BEST SOUND ELECTRONICS
SPECIFICATION OF
ANALOG MEMS MICROPHONE
MODEL NO. : CMOE-I110TM42-4P
DIRECTIVITY : OMNI-DIRECTIONAL
SOUND PORT : TOP PORT TYPE
BSE CO., LTD
58B-4L, 626-3, GOZAN-DONG, NAMDONG-KU
INCHON-SI. KOREA
TEL :(8232) 550-1780
FAX :(8232) 554-6206
4
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1. SCOPE
This specification is for the SMD possible A-MEMS (Top port) Microphone which has endurable
reflow temperature of up to 260℃ for over 15 seconds.
This product has been added to the waterproof and dustproof features.
2. MODEL NO.
CMOE-I110TM42-4P
3. ELECTRICAL CHARACTERISTICS
Temp. = 23 ± 2 ℃
Room Humidity = 65 ± 5 %
Limits
NO.
Parameter
Symbol
Condition
At 1kHz (VS =2.0V)
(CPK 1.0이상)
Center
Max.
-45
-42
-39
dBV/Pa
300
Ω
250
㎂
1
Sensitivity
2
Output impedance
ZOUT
3
Current
consumption
IDSS
VS=2.0V
50
4
Signal to Noise
Ratio
S/N
At 1kHz(1Pa), VS=2.0V
55
5
Frequency
Response
94dB SPL, within ±3dB
50
6
Sensitivity Change
across Voltage
Vs=1.5V ~ 3.6V
7
Supply Voltage
VS
8
Total Harmonic
Distortion
THD
9
10
S
Unit
Min.
59
dB
15000
No Change
1.5
dB
2.0
3.6
At 100dB SPL
1
At 130dB SPL
5
V DC
%
Start-up time
(DC Output Voltage)
Reflow Sensitivity
Test
Hz
Reflow 2회
-3.0
Initial
100
ms
+3.0
dB
4. Measurement Circuit
VP
MEMS
Unit
AMP
Pin4
Vdd:2.0V
Pin1
Output
1uF
Pin2, 3
GND
MIC Case
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5. TYPICAL FREQUENCY RESPONSE CURVE ( FAR FIELD )
Far Field Measurement Condition
Temperature :
23 ± 2 ℃
Supply Voltage :
2.0V
Acoustic stimulus : 1Pa ( 94㏈ SPL at 1㎑ ) at 50 ㎝ from the loud-speaker.
The loud-speaker must be calibrated to make a flat frequency response input signal.
Position :
The frequency response of microphone unit measured at 50㎝ from the loud-speaker
20
F req u en cy R esp on se
[ Amplitude ; Decibel ]
15
10
5
0
-5
-1 0
-1 5
-2 0
100
1000
10000
[ F r e q u e n c y ; H e r tz ]
7. Frequency Mask Specification
Acoustic Feature :
Frequency
[Hz]
Wide Band Type
Low
Limit [dB]
Upper
Limit [dB]
50~1000
-3
+3
1000
0
0
20000
-3
+3
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6. MECHANICAL CHARACTERISTICS
※ PCB design & Pin size can be changed by model No.
SMD Type
CMOE-I110TM42-4P
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- Mechanical dimensions, Land Pattern
Dimensions (Unit : mm)
Orientation
Marking
1
4
2
3
Recommended
Recommended
PCB land pattern (Unit : mm)
solder stencil pattern (Unit : mm)
- thickness of metal mask: 0.10 mm
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7. RELIABILITY TEST CONDITIONS
Note : After test conditions are performed, the sensitivity of the microphone
shall not deviate more than ±3dB from its initial value.
DESCRIPTION
TEST
TEMPERATURE
STORAGE
[High Temperature Storage]
+70±2℃ environment for 200 hours.
(The measurement to be done after 2 hours of conditioning at room temperature)
[Low Temperature Storage]
-25±2℃ environment for 200 hours.
(The measurement to be done after 2 hours of conditioning at room temperature)
HUMIDITY
+70±2℃ and 95±2%RH environment for 200 hours.
(The measurement to be done after 2 hours of conditioning at room temperature)
TEMPERATURE
CYCLE
5 cycles of temperature change.
+70±2℃ for 1hr, at 20±2℃ for 30 min, at -25±2℃ for 1hr
(The measurement to be done after 2 hours of conditioning at room temperature)
THERMAL
SHOCK
32 cycles of temperature change.
from –40℃ to 85℃ for 1hr Changing time about 5 min
(The measurement to be done after 2 hours of conditioning at room temperature)
HIGH
TEMPERATURE
AND HUMIDITY
+85±2℃ and 85±2%RH environment for 120 hours.
(The measurement to be done after 2 hours of conditioning at room temperature)
ESD
(Electrostatic
Discharge)
VIBRATION
DROP
REFLOW
SENSITIVITY
HBM (Human Body Model) : 2kV Expose 10 Times.
MM (Machine Model) : 0.2kV Expose 10 Times.
CDM (Charged Device Model) : 0.5kV Expose 10 Times.
To be no interference in operation after vibrations.
10㎐ to 55㎐ for 1 minute full amplitude 1.52㎜ , for 2 hours at three axes
To be no interference in operation after dropped to steel floor
12 times from 1.5 meter height in state of packing
3 reflow cycles. Refer to reflow profile from specification item 11.
8 . TEMPERATURE CONDITIONS
8.1 STORAGE TEMPERATURE
: -40℃ ~ +100℃
8.2 OPERATING TEMPERATURE : -40℃ ~ +100℃
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9. MEASUREMENT SYSTEM
10. REFLOW PROFILE (Guaranteed Maximum Reflow Condition)
Parameter
Specification
Parameter
Specification
2.5℃/s
Time above 250℃
℃
Max. 10 s
2-3 minutes
Peak temp. in reflow
255℃(-0/+5℃)
Time above 217℃
℃
Max. 60 s
Temp. gradient in cooling
Max. –5℃/ s
Time above 230℃
℃
Max. 50 s
Average temp. gradient
in preheating
Soak time
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