Engineering Manual
Multicore® LF318 Solder Paste
Introduction
About the electronics group of Henkel
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Henkel is the world’s leading and most progressive provider of qualified, compatible material sets for
semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol®, Loctite®
and Multicore® brands, and its global customer support infrastructure, Henkel delivers world-class materials
products, process expertise and total solutions across the board to preempt industry changes. By partnering
with key industry leaders to pioneer added-value materials and processes, and by prioritizing environmental
responsibility and training, Henkel is formulating the materials to enable tomorrow’s electronic industry.
Slide 2
Across the Board. Around the Globe.
<Prev
Next>
Print
About the electronics group of
Henkel
Product description
Features & benefits
Introduction
Product description
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Henkel’s Multicore LF318 solder paste is a halide-free, no-clean, pin-testable solder paste. It was previously
supplied to selected customers and independent test houses for evaluation purposes as development product XP48.
<Prev
Next>
About the electronics group of
Henkel
Product description
Features & benefits
Slide 3
Across the Board. Around the Globe.
Print
Introduction
Features & benefits
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Product attribute
Process benefit
About the electronics group of
Henkel
Outstanding humidity resistance – exhibits high
coalescence even after 72 hrs @ 27°C/80%RH
Reduces process variation due to environmental factors, a particular advantage in high
temperature/humidity conditions
Product description
Colorless residues
Improves speed and ease of post-reflow inspection
Soft, non-stick pin-testable residues
Improves ease and reliability of in-circuit testing and reduces frequency with which test
probes require cleaning
Fine alloy particle size and optimized paste viscosity
Suitable for fine pitch, high speed printing up to 150 mm/s (6 in./s)
Extended open time & tack-life
Reduces solder paste wastage
Halide-free flux classification: ROL0 to ANSI/J-STD-004
High reliability of finished assembly without cleaning
High tack force
Resists component movement during high speed placement, reducing the need for rework
Long printer abandon times
Reduces solder paste wastage
Excellent solderability
Suitable for use on a wide range of surface finishes including HASL, Ni/Au, immersion
Sn, immersion Ag and OSP Cu
Wide printing and reflow process windows
Accommodates a wide range of printer settings and reflow profiles. Suitable for use in air
and nitrogen
Low voiding
Reduced risk of bridging on small pitch BGAs or CSPs. Reduced risk of decreased joint
reliability and/or outgassing.
Low slump
Reduced bridging
Slide 4
Across the Board. Around the Globe.
Features & benefits
Physical properties
Technical data
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Technical data
Datasheet LF318
Click icon
Slide 5
Across the Board. Around the Globe.
Print
Operating parameters
Printing: Process window
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
LF318 solder paste was subjected to testing in Henkel laboratories to establish the print process window, using
the following equipment:
<Prev
Next>
Printing
Process window
Printer
DEK 260
Squeege
Metal blade, 230 mm (approx. 9"), 60º
Stencil
Laser cut, stainless steel, 125 µm (approx. 0.005") thickness
Boards
Bare copper, no resist
Abandon time
Deposits examined
0.64 mm (approx. 0.025") QFP100 (0.38 mm (approx. 0.015") pads), 0.5 mm (approx. 0.020")
TQFP100 (0.25 mm (approx. 0.010") pads), 0.4 mm (approx. 0.016")
TQFP (0.2 mm (approx. 0.008") pads) and BGA225 (1.27 mm (approx. 0.050") pitch)
Volume consistency
Stereomicroscope (X10-X30)
Reflow
Inspection
Print
Slump testing
Ambient conditions during testing were 24ºC/28%RH.
Process window & thermal
profiles
A solder paste bead of approximately 250 g was placed on the stencil and printed onto the boards at speeds
ranging from 20 to 200 mm/s and squeege pressures ranging from 2–8 kg (approx. 4.4 – 17.6 lbs). Stroke was
set at 230 mm (approx. 9"), separation speed at 10% and the print gap at zero (contact print).
Humidity resistance & solder
balling performance
During printing, paste roll, stencil wipe, aperture release and drop-off were assessed with the naked eye. After
printing, the solder paste deposits were examined using a stereomicroscope to assess the general appearance
and to note the incidence of any defects:
Topography
Ideally the shape and volume of the paste deposit should reflect the stencil aperture geometry
Skipping
Little or no evidence of printed paste on the pad due to non-filling of stencil apertures or nonrelease of paste from apertures
Incomplete or insufficient fill
Poor paste coverage on the pads due to paste not being released from the stencil or not
filling some of the printed area
Spikes
Central area of the printed deposit raised, usually attributable to excessively low print pressure
Dog-ears
Extremities of the paste deposit raised
Slide 6
Across the Board. Around the Globe.
