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Low Value Flat
Value
LowLow
Value
Flat Flat
Chip
Resistor
LowChip
Value
Flat
Resistor
Chip
Resistor
Welwyn Components
Welwyn Components
Chip Resistor
Welwyn Components
LRC/LRF Series
Series
•LRC/LRF
Standard
2512, 2010
LRC/LRF
Seriesand 1206 sizes
Resistance
Standard
2512,
2010
and2010
sizes
•·LRC/LRF
values
down
to1206
0.003
ohmssizes
•Series
Standard
2512,
and
1206
·•• Leach
Resistance
values
down
to
0.003
ohms
resistant
copper
• Resistance
values
down
to 0.003 ohms
Standard
2512, solder-plated
2010
and 1206
sizes
·• wrap-around
Leach resistant
solder-plated copper
termination
• Leach
resistant
copper
Resistance
values
downsolder-plated
to 0.003 ohms
wrap-around
termination
•• Low
inductance
- less than
0.2nH
wrap-around
termination
Leach
resistant
solder-plated
copper
·• AEC-Q200
AEC-Q200 Qualified
wrap-around
termination
• Low
inductance
less
than 0.2nH
Qualified
·• RoHS
compliant and SnPb variants
Low inductance
- less
than 0.2nH
• AEC-Q200
Qualified
•
AEC-Q200 Qualified
Electrical Data
Electrical Data
Electrical
Power rating @70°C Data
LR1206
0.5
watts
watts
ohms
%
Power rating at 170°C
Resistance range
Resistance ranPgoewer rating at 70°C
ohms
Resistance tolerance1
nce range
Power rating R
ates7is0ta°C
watts
Dielectric withstanding voltage
volts
TCR
ppm/°C
Resistance ranDgielectric withstanding voltage
ohms
TCR
ppm/°C
Dielectric withTsCtaRnding voltage
volts
Dielectric
volts
Resistancewithstand
tolerance
%
T
C
R
p
p
m
/°C
Resistanrange
ce tolerance
Ambient temperature
°C
Temperature rise at rated power
°C
Resistance tolTeerm
anpceerature rise at rated power
%
Values
2
Pad
and tracerarea
for tmax
power rating @ 70°C
mm
Temperaturerise
iseataand
t ratrace
epower
d parea
owerfor max power rating @°C70°C
°C
Temperature
rated
40
Pad
2
2
Pad
and trace
max power
rating
@ 70°C
mm300
30 2
Pad
/ trace
area3area
*2
Watts
with
totalfor
solder
pad and
trace
size of
mm mm
LR2010
LR2512
LR2010
LR2512
1
2
LR1206
0.5
1.0 LR2010
1.5/2.0LR2512
*
wattsLR1206 0.5R003 to 1R0
1.0
1.5/2.0*
LR2010
LR2512
0R010 to 1R
0R003 to 1R
0R003 to 1R
<R01: 5, ≥R01: 1, 2, 5
ohms 0.5 0R010 to 1R
1.00R003 to 1R
1.5/0
2R
.00*03 to 1R
2
0
0
2
0
0
200
≥R05: ±100, R025–R047: <+200, R015-R024: <+300,
vo0ltRs010 to 1R 200
200
20
0R003 to 1R
0R003 to 1
R0
±1R01-R014:
00 (Conta<+500,
ct facto<R01:
ry for<+900
value below 0.050 ohms)
ppm/°C 200
±100 (200
Contact 2fa0c0tory for value below 02.00500 ohms)
≤R005 5%, >R005 1, 2, 5%
tacttofa+150
c≤R005
tory fo5%,
r valu>R005
e belo1,
w 2,
0.0
50 ohms)
% ±100 (Con-55
5%
40
80
90
2
≤R005
5%, >R005 1,
°C
40E24
802, 5%
90
preferred
30
30
100
80
90 90 100
mm2 40
30 80
30
30
30
2
100
300 100
LR1206
*2 Watts with total solder pad and trace size of 300 mm
2
Note
1: Contact
factory
value pad
– tolerance
combinations
outside
this
range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also
*2 Watts
with
total for
solder
and trace
size of 300
mm
