leak detector.
71
F 30
requirements of this specification, the material
so designated shall be handled in accordance
with the agreement mutually agreed upon by
the purchaser and the seller.
specification shall be one heat.
17. Investigation of Claims
17.1 Where any material fails to meet the
Table 1 Chemical Requirements
Composition, %
42 Alloy
Nickel,Anominal
Manganese, max
Silicon, max
Carbon, max
Chromium, max
Cobalt, max
Phosphorous, max
Sulfur, max
Aluminum, max
Iron
46 Alloy
48 Alloy
52 Alloy
41
0.80
0.30
0.05
0.25
46
0.80
0.30
0.05
0.25
48
0.80
0.30
0.05
0.25
50.5
0.60
0.30
0.05
0.25
B
B
B
B
0.025
0.025
0.10
remainder
0.025
0.025
0.10
remainder
0.025
0.025
0.10
remainder
0.025
0.025
0.10
remainder
A
The nickel contents listed are nominal. The nickel contents of the alloys shall be adjusted by the manufacturer
so that the alloys meet the requirements for thermal expansion. The 52 Alloy is specifically intended to match lead
(Pb) sealing glasses.
B
Cobalt is present as an incidental element and shall be reported separately.
Table 2 Thermal Expansion RequirementsA
Temperature
Range,
°C
Average Linear
Coefficient of Thermal
Expansion, µm/m•°C
42
30 to 300
30 to 450
4.0 to 4.7
6.7 to 7.4
46
30 to 350
30 to 500
7.1 to 7.8
8.2 to 8.9
48
30 to 400
30 to 550
8.2 to 9.2
9.6 to 10.3
52
30 to 450
30 to 550
9.7 to 10.2
10.0 to 10.5
Alloy No.
A
Typical expansion data up to 1000°C are given in the Appendix.
72
F 30
Table 3 Permissible Variations in Thickness of Cold-Rolled Strip
NOTE—Measurements shall be made at least 3/8 in. (9.5 mm) from the edge of strip that is over 1 in. (25.4 mm) wide.
Permissible Variations in Thickness for Width Given,
plus or minus, in. (mm)
Specified Thickness,
in. (mm)
Over 3 to 6
(76 to 152)
Under 3 (76)
0.160 to 0.100 (4.06 to 2.54), incl
0.099 to 0.069 (2.51 to 1.75), incl
0.068 to 0.050 (1.73 to 1.27), incl
0.049 to 0.035 (1.24 to 0.89), incl
0.034 to 0.029 (0.86 to 0.74), incl
0.028 to 0.026 (0.71 to 0.66), incl
0.025 to 0.020 (0.64 to 0.51), incl
0.019 to 0.017 (0.48 to 0.43), incl
0.016 to 0.012 (0.41 to 0.31), incl
0.011 to 0.0101 (0.28 to 0.26), incl
0.010 to 0.0091 (0.25 to 0.23), incl
0.009 to 0.006 (0.23 to 0.15), incl
Under 0.006 (0.15)
0.002
0.002
0.002
0.002
0.0015
0.0015
0.001
0.001
0.001
0.001
0.001
0.00075
0.0005
(0.051)
(0.051)
(0.051)
(0.051)
(0.038)
(0.038)
(0.025)
(0.025)
(0.025)
(0.025)
(0.025)
(0.019)
(0.013)
0.003
0.003
0.003
0.0025
0.002
0.0015
0.0015
0.001
0.001
0.001
0.001
0.00075
0.0005
Over 6 to 12
(152 to 305)
(0.076)
(0.076)
(0.076)
(0.064)
(0.051)
(0.038)
(0.038)
(0.025)
(0.025)
(0.025)
(0.025)
(0.019)
(0.013)
0.004
0.003
0:003
0.003
0.0025
0.002
0.002
0.0015
0.0015
0.001
0.001
…
…
(0.102)
(0.076)
(0.076)
(0.076)
(0.064)
(0.051)
(0.051)
(0.038)
(0.038)
(0.025)
(0.025)
Over 12 to 16
(305 to 406)
0.004
0.004
0.003
0.003
0.0025
0.002
0.002
0.002
0.0015
0.0015
0.001
…
…
(0.102)
(0.102)
(0.076)
(0.076)
(0.064)
(0.051)
(0.051)
(0.051)
(0.038)
(0.038)
(0.025)
Table 4 Permissible Variations in Thickness Across Width of Strip
Maximum Variation in Thickness Across Width of Strip
(Within Limits Specified in Table 3 for Edge Measurements)
for Widths and Thicknesses Given, in. (mm)
Specified Thickness,
in. (mm)
0.005 to 0.010 (0.13 to 0.25), incl
Over 0.010 to 0.025 (0.25 to 0.64), incl
Over 0.025 to 0.065 (0.64 to 1.65), incl
Over 0.065 to 3/16 (1.65 to 4.8), excl
0.00075
0.001
0.0015
0.002
(0.019)
(0.025)
(0.038)
(0.051)
0.001
0.0015
0.002
0.0025
(0.025)
(0.038)
(0.051)
(0.064)
0.0015
0.002
0.0025
0.003
(0.038)
(0.051)
(0.064)
(0.076)
Table 5 Permissible Variations in Width of Cold-Rolled Strip Supplied in Coils
Specified Thickness
in. (mm)
0.187 to 0.161 (4.75 to 4.09)
0.160 to 0.100 (4.06 to 2.54)
0.099 to 0.069 (2.51 to 1.75)
0.068 (1.73) and under
Permissible Variations in Width or Widths Given, plus or minus, in. (mm)
Under ½ to 3/16
(12.7 to 4.8)
½ to 6
12.7 to 152)
Over 6 to 9
(152 to 229)
Over 9 to 12
(229 to 305)
Over 12 to 20
(305 to 508)
…
0.010 (0.25)
0.008 (0.20)
0.005 (0.13)
0.016 (0.41)
0.010 (0.25)
0.008 (0.20)
0.005 (0.13)
0.020 (0.51)
0.016 (0.41)
0.010 (0.25)
0.005 (0.13)
0.020 (0.51)
0.016 (0.41)
0.010 (0.25)
0.010 (0.25)
0.031 (0.79)
0.020 (0.51)
0.016 (0.41)
0.016 (0.41)
73
F 30
Table 6
Permissible Variations in Diameter of Wire and Rod
Permissible Variations in
Diameter, plus or minus, in.
(mm)
Wire (Coiled, Spooled, or Straight Lengths)
Specified Diameter, in. (mm)
0.002
0.0044
0.008
0.015
0.020
0.031
0.041
0.061
0.081
0.126
0.157
to 0.0043
to 0.0079
to 0.0149
to 0.0199
to 0.0309
to 0.0409
to 0.0609
to 0.0809
to 0.1259
to 0.1569
to 0.250
(0.051 to 0.109)
(0.112 to 0.201)
(0.203 to 0.378)
(0.381 to 0.505)
(0.508 to 0.785)
(0.787 to 1.039)
(1.041 to 1.547)
(1.549 to 2.055)
(2.057 to 3.198)
(3.200 to 3.985)
(3.99 to 6.35 )
0.002
0.00025
0.0003
0.0004
0.0005
0.0006
0.0007
0.0008
0.001
0.0015
0.002
(0.051)
(0.006)
(0.007)
(0.010)
(0.013)
(0.015)
(0.018)
(0.020)
(0.025)
(0.038)
(0.051)
Rod, Centerless Ground Finish (Straight Lengths)
0.030
0.055
0.125
0.500
1.000
1.626
1.750
2.000
to 0.0549
to 0.1249
to 0.499
to 0.999
to 1.625
to 1.749
to 1.999
to 4.000
Table 7
(0.762 to 1.394)
(1.397 to 3.172)
(3.175 to 12.67)
(12.70 to 25.38)
(25.40 to 41.27)
(41.30 to 44.43)
(44.45 to 50.78)
(50.80 to 101.60)
Under 3/32 (2.4)
3/16 to
(0.013)
(0.025)
(0.038)
(0.051)
(0.064)
(0.076)
(0.102)
(0.13)
Permissible Variations in Dimensions of Standard TubingA
Specified Outside Diameter,
in. (mm)
3/32 to 3/16
0.0005
0.001
0.0015
0.002
0.0025
0.003
0.004
0.005
(2.4 to 4.8), excl
½ (4.8 to 12.7), excl
½ to 1½ (12.7 to 38.1), excl
Outside Diameter,
in. (mm)
+ 0.002 (0.051)
– 0.000
+ 0.003 (0.076
– 0.000
+ 0.004 (0.102)
– 0.000
+ 0.005 (0.127)
– 0.000
A
Any two of the three dimensional tolerances listed may be specified.
74
Inside Diameter,
in. (mm)
+ 0.000
– 0.002 (0.051)
+ 0.000
– 0.003 (0.076)
+ 0.000
– 0.004 (0.102)
+ 0.000
– 0.005 (0.127)
Wall Thickness,
plus or minus,
%
10
10
10
10
F 30
Section A—A
Diameter, in.
0.5 to 1
1 to 2
Thickness, in.
0.090 ± 0.005
0.125 ± 0.005
Metric Equivalents
in.
mm
in.
mm
1/32
0.8
1.2
0.13
2.29
0.125
0.5
1.0
2.0
3.18
12.7
25.4
50.8
3/64
0.005
0.090
Figure 1. Machined Specimen for Porosity Test
Metric Equivalents
in.
1/8
¼
7/16
1
mm
3.2
6.4
11.1
25.4
in.
111/16
2½
3
mm
42.8
63.5
76.2
Figure 2. Test Fixture for Porosity Test
75
F 30
APPENDIX
X1. THERMAL EXPANSION DATA
X1.1
Typical thermal expansion data for the alloys covered by this specifications are given in Table
X1.1 for information only.
Table X1.1
Temperature Range,
°C
30 to 300
30 to 400
30 to 500
30 to 600
30 to 700
30 to 800
30 to 900
30 to 1000
Typical Results of Thermal Expansion Tests
Average Linear Coefficient of Thermal Expansion,
µm/m•°C
42 Alloy
46 Alloy
48 Alloy
52 Alloy
4.4
6.0
7.9
9.6
10.5
11.4
12.3
13.2
7.5
7.5
8.5
9.8
10.7
11.6
12.5
13.4
8.8
8.7
9.4
10.4
11.3
12.1
13.0
13.9
10.1
9.9
9.9
10.8
11.7
12.5
13.3
14.2
The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted
in connection with any item mentioned in this standard. Users of this standard are expressly advised that determination
of the validity of any such patent rights, and the risk of infringement of such rights, are entirely their own responsibility.
This standard is subject to revision at any time by the responsible technical committee and must be reviewed every
five years and if not revised, either reapproved or withdrawn. Your comments are invited either for revision of this
standard or for additional standards and should be addressed to ASTM Headquarters. Your comments will receive
careful consideration at a meeting of the responsible technical committee, which you may attend. If you feel that your
comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,
1916 Race St., Philadelphia, PA 19103.
76
Designation: F 31–68 (Reapproved 1983)ε
1
Reprinted, with permission, from the Annual Book of ASTM Standards,
copyright American Society for Testing and Materials, 1916 Race Street,
Philadelphia, PA 19103.
Standard Specification for
1
42% NICKEL-6% CHROMIUM-IRON SEALING ALLOY
This standard is issued under the fixed designation F 31; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last
reapproval. A superscript epsilon (ε) indicates an editorial change since the last revision or reapproval.
3.1.4 Marking and packaging (Section 16),
and
3.1.5 Certification if required.
1. Scope
1.1 This specification covers an iron-nickelchromium alloy used primarily for glasssealing applications in electronic devices.
4. General Requirements
4.1 The material shall be commercially
smooth, uniform in cross section, in composition, and in temper; it shall be free from scale,
corrosion, cracks, seams, scratches, slivers,
and other defects as best commercial practice
will permit.
2. Applicable Documents
2.1 ASTM Standards:
E 18 Test Methods for Rockwell Hardness
and Rockwell Superficial Hardness of
2
Metallic MateriaIs
E 29 Recommended Practice for Indicating
Which Places of Figures Are to Be Considered Significant in Specified Limiting
3
Values
E 38 Methods for Chemical Analysis of
Nickel-Chromium and Nickel-Chromium4
Iron Alloys
E 112 Methods for Determining Average
5
Grain Size
E 228 Test Method for Linear Thermal
Expansion of Rigid Solids with a Vitreous
3
Silica Dilatometer
F 14 Practice for Making and Testing
6
Reference Glass-Metal Bead-Seal
F 140 Practice for Making Reference GlassMetal Butt Seals and Testing for Expansion
6
Characteristics by Polarimetric Methods
F 144 Practice for Making Reference GlassMetal Sandwich Seal and Testing for
Expansion Characteristics by Polarimetric
6
Methods
5. Chemical Requirements
5.1 The material shall conform to the
requirements of Table 1 as to chemical
composition.
NOTE 1—The major constituents of this alloy may be
adjusted by the manufacturer so that the alloy meets the
requirement for thermal expansion.
6. Chemical Analysis
6.1 Chemical analysis shall be made, when
desired, in accordance with Methods E 38.
7. Surface Lubricants
7.1 All lubricants used during cold-working
operations such as drawing, rolling or spinning, shall be capable of being removed
readily by any of the common organic
degreasing solvents as, for example,
trichloroethylene.
8. Temper
8.1 The desired temper of the material shall
3. Ordering Information
3.1 Orders for material under this specification shall include the following information:
3.1.1 Size,
3.1.2 Temper (Section 7),
3.1.3 Surface finish (Section 9),
1
1
This specification is under the jurisdiction of ASTM
Committee F-1 on Electronics and is the direct responsibility of
Subcommittee F01.03 on Metallic Materials.
Current edition effective Aug. 15, 1968. Originally issued
1963. Replaces F 31 – 63 T.
2
Annual Book of ASTM Standards, Vol 03.01.
3
Annual Book of ASTM Standards, Vol 14.02.
4
Annual Book of ASTM Standards, Vol 03.05.
5
Annual Book of ASTM Standards, Vol 03.03.
6
Annual Book of ASTM Standards, Vol 10.04.
NOTE – Section 2 was added editorially and subsequent
sections renumbered in April 1984.
77
F 31
be specified on the purchase order. Unless
otherwise specified, wire, rod, and tubing shall
be given a final bright anneal by the manufacturer. Strip and sheet shall be annealed
properly to develop drawing properties. For
deep drawing, the hardness shall not exceed
Rockwell B90 when determined in accordance
with Methods E 18.
12.3 The thermal expansion match between
the alloy and a glass may be evaluated by
preparing and testing an assembly in
accordance with Practice F 14, Practice F
140, or Practice F 144.
13. Porosity in Bar or Rod (½-in. Diameter
and Over)
13.1 The specimen of bar or rod ½ in. (12.7
mm) in diameter or over, when tested in accordance with Section 14 shall show no
leakage in the helium leak detector.
9. Grain Size
9.1 Strip and sheet for deep drawing
applications shall have an average grain size
not larger than ASTM No. 5 (Note 2), and no
more than 10% of the grains shall be larger
than No. 5 when measured in accordance
with Methods E 112. For materials less than
0.005 in. (0.13 mm) in thickness, the grain
size shall be such that there are no less than
4 grains across the thickness.
14. Test for Porosity
14.1 Machine the specimen in accordance
with the dimensions of Fig. 1. Degrease the
specimen and lightly pickle it in 1 + 1
hydrochloric acid containing an inhibitor at a
temperature of 65°C; then wash and dry it at
105 to 110°C. Heat treat the specimen at
1100°C for 30 min in a wet-hydrogen
atmosphere and allow it to cool in this
atmosphere.
14.2 Connect the tubulation of the test
fixture shown in Fig. 2 to a helium leak
detector. The sensitivity of the leak detector
–9
3
shall be such that a leak of 1 × 10 cm /s
measured at 20°C and 1 atm pressure, will
give a deflection of at least 5% of full scale.
Exhaust the test fixture, and test the specimen
for leakage by probing all of the exposed surface with a helium jet. If leakage is found,
squirt alcohol all around the specimen-toneoprene seal to make certain that the leak is
through the specimen and not at the gasket
seal. Make this test within 24 h after the
specimen is removed from the heat-treating
furnace.
NOTE 2—This corresponds to a grain size of 0.065 mm
2
or 16 grainslin. of image at 100 ×.
10. Surface Finish
10.1 The standard surface finishes
available shall be those resulting from the
following operations:
10.1.1 Hot rolling,
10.1.2 Forging,
10.1.3 Centerless grinding (rod),
10.1.4 Belt polishing,
10.1.5 Cold rolling, and drawing, and
10.1.6 Wire drawing.
10.2 Care shall be taken to prevent the
depletion of surface chromium during
processing.
11. Thermal Expansion Characteristics
11.1 The average linear coefficient of
thermal expansion expressed as cm per cm
per ° Celsius shall be within limits given in
Table 2.
15. Dimensional Tolerances
15.1 Cold-Rolled Strip-Cold–rolled strip
shall conform to the permissible variations in
dimensions prescribed in Tables 3, 4, and 5.
15.2 Round Wire and Rod–Wire and rod
shall conform to the permissible variations in
dimension prescribed in Table 6.
15.3 Cold-Drawn Tubing–Cold-drawn tubing, available either as seamless or welded,
shall conform to the permissible variations
prescribed in Table 7.
12. Test for Thermal Expansion
12.1 Heat the specimen for 15 min at
1100°C in a hydrogen or cracked-ammonia
atmosphere with a dew point of –40°C and
cool to room temperature at a rate not
exceeding 5°C/min.
12.2 Reheat the specimen to 450°C in a
dilatometer. Hold at 450°C for 25 min; then
determine the thermal expansion curve on
cooling with a precision dilatometer as
specified in Test Method E 228.
16. Test Results
16.1
78
Observed
or
calculated
values
F 31
obtained from analysis, measurements, or
tests shall be rounded off in accordance with
the rounding-off method of Recommended
Practice E 29, to the nearest unit in the last
right-hand place of figures used in expressing
the specified limit.
the purchaser and the seller.
Table 1
17. Packaging and Marking
17.1 Packaging shall be subject to agreement between the purchaser and seller.
17.2 The material as furnished under this
specification shall be identified by the name
or symbol of the manufacturer and by melt
number. The lot size for determining compliance with the requirements of this
specification shall be one heat.