Wetting
Voiding
Tack
Tack performance
Operating parameters
Printing: Process window
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
LF318 Print Process Window
Print speed plotted against squeegee pressure (kg/cm squeegee blade length).
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Test board includes 0.6 mm (approx. 0.025"), 0.5 mm
(approx. 0.020") and 0.4 mm (approx. 0.016") pitch
components.
Slide 7
Across the Board. Around the Globe.
Tack performance
Operating parameters
Printing: Slump testing
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
In-house testing
LF318 solder paste was subjected to slump testing in the Henkel laboratories in accordance with
IPC™-650-2.4.35, using a 0.2 mm (approx. 0.008") thick stencil, IPC slump pattern A-21. Results are below.
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Slide 8
Across the Board. Around the Globe.
Operating parameters
Printing: Slump testing
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Details IPC ANSI/J-STD-005 Slump Test
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
1 min 150ºC
15 min 150ºC
Slide 9
Across the Board. Around the Globe.
15 min RT
Operating parameters
Printing: Slump testing
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Printing
Details JIS-Z-3284 Slump Test
Summary of slump data
Process window
96SCLF318AGS88.5V
Batch No. CP4I0623
Room Temperature, 60 minutes
150°C for 1 minute
3.0 x 1.5 mm apertures
0.2 mm
0.3 mm
3.0 x 0.7 mm apertures
0.2 mm
0.2 mm
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
1 min 150ºC
15 min 150ºC
Slide 10
Across the Board. Around the Globe.
15 min RT
Operating parameters
Printing: Abandon time
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Response to 1 hour Pause/Procedure
<Prev
Next>
Print
Printing
Process window
4 knead prints
5 prints
5 prints
1 print
Volume
Measurement
Slump testing
Abandon time
Understencil
clean
Understencil
clean
1 hour
abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Slide 11
Across the Board. Around the Globe.
Operating parameters
Printing: Abandon time
Introduction
Physical Properties
Operating Parameters
Abandon time/Results
AGS: 20-45 µm powder
ADP: 15-38 µm powder
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Slide 12
Across the Board. Around the Globe.
Operating parameters
Printing: Volume consistency
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Equipment used:
DEK Infinity
Cyberoptics SE300; deposits examined 0.4 mm QFP, 0.4 mm & 0.5 mm CSP
Solder paste: 96SCLF318AGS88.5V, batch no. CP5A008
Settings: 50 mm/s, 6 kg, 250 mm/60° squeegee, 100 mm thick stencil
Printing
Deposits examined:
Abandon time
Aperture
Shape
Dimensions
No. of deposits examined per board
0.4 mm CSP
Round
Ø245 µm
964
0.5 mm CSP
Square
270 µm x 270 µm
337
0.4 mm QFP
Rectangular
830 µm x 220 µm
97
Print
Process window
Slump testing
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Procedure
4 knead prints
5 prints
5 prints
Volume
Measurement
Voiding
Tack
Understencil
clean
Understencil
clean
Slide 13
Across the Board. Around the Globe.
Tack performance
Operating parameters
Printing: Volume consistency
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Slide 14
Across the Board. Around the Globe.
Operating parameters
Reflow: Process window & thermal profiles
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
LF318 solder paste was subjected to testing in Henkel laboratories to establish the reflow process window,
using the following equipment and settings:
Printer
DEK 260
Print settings
Print speed 75 mm/s (approx. 2"/s); pressure 8 kg (approx. 17.5 lbs)
Stencil
Stainless steel laser-cut stencil, 125 µm (approx. 0.005") thickness
Boards
Bare copper, no resist
Reflow oven
Seho FDS6440
PCB areas examined
0.6 mm (approx. 0.025") QFP pads, 0.4 mm (approx. 0.016") TQFP pads,
0.3 mm (approx. 0.012") TQFP pads and 0.2 mm (approx. 0.008") BGA225 pads
Inspection
Stereomicroscope (X10-X30)
Boards were printed and reflowed at varying times to peak process temperature, from 2–12 minutes. Both
linear and soak-type reflow profiles were used, and the reflowed boards examined using a stereomicroscope.
