Introduction to Mechatronics An overview of trends and technologies for innovation Dario Petri Department of Industrial Engineering Ciclo di Seminari per l’Ingegneria Industriale – 17 Marzo 2015 Outline • What is mechatronics? • Role of Mechatronics for Industry and Society • What is a Mechatronic System • The core of Mechatronic Systems: the Embedded processing Platform • Transducers and MEMS • Annex: M.Sc. Mechatronic Engineering 2 What is Mechatronics ? 3 What is mechatronics ? a synergistic integration and convergence of disciplines A definition: approach aiming at the synergistic integration of mechanics, electronics, control theory, and computer science in order to improve and/or optimize functionality of systems or processes 4 Role of Mechatronics for Industry and Society 5 Where is mechatronics used? Automotive Robotics Ambient Assisted Living (AAL) Instruments Industrial automation Home appliances 6 What perspectives for Mechatronics ? • a key role within the European research and innovation funding programme (2014-20) called Horizon 2020 Horizon 2020 goals: Responding to the economic crisis to invest in future jobs and growth Addressing peoples’ concerns about their livelihoods, safety and environment Strengthening the EU’s global position in research, innovation and technology 7 Horizon 2020 priorities 32% 22% Excellent science Industrial leadership Societal challenges Total: € 80 bn 38% Others: 8% 8 Horizon 2020 priorities vs Mechatronics 9 Example: Automotive automobiles as distributed embedded systems multiple processors • up to 100 and more • networked together 10 Example: factory of the Future 11 Example: Smart City rational management of resources, sustainable development, for the benefit of citizens, companies, institutions pervasive use of information, mechanical and control technologies for communications, mobility, environment, energy, … Example: Smart Grids 13 Example: Smart Home Buildings as Composition of Subsystems Sensors, Actuators, Networks Performance Database Security Safety Entertainment Environmental Control Energy Efficiency Example: Ageing and Well-being Health Inclusive Society Social Interaction Home Care Mobility 15 What is a Mechatronic System? 16 General functional overview • accelerometers • cameras • sonar … sensors • analog filtering • amplification • A/D conversion input signal conditioning & interfacing signals • • • • • digital control digital filtering parameter estimation feature extractions optimization “embedded” processing communication • D/A conversion • power amplification output signal conditioning & interfacing (MCU, µP, FPGA, PLC, DSP, …) of «external» quantities (related to the environment) a feedback system! signals of «internal» quantities (related to the system itself) (gears, axles, …) sensors mechanical system • gyroscopes • potentiometers • encoders … • autonomous vehicle • manipulators • assembling lines actuators • valves • motors (electric, pneumatic, hydraulic,…) 17 Real-time operation Time between data acquisition and Residual Time actuation Release time Period Deadline Most of mechatronic systems have to work in real-time: • Hard real-time: missing deadlines may cause catastrophic consequences Examples: Airbags, ABS • Soft real-time: meeting deadlines is desirable for performance reasons, but missing them is not critical Examples: command interpreter of the user interface 18 An excellent example: The Robot The term has been used for a variety of autonomous mechanical systems. “A robot is a reprogrammable multi–functional system designed to move materials, parts, tools, or specialized devices through variable programmed motions for the performance of a variety of tasks” (Robotics Institute of America) Widely accepted definition of robotics: “the science studying the intelligent connection between perception and action” 19 Design controls for robots robot kynematics and dynamic models describe the system time evolution control electronics 20 The core of Mechatronic Systems: the "Embedded" Processing Platform 21 Embedded platform Software (Flash) Data Aggregation Algorithms Network Protocols Link Level Protocols to 10’s of mm3 and 10’s of µW from 10’s of cm3 and 10’s of mW Micro-OS and Middleware Radio Unit Processor sensor A/D D/A Other Electronics SRAM Flash BB Radio Acc. Power Generator Location finding actuator Sensing Unit DC/DC Converter Processing Unit Power Unit The central processing unit (CPU) The CPU consists of: • data section (containing registers and ALU - arithmetic and logic unit) also known as the datapath • control section, which interprets instructions and effects register transfers 23 performance CPU options for Mechatronics Application specific architectures (ASIC) Embedded processors Microcontrollers Microprocessors disappearing distinction performance evolution cost 24 A CPU architecture: ARM A9 25 Increasingly on the Same Chip System-on-Chip (SoC) Copyright 2003 Mani Srivastava Embedded design variables Embedded systems are computing systems dedicated to an application domain and “embedded” into a technical environment (e.g. car, robot) Contributions to cost: cost • silicon area • memory (program, data) • packaging power consumption • hardware design effort • time-to-market • software