Element
Composition,%
Nickel, nominal
Chromium, nominal
Carbon, max
Manganese, max
Phosphorus, max
Sulfur, max
Silicon, max
Aluminum, max
Iron
42.0
5.6
0.07
0.25
0.025
0.025
0.30
0.20
remainder
Table 2
Coefficient of Thermal Expansion
Coefficient, µm/m °CA
9.7 to 10.4
8.5 to 9.2
Temperature Range. °C
30 to 425
30 to 350
18. Investigation of Claims
18.1 Where any material fails to meet the
requirements of this specification, the material
so designated shall be handled in accordance
with the agreement mutually agreed upon by
Table 3
Chemical Requirements
A
Typical expansion data up to 700°C are given in the
Appendix.
Permissible Variations in Thickness of Cold-Rolled Strip
Note—Measurement shall be made at least 3/8 in. (9.5 mm) from the edge of strip over 1-in. (25.4mm) wide.
Specified Thickness
Permissible Variations in Thickness for Width Given, ±
in.
mm
Under
3 in.
in.
Under
76 mm
mm
Over 3
76 to Over 6 150 to Over 12 300 to
to 6 in. 150 mm to 12 in. 300 mm to 16 in. 400 mm
in.
mm
in.
mm
in.
mm
0.160 to 0.100, incl
0.099 to 0.069, incl
0.068 to 0.050, incl
0.049 to 0.035, incl
0.034 to 0.029, incl
0.028 to 0.026, incl
0.025 to 0.020, incl
0.019 to 0.017, incl
0.016 to 0.012, incl
0.011 to 0.0101, incl
0.010 to 0.0091, incl
0.009 to 0.006, incl
Under 0.006
4.06 to 2.54
2.51 to 1.75
1.73 to 1.27
1.24 to 0.89
0.86 to 0.74
0.71 to 0.66
0.64 to 0.51
0.48 to 0.43
0.41 to 0.30
0.28 to 0.256
0.254 to 0.231
0.228 to 0.152
0.152
0.002
0.002
0.002
0.002
0.0015
0.0015
0.001
0.001
0.001
0.001
0.001
0.00075
0.0005
0.05
0.05
0.05
0.05
0.038
0.038
0.025
0.025
0.025
0.025
0.025
0.019
0.013
0.003
0.003
0.003
0.0025
0.002
0.0015
0.0015
0.001
0.001
0.001
0.001
0.00075
0.0005
79
0.076
0.076
0.076
0.064
0.05
0.038
0.038
0.025
0.025
0.025
0.025
0.019
0.013
0.004
0.003
0.003
0.003
0.0025
0.002
0.002
0.0015
0.0015
0.001
0.001
…
…
0.10
0.076
0.076
0.076
0.064
0.05
0.05
0.038
0.038
0.025
0.025
0.004
0.004
0.003
0.003
0.0025
0.002
0.002
0.002
0.0015
0.0015
0.001
…
…
0.10
0.10
0.076
0.076
0.064
0.05
0.05
0.05
0.038
0.038
0.025
80
in.
0.187 to 0.161
0.160 to 0.100
0.099 to 0.069
0.068 and under
mm
4.75 to 4.09
4.06 to 2.54
2.51 to 1.75
1.73
Specified Thickness
Under
½ to
3/16 in.
in.
...
0.010
0.008
0.005
0.019
0.025
0.038
0.051
127 mm
and Under
mm
0.001
0.0015
0.002
0.0025
Over 5
to 12 in.
in.
0.0015
0.002
0.0025
0.003
Over 12 to
24 in., incl
in.
0.25
0.20
0.13
Under
12.7
to 4.75
mm
in.
0.016
0.010
0.008
0.005
½ to
6 in
12.7 to
150
mm
mm
0.41
0.25
0.20
0.13
Over
6 to
9 in.
in.
0.020
0.016
0.010
0.005
150 to
225
mm
mm
0.51
0.41
0.25
0.13
Over
9 to
12 in.
in.
0.020
0.016
0.010
0.010
225 to
300
mm
mm
0.51
0.41
0.25
0.25
Over
12 to
20 in.
in.
0.031
0.020
0.016
0.016
Permissible Variations in Width for Widths Given, ±
.
0.025
0.038
0.051
0.064
Over 127 to
300 mm
mm
0.038
0.051
0.064
0.076
Over 300 to
600 mm
mm
300
to
500
mm
mm
0.79
0.51
0.41
0.41
Permissible Variations in Width of Cold-Rolled Strip Supplied in Coils
0.00075
0.001
0.0015
0.002
0.13 to 0.25
0.25 to 0.64
0.64 to 1.65
1.65 to 4.74
0.005 to 0.010, incl
Over 0.010 to 0.025, incl
Over 0.025 to 0.065, incl
Over 0.065 to 3/16, excl
Table 5
5 in. and
Under
in.
mm
Maximum Variation in Thickness Across Width of Strip, Within Those Provided
for in Table 1 for Edge Measurements for Widths and Thicknesses Given.
in.
Specified Thickness
Table 4 Permissible Variation In Thickness Across Width of Strip
Over
20 to
2315/16
in.
in.
0.031
0.020
0.020
0.020
500
to
600
mm
mm
0.79
0.51
0.51
0.51
F31
F 31
Table 6 Permissible Variations in Diameter
of Wire and Rod
Specified Diameter
in.
Permissible Variations in Diameter, ±
mm
in.
mm
Wire (Coiled, Spooled or Straight Lengths)
0.002 to 0.0043
0.0044 to 0.0079
0.008 to 0.0149
0.015 to 0.0199
0.020 to 0.0309
0.031 to 0.0409
0.041 to 0.0609
0.061 to 0.0809
0.081 to 0.1259
0.126 to 0.1569
0.157 to 0.250
0.0002
0.00025
0.0003
0.0004
0.0005
0.0006
0.0007
0.0008
0.001
0.0015
0.002
0.051 to 0.109
0.112 to 0.200
0.203 to 0.378
0.381 to 0.505
0.508 to 0.785
0.787 to 1.039
1.041 to 1.547
1.549 to 2.055
2.057 to 3.198
3.200 to 3.985
3.988 to 6.35
0.005
0.0064
0.0076
0.0102
0.0127
0.0152
0.0178
0.0203
0.0254
0.038
0.051
Rod, Centerless Ground Finish (Straight Lengths)
0.030 to 0.0549
0.055 to 0.1249
0.125 to 0.499
0.500 to 0.999
1.000 to 1.625
1.626 to 1.749
1.750 to 1.999
2.000 to 4.000
0.766 to
1.397 to
3.175 to
12.70 to
25.4 to
41.3 to
44.45 to
50.8 to
1.394
3.172
12.67
25.37
41.27
44.42
50.17
101.6
0.0005
0.001
0.0015
0.002
0.0025
0.003
0.004
0.005
0.0127
0.0254
0.038
0.051
0.064
0.076
0.010
0.013
Table 7 Permissible Variations in Dimensions of Standard Tubing
Permissible VariationsA
Specified Outside Diameter,
Outside Diameter
in.
A
mm
Under 0.093
2.36
0.093 to 0.187, excl
2.36 to 4.75
0.187 to 0.550, excl
4.75 to 12.7
0.500 to 1.500, excl
12.7 to 38.1
Inside Diameter
in.
mm
in.
mm
+ 0.002
– 0.000
+ 0.003
– 0.000
+ 0.004
– 0.000
+ 0.005
– 0.000
+ 0.051
– 0.000
+ 0.076
– 0.000
+ 0.102
– 0.000
+ 0.13
– 0.00
+ 0.000
– 0.002
+ 0.000
– 0.003
+ 0.000
– 0.004
+ 0.000
– 0.005
+ 0.000
– 0.051
+ 0.000
– 0.076
+ 0.000
– 0.102
+ 0.000
– 0.13
Any two of the three dimensional tolerances listed may be specified.
81
Wall
Thickness,
plus or
minus, %
10
10
10
10
F 31
Section A—A
Diameter, in.
½ to 1
1 to 2
Thickness, in.
0.090 ± 0.005
0.125 ± 0.005
Figure 1. Machined Specimen for Porosity Test
Figure 2. Test Fixture for Porosity Test
82
F 31
APPENDIX
(Nonmandatory Information)
XI. THERMAL EXPANSION DATA
XI.1 The following typical thermal expansion data for 42% nickel-6% chromium-iron sealing alloy are given for information only.
Temperature Range.
°C
30 to 300
30 to 400
30 to 500
30 to 600
30 to 700
Average Linear Coefficient of Thermal
Expansion.
µm/m. °C
8.2
10.1
11.2
12.1
13.0
The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted in connection with
any item mentioned in this standard. Users of this standard are expressly advised that determination of the validity of any such patent
rights, and the risk of infringement of such rights, are entirely their own responsibility.
This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years and if not
revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standards and should be
addressed to ASTM Headquarters. Your comments will receive careful consideration at a meeting of the responsible technical committee,
which you may attend. If you feel that your comments have not received a fair hearing you should make your views known to the ASTM
Committee on Standards. 1916 Race St., Philadelphia, Pa. 19103.
83
MIL-I-23011C
29 March 1974
Military Specification
Superseding
MIL-I-23011 B (ASG)
30 April 1965
IRON-NICKEL ALLOYS FOR SEALING
TO GLASSES AND CERAMICS
This specification is approved for use by all Departments and Agencies of the Department of Defense.
1. Scope
Cold drawn or rolled
Belt polished
* 1.2.4 Condition and temper. Condition and
temper shall be as follows (see Tables IV
and V):
Annealed
¼ hard (one quarter hard temper)
½ hard (one half hard temper)
Hard (full hard temper)
1.1 Scope. This specification covers a series of iron-nickel, iron-nickel-cobalt, and ironnickel-chromium alloys used for sealing to
glasses and ceramics in electronic applications (see 6.1)
* 1.2 Classification. The alloys shall be of the
following classes, forms, finishes, and conditions, as specified (see 6.2):
* 1.2.1 Classes. Classes shall be as follows:
Class 1 - Iron-nickel-cobalt alloy
(29% Ni, 17% Co,
remainder Fe)
Class 2 - Iron-nickel alloy (50.5% Ni,
remainder Fe)
Class 3 - Iron-nickel alloy (48% Ni,
remainder Fe)
Class 4 - Iron-nickel alloy (46% Ni,
remainder Fe)
Class 5 - Iron-nickel alloy (41% Ni,
remainder Fe)
Class 6 - Iron-nickel-chromium alloy
(41 % Ni, 5.5% Cr,
remainder Fe)
Class 7 - Iron-nickel alloy (36% Ni,
remainder Fe)
* 1.2.2 Forms. Alloys shall be in the form
specified in Table I.
Table I.
Forms
Bar
1
X
2. Applicable Documents
2.1 The following documents, of the issue in
effect on date of invitation for bids or request
for proposal, form a part of this specification
to the extent specified herein:
Specifications:
Military
MIL-C-16173
Corrosion Preventive Compound,
Solvent
Cutback,
ColdApplication
Standards:
Federal
Fed. Std. No. 48
Tolerances for Steel
and Iron Wrought Products
Fed. Test Method Metal; Test Methods
Std. No. 151
Military
MIL-STD-105 Sampling Procedures and
Tables for Inspection by Attributes
MIL-STD-163
Steel Mill Products; Preparation for Shipment and Storage
Availability of forms
2
X
3
X
Class
4
5
X
X
6
---
7
X
X
Rods
X
X
X
X
X
---
Ribbon
X
X
---
X
X
X
--
Strip
X
X
X
X
X
---
X
Tubing
X
---
---
---
---
---
--
Wire
X
X
X
X
X
X
X
(Copies of specifications, standards, drawings, and publications required by suppliers in
connection
with
specific
procurement
functions should be obtained from the procuring activity or as directed by the contracting
officer.)
* 2.2 Other publications. The following documents form a part of this specification to the
extent specified herein. Unless otherwise indicated, the issue in effect on date of invitation for bids or request for proposal shall
apply:
* 1.2.3 Finishes. Finishes shall be as follows:
Hot rolled or forged
Centerless ground
84
MIL-I-23011 C
es 2 to 6, inclusive, which are less than 0.005
inch in thickness, the grain size shall be such
that there are no less than 9 grains across the
thickness in the short transverse direction.
3.6 Phase transformation. No phase transformation shall occur in the finished forms of
the Class 1 alloy from 1100°C to –80°C (see
4.5.6), except that material having a thickness
or diameter exceeding 0.75 inch, some localized transformation may be tolerated if it does
not exceed 1 percent of the cross section.
3.7 Porosity. When specified in the contract
or order (see 6.2), material shall show no leakage, when tested with a helium leak detector
(see 4.5.7).
3.8 Permissible variations in dimensions. The
permissible variations in dimensions shall be
as shown in applicable paragraph and table
for the various forms of material (see 4.4.1).
3.8.1 Bars, rods, and wire diameter, thickness, or width. Bars, rods, and wire, measured
on their diameters or between parallel faces,
shall not vary at any point from the specified
dimensions by more than the amounts shown
in Tables VI, VII, VIII, and IX.
3.8.1.1 Straightness. The permissible variation in straightness of rods and bars as
determined by the departure from true
straightness (thrown in one revolution for rods
or depth of chord for bars) shall be as specified in Table X.
3.8.2 Ribbon width. The permissible variation in width of ribbon shall be as specified in
Table XI.
3.8.2.1 Ribbon thickness. The permissible
variation in thickness of ribbon shall be the
same as those applicable to wire in Table VI.
Strip
dimensions.
The
strip
3.8.3
dimensions and allowable variation shall
conform to Tables XII, XIII, and XIV.
3.8.3.1 Thickness. Permissible variation in
thickness of cold rolled strip shall be as specified in Table XII.
3.8.3.2 Strip crown tolerance. Permissible
variation in crown tolerance, which is a permissible additive variation at the middle of the
strip to the permissible variation at the edge
as specified in 3.8.3.1 and Table XI, shall be
as specified in Table XIII.
3.8.3.3 Strip width. Permissible variation in
width of cold rolled slit edge strip shall be as
specified in Table XIV. The dimensions for
American Society for Testing and Materials
Publications
ASTM E8 - Methods of Tension Testing of
Metallic Material
ASTM E18 - Methods of Test for Rockwell
Hardness and Rockwell Superficial
Hardness of Metallic Materials
ASTM E112 - Methods for Estimating the
Average Grain Size of Metals
ASTM E228 - Method of Test for Linear
Thermal Expansion of Rigid Solids
with a Vitreous Silica Dilatometer
(Application for copies of ASTM publications
should be addressed to American Society for
Testing and Materials, 1916 Race Street,
Philadelphia, PA 19103.)
3. Requirements
3.1 Condition and temper. Unless otherwise
specified in the contract or purchase order,
rod, ribbon, tubing, and wire shall be bright
annealed. Strip shall be annealed properly to
have deep drawing or spinning properties.
(see 6.2).
3.1.1 Drawing and forming. Compounds and
lubricants used in drawing and forming operations and during cold working shall be capable of being completely removed by vapor
degreasing.
* 3.2 Chemical composition. The chemical
composition of the iron-nickel alloys shall be
as specified in Table II (see 4.5.1).
* 3.3 Linear coefficient of thermal expansion.
The linear coefficient of thermal expansion
shall conform to the value for the applicable
class as listed in Table III (see 4.5.2).
* 3.4 Tensile strength or hardness. The tensile strength for the applicable class of materials in the finished form and in the specified
condition and temper shall conform to Table
IV (see 4.5.3). If the size of product prevents
the cutting of tensile specimens as defined by
ASTM E8, conformance to hardness requirements of Table V may be substituted.
3.5 Grain size. The average grain size of annealed strip materials to be used for deep
drawing or spinning purposes shall be no larger than No. 5 and no more than 10 percent of
the individual grains may be larger than No. 5
(see 4.5.5). However, for material of Class-
85
MIL-I-23011 C
either as seamless or welded, shall be as
specified in Table XV.
3.9 Identification. Material shall be furnished
in lots which shall be identified by this specification number, class number, finish, manufacturer’s alloy designation, name or symbol of
supplier, melt number and size.
strip, other than slit edge, shall be as
negotiated between the vendor and procuring
activity, and permissible variations in width
shall be as specified in Fed. Std. No. 48 for
low alloy steel strip.
* 3.8.4 Tubing dimensions. Permissible variation in dimensions of cold drawn tubing,
Table II.
Chemical composition
Class
Elements
(percent) 1/
Nickel (Ni)
Cobalt (Co)
Chromium (Cr)
Manganese (Mn)
Silicon (Si)
Carbon (C)
Aluminum (AI)
Magnesium (Mg)
Zirconium (Zr)
Titanium (Ti)
Phosphorus (P)
Sulfur (S)
Iron (Fe)
1
2
3
4
5
6
7
2/ 29
2/ 17
--0.50
0.20
0.06
3/ 0.10
3/ 0.10
3/ 0.10
3/ 0.10
----Remainder
2/ 50.5
0.50
0.10
0.60
0.30
0.05
0.10
------0.025
0.025
Remainder
2/ 48
0.50
0.10
0.80
0.30
0.05
0.10
------0.025
0.025
Remainder
2/ 46
0.50
0.10
0.80
0.30
0.05
0.10
------0.025
0.025
Remainder
2/ 41
0.50
0.10
0.80
0.30
0.05
0.10
------0.025
0.025
Remainder
2/ 42.0
--2/ 5.6
0.25
0.30
0.07
0.20
------0.025
0.025
Remainder
2/ 35.5-36.5
--0.25
0.50
0.25
0.05
3/ 0.10
3/ 0.10
3/ 0.10
3/ 0.10
0.020
0.020
Remainder
1/
All percentages are maximum, unless otherwise indicated.
2/
Nominal contents. The nominal contents of the alloys shall be adjusted by the
supplier so that the alloys meet the requirements for thermal expansion (see 3.4)
3/
Total permissible contents of aluminum, magnesium, zirconium, and titanium shall
not exceed 0.20 percent.
Table III.
Linear coefficients of thermal expansion
Linear coefficient of thermal expansion
–6
cm. per cm. per °C × 10
Temperature
Range — °C
30-100
30-200
30-300
30-350
30-400
30-425
30-450
30-500
30-550
Class
1
2
3
4
5
6
7
--------4.6-5.2
--5.1-5.5
-----
------------9.6-10.1
--10.2-10.7
--------8.2-9.2
------9.6-10.3
------7.1-7.8
------8.2-8.9
---
----4.0-4.7
------6.7-7.4
-----
------8.5- 9.2
--9.7-10.4
-------
0.8-1.6
1.3-2.1
--6.2-7.0
----8.5-9.2
-----
Table IV.
Tensile Strength (1,000 psi)
Condition
All classes
Annealed
1/4 Hard
1/2 Hard
Hard
85 max.
90 to 115
105 to 125
120 min.
86
MIL-I-23011 C
Table V.