Reflow quality was assessed according to the appearance of the solder fillet and post-reflow residue, paying
particular attention to coalescence during reflow, solder surface appearance, solder balling, residue surface
quality and residue color.
<Prev
Next>
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Slide 15
Across the Board. Around the Globe.
Print
Operating parameters
Reflow: Process window & thermal profiles
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Linear Reflow Profile
The convection oven’s zone settings were maintained at the settings shown below; the peak
temperature & time to peak temperature were adjusted by varying the belt speed from 30 cm/min
(12”/min) to 130 cm/min (51”/min).
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Range of acceptable reflow conditions:
T>217°C: 11.5 – 171 s
Peak temperature: 223 – 266°C
Belt speed: 30 – 120 cm/min
(These should not be taken as guidelines for profiling – they merely indicate that LF318 has a large process window when assessed under
laboratory conditions.)
Slide 16
Across the Board. Around the Globe.
Operating parameters
Reflow: Process window & thermal profiles
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Soak Reflow Profile
The convection oven’s zone settings were maintained at the settings shown below; the peak temperature & time
to peak temperature were adjusted by varying the belt speed from 30 cm/min (12”/min) to 130 cm/min (51”/min).
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Range of acceptable reflow conditions:
T>217°C: 11.5 – 171 s
Peak temperature: 223 – 266°C
Belt speed: 30 – 120 cm/min
(These should not be taken as guidelines for profiling – they merely indicate that LF318 has a large process window when assessed under
laboratory conditions.)
Slide 17
Across the Board. Around the Globe.
Tack performance
Operating parameters
Reflow: Humidity resistance & solder balling performance
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
LF318 was tested to establish humidity resistance and solder balling performance. After printing, coupons were
stored in a temperature/humidity controlled chamber. After the appropriate storage period they were removed from
the chamber and reflowed, in air, using a convection reflow oven. Profile peak temperature was 242°C, time to
peak 5 min 15 s, time above liquidus (217°C) was 80 s.
<Prev
Next>
Print
Printing
Process window
Slump testing
LF318: Humidity resistance
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Initial
Reflow after 4 hrs, 27°C/80%RH
Wetting
Voiding
Tack
Tack performance
Reflow after 24 hrs, 27°C/80%RH
Reflow after 72 hrs, 27°C/80%RH
Note: J-STD condition 25ºC, 50%RH initial and after 4 h
Slide 18
Across the Board. Around the Globe.
Operating parameters
Reflow: Wetting
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Wetting behaviour of LF318 according to J-STD-005.
<Prev
Next>
Print
Printing
This test is carried out to determine the ability of a solder paste to wet an oxidised copper surface & to
qualitatively examine the amount of solder spatter of the paste during reflow.
LF318 was printed onto 4 copper test pieces (each 76x25x0.8 mm) using a 0.2 mm thick stencil with round
apertures 6.5mm in diameter. Two test pieces were reflowed immediately after printing on a solder bath at
242°C. The reflowed solder was then examined at 10X magnification to establish if the copper was uniformly
wetted with no evidence of non-wetting, de-wetting or spatter around the deposit.The test was repeated on the
remaining test coupons after 4 hours exposure to 25°C/50%RH. LF318 passes this test.
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Reflowed within 15 minutes of printing
Reflowed after 4 hours exposure to
25ºC/50%RH
Slide 19
Across the Board. Around the Globe.
Tack
Tack performance
Operating parameters
Reflow: Wetting
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
SOT23 Pads:
Offset print
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Bare Copper
After print
Immersion Tin
After print
Immersion Silver
After print
Gold over nickel
After print
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Voiding
Tack
Tack performance
Bare Copper
After reflow
Immersion Tin
After reflow
Immersion Silver
After reflow
Slide 20
Across the Board. Around the Globe.
Gold over nickel
After reflow
Operating parameters
Reflow: Voiding
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Void % area = 0.49% over
132 balls
Void % area in balls
containing voids = 3.38%
Total of 16 Voids
1 Void > 10% ball area
2 Voids 10% - 5%
13 Voids < 5%
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Linear Profile (Worst case scenario)
Device: TBGA132 SnPb balls
PCB: Cu pads @ 0.5 mm pitch
Stencil thickness = 120 µm
Wetting
Voiding
Tack
Tack performance
Slide 21
Across the Board. Around the Globe.
