Applications
• Receiver protection
Features
• High power, midrange and clean-up
designs
• Low insertion loss
(0.1 dB at 10 GHz)
• Power handling to
70 dBm
• Tight control of
basewidth
Limiter Diodes
Skyworks’ broad product portfolio includes limiter diodes as packaged and bondable
silicon chips, in addition to ceramic hermetic packaged and plastic surface mount
packaged devices for receiver protection applications.
Skyworks series of silicon limiter diode chips provides passive receiver protection
over a wide range of frequencies from 100 MHz to beyond 30 GHz. These devices utilize
Skyworks well established silicon technology for high resistivity and tightly controlled
thin basewidth PIN limiter diodes. Limiter circuits employing these devices perform with
strong limiting action and low loss. The CLA series consists of nine individual chip designs
of different intrinsic region basewidths and capacitances designed to accommodate
multistage limiter applications. The mesa constructed, thin basewidth, low capacitance
CLA4601, CLA4602, CLA4604 and CLA4605 and SMP1330 are designed for low-level
and cleanup applications. The CLA4603, and CLA4606 through CLA4609 are planar
designs designed for mid-range and high-power applications.
Receiver
Receiver Protector
Limiter
Downconverter
Mixer
Low Noise
AAmplifier
lifi
High Power
Amplifier
Transmitter
Simplified Radar Transceiver with a Receiver Protector Limiter
Skyworks Green™ products are compliant to all applicable materials legislation
and are halogen-free. For additional information, refer to Skyworks Definition of
Green™, document number SQ04-0074.
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Limiter Output
30
DC
Block
Input
Output Power (dBm)
DC
Block
Output
RF
Choke
Limiter
PIN
Pin-IL
Limiting
Operation
Low Insertion
Loss Operation
20
1 dB
10
0
Threshold Level
-10
-10
0
10
20
30
Input Power (dBm)
Output Power vs. Input Power for a Single-Stage Limiter
A Single-Stage Limiter
The PIN limiter diode can be described as an incidentpower-controlled, variable resistor. In the case when no
large input signal is present, the impedance of the limiter
diode is at its maximum, thereby producing minimum
insertion loss, typically less than 0.5 dB. The presence of a
large input signal temporarily forces the impedance of the
diode to a much lower value, producing an impedance
mismatch which reflects the majority of the input signal
power back towards its source.
Electrical Specifications at 25 °C
Thermal Impedance (q)
Top Contact
Diam.
(mils/mm)
Typ.
Part Number
Breakdown
Voltage (V)
Min. – Max.
I Region
(µm) Nominal
CJ @ 0 V
(pF) Typ.
CJ @ 6 V
(pF) Max.
RS @ 10 mA
(Ω) Max.
TL @ 10 mA
(ns) Typ.
Average
(°C/W) Max.
1 µs Pulse
(°C/W) Typ.
CLA4601 Series
15–30
1.0
0.12
0.10
2.5
5
120
15
1.2/0.03
CLA4602 Series
15–30
1.0
0.20
0.15
2.0
5
80
10
1.5/0.038
SMP1330 Series
20–50
1.5
0.20
–
1.5
4
110
25
N/A
CLA4603 Series
20–45
1.5
0.20
0.15
2.0
5
100
10
1.5/0.038
CLA4604 Series
30–60
2.0
0.12
0.10
2.5
7
100
10
1.5/0.038
CLA4605 Series
30–60
2.0
0.20
0.15
2.0
7
70
7
2.5/0.064
CLA4606 Series
45–75
2.5
0.20
0.15
2.0
10
80
7
2.5/0.064
CLA4607 Series
120–180
7.0
0.20
0.15 @ 50 V
2.0
50
40
1.2
3/0.076
CLA4608 Series
120–180
7.0
0.80
0.5 @ 50 V
1.2
100
15
0.3
5/0.127
CLA4609 Series
>250
28
0.26
0.14
1.5
1175
15
0.3
6.5/0.165
Capacitance, CJ, specified at 1 MHz.
Resistance, RS, measured at 500 MHz.
CW thermal resistance for infinite heat sink.