Condition
Hardness, Rockwell B
Class
2,3,4,5,7
1
Annealed
1/4 Hard
1/2 Hard
35 max.
90 to 93
94 to 96
70 max.
78 to 83
84 to 88
1/
70 max.
78 to 83
84 to 88
1/
2/
1/
Hardness for deep drawing strip material less than 0.100 inch shall be
Rockwell B82 maximum and Rockwell B85 maximum for material over 0.100
inch.
2/
The maximum hardness for deep drawing strip material shall be Rockwell B90.
Table VI.
Permissible variation in diameter
of cold drawn wire and rods
Specified diameter,
inch
Permissible variation
plus or minus, inch
Under 0.008
Over 0.008 to 0.015, incl.
Over 0.015 to 0.020, incl.
Over 0.020 to 0.030, incl.
Over 0.030 to 0.040, incl.
Over 0.040 to 0.060, incl.
Over 0.060 to 0.080, incl.
Over 0.080 to 0.125, incl.
Over 0.125 to 0.156, incl.
Over 0.156 to 0.188, incl.
Over 0.188 to 0.250, incl.
Over 0.250 to 0.500, incl.
Over 0.500 to 1.000, incl.
0.00025
0.0003
0.0004
0.0005
0.0006
0.0007
0.0008
0.001
0.0015
0.002
0.005
0.010
0.020
Table VII.
Permissible variation in distance between
parallel surfaces of cold drawn bars
Permissible variation under
specified dimension, inch
Specified dimension,
inch 1/
0.0002
0.00025
0.0003
0.0004
0.0005
0.0006
0.0007
0.001
0.002
0.002
0.0043 and under
0.0044 to 0.0079, incl.
0.008 to 0.0149, incl.
0.0150 to 0.0199, incl.
0.020 to 0.031, incl.
0.032 to 0.045, incl.
0.046 to 0.079, incl.
0.080 to 0.1875, incl.
0.1876 to 0.406, incl.
Over 0.406
1/
6
Dimensions apply to the distance between flats for hexagons and squares
and separately to width and thickness of rectangles.
87
MIL-I-23011 C
Table VIII.
Permissible variation in diameter of
hot rolled rods
Specified diameter,
inch
Permissible variation from
specified diameter plus
or minus, inch
0.250 to 0.750, incl.
Over 0.750 to 1.250, incl.
Over 1.250 to 3.500, incl.
0.010
0.015
0.025
Table IX.
Permissible variation in diameter of
centerless ground rods
Specified diameter,
inch
Permissible variation,
inch
0.835 and under
0.836 to 1.125, incl.
1.126 to 1.750, incl.
1.751 to 2.000, incl.
2.001 to 3.000, incl.
Table X.
Plus
Minus
0.000
0.002
0.0025
0.004
0.005
0.002
0.002
0.0025
0.004
0.005
Permissible variation in straightness of
rods and bars
Specified diameter or distance
between parallel surfaces,
inch 1/
Permissible variation in
given lengths,
inch
Rods — cold drawn:
0.500 and under
Over 0.500 to 1.000, incl.
Throw in one revolution:
0.003 in 18 inches of length
0.005 in 42 inches of length
Rods — hot rolled:
All sizes
Throw in one revolution
0.150 in 36 inches of length
Bars — cold drawn:
All sizes 2/
Depth of chord:
0.150 in 36 inches of length
1/
Dimensions apply to the diameter of rods, distance between parallel flats for hexagons
and squares, and separately to width and thickness of rectangles.
2/
Bars are available with square, rectangular, and hexangular cross-sectional areas.
Table XI.
Permissible variation in width of ribbon or flattened
round wire
Specified width,
inch
Permissible variation in
width, plus or minus, inch
0.0156 and under
0.0157 to 0.0468, incl.
0.0469 to 0.0781, incl.
0.0782 to 0.1875, incl.
Over 0.1875
0.0015
0.002
0.0025
0.003
0.005
88
MIL-1-23011 C
Table XII.
Permissible variation in thickness of
cold rolled strip 1/
Permissible variation in thickness, plus
or minus, for given width, inch
Over
Over
Over
Less than
3 to 6
6 to 12
12 to 16
3 inches
inches
inches
inches
Specified thickness,
inch
Under 0.006
0.006 to 0.009, incl.
0.0091 to 0.010, incl.
0.0101 to 0.011, incl.
0.012 to 0.016, incl.
0.017 to 0.019, incl.
0.020 to 0.025, incl.
0.026 to 0.028, incl.
0.029 to 0.034, incl.
0.035 to 0.049, incl.
0.050 to 0.068, incl.
0.069 to 0.099, incl.
0.100 to 0.160, incl.
1/
0.0005
0.00075
0.001
0.001
0.001
0.001
0.001
0.0015
0.0015
0.002
0.002
0.002
0.002
0.0005
0.00075
0.001
0.001
0.001
0.001
0.0015
0.0015
0.002
0.0025
0.003
0.003
0.003
----0.001
0.001
0.0015
0.0015
0.002
0.002
0.0025
0.003
0.003
0.003
0.004
----0.001
0.0015
0.0015
0.002
0.002
0.002
0.0025
0.003
0.003
0.004
0.004
Measurements shall be made at least 3/8 inch from the edge of strips over 1-inch wide.
Table XIII.
Permissible crown in cold rolled strip
Permissible additional thickness at middle of
strip over that provided for in Table XI for
edge measurements, for given widths, inch
Over
Over
To
5 to 12
12 to 24
5 inches
inches
inches
incl.
incl.
incl.
Specified thickness,
inch
0.010 and under
Over 0.010 to 0.025, incl.
Over 0.025 to 0.065, incl.
Over 0.065 to 0.188, incl.
Table XIV.
0.00075
0.001
0.0015
0.002
0.001
0.0015
0.002
0.0025
0.0015
0.002
0.0025
0.003
Permissible variation in width of cold rolled strip
Specified thickness,
inch
Specified width,
inches
Permissible variation
in width, plus
or minus, inch
Under 0.125
0.125 to 0.188, incl.
Over 0.750 to 5, incl.
Over 5 to 16, incl.
0.005
0.010
Table XV.
Specified outside
diameter, inch
Less than and
excluding 3/32
3/32 to 3/16, excl.
3/16 to 1/2, excl.
1/2 to 1-1/2, excl.
Permissible variation in dimensions of seamless
or welded cold-drawn tubing
Outside
diameter,
inch
Plus
Minus
0.002
0.003
0.004
0.005
0.000
0.000
0.000
0.000
89
Permissible variation
Inside
diameter,
inch
Plus
Minus
0.000
0.000
0.000
0.000
0.002
0.003
0.004
0.005
Wall
thickness,
percent
Plus or Minus
10
10
10
10
MIL-I-23011 C
3.10 Workmanship. All forms shall have
uniform surface finishes. The surfaces shall
be commercially smooth, free from scale, corrosion, cracks, scratches, seams, laps or
folds, slivers and other injurious defects which
would impair their serviceability for the use intended.
or prepared from each group of ingots of the
same alloy poured simultaneously from the
same source of molten metal by the supplier
for test of 4.5.2. The sample shall then be
worked down to small rounds for testing.
Specimens for thermal expansion tests may
be taken from the same sample as the
specimens for chemical analysis when
dimensions permit.
4.3.2.2 Finished product sampling. Finished
products need not be sampled unless in the
form of bars and rods over ¼ inch in diameter.
When sampling has not been made in
accordance with 4.3.2.1, a sample over 6
inches in length shall be selected at random
from each lot to provide a specimen for the
test of 4.5.2.
4.3.3 Tensile test. A total of three
specimens shall be taken from three
individual lengths, selected at random from
each lot. If the lot consists of less than three
lengths, a specimen shall be taken from each
length (see 4.5.3).
4.3.4 Hardness test. A total of three
specimens shall be taken from three
individual lengths selected at random from
each lot. If the lot consists of less than three
lengths, a specimen shall be taken from each
length (see 4.5.4).
4.3.5 Grain size. Sampling shall be
performed only on sheet and strip materials to
be used for deep drawing purposes. A total of
three specimens shall be taken from three
individual lengths selected at random from
each lot. If the lot consists of less than three
lengths, a specimen shall be taken from each
length (see 4.5.3).
4.3.6 Phase transformation test. Unless
otherwise specified, one specimen ½ inch in
length shall be taken from one individual
length selected at random from each lot. The
specimen shall be taken only from materials
whose minimum cross-sectional dimension is
less than 7/8 inch. The specimen shall include
the entire cross-sectional area of the material
if possible (see 4.5.6).
4.3.7 Porosity. When specified, one
specimen shall be taken from one individual
length selected at random from each lot. The
specimen shall be taken only from material
which can provide the dimensional requirements specified for a porosity test
4. Quality Assurance Provisions
* 4.1 Responsibility for inspection. Unless
otherwise specified in the contract or
purchase order, the supplier is responsible
for the performance of all inspection
requirements as specified herein. Except as
otherwise specified, in the contract or order,
the supplier may use his own or any other
facilities suitable for the performance of the
inspection requirements specified herein,
unless disapproved by the Government. The
Government reserves the right to perform any
of the inspections set forth in the specification
where such inspections are deemed
necessary to assure supplies and services
conform to prescribed requirements.
4.2 Lot. Unless otherwise specified in the
contract or purchase order (see 6.2), a lot
shall consist of material of the same class, of
one form, of the same cross-sectional area,
condition, temper, and finish produced under
the same conditions and submitted for
delivery at one time.
4.3 Sampling.
4.3.1 Chemical test.
4.3.1.1 Ingot sampling. At least one sample
shall be taken from each group of ingots of
the same alloy poured simultaneously from
the same source of molten metal by the
supplier for the test of 4.5.1. Complete ingot
analysis record shall be available to the procuring activity.
4.3.1.2 Finished product sampling. When
sampling has not been made in accordance
with 4.3.1.1, four individual lengths shall be
selected at random from each lot of material
to provide a composite sample for the test of
4.5.1. If the lot consists of less than 4 lengths,
a sample piece shall be taken from each
length.
4.3.2 Linear thermal expansion test.
* 4.3.2.1 Ingot sampling. At least one sample
from 6 to 10 inches in length and over ¼ inch
in diameter shall be taken from each group
90
MIL-I-23011 C
expansion of the alloy class in Table III in the
dilatometer.
* 4.5.2.1 Heat treatment of specimens. Prior
to test, specimens for the thermal linear
coefficient of expansion test (see 4.5.2) and
phase transformation test (see 4.5.6) shall be
heat treated in a furnace atmosphere of
hydrogen as follows: Heat Class 1 alloy
specimens for 1 hour at 900°C, raise
temperature to 1100°C and soak specimens
for 15 minutes. Between the 900°C and the
1100°C
heat-treatment
periods,
the
specimens may be cooled to room
temperature. Heat soak Classes 2 through 5
and Class 7 specimens for 1 hour at 900°C,
and Class 6 specimens for 15 minutes at
1100°C. At the end of the soak period,
furnace cool to 175°C or less, preferably room
temperature, at a cooling rate not to exceed
5°C per minute before removal from the oven.
* 4.5.3 Tensile test. The samples selected in
accordance with 4.3.3 shall be tested in
accordance with ASTM E8 to assure
compliance with the condition or temper
specified in 3.4 and Table IV.
* 4.5.4 Hardness test. The samples selected
in accordance with 4.3.4 shall be tested in
accordance with ASTM E18 to assure
compliance with the condition or temper
specified in Table V.
* 4.5.5 Grain size. The specimens selected in
accordance with 4.3.5 shall be polished,
etched, and examined at 100 magnifications
on a metallograph to assure compliance with
the requirements of 3.5. Determinations of
grain size shall be performed in accordance
with ASTM E112. The specified grain size
No. 5 represents grains having diameters
between 0.060 to 0.064 mm or 16 grains per
a square inch of image at 100 magnifications.
4.5.6 Phase transformation test. The
specimen selected in accordance with 4.3.6
shall be examined for phase transformation or
the presence of the alpha phase as follows:
heat treat as specified in 4.5.2.1. When cool,
polish and etch in an etchant consisting of
three parts of concentrated hydrochloric acid
and one part of concentrated nitric acid
saturated with cupric chloride, prepared from
20 to 60 minutes prior to etching. Soak the
etched specimen at –80°C, produced by an
excess of dry ice in alcohol, for a minimum
specimen in Figure 1 (see 4.5.7).
4.3.8 Visual and dimensional. A random
sample shall be selected from each lot in
accordance with MIL-STD-105, Inspection
Level II, Acceptable Quality Level 2.5 percent
defective for bars, rods, tubing and flat strip
and an Acceptable Quality Level of 2.5
percent defects per 100 feet of coiled strip,
ribbon, and wire. The sample footage of alloy
material shall consist of approximately equal
length of strips taken from the outer end of
each coil or spool of wire, ribbon, and sheared
strip in the lot. The total sample shall consist
of a minimum of 50 feet from each lot.
4.4 Examinations
4.4.1 Visual and dimensional examination.
Finished material selected in accordance with
4.3.8 shall be visually inspected to determine
compliance with 3.10 and dimensionally
examined to determine conformance to
dimensional requirements of 3.8.
4.4.2 Preparation for delivery. The entire lot
shall be visually examined to assure compliance with the identification requirements of
3.9 and the preservation, packaging, packing,
and marking requirements of Section 5.
4.5 Tests.
4.5.1 Chemical Analysis Specimens shall
be prepared from the samples selected in
accordance with 4.3.1.1 or 4.3.1.2 and tested
in accordance with Method 111 or Method
112 of Fed. Test Method Std. No. 151 to
determine conformance to the chemical
requirements of Table II. If the ingot sample
fails to conform to Table II, the ingot shall be
rejected. If the finished product sample fails to
conform to Table II, the lot shall be rejected.
4.5.2 Linear thermal expansion. The sample
selected as specified in 4.3.2.1 or the bar and
rod finished product sample selected as
specified in 4.3.2.2 shall be used to determine
conformance of the material to 3.3.
Dilatometric determination of the linear coefficient of thermal expansion shall be
performed in accordance with the procedure
described in ASTM E228. Prior to the
dilatometric analysis, the specimen shall be
heat treated as specified in 4.5.2.1. The linear
thermal coefficient of expansion shall be
determined from the cooling curve after
heating the specimen 25° to 50°C above the
highest temperature specified for the thermal
91
MIL-I-23011 C
prepared specimen shall be decarburized in a
furnace at 1100°C for 30 minutes and
subsequently furnace cooled to 200°C or
room temperature at a cooling rate not to
exceed 5°C per minute. The furnace atmosphere during decarburization and cooling
shall have a controlled hydrogen atmosphere
at a dew point from 20°C to 30°C. The
porosity test shall be performed upon
the decarburized specimen, mounted as
illustrated in Figure 2, upon the specimen
containing fixture. After the decarburizing
treatment, specimens should only be handled
with tweezers, clean plastic gloves or finger
cots. The tubulation of the specimen containing fixture shall be connected to the inlet of a
fixed focus mass spectrometer. The fixture
shall then be evacuated and the entire surface
of the test specimen probed with a helium jet
in accordance with Method 441 of Fed. Test
Method Std. No. 151. When leakage is detected, the procedure shall be repeated by first
of 4 hours. Examine microscopically at 150
magnifications over the entire surface. The
presence of an acicular structure at any point
on the etched surface shall be cause for
rejection as specified in 3.6.
* 4.5.7 Porosity test. When required, the
specimen selected as specified in 4.3.7 and
machined in accordance with Figure 1, shall
be subjected to the porosity test using a
helium leak detector sufficiently sensititve to
-9
detect a leak of 1 × 10 cc per second at
20°C and one atmosphere pressure at a
deflection of at least 5 percent of full scale.
Prior to performing the actual test, the
specimen shall be chemically prepared
and metallurgically conditioned. Chemical
preparation: The machined specimen shall be
degreased in a solvent, such as acetone,
pickled in an aqueous solution of 1 to 1
inhibited hydrochloric acid, rinsed and dried
at a temperature from 105° to 110°C.
Metallurgical conditioning: The chemically
Specimen dimensions, inch
A
B
C
D
E
1/2 to 1
1 to 2
0.090 ± 0.005
0.125 ± 0.005
0.250
0.250
.031 to
.047
.031 R
Max.
Figure 1. Porosity Test Specimen
92
MIL-1-23011C
Figure 2. Specimen Containing Fixture for Porosity Test
5. Preparation for Delivery
A or C, as specified (see 6.2), in accordance
with MIL-STD-163.
5.3 Packing. Packing of the bars, rods,
ribbon, strips, tubing and wire shall be level A
or C, as specified (see 6.2), in accordance
with MIL-STD-163.
5.4 Marking. In addition to any special marking specified in contract or order, marking
shall be in accordance with MIL-STD-163.
5.1 Preservation. When specified in the
contract or order (see 6.2), the bars, rods,
ribbon, strips, tubing, and wire shall be coated
with preservative conforming to MIL-C-16173,
grade 2.
5.2 Packaging. Packaging of the bars, rods,
ribbon, strips, tubing, and wire shall be level
6. Notes
6.1 Intended use. Material procured by this
specification is intended for applications in
electronic components where hermetic seals
are required between glass and metal or
ceramic and metal.
6.1.1 Class 1 alloy is the sealing alloy most
squirting or painting alcohol all around the
specimen-to-neoprene seal and then probing
with the helium jet to prove that the leakage is
through the specimen and not at the seal.
4.6 Rejection criteria. Failure of any specimen to conform to this specification shall be
cause for rejection of the lot represented.
93
MIL-I-23011 C
commonly used with hard, low expansivity,
borosilicate glasses where the applications
require glasses of low thermal expansion,
high thermal shock resistance, high strength,
and high electrical resistance. In current
commercial practice, the borosilicates have
setting point temperatures ranging from
450°C to 472°C and thermal coefficients of
expansion at these temperatures ranging from
–6
5.0 to 5.8 × 10 cm/cm/°C.
6.1.2 Classes 2, 3, and 6 alloys are the
sealing alloys used with soft glasses
belonging to the potash-soda-lead and sodalime series. The setting point temperatures of
these glasses range from 410° to 590°C, and
the thermal coefficients of expansion at these
–6
temperatures range from 9.7 to 10.2 × 10
cm/cm/°C.
6.1.3 Class 4 alloy is most frequently used
for sealing applications with glazed ceramics.
6.1.4 Class 5 alloy is the sealing alloy used
with the softer borosilicate glasses and leaded glasses. The leaded glasses are used
where the applications demand glasses with
very high surface resistivity or controlled radiaation shielding.
* 6.1.5 Class 7 alloy is a low expansion
material used as the sealing alloy in special
applications, such as with optical glasses,
where dimensional changes must be
minimized when exposed to low temperatures
such as –40°C to 0°C.