Operating parameters
Tack perfomance
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Tack testing according to J-STD-005
Contact Details
<Prev
Next>
Print
Printing
Process window
Slump testing
Abandon time
Volume consistency
Reflow
Process window & thermal
profiles
Humidity resistance & solder
balling performance
Wetting
Tack testing should be continued until tack reaches 80% of the initial tack force is reached.
However, as can be seen, even after 72 hours LF318 tack remained high. Testing was not
continued after this time.
Voiding
Tack
Tack performance
Slide 22
Across the Board. Around the Globe.
Test data
Pin testability assessment
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Pin testability in Air/N2
Pin test done on copper laminate; electrical continuity during testing monitored using an electronic counter
Boards were reflowed using profile below, 3 in air & 3 in N2 environment
Test done using 4-pin crown point probe (Croda PA4QPS-040)
840 test points per PCB
<Prev
Next>
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Slide 23
Across the Board. Around the Globe.
Print
Test data
Pin testability assessment
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Pin testability assessment
Pin-testability:
Air reflow
Board No.
(Reflowed in air)
% contacts using crown probe on 840 test pads
Result
1
100%
Pass
2
100%
Pass
3
100%
Pass
Probe appearance after 840 hits
Slide 24
Across the Board. Around the Globe.
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Test data
Pin testability assessment
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Print
Pin testability assessment
Pin-testability:
N2 reflow
Board No.
(Reflowed in N2)
% contacts using crown probe on 840 test pads
Result
1
100%
Pass
2
100%
Pass
3
100%
Pass
Probe appearance after 840 hits; one
reflow cycle
Slide 25
Across the Board. Around the Globe.
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Test data
Pin testability assessment
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
Pin testability after multiple reflow cycles
Some copper laminate test boards with 840 pads made with 96SCLF318AGS88.5V were reflowed in air a
number of times to simulated double-sided boards with selective soldering. The profile used can be seen below.
Pin testability was then assessed after reflow using a 4-pin crown point probe (Croda PA4QPS-040);
electrical continuity during testing was monitored using an electronic counter
<Prev
Next>
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Slide 26
Across the Board. Around the Globe.
Print
Test data
Pin testability assessment
Introduction
Physical Properties
Operating Parameters
Pin-testability: Air reflow
3 test boards per condition
Probe appearance after 840 hits; two reflow cycles
Test Data
Troubleshooting
Contact Details
Pin-testability: Air reflow
3 test boards per condition
Probe appearance after 840 hits; three reflow cycles
Reflowed
twice
% contacts using crown
probe on 840 test pads
Result
Reflowed
three times
% contacts using crown
probe on 840 test pads
Result
1
100%
Pass
1
100%
Pass
2
100%
Pass
2
100%
Pass
3
100%
Pass
3
100%
Pass
Probe appearance after 840 hits
Slide 27
Across the Board. Around the Globe.
Probe appearance after 840 hits
<Prev
Next>
Print
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Test data
J-STD-004 Reliability test results
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
J-STD004: copper mirror
IPC-TM-650, 2.3.32
Flux induced corrosion (copper mirror)
No breakthrough of copper = flux classification ‘L’
Contact Details
<Prev
Next>
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
LF318 Copper Mirror- no breakthrough
Print
Control Copper Mirror – no breakthrough
Slide 28
Across the Board. Around the Globe.
Test data
J-STD-004
Introduction
Physical Properties
Operating Parameters
J-STD004: halide test
IPC-TM-650, 2.3.33
Silver chromate paper method
No discoloration of silver chromate paper = flux activity ‘0’
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
LF318
Control
Slide 29
Across the Board. Around the Globe.
Print
Test data
J-STD-004
Introduction
Physical Properties
Operating Parameters
Test Data
J-STD004: flouride test
IPC-TM-650, 2.3.35.1
No change in colour from purple to yellow confirms absence of flourides
Flux activity type ‘0’
Troubleshooting
Contact Details
<Prev
Next>
Pin testability assessment
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
Zirconium-alazarin purple lake
With LF318 added
Slide 30
Across the Board. Around the Globe.