Pulse thermal resistance for single 1 µs pulse.
Typical Performance at 25 °C
Part Number
Insertion Loss @
-10 dBm (dB)
Input Power for 1 dB
Loss (dBm)
Maximum Pulsed
Input Power (dBm)
Output at Max. Pulsed Maximum CW Input
Input (dBm)
Power (W)
CLA4601 Series
0.10
7
47
21
2
Recovery Time
(ns)
5
CLA4602 Series
0.10
7
50
24
3
5
SMP1330 Series
0.15
11
50
30
1
30
CLA4603 Series
0.10
10
50
22
2
10
CLA4604 Series
0.10
12
47
24
3
10
CLA4605 Series
0.10
12
50
27
4
10
CLA4606 Series
0.10
15
53
27
3
20
CLA4607 Series
0.10
20
60
39
6
50
CLA4608 Series
0.20
20
66
44
15
100
CLA4609 Series
0.30
38
70
50
20
1000
Insertion loss for CLA4601 through CLA4607 at 10 GHz; insertion loss for CLA4608 at 5 GHz.
Limiter power results at 1 GHz for shunt connected, single limiter diode and DC return in
50 Ω line.
Maximum pulsed power for 1 µs pulse and 0.1% duty factor with chip at 25 °C heat sink.
Derate linearly to 0 W at 175 °C.
Maximum CW input power at 25 °C heat sink. Derate linearly to 0 W at 175 °C.
Recovery time to insertion loss from limiting state.
How to Select Limiter Diode Packages
Ceramic-Metal Packages
Skyworks limiter diodes are available in several types of
packages and as unpackaged dice. In most cases the
requirements of the end application will determine the
optimal physical diode configuration.
Ceramic-metal packages offer several advantages
over plastic packages: their parasitic inductances and
capacitances are generally lower, sometimes by as much
as 75%, than that of the plastic SMT packages described
above. Their thermal resistances are also generally much
lower than that of the large majority of plastic SMT
packages. Most ceramic packages used for limiter diodes
are capable of being hermetically sealed, thereby offering
maximum protection to the die against environmental
contaminants such as sodium (Na), water vapor, etc.
Plastic Surface Mount Technology Packages
Plastic surface mount technology (SMT) packages are
inexpensive and are compatible with modern pick-andplace assembly techniques, so they are optimal choices
for high-volume, low-cost final product assemblies.
While careful attention has been paid to minimizing
package parasitic reactances they are always present
in such diode configurations. These parasitics, package
capacitance and package inductance, inherently reduce
the bandwidth over which a diode may be used and can
affect insertion loss and isolation. Plastic SMT packages
also add thermal resistance to that of the die, thereby
reducing the amount of power a diode can dissipate
without exceeding its maximum rated operating junction
temperature.
Ceramic-metal packages have two disadvantages
compared to plastic SMT packages: they are typically
more costly, and, they generally are not compatible with
automated surface mount assembly.
(Packageless) Dice
Diode dice, sometimes known as chips, eliminate
the parasitic reactances and thermal resistance of
the package. This configuration produces the widest
bandwidth of operation as well as maximal power
dissipation capabilities.
Of course, the end user of unpackaged diode dice
must be capable of handling these tiny devices as well
as performing die attach and wire bonding assembly
techniques. The assemblies which contain dice must be
protected from mechanical damage, especially to the
fragile bond wires.
Outline Drawings
149-815
150 Series
Anode
Metallized
Gold Dot
Schematic
0.010 (0.251 mm) Min.
0.014 (0.356 mm) Max. Sq.
Anode
Top Contact, Gold
0.002 (0.050 mm)
Dia. Min.
0.014 ± 0.001
(0.325 ± 0.025 mm)
150-801:
0.002 (0.051 mm) Min.
150-806:
0.0011 (0.028 mm) Min.
0.014 ± 0.001
(0.325 ± 0.025 mm)
0.004 (0.010 mm)
0.006 (0.015 mm) Nom.
0.004 (0.127 mm) Min.
0.006 (0.152 mm) Max.