* 6.2 Ordering data. Procurement documents
should specify:
strip if applicable (see 3.8).
(i) Quantity of material required (see 4.2).
(j) Additional specimens for phase
transformation test (see 4.3.6).
(k) Preservation, if required (see 5.1).
(I) Level of packaging and packing
required (see 5.2 and 5.3).
(m) Special marking, if required (see 5.4).
6.3 Bar stock. Bar stock with square, rectangular, or hexagonal cross-sectional areas
are generally not stock items, but are
available upon request.
* 6.4 Phase transformation. Specimens of
Class 1 alloy being microexamined for phase
transformation (see 4.5.6) may be compared
with the illustrations shown in ASTM F 15,
specification for Iron-Nickel-Cobalt Sealing
Alloy, for presence or absence of an acicular
structure. Figure 1 shows specimen with no
transformation, whereas Figure 2 shows
specimen with partial transformation.
* 6.5 Typical thermal expansion data for the
alloys are given in Table XVI to assist in the
selection of material and for information only.
* 6.6 For ease and simplicity of referencing
this document with those documents issued
by the American Society for Testing and
Materials, the following cross reference is
included for information only:
MIL-I-23011
ASTM Designation
Class 1
F15, Iron-nickel-cobalt
sealing alloy
F30, Alloy No. 52 Iron-nickel
sealing alloy
F30, Alloy No. 48 Iron-nickel
sealing alloy
F30, Alloy No. 46 Iron-nickel
sealing alloy
F30, Alloy No. 42 Iron-nickel
sealing alloy
F31, 42 percent nickel - 6
percent chromium iron
sealing alloy
Class 2
(a) Title, number, and date of this specification.
(b) Class, form, and finish of material
required (see 1.2, 1.2.1, 1.2.2, and 1.2.3).
(c) Condition, and if applicable, temper
(see 1.2, 1.2.4, and 3.1).
(d) Porosity test, if required (see 3.7 and
4.3.7).
(e) Diameter of rod and wire, if applicable
(see 3.8).
(f) Dimensions of bar stock, if applicable,
as well as shape (square, rectangular, or
hexangular (see 3.8).
(g) Dimensions of tubing, if applicable
(see 3.8).
(h) Thickness dimension of ribbon and
Class 3
Class 4
Class 5
Class 6
6.7 Changes from previous issues. The
outer margins of this specification have been
marked “*” to indicate where changes (deletions,
additions, etc.) from the previous issue have
been made. This has been done as a convenience only and the Government assumes
94
MIL-I-23011 C
no liability whatsoever for any inaccuracies in
these notions. Bidders and contractors are
cautioned to evaluate the requirements of this
document based on the entire contents as
written irrespective of the marginal notations
and relationship to the last previous issue.
User Activities:
Army - AT, AV, MI
Navy - OS
Air Force - 17
Review/user information is current as of the
date of this document. For future coordination
of changes to this document, draft circulation
should be based on the information in the current Federal Supply Classification Listing of
DoD Standardization Documents.
Preparing Activity:
Navy - AS
Project No. 9505-0071
Custodians:
Army - MR
Navy - AS
Air Force - 11
Review Activities:
Army - ME
Air Force - 84
Table XVI.
Typical thermal expansion data
Linear coefficient of thermal expansion —
cm. per cm. per °C x 10–6
Temperature
range
°C
Class
1
2
3
4
5
6
7
30 to 100
—
10.5
9.4
8.2
4.8
—
1.18
30 to 150
—
10.5
9.4
8.1
4.6
—
—
30 to 200
5.5
10.4
9.4
7.9
4.5
—
1.72
30 to 250
—
10.4
9.3
7.8
4.5
—
—
30 to 300
5.1
10.2
8.8
7.5
4.5
8.2
4.92
30 to 325
—
—
—
—
4.7
—
—
30 to 350
—
10.2
9.0
7.4
5.0
8.7
6.60
30 to 375
—
—
—
7.5
5.5
—
—
30 to 400
4.9
10.1
8.7
7.5
6.0
10.0
7.82
30 to 425
—
—
8.9
7.6
—
—
—
30 to 450
5.3
10.1
9.0
7.9
7.1
10.6
8.82
30 to 475
—
10.1
9.3
—
—
—
—
30 to 500
30 to 525
30 to 550
6.2
—
—
10.0
10.4
10.5
9.4
—
10.2
8.6
—
9.3
8.0
—
8.8
11.2
—
11.7
9.72
—
—
30 to 600
7.9
10.8
10.4
9.8
9.5
12.2
11.35
30 to 700
9.3
11.7
11.3
10.7
10.5
13.0
12.70
30 to 800
10.4
12.5
12.1
11.6
11.4
13.7
13.45
30 to 900
11.5
13.3
13.0
12.5
12.3
14.6
13.85
30 to 1,000
—
14.2
13.9
13.4
13.2
15.4
—
95
MIL-M-38510F
Military Specification
MICROCIRCUITS, GENERAL SPECIFICATION FOR
This specification is approved for use by all Departments and Agencies of the Department of Defense.
This specification is intended to support Government microcircuit application and logistic programs. Detailed characteristics
of microcircuits needed for a program are to be defined by detail drawings or specifications.
1. Scope
Military
MIL-STD-129 - Marking for Shipment and
Storage.
MIL-STD-280 - Definitions of Item Levels,
Item Exchangeability, Models and Related
Terms.
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
1.1 Statement of scope. This specification
establishes the general requirements for
monolithic, multichip, and hybrid microcircuits
and the quality and reliability assurance
requirements which must be met in the acquisition of microcircuits. Detail requirements,
specific characteristics of microcircuits, and
other provisions which are sensitive to the
particular use intended shall be specified in
the applicable device specification. Multiple
levels of product assurance requirements and
control for monolithic and multichip microcircuits and two levels for hybrid microcircuits
are provided for in this specification.
Military
MIL-STD-976 - Certification Requirements
for Microcircuits.
MIL-STD-1331 - Parameters to be Controlled for the Specification of Microcircuits.
MIL-STD-45662 - Calibration Systems
Requirements.
2. Applicable Documents
2.1.2 Other Government documents, drawings, and publications. The following other
Government documents, drawings, and
publications form a part of this specification to
the extent specified herein.
2.1 Government documents.
2.1.1 Specifications and standards. Unless
otherwise specified, the following specifications and standards of the issue listed in that
issue of the Department of Defense Index
of Specifications and Standards (DoDISS)
specified in the solicitation form a part of this
specification to to the extent specified herein.
Specification:
Military
MIL-M-55565 - Microcircuits, Packaging of.
Cataloging Handbook H4-1 - Federal Supply
Code for Manufacturers.
DLAM 8200.2 - Procurement Quality
Assurance Support Manual for Defense
Contract Administration Service.
NAVSHIPS 0967-190-4010 - Manufacturer's
Designating Symbols.
Standards:
Federal
FED-STD-209 - Clean Room and Work
Station Requirements, Controlled Environments.
FED-STD-595 - Color (Requirements for
Individual Color Chips).
Single copies of military specifications,
standards and handbooks may be requested
by mail or telephone from the Naval
Publications and Forms Center, 5801 Tabor
Avenue, Philadelphia, PA 19120. Not more
than five items may be ordered on a single
request; the invitation for bid or contract
number should be cited where applicable.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this
document should be addressed to: Rome Air Development Center (RBE-2). Griffiss AFB, NY 13441.
96
MIL-M-38510F
Only latest revisions (complete with latest
amendments) are available; slash sheets
must be individually requested. Request all
items by document number. For information
on subscription service, direct inquiries to the
above address with additional marking
ATTN: Code 56, or telephone (215) 697-2179,
Inquiry desk.
Information on ordering copies of Federal
specifications and standards may be obtained
from General Services Administration offices
in Atlanta; Auburn, Washington; Boston;
Chicago; Denver; Fort Worth; Kansas City,
MO; Los Angeles; New Orleans; New York;
San Francisco; and Washington, DC.
2.2 Other Publications. The following
documents form a part of this specification to
the extent specified herein. The issues of the
documents which are indicated as DoD
adopted shall be the issue listed in the current
DoDISS and the supplement thereto, if
applicable.
3.5.1 Package. All devices supplied under
this specification shall be hermetically sealed
in glass, metal, or ceramic (or combinations of
these) packages. No organic or polymeric
materials (lacquers, varnishes, coatings,
adhesives, greases, etc.) shall be used inside
the microcircuit package unless otherwise
specified. Desiccants may be used in the
microcircuit package (except for class S
devices where they are prohibited) only if
each lot is subjected to and passes group B,
subgroup 6 tests of method 5005 of MILSTD-883. The internal moisture content for
class S devices after completion of all screening shall not exceed 5,000 ppm at 100°C.
Polymer impregnations (backfill, docking,
coating, or other uses of organic or polymeric
materials to effect, improve, or repair the seal)
of the microcircuit packages shall not be permitted. In addition, packages for class S
microcircuits shall have metal body with hard
glass seals, hard glass body, or ceramic body
and the lids shall be welded, brazed, preform
soldered, or glass frit sealed with a frit sealing temperature in excess of 385°C. In
addition, glass frit sealed packages shall pass
the Lid Torque Test (method 2024 of MILSTD-883) and Internal Water-vapor Content
(method 1018 of MIL-STD-883) specified in
the class S, group B tests. Packages with the
lead frame attached to the body using a glass
frit shall have glass on the mating surfaces
only and the inside surfaces of the cavity shall
not be coated with the seal glass. Single layer
alumina metallized (SLAM) chip carrier
packages are prohibited.
American Society For Testing and Materials
(ASTM)
ASTM B487-79 - Measurement of Metal and
Oxide Coating Thicknesses by Microscopical Examination of a Cross Section
ASTM B567-79A - Measurement of Coating
Thickness by the Beta Backscatter
Method
(Application for copies should be addressed
to the American Society for Testing and
Materials, 1916 Race Street, Philadelphia, PA
19103.)
Electronic Industries Association (EIA)
NOTE: Packages containing beryllia shall not be ground,
sand-blasted, machined, or have other operations
performed on them which will produce beryllia or beryllium
dust. Furthermore, beryllium oxide packages shall not
be placed in acids that will produce fumes containing
beryllium.
EIA-STD-RS-471 - Symbol and Label for Electrostatic Sensitive Devices
(Application for copies should be addressed
to the Electronic Industries Association, 2001
Eye Street, N.W., Washington, DC 20006.)
MIL-M-38510F
(Industry association specifications and standards are generally available for reference
from libraries. They are also distributed among
technical groups and using Federal Agencies.)
3.5.2 Metals. External metal surfaces shall
be corrosion-resistant or shall be plated or
treated to resist corrosion. External leads
shall meet the requirements specified in 3.5.6.
3.5.3 Other materials. External parts,
elements or coatings including markings shall
be inherently nonnutrient to fungus and shall
not blister, crack, outgas, soften, flow or
2.3 Order of precedence. In the event of a
conflict between the text of this specification
and the references cited herein, the text of
this specification shall take precedence.
97
MIL-M-38510F
strates(s) and package terminals or lands as
applicable to the specific type of microcircuit
supplied. If these interconnections show
clearly on the die intraconnection pattern
photograph, an additional photograph or
drawing is not required.
3.5.4.4 Schematic diagrams. For microcircuits supplied under this specification, the
actual schematic diagram(s), logic diagram(s),
or combination thereof shall be provided,
sufficient to represent all electrical elements
functionally designed into the microcircuit
together with their values (when applicable).
For simple devices, this shall be a complete
detailed schematic circuit showing all
functional elements and values. For complex
devices or those with redundant detail, the
overall microcircuit may be represented by a
logic diagram in combination with schematic
details. As a minimum, details which must be
included are: (a) a schematic presentation of
input/output stages and protection network
details identified by appropriate pin numbers,
and (b) sufficient details to depict addressing
or other device elements where the test
parameters, conditions, or limits are sensitive
to the specific device schematics. Where
parasitic elements are important to the proper
functioning of any microcircuit, they shall be
included in the schematic diagram.
3.5.5 Internal conductors. Internal thin film
conductors on silicon die or substrate (metallization stripes, contact areas, bonding interfaces, etc.) shall be designed so that no
properly fabricated conductor shall experience
in normal operation (at worst case specified
operating conditions), a current density in
excess of the maximum allowable value
shown below for the applicable conductor
material:
exhibit defects that adversely affect storage,
operation, or environmental capabilities of
microcircuits delivered to this specification
under the specified test conditions.
3.5.4 Design documentation. Design,
topography, and schematic circuit information
for all microcircuits supplied under this
specification shall be submitted to the
qualifying activity and shall be available inplant for review by the acquiring activity and
the qualifying activity upon request. This
design documentation shall be sufficient to
depict completely the physical and electrical
construction of the microcircuits supplied
under this specification, and shall be
traceable to the specific part, drawing or type
numbers to which it applies, and to the
production lot(s) and inspection lot codes
under which microcircuits are manufactured
and tested so that revisions can be identified.
3.5.4.1 Die topography. For semiconductor
die (monolithic die or dice for inclusion in multichip or hybrid microcircuits), there shall be
an enlarged color photograph(s) or transparency of diazotypes of the mask set showing the topography of elements of the die
without the intraconnection pattern to a minimum magnification of 80 ×. If this results in a
photograph larger than 8" × 10", the magnification may be reduced to accommodate an
8" × 10" view.
3.5.4.2 Die intraconnection pattern. There
shall be an enlarged photograph(s) or
transparency of diazotypes of the mask set to
the same scale as the die topography (see
3.5.4.1) showing the specific intraconnection
pattern used to connect the elements on the
die so that elements used and those not used
can be easily determined. For film hybrid or
multichip microcircuits, this requirement shall
apply to the substrate and all conductor pattern and active or passive circuit elements
deposited thereon, as well as to semiconductor die, as applicable.
3.5.4.3 Die to terminal interconnection.
There shall be an enlarged photograph(s),
transparency, or drawing(s) to scale and of
sufficient magnification to clearly depict the
interconnection pattern for all connections
made by wire or ribbon bonding, beam leads
or other methods between the semiconductor
die, other elements of the microcircuit, sub-
Conductor material
Aluminum (99.99% pure
or doped) without
glassivation or without
glassivation layer integrity
test
Aluminum (99.99% pure
or doped) glassivated
(see 3.5.5.4)
Gold
All other (unless otherwise specified)
98
Maximum allowable current
density
2 × 105 A/cm2
5 × 105 A/cm2
6 × 105 A/cm2
2 × 105 A/cm2
MIL-M-38510F
bonding interfaces, etc.) shall be designated
so that no properly fabricated conductor shall
2
dissipate more than 4 watts/cm when carrying maximum design current.
3.5.5.1 Metallization thickness. For class S
microcircuits, the minimum metallization
thickness shall be 8,000 Å (800 nm) for single
level metal and for the top level of multilevel
metal, and 5,000 Å (500 nm) for the lower
level(s) of multilevel metal. In all cases, the
current density requirements of 3.5.5 shall
also be satisfied.
3.5.5.2 Internal wire size and material. For
class S microcircuits, the internal wire
diameter shall be 0.001 inch minimum (0.03
mm) and, except for hybrid microcircuits, the
internal lead wire shall be of the same metal
as the die metallization.
3.5.5.3 Internal lead wires. Internal lead
wires or other conductors which are not in
thermal contact with a substrate along their
entire length (such as wire or ribbon conductors) shall be designed to experience, at
maximum rated current, a continuous current
for direct current, or an RMS current (peak
current divided by √2), for alternating or
pulsed current, not to exceed the values
established by the following relationship.
The current density shall be calculated at the
point(s) of maximum current density (i.e.,
greatest current [see 3.5.5a] per unit cross
section) for the specific device type and
schematic or configuration.
a. Use a current value equal to the maximum continuous current (at full fanout
for digitals or at maximum load for
linears) or equal to the simple timeaveraged current obtained at maximum
rated frequency and duty cycle with maximum load, whichever results in the
greater current value at the point(s) of
maximum current density. This current
value shall be determined at the maximum recommended supply voltage(s)
and with the current assumed to be
uniform over the entire conductor crosssectional area.
b. Use the minimum allowed metal
thickness per manufacturing specifications and controls including appropriate
allowance for thinning experienced in the
metallization step. The thinning factor
over a metallization step is not required
unless the point of maximum current
density is located at the step.
I = Kd3/2
c. Use the minimum actual design conductor widths (not mask widths) including
appropriate allowance for narrowing or
undercutting experienced in metal
etching.
where: I = Maximum allowed current in
amperes.
d = Diameter in inches for round wire
(or equivalent round wire diameter
which would provide the same crosssectional area for other than round
wire internal conductor).
K = A constant taken from the table
below for the applicable wire or conductor length and composition used in
the device.
d. Areas of barrier metals and nonconducting material shall not be included
in the calculation of conductor cross
section.
Thick film conductors on hybrid microcircuits
or multichip substrates (metallization strips,
Composition
Aluminum
Gold
Copper
Silver
All other
“K” values for bond-to-bond total conductor length
Length ≤ 0.040" (0.10 cm)
22,000
30,000
30,000
15,000
9,000
99
Length > 0.040" (0.10 cm)
15,200
20,500
20,500
10,500
6,300
MIL-M-38510F
3.5.5.4 Verification of glassivation layer
integrity. Where the current density of
aluminum metallization for a device type to be
qualified exceeds the allowable current density for unglassivated aluminum, the device
type shall be subjected to and pass the
requirements of MIL-STD-883 test method
2021 prior to part I or part II qualification
(whichever comes first) and a photograph of
the etched die shall be submitted with the
qualification test report. One resubmission is
permitted at twice the sample size. Unless
otherwise specified by the qualifying activity,
the device type shall be tested after sealing
(or after exposure to the time/temperature
sealing profile) in each package type for which
the device type is to be qualified. Changes in
design, materials, or process which affect current density or glassivation shall also be
evaluated using MIL-STD-883, test method
2021. This evaluation applies only when the
current density requirements for unglassivated
aluminum are exceeded.