Print
Test data
J-STD-004
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
J-STD004: chlorides & bromides
IPC-TM-650, 2.3.35
Chloride & bromide concentrations
Halide content <0.005%
Next>
Print
Pin testability assessment
J-STD-004 reliability test
results
J-STD004: flux solids
IPC-TM-650, 2.3.34
Flux solids (non-volatile content) determination
Approximately 2 g of flux medium was accurately weighed into a clean metal dish which was then placed
into an air circulating oven at 145°C for 2 hours. The dish was allowed to cool and re-weighed. The solids
content was calculated using the following equation:
Solids content = (final mass of flux medium/initial mass of flux medium) x 100%
Solids content was found to be 69%
J-STD004: flux corrosion
IPC-TM-650, 2.6.15
No evidence of corrosion = type ‘L’ flux classification
Test done in duplicate: 240 hrs (10 days) humid storage at 40°C/93±2%RH – no evidence of corrosion products
LF318 – coupon 1
<Prev
LF318 – coupon 2
Slide 31
Across the Board. Around the Globe.
JIS standards testing
GR-CORE-78
Test data
J-STD-004
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
J-STD004: SIR
IPC-TM-650, 2.6.3.3
Moisture & surface insulation resistance
Passmark: 1 x 108 Ω
<Prev
Next>
Print
Pin testability assessment
J-STD-004 reliability test
results
24 hrs at 85°C, 85%RH, 50V bias. 96 hrs at 85°C, 85%RH, 50V bias. 168 hrs at 85°C, 85%RH,
50V bias.
Control (Ω)
5.89 x 109
3.60 x 109
2.85 x 109
96SCLF318AGS88.5V (Ω)
3.13 x 109
1.03 x 109
1.06 x 109
Passmark (Ω)
1.00 x 108
1.00 x 108
1.00 x 108
Slide 32
Across the Board. Around the Globe.
JIS standards testing
GR-CORE-78
Test data
JIS standards testing
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
JIS-Z-3284: SIR
<Prev
Next>
Print
Pin testability assessment
Pass: 1 x 108 Ω
85°C, 85%RH
Initial
24 hours
96 hours
168 hours
LF318 (Ω)
7.44 x 1011
1.73 x 109
1.75 x 109
1.96 x 109
Unfluxed control (Ω)
8.94 x 1011
1.51 x 109
1.26 x 109
1.27 x 109
J-STD-004 reliability test
results
JIS standards testing
GR-CORE-78
JIS-Z-3284: electromigration
85°C/85%RH, 50V bias, 1000 hours duration
No dendrites observed
Slide 33
Across the Board. Around the Globe.
Test data
GR-CORE-78
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
GR-CORE-78: SIR
Contact Details
<Prev
Next>
Print
Pin testability assessment
35°C/85%RH, 50V bias
24 hours
96 hours
LF318 (Ω)
1.489 x 1011
1.84 x 1011
J-STD-004 reliability test
results
Controls (Ω)
1.804 x 1011
1.47 x 1011
JIS standards testing
GR-CORE-78
Slide 34
Across the Board. Around the Globe.
Test data
GR-CORE-78
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
GR-CORE-78: electromigration
Contact Details
<Prev
Next>
Print
Pin testability assessment
65°C/85%RH, 10V bias
96 hours
500 hours
Dendrites
LF318 (Ω)
3.73 x 1010
3.47 x 1010
None
J-STD-004 reliability test
results
Controls (Ω)
2.59 x 1010
5.24 x 1010
None
JIS standards testing
GR-CORE-78
Slide 35
Across the Board. Around the Globe.
Troubleshooting
Printing
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
For the purposes of this solder paste printing troubleshooting guide, it is assumed that the correct thickness of stencil
is used and that gasketing, stencil cleaning, component solderability, board support and handling are satisfactory.
<Prev
Next>
Printing
Reflow
Paste bleeds under stencil, leading
to bridging
Paste skips – solder paste does not
release completely from stencil
Paste deposits are irregular
Unsatisfactory aperture filling
Paste deposit excessive, leading to
bridging
Print pressure
Separation speed
Separation speed; increase print
speed to lower viscosity
Squeegee speed and pressure
settings
Squeegee pressure may need to
be increased; separation speed
Poor print definition leads to
‘dog-ears’
Paste scooping
Overprinting – paste deposit
exceeds pad area
Paste bridges or smears; poor
edge definition
Print is misaligned
Separation speed; increase
print speed
Reduce squeegee pressure
Reduce print pressure or adjust
print speed
Reduce print pressure
Stencil registration/printer
alignment
Description
Slide 36
Across the Board. Around the Globe.
Check/adjust
Print
Troubleshooting
Reflow
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
For the purposes of this solder paste reflow troubleshooting guide, it is assumed that component and board
storage and handling are satisfactory and that the reflow profile is suited to the specification limits of the
components and substrate.
