EVS SERIES
Features
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SMD TYPE. Conductive Polymer Aluminum Solid Capacitors
This type has lowest ESR level and excellent performance at high frequency through low profile.
Ideal capacitor for digital and high frequency devices.
High heat resistance and high reliability.
Application :
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Circuit= Noise-limitter, smoothing circuit of power supply
Equipment = PC, Digital Still Camera, Hard Disk Drive, PDA, M.D. Graphic card etc
Characteristics
Low Temperature Characteristics
2.5 ~25VDC
6.8uF ~ 1500uF
-55 ~ +105℃
0
M=+20%/-20% , K=+10%/-10% (at 20 C , 120Hz)
0.2 x Capacitance(μF) x Rated Voltage(Vdc) After 2minutes
Appearance
≦No significant damage
Capacitance Change (μF)
≦20% of an initial measured value
Dissipation Factor (tanδ)
≦150% of an initial specified value
ESR (mΩ)
≦150% of an initial specified value
Leakage Current (μA)
≦An initial specified value
Impedance Ratio (at 100kHz): Z-25 /Z+20 : 1.15 , Z-55 /Z+20 : 1.25
Surge Voltage (V)
Rated Voltage x 1.15 (at 105℃)
Voltage Range
Capacitance Range
Temperature Range
Capacitance Tolerance
Leakage Current
Endurance
(Rated Voltage at 105℃ 2000h then
restored to 20℃)
Diagram of dimensions
Lead Spacing And Diameter
SIZE CODE
C6
C7
D7
E12
F8
F10
F13
φD
6.3
6.3
8
8
10
10
10
L
6.0±0.2
7.0±0.2
7.0±0.2
12.0±0.5
8.0±0.2
10.0±0.5
13±0.5
A
6.6
6.6
8.4
8.4
10.4
10.4
10.4
B
6.6
6.6
8.4
8.4
10.4
10.4
10.4
C
2.7
2.7
3.0
3.0
3.3
3.3
3.3
W
0.5 to 0.8
0.5 to 0.8
0.7 to 1.1
0.7 to 1.1
0.7 to 1.1
0.7 to 1.1
0.7 to 1.1
P±0.2
2.0
2.0
3.1
3.1
4.7
4.7
4.7
Frequency coefficient for ripple current
Frequency
Coefficient
120Hz≦f<1KHz
0.05
1KHz≦f<10KHz
0.3
10KHz≦f<100KHz
0.7
100KHz≦f<500KHz
1
EVS SERIES
Dimension: φDx L(mm)
Ripple Current: mA/rms at 100kHz, 1050C
DIMENSIONS & CHARACTERISTICS
W.V.(V)
2.5(0E)
4(0G)
Capacitance
(µF)
Size
φDxL(mm)
SIZE
Code
Tanδ
(120Hz,200C)
L.C.
(µA)
220
560
680
1000
1200
1500
150
220
330
470
560
680
820
1200
82
100
120
6.3x6
8x7
8x12
10x10
10x10
10x13
6.3x6
8x7
8x7
10x8
8x12
10x8
10x10
10x13
6.3x6
6.3x6
6.3x7
6.3x7
8x7
6.3x7
8x7
10x8
8x12
10x10
10x13
6.3x6
8x7
8x12
10x10
10x13
6.3x6
8x7
8x12
10x10
10x13
6.3x6
8x7
8x12
10x10
10x13
6.3x6
8x12
10x13
C6
D7
E12
F10
F10
F13
C6
D7
D7
F8
E12
F8
F10
F13
C6
C6
C7
C7
D7
C7
D7
F8
E12
F10
F13
C6
D7
E12
F10
F13
C6
D7
E12
F10
F13
C6
D7
E12
F10
F13
C6
E12
F13
0.12
0.12
0.18
0.18
0.18
0.18
0.12
0.12
0.12
0.12
0.18
0.18
0.18
0.18
0.12
0.12
0.12
0.12
0.12
0.12
0.12
0.12
0.15
0.15
0.15
0.10
0.10
0.15
0.15
0.15
0.10
0.10
0.15
0.15
0.15
0.10
0.10
0.15
0.15
0.15
0.10
0.12
0.12
110
280
340
500
750
500
120
176
264
376
448
544
656
960
103
126
151
189
189
277
277
416
592
706
1033
112
300
660
940
1120
150
262
576
704
1056
88
188
400
400
608
170
413
700
150
6.3(0J)
10
16
20
25
220
330
470
560
820
56
150
330
470
560
47
82
180
220
330
22
47
100
150
6.8
33
56
E.S.R.