3.5.6 Lead or terminal material and finish.
3.5.6.1 Lead or terminal material. Lead or
terminal material shall conform to one of the
following chemical compositions:
a. Type A
Iron ............................. 53 percent, nominal
Nickel ................................. 29 ± 1 percent
Cobalt .................................. 17± 1 percent
Manganese ........... 0.65 percent, maximum
Carbon.................. 0.06 percent, maximum
Silicon................... 0.20 percent, maximum
Aluminum.............. 0.10 percent, maximum
Magnesium ........... 0.10 percent, maximum
Zirconium.............. 0.10 percent, maximum
Titanium................ 0.10 percent, maximum
(Combined total of aluminum, magnesium,
zirconium and titanium to be a maximum of
0.20 percent).
b. Type B
Nickel ................................ 40 - 43 percent
Manganese ........... 0.80 percent, maximum
Silicon................... 0.30 percent, maximum
Carbon.................. 0.10 percent, maximum
Chromium ............. 0.25 percent, maximum
Cobalt ................... 0.50 percent, maximum
Phosphorus ........ 0.025 percent, maximum
Sulfur.................. 0.025 percent, maximum
Aluminum ..............0.10 percent, maximum
Iron .......................................... Remainder
c. Type C
Co-fired metallization such as nominally
pure tungsten. The composition and
application processing of these materials
shall be subject to qualifying activity
approval and submitted with the application to test and as otherwise requested by
the qualifying activity.
3.5.6.2 Microcircuit finishes. Finishes of all
external leads or terminals and all external
metallic package elements shall conform to
either 3.5.6.2.1 or 3.5.6.2.2, as applicable. The
lead finish designator (see 3.6.2.7) shall apply
to the finish of the leads or terminals. The
leads or terminals shall meet the applicable
solderability
and
corrosion
resistance
requirements. The other metallic package elements (including metallized ceramic elements)
shall meet the applicable corrosion resistance
requirements. Finishes on interior elements
(e.g., bonding pads, posts, tabs) shall be such
that they meet lead bonding requirements and
any applicable design and construction requirements.
The use of strike plates is permissible to a
maximum thickness of 10 microinches
(0.25 µm). All plating of finishes and undercoats shall be deposited on clean, nonoxidized metal surfaces. Suitable deoxidation
or cleaning operations shall be performed before or between plating processes. As defined
above, all parts shall meet MIL-STD-883;
method 2004, test condition B2, Bending
Stress (except leadless chip carriers); method
1009, Salt Atmosphere; method 2003 or
method 2022, Solderability (plus the time/temperature exposure of burn-in); method 2025,
Adhesion of Lead Finishes; ASTM B487,
Measurement of Metal and Oxide Coating
Thicknesses by Microscopical Examination of
a Cross Section, or ASTM B567, Measurement of Coating Thickness by the Beta Backscatter Method, or equivalent, and this
capability shall be demonstrated when and
as specified. The aforementioned ASTM
methods are provided as reference methods
to be used when the failure to pass other
finish requirements suggests deficiencies in
plating thickness.
100
MIL-M-38510F
3.5.6.2.1 Lead finish. The finish system on
all external leads or terminals shall conform to
one of the following:
a. Hot solder dip. The hot solder dip shall be
homogeneous with a minimum thickness
of 60 microinches (1.52 µm) for round
leads and, for other shapes, a minimum
thickness at the crest of the major flats of
200 microinches (5.08 gm) solder (SN60
or SN63). In all cases, the solder dip shall
extend up to and beyond the effective
seating plane or to the glass seal for flushmounted devices. The hot solder dip is applicable: (1) over a finish in accordance with
3.5.6.2.1b or 3.5.6.2.1c (2) over electroplated nickel or electroless nickel phosphorus,
per 3.5.6.2.3, or (3) over the basis metal.
When applied over the basis metal, hot
solder dip shall cover the entire lead to the
glass seal or point of emergence of the lead
or metallized contact through the package
wall.
b. Tin plate. As-plated tin shall be a minimum
of 300 microinches thick and shall be
dense, homogeneous and continuous. Asplated tin shall contain no more than 0.05
percent by weight co-deposited organic
material measured as elemental carbon.
Tin plate shall be fused after plating before
or after burn-in by heating above its
liquidus temperature. Fused tin plate shall
be visually inspected after fusing and shall
exhibit a dense, homogeneous and continuous coating. Fused tin plate shall be a
minimum of 200 microinches thick when
measured at the crest of major flats. This
measurement shall be taken halfway
between the seating plane and the tip of
the lead. (This requirement is to avoid
having the inspector select a nontypical
portion of the lead on which to perform
the measurement.) Fused tin plate is
applicable: (1) over electroplated nickel or
electroless nickel-phosphorous (only for
rigid leads or package elements other than
leads), per 3.5.6.2.3; or (2) over the basis
metal.
As-plated tin need not be fused if the leads
are subsequently hot solder dipped in
complete accordance with 3.5.6.2.1 a. Tinlead plating may be used as an alternative
to tin plate and shall have in the plated
deposit two percent to 50 percent by weight
lead (balance nominally tin) homogeneously co-deposited. As-plated tin-lead shall be
a minimum of 300 microinches thick. Asplated tin-lead shall contain no more than
0.05 percent by weight co-deposited
organic material measured as elemental
carbon. Tin-lead plate is applicable: (1)
over as plated tin; (2) over electroplated
nickel or electroless nickel phosphorous
per 3.5.6.2.3; (3) over the basis metal. Tinlead plating may be fused after plating
before or after burn-in by heating above its
liquidus temperature. Fused tin-lead shall
be visually inspected after fusing, and shall
exhibit a dense, homogeneous and continuous coating. Fused tin-lead shall be
a minimum of 200 microinches thick
measured at the crest of the major flats.
This measurement shall be taken halfway
between the seating plane and the tip of
the lead (this requirement is to avoid having the inspector select a nontypical portion of the lead on which to perform the
measurement). The maximum carbon content for both tin and tin-lead plate (and
minimum lead content in the tin-lead plate)
on the as-plated finish shall be determined
by the manufacturer on at least a weekly
basis.
The visual inspection after fusing shall be
conducted on a sampling basis by the
manufacturer as an in-process control.
Visual inspection of the fusing shall be performed at a frequency sufficient to assure
uniform compliance with these requirements on the finished product. The
determination of carbon and lead content
may be made by any accepted analytical
technique (e.g., for carbon: pyrolysis,
infrared detection [using an IR212, IR244
infrared detector or equivalent]; for lead: Xray fluorescence, emission spectroscopy)
so long as the assay reflects the actual content in the deposited finish.
c. Gold plate. Gold plating shall be a minimum
of 99.7 percent gold, and only cobalt shall
be used as the hardener. Gold plating shall
be a minimum of 50 microinches
(1.27 µm) and a maximum of 225 microin-
101
MIL-M-38510F
ches (5.72 gm) thick. Gold plating shall be
permitted over nickel plate or undercoating
as per 3.5.6.2.3.
3.5.6.2.2 Package element (other than lead)
finish. External metallic package elements
other than leads or terminals (e.g., lids,
covers, bases, seal rings, etc.) shall meet
the applicable corrosion resistance and
environmental requirements without additional
finishing of the base material or else they
shall be finished so that they meet those
requirements using finishes conforming to one
or more of the following as applicable:
a. Solder per 3.5.6.2.1a.
b. Tin plate per 3.5.6.2.1b.
c. Gold plate per 3.5.6.2.1c except that for
elements other than leads the gold plate
shall be applied over electroless or
electroplated nickel undercoating per
3.5.6.2.3.
d. Nickel plate per 3.5.6.2.3.
3.5.6.2.3. Nickel plate or undercoating.
Electroplated nickel undercoating or finishes
from a sulfamate nickel bath is preferred and
shall be 50 to 350 microinches (1.27 to
8.89 µm) thick measured on major flats or
diameters. Electroless nickel undercoating or
finishes, when allowed, shall be 50 to 100
microinches (1.27 to 2.54 µm) thick for leads
and 50 to 250 microinches (1.27 to 6.35 µm)
thick for package elements other than leads
measured on major flats or diameters. The addition of organic addition agents is prohibited
for either sulfamate or phosphorous nickel
baths. Electroplate or electroless nickel plate
(or combinations thereof) as well as nickel
cladding may be used as the finish for
package elements other than leads or
terminals provided the corrosion resistance
and environmental requirements are met.
In all cases, electroplated nickel undercoating
from a nickel sulfamate bath is preferred for
lead and terminal finishes. Electroless nickel
phosphorous shall not be used as the undercoating on flexible or semi-flexible leads (see
3.3.1 and 3.3.2 of method 2004 of MILSTD-883) and shall be permitted only on rigid
leads or package elements other than leads.
102
QQ-N-290A
November 12, 1971
Federal Specification
Superseding
Fed. Spec. QQ-N-290
April 5, 1954
NICKEL PLATING (ELECTRODEPOSITED)
This specification was approved by the Commissioner, Federal Supply Service, General Services Administration, for
the use of all Federal agencies.
1. Scope and Classification
1.1 Scope. This specification covers the requirements for electrodeposited nickel plating
on steel, copper and copper alloys, and zinc
and zinc alloys.
1.2 Classification.
1.2.1 Classes. Electrodeposited nickel plating covered by this specification shall be of
the following classes, as specified (see 6.2):
Class 1 - Corrosion protective plating
Class 2 - Engineering plating
1.2.2 Grades. Class 1 plating shall be of the
following grades, as specified (see 6.2):
Grade A - 0.0016 inch thick
Grade B - 0.0012 inch thick
Grade C - 0.0010 inch thick
Grade D - 0.0008 inch thick
Grade E - 0.0006 inch thick
Grade F - 0.0004 inch thick
Grade G - 0.0002 inch thick
2. Applicable Documents
2.1 The following documents, of the issue in
effect on date of invitation for bids or request
for proposal, form a part of the specification to
the extent specified herein.
Federal Specification:
QQ-S-624 - Steel Bar, Alloy, Hot Rolled and
Cold Finished (General Purpose).
Federal Standard:
Fed. Test Method Std. No. 151 - Metals;
Test Methods.
(Activities outside the Federal Government
may obtain copies of Federal Specifications,
Standards, and Handbooks as outlined under
General Information in the Index of Federal
Specifications and Standards and at the prices
indicated in the Index. The Index, which includes cumulative monthly supplements as issued, is for sale on a subscription basis by the
Superintendent of Documents, U.S. Government Printing Office, Washington, DC 20402.
(Single copies of this specification and other
Federal Specifications required by activities
outside the Federal Government for bidding
purposes are available without charge from
Business Service Centers at the General
Services Administration Regional Offices in
Boston, New York, Washington, DC, Atlanta,
Chicago, Kansas City, MO, Fort Worth, Denver, San Francisco, Los Angeles, and Seattle, WA.
(Federal Government activities may obtain
copies of Federal Specifications, Standards,
and Handbooks and the Index of Federal
Specifications
and
Standards
from
established distribution points in their
agencies.)
Military Specification:
MIL-S-5002 - Surface Treatments and
Inorganic Coatings for Metal Surfaces of
Weapons Systems.
Military Standard:
MIL-STD-105 - Sampling Procedures and
Tables for Inspection by Attributes.
(Copies of Military Specifications and
Standards required by contractors in connection with specific procurement functions
should be obtained from the procuring activity
or as directed by the contracting officer.)
2.2 Other publications. The following documents form a part of this specification to the
extent specified herein. Unless a specific issue is identified, the issue in effect on date of
invitation for bids or request for proposal shall
apply.
American Society for Testing and Materials
(ASTM) Standards:
B487 - Measuring Metal and Oxide Coating
Thickness by Microscopic Examination
of a Cross Section.
B504 - Measuring the Thickness of Metallic
Coatings by the Coulometric Method.
B529 - Measurement of Coating Thickness by
the Eddy Current Test Method; Nonconductive Coatings on Nonmagnetic Basis
Metals.
103
QQ-N-290A
B530 - Measurement of Coating Thickness by
the Magnetic Method: Electrodeposited
Nickel Coatings on Magnetic and Nonmagnetic Substrates.
(Application for copies should be addressed
to the American Society for Testing and
Materials, 1916 Race Street, Philadelphia,
Pennsylvania, 19103.)
3. Requirements
3.1 Materials. The materials used shall be
such as to produce platings which meet the
requirements of this specification.
3.2 General requirements.
3.2.1 High tensile strength steel parts. Unless otherwise specified, steel parts having an
ultimate tensile strength greater than 240,000
pounds per square inch (psi) shall not be plated without specific approval of the procuring
activity (see 6.2).
3.2.2 Stress relief treatment. Unless otherwise specified, all steel parts which are
machined, ground, cold formed or cold
straightened shall be given a heat treatment
at a minimum of 375 ± 25°F (191 ± 14°C) for
three hours or more prior to cleaning and plating for the relief of damaging residual tensile
stresses (see 6.2 and 6.4).
3.2.3 Cleaning. Unless otherwise specified,
all steel parts shall be cleaned in accordance
with MIL-S-5002 (see 6.2). Other basis metals
shall be cleaned by methods which shall not
damage the substrate and shall not interfere
with adhesion of the deposit (see 6.5).
3.2.4 Plating application. Unless otherwise
specified, the plating shall be applied after all
basis metal heat treatments and mechanical
operations such as machining, brazing, welding, forming and perforating of the article have
been completed (see 6.2).
3.2.5 Underplating. When specified in the
contract, purchase order or applicable drawing (see 6.2), Class 1 plating shall be applied
over a plating of copper on steels, copper and
copper based alloys. Class 1 plating shall be
applied over an underplating of copper or yellow brass on zinc and zinc based alloys. In no
case, shall the copper underplate (see
3.3.1.1.2 and Table I) be substituted for any
part of the specified nickel thickness.
3.2.6 Class 1 processing. Parts for Class 1
deposition shall be plated to specific dimen-
sions as specified (see 3.3.1.1). When specified, parts shall be processed in accordance
with procedural instructions for form of nickel
deposit. (see 6.2 and 6.7).
3.2.7 Class 2 processing. Parts for Class 2
deposition shall be plated to specific dimensions as specified (see 3.3.1.2). When specified, parts shall be processed in accordance
with procedural instructions of the procuring
activity (see 6.2).
3.2.8 Coverage. Unless otherwise specified,
the plating shall cover all surfaces including
roots of threads, corners and recesses (see
6.2).
3.2.9 Boundaries. Boundaries of Class 2
plating which cover only a portion of the surface shall be free from beads, nodules,
jagged edges and other irregularities.
3.2.10 Surface finish. Unless otherwise
specified, either a fully bright or dull (semibright finish shall be acceptable [see 6.2 and
6.7]).
3.2.11 Embrittlement relief. All steel parts
having a hardness of Rockwell C40 and higher
shall be baked at a minimum of 375 ± 25°F
(191 ± 14°C) for three hours or more, within
four hours after plating, to provide hydrogen
embrittlement relief (see 6.6). The baked
parts, when tested in accordance with 4.5.3,
shall not crack or fail by fracture (see 4.4.3.3).
Plated springs and other parts subject to
flexure shall not be flexed prior to the hydrogen embrittlement relief treatment.
3.3 Detail requirements.
3.3.1 Thickness of plating.
3.3.1.1 Class 1. Unless otherwise specified,
the minimum thickness of Class 1 nickel plating shall be as specified in Table 1 on all visible surfaces which can be touched by a ball
0.75 inch (19 mm) in diameter. All other surfaces which cannot be touched by the 0.75
inch (19 mm) diameter ball shall not be less
than the minimum thickness specified in
Table 1.
3.3.1.1.1 Unless otherwise specified, the
minimum nickel plating for ferrous materials or
for zinc and zinc base alloys shall be Grade
C. Unless otherwise specified, the minimum
nickel plating for copper and copper alloys
shall be Grade D. If the maximum thickness
for Grade A is not specified in the contract,
order or applicable drawing, the thickness
104
QQ-N-290A
shall not exceed 0.0020 inch (51 micrometers)
on all visible surfaces which can be touched
by the 0.75 (19 mm) diameter ball.
3.3.1.1.2 Underplate. When an underplate
is employed (see 3.2.5), the thickness of the
copper or other copper base alloy shall be as
specified (see Table 1). The thickness of the
underplate shall not be used in the determination of the specified nickel plating thickness.
3.3.1.2 Class 2. The thickness for Class 2
nickel plating shall be as specified in the contract, purchase order or on the applicable
drawing (see 6.2). If a thickness is not specified, it shall be 0.003 inch (0.076 mm) for the
finished part. In no case, shall the minimum
nickel plating thickness be less than 0.002
inch (0.051 mm). The thickness requirement
for Class 2 plating shall apply after all metal
finishing operations have been completed.
3.3.2 Adhesion. The adhesion of the nickel
plating and any undercoat or nickel layers
shall be such that when examined at a
magnification of approximately 4 diameters,
Table I.
neither the nickel plating, any layers of nickel
plating nor any electrodeposited undercoat
shall show separation from the basis metal or
from each other at their common interface(s)
when subjected to the test described in 4.5.2.
The interface between a plating and the basis metal is the surface of the basis metal before plating. The formation of cracks in the
basis metal or plate which do not result in
flaking, peeling or blistering of the plate shall
be considered as conformance to this requirement.
3.4 Workmanship.
3.4.1 Basis metal. The basis metal shall be
free from visible defects that will be detrimental to the appearance or protective value of
the plating. The basis metal shall be subject
to such cleaning and plating procedures as
necessary to yield deposits herein specified.
3.4.2 Plating. The nickel plating shall be
smooth, fine grained, adherent, uniform in
appearance, free from blisters, pits, nodules,
excessive edge buildup and other defects.
Minimum thickness of class 1 nickel plating
Basis Metal
Steels 1/, Zinc and
Zinc Alloys 2/ Coating Grade
A
B
C
D
E
F
–
Plating Thickness
Copper and
Copper Alloys 3/ Coating Grade
Surface touched by
0.75 inch dia. ball
(see 3.3.1.1)
All other surfaces 5/
Inch-Min.
Inch-Min.
–
B
C
D
E
F
G
Equiv. Micrometers 4/
(approx.)
0.0016
0.0012
0.0010
0.0008
0.0006
0.0004
0.0002
40
30
25
20
15
10
5
0.0012
0.0010
0.0008
0.0006
0.0004
0.0002
0.0001
Equiv. Micrometers 4/
(approx.)
30
25
20
15
10
5
3
1/
Copper underplate shall be 0.0002 inch minimum. May range to 0.0010 inch depending on thickness of
nickel plating. Use of extremely thin strikes may cause operational difficulties.
2/
Zinc and zinc alloys shall have a copper underplate of 0.0002 inch minimum thickness.
3/
Copper alloys containing zinc equal to or greater than 40 percent shall have a copper underplate of
0.0003 inch minimum thickness.
4/
0.001 inch = 1 mil = 25.4 micrometers (microns).
5/
Threads, holes, deep recesses, bases of angles and similar areas.
