MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G−01
ISSUE F
1
SCALE 2:1
D
ÇÇÇ
ÇÇÇ
ÇÇÇ
PIN 1
LOCATION
2X
A
B
L
DETAIL A
E
ÉÉ
ÉÉ
TOP VIEW
(A3)
DETAIL B
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
0.10 C
L
L1
0.10 C
2X
DATE 22 JUN 2011
A1
DETAIL B
A
0.05 C
ÉÉ
ÉÉ
ÇÇ
A3
MOLD CMPD
ALTERNATE
CONSTRUCTIONS
NOTE 4
A1
SIDE VIEW
C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
XXXXX
XXXXX
ALYWG
G
0.10 C A B
16X
L
DETAIL A
D2
8
4
16X
9
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
E2
K
1
16
e
e/2
BOTTOM VIEW
16X
MILLIMETERS
MIN
NOM MAX
0.80
0.90
1.00
0.00
0.03
0.05
0.20 REF
0.18
0.24
0.30
3.00 BSC
1.65
1.75
1.85
3.00 BSC
1.65
1.75
1.85
0.50 BSC
0.18 TYP
0.30
0.40
0.50
0.00
0.08
0.15
b
0.10 C A B
0.05 C
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”,
may or may not be present.
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
16X
0.58
PACKAGE
OUTLINE
1
2X
2X
1.84 3.30
16X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON04795D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
1
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN16, 3X3 MM, 0.5 PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON04795D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION, REQUESTER UNKNOWN.
08 MAY 2001
A
CORRECTED MARKING DIAGRAM, REQ. BY M. WORKMAN.
25 JUN 2003
B
UPDATED TO ASME FORMAT. REQ. BY P. CELAYA.
23 MAR 2004
C
CHANGED DIMENSION K TO 0.18 TYP. REQ. BY P. CELAYA.
02 MAR 2006
D
ADDED TERMINAL OPTIONS DETAILS A AND B. REQ. BY A. CARMONA.
25 JUN 2008
E
ADDED SOLDER FOOTPRINT. UPDATED PACKAGE TOLERANCES PER JEDEC.
UPDATED MARKING DIAGRAM. REQ. BY J. LIU.
23 MAR 2010
F
ADDED NOMINAL VALUES TO DIMENSION TABLE. REQ. BY P. SHOCKMAN.
22 JUN 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 01F
Case Outline Number:
485G