available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipation on FR4 PCB
Physical
Data Data
Physical
Physical
Data
Dimensions (mm)
Dimensions (mm)
(mm)
S ize
SDimensions
iz e
L
Size
LR1206
LR1206
L
LR1206
3.20±0.305 3.20±0.305
1.63±0.201.63±0.20
LR2010
LR2010
3.20±0.305 5.23±0.38
LR2512
LR2512
5.23±0.38
6.50±0.38 6.50±0.38
6.50±0.38
2.64±0.252.64±0.25
H (max) 0.8
0.8
0.8
0.84
3.25±0.253.25±0.25
0.84
LR2010
LR2512
D
D
D 0.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
0.84
2.64±0.25
0.84
0.84
3.25±0.25
0.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
0.84
LR 1206 L/R21021006//22501120 / 2512
W
W
W
LR 1206 / 2010 / 2512
L
LL
H
H
H
LRC/LRF Series
H (max) H (max)
W
W
1.63±0.20
5.23±0.38
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Low Value Flat
Chip Resistor
W
L
D
D
D
Solder Plating
SolderPlating
Plating
Solder
Nickel Barrier Layer
Protective Overcoat
NickelBarrier
Barrier
Layer
Nickel
CopperLayer
Wraparound
Copper
Wraparound
Termination
Copper Wraparound
Termination
Alumina Substrate
Termination
Alumina Substrate
ProtectiveOvercoat
Overcoat
Resistive Element
Protective
ResistiveElement
Element
Copper Termination
Resistive
Copper Termination
Copper Termination
Recommended Solder Pad Dimensions (mm)
A
Welwyn Components
Alumina Substrate
B
C
A
LR1206
2.0
4.0
1.25
LR2010
3.05
6.5
1.5
B
General Note
General
LR2512Note
3.7to make changes in product
7.75 specification without 1.5
Welwyn Components reserves the right
notice or liability.
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
All information
is subject to Welwyn’s own data and is considered accurate at time of going to print.
Welwyn Components reserves the right to make changes in product specification without notice or liability.
©
Welwyn
Components
Limited
· Bedlington,
Northumberland
NE22 7AA, UK
All
subject
to Welwyn’s
own data
and is considered
accurate
at time
of going
© information
Welwyn isComponents
Limited
· Bedlington,
Northumberland
NE22
7AA,
UK to print.
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com (%)
· Website: www.welwyn-tt.com
Telephone:
+44 (0) 1670
822181
· Website: www.welwyn-tt.com
AEC-Q200
Table
7 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com
General
Note
Typ.
Max.
100
Method
© Welwyn Components Limited · Bedlington,
Northumberland NE22 (add
7AA,R05)
UK
(@1R0)
C
A subsidiary of
A subsidiary of
TT electronics plc
TT electronics plc
A subsidiary of
TT electronics04.10
plc 04.10
4
Temperature Cycling
JESD22 Method JA-104
©6TT electronics
plc Resistance MIL-STD-202 Method 106
Moisture
7
Biased Humidity MIL-STD-202 Method 103
R% 0.25
0.1
R%
0.5
0.2
R%
0.5
0.2
Power Rating
TTref
electronics
reserves
the822181
right to·make
changes
specification
without
notice or liability.
Test
04.10
Telephone:
+44
(0) 1670
Facsimile:
+44 in
(0)product
1670 829465
· Email:
info@welwyn-tt.com
· Website: www.welwyn-tt.com
80
All3information isHigh
subject
to TT Exposure
electronics’ own
data and is considered
at
time 0.5
of going0.2
to print.
Temp.