105
QQ-N-290A
The plating shall show no indication or contamination or improper operation of equipment
used to produce the nickel deposit, such as
excessively powdered or darkened platings,
buildup and other defects. The size and number of contact marks shall be at a minimum
consistent with good practice. The location of
contact marks shall be in areas of minimum
exposure to service environmental conditions
where important to the function of the part. Superficial staining which has been demonstrated as resulting from rinsing, or slight
discoloration resulting from baking operations
to relieve embrittlement, as specified above
(see 3.2.11), shall not be cause for rejection.
All details of workmanship shall conform to
the best practice for high-quality plating.
4. Quality Assurance Provisions
4.1 Responsibility for inspection. Unless
otherwise specified in the contract or purchase
order, the supplier is responsible for the performance of all inspection requirements as
specified herein. Except as otherwise specified in the contract or order, the supplier may
use his own or any other facilities suitable
for the performance of the inspection
requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the
inspections set forth in the specification where
such inspections are deemed necessary to
assure that supplies and service conform to
prescribed requirements.
4.2 Classification of inspection. The
inspection requirements specified herein are
classified as follows:
1 - Production control inspection (see 4.3)
2 - Quality conformance inspection (see 4.4)
4.3 Production control inspection.
4.3.1 Control records. When specified in the
contract or order (see 6.2), the supplier shall
maintain a record of each processing bath,
showing all additional chemicals or treatment
solutions to the unit, the results of all analyses
performed and the quantity of parts plated during operation. Upon request of the procuring
activity, such records shall be made available.
These records shall be maintained for not less
than one year after completion of the contract
or purchase order.
4.3.2 Production control. The equipment,
procedures and operations employed by a
supplier shall be capable of producing highquality electrodeposited platings of nickel on
ferrous alloys, copper and copper alloys, zinc
and zinc alloys as specified in this document.
When specified by the procuring activity (see
6.2), the supplier, prior to production, shall
demonstrate the capability of the process
used to show freedom from hydrogen
embrittlement damage as indicated by satisfactory behavior of specimens prepared (see
6.2.2) and tested in acordance with 4.3.2.1 to
comply to the requirements of MIL-S-5002 for
preproduction process qualification.
Preproduction
control.
For
4.3.2.1
preproduction control four round notched steel
specimens shall be prepared in accordance
with 4.4.4.2 from four individual heats for a total of 16 specimens, using the specified steel
alloy for which preproduction examination of
the process is to be demonstrated. Specimens
shall be heat treated to the maximum tensile
strength representing production usage. The
specimens shall be given the same pretreatments, proposed for production. The
specimens shall be subject to test detailed in
4.5.3. The process shall be considered satisfactory if all specimens show no indication of
cracks or failure. The test results and production control information shall be submitted to
the procuring activity for approval. Until approval has been received, parts shall not be
plated.
4.3.3 Frequency of tests. To assure
continuous control of the process as required
by MIL-S-5002 and to prevent detrimental
hydrogen embrittlement during production, the
satisfactory behavior of specimens, prepared
and tested in accordance with Table II, shall
be made once each month or more frequently
if required by the procuring activity. The
results of tests made to determine conformance of electrodeposited platings to all
requirements of this specification for definite
contracts or purchase order are acceptable as
evidence of the properties being obtained with
the equipment and procedures employed.
4.3.4 Production control specimens. Test
specimens for production control shall be prepared in accordance with 4.4.4 and 4.4.4.1 as
106
QQ-N-290A
Table II.
Production control tests and specimens
Test
For coating
classes
Requirement
paragraphs
Thickness
1 and 2
3.3.1,
3.3.1.1 and
3.3.1.2
4.4.4 and
4.4.4.1
4.5.1
Adhesion
1 and 2
3.3.2
4.4.4 and
4.4.4.1
4.5.2
Hydrogen
embrittlement
1 and 2
3.2.11
4.3.4, 4.4.4,
and 4.4.4.2
4.5.3
1/
Test reference
paragraphs
Standard alloy steels shall be used for production control specimens. The selection shall be at the option of the supplier; however, alloy steels such as AISI or SAE numbers 4130, 4135, 4140, 4145, 4340,
8645 and 8740 conforming to QQ-S-624 shall be used.
applicable for the thickness and adhesion
tests detailed in Table II. Specimens for the
production control embrittlement relief test
shall be four round notched steel specimens
of alloy steel 4340 conforming to QQ-S-624,
heat treated to the maximum tensile strength,
from one or more heats, and prepared in
accordance with 4.4.4.2.
4.4 Quality conformance inspection.
4.4.1 Lot. A lot shall consist of plated articles of the same metal composition, class and
grade plated and treated under the same conditions and approximately the same size and
shape submitted for inspection at one time.
4.4.2 Sampling for visual examination and
non-destructive tests. Sampling for visual
Table III.
examination and non-destructive tests shall
be conducted as directed by the procuring
activity (see 6.2) in accordance with MILSTD-105 or using Table III. A sample of coated parts or articles shall be drawn by taking at
random from each lot the number of articles in
accordance with MIL-STD-105, Level 11,
Acceptable Quality Level (AQL) 1.5 percent
defective, or as indicated in Table Ill. The lot
shall be accepted or rejected according to the
procedures in 4.4.2.1 for visual examination
and 4.4.2.2 for plating thickness (non-destructive tests).
4.4.2.1 Visual examination. Samples selected in accordance with 4.4.2 shall be examined
for compliance with the requirements of 3.4.2
Sampling for visual examination and non-destructive tests
Numbers of items
in lot inspections
15 or less
16 to 40
41 to 110
111 to 300
301 to 500
501 and over
1/
Specimen
preparation
paragraphs 1/
Number of items
in samples
(randomly selected)
7
10
15
25
35
50
1/
Acceptance number
(maximum number of
sample item nonconforming to any test)
0
0
0
1
1
2
If the number of items in the inspection lot is less than 7, the number of items in the sample shall equal
the number of items in the inspection lot.
107
QQ-N-290A
after plating. If the number of nonconforming
articles exceeds the acceptance number for
the sample, the lot represented by the sample
shall be rejected.
4.4.2.2 Thickness of plating (non-destructive
tests). Samples selected in accordance with
4.4.2 shall be inspected and the plating thickness measured by the applicable tests
detailed in 4.5.1, at several locations on each
article as defined in 3.3.1, 3.3.1.1 or 3.3.1.2,
as applicable, for compliance with the requirements. The part or article shall be considered
nonconforming if one or more measurements
fail to meet the specified minimum thickness.
If the number of defective items in any sample
exceeds the acceptance number for the
specified sample, the lot represented by the
sample shall be rejected. Separate specimens
(see 4.4.4.1) shall not be used for thickness
measurements unless a need has been
demonstrated.
4.4.3 Sampling for destructive tests. A random sample of four plated parts or articles
shall be taken from each lot for each
destructive test or separately plated
specimens shall be prepared in accordance
with 4.4.4, 4.4.4.1 and 4.4.4.2 to represent
each lot. If the number of articles in the lot is
four or less, the number of articles in the
sample shall be specified by the procuring
activity (see 6.2).
4.4.3.1 Thickness of plating (destructive
tests). If sampling and testing for thickness of
plating by non-destructive testing is not the
option of the supplier, samples selected in
accordance with 4.4.3 shall be measured for
plating thickness by the applicable tests
detailed in 4.5.1 at several locations as
defined in 3.3.1, 3.3.1.1 or 3.3.1.2, for compliance with the requirements. If the plating
thickness at any place on any article or
specimen is less than the specified minimum
thickness, the lot shall be rejected. Separate
specimens (see 4.4.4.1) shall not be used for
thickness measurements unless a need has
been demonstrated.
4.4.3.2 Adhesion (destructive tests). The
articles or specimens used for the destructive
thickness test (see 4.4.3.1), if of suitable size
and form, may be used as the test pieces for
the adhesion test to determine compliance
with the requirements of 3.3.2. Failure of one
or more of the test pieces shall constitute
failure of the lot.
4.4.3.3 Hydrogen embrittlement relief
(destructive tests). Unless otherwise specified
in the contract or order, conformance to the
requirements of 3.2.11 for hydrogen embrittlement relief of treated steel parts shall be
determined for those parts having a tensile
strength of or heat treated to a tensile strength
of 240,000 psi or above and which will be
subject to a sustained tensile load in use (see
6.2). A random sample of four plated articles
shall be taken from each lot or four specimens,
prepared in accordance with 4.4.4 and 4.4.4.2,
shall be used to represent the lot. When tested
as specified in 4.5.3, cracks or failure by fracture shall be cause for rejection. Failure of one
or more of the test pieces shall reject the lot.
4.4.4 Quality conformance specimen
preparation. When the plated articles are of
such form, shape, size and value as to prohibit
use thereof, or are not readily adaptable to a
test specified herein, or when destructive
tests of small lot sizes are required, the test
shall be made by the use of separate
specimens plated concurrently with the articles
represented. The separate specimens shall
be of a basis metal equivalent to that of the
articles represented. “Equivalent” basis metal
includes
chemical composition, grade,
condition and finish of surface prior to plating.
For example, a cold-rolled steel surface
should not be used to represent a hot-rolled
steel surface. Due to the impracticality of
forging or casting separate test specimens,
hot-rolled steel specimens may be used to
represent forged and cast-steel articles. The
separate specimens may be also cut from
scrap castings when ferrous alloy castings are
being plated. These separate specimens shall
be introduced into a lot at regular intervals
prior to the cleaning operations, preliminary
to plating, and shall not be separated
therefrom until after completion of plating.
Conditions affecting the plating of specimens
including the spacing, plating media, residual
air pressure, temperature, etc. in respect to
other objects being plated shall correspond as
nearly as possible to those affecting the significant surfaces of the articles represented.
Separate specimens shall not be used for
thickness measurements, however, unless the
108
QQ-N-290A
necessity for their use has been demonstrated.
4.4.4.1 Specimens for thickness and
adhesion tests. If separate specimens for
thickness and adhesion tests are required,
they shall be strips approximately 1 inch wide,
4 inches long and 0.04 inch thick.
4.4.4.2 Specimens for embrittlement relief.
Separate specimens for embrittlement relief
test shall be round notched specimens with
the axis of the specimen (load direction)
perpendicular to the short transverse grain
flow direction. The configuration shall be in
accordance with Figure 8 of ASTM E8 for
rounded specimens. Specimens shall have a
60 degree V-notch located approximately at
the center of the gage length. The cross
section area at the root of the vee shall be
approximately equal to half the area of the full
cross section area of the specimen's reduced
section. The vee shall have a 0.010 ± 0.0005
inch radius of curvature at the base of the
notch (see 6.2.2).
4.5 Tests.
4.5.1 Thickness. For non-destructive
measuring of plating thickness, procedures in
accordance with Federal Test Method
Standard No. 151, Method 520 (electronic
test), ASTM B529 (eddy current), or ASTM
B530 (magnetic test) may be used. For
destructive measuring of plating thickness,
procedures in accordance with ASTM B487
(microscopic) or ASTM B504 (coulometric)
may be used. At the option of the supplier
other instruments, such as those employing
the principle of beta-radiation back scatter or
X-ray spectrometry may be used.
4.5.2 Adhesion. Adhesion may be
determined by scraping the surface or shearing with a sharp edge, knife, or razor through
the plating down to the basis metal and
examining at four diameters magnification for
evidence of non-adhesion. Alternately the
article or specimen may be clamped in a vise
and the projecting portion bent back and forth
until rupture occurs. If the edge of the
ruptured plating can be peeled back or if
separation between the plating and the basis
metal can be seen at the point of rupture
when
examined
at
four
diameters
magnification, adhesion is not satisfactory.
4.5.3 Embrittlement relief. Compliance with
3.2.11 shall be determined with samples of
plated parts taken as specified in 4.4.3.3.
Parts such as spring pins, lock rings, etc.
which are installed in holes or rods shall be
similarly assembled using the applicable parts
specifications or drawing tolerances which
impose the maximum sustained tensile load
on the plated part. The selected samples shall
be subjected to a sustained tensile load equal
to 115 percent of the maximum design yield
load for which the part was designed. Parts
which require special fixtures, extreme loads
to comply with the above requirements, or
where the maximum design yield load is
not known may be represented by separate
specimens prepared in accordance with
4.4.4.3. The notched specimens shall be
subject to a sustained tensile load equal to 75
percent of the ultimate notch tensile strength
of the material. The articles, parts or specimens shall be held under load for at least 200
hours and then examined for cracks or
fracture.
5. Preparation for Delivery
5.1 Packaging and packing. Preservation,
packaging and packing methods for electrodeposited nickel plated parts or articles
employed by a supplier shall be such as to
preclude damaging during shipment and
handling.
6. Notes
6.1 Intended use.
6.1.1 Class 1 plating. Class 1 plating is
used to protect iron, copper, or zinc alloys
against corrosive attack in rural, industrial or
marine atmospheres depending upon the
thickness of the nickel deposit or is used as
an undercoat for chromium or one of the
precious metals. Class 1 plating is used also
for decorative purposes.
6.1.2 Class 2 plating. Class 2 plating is
used for wear resistance, abrasion resistance
and such incidental corrosion protection of
parts as the specified thickness of the nickel
plating may afford. Heavy deposits of the
Class 2 plating, especially when the Watts
bath process is employed, may be used for
buildup of worn or undersized parts, or for
salvage purposes, and to provide protection
against corrosive chemical environments.
109
QQ-N-290A
6.2 Ordering data. Purchasers should select
the preferred options permitted herein and
include the following information in procurement documents:
(a) Title, number, and date of this
specification.
(b) Class of plating (see 1.2.1).
(c) Grade of Class 1 plating if applicable
(see 1.2.2).
(d) When plating is to be applied, if other
than specified (see 3.2.1, 3.2.4, 3.2.6 and
3.2.7).
(e) Stress relief treatment, if other than
specified (see 3.2.2).
(f) Cleaning of steel, if other than specified
(see 3.2.3).
(g) Underplating required (see 3.2.5).
(h) Coverage, if other than specified (see
3.2.8).
(i) Surface finish, if particular finish
required (see 3.2.10).
(j) Thickness of coating, if other than
specified (see 3.3.1, 3.3.1.1, 3.3.1.1.1 and
3.3.1.2).
(k) Control record requirement (see 4.3.1).
(I) Preproduction control examination (see
4.3.2).
(m) Sampling plan (see 4.4.2).
(n) Number of samples for destructive
testing (see 4.4.3).
(o) Whether hydrogen embrittlement relief
test is required. (see 4.4.3.3).
6.2.1 The manufacturer of the basis metal
parts should provide the plating facility with
the following data:
(a) Hardness of steel parts (see 3.2.1).
(b) Heat treatment for stress relief, whether
has been performed or is required (see
3.2.2).
(c) Tensile loads required for embrittlement
relief test, if applicable (see 4.5.3).
6.2.2 The manufacturer of the basis metal
parts should provide the plating facility with
notched tensile specimens (see 4.4.4.2) to be
plated for conformance with 3.2.11 required
for production control (see 4.3.2.1 and 4.3.4)
and lot acceptance (see 4.4.3 and 4.4.3.3).
6.3 Black nickel plating. Electrodeposited
black nickel plating, in accordance with MILP-18317, has little protective value and is
used primarily to obtain a dark, nonreflective,
decorative finish on steel and copper alloy
instrument parts.
6.4 Stress relief. There is a hazard that
hardened and tempered cold-worked or coldstraightened steel parts may crack during
cleaning and plating. Such parts should have
a suitable heat treatment for stress relief prior
to cleaning and plating (see 3.2.2).
6.5 Cleaning. Copper and copper-based
alloys may be cleaned as detailed in ASTM
B281, Recommended Practice for Preparation
of Copper and Copper-Base Alloys for
Electroplating. Zinc and zinc-based alloys
may be cleaned as detailed in ASTM B252,
Recommended Practice for Preparation of
Zinc-Base Die Castings for Electroplating (see
3.2.3).
6.6 Baking time. For high-strength materials
(Rockwell C40 and above), it may be beneficial
to extend the baking time to 23 hours to insure
complete hydrogen embrittlement relief (see
3.2.11).
6.7 Class 1 processing. Class 1 plating may
be processed for the following forms of nickel
deposition:
SB - Single layer coating in a fully bright
finish.
SD - Single layer coating in a dull or semibright finish, containing less than 0.005
percent sulfur and having an elongation
greater than 8 percent. A full brightness
finish may be obtained by polishing the
coating.
M - Multilayer coating, either double-layer or
triple-layer. The bottom layer should
contain less than 0.005 percent sulfur
and have an elongation greater than 8
percent. The top layer should contain
more than 0.04 percent sulfur. In a
double-layer coating, the thickness of
the bottom layer should be not less than
60 percent of the total nickel thickness,
except on ferrous parts where the bottom thickness should be not less than
75 percent of the total nickel thickness.
In a triple-layer coating, the thickness of
the bottom layer should be not less
than 50 percent of the total nickel
thickness. The intermediate layer of the
triple-layer coating should contain more
sulfur than the top layer and the
thickness should be not greater than 10
percent of the total nickel thickness. The
110
QQ-N-290A
thickness of the top layer of either
double- or triple-layer coating should be
not less than 10 percent of the total
nickel thickness.
6.7.1 Correlation. The correlation between
the grades of nickel plating used in this
specification and the forms of nickel deposition are indicated in Table IV.
6.7.2 Thickness measurements. Thickness
measurements for the single layer Class 1
plating should be made whenever applicable
by the non-destructive test methods, especially
the magnetic method. Thickness measurements for the double or triple layer Class 1
plating should be made on cross sections
taken perpendicular to the significant surfaces
by the microscopic method. This permits
measurements of the thickness of the individual nickel layers when suitable etchants are
used. Suitable etchants are as follows:
(a) Etchant No. 1.
Nitric acid (sp. gr. 1.42)
1 volume
Glacial acetic acid
1 volume
(b) Etchant No. 2.
Sodium cyanide
100 gms per
liter of water
Sodium or
100 gms per
ammonium persulfate
liter of water
NOTE: Equal parts of the two water solutions (the cyanide
and the persulfate) are mixed. Caution must be
taken as toxic fumes are evolved when these
solutions of the chemicals are mixed. Use of this
etchant must be confined to a well-ventilated hood.
When either of the two etchants are used, the
microstructure of the dull or semi-bright nickel
layer will be shown to be columnar, whereas
that of the bright nickel layer will be banded or
unresolved.
6.7.3 Sulfur contents. The sulfur contents
stated in 6.7 indicate the kind of nickel plating
solution that is to be used by the supplier. No
simple method exists for the determination of
the sulfur content of a nickel deposit on a
coated article; however, X-ray fluorescence
techniques can be used.