Solder joint cracks during cooling
Tombstoning/Manhattan
effect/drawbridging
Reflow incomplete
Cooling rate
Adjust preheat to balance temperature
at both component terminations
Reflow profile: balance time
Above liquidus with excessive
heat causing flux exhaustion
Reflow profile – may need to
reduce preheat
Poor solderability
Description
Mid-chip beading
Paste bridging
Uncoalesced solder
Check paste life and stencil
geometry alignment, gasketting
and cleanliness
Check the under stencil
cleanliness, print preassure,
gasketting & the board
Check reflow profile to ensure
sufficient time above reflow is
provided for
Slide 37
Across the Board. Around the Globe.
Check/adjust
<Prev
Next>
Printing
Reflow
Print
Contact details
Introduction
Physical Properties
Operating Parameters
Test Data
Troubleshooting
Contact Details
<Prev
Next>
Contact
Henkel Americas
Henkel Europe
Henkel Asia
15350 Barranca Parkway,
Irvine, CA 92618
USA
Tel: +1 949 7839 2500
electronics@us.henkel.com
Technologies House,
Wood Lane End
Hemel Hempstead
Hertfordshire, HP2 4RQ
UK
Tel: +44 1442 278000
No. 90 Zhujiang Road
Yantai Development Zone
Shandong
China 264006
Tel: +86 535 6399820
electronics.henkel.com
Slide 38
Across the Board. Around the Globe.
Print
Technical Data Sheet
LF318 Solder Paste
July 2005
PIN-TESTABLE LEAD-FREE SOLDER PASTE
PRODUCT DESCRIPTION
Multicore™ LF318 solder paste is a halide-free, no clean, pin
testable Pb-free solder paste, which has excellent humidity
resistance and a broad process window, both for reflow and
printing. LF318 solder paste offers a high tack force to resist
component movement during high speed placement, long
printer abandon times and excellent solderability over a wide
range of reflow profiles in air and nitrogen and across a wide
range of surface finishes including Ni/Au, Immersion Sn,
Immersion Ag and OSP Copper.
FEATURES AND BENEFITS
• Outstanding humidity resistance – gives excellent
coalescence even after 72 hours exposure to 27ºC/80%
RH, thus reducing process variation due to environmental
factors
• Colourless residues for easy post-reflow inspection
• Soft non-stick pin testable residues allow easy in-circuit
testing
• Suitable for fine pitch, high speed printing up to 150mm/s
(6”/s)
• Extended open time & tack-life leading to low wastage.
• Halide free flux classification: ROL0 to ANSI/J-STD-004
TYPICAL PROPERTIES
Based upon type 3 powder; other sizes also available
DIRECTIONS FOR USE
Printing: Multicore LF318 solder paste is available for stencil
printing down to 0.4mm (0.016”) pitch devices, with type 3
(AGS) powder. Printing at speeds between 25mm/s (1.0”/s) &
150mm/s (6”/s) can be achieved using laser cut, electropolished, or electroformed stencils and metal squeegees
(preferably 600).
Acceptable first prints have been achieved at 0.4mm (0.016”)
pitch after printer down times of 4 hours without requiring a
knead cycle.
Reflow:
Any of the available methods of heating to cause reflow may
be used including IR, convection, hot belt, vapour phase and
laser soldering. LF318 is not particularly sensitive to reflow
profile type. There is no single reflow profile which is suitable
for all processes & applications, but the following graph
shows example profiles that have given good results in
practice.
LF318
96SC, 97SC
20-45
Example Reflow Profiles
AGS
88.5
IPC A21 Pattern
0.06
0.33
0.25
0.41
300
Temperature °C
Properties
Alloys
Powder Particle Size, µm
Multicore Powder Size
Coding
Metal Loading (%
weight)
Slump, J-STD-005, mm(4)
RT (15 minutes)
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
150oC (15 minutes)
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
Solder powder: Careful control of the atomisation process for
production of solder powders for LF318 solder pastes ensures
that the solder powder is produced to a quality level that
exceeds IPC/J-STD006 & EN29453 requirements for
sphericity, size distribution, impurities and oxide levels.
Minimum order requirements may apply to certain alloys and
powder particle sizes. For availability with other alloys and
powder sizes, contact your local technical service helpdesk.