Silicon
Cathode Metallized Back
Contact: Gold
Metallized Back
Contact, Gold
-210 Hermetic Pill
Schematic
-203 Hermetic Pill
Schematic
N-Type
0.064 (1.63 mm)
0.060 (1.52 mm)
2 PLCS
0.050 (1.27 mm)
0.040 (1.02 mm)
0.055 (1.40 mm)
0.051 (1.30 mm)
Dia.
0.124 (3.15 mm)
0.119 (3.02 mm) Dia.
0.025 (0.63 mm)
Max.
0.225 (5.72 mm)
0.205 (5.20 mm)
0.097 (2.46 mm)
0.83 (2.11 mm)
247-001
0.083 (2.20 mm)
0.077 (1.95 mm)
0.064 (1.63 mm)
0.060 (1.52 mm)
023-000
-240 Hermetic Stripline
-219 Hermetic Pill
Schematic
1
Schematic
0.075 (1.91 mm)
0.065 (1.65 mm)
Sq.
2
-011 (240)
50°
45°
0.175 (4.44 mm)
0.125 (3.18 mm)
2 Plcs.
0.045 (1.14 mm)
0.030 (0.76 mm)
0.020 (0.51 mm) Typ.
0.098 (2.49 mm)
0.092 (2.34 mm)
Cover Dia.
Colored Dot
Denotes Cathode
0.104 (2.64 mm)
0.092 (2.34 mm)
Sq.
0.022 (0.56 mm)
0.018 (0.46 mm)
2 Plcs.
0.010 (0.24 mm)
Ref.
0.048 ± 0.005
0.012 (0.30 mm)
Typ.
0.033 (0.84 mm)
Min.
0.005 (1.27 mm)
0.003 (0.76 mm)
0.042 (1.06 mm)
0.028 (0.71 mm)
325-011
404-801
Outline Drawings (Continued)
-085LF, -086LF
SOT-23 (-005LF) Plastic
0.5 ± 0.15
2 ± 0.2
Exposed Pad
0.030 (0.8 mm)
3 Plcs.
Detail B
2 ± 0.2
1.7 ± 0.15
3
0.035
(0.9 mm)
3 PLCS.
1
2
Orientation
Indicator
0.90 ± 0.1
Top View
Side View
3
1
Detail B
0.104
(2.64 mm)
0.083
(2.10 mm)
0.055 (1.40 mm)
1
0.047 (1.19 mm)
0.024 (0.61 mm)
0.018 (0.45 mm)
0.080 (2.03 mm)
0.070 (1.78 mm)
2
S1632
All dimensions in millimeters
0.027 (0.69 mm) Ref.
-040LF
0.004 (0.10 mm)
0.0005 (0.01 mm)
0.040
(1.02 mm)
0.037
(0.94 mm)
0.045
(1.14 mm)
0.035
(0.89 mm)
Application Notes
0.650
For additional information, please refer to the
following Application Notes.
1.000
0.325
0.600
2X 0.50 ± 0.05
2X 0.25 ± 0.05
0.018 (0.45 mm)
0.015 (0.38 mm)
3
0.037
(0.95 mm)
0.075
(1.9 mm)
0.007
(0.18 mm)
0.003
(0.08 mm)
2
0.27 ± 0.15
0.120 (3.05 mm)
0.110 (2.79 mm)
Footprint
Bottom View
0.4 ± 0.1
0.070
(1.8 mm)
All dimensions in millimeters
Green Initiative™
Cathode
Indicator
PIN Diode Basics
Top View
PIN Limiter Diodes in Receiver Protectors
Cathode
Terminal
Side View
0.05/0.00
0.46 +0.04/–0.06
Bottom View
Diode Chips, Beam-Lead Diodes, Capacitors:
Bonding Methods and Packaging
S1892
Through our Green Initiative,™ we are committed to manufacturing products that comply with global
government directives and industry requirements.
Skyworks is continuously innovating RF, analog and mixed-signal ICs. For the latest product introductions and
information about Skyworks, visit our Web site at www.skyworksinc.com
For additional information on our broad overall product portfolio, please contact your local sales office or email us at
sales@skyworksinc.com.
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