6.7.4 Corrosion protection. In a double-layer
nickel deposition, as the undercoat with other
electrodeposited top coats, the nickel
immediately under the top coat is a bright
nickel containing sulfur while the bottom layer
under that is a semi-bright nickel essentially
free of sulfur. In any galvanic electrolytic cell
set up with the top coat, the bright nickel
reacts anodically to the purer semi-bright
nickel. If microscopic corrosion sets in through
pores in the top coat material and penetrates
the bright nickel layer, galvanic action
between the two kinds of nickel tends to cause
the microscopic pit to spread laterally in the
outer nickel layer. The net effect is to retard
penetration toward the base metal, hence to
lengthen the useful life of the coating. This
galvanic corrosion system may be further
complicated by the use of three layers of
nickel of different sulfur contents with further
improvement against corrosion at a slightly
Table IV.
Correlation of class 1 nickel plating grades and deposition 1/
Grades
A
B
C
D
E
F
G
Forms of Deposition for
Steels, Zinc and Zinc Alloys
SD and M
SD and M
M
SB, SD and M
SB, SD and M
SB, SD and M
—
2/
2/
2/
For Copper and Copper
Alloys
—
SB and M
SB, SD and M
SD and M
SB, SD and M
SB, SD and M
SB, SD and M
2/
2/
2/
1/
Where a dull or satin-like finish is required, unbuffed Form SD processed nickel may be substituted
for Form SB processed nickel or for the bright layer of Form M processed nickel.
2/
Nickel deposited under Forms SD or M conditions may be substituted for nickel deposited in Form
SB condition where the nickel deposit and top coat are subject to mild or moderate service conditions.
111
QQ-N-290A
greater cost.
6.8 Cross-reference. The correlation
between the grades of Class 1 nickel plating
Table V.
used in this specification and the previous
designation (types) of Class 1 in QQ-N-290
are indicated in Table V.
Correlation of class 1 nickel plating
Basis Metal
QQ-N-290
QQ-N-290A
Types
Grades
Suggested forms of
plating deposition
(see 6.7)
Steel
I
II
III
IV
(DS)
(FS)
(KS)
(QS)
C
E
F
G
M
SB
SB
SB
Copper and
Copper-based alloys
V
VI
VII
(FC)
(KC)
(QC)
E
F
G
SB
SB
SB
Zinc and Zinc-based
alloys
VIII (FZ)
IX (KZ)
X (QZ)
E
F
F
SB
SB
SB
1/
2/
1/
When copper undercoat is omitted, the minimum nickel should be equivalent to Grade B, deposition
forms SD or M (see 6.7).
2/
When copper undercoat is omitted, the minimum nickel should be equivalent to Grade D, plating form
SB (see 6.7).
112
G2
Reprinted by the Nickel Development Institute with permission, from the Semiconductor Equipment and Materials
Institute, Inc., Book of SEMI Standards, Copyright the
Semiconductor Equipment and Materials Institute, Inc., 805
E. Middlefield Road, Mountain View, CA 94043.
G2-86
SEMI SPECIFICATION
METALLIC LEADFRAMES FOR CER-DIP PACKAGES
1. Preface
This specification covers stamped or etched
metallic leadframes used in construction of
Cer-DIP packages.
2. Applicable Documents
2.1 This document specifically refers to:
1
MIL-I-23011 Iron/Nickel Alloys for Sealing
to Glasses and Ceramics
MIL-M-38510 General
Specifications
for
Microcircuits
MIL-STD-883 Test Methods and Procedures
for Microelectronics
2.2 Related information may also be found
in:
MIL-STD-105 Sampling Procedures and Tables
for Inspection by Attributes.
3. Selected Definitions
bonding area - coined area on bond fingers
within a distance of .030" (.762 mm) from lead
tips.
bottom formed width - see Figure 3.
bow - curvature of the leadframe strip in the
vertical plane; see Figure 1.
burr - fragment of excess parent material
attached to the leadframe edges.
camber - curvature of the leadframe strip
edge in the horizontal plane; see Figure 2.
coined area - the area of the bond fingers
planished to produce a flattened area for
functional use; see Figure 3.
coplanarity - the total indicator reading
difference of the lead tips in the Z direction.
datum plane - M is datum plane; see Figure 3.
discoloration - a darkening or stain of the
aluminum (metallization).
foreign material - any adhering residue which
is not of the leadframe composition.
pit - a shallow surface depression or crater
with a visible edge.
planarity - total indicator reading of the lead
tips in the Z direction relative to datum M.
projection - a raised portion of the surface
indigenous with the parent material, other
than a burr.
slug marks - random dents in the leadframe.
stamped leadframe terminology - see Fig. 3.
tilt - the deviation of the plane of the coined
area from a condition parallel to the plane on
datum M.
top formed width - see Figure 3.
twist - the angular rotation of one end of the
leadframe or strip with reference to the other
end; see Figure 4.
void - an absence of aluminization from a
designated area of the leadframe.
4. Ordering Information
Purchase order for Cer-DIP metallic leadframes furnished to this specification shall
include the following items:
1. Drawing number and revision level
2. Material
3. Number of leads
4. Description, see Table 1
5. Metallization thickness, type, and surface location
6. Form of leadframes (i.e., singles, scored
strips or unscored strips)
7. Number of frames per strip; as applicable
8. Material certification
9. Packaging and marking
5. Dimensions and Permissible Variations
The leadframe dimension shall conform to the
specifications given in Table 1.
1
113
Military Standards, Naval Publications and Form Center,
5801 Tabor Ave., Philadelphia, PA 19120
G2
6. Materials
6.1 Leadframe
6.1.1 Chemical composition shall conform
to the requirements of MIL-M-38510, Type A
or B.
6.1.2 Material tensile strength shall be
supplied per MIL-I-23011
6.2 Metallization - Aluminum
6.2.1 Thickness - 100 microinches minimum, 600 microinches maximum.
6.2.2 Coverage -.030" (.762 mm) minimum;
measured from lead tip. Maximum to be determined by ceramic size.
6.2.3 Composition
6.2.3.1 Clad material - 99.4% minimum
aluminum
6.2.3.2 Vapor deposition - 99.9 % minimum
aluminum
NOTE–The two types of aluminum may exhibit different
visual appearances and non-functional characteristics after processing.
7. Defect Limits
7.1 Burrs
7.1.1 Horizontal
7.1.1.1 Bonding Area - .001" (.025 mm) max.
7.1.1.2 Other areas -.002" (.051 mm) max.
7.1.2 Vertical
7.1.2.1 Bonding Area -.001" (.025 mm) max.
7.2 Planarity/Coplanarity - See Table 1.
7.3 Foreign Materials - Leadframes shall be
clean and free from foreign material such as
photoresist, lubricants, solvent residue, water
marks, and rust spots. Protective coatings
acceptable to both vendor and user are not
considered foreign material.
7.4 Pits and Slug Marks
7.4.1 Bonding Area -.001" (.025 mm) max.
surface dimension × .0005" (.013 mm) max.
depth.
7.4.2 Other Areas -.010" (.254 mm) max.
surface dimension × .0005" (.013 mm) max.
depth.
7.5 Projections
7.5.1 Bonding Area - None allowed.
7.5.2 Other Areas - .010" (.254 mm) max.
surface dimension × .002" (.051 mm) max.
height.
7.6 Scratches - There shall be no scratches
in the aluminum metallization that penetrate to
the underlying base material.
7.7 Voids - All metallized areas of the leadframe within the bonding area shall have no
voids larger than .001" (.025 mm) in any
dimension.
7.8 Twist - .004 inch per inch (.102 mm per
mm) max.
7.9 Coining
7.9.1 Coined Depth - Minimum .0005"
(.013mm); maximum .002" (.051 mm). Minimum coined depth may be controlled by minimum flat area.
7.9.2 Coined Flat Area - Minimum of 80% of
normal lead width; measured .005" (.127 mm)
back from lead tip.
7.9.3 Coined Length - Minimum .025" (. 635
mm) from lead tip.
7.10 Lead Position
7.10.1 Lead Position - A .007" (.178 mm) diameter circle must be 100% within nominal
lead position when centered at lead nominal
centerline and .007" (.178 mm) back from lead
tip.
7.10.2 Minimum Spacing -.006" (.152 mm)
minimum.
7.11 Bowing
7.11.1 Convex - .0025 inch per inch (.0025
mm per mm) maximum.
7.11.2 Concave -.0025 inch per inch (.0025
mm per mm) maximum.
7.12 Camber -.005 inch per inch (.005 mm
per mm) maximum.
NOTE–Items 7.11 and 7.12 refer to scored strips only.
8. Sampling
Sampling will be determined between supplier and purchaser.
9. Test Methods
9.1 Sequence of Events and Tests
The sequence of testing should be:
1. Degrease
2. Metallurgical Bond Adhesion (9.3.1)
3. Frame Attach
4. Die Attach
5. Bond
6. Pre-Seal Bond Pull (9.3.2)
7. Seal
8. Mechanical Testing (9.2)
9. Lead Trim
10. Post-Seal Bond Pull (9.3.2)
NOTE—It is acknowledged that the leadframe
manufacturer may not perform all these tests due to equipment and component limitations. Regardless, leadframes
must fulfill these requirements, subject to the influence of
the testing facility and associated components.
114
G2
9.2 Mechanical and Thermal
9.2.1 Temperature cycling - per MILSTD-883, Method 1010.4, Condition C.
9.2.2 Thermal shock - per MIL-STD-883,
Method 1011.2, Condition C.
9.2.3 Centrifuge - per MIL-STD-883,
Method 2001.2, Condition E.
9.2.4 Lead Integrity
9.2.4.1 A 500°C ± 20° –55% R.H. heat
soak for 15 minutes ± 1 minute. Cooled at no
more than 50°C per minute. Afterwards the
frame is clamped between plates of a suitable size for the lead spacing (see 9.2.4.2);
then (3) 90° cycles are performed. Frames are
examined at 20× magnification and if cracks
are observed at the Apex A (Figure 3) then the
frame is rejected.
9.2.4.2 Plate shall be of equivalent planform
to the ceramic being employed for the
particular frame. An edge radius equivalent to
2T, where T is the leadframe thickness, shall
be on the contacting surface of the plate.
9.3 Functional Test Methods
9.3.1 Metallurgical Bond Adhesion Aluminization - The metallurgical bond between the
aluminization and the base metal shall permit
the leadframe to be heated in air to 525°C ±
10°C for five (5) minutes minimum without evidence of aluminum peeling, blistering or discoloring when viewed at 20× magnification.
(Discoloration must not jeopardize the user's
standard part reliability.) Subsequently, the
aluminized layer must pass the following two
adhesion tests:
9.3.1.1 A cellophane type adhesive tape
is firmly applied to the aluminization and
removed toward the center of the cavity in a
continuous rapid motion. This test is to be
performed over the same area three times.
No evidence of aluminum separation from the
base metal shall be visible at 20× magnification.
9.3.1.2 The aluminization shall be capable
of passing a functional wirebond test without
separating.
9.3.2 Lead Bond Quality - Minimum pre-seal
and post-seal bond strength test per MILSTD-883, Method 2011.2, Test Condition D.
Applicable failure categories: A - 4 and A - 6.
10. Packaging and Marking
10.1 Packaging - Leadframes must be packaged in containers designed and constructed
to prevent damage and/or contamination.
Specific protection must be provided against
foreseeable mechanical and environmental
hazards.
10.2 Marking - The outer containers shall
be clearly marked identifying the user, stock
number, user purchase order number, drawing number, and vendor lot number.
Table 1
Typical Ceramic Cer-DIP Metallic Leadframes Dimensions and Tolerance Requirements
Description
8SSI
Cavity Length
—
8MSI
—
8LSI
—
14SSI
14MSI
16SSI
16MSI
16LSI
.160 ± .007
4.06 ± .178
.260 ± .007
6.60 ± .178
.160 ± .007
4.06 ± .178
.260 ± .007
6.60 ± .178
.260 ± .007
6.60 ± .178
Cavity Width
.120 ± .007
3.05 ± .178
.140 ± .007
3.56 ± .178
.160 ± .007
4.06 ± .178
.120 ± .007
3.05 ± 1.78
.140 ± .007
3.56 ± 1.78
.120 ± .007
3.05 ± .178
.140 ± .007
3.56 ± .178
.170 ± .007
4.32 ± .178
Lead-Formed
Width,
Top
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
115
Bond Finger
Layout
End vs. Side
0
4
0
4
0
4
4
3
4
3
4
4
4
4
4
4
Nominal
Progression
.945
24.00
.945
24.00
.945
24.00
.945
24.00
.945
24.00
.945
24.00
.945
24.00
.945
24.00
Units
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
G2
Table 1 (continued)
Description
16SLSI
16VLSI
18MSI
18LSI
18VLSI
20MSI
20LSI
20VLSI
22MSI
22LSI
22VLSI
24MSI
24LSI
24VLSI
24SD3S
24SD3M
24SD4M
28MSI
28LSI
28VLSI
40MSI
40LSI
Cavity Length
.360 ± .007
9.14 ± .178
.330 ± .007
8.38 ± .178
.260 ± .008
6.60 ± .203
.260 ± .008
6.60 ± .203
.330 ± .008
8.38 ± .203
.210 ± .008
5.33 ± .203
.260 ± .008
6.60 ± .203
.330 ± .008
8.38 ± .203
.270 ± .010
6.86 ± .254
.310 ± .010
7.87 ± .254
.350 ± .010
8.89 ± .254
.260 ± .010
8.38 ± .254
.330 ± .010
8.38 ± .254
.420 ± .010
10.67 ± .254
.260 ± .010
6.60 ± .254
.430 ± .010
10.92 ± .254
.210 ± .010
5.33 ± .254
.260 ± .011
6.60 ± .279
.325 ± .011
8.26 ± .279
.420 ± .011
10.67 ± .279
.270 ± .012
6.86 ± .305
.375 ± .012
9.53 ± .305
Cavity Width
.170 ± .007
4.32 ± .178
.180 ± .007
4.57 ± .178
.140 ± .008
3.56 ± .203
.170 ± .008
4.32 ± .203
.180 ± .008
4.57 ± .203
.140 ± .008
3.56 ± .203
.170 ± .008
4.32 ± .203
.175 ± .008
4.45 ± .203
2.10 ± .010
5.33 ± .254
.240 ± .010
6.10 ± .254
.260 ± .010
6.60 ± .254
.260 ± .010
6.60 ± .254
.285 ± .010
7.24 ± .254
.290 ± .010
7.37 ± .254
.170 ± .010
4.32 ± .254
.180 ± .010
4.57 ± .254
.210 ± .010
5.33 ± .254
.260 ± .011
6.60 ± .279
.275 ± .011
6.99 ± .279
.280 ± .011
7.11 ± .279
.260 ± .012
6.60 ± .305
.295 ± .012
7.49 ± .305
Lead-Formed
Width,
Top
Bond Finger
Layout
End vs. Side
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.311 ± .003
.790 ± .076
.411 ± .003
10.44 ± .076
.411 ± .003
10.44 ± .076
.411 ± .003
10.44 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
.311 ± .003
7.90 ± .076
.311 ± .003
7.90 ± .076
.411 ± .003
10.44 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
.611 ± .003
15.01 ± .076
4
4
6
2
4
5
6
3
6
3
4
6
6
4
6
4
6
5
6
5
8
3
6
6
6
6
6
6
6
6
8
4
6
6
8
6
8
6
8
6
10
10
12
8
Nominal
Progression
Units
.945
24.00
.945
24.00
1.061
26.95
1.061
26.95
1.061
26.95
1.175
29.85
1.175
29.85
1.175
29.85
1.250
31.75
1.250
31.75
1.250
31.75
1.510
38.35
1.150
38.35
1.510
38.35
1.510
38.35
1.510
38.35
1.510
38.35
1.724
43.79
1.724
43.79
1.724
43.79
2.300
58.42
2.300
58.42
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
in
mm
NOTE: While a .311 top form is still currently being used, numerous users have changed to a .314 top form to
prevent interference between the Cer-DIP base and leadframe.
116
G2
Figure 1.
Bow
Figure 2.
Camber
Figure 3.
Stamped Leadframe Terminology
117
G2
Using surface plate, establish a reference plane the whole
length of the frame strip. Place frame strip, either method 1
or 2, whichever method gives a 3 point contact with reference
plane A, using thickness gauges to determine height between
reference plane and 4th point noted as t. This measurement
will determine frame twist over entire length.
Figure 4.
Twist Strip
Figure 5.
Standoff Lead Length
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any particular application. The determination of the suitability of
the standard is solely the responsibility of the user. Users are cautioned to refer to
manufacturer's instructions, product labels, product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are subject to change
without notice.
118
G4
Reprinted by the Nickel Development Institute with permission, from the Semiconductor Equipment and Materials Institute, Inc., Book of SEMI Standards. Copyright the
Semiconductor Equipment and Materials Institute, Inc., 805
E. Middlefield Road, Mountain View, CA 94043.
G4-86
SEMI SPECIFICATION
INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE
PRODUCTION OF STAMPED LEADFRAMES (PROPOSED)
1. Scope
This specification covers the special requirements for metal strip to be used to
fabricate integrated-circuit leadframes by
stamping.
2. Applicable Documents
ASTM B601
ASTM E8
ASTM B193
1
Recommended Practice for
Temper Designations for
Copper and Copper Alloys
Wrought and Cast.
Methods of Tension Testing
of Metallic Materials
Test Method for Resistivity
of Electrical Conductor
Materials
this specification. Samples can be obtained
from the ID or the OD of each coil. If the
material does not conform to this specification,
remove 2 wraps from the ID and OD of each
coil and test for conformance again.
5.2 Thickness and Width - The tolerances
for thickness and width shall be as shown
on Table 1. More restrictive tolerances than
those shown below or tolerances for other
thickness and widths shall be as agreed upon
by purchaser and supplier.
Table 1
Thickness and Width Tolerances
3. Ordering Information
Orders for material under this specification
shall include the following information:
1. Quantity of each size
2. Alloy name and number
3. Temper or mechanical properties
4. Dimensions: thickness and width
(See 5)
5. How furnished: coils and coil size
(See 8)
6. Certification or test report requirements
(See 9), and
7. Packaging and marking requirements
(See 10)
4. General Requirements
4.1 The materials covered by this specification shall conform to the requirements
detailed herein, unless otherwise agreed upon
by supplier and purchaser.