250
200
150
100
50
0
0
2
4
6
Time Minutes
Viscosity measured at
25°C (Typical)
Brookfield, cP(1)
Malcom 10rpm, P(2)
Thixotropic Index (Ti)(3)
Tack(5)
Initial tack force, gmm-2
Useful open time, hours
(1)
765,000
1961
0.54
2.0
>24
Measured at 25°C, TF spindle at 5rpm after 2 minutes
Measured at 25°C, and a shear rate of 6s-1
TI = log (viscosity at 1.8s-1/Viscosity at18s-1)
(4)
Slump data are expressed as the minimum spacing between pads of the size
shown that does not allow bridging
(5)
Tack data are derived from comparative laboratory tests and do not necessarily
relate directly to a particular user’s conditions
(2)
(3)
Cleaning: Multicore LF318 solder pastes are no-clean & are
designed to be left on the PCB in many applications since they
do not pose a hazard to long term reliability. However, should
there be a specific requirement for residue removal, this may
be achieved using conventional cleaning processes based on
solvents such as Multicore MCF800, or suitable saponifying
agents. For stencil cleaning and cleaning board misprints,
Multicore SC-01 Solvent Cleaner is recommended.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.
NEXT
LF318, July 2005
RELIABILITY PROPERTIES
Solder paste medium: Multicore LF318 medium contains a
stable resin system and slow evaporating solvents with
minimal odour. The formulation meets the requirements of
the Telcordia (formerly known as Bellcore) GR-78-CORE and
ANSI/J-STD-004 for a type ROL0 classification.
Test
Copper Plate Corrosion
Copper Mirror Corrosion
Chlorides & Bromides
Surface Insulation
Resistance
(without cleaning)
Flux Activity Classification
(without cleaning)
Specification
ANSI/J-STD-004
ANSI/J-STD-004
ANSI/J-STD-004
ANSI / J-STD-004
Telcordia GR-78-Core
JIS-Z-3284
ANSI/J-STD-004
Results
Pass
Pass
Pass
Pass
Pass
Pass
ROL0
PACKAGING
Containers: Multicore LF318 solder paste is supplied in:
•
•
500g plastic jars with an air seal insert.
1kg, 600g or 500g Semco cartridges
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
Note
The data contained herein are furnished for information only and are believed
to be reliable. We cannot assume responsibility for the results obtained by
others over whose methods we have no control. It is the user's responsibility
to determine suitability for the user's purpose of any production methods
mentioned herein and to adopt such precautions as may be advisable for the
protection of property and of persons against any hazards that may be
involved in the handling and use thereof. In light of the foregoing, Henkel
Corporation specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a particular
purpose, arising from sale or use of Henkel Corporation’s products.
Henkel Corporation specifically disclaims any liability for consequential
or incidental damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be interpreted as
representation that they are free from domination of patents owned by others
or as a license under any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each prospective user test his
proposed application before repetitive use, using this data as a guide. This
product may be covered by one or more United States or foreign patents or
patent applications.
Other packaging types may be available on request; please
contact your local technical service helpdesk for assistance.
Storage:
It is recommended to store LF318 at 0-10°C (NB cartridges
should be stored tip down to prevent the formation of air
pockets). The paste should be removed from cold storage a
minimum of 8 hours prior to use. Do not use forced heating
methods to bring solder paste up to temperature. Multicore
LF318 solder paste has been formulated to minimize flux
separation on storage but should this occur, gentle stirring for
15 seconds will return the product to its correct rheological
performance.
To prevent contamination of unused product, do not return any
material to its original container. For further specific shelf life
information, contact your local Technical Service Centre.
Shelf Life:
Provided Multicore LF318 solder pastes are stored tightly
sealed in the original container at 0-10°C, a minimum shelf
life of 6 months can be expected.
Air shipment is
recommended to minimize the time that containers are
exposed to higher temperatures.
DATA RANGES
The data contained herein may be reported as a typical value
and/or range. Values are based on actual test data and are
verified on a periodic basis.
Americas
Henkel Corporation
15350 Barranca Parkway
Irvine, CA 92618 U.S.A.
949.789.2500
Europe
Henkel Loctite Adhesives Ltd
Technologies House, Wood Lane End
Hemel Hempstead
Hertfordshire HP2 4RQ, United Kingdom
+44 (0) 1442 278 000
Asia
Henkel Loctite (China) Co. Ltd
No. 90 Zhujiang Road
Yantai Development Zone
Shandong, China 264006
+86 535 6399820
All trademarks, except where noted are the property of Henkel Corp.
BACK