MIL-STD-202
Method accurate
108
R%
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
60
40
2.14
23 23
23
Recommended Solder Pad Dimensions (mm)
A
LR1206
B
C
A
Low Value Flat
LR2010Resistor
Chip
2.0
4.0
1.25
3.05
6.5
1.5
LRC/LRF
Series
LR2512
3.7
7.75
1.5
B
C
ref
3
Typ.
(%)
100
R% 0.5
0.2
80
Max.
(add R05)
(@1R0)
4
Temperature Cycling
R% 0.25
0.1
6
Moisture Resistance MIL-STD-202 Method 106
R% 0.5
0.2
7
Biased Humidity MIL-STD-202 Method 103
R% 0.5
0.2
JESD22 Method JA-104
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
R%
14
R% 0.5
Vibration MIL-STD-202 Method 204
15 Resistance to Soldering Heat MIL-STD-202 Method 210
16
1
0.5
0.05
R% 0.25
Thermal Shock MIL-STD-202 Method 107
J-STD-002
60
40
20
0
R% 0.25 0.05
70
25
Solderability
21
Board Flex
AEC-Q200-005
R% 0.5
0.2
Terminal Strength
AEC-Q200-006
R% 0.25
0.1
Short Term Overload
6.25 x Pr for 2s
R% 0.5
Low Temperature Storage
-65°C for 100 hours
R% 0.5
Leach Resistance
Solder dip at 250°C
90s minimum
150 (°C)
Ambient temperature
0.1
18
22
Power Rating
AEC-Q200 Table 7
Method
Test
High Temp. Exposure MIL-STD-202 Method 108
>95% coverage
LRC 25
12 2
1 watt
LRC 20
10 1
0.w
5 at
wat
t t
LRC 12
06 0.5
25ww
atat
tt
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values
≥R01.
Ordering Procedure
Ordering
Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
This product has two valid part numbers:
LRF2512–R01GW
European
(Welwyn) Part Number: LRF1206-R02FW (1206, 20 milliohms ±1%, Pb-free)
Type
Mounting L
R F
1
2
0
6
R 0
Conventional (element up)
Values > R025
1
2
Flip-chip (element down)
Values < R025 3
F
Size
1
Value (use IEC62 code)
Type
Tolerance (use IEC62 code)
2
T1
1206 or 2010
2512
All sizes
5
3
4
Size
Value
Tolerance
Termination & Packing
F = ±1%
G = ±2%
J = ±5%
W
Pb-free, standard packing
T1 Pb-free, 1000/reel (non-standard)
PB
SnPb finish, standard packing
Standard packing is tape & reel
1206 & 2010
3000/reel
2512
1800/reel
1%LR = Conventional orientation 1206 E24 = 3/4
(values >R025)
2%
2010 characters
5% LRF = Flip-chip orientation 2512 R = ohms
(values ≤R025)
Packing
Tape
W
4
2
F
G
J
W
F
3000/reel
1800/reel
1000/reel
5
Standard
USA (IRC) Part Number: LRC-LRF1206LF-01-R020-F (1206, 20 milliohms ±1%, Pb-free)
L R Components
C
L Limited
R F Bedlington,
1
2 Northumberland
0
6
LNE22 F
© Welwyn
7AA, UK
0
1
-
R
0
2
0
-
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
1
2
3
4
5
F
6
7
04.10
1
2
3
4
5
6
7
Family
Model
Size
Termination
TCR
Value
Tolerance
Packing
F = ±1%
G = ±2%
J = ±5%
Standard packing is
tape & reel
1206 & 2010 3000/reel
2512
1800/reel
LRC
LR = Conventional orientation 1206 Omit for SnPb 01 = standard 4 characters
(values >R025)
R = ohms
2010 LF = Pb-free (±100ppm/°C
values ≥R05)
2512
LRF = Flip-chip orientation
(values ≤R025)
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
Electrical Data
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
LR1206
LR2010
LR2512
2.14