5. Dimensions and Tolerances
5.1 The following tests shall be used to determine conformance or non-conformance to
Thickness
.006" (.152 mm)
.008" (.203 mm)
.010" (.254 mm)
.015" (.381 mm)
.020" (.508 mm)
Tolerance
± .0003" (.008 mm)
± .0003" (.008 mm)
± .0003" (.008 mm)
± .0004" (.010 mm)
± .0005" (.013 mm)
Width
≤ 2.000" (50.80 mm)
2.001-2.500"
(50.83-63.50 mm)
Tolerance
± .002" (.054 mm)
± .002" (.051 mm)
5.3 Camber (Edgewise Curvature) - A six or
eight foot long strip sample shall be placed on
a flat surface against the edge of a six foot (or
longer) straight edge. The largest amount of
separation of the strip sample from the straight
edge shall be measured. Extreme care must
be exercised with this test to ensure that the
sample illustrates a uniform camber (no
reverse curvature should be present in the
sample), and also that it is not bent or kinked,
as this could result in a grossly inaccurate
measurement. The maximum camber allow1
119
ASTM Specifications, 1916 Race Street, Philadelphia, PA
19103
G4
able in any 72" or 96" length is shown in
Table 2.
Table 2
Camber Limits
Specified Width
inches
.600-.949
(15.24-24.11 mm)
≥ .950
(24.13 mm)
Camber in
any 72" length,
inches
.250
(6.35 mm)
.125
(3.18 mm)
Camber in
any 96" length,
inches
.438
(11.13 mm)
.219
(5.56 mm)
7. Corrosion
5.4 Coil Set - A three foot long sample shall
be held with one end against a flat vertical
surface. The distance between the flat vertical
surface and the free hanging end of the strip
(that is positioned for maximum distance from
the flat vertical surface) shall be measured.
The measured coil set shall not exceed 1.5"
(38.10 mm). Coil set is dependent on alloy,
temper, and coil diameter and, where the
combination of these requirements results in
coil set (1.5" [38.10 mm] or less), it shall be
uniformly in the direction of coiling.
5.5 Twist - The twist shall not exceed 20°
over the three foot sample. (See Figure 1 for
an example of a fixture commonly used to
measure twist.)
5.6 Edge Burrs - Undesirable and, if present,
their height shall not exceed 10% of the metal
thickness.
5.7 Crossbow (dish) - Crossbow shall be
measured using a toolmaker's microscope or
equivalent, with any burrs present being removed prior to measurement. The maximum
crossbow allowable shall be shown in Table 3
unless otherwise agreed upon between supplier and purchaser.
Table 3
Maximum Crossbow
Specified Width, inches
Up to 1.000" (25.4 mm) incl.
Over 1.000" (25.4 mm) up
to 2.000" (50.8 mm), incl.
mm) in depth shall be acceptable unless
otherwise agreed upon between supplier and
purchaser.
6.3 Material shall meet an 8 micro inch
(RMS) maximum surface roughness as measured across the direction of rolling.
Maximum Crossbow
.003 (.076 mm)
.006 (.152 mm)
6. Surface Finish
6.1 The material shall be commercially free
of surface imperfections such as pits, nicks,
dents, gouges, scratches, laminations, or
inclusions.
6.2 Surface defects less than .0003" (.0076
7.1 Visual inspection shall be used to determine if objectionable surface oxides are
present which would render the product unusable for the intended application. Objectionable conditions, if present, should be reported
to the supplier within 60 days after the receipt
of the material.
7.2 There shall be no visible rust on the surface of the Alloy 42 material.
8. Coils
8.1 Unless otherwise specified, coils shall
be supplied with an inside diameter that provides for good packing practice without resulting in excessive coil set.
8.2 All coils supplied shall be continuous,
uniform lengths, and free of welds. Autogenous welds made at heavy gauge, prior
to finish reductions that ultimately provide
homogeneous structures, are allowed.
9. Certification or Test Reports
9.1 Requests for certifications or test
reports shall be made at the time of order
entry or contract agreement. They shall be
furnished by the manufacturer within one
week of date of shipment.
9.2 When certifications are required, the
following information shall be supplied as a
minimum:
1. Vendor name
2. Purchase order number
3. Vendor order number
4. Alloy name and number
5. Chemical analysis
6. Temper designation, reference only (for
copper base alloys only) (ASTM 13601)
7. Tensile strength (ASTM E8)
8. Elongation percent in 2" (ASTM E8)
9. Electrical conductivity % IACS (for copper
base alloys only) (ASTM 13193)
9.3 In the event of a disagreement between
supplier and purchaser, an independent test
shall be conducted on strip to verify the data
120
G4
supplier and
purchase.
provided in the certification.
10. Packaging and Marking
10.1 the material shall be separated by
size, compositions, and temper, and prepared
for shipment in such a manner as to ensure
acceptance by a common carrier for transportation at the lowest applicable rate.
10.2 The material shall be suitably
packaged to protect from condensation,
contamination, etc., and to afford protection
from the normal hazards of transportation.
10.3 Each shipping unit shall be legibly
marked with the purchase order number, alloy
name or number, temper, size, gross and
net weight, and name of the supplier. The
specification number shall be shown when
specified on the purchase order.
10.4 Any special packaging or shipping
requirements shall be agreed upon between
purchaser
at
the
time
of
11. Basis for Rejection
11.1 For the purposes of determining
conformance
with
the
requirements
prescribed in the specifications, any
measured value outside the specified limiting
values shall be cause for rejection.
11.2 If objectionable material is found and
rejected, samples of the questionable material, with the defects identified and marked,
should be sent to the supplier along with information as to order number, quantity originally received, date received, and quantity
rejected. Rejected material should be held
with adequate protection and identification by
the purchaser for a reasonable amount of
time, pending investigation by the supplier.
Figure 1.
Twist Measurement Fixture
(Continued on next page)
121
G4
Figure 1. (cont.)
NOTICE: SEMI makes no warranties or representations as to the suitability of the
standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels, product data sheets, and other
relevant literature respecting any materials mentioned herein. These standards are
subject to change without notice.
122
G22
Reprinted by the Nickel Development Institute with permission, from the Semiconductor Equipment and Materials Institute, Inc., Book of SEMI Standards. Copyright the
Semiconductor Equipment and Materials Institute, Inc., 805
E. Middlefield Road, Mountain View, CA 94043
G22-86
SEMI SPECIFICATION
CERAMIC PIN GRID ARRAY PACKAGES (PROPOSED)
1. Preface
This specification defines the acceptance
criteria for cofired ceramic pin grid array
packages.
2. Applicable Documents
MIL-STD-105
1
Sampling Procedures and Tables for Inspection by Attributes
MIL-STD-883 Test Methods and Procedures
for Microelectronics
MIL-STD-7883 Brazing
MIL-G-45204 Gold Plating, Electrodeposited
MIL-M-38510 General Specifications for
Microcircuits
1
Nickel Plating
QQ-N-290A
2
Dimensioning and Tolerancing
ANSI Y14.5
MIL-I-23011
Iron Nickel Alloys for Sealing
to Glasses and Ceramics
3
JEDEC Publication No. 95 Registered and
Standard Outlines
for Semiconductor
Devices
3. Selected Definitions
blister (bubble) ceramic - Any separation
within the ceramic which does not expose underlying ceramic material.
blister (bubble) metal - Any localized separation within the metallized or between the
metallization and ceramic which does not expose underlying metal or ceramic material.
braze - An alloy with a melting point equal
to or greater than 450°C.
burr - An adherent fragment of excess parent material at the component edge.
chip - A region of ceramic missing from the
surface or edge of a package which does not
go completely through the package. Chip size
is given by its length, width and depth from a
projection of design plan form (Figure 1).
cofired - A process or technology to
manufacture product in which the ceramic and
refractory metallization are fired simultaneously.
Figure 1.
Chip Illustration
crack - A cleavage or fracture that extends
to the surface of a package. It may or may not
pass through the entire thickness of the
package.
contact pad - That metallized pattern that
provides mechanical or electrical connection
to the external circuitry.
delamination - The separation of the individual layers of the ceramic.
die attach area - A dimensional outline
designated for die attach.
discoloration - Any change in the color of
the package plating as detected by the unaided
eye after the application of heat per G22 9.1.1.
flatness - The allowable deviation of a surface from a reference plane. The tolerance
zone is defined by two parallel planes within
which the surface must lie.
footprint - Pin pattern.
foreign material - An adherent particle other
than parent material.
isolation gap – Metal-free space between
conductive areas.
layer - A dielectric sheet with or without
metallization that performs a discrete function
as part of the package.
peeling (flaking) - Any separation of metallization from the base material exposing the
base material.
1
2
3
123
Military Standards, Naval Publications and Form Center, 5801
Tabor Ave., Philadelphia, PA 19120
ANSI, 1430 Broadway, New York, NY 10018
JEDEC, 2001 Fye St. N.W., Washington, DC 20006
G22
pit - Any unspecified depression in the
package.
projection - An adherent fragment of parent
material on the package surface.
pullback - The linear distance between the
edge of the ceramic and the first measurable
metallization (see Figure 2).
rundown - The vertical extension of metallization from the ceramic (see Figure 2).
seal area - A dimensional outline area
designated for either metallization or bare
ceramic to provide a surface area for sealing.
seating plane - Is defined by the standoff
features or the package base plane if no
standoff is used (See Figure 3).
standoff - The designed separation between
the base plane and the seating plane created
by a physical feature. Standoff use configuration and placement are optional (See
Figure 3).
terminal - Case outline at point of entry or
exit of an electrical contact.
TIR - Total Indicator Reading.
voids - An absence of metallization or plating from a designated area.
4. Ordering Information
Purchase orders for Pin Grid Array Packages
furnished to this specification shall include the
following items:
1. Drawing number and revision level
2. Certification requirements
3. Quantity
4. Reference to this document
5. Any exceptions to print or specifications
5. Dimensions and Permissible Variations
The dimensions of the pin grid array package
shall conform to the SEMI Standards or to the
customer drawing and be within the outline of
the appropriate JEDEC standard. Refer to
MIL-M-38510, Appendix C as appropriate.
6. Material Parameters
The definitions, defects and functional testing
described in this specification relate directly to
a nominal package made with the following
materials. They may also be applicable to
similar pin grid array packages made with
other materials.
6.1 Ceramic Properties
6.1.1 Materials - Alumina content 90%
Figure 2.
Metallization Misalignment
Note – Standoff use, configuration, and placement
are optional.
Figure 3.
Seating Plane
minimum. Beryllia content to be determined.
6.1.2 Color - Dark or white.
6.2 Metal Properties
6.2.1 Metallized circuits and areas shall be
refractory metal tungsten, molybdenum, or an
approved equivalent, .0003" (.00762 mm)
minimum thickness.
6.2.2 Finish shall be per MIL-M-38510; Nickel plating (if designated) shall be per QQN-290A, 50µ" -350µ" (.0013 mm - .00889
mm). Gold plating shall conform to MILG-45204, Type III and 50µ" -225µ" (.0013 mm
- .00508 mm).
6.2.3 Braze shall be per MIL-STD-7883.
6.2.4 Pin Material - Iron nickel cobalt alloy
per MIL-M-38510, Type A (Kovar). Iron nickel
alloy per MIL-M-38510, Type B (Alloy 42).
Phosphor bronze per ASTM B159.
7. Defect Limits
A magnification of 10× shall be used to
inspect the packages unless otherwise
specified.
7.1 Ceramic
7.1.1 Cracks - Per MIL-STD-883, Method
2009.
7.1.2 Chips - (See Figure 1).
7.1.2.1 Edge - .100" length × .030" (.762
mm) width × .020" (.508 mm) (see Figure 1,A)
124
G22
7.1.2.2 Corner - .030" (.762 mm) length ×
.030" (.762 mm) width × .030" (.762 mm) (see
Figure 1,B).
7.1.2.3 Chips cannot encroach upon contact
pad or expose any buried metallization.
7.1.2.4 Seal Area - .060" (1.52 mm) length ×
.020" (.508 mm) width × .020" (.508 mm)
depth maximum. Chips cannot reduce the seal
width by more than 1/3 of the design width.
7.2 Package Flatness - .004 inch/inch
maximum.
7.2.1 Seal Area Flatness
Seal Area Size
.000" - .500" (0 - 12.7 mm)
.501" - .750" (12.72 - 19.05 mm)
.751" & greater (19.07 mm)
Seal Area Flatness (TIR)
.002" (.051 mm) Maximum
.003" (.076 mm) Maximum
.004" (.101 mm) Maximum
7.2.2 Die Attach Area Flatness
Die Attach Area Size
.000" - .500" (0 - 12.7 mm)
.501 " - .750"(12.72 - 19.05 mm)
Die Attach Area Flatness (TIR)
.002" (.051 mm) Maximum
.0035" (.088 mm) Maximum
7.3 Metallization Voids (voids greater than
.003" should be considered).
7.3.1 Seal Area - Maximum number of 3
voids per seal ring allowed. The maximum
void dimension is .010" and voids must be
separated by a minimum of .030" (.762 mm).
7.3.2 Wire Bond Finger - Be free of voids or
bare spots in the bonding area as defined by
customer drawing.
7.3.3 Die Attach Area - Three voids
allowed, maximum .010" (.254 mm) diameter
voids separated by a distance greater than
.010" (.254 mm). Voids within .015" (.381 mm)
of die attach cavity wall shall not be
considered as the basis for rejection.
7.3.4 Braze Metallization - A .010" (.254
mm) maximum diameter void is acceptable,
one void per pad.
7.4 Metallization Misalignment (see Figure 2).
7.4.1 Metallization Rundown - Internal cavity
not to exceed .010" maximum.
7.4.2 Wire Bond Finger Pullback - .010"
(.254 mm) maximum.
7.4.3 Wire Bond Finger Rundown - Metallization rundown not to exceed 0.10"
maximum.
7.4.4 Pattern Isolation - Minimum shall not
be reduced by more than 50% of the design.
7.5 Pin Attachment
8. Sampling
NOTE: This topic currently under revision in
another committee.
Sampling size must meet the requirements of
MIL-STD-105 or MIL-M-38510, o r as agreed
to between vendor and customer. Single,
double or multiple samples may be used per
vendor and customer agreement.
9. Test Methods
9.1 Mechanical, electrical and thermal test
methods per MIL-STD-883 unless otherwise
noted.
9.1.1 Gold plating and bake test of gold
plated package shall be tested by placing
parts on a calibrated heater per MIL-STD-883,
Method 1008 (excluding temperature).
9.1.1.1 Condition A - 450°C ± 10°C for two
minutes in air or
9.1.1.2 Condition B - 470°C ± 10°C for one
minute in nitrogen.
9.1.1.3 After cooling at room temperature
the packages will be examined for the
following criteria:
1. Blisters - None allowed at 10× magnification.
2. Any non-uniform color change of the gold
at die attach pad edges up to .015" (.381
mm) from the cavity walls is acceptable.
3. Any non-uniform color change of the bonding fingers, seal ring surface, or external
pins is not acceptable.
4. There shall be no flaking or peeling of the
package plating when viewed at 10×
magnification.
5. Superficial stains left during drying or prior
operations is not cause for rejection.
6. Plating adhesion tape test.
9.1.2 Lead Pull - Under the test condition of
five (5) pounds ± one-quarter (¼) pound pull
at an angle of 20° or less from the pins
vertical line, measured perpendicular to the
package, there shall be no visible separation
of the braze joint under 10× magnification.
This excludes plating.
9.1.3 Lead Fatigue - Test per MIL-STD-883,
Method 2004 Test Condition B2, Paragraph 3.2.
9.2 Functional Test Methods
9.2.1 Die Attach Quality - Destructive die
shear test post environmental testing per MIL-
125
G22
STD-883, Method 2019, Paragraph 3.2C.
9.2.2 Wire Bond Quality - Minimum pre-seal
and post-seal bond strength test per
MIL-STD-883, Method 2011, Test Condition
D. Reject for bonds which cause plating to lift
from the base metal of the bonding fingers or
fail to meet minimum strength requirement.
9.2.3 Solderability - Test per MIL-STD-883,
Method 2003 (omit aging).
9.2.4 Insulation Resistance - Test per MILSTD-883, Method 1003, Condition D.
9.2.5 Hermetic and Environmental Testing
per MIL-STD-883.
9.2.5.1 The hermetic integrity of the package must be maintained after all environmental testing. Hermetic checks shall comply with
MIL-STD-883, Method 1014, Test Conditions
A, B, C, or D.
9.2.5.2 Environmental testing shall include,
but not be limited to, the following:
1. Temperature Cycle, MIL-STD-883, Method
1010, Condition C w/o heat sink; Condition
B w/ heat sink.
2. Thermal Shock, MIL-STD-883, Method
1011, Condition C w/o heat sink; Condition
B w/ heat sink.
3. Centrifuge, MIL-STD-883, Method 2001,
Condition E, Y1 axis only - cavity up; Y2
axis only cavity down- (optional).
4. Mechanical Shock, MIL-STD-883, Method
2002, Condition B.
5. Vibration, MIL-STD-883, Method 2007,
Condition A.
NOTE 1 – Package applications requiring a heat sink attach will require the environmental test requirements (temp.
cycle, shock, etc.) to be evaluated on an individual basis.
The material, form factor, and method of attach used for
heat sinks may result in severe stresses being induced on
the package assembly during environmental testing. Actual accelerated test requirements should be based on the
expected product application environment and may be less
rigorous than those tests for packages without heat sinks.
10. Sequence of Events and Incoming
Testing
During incoming inspection the sequence of
testing shall be:
A. Visual
B. Dimensional
C. Functional (typical functional tests which
may be applied)
Die Attach
Wire Bond
Pre-seal Wire Pull
Seal
Heat Sink Attach (if applicable)
Environmental Test
Fine Leak MIL-STD-883, Method 1014,
Condition B.
Gross Leak -MIL-STD-883, Method 1014,
Condition C.
Post-Seal Bond Pull Radiography
Die Shear, MIL-STD-883, Method 2019
Solderability, MIL-STD-883, Method 2003
NOTE 2 – An initial vendor qualification may be performed
on the thermal and electrical characteristics of the package. The characteristics tested will be:
Insulation Resistance — MIL-STD-883, Method 1003, Test
Condition D.
Thermal Dissipation — MIL-STD-883, Method 1012.
11. Packaging and Marking
11.1 Packaging - Container selected shall
be strong enough and suitably designed to
provide maximum protection against crushing,
spillage and other forms of damage to the
container or its contents to contamination
from exposure to excessive moisture or
oxidation by gases. Packaging materials shall
be so selected to prevent any contamination
of the ceramic components parts with fibers or
organic particles.
11.2 Marking - The outer containers shall
be clearly marked identifying the customer
part no., customer purchase order number,
drawing number (optional), quantity, date and
vendor lot number (optional).
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any particular application. The determination of the suitability of
the standard is solely the responsibility of the user. Users are cautioned to refer to
manufacturer's instructions, product labels, product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are subject to change
without notice.
126