SARNOFF EUROPE
ESD DESIGN
SOLUTIONS
TSMC DCA foundry partner
Sarnoff Europe has joined the TSMC Design Center Alliance (DCA) which aligns IC
companies and TSMC-qualified providers.
Tom Quan, Deputy Director at the Design Methodology and Service Marketing at TSMC
“Sarnoff Europe combines IP in an advanced design flow
with calculation and integration tools, and customized
services. They complement the diverse Design Services
offered by our portfolio of DCA partners”
TSMC Customer Quote
Michel De Mey, Senior Director, AMIS
“Sarnoff has truly demonstrated first-time-right delivery
capabilities. With the easy-to-use, easy-to-integrate
TakeCharge ESD solution, AMIS can focus on bringing
products to customers quickly and cost effectively.”
Compelling Value Proposition
Design Success
Enable customers to integrate product proven ESD
solutions in their ICs. Create customer value with:
• Faster time to market
• Smallest silicon area layout
• Optimized ESD and IC performance
• Lower R&D risk and expense
• Easy integration and adoption
• Quality solutions and support
TakeCharge use is reported in 475 commercial IC tapeouts (till 2008), including ASICs, FPGAs, LCD drivers,
power, consumer and communication ICs.
Our customers include IDM & fabless: Toshiba, Altera,
Infineon, ST, Ricoh, OKI, Sony, Fujitsu, Renesas,
Panasonic, Seiko Epson, NJR, PMC-Sierra, ON, AMIS,
RedMere, Nanotech, Gennum, Actel, CamSemi, THine,
Inphi and others.
Complementary Solution Set
Sarnoff Europe offers a proprietary portfolio of
solutions that are complementary to the standard, the
foundry or the customers own solutions. The solutions
are delivered in a fast turnaround (less than 3 weeks).
An optional Toolkit is available for further independent
product implementation.
TakeCharge focuses on:
• High ESD protection requirements
8kV HDMI, 6kV TCON, and 15kV analog switches
• Mobile and green solutions
pA leakage in 40nm
• Protection of high speed / RF signal pins
Up to 20Gbps, SerDes
• ESD sensitive custom designs
thin gate inputs or fully silicided output drivers
• Combinations of the above
Custom full solution development, including standard
ESD solutions, are often requested and hence offered
for proprietary processes.
475
354
222
137
75
3
29
Statusv
Q3
2002 2003 2004 2005 2006 2007 2008
Example - High speed differential
application in TSMC 90nm
•
•
Flexible cooperation model
•
TSMC customers can rely on Sarnoff Europe’s
experience, its advanced and proprietary tools
and product proven ESD solutions to achieve quick
turnaround for ESD risk assessment, ESD test and
qualification, design and layout review, debugging,
optimization, …
•
•
•
Full local clamping for 1.2V IO
ESD protection >4kV HBM
>200V MM ; >750V CDM
Low leakage during normal operation
1nA @ 1.2V
Low junction capacitive < 190fF total
Small area for full local protection: 1,200um2
0 ohm series resistance inserted
Sarnoff Europe and client engineers work closely
together throughout the design cycle to ensure
successful ESD protection of the product under study.
The resulting full chip solution typically consists of
a combination of public- and customer’s in-house
developed solutions and TSMC/foundry supplied
guidelines, complemented upon necessity by Sarnoff
proprietary ESD solutions.
Contact Information
CTC - Itochu Techno-Solutions Corporations - Mr. Noriyuki Takemoto
ntake@ctc-g.co.jp - Phone: +81 (3) 6417 5443 - Fax: +81 (3) 5434 0054
IPN Corporation (http://www.ipncorp.com) - Mr. Kanji Saruta
kanjisaruta@ipncorp.com - Phone: +81 (3) 5212 3525 - Fax: +81 (3) 5212 3526
Sarnoff Europe reserves the right to change these specifications without notice. © 2008. Azll rights reserved. Ref. 20090120JAPANTSMCv2