design effort 27 Embedded system characteristics Real-Time Operation • Reactive: computations must occur in response to external events • Correctness is partially a function of time Small Size, Low Weight • Hand-held electronics and Transportation applications -- weight costs money Low Power • Battery power for several hours (laptops often last only 2 hours) Harsh environment • Heat, vibration, shock, power fluctuations, RF interference, lightning, corrosion Safety- critical operation • Must function correctly and Must not function in correctly Extreme cost sensitivity • $0.05 adds up over 1,000,000 units 28 Hardware-software co-design 29 Microelectronic evolution: Moore’s law Gordon Moore: noted that the number of transistors on a chip doubled every 18 to 24 months (1965) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Electronics, April 19, 1965 1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975 LOG2 OF THE NUMBER OF COMPONENTS PER INTEGRATED FUNCTION Prediction: semiconductor technology will double its effectiveness every 18 months (strong impact on both CPUs and memories) 30 Transistor count growth in CPUs 2012 > 1 billion transistors 1,000,000 1 billion transistors K 100,000 10,000 1,000 i386 80286 100 10 i486 Pentium® III Pentium® II Pentium® Pro Pentium® 8086 1 1975 1980 Courtesy, Intel 1985 1990 1995 2000 2005 2010 projected 31 Embedded HW: Moore’s Law 18 nm 5000 Kgates/mm2 45 nm 2600 Kgates/mm2 65 nm 1400 Kgates/mm2 Margarshack03 P.Marwedel today atomic radius ∼ 30-300 pm STMicroelectronics Roadmap Instruction level parallelism • Instruction Level Parallelism (IPL): the capability of a CPU to run more instructions at the same time • the most classic solution: the pipeline 33 The power wall • design goal (late 1990’s - early 2000’s): drive the clock rate up by increasing parallelism • this increased the power dissipation of the CPU chip beyond the capacity of inexpensive cooling techniques 34 Power density Power density too high to keep junctions at low temp Solution: multi-core CPUs Sequential App Performance 36 A multi-core CPU: ARM11 MPcore 37 Evolution of micro-integration 38 Integration of Technologies 3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems Proceedings of the IEEE , January 2009 3D technology integration: ICT, Nano e Bio Transducers and MEMS 40 What is a transducer ? transducer: a device that converts a quantity with a primary form of energy to another primary energy forms: mechanical, thermal, electromagnetic, optical, chemical … it takes form of: • sensor (e.g., thermometer): a transducer that acquires information from the “empirical world” providing an electrical signal at its output • actuator (e.g., heater): a transducer that acts on the “empirical world” converting information into an action empirical world sensor actuator intelligent feedback system 41 Transducer examples Light Sensors • photoconductor: ∆R = f (light level) • photodiode ∆Iλ = f (light level) Pressure sensors • resistive ∆R = f (pressure) • capacitive ∆C = f (pressure) 42 Micro Electrical Mechanical Systems (MEMS) Characteristics: • miniaturization (size: 1 µm – 1 mm) • fabricated using micromachining (technologies derived from µelectronics) • batch fabrication reduces cost • low power consumption micro-fluidics • new capabilities: micro-analysis and micro-manipulation systems micro-gears micro-mirrors micro-electrodes 43 MEMS in automotive applications distributed all over the vehicle 44 Ecall • • mandatory in all EU new cars since October 2015 activated by airbag sensors, send an alarm signal to 112 (emergency call number) with date, time and GPS coordinates of the vehicle expected cut help delay: about 50% -2500 dead/year cost: 50-300 euro 3D imagers Maneuvering area • 3D imagers rely on the measurement of Time-of-Flight (ToF) of optical pulses • range 1 - 20 m, accuracy of a few cm Functional scheme • target identification • distance measurements output 50 m 80 m 10 m 46 Autonomous Vehicle Arnold Schwarzenegger Total Recall, 1990 Piero Angela Parma, Jan 2014 M.S. (Laurea Magistrale) in Mechatronic Engineering classe Mechanical Engineering 48 M.S. Mechatronic Engineering 2°Semester Manifesto 2014-15 (draft) 2° year Comp. Meth. for Mechatronics Manufacturing Automation Systems and tech. for D.S.P. Mech. Design Machine Elem. Introduction to Electr. Syst. Elective course* (6 CFU) (6 CFU) (9 CFU) (9 CFU) (6 CFU) (6 CFU) Automatic Control Mechanical Vibrations Modeling Simul. Mech. Systems Elective course* (9 CFU) (6 CFU) (9 CFU) (6 CFU) Computer Vision Distrib. Systems Meas. Autom. Industrial Robotics Logistica Gestione Impianti Ind. Introd. to Electronic Systems* Quality and Innovation Engin. (6 CFU) (6 CFU) (6 CFU) (6 CFU) (6 CFU) (6 CFU) 1° Semester 1°Semester 1° year Curriculum Electronics - Robotics Robotic Perception and Action Design Control of Product. Proc. Functional and Smart Materials Elective course Elective course (6/9 CFU) (6 CFU) (6 CFU) (6 CFU) (6 CFU) Modeling design finite elements Dynamic control vehicles robots Embedded Systems Other activities Final project (6 CFU) (9 CFU) (9 CFU) (3 CFU) (15 CFU) Aerodinamica (6 CFU) Informatica e Programmaz.* (6 CFU) Metodi Progettazione Industriale (6 CFU) 2°Semester Curriculum Mechanics – Mechatronics