WKH Package 56-Lead QFN Multipad (7mm × 9mm) (Reference

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WKH Package
56-Lead QFN Multipad (7mm × 9mm)
(Reference LTC DWG # 05-08-1870 Rev A)
SEATING PLANE
A
7.00
BSC
0.50 BSC
45
B
PAD 1
CORNER
3
2.90 REF
2.63 REF
0.00 – 0.05
44
1
bbb M C A B
4
9.00
BSC
PIN 1 ID
56
4.76 ±0.10
3.82 REF
1.97
±0.10
3.15 ±0.10
4.06 ±0.10
0.95
REF
1.50 REF
NX b
12
aaa C 2x
2.25 ±0.10
4.27 ±0.10
16
29
0.58 ±0.05
aaa C 2x
TOP VIEW
0.90 ±0.10
6
NX
0.08 C
// ccc C
7.50 ±0.05
2.90 REF
3.82 REF
3.15 ±0.05
4.76 ±0.05
0.85 × 0.85 (8×)
0.85 × 0.75 (15×)
1.50 REF
4.27 ±0.05
0.9 × 0.9 (8×)
MLP56 QFN REV A 1013
3
THE LOCATION OF THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING
CONVENTION CONFORMS TO JEDEC PUBLICATION 95 SPP-002
4
DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED
BETWEEN 0.20mm AND 0.30mm FROM THE TERMINAL TIP. IF THE TERMINAL
HAS THE OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE
DIMENSION b SHOULD NOT BE MEASURED IN THAT RADIUS AREA.
5
COPLANARITY APPLIES TO THE TERMINALS AND ALL OTHER SURFACE
METALLIZATION
6
DRAWING SHOWN ARE FOR ILLUSTRATION ONLY
0.40 ±0.05
1.78
REF
RECOMMENDED SOLDER PAD LAYOUT
TOP VIEW
1.35
±0.05
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
ccc
0.10
7. PAD LAYOUT AND STENCIL LAYOUT AS GUIDE LINE ONLY. DRAWING NOT TO SCALE
PACKAGE
OUTLINE
0.25 ±0.05
0.25 ±0.05
BOTTOM VIEW
(BOTTOM METALLIZATION DETAILS)
9.50 ±0.05
2.25 ±0.05
1.78
REF
17
NOTE:
1. DIMENSIONING AND TOLERANCING CONFORM TO ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS, ANGLES ARE IN DEGREES (°)
1.97
±0.05
4.06 ±0.05
19
1.35
± 0.05
5
2.63 REF
0.50 BSC
PIN 1
3.82 REF
0.40 ±0.05
28
RECOMMENDED STENCIL DESIGN
(SAME DIMENSIONS AS PAD LAYOUT, NOTE 7)
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