(100k-300kHz,mΩ,
200C MAX)
25
23
12
13
13
10
26
25
25
22
12
13
13
10
27
27
30
30
25
45
25
22
12
16
10
31
27
14
18
12
50
30
16
20
14
50
45
24
25
20
80
30
28
Rated R.C
(mArms at 100kHz,
1050C)
2500
3100
4770
5000
5200
5500
2450
3020
3020
3800
4770
5000
5200
5500
2400
2400
2010
2250
3020
2320
3020
4000
4770
4700
5500
2250
2800
4420
4400
5300
1650
2700
4360
4200
5050
1650
2000
3320
3700
4320
1200
2980
3800
Soldering Profile
Recommended pad pattern and size
Unit: mm
Land size
X
Y
W
1.6
2.6
1.0
Case size
Case
code
4×5.3
A
8×10
E
5×5.3
6.3×5.3
6.3×5.7
B
C
C(EZV)
1.6
1.6
1.6
3.0
3.5
3.5
1.4
1.9
1.9
8×12.0*
10×8.0*
10×10.0
E12
F8
F
2.5
2.5
2.5
3.5
4.4
4.0
3.0
4.3
4.0
6.3×6.0*
6.3×7.0*
6.3×7.7
C6
C7
C8
1.6
1.6
1.6
3.5
3.5
3.5
2.1
2.1
1.9
10×13.0*
12.5×13.5
12.5×16
F13
G
H
2.5
4.0
4.0
4.4
7.5
7.5
4.3
7.0
7.0
8×6.5
8×7.0*
D
D7
1.6
2.5
4.0
3.5
2.1
3.0
16×16.5
I
6.0
8.5
9.5
Case size
Case
code
Land size
X
Y
W
2.5
3.5
3.0
Case size in mark of “*” is for EVS capacitors application.
(1) Method is as follows.
Recommended soldering methods
●
Method
Reflow soldering
Soldering iron
Flow soldering
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Advisability
Recommended
Recommended
Not Recommended
Lead-free type
Reflow soldering condition.
The following temperature profile condition
should be observed for soldering. (For higher
temperature, pleases contact us after measuring
the capacitor’s product temperature profile at
your side.)
Product temperature will rise slower as the product
size gets bigger. It is not necessary to adjust the
reflow furnace temperature setting according to
the product size, for example, φ4 and φ10
products can be mixed on one PCB for reflowing.
(2) Soldering precautions
●
Test conditions
Type
Preheat
Duration
Peak
Non-solid capacitor
EVS
WV
4 ~ 50V
63V~
4V ~
---
Case size (φ)
4 ~ 6.3
4 ~ 6.3 8 ~ 16
---
℃)
Temp.(T1 ~ T2,
150 ~ 180
Time (t1) (Max, secs)
Temp.(T3,
℃)
Time (t2) (Max, secs)
Temp.(T4,
℃)
Time(t3, secs)
Reflow cycles
100
217
230
90
60
90
217
217
200
217
60
50
230
60
40
260
250
240
250
260
40
5
5
5
5
5
1
2 or less
2
1
1. Elements related to the reflow soldering
temperature
* Product size: The temperature rises slower as
the size gets bigger.
* Product location: The center part of the PCB
tends to have a lower temperature than the
PCB edges.
* PCB size: The PCB temperature rises slower
as the area and/or thickness of the PCB gets
greater.
2. Repeated reflowing
* Avoid reflowing twice if possible.
* If repeated reflowing is unavoidable, contact
us after measuring the first and the second
reflow profiles and reflow interval at your
side.
* Do not attempt to reflow three times.
3. Soldering with soldering iron
Observe the following conditions.
* The iron tip temperature: 350±5℃
* Soldering item: 3+1/-0 second
* Please contact our representative if your condition is higher.
●
Attention for EVS
Reflow soldering may reduce the capacitance of products before or after soldering even if soldering conditions stipulated in
Recommendable Reflow Condition are met.
Though the actual reflow conditions are subject to change depending on the kind of reflow soldering method, please be aware
that the peak temperature at the top of Al-case and electrode terminals should not exceed peak temperature.
Particular notice should be given to the time that EVS is heated at 200℃ or higher during reflow.
If your reflow conditions (temperature and/or duration) exceed the above, EVS may be damaged exhibiting; 50% decrease in
capacitance, an increase of leakage current, (up to several mA) as well as damage to the exterior of the capacitor.